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PRODUCT ATTRIBUTES
commonly used as a high resolution positive resist for direct write e-beam as well as
E-beam, X-ray & deep UV imaging
Standard PMMA products cover a wide range of film thicknesses and are formulated
with 495,000 & 950,000 molecular weight (MW) resins in either chlorobenzene or
the safer solvent anisole. Custom MW products ranging from 50,000 - 2.2 million are
available upon request. In addition, we offer copolymer (MMA (8.5) MAA) products
formulated in the safer solvent ethyl lactate. All MCC PMMA and copolymer resists
APPLICATIONS
Multi-layer T-gate processing
PROCESSING GUIDELINES
Typical process flow for bi-layer T-gate process
Substrate Preparation
The substrate should be clean and dry. Solvent, O2 plasma, and O3
1.
2.
Spin Coat
Bottom Layer
PMMA Resist
Prebake
PMMA
Coat
MicroChem PMMA resists produce low defect coatings over a broad
range of film thicknesses. The film thickness vs. spin-speed curves
displayed in Fig. 1 through 8 provide the information required to
select the appropriate PMMA dilution and spin speed needed to
achieve the desired film thickness.
3.
4.
Spin Coat
Top Layer
Copolymer Resist
Remove Resist
Edge Bead
(2) Spread:
DYNAMIC
STATIC
(3) Spin:
5.
6.
Expose and
Develop
Resist Stack
Prebake
Copolymer
Pre Bake
PMMA
Hot plate:
Convection Oven:
Copolymer
Hot plate:
Convection Oven:
8.
Strip/Remove
Resist Stack
Expose
spectrum.
ACTION
SPRAY**
SPRAY PUDDLE
Dispense
IMMERSION (21OC)
Dispense
No Dispense
30 secs
0.1mm images.
Rinse *
30 secs
Dry
at 248nm.
** Variables such as developer pressure, nozzle type & position, spray pattern, etc. should be optimized
Table 2
Postbake/Hardbake (optional)
To remove residual developer, rinse solvent, and moisture from the
Develop
PMMA and copolymer resists are compatible with immersion
(21oC), spray puddle, and spray process modes. Process variables
such as soft bake, exposure conditions, choice of resist
and developer should be optimized to achieve desired results.
For more process details see the PMMA and Copolymer DEVELOPER
resist image.
Hot Plate OR
Convection Oven
Remove
recommended usage.
COMPOSITION
RESOLUTION
Wet:
Bath:
Spray:
Dry:
plasma O2
SENSITIVITY /
THROUGHPUT
high
high
M/I 1:2
higher
medium
M/I 1:3
very high
low
MIBK
low
high
MIBK
Table 1
N2 blow dried.
Technical Services.
10000
9000
8000
7000
6000
5000
4000
3000
2000
1000
0
495PMMA A Resists
Solids: 2% - 6% in Anisole
7000
6000
Film Thickness ()
Film Thickness ()
495PMMA C Resists
Solids: 2% - 6% in Chlorobenzene
C6
C4
5000
4000
A6
3000
2000
A4
1000
C2
A2
0
500
1000
1500
2000
2500
3000
3500
4000
500
4500
1000
1500
2000
2500
3000
3500
Figure 1
Figure 3
495PMMA C Resists
Solids: 8% - 9% in Chlorobenzene
495PMMA A Resists
Solids: 8% - 11% in Anisole
4000
4500
Film Thickness ()
C9
20000
15000
10000
A11
5000
A8
C8
0
500
1000
1500
2000
2500
3000
3500
4000
500
4500
1000
1500
2000
2500
3000
Figure 2
Figure 4
Copolymer Resists
Solids: 6% - 11% in Ethyl Lactate
12000
Film Thickness, ()
Film Thickness ()
25000
23000
21000
19000
17000
15000
13000
11000
9000
7000
5000
10000
8000
6000
EL 11
4000
EL 9
2000
EL 6
0
500
1000
1500
2000
2500
Figure 9
3000
3500
4000
4500
3500
4000
4500
950PMMA A Resists
Solids: 9% - 11% in Anisole
55000
50000
45000
40000
35000
30000
25000
20000
15000
10000
C10
C9
500
1000
1500
2000
2500
3000
3500
4000
55000
50000
45000
40000
35000
30000
25000
20000
15000
10000
Film Thickness ()
Film Thickness ()
950PMMA C Resists
Solids: 9% - 10% in Chlorobenzene
A11
A9
500
4500
1000
1500
2000
950PMMA C Resists
Solids: 2% - 7% in Chlorobenzene
3500
4000
4500
950PMMA A Resists
Solids: 2% - 7% in Anisole
12000
25000
10000
20000
Film Thickness ()
Film Thickness ()
3000
Figure 7
Figure 5
15000
10000
C7
5000
C4
0
500
2500
C2
1000
1500
2000
2500
3000
3500
4000
8000
6000
4000
A7
2000
A4
4500
A2
0
500
1000
1500
2000
2500
3000
3500
4000
4500
Figure 6
Figure 8
Optical Properties
Copolymer Resists
Optical Properties
495 and 950 PMMA Resists
1.7
1.7
Cauchy Coeffiecients
A
495 PMMA
950 PMMA
1.491
1.488
3.427 e-03
2.898 e-03
Cauchy Coeffiecients
A
C
1.65
1.819 e-04
1.579 e-04
Refractive Index
Refractive Index
1.65
1.6
1.55
1.5
8.5 mEL
1.478
7.204 e-04
-3.478 e-04
1.6
1.55
1.5
1.45
0
300
500
700
Wavelength (nm)
Figure 10
900
1.45
0
300
500
700
Wavelength (nm)
Figure 11
900
Bi-Layer Process
PMMA
PMMA
GaAs
GaAs
Copolymer
PMMA
5. Deposition
e-beam
>>
GaAs
GaAs
PMMA
shaped resist profiles are realized and influenced through the careful
choice of PMMA molecular weight, film thickness and other process
GaAs
GaAs
set points.
Tri-Layer Process
PMMA
PMMA
Copolymer
PMMA
GaAs
GaAs
PMMA
Copolymer
PMMA
GaAs
GaAs
Copolymer
6. Deposition
PMMA
Copolymer
PMMA
GaAs
GaAs
PMMA
Copolymer
PMMA
GaAs
NOTES
PROCESSING ENVIRONMENT
For optimum results, use NANO PMMA & Copolymer Series Resists in a
controlled environment. 20 - 25o 1oC (68 - 77oF) is suggested.
STORAGE
Store upright in original containers in a dry area above 50oF. Do not refrigerate. Keep
away from sources of ignition, light, heat, oxidants, acids, and reducers. Shelf life is
13 months from date of manufacture.
DISPOSAL
Each locality, state, and county has unique regulations regarding the disposal
of organic solvents such as NANO PMMA Series Resists. It is the responsibility of
the customer to dispose of NANO PMMA Series Resists in compliance with all
applicable codes and regulations. See MSDS for additional information.
mcc@microchem.com
The information regarding these products is based on our testing to date, which we believe to
be reliable, but accuracy or completeness is not guaranteed. We make no guarantee or warranty,
expressed or implied, regarding the information, use, handling, storage, or possession of these
products, or the application of any process described herein or the results desired, since the use
and handling of these products are beyond our control.
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