Professional Documents
Culture Documents
School of Materials Science and Engineering, Southeast University, Nanjing 211189, Jiangsu, China
Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta T6G 2V4, Canada
a r t i c l e
i n f o
Article history:
Received 30 October 2009
Received in revised form
31 December 2009
Accepted 6 January 2010
Keywords:
Surface nanocrystallization
Electron work function
Mechanical behavior
Corrosion resistance
a b s t r a c t
Surface nanocrystallization is an effective approach that can be used to enhance many metallic materials for increased resistances to electrochemical and mechanical attacks. Efforts have been continuously
made to improve existing surface nanocrystallization processes for feasible industrial applications. In this
article, we demonstrate a simple process for surface nanocrystallization achieved by repeated punching
with subsuent recovery treatment. As a sample study, we applied this process to a Cu30Ni alloy and
showed that the nanocrystallized CuNi surfaces exhibited increased hardness, corrosion resistance and
electron stability; the properties were further improved by increasing the punching time, which led to
smaller nano-sized grains and thicker nanocrystalline layers. This study demonstrates that the repeated
punching plus recovery treatment is a simple and effective process for surface nanocrystallization.
2010 Elsevier B.V. All rights reserved.
1. Introduction
Different from their coarse-grained polycrystalline counterparts, nanostructured materials possess improved or modied
mechanical, physical and chemical properties, such as strength,
resistances to wear and corrosion, and workability, etc. [14].
Recent studies show that nanocrystallization also helps to reduce
the afnity of stainless steel for bacterial biolms [5], attributed
to the formation of an enhanced passive lm that blocks the surface electronic interaction with the surrounding medium more
effectively. This makes nanocrystallization also promising for suppressing bio-corrosion, i.e. the deterioration of materials as a result
of the metabolic activity of microorganisms, which may produce
enzymes, organic and inorganic acids, and volatile compounds such
as hydrogen sulde, and thus inuences surface electrochemical
processes [6]. Nanocrystallization provides many new opportunities for materials engineers to mitigate problems with wear and
corrosion including bio-corrosion. Various processing techniques
have been developed to fabricate nanocrystalline materials, such
as the consolidation of ultrane power [2], ball-milling [7], severe
plastic deformation (SPD) [8], crystallization of amorphous solids
[4] and electrodepositing [9]. Among these processes, SPD is a simple method to generate nanocrystalline metallic materials but it
is less easy for treating hard bulk metals or alloys [10,11]. However, failure of a work piece often initiates at surface caused by,
Corresponding author.
E-mail address: dongyang.li@ualberta.ca (D.Y. Li).
0921-5093/$ see front matter 2010 Elsevier B.V. All rights reserved.
doi:10.1016/j.msea.2010.01.024
e.g., fatigue, fretting, wear or corrosion. Many mechanical components, e.g., gears, are primarily required to have superior surface
properties, since the surface damage changes the dimensions of
the components thus making them no longer functional. In this
case, surface nanocrystallization could be sufcient, which is much
easier to be achieved by applying SPD to a target surface. Surface
nanocrystallization produced by SPD has attracted many interests [1214]. Processes for surface nanocrystallization through SPD
include surface mechanical attrition [13,14], shot peening [1518],
sliding wear [19], surface rolling [20], wire-brushing [21], and
sandblasting [2224]. Researchers have been continuously making
efforts to improve these techniques in order to produce thicker and
more effective nanocrystalline surface layers for industrial applications.
In this article, we demonstrate a simple surface nanocrystallization process, which combines repeated punching and subsequent
recovery treatment. This process has the capability for generating
relatively thicker nanocrystalline layers with smaller nano-grains
by repeated punching due to the facts that there is no material
removal and the punching force and duration can be varied to
achieve larger depths of the affected layers with smaller dislocation
cells.
The main objective of this work is to demonstrate the effectiveness of this approach with emphasis on effects of the punching
duration on surface grain size, thickness of the nanocrystalline
layer, and corresponding surface mechanical and electrochemical
properties. We use Cu30Ni alloy as a sample material for the study.
Choosing Cu30Ni alloy as the sample material is attributed to its
resistance to corrosion for many applications in the marine envi-
2876
X.Y. Mao et al. / Materials Science and Engineering A 527 (2010) 28752880
CA, USA). Hardness and = We/Wt that is the ratio of the elastic deformation energy (We) to the total deformation energy
(Wt) were measured using a triboscope (nano-indenter made by
Hysitron, Minneapolis, USA) that was attached to the AFM. During the nanoindentation tests, indentation loaddepth curves were
recorded under maximum forces of 50, 100, 200 N, respectively.
Microhardness of the samples was also measured using a microindenter probe (Fisher Technology Ltd., Winsor, CT, USA) with a
diamond tip under a larger load of 50 mN. The hardness of each
tested location was measured at least three times.
Dynamic polarization measurements were carried out using
a commercial electrochemical system (model Pc4-750, Gamry
Instruments Inc., Warminster, PA, USA) by sweeping the potential
at a scan rate of 3 mv/s from 0.4 to 0.1 V vs. the open corrosion
potential (OCP) in a 3.5 wt.%NaCl solution. Prior to the electrochemical tests, mounted samples with electrical connecting wire were
stabilized in the solution for 50 min. The exposed square area of
5 mm 5 mm acted as the working electrode. A saturated calomel
electrode (SCE) was used as the reference electrode and a platinum
plate of 20 mm 20 mm was used as the counter electrode. During
the polarization tests, corrosion current and potential curves were
recorded.
Electron work functions (EWF) of treated and untreated sample surfaces in the ambient environment were determined using a
scanning Kelvin probe (SKP, KP Technology Ltd., Wick, UK). Surfaces
of the samples were lightly polished and etched using a 4% NHO3
solution to remove the deformed top layer (caused by polishing).
A gold tip of 1 mm in diameter was used to scan a sample surface
within an area of 2 mm 2 mm covering 10 10 = 100 measurement points. The EWF value was obtained by averaging EWF values
collected from 100 points over the scanned area. The oscillation
frequency of the SKP tip was 173.5 Hz. The principle and experimental procedure of the SKP system for measuring EWF have been
described in detail in the literature [27,28].
3. Results and discussion
2.2. Characterization
The morphology and grain size of sample surfaces were analyzed using an atomic fore microscope (AFM, Digital Instruments,
Fig. 1. Schematic illustration of a punching process: the hammer was moved up and down at a frequency of 50 Hz to impact a target surface and introduced severe plastic
deformation in the surface layer.
X.Y. Mao et al. / Materials Science and Engineering A 527 (2010) 28752880
(1)
2877
Fig. 2. Representative AFM image of samples punched for 30 min (a) and 120 min (b), respectively, and annealed at 350 C for 1 h.
2878
X.Y. Mao et al. / Materials Science and Engineering A 527 (2010) 28752880
Fig. 5. Average grain size with the punching time (annealed at 350 C for 1 h).
Fig. 4. Hardness versus the depth for samples punched for 30, 60, 90, 120 min, respectively. Annealing condition: 350 C, 1 h.
X.Y. Mao et al. / Materials Science and Engineering A 527 (2010) 28752880
2879
Fig. 7. Effects of the grain size on corrosion potential and passivation current.
enhanced passive lms interfacial adherence through, e.g., possible pegging of the passive lm into the substrate with high-density
grain boundaries [35].
During corrosion, material loss occurs through electrochemical
reactions. The exchange of electrons between a metal and surrounding medium constitutes an electric circuit at the interface.
Corrosion is related to the surface electron behavior or electron
activity [35,36], which may be characterized by the electron work
function (EWF) that is the minimum energy required to move an
electron from inside a metal to its surface [37]. EWF is an informative parameter for further understanding the corrosion behavior or
electrochemical stability of a material. In this work, EWFs of sample surfaces experienced punching and recovery treatment were
measured after light polishing and etching.
Fig. 8 illustrates representative EWFs of nanocrystallized samples having different grain sizes. As shown, the EWF increases as
the grain size decreases, corresponding to an increase in the surface inertness to electrochemical attack. The rise of EWF resulting
from surface nanocrystallization is largely attributed to the formation of an enhanced passive lm. The activity or inertness of a
metal can be characterized by its absolute electrode potential (Em ),
which is dependent on the electron work function (EWF: m ) of
the metal and the contact potential difference (m
) at the metal
s
(M)solution (S) interface [38]
E m = m + m
s
(2)
2880
X.Y. Mao et al. / Materials Science and Engineering A 527 (2010) 28752880
4. Conclusions
This study demonstrates a simple surface nanocrystallization
process combining repeated punching and subsequent recovery
treatment to produce nanocrystalline surface layers, using Cu30Ni
alloy as an example. It was demonstrated that the surface grain
size decreased while the thickness of the nanocrystallized layer
increased with respect to the punching period or duration, resulting
in increases in both hardness and corrosion resistance of Cu30Ni
alloy (in a NaCl solution) with a longer expected service life. The
surface EWF also increased with surface nanocrystallization, corresponding to higher surface stability and enhanced corrosion
resistance.
Acknowledgements
This work is nancially supported by Natural Science and Engineering Research Council of Canada, Major State Basic Research
Development Program of China (Grant No.2007CB616903), and
China Scholar Council (CSC). The authors would like to thank Dr.
Xinhu Tang at University of Alberta for his assistance in using
various instruments for this study and valuable suggestions. The
authors are also grateful to express their thanks to Gao Xin Zhangtong Limited Company (China) for the provision of experimental
materials of Cu30Ni alloy tube.
References
[1] K.S. Kumar, H. Van Swygenhoven, S. Suresh, Acta Materialia 51 (2003)
57435774.
[2] H. Gleiter, Progress in Materials Science 33 (4) (1989) 223315.
[3] C. Suryanarayana, International Materials Reviews 40 (1995) 4164.
[4] K. Lu, Materials Science and Engineering R 16 (4) (1996) 161221.
[5] B. Yu, R.S. Hodges, E. Davis, R.T. Irvin, D.Y. Li, Nanotechnology 19 (2008) 335101.
[6] I.B. Beech, J. Sunner, Current Opinion in Biotechnology 15 (2004) 181186.
[7] C.C. Koch, Nanostructure Materials 2 (2) (1993) 109129.
[8] R.Z. Valiev, A.V. Korznikov, R.R. Mulyukov, Materials Science and Engineering
A 168 (2) (1993) 141148.
[9] U. Erb, A.M. El-Sherik, G. Palumbo, K.T. Aust, Nanostructure Materials 2 (4)
(1993) 383390.
[10] Y. Iwnhashi, Z. Horita, M. Nemoto, T.G. Langdon, Acta Materialia 46 (9) (1998)
33173331.
[11] F. Wetscher, A. Vorhauer, R. Pippan, Materials Science Engineering A 410/411
(25) (2005) 213216.
[12] K. Lu, J. Lu, Journal of Science and Technology 15 (1999) 193197.
[13] J.W. Ren, A.D. Shan, J.B. Zhang, H.W. Song, J.L. liu, Materials Letters 60 (2006)
20762079.
[14] W.L. Li, N.R. Tao, K. Lu, Scripta Materialia 59 (2008) 546549.
[15] T. Wang, J. Yu, B. Dong, Surface and Coatings Technology 200 (2006) 47774781.
[16] X. Wu, N.R. Tao, Y. Hong, B. Xu, J. Lu, K. Lu, Acta Materialia 50 (8) (2002)
20752084.
[17] Y. Todaka, M. Umemoto, J. Li, K. Tsuchiya, Reviews on Advanced Materials
Sciences 10 (2005) 409416.
[18] M. Umemoto, K. Todaka, K. Tsuchiya, Materials Science Engineering A 375377
(2004) 899904.
[19] D.A. Hughes, D.B. Dawson, J.S. Korellls, L.I. Weingarten, Journal of Materials
Engineering and Performance 3 (4) (1994) 459475.
[20] L. Waltz, D. Retraint, A. Roos, P. Olier, Scripta Materialia 60 (1) (2009) 2124.
[21] M. Sato, N. Tsuji, Y. Minamino, Y. and, Koizumi, Materials Science Forum
426432 (2003).
[22] D.Y. Li, L. Wang, W. Li, Materials Science and Engineering A 384 (1/2) (2004)
355360.
[23] X.S. Guan, Z.F. Dong, D.Y. Li, Nanotechnology 16 (2005) 29632971.
[24] X.Y. Wang, D.Y. Li, Electrochemistry Acta 47 (2002) 39393947.
[25] X.Y. Mao, F. Fang, F. Yang, J.Q. Jiang, R.S. Tan, Journal of Materials Processing
Technology 209 (2009) 21452151.
[26] J.K.W. Roberta, Wear 261 (2006) 10121023.
[27] W. Li, D.Y. Li, Acta Materialia 53 (14) (2005) 38713878.
[28] I.D. Baikie, P.J.S. Smish, D.M. Portereld, P.J. Estrup, Review of Scientic Instruments 70 (3) (1999) 18421850.
[29] J.P. Hirth, J. Lothe, Theory of Dislocations, 2nd ed., John Wiley & Sons, Inc., New
York, 1982.
[30] T.H. Courtney, Mechanical Behavior of Materials, 2nd ed., McGraw Hill, Boston,
2000.
[31] P.W.J. Mckenzie, R. Lapovok, Y. Estrin, Acta Materialia 55 (2007) 29852993.
[32] Y. Estrin, L.S. Toth, A. Molinari, Y.B. Chet, Acta Materialia 46 (1998) 55095522.
[33] M. Ohnami, Plasticity and High Temperature Strength of Materials, Elsevier
Applied Science, London, 1988.
[34] R. Liu, D.Y. Li, Y.S. Xie, R. Liewellyn, H.M. Hawthorne, Scripta Materialia 41
(1999) 691.
[35] S. Tao, D.Y. Li, Philosophical Magazine Letters 88 (2008) 137144.
[36] W. Li, D.Y. Li, Applied Surface Science 240 (2005) 388395.
[37] N.W. Ashcroft, N.D. Mermin, Solid State Physics, Saunders College Publishing,
New York, 1976.
[38] J.O. Bockris, S.U.M. Khan, Surface Electrochemistry: A Molecular Level
Approach, Springer, New York, 1993.
[39] I. Milosev, M. Metikos-Hukovis, Electrochimica Acta 42 (10) (1997) 15371548.
[40] E. Hosseini, M. Kazeminezhad, Computational Materials Science 44 (2009)
11071115.