Edited Seminar

SEMINAR REPORT2016-17
PLACEMENT OF EMBEDDED
TEMP. SENSOR IN PCB
CHAPTER-1
INTRODUCTION
The recent improvements of automatic control mechanisms led to a smarter

manufacturing process [1]. This ongoing trend will be supported by new
sensor
concepts,
which
deliver
sensor
data
from
new
point
of
measurement. This is the product itself, e.g. the printed circuit board (PCB)
as the principal component of electronic devices. The sensor will be
implemented inside the PCB and will be able to increase the efficiency of the
automatic
control
mechanism
of
the
manufacturing
process.
The
implemented sensor can also be used to calibrate other sensors, whose

measurements are sensitive to temperature fluctuations. The challenge for
such a system is the appropriate placement of these sensors. The placement
must be done at the layout phase of the PCB design. Therefore, an utility
software based on a layout file can give a variety of possible sensor positions
depending on the placement of integrated circuits at the PCB. This utility
software can also be used to give the thermal parameters for determine the
temperature
at the surface of the PCB, which are required for the automatic control
mechanisms (e.g. in a reflow process - determine and control the solder
temperature of a solder-pad of an integrated circuit (IC)).
The term of smarter production processes includes the
improvement of the automatic control mechanism. Therefore, it is useful to
provide more sensor data about the product itself. These information are
gathered by sensors (e.g. temperature sensor) which are installed in a
permanent
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FIG.1 SIMPLE BLOCK DIAGRAM

The thermal parameters are
required for the temperature difference between the sensor inside the PCB
and the temperature at the point of interest (POI) on top of the PCB. Thus
parameters depend on the material and geometrical composition at the
sensor position. These circumstances can differ for different sensor positions
on the PCB. Therefore, a thermal parameter calculation for each sensor
position has to be done, before the sensor can used inside a PCB.
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In the following chapter the

basic formulas and fundamentals are given, which are used to calculate the
thermal parameter in the utility software. In chapter 3 a first approach based
on finite element simulation is shown. Experimental measurements are
shown in chapter 4. In chapter 5 the utility software as a python program will
be described. Chapter 6 is about the results comparison of the simulation,
measurement and the application. At least in the 7 th chapter a conclusion is
given and future work will be addressed.
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FIG.2 Circuit diagram
This particular product is used in a lot of different modern consumer

devices and the embedding of electronic components directly into the PCBs
substrate material is available. The appropriate placement of the integrated
sensor is a challenging issue and will be discussed in this paper. The position
influences the sensor readings and must be considered for the automatic
control mechanism of the production plant. Therefore, a method is described
for calculating the required parameter of the sensor position based on the
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PCBs layout information. For this, the main parameter is the time coefficient
of the temperature gradient.
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CHAPTER-2
THERMAL FORMULAS
To calculate the thermal parameters the equivalent circuit diagram will be

used. The required parameters for a calculation are the thermal resistance
(Rth) and the thermal capacity (Cth). The resistance can be calculated with
the length (l) over the area (A) multiplied with the coefficient of thermal
conduction (k)
Rth = l/A*k
(1)
The thermal capacity (Cth) results from the the coefficient of the thermal
capacity (Cv)
Cth = Cv*V*P
(2)
With these two parameters a curve can be calculated, which shows the
dependencies of the temperature difference over time. The function is an
exponential one with the time(t) over time constant() and the starting
difference of the temperature. With
= Rth*Cth
(3)
(1)and (2) the function is

T=To*e^(-t/)
If the starting temperature is known, than with (4) the curve can be
calculated. [2] The curve allows a determination of the temperature on the
surface above the sensor at any time (see Fig. 3). If the sensor is connected
to a microcontroller this one can send temperature data of the sensor itself
but also the temperature of the surface based on the curve
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FIG.3 Simulation result of(5) with FR4 above sensor
2.1. TEST-STRUCTURE FOR SENSOR

A standard printed circuit
board consist of glassreinforced epoxy with copper as electric conductor,
where the active and passive devices are mounted. This setup can be
stacked multiple times. To connect the different copper layer, vias are used
through the glass-reinforced epoxy.
Each of the shown materials
and connection methods influences the temperature readings of the sensor,
if the sensor is placed inside the PCB. This influence can be calculated by the
formulas shown in chapter 2.1. For the experiments the following setups are
chosen: a) a sensor under copper in FR4, b) sensor connected with a thermal
via to the copper of the surface and c) an IC on top of the FR4 with air
between them over the sensor position.
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FIG.4 Component placement
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CHAPTER-3
SIMULATION
The simulation was made in Comsol Multiphysics 4.4, a finite element calculation
program. The focus of the simulation was to compare typical PCB surface structures
(see Fig. 2) above the implemented sensor in terms of thermal behaviour.
FIG. 5. Simulation result of the sensor (I) under a via (II)

and a copper surface (III)
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For each simulated structure the boundary conditions are: the temperature
on top is set at 413.15 K, the other sides are isolated and the
startingtemperature is set to 273.15 K. In table 1 the coefficients for the
common materials in coherence with PCB are shown. The temperature
difference is set to a fixed value over time at 120 K. With the resulting
exponential curve the factor of was calculated. The results will be
compared with experimentally measured values and the result of the
program in chapter 6.
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CHAPTER-4
EXPERIMENTAL MEASUREMENT
The measurements were conducted on a heating plate. Therefore, a PCB was

prepared with
thermocouples on top and inside the PCB to monitor the temperature
development. With a CNC milling machine four trenches were produced
beneath the points of interest (POI). Inside each trench a thermocouple (type
K) was placed. The trench depth was half of the PCB height. At the opposite
side of the PCB another thermocouple was placed. The POIs are selected to
compare the shown structures in chapter 2.2 on the board. These trenches
are shown in Fig. 4. In the figure are four test-points: point 1 at a via, point 2
under a copper area, point 3 under an IC and point 4 with only FR4 on top.
FIG. 6. Test PCB with milled trenches (left) and

trenches ends enlarged (right).
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An exemplary temperature curve is shown I Fig. 5. There is a temperature

difference shown for a setup with structure of an integrated circuit over the
sensor position 8 128 . A table with all results of the different structures is
given in chapter 6.
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CHAPTER-5
UTILITY SOFTWARE FOR SENSOR IMPLEMENTATION

The program is written in Python. It will work on any operating system where
python can be installed (Windows, Linux etc.). It is based on a graphical
user interface, where the layout of a PCB can be opened. The layout will be
drawn inside the program, based on the information of the layout file (e.g.
board files from Eagle).
FIG.6 GUI of the sensor utility layoutbof the PCB(LEFT), a table of the
package information
of the selected sensor including the time coefficient
(top right)and the curve of the temperature difference over time for the
selected sensor(bottom right)
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These board file information determine the possible sensor placement

positions. Therefore, the
program extracts the coordinates of electric compounds on the PCB and
gives the user a graphical feedback where the sensors can be places (see
Fig. 6) Additionally, in the table on the right side the names of the
compounds are given with the package and the calculated thermal
parameter.
FIG.7 Thermal resistance of heat flow through different directions
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Those thermal parameters are calculated with (1)- (2). The length
information is set as the height of the PCB (e.g. 1.6 mm) and the copper
thickness (e.g. 100 m). For the length of the heat flow from the surface to
the sensor in the IC on top structure, a length calculation to the SMD pads of
the package is used and not the direct way through the IC and air. The
reason is the high thermal resistance of the air compared to the copper of
the pads, the timecoefficient of the temperature difference depends on the
heat flow through the copper not the air (see Fig. 7). Therefore the distance
from the sensor to the next pad must be known. In a simple calculation the
length was determined with the square root of the distance square plus the
height to the pad square (Pythagoras
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CHAPTER-6
SELECTING TEMPERATURE SENSORS FOR SYSTEM

MEASUREMENT AND PROTECTION
A number of technologies are available to designers who need to measure
temperature within a system. Thermistors, thermocouples, RTDs, and temperaturesensor ICs each have advantages and disadvantages in any given situation. This
article compares the most popular temperature sensing technologies. It discusses
the suitability of each technology for monitoring common targets such as PC
boards, ambient air, and high-power circuits like as CPUs and FPGAs .
The position
influences the sensor readings and must be considered for the automatic
control mechanism of the production plant. Therefore, a method is described
for calculating the required parameter of the sensor position based on the
PCBs layout information. For this, the main parameter is the time coefficient
of the temperature gradient. The thermal parameters are required for the
temperature difference between the sensor inside the PCB and the
temperature at the point of interest (POI) on top of the PCB. Thus parameters
depend on the material and geometrical composition at the sensor position.
These circumstances can differ for different sensor positions on the PCB.
Therefore, a thermal parameter calculation for each sensor position has to be
done, before the sensor can used inside a PCB.
This ongoing trend will be supported by new sensor
concepts, which deliver sensor data from a new point of measurement. This
is the product itself, e.g. the printed circuit board (PCB) as the principal
component of electronic devices position. To increase the quality of the
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products sensor data, the sensors can be implemented in the product itself,
especially in a product like a printed circuit board (PCB).
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CHAPTER-7
TEMPERATURE SENSING TECHNOLOGIES
Sensors are often used within electronic systems to monitor temperature and
provide protection from excessive temperature excursions. The most
common technologies for use within systems are listed below.
7.1 THERMOCOUPLES
Thermocouples are made by joining two wires of dissimilar metals. The
point of contact between the wires generates a voltage that is approximately
proportional to temperature. Characteristics include wide temperature range
(up to 1250C), low-cost, very low output voltage (on the order of 40V per
C for type K), reasonable linearity, and moderately complex signal
conditioning (cold-junction compensation and amplification). There are
several thermocouple types, which are designated by letters. The most
popular is type K. Maxim manufactures ICs (MAX6674 and MAX6675) that
perform
the
signal
conditioning
functions
for
type-K
thermocouples,
simplifying the design task and significantly reducing the number of

components required to amplify, cold-junction compensate, and digitize the
thermocouple's
output. Thermocouples are available in probes and with bare leads.
7.2 RTDs
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RTDs are essentially resistors (often made from platinum wire) whose
resistance varies with
temperature. Characteristics include wide temperature range (up to 750C),
excellent accuracy and repeatability, reasonable linearity, and the need for
signal conditioning. Signal conditioning for an RTD usually consists of a
precision current source and a high-resolution ADC. Cost can be high. RTDs
are available in probes, in surface-mount packages, and with bare leads.
7.3 THERMISTORS
Thermistors are temperature-dependent resistors, usually molded from conductive
materials. The most
common thermistors have a negative temperature coefficient (NTC) of resistance.
Characteristics include moderate temperature range (up to 150C), low-to-moderate
cost (depending on accuracy), poor but predictable linearity, and the need for some
signal conditioning. Thermistors are available in probes, in surface-mount packages,
with bare leads, and in a variety of specialized packages. Maxim manufactures ICs
that convert thermistor resistance to digital form
7.4 IC TEMPERATURE SENSORS

IC temperature sensors are complete, silicon-based sensing circuits with either
analog or digital outputs. Characteristics include moderate temperature range (up
to about 150C), low cost, excellent linearity, and additional features like signal
conditioning, comparators, and digital interfaces. Digital formats are numerous and
include 3-wire and 4-wire (such as SPI), 2-wire (IC and SMBus), and single-wire
(1-Wire, PWM, frequency, and period). Note that signal conditioning, analog-todigital conversion, and thermostatic functions all add costs to the other sensing
technologies, but are normally included within sensor ICs. IC temperature sensors
are available primarily in surface-mount packages.
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CHAPTER-8
CHOOSING THE PROPER TEMPERATURE SENSOR

FOR SYSTEM-MEASUREMENT TARGETS
Picking
the
right
sensor
technology
begins
with
understanding
the
characteristics and requirements of the target whose temperature needs to

be measured. Some common temperature-measurement targets are listed
below and are summarized
8.1 PC BOARD
Surface-mount sensors are best for PC board measurement. RTDs, , and IC
sensors are available in surface-mount packages and temperature ranges
that are compatible with sensing the temperature of a PC board. RTDs are
quite accurate and produce highly repeatable measurements, but can be
costly compared to thermistors and ICs. Thermistors are very nonlinear, but
the nonlinearity is predictable. When used over a narrow temperature range,
they can often be linearized reasonably well with just an external resistor or
two. If accuracy is not critical, thermistors can be inexpensive; but, precision
thermistors can be moderately expensive. The system cost and complexity
can increase significantly if linearization calculations or lookup tables must
be used. ICs have excellent linearity and additional features, such as digital
interface or thermostat functions. These features usually give them the edge
over other sensor technologies in terms of system cost, design complexity,
and performance when measuring PC board temperature. One of the keys to
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measuring PC board temperature accurately is positioning the sensor in the

right place.
It is common to
measure the temperature of a specific component or group of components,
either to ensure that the temperature does not exceed the safe operating
range, or to compensate for temperature-induced changes in a component's
performance. When location of the sensor is critical, look for temperature
sensors in small packages, such as SOT23s, that can be easily placed in the
appropriate location without disturbing the layout. Digital outputs are useful
when sensors need to be located in sites that may be electrically noisy or far
from the other temperature-related circuitry.
8.2 AMBIENT AIR

Ambient-air temperature is difficult to measure because the sensor's
temperature must be influenced by
the air, but isolated from other
components (PC board, power supply, CPU) that might be at a different

temperature. Thermistors, thermocouples, and RTDs are available on long
leads that isolate the sensing elements from the PC board temperature. If the
leads are long enough, the sensing element will be at the ambient
temperature, although the leads are connected to the PC board, which is
probably at a different temperature. Figure 1(a) shows an example of a
thermistor mounted above the surface of a printed circuit board to measure
ambient air temperature.
ICs are available that help with signal
conditioning of other types of sensors. For example, the MAX6603 provides a
convenient analog interface for RTDs, the MAX6691, MAX6697, and others
include thermistor-to-digital functions, and the MAX6674 and MAX6675
convert K-Type thermocouple signals to digital. Figure 1(b) shows a
MAX6675 and a K-Type thermocouple measuring ambient temperature.
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Surface-mount ICs are more difficult to use for measuring ambient

temperature because the best thermal path for an IC sensor is through its
leads, which are at the same temperature as the PC board.
If
the PC board is not at ambient temperature (for example, if it contains
components that dissipate enough power to raise its temperature), the
surface-mount IC will not measure ambient temperature. However, because
they have additional system features, such as digital outputs or thermostat
functions, IC temperature sensors are sometimes used for ambient-air
temperature sensing. This is usually done by placing them on small
"satellite" PC boards that are at ambient temperature. Note that even
conventional IC packages, such as TO-92s, that raise the IC sensor above the
PC board conduct heat so well through their leads that the measured
temperature is effectively equal to the PC board temperature. An excellent
solution with a TO-92 package is to mount the package at the end of a
twisted pair of long, thin wires above the circuit board, as shown in Figure
1(c). Here, the DS18S20, a precision sensor using Maxim's 1-Wire digital
interface, measures the ambient temperature.
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Figure 8. Thermistor monitoring air temperature. Note that the long

thermistor leads provide thermal isolation from the board's surface. The
thermistor temperature can be converted to digital form using such ICs as
the MAX6697 or the MAX6691
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Figure 9. Using a thermocouple to sense ambient temperature, the MAX6675

provides cold junction compensation and converts the output of the
thermocouple directly to digital form
Figure 10.The DS18S20 precision 1-Wire temperature sensor IC is mounted

at the end of a twisted pair of wires to isolate the sensor from the printed
circuit board. In this case, the DS18S20 is powered by the data line. The data
and power are controlled by the microcontroller's I/O pins
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8.3 CPU, GRAPHICS PROCESSOR, FPGA, POWER DEVICE, MODULE,

Etc
The temperature of a high-power component can often be measured with a
surface-mount sensor (thermistor, IC, or RTD) near or under the device. If
this is impractical, or if the device has a heat sink or some other surface that
must be measured, sensors with long leads (thermocouples, RTDs, and
thermistors) can be placed in contact with the surface to be measured. If the
temperature to be measured is more than approximately 150C, a
thermocouple or RTD is the best choice. Near or above 750C, thermocouples
become the only choice.
8.4 CPU, GRAPHICS PROCESSOR, FPGA, POWER DEVICE, MODULE,

Etc. (WITH ON-BOARD THERMAL DIODE)
Some components, especially high-performance ICs such as CPUs, graphics
processors (GPUs), and FPGAs, include a diode-connected bipolar transistor
for sensing temperature. Because the thermalsensing transistor is on the IC
die, measurement accuracy is far better than with other sensing technique
and thermal time constants are quite small. Maxim manufactures several ICs
that are specifically designed to accurately measure the temperature of a
thermal diode and convert it directly to digital form. Some of these ICs
measure a single thermal diode, while others measure as many as four. The
signal levels are small (on the order of 200V per C), but still larger than
those of thermocouples. Internal and external filtering, combined with
reasonable care in layout, allow remote diode sensors to be widely used in
electrically noisy equipment such a computers, servers, and workstations.
Most of these ICs provide additional functions to protect the target IC, such
as overtemperature alarm pins that can be used to shut the system down if
temperature exceeds the safe operating limits of the target. An example of a
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remote diode sensor (MAX6642) is shown in Figure 2. This IC measures the

thermal diode temperature and its own temperature up to 150C, and also
provides an overtemperature alarm output with a trip temperature that is
programmable over the SMBus.
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Figure11. The MAX6642 is the world's smallest remote temperature sensor. It

has an ALERT pin that may be used as an interrupt or as a system shutdown
signal to protect the target IC from damage due tooverheating.
There are several different temperature-sensing technologies available for
the system designer. The righttechnology depends on the target temperature
to be measured, and also on other system requirements such as cost, circuit
size, and design time. Maxim's comprehensive selection of temperaturesensing ICs can help the designer solve common temperature-measurement
problems with excellent performance and low overall cost
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CHAPTER-9
SOLDERING PROCESSES
The soldering process is one important focus of research in a PCB production
environment (e.g. reflow oven) for our generators, because of the available
thermal energy in this process. Nevertheless, the testing of a PCB in a
climate test chamber is also a suitable application, since there is a cyclic
change of low and high temperature. A thermoelectric generator (TEG)
seems to be the best choice for the reflow oven, whereas for the test
chamber application a pyroelectric generator (PEG) is preferred, because of
the high temperature change. But in other processes where no temperature
is involved the radio frequency energy harvesting. In our contribution we will
focus on the questions.
In the printed circuit board (PCB) production the
trend leads toward more and more complex designs, particular in Europe with small quantities
and high quality demands. To achieve these requirements the new production cycles need to have
a higher yield and a faster adjustment speed. A solution is to increase the numbers of sensors
inside the production equipment, as well as place sensors inside the product itself (the PCB).
we present the pure energy output information of the harvesters in the regarded
environment, so that these results can be compared with other sensor systems. Our system
consists of a temperature sensor, a microcontroller and a radio transceiver. The wireless interface
enables a real-time sensor-data transfer.
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CHAPTER-10
EMBEDDED SENSOR
The sensor inside the printed circuit board, as shown in Fig. 1, delivers
information that cant be measured from the outside or need to be
manufactured manually at the PCB (increases time and cost), before the
process. For example if the temperature at a solder pad should be tracked in
a reflow oven. Todays method is to attach a thermocouple near this solder
pad and connect them with a wire to the data logger. The embedded sensor
can be implemented near the pad and deliver information not only for the
soldering process but also for the whole lifetime of the PCB
FIG.11 Embedded sensor in PCB
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CHAPTER-11
WIRELESS SENSOR IN TEMPERATURE PROTECTION

SYSTEMS
Currently if sensors are embedded within Thermal Protection Systems, the sensors must be fully
wired to carry power, commands, and data from the sensors to a data collection system within
the spacecraft. This current system adds unnecessary weight and has the potential to increase the
flight risk. As a result sensors have not been frequently used. To save mass, complexity, and
reduce risk, a fully wireless system has been designed and tested. Several different wireless
transmission methods were researched including radio frequency, infrared, and near field
electromagnetic coupling. Preliminary results show that an RF transmitter was a reasonable
choice, because there would not necessarily be line of sight for an IR transmitter and
electromagnetic coupling is an underdeveloped technology.
The RF protocol selected was ZigBee,
a protocol used mostly by industry to transmit sensor network data for low power applications.
To demonstrate proof of concept, a wireless TPS temperature measurement system comprising
four thermocouples was designed, built, and tested at the NASA Ames X-jet facility. Tests were
conducted using different RF transmitter antenna configurations, power settings, heat fluxes, and
transmission distances. Test results showed that the wireless system could transmit out of the
environment with little interference. There was some packet loss and other problems involved
with the thermocouple bonding in the TPS but the transmission link was found to be strong
.
Every spacecraft entering a planetary
atmosphere requires a Thermal Protection System (TPS). The TPS must endure severe heat
loads, which requires an understanding of atmospheric properties, vehicle aerodynamics, TPS
material properties and the physics of the entry environment. NASA and other space agencies
would like to collect temperature, pressure, heat flux, radiation, and recession measurements on
flight tests and flight missions in order to verify TPS design and to aid in the characterization of
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physical and chemical phenomena in the entry environment. Currently the missions that do fly
with thermocouples have the sensors wired into the TPS of the spacecraft. Utilizing this
architecture adds risk to the TPS system due to the process of routing wires in the shield and the
difficulty of jettisoning the system after entry. Many current and past spacecraft engineers have
decided not to fly sensors embedded within the TPS in an effort to mitigate the risk of spacecraft
failure during entry. A wireless instrumentation system could collect measurements needed for
scientists and engineers to improve future spacecraft design while lowering the overall risk of
implementing sensors into the entry vehicles.
11.1 CONCEPTS CONSIDERED

A primary focus of this project was to research different types of wireless architectures that are
available for use in a wireless system. With preliminary research of wireless and thermocouple
architectures the team constructed a block diagram to express the outline of the transmitter
sensor system as seen in Figure 1. Using Figure 1 as guidance, three main architectures were
considered: radio frequency, light emission and near field magnetic communication. Before
looking at each architecture within the context of the specific project scenario, the team
researched and developed a decision matrix for each of the types of wireless transmission in
order to develop an understanding of the capabilities and restraints. the decision matrix evaluated
each architecture by power consumption, data rate, transmission distance, necessity of line of
sight, operating frequency, and overall complexity [1]. Using this decision matrix ThermaSense
narrowed down the available wireless technologies to ZigBee [2] and IR [3], with the addition of
Near Field Magnetic Coupling (NFMC) [4] Technology. These three technologies were then
researched in depth and another decision matrix was constructed
Based on these characteristics
alone, each architecture is capable of transmitting the thermocouple signal for a table top
demonstration in an interference free facility. This will not be the environment of the final
product, so the team also judged the wireless architectures on noise immunity and power
consumption. When looking at the requirements of these two specifications, near field magnetic
communication is the best wireless option. But since one of the other previously specified
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restraints of the technology must be readily available and NFMC is not, the next best choice is
ZigBee.
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FIG 12. Fundamental transmitter circuit structure
11.2 SENSOR CALIBERATION

The CJC chips are factory calibrated to be accurate to with-in +/- 4 degrees Celsius through the
complete range of temperatures added to a +/- .2 percent reading error. Once the temperature
data enters the CJC, the only other possible error in data received would be a dropped packet. To
test the factory calibration a controlled test was set up and conducted. A voltage from a DC
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source applied to the thermocouple inputs caused the circuit to display a temperature. Comparing
this temperature against standard type K thermocouple tables provides an indication of the circuit
calibration error. The results of the temperature calibration test and the accuracy of the circuit in
a typical room environment are shown in Figure 6.
FIG.13 Percent error found in calibration testing

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The temperature calibration test table shows a maximum error of +/- 1.2 percent error within the
range of the temperatures to be read. This error is over the manufacturers maximum rated error
of +/- .8 percent error at maximum reading. There are several possible causes for the difference
in maximum error. The first is the circuit layout. Because there is a terminal block connecting the
CJC chip and the thermocouple, a voltage error due to the metal contacts is possible causing the
circuit to read a slightly incorrect thermocouple voltage. The second is a programming error
where the CJC reads off a temperature in Celsius and rounded off decimals turn into significant
errors when converted to Fahrenheit. Both of these possibilities can be compensated for with the
correct calibration precautions addressed in the code.
11.3 RECOMMENDED FUTURE WORK

Future work to be pursued by future teams includes creating a multi-nodal system, powering the
sensor, programming the sensor for advanced power savings capabilities, determining the
transmitters interference tolerances, maximizing the signal to noise ratio while minimizing
power consumption, miniaturization, multiple sensor instrumentation, and protective packaging
of the transmitter system. A future milestone of this project is to implement the wireless system
on to a test flight. One possibility would be to fly as a payload on the University of Idahos High
Altitude Scientific balloon program. A successful flight test will require a software update.
Currently, if the receiver gets corrupted data the software crashes and needs to be reset before
data can be recorded. New software will need to overcome this issue as software will not be able
to reset during a flight test and will also need to recover from lost packets and general signal
disruption. Further work also presents the need for multiple types of sensors to be used by means
of the wireless system. This will require the transmitter circuit architecture to be universalized
for all sensors, or separated form the ZigBee transmitter.
If separation of the sensor circuitry and
the transmitter is needed, work towards a standard transmitter circuit and a sensor connection
strategy is recommended. This change would make it easier to connect the transmitter to any data
source as long as that source transmits a standard set of data (time, sensor ID, and reading).
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A successful flight test will also require improved protective packaging of the circuit. The
environment that the circuit is exposed to during testing and flight is likely to involve thermal
extremes, vibrations, and radiation. All of these factors could damage the circuit and disrupt the
data. Packaging will need to be constructed that can resist these many environmental factors. The
discussed future work does not represent the only possibilities of continued research. It is
expected that other issues, parameters, requirements and ideas will be uncovered as the project
progresses. Any additional work that fits into the scope and propels the project towards the final
goal of implementation on a space flight would be worthwhile and should be pursued.
ECE DEPARTMENT
40
TEMP. SENSOR IN PCB
CHAPTER-12
EMBEDDED BASED TEMPERATURE MONITORING
SYSTEM USING GSM
This paper describes the design of a simple low cost microcontroller based
temperature monitoring system using GSM technique. The temperature
monitoring system using GSM undergoes three stages signal conditioning
circuit, analog to digital converter and with GSM Modem the message is send
to mobile.ADC is used because microcontroller works with digital inputs. GSM
modem can be used to send and receive SMS through AT commands. At the
transmitter side, the user sends an SMS to the GSM modem using AT
commands. The LM35 is an integrated circuit sensor that can be used to
measure temperature with electrical output proportional to the temperature.
The
LM35
sensor
is
connected
to
PIC
microcontroller
and
varying
temperature is sent to GSM modem, which is simultaneously displayed in

LCD. The GSM
modem performs the operation of sending message to a particular SIM
number .GSM technology provides users with high quality signal and speech
channels, giving them access to high quality digital communication at very
affordable rates. GSM network operators can provide their customers with
cheaper calling and text messing options
The objective
of this paper is to design and develop a wireless communication link to
monitor and control equipments that are far away from the user and also
develop a high security system to keep a check on them. In an industry
during certain hazards it will be very difficult to monitor the parameter
through wires and analog devices such as transducers. Embedded system
plays a vital role in this paper. It is a user-friendly application system. GSM
plays a key role for transmitting and receiving the data from the user. The
ECE DEPARTMENT
41
TEMP. SENSOR IN PCB
main advantage of this concept is the real time direct measurement of the
parameter through GSM technique. The stoppage and some accidents
caused by increased temperature can be avoided. The self designed GSM
module is selected to finish the transmission and
decoding of the data
through AT command and coding of short PDU. Here, the temperature is

monitored directly which is simultaneously displayed in the LCD and can be
sent as a message by GSM technique.
ECE DEPARTMENT
42
TEMP. SENSOR IN PCB
FIG 14. Hardware Implementation
ECE DEPARTMENT
43
TEMP. SENSOR IN PCB
12.1 WORKING
The LM 35 is the temperature sensor connected to AN0 port of the PIC
microcontroller device. The output voltage sensor is obtained in milli volt and
it
amplified
IC741.
The
GSM
modem
and
LCD
are
connected
to
microcontroller. The temperature can be monitored directly which is

simultaneously displayed in the LCD and message to the mobile by using it
sends as a GSM technique
FIG.15 Simplified Block diagram
ECE DEPARTMENT
44
TEMP. SENSOR IN PCB
CHAPTER-13
CONCLUSION AND FUTURE WORK

The program is able to calculate the time coefficient with data from a layout
and additional data
for the integrated circuit parameter. The results show that a first
approximation of the time coefficient can be done with the program and it is
necessary to know this one because of the high difference in compare to the
structures the sensor is placed under. For further work more detailed
simulations and measurements have to be done, based on work of for a more
detailed simulation of the temperature environment [3] and the integrated
circuit [4]. An implementation of a database for the packages information of
integrated circuits is required to improve the results of the utility software.
The sensor and utility software are tested and programed only for a two layer
PCB, additional layer will have an influence. This influence on the sensor
readings are needed to be researched in future work
ECE DEPARTMENT
45
TEMP. SENSOR IN PCB
CHAPTER-14
MERITS AND DEMERITS
MERITS
Better protection for devices and PCB
Good durability for device
Automatic control mechanism of circuit
Sensor can achieve even thermal datas directly from the processors
DEMERITS
The appropriate placement of integrated senor is a challenging issue
The position influence the sensor reading
Variation in the combination of materials in PCB
Difficulty in determination of time coefficient time
ECE DEPARTMENT
46
TEMP. SENSOR IN PCB
CHAPTER-15
REFERENCE
[1] J. Davis, T. Edgar, J. Porter, J. Bernaden, and M. Sarli, Smart
manufacturing,
manufacturing
intelligence
and
demand-dynamic
performance, Comput. Chem. Eng., vol. 47, pp. 145156, 2012.

[2] Plamann, Wilfried, and Schulz, Handbuch Elektrotechnik. 2013, p. 183ff.
[3] B. Ills, Measuring heat transfer coefficient in convection reflow ovens,
Meas. J. Int. Meas. Confed., vol. 43, pp. 11341141, 2010.
[4] B. Ills and G. Harsnyi, 3D thermal model to investigate component
displacement phenomenon during reflow soldering, Microelectron. Reliab.,
vol. 48, pp. 10621068, 2008.
[5] B. Ills and G. Harsnyi, Heating characteristics of convection reflow
ovens, Appl. Therm. Eng., vol. 29, no. 1112, pp. 21662171, 2009
[6]
The
Tech-FAQ,
Types
of
Wireless
Networks
[Online],
http://www.tech
faq.com/wirelessnetworks. shtml
[7] Jon Adams, Using ZigBee Wireless Networking to Develop Commercial Products [Online]
http://www.rtcmagazine.com/home/ article.php?id=100656
[8] Bonnie C. Baker, Wireless Communication Using the IrDA Standard Protocol [Online]
http://ww1.microchip.com/downloads/en/Devi ceDoc/adn006.pdf
[9] AURA, Near Field Magnetic Communication Technology [Online]
http://www.auracomm.com/site/content/techno logy.asp
[10] MaxStream, XBee ZigBee OEM RF Module [Online] http://www.maxstream.net/products/
xbee/xbee-oem-rf-module-zigbee.php
[11] ThermaSense Website, Documents [Online] http://seniordesign.engr.uidaho.edu/2006_2007
/thermasense/documents.htm
[12] Temperature Sensors, Type K Thermocouple [Online] http://srdata.nist.gov/its90/download/
type_k.tab
ECE DEPARTMENT
47
TEMP. SENSOR IN PCB
ECE DEPARTMENT
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TEMP. SENSOR IN PCB
ECE DEPARTMENT
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SEMINAR REPORT2016-17

The recent improvements of automatic control mechanisms led to a smarter

implemented sensor can also be used to calibrate other sensors, whose

FIG.1 SIMPLE BLOCK DIAGRAM

In the following chapter the

FIG.2 Circuit diagram

This particular product is used in a lot of different modern consumer

To calculate the thermal parameters the equivalent circuit diagram will be

(1)and (2) the function is

FIG.3 Simulation result of(5) with FR4 above sensor

2.1. TEST-STRUCTURE FOR SENSOR

FIG.4 Component placement

FIG. 5. Simulation result of the sensor (I) under a via (II)

The measurements were conducted on a heating plate. Therefore, a PCB was

FIG. 6. Test PCB with milled trenches (left) and

An exemplary temperature curve is shown I Fig. 5. There is a temperature

UTILITY SOFTWARE FOR SENSOR IMPLEMENTATION

of the selected sensor including the time coefficient

These board file information determine the possible sensor placement

FIG.7 Thermal resistance of heat flow through different directions

SELECTING TEMPERATURE SENSORS FOR SYSTEM

simplifying the design task and significantly reducing the number of

7.4 IC TEMPERATURE SENSORS

CHOOSING THE PROPER TEMPERATURE SENSOR

characteristics and requirements of the target whose temperature needs to

measuring PC board temperature accurately is positioning the sensor in the

8.2 AMBIENT AIR

the air, but isolated from other

components (PC board, power supply, CPU) that might be at a different

Surface-mount ICs are more difficult to use for measuring ambient

Figure 8. Thermistor monitoring air temperature. Note that the long

Figure 9. Using a thermocouple to sense ambient temperature, the MAX6675

Figure 10.The DS18S20 precision 1-Wire temperature sensor IC is mounted

8.3 CPU, GRAPHICS PROCESSOR, FPGA, POWER DEVICE, MODULE,

8.4 CPU, GRAPHICS PROCESSOR, FPGA, POWER DEVICE, MODULE,

remote diode sensor (MAX6642) is shown in Figure 2. This IC measures the

Figure11. The MAX6642 is the world's smallest remote temperature sensor. It

FIG.11 Embedded sensor in PCB

WIRELESS SENSOR IN TEMPERATURE PROTECTION

Every spacecraft entering a planetary

11.1 CONCEPTS CONSIDERED

FIG 12. Fundamental transmitter circuit structure

11.2 SENSOR CALIBERATION

FIG.13 Percent error found in calibration testing

11.3 RECOMMENDED FUTURE WORK

temperature is sent to GSM modem, which is simultaneously displayed in

decoding of the data

through AT command and coding of short PDU. Here, the temperature is

FIG 14. Hardware Implementation

microcontroller. The temperature can be monitored directly which is

FIG.15 Simplified Block diagram

CONCLUSION AND FUTURE WORK

MERITS AND DEMERITS

Better protection for devices and PCB

Good durability for device

Automatic control mechanism of circuit

The appropriate placement of integrated senor is a challenging issue

The position influence the sensor reading

Variation in the combination of materials in PCB

Difficulty in determination of time coefficient time

performance, Comput. Chem. Eng., vol. 47, pp. 145156, 2012.

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