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Contents

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Contents

No.253Ap 2Q 1~

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92
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27

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BP

149

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162

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2014 5-6

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/
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microstructure(

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processing-property

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(N iFe)

1 l

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tap

density

48

Il< 224

20144

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trial-and- error

(N iFe)

1 l

UI! processing

(microstructure)

property

property

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curiosity

processl

mlcrostructure-property

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UI!

processing -mcrostructure-property

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tap

density

48

Il< 224

20144

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pr ing

mlcrostructure
property

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-Ni(OH)

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mistructu

property

PK

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pro ing

()

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processmg-property

y-NiOOH'

trial-and-error

. a-Ni(OH) iJ

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Bode cycle

y-NiOOH' -NiOOH

{3.4 1 "

NH OH

-Ni(OH) ' y-NiOOH

a-Ni(OH)

-Ni(OH)

-Ni(OH) ;

Mg(OH)

1 I

50

y-NiOOH

turbostratic(

433 mAh289

"

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mAhl

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Fe/Co/Mn/AI

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224

20144

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mistructu

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PK

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pro ing

()

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processmg-property

y-NiOOH'

trial-and-error

. a-Ni(OH) iJ

I:

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y-NiOOH' -NiOOH

{3.4 1 "

NH OH

-Ni(OH) ' y-NiOOH

a-Ni(OH)

-Ni(OH)

-Ni(OH) ;

Mg(OH)

1 I

50

y-NiOOH

turbostratic(

433 mAh289

"

) 2

mAhl

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Fe/Co/Mn/AI

WJ

81!

224

20144

51

2DI

Ap,u

AVCO

2-3m

sphere

346

1 .7

270-284

6
7

1 m

70'C

Ni(SO,),1 DPE-31 KOH , 1.2 M


Ni(SO,)j NH

50'C

Zn/Co

700-800 nm( 2)

inate precipitat melh

Ni(SO,)j PAIV Na

55nm

90.C , 12 hr

Ni(SO,)jNaOH , 1. 5M

20-30 nm

50' C, 5
hr aging

Ni(NO, )jNH,OH , 0.2 M

ny

AIIColYlZn

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NH (

275

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10m

sphere

260

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sphere

275

10

7000

( B)

rpm 5 SEM

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.oHI NaOH

hydrolhenmal

melhod

Ni(NO,)j urea , 0.1 M

160 C, 30 minutes

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sphere

11

2 3

N(NH );'

Ni(CH ,COO)j L-argininel


NH,OH , I mM

100 'C, 8 h

1-2m

sphere

12

Ni(NO,)j elhylene diaminel


hydrazine , 1 mM

180'C, 12 h

3-5m

sphere

13


()

52

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processng-mcrostructure

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property

. 2

!i'i 224

20144

(B)SEM

53

2DI

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2-3m

sphere

346

1 .7

270-284

6
7

1 m

70'C

Ni(SO,),1 DPE-31 KOH , 1.2 M


Ni(SO,)j NH

50'C

Zn/Co

700-800 nm( 2)

inate precipitat melh

Ni(SO,)j PAIV Na

55nm

90.C , 12 hr

Ni(SO,)jNaOH , 1. 5M

20-30 nm

50' C, 5
hr aging

Ni(NO, )jNH,OH , 0.2 M

ny

AIIColYlZn

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co.precipilation m~thod

. mAh/g !

Il

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+2

OH-

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, + 6 NH,

( 3)

3N(NH ) ; '

pHfl

NH

NH (

275

pH A

50'C, 16 hr

10m

sphere

260

NaOHpH'

55'C

5-8m

sphere

275

10

7000

( B)

rpm 5 SEM

60-80% '71<

.oHI NaOH

hydrolhenmal

melhod

Ni(NO,)j urea , 0.1 M

160 C, 30 minutes

3-6m

sphere

11

2 3

N(NH );'

Ni(CH ,COO)j L-argininel


NH,OH , I mM

100 'C, 8 h

1-2m

sphere

12

Ni(NO,)j elhylene diaminel


hydrazine , 1 mM

180'C, 12 h

3-5m

sphere

13


()

52

tll1

N(NO )6H O 28-

30 % NH .o H

[N(NH) l"{

F!!:

Iry-and-e rror

NaOH AI(NO)3I(

processng-property

i; AI(OH)4

processng-mcrostructure

) ; 90.C

property

. 2

!i'i 224

20144

(B)SEM

53

1M KOH

0.5C

( B) pH

11 4 1 pH - 12 '

6 50

60.C 2-3
m
()

SEM54

(-Ni(OH)TEM

NaOH

100 % .

4 XRD

a-Ni(OH)B

Inew 3h - 2 rawl
[12hr. rawl12hr

500

38-0715> Ni(OH) 1 0.75H O - Nickel Hydroxide Hydrate

Tap densityjj(A B*tl

1.25

27

1.13g/cm'

1.41

72%

5% () 20%

Charge

jscharge

2%PTFE I%CMC

CV 1680 mV

CC 500 mA

f( nickel foamJ

240 min

300min

< 500 mA

<600 mV

450
4
quqd

(E2U)
2
-zo-c-

OODD
505o

10

20

70

Two - Thets (deg)


4

54

XRDAB

Ili. 224

85

20144

l\( B) m SEM ()

55

1M KOH

0.5C

( B) pH

11 4 1 pH - 12 '

6 50

60.C 2-3
m
()

SEM54

(-Ni(OH)TEM

NaOH

100 % .

4 XRD

a-Ni(OH)B

Inew 3h - 2 rawl
[12hr. rawl12hr

500

38-0715> Ni(OH) 1 0.75H O - Nickel Hydroxide Hydrate

Tap densityjj(A B*tl

1.25

27

1.13g/cm'

1.41

72%

5% () 20%

Charge

jscharge

2%PTFE I%CMC

CV 1680 mV

CC 500 mA

f( nickel foamJ

240 min

300min

< 500 mA

<600 mV

450
4
quqd

(E2U)
2
-zo-c-

OODD
505o

10

20

70

Two - Thets (deg)


4

54

XRDAB

Ili. 224

85

20144

l\( B) m SEM ()

55

Jg

chtstrukturen mit brucithnlichen

density spherical and non-spherical

Schichtionen [Me(I1) l-xMe(III)x(OH),]

Ni(OH), as cathode materials for nickel-

x-, 24 (1970) , 99-113.

metal hydride batteries , Journal of

42

OODOOOO
3332222

(
E
)bU

sample1

[4]P. Axmann , O. Glemser , Nickel

Itap densityl XRD

hydroxide as a matrix for unusual

[9]X. Yue , J. Pan , Y. Sun , Z. Wang ,

valencies: the electrochemical behavior

Synthesis and electrochemical properties

processmg

of metal (III) - ion - substituted nickel

of nano-micro

- microstructure - property

hydroxides of pyroaurite type , Journal

with super high charge-discharge speed,

of AlI oys and Compounds , 246 (1997) ,

lndustrial & Engineering Chemistry

232-24 1.

Research 51 (2012) , 8358-8365.

8642

SEM

200

sample2

10

20 30
Cycle

40

50

60

[1 0]W. Zhang , W.

spherical -Ni(OH)

Jia

L. Yu , Z. W.

performance of multi-element

doped

Hydrogen Energy 34 (2009) , 473-780.

cyc1 e 330 mAhl

iJ

nickel hydroxide prepared by supersonic

[1I ]Z. Zhu , Y. Zhang , Y. Zhang , H. Liu , C

co-precipitation method. Journal of

Zhu , Y. Wu , PEG-directed microwave-

A lI oys and Compounds , 509 (2011) ,

assisted hydrothermal synthesis

7034-7037.

of spherical Ni(OH ), and NiO

300 mAh/g 10% '20 cyc1 e


$iJ

H.Z. Zheng , Electrochemical

[6]Y. Wang , D. Cao , G.

Wa

J. Wen , J.

Xia , M. Yang , International Joumal of

architectures , Ceramics International

Co(OH)

[I]H. Bode , K. Dehmelt , J. Witte ,

Yin , Spherical c1 usters of -Ni(OH)

CoOOH

Zur kenntis der nickeldydro-

nanosheets supported on nickel foam

[12]Y. C. Chen , F. C. Zheng , Y. L. Min ,

11

xidelektrode 1

Uber das nickel

for nickel metal hydride battery.

T. Wao , Y. X. Wang , Y. G. Zhang ,

(11) hydroxiddydrat , Electrochimica

Electrochimica Acta , 56 (2011) , 8285-

One pot synthesis of Ag/Ni(OH) ,

Acta , 11 (1966) , 1079-1087.

8290.

flower microspheres with enhanced

ill

39 (2013) , 2567-2573

[2]R. L. Doyle , I.J. Godwin , M.P.

[7] Y. Kim , D. Kim , Synthesis of high-

photocatalytic perfo m1 ance , Colloids

processing - micros

Brandon , M.E.G. Lyons , Redox

density nickel cobalt aluminum hydro-

and Surfaces A: Physicochemical and

tructure - property

and electrochemical water splitting

xide by continuous co-precipitation

Engineering Aspects 395 (2012) , 125-

property

catalytic properties of hydrated

method , Applied Materials &

l microstructure

metal oxide modified electrodes ,

4 (2012) , 586-589.

Phys. Chem. Chem. Phys. 15

(2013) , 13737-13783.

processing

56

[5]Z.J. Zhang , Y.J. Zhu , J. Bao , X.R.

Power Sources 196 (2011) , 7797-7805.

[3]R. A lI mann , Chimia , Doppelschi-

224

Interfac

130.
[13]M. Salavati-Niasari , M. Entesari ,

[8]E. Shangguan, Z. Chang, H. Tang , X. Z.

Controlled synthesis of sphericalaNi

Yuan , H. Wang , Comparative structural

(OH) hierachical nanostructures via a

and electrochemical study of high-

simple hydrothe m1 al process and their

20144

!>l

Jg

chtstrukturen mit brucithnlichen

density spherical and non-spherical

Schichtionen [Me(I1) l-xMe(III)x(OH),]

Ni(OH), as cathode materials for nickel-

x-, 24 (1970) , 99-113.

metal hydride batteries , Journal of

42

OODOOOO
3332222

(
E
)bU

sample1

[4]P. Axmann , O. Glemser , Nickel

Itap densityl XRD

hydroxide as a matrix for unusual

[9]X. Yue , J. Pan , Y. Sun , Z. Wang ,

valencies: the electrochemical behavior

Synthesis and electrochemical properties

processmg

of metal (III) - ion - substituted nickel

of nano-micro

- microstructure - property

hydroxides of pyroaurite type , Journal

with super high charge-discharge speed,

of AlI oys and Compounds , 246 (1997) ,

lndustrial & Engineering Chemistry

232-24 1.

Research 51 (2012) , 8358-8365.

8642

SEM

200

sample2

10

20 30
Cycle

40

50

60

[1 0]W. Zhang , W.

spherical -Ni(OH)

Jia

L. Yu , Z. W.

performance of multi-element

doped

Hydrogen Energy 34 (2009) , 473-780.

cyc1 e 330 mAhl

iJ

nickel hydroxide prepared by supersonic

[1I ]Z. Zhu , Y. Zhang , Y. Zhang , H. Liu , C

co-precipitation method. Journal of

Zhu , Y. Wu , PEG-directed microwave-

A lI oys and Compounds , 509 (2011) ,

assisted hydrothermal synthesis

7034-7037.

of spherical Ni(OH ), and NiO

300 mAh/g 10% '20 cyc1 e


$iJ

H.Z. Zheng , Electrochemical

[6]Y. Wang , D. Cao , G.

Wa

J. Wen , J.

Xia , M. Yang , International Joumal of

architectures , Ceramics International

Co(OH)

[I]H. Bode , K. Dehmelt , J. Witte ,

Yin , Spherical c1 usters of -Ni(OH)

CoOOH

Zur kenntis der nickeldydro-

nanosheets supported on nickel foam

[12]Y. C. Chen , F. C. Zheng , Y. L. Min ,

11

xidelektrode 1

Uber das nickel

for nickel metal hydride battery.

T. Wao , Y. X. Wang , Y. G. Zhang ,

(11) hydroxiddydrat , Electrochimica

Electrochimica Acta , 56 (2011) , 8285-

One pot synthesis of Ag/Ni(OH) ,

Acta , 11 (1966) , 1079-1087.

8290.

flower microspheres with enhanced

ill

39 (2013) , 2567-2573

[2]R. L. Doyle , I.J. Godwin , M.P.

[7] Y. Kim , D. Kim , Synthesis of high-

photocatalytic perfo m1 ance , Colloids

processing - micros

Brandon , M.E.G. Lyons , Redox

density nickel cobalt aluminum hydro-

and Surfaces A: Physicochemical and

tructure - property

and electrochemical water splitting

xide by continuous co-precipitation

Engineering Aspects 395 (2012) , 125-

property

catalytic properties of hydrated

method , Applied Materials &

l microstructure

metal oxide modified electrodes ,

4 (2012) , 586-589.

Phys. Chem. Chem. Phys. 15

(2013) , 13737-13783.

processing

56

[5]Z.J. Zhang , Y.J. Zhu , J. Bao , X.R.

Power Sources 196 (2011) , 7797-7805.

[3]R. A lI mann , Chimia , Doppelschi-

224

Interfac

130.
[13]M. Salavati-Niasari , M. Entesari ,

[8]E. Shangguan, Z. Chang, H. Tang , X. Z.

Controlled synthesis of sphericalaNi

Yuan , H. Wang , Comparative structural

(OH) hierachical nanostructures via a

and electrochemical study of high-

simple hydrothe m1 al process and their

20144

!>l

2014 |||||| |

conversion to NiO , Polyhedron 33

.....EE--...nnz2.2.2.zzzzz

- -

(2012) , 302-309.

@
@
@

: 1

[14]0. A. Parks , The isoelectric points of

2.

solid oxides , solid hydroxides and

3 1GE

aqueous hydroxo complex systems ,

4
5

Chemical Reviews , 65 (1965) , 177-

198

[l 5]M. Oshitani , H. Yufu , K.


S. Tsuji , Y.

Matsuman

Takashim

Development

of a pasted nickel electrode with high

lU1\

active material utilization , Journal

FFhtKM SH
2 Hgann
T &
-

of the Electrochemical Society 136


(1989) , 1590-1593.

(biochemistry) E

()

~lii

--------- - -

2 Highughput Screening a
3 Quality

by Design

4. Process Analytical Technology

5 Continuous Process

DO DO

"Iearn-before-doing"

"Iearn-while-doing"

l::emrnl
F..iam..11 6

mmmpc com

High-Throughput
Screening Quality

"

Analytical

by

Design Process

Technology Continuous Process

5B

22 4

2014 |||||| |

conversion to NiO , Polyhedron 33

.....EE--...nnz2.2.2.zzzzz

- -

(2012) , 302-309.

@
@
@

: 1

[14]0. A. Parks , The isoelectric points of

2.

solid oxides , solid hydroxides and

3 1GE

aqueous hydroxo complex systems ,

4
5

Chemical Reviews , 65 (1965) , 177-

198

[l 5]M. Oshitani , H. Yufu , K.


S. Tsuji , Y.

Matsuman

Takashim

Development

of a pasted nickel electrode with high

lU1\

active material utilization , Journal

FFhtKM SH
2 Hgann
T &
-

of the Electrochemical Society 136


(1989) , 1590-1593.

(biochemistry) E

()

~lii

--------- - -

2 Highughput Screening a
3 Quality

by Design

4. Process Analytical Technology

5 Continuous Process

DO DO

"Iearn-before-doing"

"Iearn-while-doing"

l::emrnl
F..iam..11 6

mmmpc com

High-Throughput
Screening Quality

"

Analytical

by

Design Process

Technology Continuous Process

5B

22 4

2014 |||||| |

conversion to NiO , Polyhedron 33

.....EE--...nnz2.2.2.zzzzz

- -

(2012) , 302-309.

@
@
@

: 1

[14]0. A. Parks , The isoelectric points of

2.

solid oxides , solid hydroxides and

3 1GE

aqueous hydroxo complex systems ,

4
5

Chemical Reviews , 65 (1965) , 177-

198

[l 5]M. Oshitani , H. Yufu , K.


S. Tsuji , Y.

Matsuman

Takashim

Development

of a pasted nickel electrode with high

lU1\

active material utilization , Journal

FFhtKM SH
2 Hgann
T &
-

of the Electrochemical Society 136


(1989) , 1590-1593.

(biochemistry) E

()

~lii

--------- - -

2 Highughput Screening a
3 Quality

by Design

4. Process Analytical Technology

5 Continuous Process

DO DO

"Iearn-before-doing"

"Iearn-while-doing"

l::emrnl
F..iam..11 6

mmmpc com

High-Throughput
Screening Quality

"

Analytical

by

Design Process

Technology Continuous Process

5B

22 4

j fl;

"A fI..rl 1

1E

(pyrolysis) (CVD)

( 5-6

(1 -31

(BN)

(high

thermal conductivity composite

material)

(SHS)

i (classical high temperare routes) ,

((l))-(

(2)) -( (3)) (1.1 1

,o (T=900.C) (1)

Na2Bp + 2NH

,Cl + N
2

N + CO + H O

EU

(2)

H)
CG
1)

4BN +2NaCI

(T>IOOO'C)

(
)[ .17 1

B20 ,+ 2NH 3 2BN + 3H

Borovinskaya[ l8.

19 )

1 kW 20sec

B,03 + 3CaB 6 + ION

10 79% '

(T>1500'C)

20BN +3CaO

) (>6

MPa) ,

(4)

f 30%

m'l

g l

300-400'C

60

( 2

f!l;

11 y

(1. 5 MPa) 80%

16 m'lg 162

(boron

nitride , BN)

(h-BN) (c-BN) (c-BN)

eV)

224

m 2 /g

6 MPa'

30%

80%

(solid-state

15 m 2

2014 4

metathesis)

'

61

j fl;

"A fI..rl 1

1E

(pyrolysis) (CVD)

( 5-6

(1 -31

(BN)

(high

thermal conductivity composite

material)

(SHS)

i (classical high temperare routes) ,

((l))-(

(2)) -( (3)) (1.1 1

,o (T=900.C) (1)

Na2Bp + 2NH

,Cl + N
2

N + CO + H O

EU

(2)

H)
CG
1)

4BN +2NaCI

(T>IOOO'C)

(
)[ .17 1

B20 ,+ 2NH 3 2BN + 3H

Borovinskaya[ l8.

19 )

1 kW 20sec

B,03 + 3CaB 6 + ION

10 79% '

(T>1500'C)

20BN +3CaO

) (>6

MPa) ,

(4)

f 30%

m'l

g l

300-400'C

60

( 2

f!l;

11 y

(1. 5 MPa) 80%

16 m'lg 162

(boron

nitride , BN)

(h-BN) (c-BN) (c-BN)

eV)

224

m 2 /g

6 MPa'

30%

80%

(solid-state

15 m 2

2014 4

metathesis)

'

61

"

ApJ'!.!

MPa)

(<1

CC)

(W/m K)

20

220
----

I -260

B.O

5iC

Si)N

5iO()

5iO(..)

2050

2530

2500

2800

1700

170

25 I

250

9C210

30

1. 3

( 10W/m*K)

4044

75

3.1

3.0

15

0.5

10"

10"

3.8-5 .4

3.9

2:64

2.20

9-

310

73

67-71

10 11

(Ohm'cm)
l

(RT-1MHz)

(g/cm')

(GPa)

4.1

101

auou

10 1

> 10"

:>1

aong

1.90

3.26

3.89

12

20

43

331

345

(ppmrc)

0.25W/m*K[ 23)

10 1 4

12

15

LED 90.C .

(AIN) (BeO) (SiC)

l 1

T&

T&

(polyimide PI)

1/ \0

i'i (phenolics) (silicones)

(epoxy)

(GPa)

+s

-uq

r
drhU

20144

ANA
2HHa
O+402
H 3
O+MH-H
H{ N
(
)
(
)
(
)
++O
'N+
r

224

1241 :

qO

62

2600
----

AIO

AIN

fif

0.15-

h-BN

"

ApJ'!.!

MPa)

(<1

CC)

(W/m K)

20

220
----

I -260

B.O

5iC

Si)N

5iO()

5iO(..)

2050

2530

2500

2800

1700

170

25 I

250

9C210

30

1. 3

( 10W/m*K)

4044

75

3.1

3.0

15

0.5

10"

10"

3.8-5 .4

3.9

2:64

2.20

9-

310

73

67-71

10 11

(Ohm'cm)
l

(RT-1MHz)

(g/cm')

(GPa)

4.1

101

auou

10 1

> 10"

:>1

aong

1.90

3.26

3.89

12

20

43

331

345

(ppmrc)

0.25W/m*K[ 23)

10 1 4

12

15

LED 90.C .

(AIN) (BeO) (SiC)

l 1

T&

T&

(polyimide PI)

1/ \0

i'i (phenolics) (silicones)

(epoxy)

(GPa)

+s

-uq

r
drhU

20144

ANA
2HHa
O+402
H 3
O+MH-H
H{ N
(
)
(
)
(
)
++O
'N+
r

224

1241 :

qO

62

2600
----

AIO

AIN

fif

0.15-

h-BN

lIl1I

()/

51 %

Agari l2

/PE

PE

1.

/PE . Jt

: 1

: 3 : 3.5 : 3.5)

/PE

X-ray

( 350.C) .

//

()

1.7

TTP

20

(.

UI! 3 :

l 4)

70.C 2

! 35mesh

175.C 50

(37 %

61% 1

1) (

2:: 1 :

3 : 1. 5 P N2 = 0 .45 MPa

Jt

Nga
- BMN
o
d

(a)

kg/cm 3

' .\
(b)

(NDD).

(ODF).

20

25

30

35

40

45

50

55

60

2 (degree)

22 4

1 : 3.5 : 1. 5 P N2 = 0 .4 5 MPa

(
0
).

3 ::

(Mg) (NH 4 C1)(NaN )

1850.C 1300.C .

1 (::

bacBE
ZEE

(Bo)

64

20144!L'1

XRD (a) (b)

65

lIl1I

()/

51 %

Agari l2

/PE

PE

1.

/PE . Jt

: 1

: 3 : 3.5 : 3.5)

/PE

X-ray

( 350.C) .

//

()

1.7

TTP

20

(.

UI! 3 :

l 4)

70.C 2

! 35mesh

175.C 50

(37 %

61% 1

1) (

2:: 1 :

3 : 1. 5 P N2 = 0 .45 MPa

Jt

Nga
- BMN
o
d

(a)

kg/cm 3

' .\
(b)

(NDD).

(ODF).

20

25

30

35

40

45

50

55

60

2 (degree)

22 4

1 : 3.5 : 1. 5 P N2 = 0 .4 5 MPa

(
0
).

3 ::

(Mg) (NH 4 C1)(NaN )

1850.C 1300.C .

1 (::

bacBE
ZEE

(Bo)

64

20144!L'1

XRD (a) (b)

65

5:::

15%
70"

--

120

60

1750

100
Q>

80

40 '1

II!J

'-

30

(U
)

nnunu

6
5
4
5
5
5
1
1
1

50

62%

1850

140

40

1350

h
2

.J

1250

()

70

170

\T

0.2MPa
0 .4 5 MPa 72 % 79%

4:: 1 :

76%

140m'fg45 m'fg

6 6a

'

16 m'

40 m'f 6c 112 m'/g 6d 166 m'/

Jt 2

g 16

1600 C .

166 m1(001)

250

30

1650

'

_ l.~ _

90

6-

\T

()

1450

!ll!

1350

20

>:

50

.-

"^
~

/A

-A..A.

;>/

1600

10

80

()

15

1400

60

.....~

45

1250

1150

35

()

.3

66

1700

/~ y

:.... ,....-1...

40

* -
30

140
120

.60_ .6,

'

"'~

10

1800

65

55

160

bl

- 6.

70

\T

i\T

Q>

{d
b
)

110

J e

1550

40

85

130

79 % 115 m'/g

75

50

3.5: 3.5 P N - 0 .4 5 MPa

1750

150

i+

60

3 .5

: 3.5 : 3.5 :

20

20

20144

1200

{)

22 4

1300

67

5:::

15%
70"

--

120

60

1750

100
Q>

80

40 '1

II!J

'-

30

(U
)

nnunu

6
5
4
5
5
5
1
1
1

50

62%

1850

140

40

1350

h
2

.J

1250

()

70

170

\T

0.2MPa
0 .4 5 MPa 72 % 79%

4:: 1 :

76%

140m'fg45 m'fg

6 6a

'

16 m'

40 m'f 6c 112 m'/g 6d 166 m'/

Jt 2

g 16

1600 C .

166 m1(001)

250

30

1650

'

_ l.~ _

90

6-

\T

()

1450

!ll!

1350

20

>:

50

.-

"^
~

/A

-A..A.

;>/

1600

10

80

()

15

1400

60

.....~

45

1250

1150

35

()

.3

66

1700

/~ y

:.... ,....-1...

40

* -
30

140
120

.60_ .6,

'

"'~

10

1800

65

55

160

bl

- 6.

70

\T

i\T

Q>

{d
b
)

110

J e

1550

40

85

130

79 % 115 m'/g

75

50

3.5: 3.5 P N - 0 .4 5 MPa

1750

150

i+

60

3 .5

: 3.5 : 3.5 :

20

20

20144

1200

{)

22 4

1300

67

m
J

='

2HC1 x(g)+2xNa
_..- --(g)
, ,

160

90
80

70

:174

(4
0
)

4.

40 .,

'".

0,1

0, 3

0.4

0,6

0]

0, 8

0, 9

--,
10
,

~ 14

60
T

-,-1.1

-1 40

1 1300

20

1200

1. 2

(a)

200nm
6

(a)16 m'/g (b)40 m' (c)116 m' (d)166

2NaN3(s)

2Na

, ,
-- --(g)

xHCL+B
)' -(

66

(8)

NH.Cl
4 --(s)

(9)

N
H.., + ----(g)
HCl
- ---3(g)

( 1AU)

+ 3N
--

'Z(

BCL_
,

+ H
2

(1 )

2BClx(g)
, ,+ -.-.
2xNa
,,+ N
--(g)
- "2(g)

. tlll(8)-(1 5):

B ,03(') + 3Mg(,) 2B( ,) + 3MgO(,)

m'/g

2BN.(s), + ---2xNaCl
----(5)

(1 2)

2BCl , , + N.. , + ----Z(g)


xH
(

2(g)

2BN (s) + 2xHCl


, ,

-'---~-(g)

(1 3)

22 4

7 (1

( (11)) .

8 15 ) (1 3.6

( (12)

(1)

70vol %

tt

(9) (10))

(MPa)

"

:i

30

( (8))

-1 1600

c>

-1 80

(15)

120

-.-

2()+N(/or NH) 2BN(

(14)

1700

\2

50

140

1800

2xNaCL+H

--2(g)

---- ----(s)

{|

3.5 4 fl!

25

80vol% . 1

3.5

-3

(8 15 ) .

80 vo

{ 70 vol%

(4 5 5.5

3.8 4.2 W/mK'

W/mK 0

WlmK

5 3 3.5 4

2 3.5

20f

20144

69

m
J

='

2HC1 x(g)+2xNa
_..- --(g)
, ,

160

90
80

70

:174

(4
0
)

4.

40 .,

'".

0,1

0, 3

0.4

0,6

0]

0, 8

0, 9

--,
10
,

~ 14

60
T

-,-1.1

-1 40

1 1300

20

1200

1. 2

(a)

200nm
6

(a)16 m'/g (b)40 m' (c)116 m' (d)166

2NaN3(s)

2Na

, ,
-- --(g)

xHCL+B
)' -(

66

(8)

NH.Cl
4 --(s)

(9)

N
H.., + ----(g)
HCl
- ---3(g)

( 1AU)

+ 3N
--

'Z(

BCL_
,

+ H
2

(1 )

2BClx(g)
, ,+ -.-.
2xNa
,,+ N
--(g)
- "2(g)

. tlll(8)-(1 5):

B ,03(') + 3Mg(,) 2B( ,) + 3MgO(,)

m'/g

2BN.(s), + ---2xNaCl
----(5)

(1 2)

2BCl , , + N.. , + ----Z(g)


xH
(

2(g)

2BN (s) + 2xHCl


, ,

-'---~-(g)

(1 3)

22 4

7 (1

( (11)) .

8 15 ) (1 3.6

( (12)

(1)

70vol %

tt

(9) (10))

(MPa)

"

:i

30

( (8))

-1 1600

c>

-1 80

(15)

120

-.-

2()+N(/or NH) 2BN(

(14)

1700

\2

50

140

1800

2xNaCL+H

--2(g)

---- ----(s)

{|

3.5 4 fl!

25

80vol% . 1

3.5

-3

(8 15 ) .

80 vo

{ 70 vol%

(4 5 5.5

3.8 4.2 W/mK'

W/mK 0

WlmK

5 3 3.5 4

2 3.5

20f

20144

69

12

E
~ 8

=Z

s
=

__
I

BN1~m

____ BN
BN

__

8~m

15m

E
O

3.84.2 W/mK'

Acta , 434-157 (2005)

AIN

Goutaudier; B. Bonnetot, "High Surface

and High Nanoporosity Boron Nitride

Adapted to Hydrogen Sequestration" ,

Materials Science Forum , 555 , 355-362

13.6~m

(2007).

E 1

[7]M. Zheng;Y. Liu;Y. Gu;Z. Xu ,


"Synthesis and characterization of boron

filler nl0nl(%)

[6] L. Laversenne;S. Miljani;P. Miele;C

70

combustion catalysts" , Thermochimica

xy

iZ 10

g 6

{ 7 W/mK'

[I]A. Li pp;K. A. Schwetz;K. Hunold ,

nitride sponges as a novel support for

"Hexagonal boron nitride: Fabrication ,

metal nanopartic1es" , Science in China

properties and applications" , Journal of

Series B: Chemistry, 51 , 205-210

the European Ceramic Society, 5 , 3-9

(2008)

(l 989).

[8]Y. Li;J. Zhou;Z. Luo;S. Tung;E.

[2]R. T. Paine;C. K. Narula , "Synthetic

Schneider;J. Wu;X. Li , "Investigation on

routes to boron nitride" , Chemical

two abnormal phenomena about thermal

Reviews , 90 , 73-91 (1990)

conductivity enhancement of BN!EG

[3]Y. Kimura; T. Wakabayashi;K. Okada;T

( l

Wada;H. Nishikawa , "Boron nitride as a

) 13.6

lubricant additive" , Wear, 232 , 199-206

(l 999).

i60 vol%

(8 15 )

nanoftuids" , Nanoscale research letters ,


6 , 443 (2011)

[9]G. Lian;X. Zhang;S. Zhang;D. Liu;D.


Cui;Q. Wang , "Controlled fabrication

[4]R. Ma;Y. Bando;T. Sato;D. Golberg;H

of ultrathin-shell BN hollow spheres

Zhu;C. Xu;D. Wu , "Synthesis of boron

with excellent performance in hydrogen

( 1.0 MPa)

nitride nanofibers and measurement

storage and wastewater treatment" ,

(79%)( 170

m'l

of their hydrogen uptake capacity" ,

Energy & Environmental Science , 5 ,

60 vol%

g)

Applied Physics Letters , 81 , 5225

7072 (2012)

70

(2002).

vol%7W/mK'

60 vol%

4.5 5.5 WI

mK'

60 vol%

22 4

[IO] L. Wang; L. Shen;X. Xu; L. Xu;Y. Qian ,

[5]G. Postole;M. Caldararu;N. 1. 10nescu; B.

"Facile synthesis of uniform h-BN

Bonnetot;A. Auroux;C. Guimon , "Boron

nanocrystals and their application as a

nitride: A high potential support for

catalyst support towards the selective

20144

71

12

E
~ 8

=Z

s
=

__
I

BN1~m

____ BN
BN

__

8~m

15m

E
O

3.84.2 W/mK'

Acta , 434-157 (2005)

AIN

Goutaudier; B. Bonnetot, "High Surface

and High Nanoporosity Boron Nitride

Adapted to Hydrogen Sequestration" ,

Materials Science Forum , 555 , 355-362

13.6~m

(2007).

E 1

[7]M. Zheng;Y. Liu;Y. Gu;Z. Xu ,


"Synthesis and characterization of boron

filler nl0nl(%)

[6] L. Laversenne;S. Miljani;P. Miele;C

70

combustion catalysts" , Thermochimica

xy

iZ 10

g 6

{ 7 W/mK'

[I]A. Li pp;K. A. Schwetz;K. Hunold ,

nitride sponges as a novel support for

"Hexagonal boron nitride: Fabrication ,

metal nanopartic1es" , Science in China

properties and applications" , Journal of

Series B: Chemistry, 51 , 205-210

the European Ceramic Society, 5 , 3-9

(2008)

(l 989).

[8]Y. Li;J. Zhou;Z. Luo;S. Tung;E.

[2]R. T. Paine;C. K. Narula , "Synthetic

Schneider;J. Wu;X. Li , "Investigation on

routes to boron nitride" , Chemical

two abnormal phenomena about thermal

Reviews , 90 , 73-91 (1990)

conductivity enhancement of BN!EG

[3]Y. Kimura; T. Wakabayashi;K. Okada;T

( l

Wada;H. Nishikawa , "Boron nitride as a

) 13.6

lubricant additive" , Wear, 232 , 199-206

(l 999).

i60 vol%

(8 15 )

nanoftuids" , Nanoscale research letters ,


6 , 443 (2011)

[9]G. Lian;X. Zhang;S. Zhang;D. Liu;D.


Cui;Q. Wang , "Controlled fabrication

[4]R. Ma;Y. Bando;T. Sato;D. Golberg;H

of ultrathin-shell BN hollow spheres

Zhu;C. Xu;D. Wu , "Synthesis of boron

with excellent performance in hydrogen

( 1.0 MPa)

nitride nanofibers and measurement

storage and wastewater treatment" ,

(79%)( 170

m'l

of their hydrogen uptake capacity" ,

Energy & Environmental Science , 5 ,

60 vol%

g)

Applied Physics Letters , 81 , 5225

7072 (2012)

70

(2002).

vol%7W/mK'

60 vol%

4.5 5.5 WI

mK'

60 vol%

22 4

[IO] L. Wang; L. Shen;X. Xu; L. Xu;Y. Qian ,

[5]G. Postole;M. Caldararu;N. 1. 10nescu; B.

"Facile synthesis of uniform h-BN

Bonnetot;A. Auroux;C. Guimon , "Boron

nanocrystals and their application as a

nitride: A high potential support for

catalyst support towards the selective

20144

71

~"

oxidation of benzyl alcohol" , RSC

electronic and optoelectronic

of Materials

Advances , 2, 10689 (2012)

applications" , Proceedings of the

(2000)

[ll]X. Wang;A. Pakdel;J. Zhang;Q.

[27] Y. Hashizume;M. Uenishi;T. Yokote ,


U.S. , 1990

[25]H. B. Shan; Y. Zhu;Z. T.

Zhan

[28] W.

Zh ;S.

Qi;H. Li;S. Shao , "Study on

Weng;T. Zhai;C. Zhi;D. Golberg; Y.

[17]G. Ciofani;V. Raffa;J. Yu; Y. Chen;Y.

"Surface treatment and hydrolysis

insulating thermal conductive BNIHDPE

Bando , "Large-surface-area BN

Obata;S. Takeoka;A. Menciassi;A

kinetics of organic films coated

composites" , Thermochimica Acta , 452 ,

nanosheets and their utilization in

Cuschieri, "Boron Nitride Nanotubes:

AIN powder" , British Ceramic

36-42 (2007)

polymeric composites with improved

A Novel Vector for Targeted Magnetic

Transactions, 98 , 146-150 (1 999).

thermal and dielectric properties" ,

Drug Delivery" , Current Nanoscience ,

Nanoscale research letters , 7 , 662

5, 33-38 (2009).
[1 8] 1. P.

(2012)
[12]C. Tang;Y. Bando;C. Li u;S. Fan;J.

[26] 1. Ganesh;N. Thiyagarajan;G.


Sundarar an;S.

Borovinskaya;1.

Vershinnikov;A.

Wang;T. Iizuka;M. Kozako; Y. Ohki;T.

Tanaka , "Development of epoxy/BN

M. Olhero;J. M. F.

composites with high thermal con-

"A non-aqueous processing

ductivity and sufficient dielectric break-

route for phosphate-protection of

down strength partI - sample preparations

Ferrei

G. Merzhanov, 1999

[2Z.

Zhang;X. Ding;D. Golberg , "Thermal

[19] 1. P. Borovinskaya , "Preparation of

AIN powder against hydrolysis" ,

and thermal conductivity" , IEEE

conductivity of nanostructured boron

ultrafine boron nitride powders by

Journal of the European Ceramic

Transactions on Dielectrics and Electrical

nitride materials" , The journal of

self-propagating high temperature

Society

Insulation , 18 , 1963-1972 (20 11)

physical chemistry. B , 110 , 10354-

synthesis.pdf 1norganic

10357 (2006).

39 , 588-593 (2003).

[1 R.

Zhl T.

[20]C.-C. Hwang;S.- L. Chung , "Com-

Xu;D. Wu , "Hydrogen Uptake in

bustion synthesis of boron nitride

Boron Nitride Nanotubes at Room

powder" , Journal of Materials

Temperature" , J. Am. Chem. Soc. , 124,

Research , 13 , 680-686 (1998).


[21]P. A. Hochstein , U.S. , 5857767, 1999.

[14]D. Golberg;Y. Bando;Y. Huang;T


Terao;M. Mitome;C. Tang;C. Zhi ,

[2 H.

Lee;K. Neville , "Handbook of

Epoxy Resins" , Joumal , (1 967).

"Boron nitride nanotubes and

[23]K. W. Garrett;H. M. Rosenberg , "The

nanosheets" , ACS nano , 4 , 2979-2993

thermal conductivity of epoxy-resinl

(2010)

powder composite materials" , Joumal

[15]C. Jacobsen , "Boron Nitride: A


Novel Support for

2281-2288 (2008).

Materials ,

Sato;C.

Ma;Y. Bando;H.

7672-7673 (2002).

RutheniumBased

Ammonia Synthesis Catalysts" ,


Joumal ofCatalysis, 200, 1-3 (2001).
[16]R. F. Davis , "111- V nitrides for

72

IEEE , 79, 702-712 (1991).

Science 2743-2748

of Physics D . Applied Physics , 7 ,

1247-1258 (1 974).
[24]S. Fukumoto;T. Hookabe;H. Tsubakino ,
"Hydrolysis behavior of aluminum
Il itride

in various solutions" , Joumal

224

20144

73

~"

oxidation of benzyl alcohol" , RSC

electronic and optoelectronic

of Materials

Advances , 2, 10689 (2012)

applications" , Proceedings of the

(2000)

[ll]X. Wang;A. Pakdel;J. Zhang;Q.

[27] Y. Hashizume;M. Uenishi;T. Yokote ,


U.S. , 1990

[25]H. B. Shan; Y. Zhu;Z. T.

Zhan

[28] W.

Zh ;S.

Qi;H. Li;S. Shao , "Study on

Weng;T. Zhai;C. Zhi;D. Golberg; Y.

[17]G. Ciofani;V. Raffa;J. Yu; Y. Chen;Y.

"Surface treatment and hydrolysis

insulating thermal conductive BNIHDPE

Bando , "Large-surface-area BN

Obata;S. Takeoka;A. Menciassi;A

kinetics of organic films coated

composites" , Thermochimica Acta , 452 ,

nanosheets and their utilization in

Cuschieri, "Boron Nitride Nanotubes:

AIN powder" , British Ceramic

36-42 (2007)

polymeric composites with improved

A Novel Vector for Targeted Magnetic

Transactions, 98 , 146-150 (1 999).

thermal and dielectric properties" ,

Drug Delivery" , Current Nanoscience ,

Nanoscale research letters , 7 , 662

5, 33-38 (2009).
[1 8] 1. P.

(2012)
[12]C. Tang;Y. Bando;C. Li u;S. Fan;J.

[26] 1. Ganesh;N. Thiyagarajan;G.


Sundarar an;S.

Borovinskaya;1.

Vershinnikov;A.

Wang;T. Iizuka;M. Kozako; Y. Ohki;T.

Tanaka , "Development of epoxy/BN

M. Olhero;J. M. F.

composites with high thermal con-

"A non-aqueous processing

ductivity and sufficient dielectric break-

route for phosphate-protection of

down strength partI - sample preparations

Ferrei

G. Merzhanov, 1999

[2Z.

Zhang;X. Ding;D. Golberg , "Thermal

[19] 1. P. Borovinskaya , "Preparation of

AIN powder against hydrolysis" ,

and thermal conductivity" , IEEE

conductivity of nanostructured boron

ultrafine boron nitride powders by

Journal of the European Ceramic

Transactions on Dielectrics and Electrical

nitride materials" , The journal of

self-propagating high temperature

Society

Insulation , 18 , 1963-1972 (20 11)

physical chemistry. B , 110 , 10354-

synthesis.pdf 1norganic

10357 (2006).

39 , 588-593 (2003).

[1 R.

Zhl T.

[20]C.-C. Hwang;S.- L. Chung , "Com-

Xu;D. Wu , "Hydrogen Uptake in

bustion synthesis of boron nitride

Boron Nitride Nanotubes at Room

powder" , Journal of Materials

Temperature" , J. Am. Chem. Soc. , 124,

Research , 13 , 680-686 (1998).


[21]P. A. Hochstein , U.S. , 5857767, 1999.

[14]D. Golberg;Y. Bando;Y. Huang;T


Terao;M. Mitome;C. Tang;C. Zhi ,

[2 H.

Lee;K. Neville , "Handbook of

Epoxy Resins" , Joumal , (1 967).

"Boron nitride nanotubes and

[23]K. W. Garrett;H. M. Rosenberg , "The

nanosheets" , ACS nano , 4 , 2979-2993

thermal conductivity of epoxy-resinl

(2010)

powder composite materials" , Joumal

[15]C. Jacobsen , "Boron Nitride: A


Novel Support for

2281-2288 (2008).

Materials ,

Sato;C.

Ma;Y. Bando;H.

7672-7673 (2002).

RutheniumBased

Ammonia Synthesis Catalysts" ,


Joumal ofCatalysis, 200, 1-3 (2001).
[16]R. F. Davis , "111- V nitrides for

72

IEEE , 79, 702-712 (1991).

Science 2743-2748

of Physics D . Applied Physics , 7 ,

1247-1258 (1 974).
[24]S. Fukumoto;T. Hookabe;H. Tsubakino ,
"Hydrolysis behavior of aluminum
Il itride

in various solutions" , Joumal

224

20144

73

Aprif

1954 D.M.

Chapin

CIGS LED

[1]

(Silicon-based

cell) (Thin

film solar

cell) (Organic

solar

cell)['

60

(LED)

(CIGS

thin-film solar cell)

5.3x 10 20

(GaAs) (CdTe)

2.1x10 19 2040

(Cu (I n 1.,' G a,) Se )111

8 .4 x 10'0

3.8x10'4

1. 10" 1

19.6%[6]

30

; (Cd)

14

solar

224

20144

15

Aprif

1954 D.M.

Chapin

CIGS LED

[1]

(Silicon-based

cell) (Thin

film solar

cell) (Organic

solar

cell)['

60

(LED)

(CIGS

thin-film solar cell)

5.3x 10 20

(GaAs) (CdTe)

2.1x10 19 2040

(Cu (I n 1.,' G a,) Se )111

8 .4 x 10'0

3.8x10'4

1. 10" 1

19.6%[6]

30

; (Cd)

14

solar

224

20144

15

CIGS

(Donor)

N (N-type

20.8 %

3A

4A 5A 6A

(Hole) . 3

{:

1993 NAKAMURA

(Intrinsic semiconductor)

(Acceptor)

(Extrinsic

(LED)

(P-type semiconductor)

(Light-emitting

Diode, LED)i

P N

4 5

P N

(:)

PN (PN

2 . 'N

(electron) P

(hole) (Space

semiconductor) . 3

junction)

25.0%

15-16%

20.4%

10-14%

-.-.-.

(Monoc slalline)

(Silin.based)

(Polycryslalline)

~-

(Amorphous)
GaAs

(Thin film)

( anic)

76

semiconductor)

(:)

4%

7%

i1lI

28.8%

1 -23%

16.1%

- -

[]

CdTe

19.6%

Cu(lnl_~tGa)Se2

20.8%

10-15%

Dye.sensitized

11 .4%

5-10%

Organic

11. 1%

224

20144

77

CIGS

(Donor)

N (N-type

20.8 %

3A

4A 5A 6A

(Hole) . 3

{:

1993 NAKAMURA

(Intrinsic semiconductor)

(Acceptor)

(Extrinsic

(LED)

(P-type semiconductor)

(Light-emitting

Diode, LED)i

P N

4 5

P N

(:)

PN (PN

2 . 'N

(electron) P

(hole) (Space

semiconductor) . 3

junction)

25.0%

15-16%

20.4%

10-14%

-.-.-.

(Monoc slalline)

(Silin.based)

(Polycryslalline)

~-

(Amorphous)
GaAs

(Thin film)

( anic)

76

semiconductor)

(:)

4%

7%

i1lI

28.8%

1 -23%

16.1%

- -

[]

CdTe

19.6%

Cu(lnl_~tGa)Se2

20.8%

10-15%

Dye.sensitized

11 .4%

5-10%

Organic

11. 1%

224

20144

77

"

Apm

PN

. 3

78

PN

' CIGS)

(Intrinsic zinc oxide)

P :

(Transparent conductive oxide)

(Cu{l n ."Ga) Se

charge region) 3

P-N 50

(Window layer)

(Buffer layer)N a

NP

(Transparent

:N

(Photocurrent) 4

conductive oxide) In03 :

Sn( 0) ZnO : AI(AZO)

(Cadmium sulfide)

(Metal

(Sputter) (Molybdenum)

(Zinc sulfide)(Indium sulfide) ,

chemical vapor deposition , MOCVD)

p PN

ZnO : B(BZO) (Ni)

224

20144

organic

79

"

Apm

PN

. 3

78

PN

' CIGS)

(Intrinsic zinc oxide)

P :

(Transparent conductive oxide)

(Cu{l n ."Ga) Se

charge region) 3

P-N 50

(Window layer)

(Buffer layer)N a

NP

(Transparent

:N

(Photocurrent) 4

conductive oxide) In03 :

Sn( 0) ZnO : AI(AZO)

(Cadmium sulfide)

(Metal

(Sputter) (Molybdenum)

(Zinc sulfide)(Indium sulfide) ,

chemical vapor deposition , MOCVD)

p PN

ZnO : B(BZO) (Ni)

224

20144

organic

79

A II!.:i i

Grid
Anti-reflection layer

{:

CIGS

vmmxImu= ACxE

vm

F. F. =
Transparent conductive oxide (400 nm)

Intrinsic zinc oxide (100 nm)


Buffer layer (50 nm)

(Recombination)

n xA , x E

-:-:-

v" C

[5C

):

'7=
Cu(ln ,a,)Se, (2 -4 m)

Imx:

F .F. xVoc x

[5C

Ac x E

---+

6.

Molybdenum (5 nm)
Substrate

I~

---+

CJGS

(Al)

Vo ISC

V CIGS

(Vol

(Band

(1) (F.F.)

gap , Eg)

voc

1"

(Pm)

(Anti-reflection layer)

P~nv
'7(%)= x
m
V~nv

100%

(1)

Ln

100%

=L x

CIGS

Ac x E

(Fill factor, F.F.)

AM 1.5

(P m ) (Open circuit

2S'C IOOOW/

voltage , Vol (Short circuit

cm'(E)

curre 1sc):


(P)

ao

P=n

...n.... X

v
Jl- t Az!

l n. .
'WI

F.F.= :=L

v" c

[5C

VOC

[5C

22 4

20144

1lI!-

a1

A II!.:i i

Grid
Anti-reflection layer

{:

CIGS

vmmxImu= ACxE

vm

F. F. =
Transparent conductive oxide (400 nm)

Intrinsic zinc oxide (100 nm)


Buffer layer (50 nm)

(Recombination)

n xA , x E

-:-:-

v" C

[5C

):

'7=
Cu(ln ,a,)Se, (2 -4 m)

Imx:

F .F. xVoc x

[5C

Ac x E

---+

6.

Molybdenum (5 nm)
Substrate

I~

---+

CJGS

(Al)

Vo ISC

V CIGS

(Vol

(Band

(1) (F.F.)

gap , Eg)

voc

1"

(Pm)

(Anti-reflection layer)

P~nv
'7(%)= x
m
V~nv

100%

(1)

Ln

100%

=L x

CIGS

Ac x E

(Fill factor, F.F.)

AM 1.5

(P m ) (Open circuit

2S'C IOOOW/

voltage , Vol (Short circuit

cm'(E)

curre 1sc):


(P)

ao

P=n

...n.... X

v
Jl- t Az!

l n. .
'WI

F.F.= :=L

v" c

[5C

VOC

[5C

22 4

20144

1lI!-

a1

':111M

CIGS
CIGS

550.C ' Cu [J Se

Ar ' Ar+

{ Cllxsey

CIGS

Cu-rich ' In

CIGS

Ga Se{

Cu CuGa InGa

(Co-evaporation)

1994

Cus e y CIGS

( 28.C)

(Sputtering)

(NREL)19J

{ Cu-poor ' Cu/

(154.C)

(Three-stage coevaporation)

(In+Ga)=0.8-0.9 f "

(Electrodeoposition) (Spray

: 300

CIGS 19.9 %

pyrolysis) (Nanoparticle

-400.C ' In Ga Se

CIGS

coating) (Solution coating)

(I nGa) Se y f j:

ZSW(Zentrum r

Sonnenenergie-

Culn

und Wasserstoff-Forschung Baden-

Wrttemberg , ZSW, Stut Germany)

Cu

1300-1500'C

In

1000-1200'C

Ga

1150-1250'C

Se

250-380'C

{ (CIG

) (Selenization)

CIGS (Cu/(I n+Ga)=0.8-0.9 Gal

CIGS

(In+Ga)=0.2-0

9 l Se

(Ga grading)(Band

(Se Se)(

CIGS

gap Engineering)

500-550 "C)

CIGS

CIGS

Se

()

Se Se 9

1.

Substrate

Cu , In , Ga , 5e Vapor

( PBN)

2.

7 (Co

(Sputtering)

evaporation)

CIGS

82

20.8%

224

20144

83

':111M

CIGS
CIGS

550.C ' Cu [J Se

Ar ' Ar+

{ Cllxsey

CIGS

Cu-rich ' In

CIGS

Ga Se{

Cu CuGa InGa

(Co-evaporation)

1994

Cus e y CIGS

( 28.C)

(Sputtering)

(NREL)19J

{ Cu-poor ' Cu/

(154.C)

(Three-stage coevaporation)

(In+Ga)=0.8-0.9 f "

(Electrodeoposition) (Spray

: 300

CIGS 19.9 %

pyrolysis) (Nanoparticle

-400.C ' In Ga Se

CIGS

coating) (Solution coating)

(I nGa) Se y f j:

ZSW(Zentrum r

Sonnenenergie-

Culn

und Wasserstoff-Forschung Baden-

Wrttemberg , ZSW, Stut Germany)

Cu

1300-1500'C

In

1000-1200'C

Ga

1150-1250'C

Se

250-380'C

{ (CIG

) (Selenization)

CIGS (Cu/(I n+Ga)=0.8-0.9 Gal

CIGS

(In+Ga)=0.2-0

9 l Se

(Ga grading)(Band

(Se Se)(

CIGS

gap Engineering)

500-550 "C)

CIGS

CIGS

Se

()

Se Se 9

1.

Substrate

Cu , In , Ga , 5e Vapor

( PBN)

2.

7 (Co

(Sputtering)

evaporation)

CIGS

82

20.8%

224

20144

83

"

Ap

2.

Heater

260 nm '

(Nanoparticle
coating) (Ink

30% '

Se/H Se

CIGS' 13.6%1 13

CIGS

{ Se

10 . Solartechnik

CIGS CIGS

Cu S CIGS

RTP 14.5%[

ET(Internation

Solar Electronic
3.

H Se

Technology

(450'C) Hs e CIGS lUi

()

H Se

1.

ppm

(E 1ec trodeop is iti on)

f!

In Ins e

CIGS

In RTP

CIG

In

CIGS

H Se CIGS

84

Process) ,

Inc.)

CuO+ln.O
,-,
pwder

Powdisant+

water mixing 42 hr
ball milllng

Filter

Cu-Se In-Se

Cu In

TSMC Solar Miasole l Showa

Shelllll.121

CIGS

1 1. 2%

Dlor

blading

Selenizat

Repeal3

450'C
15min

mes

10

224

20144

ISET

85

"

Ap

2.

Heater

260 nm '

(Nanoparticle
coating) (Ink

30% '

Se/H Se

CIGS' 13.6%1 13

CIGS

{ Se

10 . Solartechnik

CIGS CIGS

Cu S CIGS

RTP 14.5%[

ET(Internation

Solar Electronic
3.

H Se

Technology

(450'C) Hs e CIGS lUi

()

H Se

1.

ppm

(E 1ec trodeop is iti on)

f!

In Ins e

CIGS

In RTP

CIG

In

CIGS

H Se CIGS

84

Process) ,

Inc.)

CuO+ln.O
,-,
pwder

Powdisant+

water mixing 42 hr
ball milllng

Filter

Cu-Se In-Se

Cu In

TSMC Solar Miasole l Showa

Shelllll.121

CIGS

1 1. 2%

Dlor

blading

Selenizat

Repeal3

450'C
15min

mes

10

224

20144

ISET

85

2013

(Spin coating)

(Screen printing) (Doctor-blade

(Roll

coating)

to-Roll)

CIGS

!!

f crGS

CIGS

CIGS

crGS

IBMI.1 cu8 s rn Se Ga Se

Ga (N H)
400-525'C

crGS

{ 15.2% crGS

11 '

CIGS

Cu2S

In2Se,

Ga+Se

'

\
01 Iveln

N4H.

-~

SelS

Spin ngon

5ubstrate

.',
-

10'/Paally

dEmposep3re50cu.cr

Fllm250-3SO

CIGSFllm

11

86

CrGS

Thicker l
Film

CIGS

IBM

224

crGS

j;)Manz

Wrth Solar; 2011 Manz

W Solar CrGS

(19J

2013 10 1

Solarion

ion-beam deposition

2018

crGS 14%

Global Solar Energy 2000

crGS

5.75

12.6 % 2011

20144

mxO.5 m

B7

2013

(Spin coating)

(Screen printing) (Doctor-blade

(Roll

coating)

to-Roll)

CIGS

!!

f crGS

CIGS

CIGS

crGS

IBMI.1 cu8 s rn Se Ga Se

Ga (N H)
400-525'C

crGS

{ 15.2% crGS

11 '

CIGS

Cu2S

In2Se,

Ga+Se

'

\
01 Iveln

N4H.

-~

SelS

Spin ngon

5ubstrate

.',
-

10'/Paally

dEmposep3re50cu.cr

Fllm250-3SO

CIGSFllm

11

86

CrGS

Thicker l
Film

CIGS

IBM

224

crGS

j;)Manz

Wrth Solar; 2011 Manz

W Solar CrGS

(19J

2013 10 1

Solarion

ion-beam deposition

2018

crGS 14%

Global Solar Energy 2000

crGS

5.75

12.6 % 2011

20144

mxO.5 m

B7

"

Solar Frontier 12

12

!I!!

(CIS)

(Ce") YAG

. MSi , O , N, (M=

(23) LED

Ca Sr Ba)

CIGS

YAG

" 2008

YAG

M =

TUV NORD

LED

Ca Sr Ba

0.6 mx l. 2 m 11 - 12 %

i(color

(Monoclinic) P2/c'

2013 7

rendering index , CRI)

P2 /m PJrn a OEu'

CIGS

[I ]Chapin D. M.; Fuller C. S. ; Pearson

(15 .7%)1 CIGS

G. L. , "A New silicon P-N Junction

; 2014

LED {

LED

photoc11

17% '

CaSi oN : Eu" SrSi ON : Eu "

into electrical power ", J. App l. Phys. ,

25 , 676(1954).

17%

: Ce"

YAG

for converting solar radiation

LED -

CIGS

(Sr , SiO 4

(Ca , Sr)AISiN (Ca " Ba)Si N

CRI

CIGS1ir

YAG m

[3]Panek P.; Lipinski M.; Be ltowska-

LED

Eu "

Lehman E.; Drabczyk K .; Ciach

R. , "Industrial technology of

LED

multicrystalline silicon solar cells" ,

Opto-Electronics Review , 1 J ,

269(2003)

LED (oxynitride)

(nitride)

B.; DeHart C.; Scharf J.; Perkins C

LED a

L.; To B.; Noufi R. ,

(Nichia)
(blue LED)

(Y , AI ,0 12

Toyoda

Gosei

Eu")

LED 1990

85

A(

[2] Kn obloch J.; Glunz S. w.; Biro 0 .; Warta

w.,

with efficiencies above 21 % processed

Schaffer E.; Wettl

"Solar cells

from Czochralski grown silicon" , 25 ,h


PVSC , 405( 1996).

[4]Repins 1.; Contreras M. A.; Egaas

' 19.9 % effici e nt

Ce YAG : Ce")

LED

LED ' 7

N " 0'

8 1. 2% fill factor" , Prog. Photovolt, 16,

LED YAG

235(2008)

(Gamet)

I!l!! LED

LED

224

2014~4 ~

ZnO /CdS/CulnGaSe s olar

cell with

(5]Han L. Y.; Islam A.; Chen H.; Malapaka

89

"

Solar Frontier 12

12

!I!!

(CIS)

(Ce") YAG

. MSi , O , N, (M=

(23) LED

Ca Sr Ba)

CIGS

YAG

" 2008

YAG

M =

TUV NORD

LED

Ca Sr Ba

0.6 mx l. 2 m 11 - 12 %

i(color

(Monoclinic) P2/c'

2013 7

rendering index , CRI)

P2 /m PJrn a OEu'

CIGS

[I ]Chapin D. M.; Fuller C. S. ; Pearson

(15 .7%)1 CIGS

G. L. , "A New silicon P-N Junction

; 2014

LED {

LED

photoc11

17% '

CaSi oN : Eu" SrSi ON : Eu "

into electrical power ", J. App l. Phys. ,

25 , 676(1954).

17%

: Ce"

YAG

for converting solar radiation

LED -

CIGS

(Sr , SiO 4

(Ca , Sr)AISiN (Ca " Ba)Si N

CRI

CIGS1ir

YAG m

[3]Panek P.; Lipinski M.; Be ltowska-

LED

Eu "

Lehman E.; Drabczyk K .; Ciach

R. , "Industrial technology of

LED

multicrystalline silicon solar cells" ,

Opto-Electronics Review , 1 J ,

269(2003)

LED (oxynitride)

(nitride)

B.; DeHart C.; Scharf J.; Perkins C

LED a

L.; To B.; Noufi R. ,

(Nichia)
(blue LED)

(Y , AI ,0 12

Toyoda

Gosei

Eu")

LED 1990

85

A(

[2] Kn obloch J.; Glunz S. w.; Biro 0 .; Warta

w.,

with efficiencies above 21 % processed

Schaffer E.; Wettl

"Solar cells

from Czochralski grown silicon" , 25 ,h


PVSC , 405( 1996).

[4]Repins 1.; Contreras M. A.; Egaas

' 19.9 % effici e nt

Ce YAG : Ce")

LED

LED ' 7

N " 0'

8 1. 2% fill factor" , Prog. Photovolt, 16,

LED YAG

235(2008)

(Gamet)

I!l!! LED

LED

224

2014~4 ~

ZnO /CdS/CulnGaSe s olar

cell with

(5]Han L. Y.; Islam A.; Chen H.; Malapaka

89

:.

C.; Chiranjeevi B.; Zhang S. F.; X. D.

Goushi Y.; Kijima S.; Aramoto T.;

A. J.; Chey S. J.; Gignac L.; Schrott A.

[23]Pan Y.; Wu M.; Su Q. , "Comparative

Yang; Yanagida M. , "High-efficiency

Fujiwara Y., "Interface control to

G. , "Hydrazine-based deposition route

investigation on synthesis and

dye-sensitized solar cell with a novel

enhance the fill factor over 0.70 in

for device-quality CIGS films" , 517 ,

photoluminescence of YAG:Ce

co-adsorbent" , Energy & Environmental

a large-area CIS based thin-film PV

2158(2009).

phosphor" , Mater. Sci. Eng. B , 106 ,

Science , 5, 6057(2012).

technology" , Thin Solid Films , 517 ,

[6]GE Research Beats First Solar's CdTe


PV Efficiency Record , http://www.
greentechmedia.coml

http://www.manz.coml

2108(2009)

251(2004).
[24]Lak. N. , Vara. U. V. , "White-Light

V. K.; Bansal A.; Le P.; Asensio

[20]Solar Frontier Officially Opens World's

Generation in Sr Si0 4 :Eu'\ Ce J -

O. 1., "Non-vacuum processing of

Largest CIS Solar Module Plant, http://

under Near-UV Excitation A Novel

www.solar-frontier.coml.

Phosphor for Solid-State Lighting" , J

[1 Kapur

[7]Thin-film photovoltaics achieves 20.8%

Culn 1, Ga,Se solar cells on rigid and

efficiency and overtakes multicrystalline

f1 exible substrates using nanopartic1e

[21]TSMC Solar Commercial-size Modules

silicon technology, http://www.zsw-bw.

precursor inks" , Thin Solid Films, 431 ,

(1. 09m') Set CIGS 15.7% Efficiency

de/.

53(2003).

Record , http://www.tsmc-solar.coml

Electrochem. Soc. , 152 , H 152005).


[2 Li

Y.Q.; de With G.; Hintzen H.T. ,

"Luminescence of a new c1ass of UV

[14]Kapur V. K.; Bansal A.; Le P.; Asensio

[22]Euler F.; Bruce J. A., "Oxygen coordinates

O. 1.; Shigeoka N. K. , "Fabrication

of compounds with garnet structure" ,

N' . ' .) :Ce J+ (M = Ca , Sr, Ba)" , J.

[9]Noufi R.; Gabor A. M.; Tuttle J. R.;

of Solar Cells via Printing of

Acta Crystallogr. , 19, 971 (1965).

Mater. Chem. , 15 , 4492(2005).

Tennant A. L.; Contreras M. A.; Albin

Nanoparticle Inks" , DOE Solar

D. S.; Carapella J. J. , "Method of

Program Review Meeting, 135(2004)

[8]Research Cell Efficiency Records , http://


www.nrel.gov/ncpvl

fabricating high-efficiency Cu(In ,Ga)

[15]Norsworthy G.; Leidholm C. R.; Halani

(SeS) thin films for solar cells" , US

A.; Kapur V. K.; Roe R. , Basol B.

patent:544 1897 (1 995).

M.; Matson R. , "CIS film growth by

[lO ]Dhere N. G. , "Present status and fure

metallic ink coating and selenization" ,

prospects of CIGSS thin film solar

Solar Energy Materials & Solar cells ,

cells" , Solar Energy Materials & Solar

60 , 127(2000).

Cells , 90, 2181 (2006).


[ll]Nagoya Y.; Kushiya K.; Tachiyuki M.;

[16]Refer to CIS Solartecknik's

http://www.cis-solartechnik.de/

sulfur into the surface of Cu(InGa)


absorber" , Solar

Cu(In ,Ga)(S ,Se ), absorber yielding

Energy Materials & Solar Cells , 67 ,

a 15.2% efficient solar cell" , Prog.

247(2001).

Photovolt, 21 , 82(2013)

K.; Tanaka Y.; Hakuma H.;

websi

T.; Mitzi D. B., "Solution-processed

[1 Kushiya

MSi O

[17]Todorov T. K.; Gunawan 0.; Gokmen

, thin-film

blue-emitting phosphors

Yamase 0. , "Role of incorporated

Se

[1 9]Strong partners with a common goal ,

[18]Mitzi D

Yuan M.; Liu

w.; Kellock

224

20144

:.

C.; Chiranjeevi B.; Zhang S. F.; X. D.

Goushi Y.; Kijima S.; Aramoto T.;

A. J.; Chey S. J.; Gignac L.; Schrott A.

[23]Pan Y.; Wu M.; Su Q. , "Comparative

Yang; Yanagida M. , "High-efficiency

Fujiwara Y., "Interface control to

G. , "Hydrazine-based deposition route

investigation on synthesis and

dye-sensitized solar cell with a novel

enhance the fill factor over 0.70 in

for device-quality CIGS films" , 517 ,

photoluminescence of YAG:Ce

co-adsorbent" , Energy & Environmental

a large-area CIS based thin-film PV

2158(2009).

phosphor" , Mater. Sci. Eng. B , 106 ,

Science , 5, 6057(2012).

technology" , Thin Solid Films , 517 ,

[6]GE Research Beats First Solar's CdTe


PV Efficiency Record , http://www.
greentechmedia.coml

http://www.manz.coml

2108(2009)

251(2004).
[24]Lak. N. , Vara. U. V. , "White-Light

V. K.; Bansal A.; Le P.; Asensio

[20]Solar Frontier Officially Opens World's

Generation in Sr Si0 4 :Eu'\ Ce J -

O. 1., "Non-vacuum processing of

Largest CIS Solar Module Plant, http://

under Near-UV Excitation A Novel

www.solar-frontier.coml.

Phosphor for Solid-State Lighting" , J

[1 Kapur

[7]Thin-film photovoltaics achieves 20.8%

Culn 1, Ga,Se solar cells on rigid and

efficiency and overtakes multicrystalline

f1 exible substrates using nanopartic1e

[21]TSMC Solar Commercial-size Modules

silicon technology, http://www.zsw-bw.

precursor inks" , Thin Solid Films, 431 ,

(1. 09m') Set CIGS 15.7% Efficiency

de/.

53(2003).

Record , http://www.tsmc-solar.coml

Electrochem. Soc. , 152 , H 152005).


[2 Li

Y.Q.; de With G.; Hintzen H.T. ,

"Luminescence of a new c1ass of UV

[14]Kapur V. K.; Bansal A.; Le P.; Asensio

[22]Euler F.; Bruce J. A., "Oxygen coordinates

O. 1.; Shigeoka N. K. , "Fabrication

of compounds with garnet structure" ,

N' . ' .) :Ce J+ (M = Ca , Sr, Ba)" , J.

[9]Noufi R.; Gabor A. M.; Tuttle J. R.;

of Solar Cells via Printing of

Acta Crystallogr. , 19, 971 (1965).

Mater. Chem. , 15 , 4492(2005).

Tennant A. L.; Contreras M. A.; Albin

Nanoparticle Inks" , DOE Solar

D. S.; Carapella J. J. , "Method of

Program Review Meeting, 135(2004)

[8]Research Cell Efficiency Records , http://


www.nrel.gov/ncpvl

fabricating high-efficiency Cu(In ,Ga)

[15]Norsworthy G.; Leidholm C. R.; Halani

(SeS) thin films for solar cells" , US

A.; Kapur V. K.; Roe R. , Basol B.

patent:544 1897 (1 995).

M.; Matson R. , "CIS film growth by

[lO ]Dhere N. G. , "Present status and fure

metallic ink coating and selenization" ,

prospects of CIGSS thin film solar

Solar Energy Materials & Solar cells ,

cells" , Solar Energy Materials & Solar

60 , 127(2000).

Cells , 90, 2181 (2006).


[ll]Nagoya Y.; Kushiya K.; Tachiyuki M.;

[16]Refer to CIS Solartecknik's

http://www.cis-solartechnik.de/

sulfur into the surface of Cu(InGa)


absorber" , Solar

Cu(In ,Ga)(S ,Se ), absorber yielding

Energy Materials & Solar Cells , 67 ,

a 15.2% efficient solar cell" , Prog.

247(2001).

Photovolt, 21 , 82(2013)

K.; Tanaka Y.; Hakuma H.;

websi

T.; Mitzi D. B., "Solution-processed

[1 Kushiya

MSi O

[17]Todorov T. K.; Gunawan 0.; Gokmen

, thin-film

blue-emitting phosphors

Yamase 0. , "Role of incorporated

Se

[1 9]Strong partners with a common goal ,

[18]Mitzi D

Yuan M.; Liu

w.; Kellock

224

20144

ttj 1

12 -4]

) .f'F

l 1

P l.

()

Li" H ' Na+)

L j+[51

WO J(t ransparenl) + xLt + xe-

Li WOJ(blue)

(1)

Transparent Substrate
Transparent Conductive Electrode

(smart windows) . IJ

(1m )

Transparent Conductive Electrode

[11 (electrochromic)

Transparent Substrate

[1) 0 f'j:

jl( 224

20144

lon Storage Layer or


Eleclrochromic Layer 11

Electrolyte (Ion Conductor)

92

Electrochromic Layer I

93

ttj 1

12 -4]

) .f'F

l 1

P l.

()

Li" H ' Na+)

L j+[51

WO J(t ransparenl) + xLt + xe-

Li WOJ(blue)

(1)

Transparent Substrate
Transparent Conductive Electrode

(smart windows) . IJ

(1m )

Transparent Conductive Electrode

[11 (electrochromic)

Transparent Substrate

[1) 0 f'j:

jl( 224

20144

lon Storage Layer or


Eleclrochromic Layer 11

Electrolyte (Ion Conductor)

92

Electrochromic Layer I

93

(1)

(7)

30

Li+

PEG (7)

PEG-PTA

PEG-PTA

PEG-

(1) Li+

H O PTA

l8JJ PTA

H 0 '

(OH)

H 0 PTA

H 2 0

(6)

PTA i

PTA {

(thiourea)

i PTA

PTA

(2)

(8)

PEG

PEG

OH-

H O peroxopolytungstic

30

2+

acid (PTA)

PTA-

(9)

400 0 C

{ PTA

30[ 2(a) (b)

+ OHN iO OH (colored) + e-

NiO (tansparent)
H

(2)

SEM 2

-330nm' 1

XRD 3(a)

(7)

{I 0.17}

XRD

PTA

PTA

(microstructure)

(templating

Opoly(ethylene

Raman 3(b)

(nanoarchitecture)

glycol) (PEG) .

805cm- 1 714cm- 1 272cm- 1

monoclinic

94

agent)

224

20144

95

(1)

(7)

30

Li+

PEG (7)

PEG-PTA

PEG-PTA

PEG-

(1) Li+

H O PTA

l8JJ PTA

H 0 '

(OH)

H 0 PTA

H 2 0

(6)

PTA i

PTA {

(thiourea)

i PTA

PTA

(2)

(8)

PEG

PEG

OH-

H O peroxopolytungstic

30

2+

acid (PTA)

PTA-

(9)

400 0 C

{ PTA

30[ 2(a) (b)

+ OHN iO OH (colored) + e-

NiO (tansparent)
H

(2)

SEM 2

-330nm' 1

XRD 3(a)

(7)

{I 0.17}

XRD

PTA

PTA

(microstructure)

(templating

Opoly(ethylene

Raman 3(b)

(nanoarchitecture)

glycol) (PEG) .

805cm- 1 714cm- 1 272cm- 1

monoclinic

94

agent)

224

20144

95

"

(a) (b)!SEM1101

(a)TEM (b)TEM }

(b)

(a)

amorphous
malrix

4(a) TEM
1l:

t
aco-c-

bazo-z-

SEM XRD Raman

2 Th ela I degr
3

pore

TEM
l
~r-

ITO. glass
10

nanoc stal

ro

200

400

600

600

Wavenmber(')

(a)XRD (b)Ramam

iS 1

95

PTA (T-O)

Raman Ramanl

4(a)

'TEM

PTA

monoclinic

1It

450 0 C

TEM

monoc1 inic

.\'f! (unit

XRDmonoclinic

[18)

(l tlJ 1 PTA

Raman i

4(b)

TEM 1iI3 M JE!

6(b)))1;1.:

TEM

5 nm

fM

)1;

6(a)

a 6(b)

ft I~ 224

2014 4

block)

97

"

(a) (b)!SEM1101

(a)TEM (b)TEM }

(b)

(a)

amorphous
malrix

4(a) TEM
1l:

t
aco-c-

bazo-z-

SEM XRD Raman

2 Th ela I degr
3

pore

TEM
l
~r-

ITO. glass
10

nanoc stal

ro

200

400

600

600

Wavenmber(')

(a)XRD (b)Ramam

iS 1

95

PTA (T-O)

Raman Ramanl

4(a)

'TEM

PTA

monoclinic

1It

450 0 C

TEM

monoc1 inic

.\'f! (unit

XRDmonoclinic

[18)

(l tlJ 1 PTA

Raman i

4(b)

TEM 1iI3 M JE!

6(b)))1;1.:

TEM

5 nm

fM

)1;

6(a)

a 6(b)

ft I~ 224

2014 4

block)

97

'!!

Final
product

Precu or

(b)

- -

T-O

(.
3
)OEO-o=E

(a)

PTA Thiourea

>.k>>

(c)

-.--<

-+

-f ~ . a . T"

-..OT>

unit

4000
(d)

. . c : WO
6

98

2000

1800 160 1400 1200


Wavenumber (cm-1 )

1000

800

600

-PTA;& 1 1.111

OQC :gas

Y : Thiourea I Thiourea trioxide

(a}T-O (b)1 (c)T-3(d)T-4 . (a)(d)"

PTA -OH)(W=O)

(NH H)CSOH))I "I

PTA

T-3

1700cm-' 1460cm-' 1250cm-'

-PTA

(T-I I)

-15nm BETl

1050cm-'

H o

50nm

T-3

-2m

1400cm-'

(hierarchical) i~

1.5 m'lg

!(2)

7.1 m'l

I I 1460cm" 1400cm"

fg-500nm' l 6(c)

20 .4 m'

vas(N-C-N)

(C= S)

50nm

PTA

(3 )

1700cm" 1250cm" 1050cm"

6(d) E

-PTA

viC=N) V0) V( S=O)I"1

1 25

50nm

-PTA

T-O 1635cm"

H O

" BET

956cm"

(thiourea trioxide ,

224

20144

99

'!!

Final
product

Precu or

(b)

- -

T-O

(.
3
)OEO-o=E

(a)

PTA Thiourea

>.k>>

(c)

-.--<

-+

-f ~ . a . T"

-..OT>

unit

4000
(d)

. . c : WO
6

98

2000

1800 160 1400 1200


Wavenumber (cm-1 )

1000

800

600

-PTA;& 1 1.111

OQC :gas

Y : Thiourea I Thiourea trioxide

(a}T-O (b)1 (c)T-3(d)T-4 . (a)(d)"

PTA -OH)(W=O)

(NH H)CSOH))I "I

PTA

T-3

1700cm-' 1460cm-' 1250cm-'

-PTA

(T-I I)

-15nm BETl

1050cm-'

H o

50nm

T-3

-2m

1400cm-'

(hierarchical) i~

1.5 m'lg

!(2)

7.1 m'l

I I 1460cm" 1400cm"

fg-500nm' l 6(c)

20 .4 m'

vas(N-C-N)

(C= S)

50nm

PTA

(3 )

1700cm" 1250cm" 1050cm"

6(d) E

-PTA

viC=N) V0) V( S=O)I"1

1 25

50nm

-PTA

T-O 1635cm"

H O

" BET

956cm"

(thiourea trioxide ,

224

20144

99

Eth l

1>

500

- - setting temp
cruclble
4~ .

(E
)O

T-1
32 T.2
o T-3

10

15

20

25

time (min)

PTA

20mCcm-' Li (

(2)

(Transmittance modulation)

[1 9(a)

-PTA

(3)

UV-Vis-IR

FTO

-80%

F 8 12-18

10%

T-3 i 1

Li

T-3

l T-3

Y!! M ?\:

PTA

-80%

- TG

H 0 !

400.C

FTIR TG IDTA-MS

632nm 70 %

il'ii [1

1'J:l

8 2 im 350-

tlfl 6

9(b) PEG

400.C 3 ;

[7J

T-3

Y!! a

l PTA
H 02

10

! ammo

PTA

~ 118)

Li

PEG

632nm

-70 % - 10%-60% '


-50 %

PEG

( I ) PTA

1M LiCIO/

H 2 0 2 '

propylene carbonate (PC)

Ag/AgCI

224

20144

'

Eth l

1>

500

- - setting temp
cruclble
4~ .

(E
)O

T-1
32 T.2
o T-3

10

15

20

25

time (min)

PTA

20mCcm-' Li (

(2)

(Transmittance modulation)

[1 9(a)

-PTA

(3)

UV-Vis-IR

FTO

-80%

F 8 12-18

10%

T-3 i 1

Li

T-3

l T-3

Y!! M ?\:

PTA

-80%

- TG

H 0 !

400.C

FTIR TG IDTA-MS

632nm 70 %

il'ii [1

1'J:l

8 2 im 350-

tlfl 6

9(b) PEG

400.C 3 ;

[7J

T-3

Y!! a

l PTA
H 02

10

! ammo

PTA

~ 118)

Li

PEG

632nm

-70 % - 10%-60% '


-50 %

PEG

( I ) PTA

1M LiCIO/

H 2 0 2 '

propylene carbonate (PC)

Ag/AgCI

224

20144

'

ta-hF

(a)

(b)

6 o g i 60

900 1200 1500


Wavelength (nm)

1800

600

900 1200 1500 1800


Wavelength (nm)

h
nu

600

..
.

.
.
.
.

..

.
.
..
...

HI

20

20

(a)

nununu

40 540

bEE
a
-gz

"

acECO
2)
(4

aunOA

~ 80

bleached state
colored state
- - - T modulation

1.0
100
nunnunu

80

-asepared

100

unOA

100

- - as-prepared
- - - bleached state
. . .. colored state
_._.. T modulation

100

nunu

10
15
5
charge density (mCcm"2)

20

nununUAUnununununu
87654321

(c)

(a)(b)PEG UV-Vis-IR

(4U)
E
EZEC
E

".1

(coloration

10(b)

efficiency, CE)

(Q) (optical density,

11 s 0

OD):

ln 110(c)

CE

= ll(OD)jllQ

(3)

ITO

50

10

100 150 200 250 300 350


Ti me (sec)

nu

3 00

7200 1 800 14400


Ti me (sec)

18 00

632 nm (a) (b)


(c)l

LiCIO/PC

FTO

-200nm

10(a) 10Acm" Li

450 0 C 30

(glancing angle) XRD

12 FTO

102

i!la 632nm

(3)

(d) (200)

() Scherrer( (4))

37cm'C" .

d=Kjcos9

SEM

-3V +3V

H O

(0.9) XRD

i!la 632nm

40%

-18nm-lO nm TEM

224

11 (a) (b)

20144

1131

(4)

1 3

ta-hF

(a)

(b)

6 o g i 60

900 1200 1500


Wavelength (nm)

1800

600

900 1200 1500 1800


Wavelength (nm)

h
nu

600

..
.

.
.
.
.

..

.
.
..
...

HI

20

20

(a)

nununu

40 540

bEE
a
-gz

"

acECO
2)
(4

aunOA

~ 80

bleached state
colored state
- - - T modulation

1.0
100
nunnunu

80

-asepared

100

unOA

100

- - as-prepared
- - - bleached state
. . .. colored state
_._.. T modulation

100

nunu

10
15
5
charge density (mCcm"2)

20

nununUAUnununununu
87654321

(c)

(a)(b)PEG UV-Vis-IR

(4U)
E
EZEC
E

".1

(coloration

10(b)

efficiency, CE)

(Q) (optical density,

11 s 0

OD):

ln 110(c)

CE

= ll(OD)jllQ

(3)

ITO

50

10

100 150 200 250 300 350


Ti me (sec)

nu

3 00

7200 1 800 14400


Ti me (sec)

18 00

632 nm (a) (b)


(c)l

LiCIO/PC

FTO

-200nm

10(a) 10Acm" Li

450 0 C 30

(glancing angle) XRD

12 FTO

102

i!la 632nm

(3)

(d) (200)

() Scherrer( (4))

37cm'C" .

d=Kjcos9

SEM

-3V +3V

H O

(0.9) XRD

i!la 632nm

40%

-18nm-lO nm TEM

224

11 (a) (b)

20144

1131

(4)

1 3

11

(a) (b) SEM [13]

TEM

(c) (d)

XRD
3
-m
C-O
Z

13(e) (
TEM

13

(a) TEM (c) TEM (e) TEM


(b) TEM (d)TEM (1)
TEM [13]

FTO-glass

14(a) (b) \fl

'1[

UV-Vis-IR

('1'

14

40mCcm- 2

14

1M NaOH

550nm- 70%

550nm

FTO

! J!/]-65 %

-70% m

40mCcm- 2

14(b)I'F

550nm

TEM 13 )

-65 % )

14(a) (b) 550nm

(b) .

. H!J 300-600nm

20% 14

Nickel Oxide
(Cubic 01-073-1519)

8ES
20 25 30 35 40 45 50 55 60 65 70 75 80
2 Theta

12

10<1

XRD I

224

20144

os

11

(a) (b) SEM [13]

TEM

(c) (d)

XRD
3
-m
C-O
Z

13(e) (
TEM

13

(a) TEM (c) TEM (e) TEM


(b) TEM (d)TEM (1)
TEM [13]

FTO-glass

14(a) (b) \fl

'1[

UV-Vis-IR

('1'

14

40mCcm- 2

14

1M NaOH

550nm- 70%

550nm

FTO

! J!/]-65 %

-70% m

40mCcm- 2

14(b)I'F

550nm

TEM 13 )

-65 % )

14(a) (b) 550nm

(b) .

. H!J 300-600nm

20% 14

Nickel Oxide
(Cubic 01-073-1519)

8ES
20 25 30 35 40 45 50 55 60 65 70 75 80
2 Theta

12

10<1

XRD I

224

20144

os

14

.,

100

'Alu
"

(a)

100

As -prepared

100

.... Colored
80
81eached
_.- T modulation

ZFESO

4oCgE

40

20)
b
R

20

---.

0 1/'.----.-._.---_._-------

300

600
900
1200
Wavelength (nm)

? ||

Col

EC

1500

11 B:tM

*'

(b)

80
~

'

40
20

..

300

:::::.....

. ,

- As-prepared
.. . Colored
- Bleached
_. - T modulation

100

-.

......-.-.- .

20 -

1200
600
900
Wavelenglh (nm)

1.0

60 c8.
40 g

1.2 [ (a)

80

150

1 1 81..
| MPEF 11 ored
EC
11
EC

0.8

.., -.-m

0.6

0.4
2

0.0

15

KE

.z-.

....

........-

1"1

r1

r'l

2ZS 5O
E
E 40

-E.

.......
10 15 20 25 30
charge density (mC/cm 2 )

o'

60

35

30
20

10~\..! . . .U .
4

U.

60 120 180 240 300 360 420 480 540 600


lmes (s)

550nm (a) (b)


I

14

(a) (b) UV-Vis-IR


[13]

[2]Wu , J.-J.; Hsieh , M.-D.; Liao , W.-

P.; Wu , W.-T.; Chen , J.-S. , "Fast-

Switching Photovoltachromic Cells with

<10% -60%

12s

Tunable Transmittance" , ACS Nano , 3,

[10.13.15 16]

2297-2303 (2009).

{ll.l

15(a)
50Acm"

550nm


(3)

106

[3]Wu , J.-J.;

Wu , W.-T.;

M.-D.; Liao , W.-P.;

Ch J.

Huang

J.-L. ,

"Photovoltachromic Device and the

Application Thereof' , US Patent No.

US8238016 B2 , (2012).

[4]

25.6cm'C'\ 0

+2V -2V

[1 ]Granqvist , C.G. , "Oxide El ectro-

[5]Granqvist, c. G. , "Handbook ofinorganic

550nm 40%

(1 4.17] 0

chromics: An Introduction to Devices

electrochromic materials" , EIsevier, The

15(b)

and Materials" , So l. Energy Mater. Sol

Netherlands. 1995

Cells, 99 , 1-13 (2012).

224

'

1384310 (2013)

20144

[6]Nagai , 1., "Characterization of

107

14

.,

100

'Alu
"

(a)

100

As -prepared

100

.... Colored
80
81eached
_.- T modulation

ZFESO

4oCgE

40

20)
b
R

20

---.

0 1/'.----.-._.---_._-------

300

600
900
1200
Wavelength (nm)

? ||

Col

EC

1500

11 B:tM

*'

(b)

80
~

'

40
20

..

300

:::::.....

. ,

- As-prepared
.. . Colored
- Bleached
_. - T modulation

100

-.

......-.-.- .

20 -

1200
600
900
Wavelenglh (nm)

1.0

60 c8.
40 g

1.2 [ (a)

80

150

1 1 81..
| MPEF 11 ored
EC
11
EC

0.8

.., -.-m

0.6

0.4
2

0.0

15

KE

.z-.

....

........-

1"1

r1

r'l

2ZS 5O
E
E 40

-E.

.......
10 15 20 25 30
charge density (mC/cm 2 )

o'

60

35

30
20

10~\..! . . .U .
4

U.

60 120 180 240 300 360 420 480 540 600


lmes (s)

550nm (a) (b)


I

14

(a) (b) UV-Vis-IR


[13]

[2]Wu , J.-J.; Hsieh , M.-D.; Liao , W.-

P.; Wu , W.-T.; Chen , J.-S. , "Fast-

Switching Photovoltachromic Cells with

<10% -60%

12s

Tunable Transmittance" , ACS Nano , 3,

[10.13.15 16]

2297-2303 (2009).

{ll.l

15(a)
50Acm"

550nm


(3)

106

[3]Wu , J.-J.;

Wu , W.-T.;

M.-D.; Liao , W.-P.;

Ch J.

Huang

J.-L. ,

"Photovoltachromic Device and the

Application Thereof' , US Patent No.

US8238016 B2 , (2012).

[4]

25.6cm'C'\ 0

+2V -2V

[1 ]Granqvist , C.G. , "Oxide El ectro-

[5]Granqvist, c. G. , "Handbook ofinorganic

550nm 40%

(1 4.17] 0

chromics: An Introduction to Devices

electrochromic materials" , EIsevier, The

15(b)

and Materials" , So l. Energy Mater. Sol

Netherlands. 1995

Cells, 99 , 1-13 (2012).

224

'

1384310 (2013)

20144

[6]Nagai , 1., "Characterization of

107

2014

fEFU

BP
Evaporated N ickel Oxide and its

[11]Wu , W.-T.; Wu , J.-J.;

[17]

Application to Electrochromic Glazing" ,

"Resistive Switching Behavior and

Cells

Multiple Transmittance States in

'

Solution-Processed Tungsten Oxide" ,

1419994 (2013)

So l. Energy. Mater. So l.

l -:1 <

[18]Wu , W.-T.; Chen , J.-S.; Wu , J.-

| "" 1 j"""

J. , "Synthesis of Tungsten Oxide

l Automotive

J.-

Powders Via Thiourea-Assisted

l ~

Poly(Ethylene Glycol)- Template

J. , "A1uminum Electrode Modulated

Route: Tailoring from Hierarchica1

Nanostructured Tungsten Oxide Films

Bipolar Resistive Switching of AI I

Microspheres to Mesoporously

with Enhanced Charge Transferl

Fuel-Assisted NiOxll TO Memory

Structured Nanoparticles" , J. Am.

Transport Characteristics" Phys. Chem.

Devices Modeled with a Dual-

Cerm. Soc. , 93 , 2268-2273 (2010).

Chem. Phys. , 11 , 9751-9758 (2009).

291-299 (1993)
[7]Wu , W.-T.;
Chen , J.-S.;

Li
VI

W.-P.;

Ch L.-

J.-J. , "Outperformed

Electrochromic Behavior of

[8]Niklasson , G. A.;

Granqvi

C. G. ,

"E1ectrochromics for Smart Windows:

ACS Applied Materials & Interfaces ,


3, 2616-2621 (2011)
[12]Chiang K.-K.;

Ch J.

Wu

10

12

(2012)

11

I ?> HH

12

;;Ta? 7-!:

12

| ;;1

14

1 SYSTEMS

12

1;: .;I.

26

12

15

(2013).

16

1 ;/7r7=-"

12

17

I Linux

12

18

I 2

19

1 NETWORK

12

20

I -;1. :;-"-t

48

23

I 7- '1'7" z

26

24

I :z ;.-

24

25

1 ;t:-t.t' }!'"

12

[14]

Structure and Intercalation Properties",


J. Electrochem. Soc. , 153 , C365-C376

(2013)

[ 15]

to Nanostructured Tungsten Oxide

/'

"An Efficient Route

12

Mater. Interfaces , 5 , 6502-6507

: CN102230172B

P.; J.-J.,

12

App l. Mater. Interfaccs , 4, 4237 -4245

Tungsten Oxide Films by Sol-gel

J.-S.; Liao , W.-

3 r '7

24

Device Application" , ACS App l.

Ch

50

| ~ 7Y::'-

(2007)

[10]Wu , W.-T.;

Nickel Oxide Films for E1ectrochromic

(2006).

Technology

Oxygen-Reservoir Structure" , ACS

These" , J. Mater. Chem. , 17 , 127-156

A. , "E1ectrochromic Nanostructured

12

| ~

Solution Route to Nanostructured

Nickel Oxide, and Devices Based on

Agnihot

! ~

[l 3]Chiang K.-K.; Wu , J.-J. , "Fuel-Assisted

K.; Shivaprasad , S. M.;

12

Thin Fi1ms of Tungsten Oxide and

[9]Deepa , M.; Joshi , A. G.; Srivastava, A

108

Ch J. -S. ,

'

1405826 (2013)

[ 16]

Fi1ms with Improved Electrochromic

Properties" , ChemPhysChem , 11 ,

3306-3312 (2010)

1405827 (2013)

'

:
-
:

y 1) _';/ ;i "

-!' :1

24

24

224

20144

109

2014

fEFU

BP
Evaporated N ickel Oxide and its

[11]Wu , W.-T.; Wu , J.-J.;

[17]

Application to Electrochromic Glazing" ,

"Resistive Switching Behavior and

Cells

Multiple Transmittance States in

'

Solution-Processed Tungsten Oxide" ,

1419994 (2013)

So l. Energy. Mater. So l.

l -:1 <

[18]Wu , W.-T.; Chen , J.-S.; Wu , J.-

| "" 1 j"""

J. , "Synthesis of Tungsten Oxide

l Automotive

J.-

Powders Via Thiourea-Assisted

l ~

Poly(Ethylene Glycol)- Template

J. , "A1uminum Electrode Modulated

Route: Tailoring from Hierarchica1

Nanostructured Tungsten Oxide Films

Bipolar Resistive Switching of AI I

Microspheres to Mesoporously

with Enhanced Charge Transferl

Fuel-Assisted NiOxll TO Memory

Structured Nanoparticles" , J. Am.

Transport Characteristics" Phys. Chem.

Devices Modeled with a Dual-

Cerm. Soc. , 93 , 2268-2273 (2010).

Chem. Phys. , 11 , 9751-9758 (2009).

291-299 (1993)
[7]Wu , W.-T.;
Chen , J.-S.;

Li
VI

W.-P.;

Ch L.-

J.-J. , "Outperformed

Electrochromic Behavior of

[8]Niklasson , G. A.;

Granqvi

C. G. ,

"E1ectrochromics for Smart Windows:

ACS Applied Materials & Interfaces ,


3, 2616-2621 (2011)
[12]Chiang K.-K.;

Ch J.

Wu

10

12

(2012)

11

I ?> HH

12

;;Ta? 7-!:

12

| ;;1

14

1 SYSTEMS

12

1;: .;I.

26

12

15

(2013).

16

1 ;/7r7=-"

12

17

I Linux

12

18

I 2

19

1 NETWORK

12

20

I -;1. :;-"-t

48

23

I 7- '1'7" z

26

24

I :z ;.-

24

25

1 ;t:-t.t' }!'"

12

[14]

Structure and Intercalation Properties",


J. Electrochem. Soc. , 153 , C365-C376

(2013)

[ 15]

to Nanostructured Tungsten Oxide

/'

"An Efficient Route

12

Mater. Interfaces , 5 , 6502-6507

: CN102230172B

P.; J.-J.,

12

App l. Mater. Interfaccs , 4, 4237 -4245

Tungsten Oxide Films by Sol-gel

J.-S.; Liao , W.-

3 r '7

24

Device Application" , ACS App l.

Ch

50

| ~ 7Y::'-

(2007)

[10]Wu , W.-T.;

Nickel Oxide Films for E1ectrochromic

(2006).

Technology

Oxygen-Reservoir Structure" , ACS

These" , J. Mater. Chem. , 17 , 127-156

A. , "E1ectrochromic Nanostructured

12

| ~

Solution Route to Nanostructured

Nickel Oxide, and Devices Based on

Agnihot

! ~

[l 3]Chiang K.-K.; Wu , J.-J. , "Fuel-Assisted

K.; Shivaprasad , S. M.;

12

Thin Fi1ms of Tungsten Oxide and

[9]Deepa , M.; Joshi , A. G.; Srivastava, A

108

Ch J. -S. ,

'

1405826 (2013)

[ 16]

Fi1ms with Improved Electrochromic

Properties" , ChemPhysChem , 11 ,

3306-3312 (2010)

1405827 (2013)

'

:
-
:

y 1) _';/ ;i "

-!' :1

24

24

224

20144

109

2014

fEFU

BP
Evaporated N ickel Oxide and its

[11]Wu , W.-T.; Wu , J.-J.;

[17]

Application to Electrochromic Glazing" ,

"Resistive Switching Behavior and

Cells

Multiple Transmittance States in

'

Solution-Processed Tungsten Oxide" ,

1419994 (2013)

So l. Energy. Mater. So l.

l -:1 <

[18]Wu , W.-T.; Chen , J.-S.; Wu , J.-

| "" 1 j"""

J. , "Synthesis of Tungsten Oxide

l Automotive

J.-

Powders Via Thiourea-Assisted

l ~

Poly(Ethylene Glycol)- Template

J. , "A1uminum Electrode Modulated

Route: Tailoring from Hierarchica1

Nanostructured Tungsten Oxide Films

Bipolar Resistive Switching of AI I

Microspheres to Mesoporously

with Enhanced Charge Transferl

Fuel-Assisted NiOxll TO Memory

Structured Nanoparticles" , J. Am.

Transport Characteristics" Phys. Chem.

Devices Modeled with a Dual-

Cerm. Soc. , 93 , 2268-2273 (2010).

Chem. Phys. , 11 , 9751-9758 (2009).

291-299 (1993)
[7]Wu , W.-T.;
Chen , J.-S.;

Li
VI

W.-P.;

Ch L.-

J.-J. , "Outperformed

Electrochromic Behavior of

[8]Niklasson , G. A.;

Granqvi

C. G. ,

"E1ectrochromics for Smart Windows:

ACS Applied Materials & Interfaces ,


3, 2616-2621 (2011)
[12]Chiang K.-K.;

Ch J.

Wu

10

12

(2012)

11

I ?> HH

12

;;Ta? 7-!:

12

| ;;1

14

1 SYSTEMS

12

1;: .;I.

26

12

15

(2013).

16

1 ;/7r7=-"

12

17

I Linux

12

18

I 2

19

1 NETWORK

12

20

I -;1. :;-"-t

48

23

I 7- '1'7" z

26

24

I :z ;.-

24

25

1 ;t:-t.t' }!'"

12

[14]

Structure and Intercalation Properties",


J. Electrochem. Soc. , 153 , C365-C376

(2013)

[ 15]

to Nanostructured Tungsten Oxide

/'

"An Efficient Route

12

Mater. Interfaces , 5 , 6502-6507

: CN102230172B

P.; J.-J.,

12

App l. Mater. Interfaccs , 4, 4237 -4245

Tungsten Oxide Films by Sol-gel

J.-S.; Liao , W.-

3 r '7

24

Device Application" , ACS App l.

Ch

50

| ~ 7Y::'-

(2007)

[10]Wu , W.-T.;

Nickel Oxide Films for E1ectrochromic

(2006).

Technology

Oxygen-Reservoir Structure" , ACS

These" , J. Mater. Chem. , 17 , 127-156

A. , "E1ectrochromic Nanostructured

12

| ~

Solution Route to Nanostructured

Nickel Oxide, and Devices Based on

Agnihot

! ~

[l 3]Chiang K.-K.; Wu , J.-J. , "Fuel-Assisted

K.; Shivaprasad , S. M.;

12

Thin Fi1ms of Tungsten Oxide and

[9]Deepa , M.; Joshi , A. G.; Srivastava, A

108

Ch J. -S. ,

'

1405826 (2013)

[ 16]

Fi1ms with Improved Electrochromic

Properties" , ChemPhysChem , 11 ,

3306-3312 (2010)

1405827 (2013)

'

:
-
:

y 1) _';/ ;i "

-!' :1

24

24

224

20144

109

April
4

j 11;

AS

ZJ

CIGS

CIGS

CIGS

CIGS

CIGS

(CIGS)

15-17 % '

f{ff iJf{t

CIGS

CIGS

m 1

CIGSI

CIGS

HelioVolt Nano solar ISET

CIGS

CIGS

(l -Octadece ODE)

CIGS

(arrested precipitation)l

(trioctylphosphine, TOP) , (oleic acid ,

CIGS

OA)(oleylamine OLA)

(1. 02 eV1. 68 eV) CIGS(1.

20% ' 30% '

CIGS(>IO'cm)

1-2m 0.03 /

(110)

(CIGS) (() CIS) (


() CIGS) (CIGSSe)

110

224

20144

11

April
4

j 11;

AS

ZJ

CIGS

CIGS

CIGS

CIGS

CIGS

(CIGS)

15-17 % '

f{ff iJf{t

CIGS

CIGS

m 1

CIGSI

CIGS

HelioVolt Nano solar ISET

CIGS

CIGS

(l -Octadece ODE)

CIGS

(arrested precipitation)l

(trioctylphosphine, TOP) , (oleic acid ,

CIGS

OA)(oleylamine OLA)

(1. 02 eV1. 68 eV) CIGS(1.

20% ' 30% '

CIGS(>IO'cm)

1-2m 0.03 /

(110)

(CIGS) (() CIS) (


() CIGS) (CIGSSe)

110

224

20144

11

AF

1>

Hot Solvent Method


.Cu. Ga , S. 5e precursors
-Solvent
-Surfactant

..

STEM-EDS mapping

( 3) EDS

.;

~.-;
b

CIGS

-~-"--
F

-_."_

Cu:ln:Ga:S:Se 1 :0.5:0.5: 1: 1
X (XPS)

CIGS

Cu1n .

Ga( SySe l )2

XRD

(111)

CulnSe 2 aCulnGaSe 2

1I:R 0

1 C1GS

CIGS

Culn 1., Ga( SySe l Y )2

o Pan

CuGaS 2 CulnSe 2

CulnSe

( 4)

112

diffraction , XRD)

O!..

E :Aq.z

heater

CIGS Culn l . Ga/S ySe l.Y)2

space group

1-42d '

Se ~

1m

5'

265 C '

Ga S

UV-Vis-NIR

Korgel 2008

6 Culn l .

iliCulnS CulnSe 2

Culn l . Ga , (SySe 1)2 S I

Ga(SySe l )2

CulnGaSe

Se In/Ga x y

Culn l .Ga/S y Se l )2

Hillhouse 2008

1] 1 S/Se In/Ga

CulnSe

Culn o .Ga O .5(So. Se o )

1. 08 eV

Il] CIGS

( 2)

2.02 eV Cyclic

Sargent CuGaSe

(TEM) HRTEM X (X-ray

voltammetry analysis (CV)

224

20144

Vegard's law'

113

AF

1>

Hot Solvent Method


.Cu. Ga , S. 5e precursors
-Solvent
-Surfactant

..

STEM-EDS mapping

( 3) EDS

.;

~.-;
b

CIGS

-~-"--
F

-_."_

Cu:ln:Ga:S:Se 1 :0.5:0.5: 1: 1
X (XPS)

CIGS

Cu1n .

Ga( SySe l )2

XRD

(111)

CulnSe 2 aCulnGaSe 2

1I:R 0

1 C1GS

CIGS

Culn 1., Ga( SySe l Y )2

o Pan

CuGaS 2 CulnSe 2

CulnSe

( 4)

112

diffraction , XRD)

O!..

E :Aq.z

heater

CIGS Culn l . Ga/S ySe l.Y)2

space group

1-42d '

Se ~

1m

5'

265 C '

Ga S

UV-Vis-NIR

Korgel 2008

6 Culn l .

iliCulnS CulnSe 2

Culn l . Ga , (SySe 1)2 S I

Ga(SySe l )2

CulnGaSe

Se In/Ga x y

Culn l .Ga/S y Se l )2

Hillhouse 2008

1] 1 S/Se In/Ga

CulnSe

Culn o .Ga O .5(So. Se o )

1. 08 eV

Il] CIGS

( 2)

2.02 eV Cyclic

Sargent CuGaSe

(TEM) HRTEM X (X-ray

voltammetry analysis (CV)

224

20144

Vegard's law'

113

e!~

(a)
(NFF)

(a)

(b)

)
A
ZcMC-

20

25

30

35

40

45

55

60

r--cu~asJ~~~:~~'
(112)

(3)
3U

Cu

x=y=0.2
0.1

CulnSe JCPDS 40.1487

20

Se

Culn , .Ga.(Se,.),
(3)
C3U

IEDS
u:25.12%
Iln ' 12 .4 4%
a : 12.42%
24.86%

(d)

LJ36

(20)

U
MZ3

20 25 30 35 40 45 50 55 60 65 70 75 80
2 Thela (degree)

Culn 1.xGaX( SySe 1y)2

25

30

35
40
45
2Thela (Degree)

2 3 4 5 6 7 8 9 1011 12
Energy (KeV)

50

55

8
10
Energy (KeV)

12

14

60

Culn 1 ' X Ga X (SySe 1 .)2 (a)XRD (b)EDS

Cu Ino.Gao (So.Se o ) (a)XRD (b)TEM (C)HRTEM (d)EDS

(b)

(a)
~lnt..Ga.(S)'Se1.)')2

CV HOMO

LUMO

CulnSe

CuG.

e,

"'.'1

,.,...0

c;..
----\C
Se
x=y=O.1;

__ r u ln t ..Ga.(SySe t ...)2

..---- ~ --- I

CuG~Se
M

I I

1. 14
eV 2.23

114

Culno~Ga(So.5e 05 )STEM-EDS7t

224

20144

Culn , Ga(SySe.}vsI

' 15

e!~

(a)
(NFF)

(a)

(b)

)
A
ZcMC-

20

25

30

35

40

45

55

60

r--cu~asJ~~~:~~'
(112)

(3)
3U

Cu

x=y=0.2
0.1

CulnSe JCPDS 40.1487

20

Se

Culn , .Ga.(Se,.),
(3)
C3U

IEDS
u:25.12%
Iln ' 12 .4 4%
a : 12.42%
24.86%

(d)

LJ36

(20)

U
MZ3

20 25 30 35 40 45 50 55 60 65 70 75 80
2 Thela (degree)

Culn 1.xGaX( SySe 1y)2

25

30

35
40
45
2Thela (Degree)

2 3 4 5 6 7 8 9 1011 12
Energy (KeV)

50

55

8
10
Energy (KeV)

12

14

60

Culn 1 ' X Ga X (SySe 1 .)2 (a)XRD (b)EDS

Cu Ino.Gao (So.Se o ) (a)XRD (b)TEM (C)HRTEM (d)EDS

(b)

(a)
~lnt..Ga.(S)'Se1.)')2

CV HOMO

LUMO

CulnSe

CuG.

e,

"'.'1

,.,...0

c;..
----\C
Se
x=y=O.1;

__ r u ln t ..Ga.(SySe t ...)2

..---- ~ --- I

CuG~Se
M

I I

1. 14
eV 2.23

114

Culno~Ga(So.5e 05 )STEM-EDS7t

224

20144

Culn , Ga(SySe.}vsI

' 15

mr

~til

(a)

Culn ,..Gall(SySe')2
x=y=O.1

(3)u
tmn

Eg

1.08 eV

CIOS

1.17 eV

x=y=0.4

1.42 eV

x=y=0.5

1.56 eV

x=y=0.6

1.71 eV

x=y=0.8

2.01 eV

x=y=0.9

2.20 eV

1 (spray coating)

i .

CIOS

illJ

50

400

600

700

8 o

9 o

1000

1100

1200

1300

1400

Wavelength (nm)

CIGS

(b)

x=y=

0.8

0.4

0.1

(d)

(c)

-3.5

505

TItiEMIti--4
Ta-EEnEt-no

7 dd

24

Tll
lli

(@)

Tll

(2m
w)
U

-4 .0

CIGS

1-5

CulnSe

2m

[]

-6.0
-6.5

-2 -1 0
2
Potential (V)

116

Culn .Ga(SySe .y)' UV-Vis-NIRECVISI

224

. 3-D

i~

20144

117

mr

~til

(a)

Culn ,..Gall(SySe')2
x=y=O.1

(3)u
tmn

Eg

1.08 eV

CIOS

1.17 eV

x=y=0.4

1.42 eV

x=y=0.5

1.56 eV

x=y=0.6

1.71 eV

x=y=0.8

2.01 eV

x=y=0.9

2.20 eV

1 (spray coating)

i .

CIOS

illJ

50

400

600

700

8 o

9 o

1000

1100

1200

1300

1400

Wavelength (nm)

CIGS

(b)

x=y=

0.8

0.4

0.1

(d)

(c)

-3.5

505

TItiEMIti--4
Ta-EEnEt-no

7 dd

24

Tll
lli

(@)

Tll

(2m
w)
U

-4 .0

CIGS

1-5

CulnSe

2m

[]

-6.0
-6.5

-2 -1 0
2
Potential (V)

116

Culn .Ga(SySe .y)' UV-Vis-NIRECVISI

224

. 3-D

i~

20144

117

~\'}'!!

;;;;t?

Experimental
Culn(SO.5SeO.5)2
- -Culn(S05Se05)2
(JCPDS 36-1311)

-m)
1

1m

40 45 50 55 60
2 Thela (degree)

3 35

EE

20 25

Culn(SJh )
weighl' 1. 18g

Culn(SSe 03S )2
-- Culn(SO.5 Se O.5>2

(JCPDS 36-1311)
. 8

"hw

oh

40 45 50 55 60
2 Thela (degree)

3 35

20 25

Experimental
Culn05Ga05Se2

CulnO.5Ga05Se2
weighl ' 1.25 9

CulnSe

- - Culn05Ga05Se2
(JCPDS 40-1488)

1n

'

1n

20 25 30 35 40 45 50 55 60
2 Thela (degree)


3.

CulnO.5Ga~(S~SeLts);
welghl ' 1.34 9

':; .:....I;.....li
:

Ea:EU

400
2 Thela (degree)

118

500

600

800 1000 1200 1400


700
900 1100 1300
Wavelenglh (nm)

CIGS178)

22 4

CIGS

CIGS

20144

19

~\'}'!!

;;;;t?

Experimental
Culn(SO.5SeO.5)2
- -Culn(S05Se05)2
(JCPDS 36-1311)

-m)
1

1m

40 45 50 55 60
2 Thela (degree)

3 35

EE

20 25

Culn(SJh )
weighl' 1. 18g

Culn(SSe 03S )2
-- Culn(SO.5 Se O.5>2

(JCPDS 36-1311)
. 8

"hw

oh

40 45 50 55 60
2 Thela (degree)

3 35

20 25

Experimental
Culn05Ga05Se2

CulnO.5Ga05Se2
weighl ' 1.25 9

CulnSe

- - Culn05Ga05Se2
(JCPDS 40-1488)

1n

'

1n

20 25 30 35 40 45 50 55 60
2 Thela (degree)


3.

CulnO.5Ga~(S~SeLts);
welghl ' 1.34 9

':; .:....I;.....li
:

Ea:EU

400
2 Thela (degree)

118

500

600

800 1000 1200 1400


700
900 1100 1300
Wavelenglh (nm)

CIGS178)

22 4

CIGS

CIGS

20144

19

..r

CIGS

CIGS

CIGSSe l!& In Ga

( 10)

CIGS

Kaelin

120

CIGS

4.76% [10] Guo

500-600 "C Culn

CIGSSe

. CIGSSe NaC17k

[Ga]/[In +

Ga] 2.1 % .

7.7%

12.0%1 11 1

1-3

191

2008

CulnSe

. Hillhouse CulnSe

CulnSe 2 *Il CuSe Cu.se Ino

Cu In:Se

if1] 500.C

= 29:43:28 CulI n 0.67 .

450-550.C

CIGSnCdS

I. CulnSe

8.2% [1

pn CIGS

1.5

Lee CIGS

1-3

2.8%

. n CdS 2 .4

pCIGS p

H s e Se

224

utio
n-b
ased d t
~s

ittion

.
~ ;..

seE!13!3;n

CIGSSe
IMoglass

Cd

Sdep
s

itti

AI-ZnO/i-ZnO/CdS J ZnO sputter


ICIGSSe/Mo/glass -

Current collection grid

. 10

20144

CIGS"

121

..r

CIGS

CIGS

CIGSSe l!& In Ga

( 10)

CIGS

Kaelin

120

CIGS

4.76% [10] Guo

500-600 "C Culn

CIGSSe

. CIGSSe NaC17k

[Ga]/[In +

Ga] 2.1 % .

7.7%

12.0%1 11 1

1-3

191

2008

CulnSe

. Hillhouse CulnSe

CulnSe 2 *Il CuSe Cu.se Ino

Cu In:Se

if1] 500.C

= 29:43:28 CulI n 0.67 .

450-550.C

CIGSnCdS

I. CulnSe

8.2% [1

pn CIGS

1.5

Lee CIGS

1-3

2.8%

. n CdS 2 .4

pCIGS p

H s e Se

224

utio
n-b
ased d t
~s

ittion

.
~ ;..

seE!13!3;n

CIGSSe
IMoglass

Cd

Sdep
s

itti

AI-ZnO/i-ZnO/CdS J ZnO sputter


ICIGSSe/Mo/glass -

Current collection grid

. 10

20144

CIGS"

121

200

CIGS

1.98 % [16]

7)<

CIGSSe

NaBH

1. 02%[( 11 )

Cu-In

(150/)

2 CU I1 In

//

CulnSe

CIGSSeIZnS(O , OH)

1 .4 7 %

Tr

112

I nJ

450"(

CIGSSelCdS

2.62 %

200-2501

CIGS 1n S

(13) 0 f 7

iiJ

iJ ll.1 %I
15]

C1GSSe

CIS

2
01
2 AhnCu-In-Se

f'( 1) Akhavan

7%

CulnSe

AM 1. 5

1.9% \1

(b)

(a)

CIGSS

Voc(V)

Jsc
(m Alcm')

FF

PCE (%)

Ref

(c) 30
-20

J Lighl

1- - Dark

.-1

Jsc= 13.96 mAlcm 2


Voc=0.26 V
Efficiency=1.02 o/t ,/
FF=0.28
/ ...

(d)

0.63

28.8

0.657

12

[]

CISe

0.44

33.7

0.55

8.2

[12)

CIGSe

0.305

17.326

0.497

2.62

[13)

Cu ll ln!l

CISe

0.352

34.3

57

[14)

amorphous Cu-In-Se

CISe

265

22.63

33

1.98

[16)

CISe

23.68

31

1.4 7

[17)

CIGSSe

26

13.96

28

1.02

[8)

CISe , CuSe , CU 2 5e.ln Z O J

50

1 CIGSe
40
30

CIGSSe

CIGS

1 cm

B 20

fii-10
2

amorphous Cu-In
CIGSSe

10

-20

-30 -11 --..~-4---.~--.--.--.l


-0 .4
-0.2
o
0.2
0.4
0.6
400
V lage (V)

11

22

600
800
Wavelenglh (nm)

00

1200

CIGSSe18)

CISe

CISe

0.4 76

8.3

0.4 88

1.93

[18)

CISe

CISe

41

16.3

0.46

3.1

[19)

CISe

CISe

34

1 96

45

1.68

[20)

224

20144

123

200

CIGS

1.98 % [16]

7)<

CIGSSe

NaBH

1. 02%[( 11 )

Cu-In

(150/)

2 CU I1 In

//

CulnSe

CIGSSeIZnS(O , OH)

1 .4 7 %

Tr

112

I nJ

450"(

CIGSSelCdS

2.62 %

200-2501

CIGS 1n S

(13) 0 f 7

iiJ

iJ ll.1 %I
15]

C1GSSe

CIS

2
01
2 AhnCu-In-Se

f'( 1) Akhavan

7%

CulnSe

AM 1. 5

1.9% \1

(b)

(a)

CIGSS

Voc(V)

Jsc
(m Alcm')

FF

PCE (%)

Ref

(c) 30
-20

J Lighl

1- - Dark

.-1

Jsc= 13.96 mAlcm 2


Voc=0.26 V
Efficiency=1.02 o/t ,/
FF=0.28
/ ...

(d)

0.63

28.8

0.657

12

[]

CISe

0.44

33.7

0.55

8.2

[12)

CIGSe

0.305

17.326

0.497

2.62

[13)

Cu ll ln!l

CISe

0.352

34.3

57

[14)

amorphous Cu-In-Se

CISe

265

22.63

33

1.98

[16)

CISe

23.68

31

1.4 7

[17)

CIGSSe

26

13.96

28

1.02

[8)

CISe , CuSe , CU 2 5e.ln Z O J

50

1 CIGSe
40
30

CIGSSe

CIGS

1 cm

B 20

fii-10
2

amorphous Cu-In
CIGSSe

10

-20

-30 -11 --..~-4---.~--.--.--.l


-0 .4
-0.2
o
0.2
0.4
0.6
400
V lage (V)

11

22

600
800
Wavelenglh (nm)

00

1200

CIGSSe18)

CISe

CISe

0.4 76

8.3

0.4 88

1.93

[18)

CISe

CISe

41

16.3

0.46

3.1

[19)

CISe

CISe

34

1 96

45

1.68

[20)

224

20144

123

Z!lII

AK1,

(-20%)

W.;

Am Chem Soc , "Synthesis of Cu-In-S

F.; Zogg H.; Meyer, T.;

CIGS

Ternary Nanocrysta1s with Tunable

"Low-cost CIGS solar ce l1 s by paste

Structure and Composition" , Joumal of

coating and selenization" , Thin Solid

The American Chemicas1 Society, 130

Films, 480, 486-490 (2005).

150

nm 3.1%1

Cha1cogenide-hydrazinium(MCC)
i

CulnSe

Energy

[5]Pan, D. C. ; An, L. J.; Sun, Z. M. ; Hou,


Yang ;

Yang, Z. Z.; Lu, Y. F., J

(17) , 5620-5621 (2008).

& Environmental

Science , 4 ,

4929-4932 (2011)
[9]Kael

M.; Rudmann , 0 .; Kurdesau


Tiwa A .

N. ,

[10]Guo, Q.; Ford, G.-M.; Hi l1 house, H.-

[6]Panthani , M. G.; Akhavan , V.;

Agrawa1 ,

R. ulfide

Nanocrysta1

Goodfellow , B.; Schmidtke , J.-P.;

Inks for DenseCu (I n,.,Ga ,)(S ,.ySe,),

[1]Schock, H.-w. ; Noufi, R. "CIGS-based

Dunn , L.; Dodaba1apur, A.; Barbara

Absorber Films and Their Photovoltaic

solar cells for the next millennium" ,

P.-F.; Korgel , B.-A. "Synthesis of

Performance", Nano Letters, 9(8), 3060-

CulnSe MCC

Progress in Photovoltaics , 8 (1), 151-

Cu1nS"

160 (2000).

(CIGS) Nanocrystal 'Inks' for Printable

[11]Guo, Q.; Ford, G.-M.; Agrawal, R.;

CulnS

and Cu(lnxGal-x)Se

3065 (2009).

MCC~

[2]Jackson , P.; Hariskos 0.; Lotter E.; Pate1

Photovo1taics" , Jouma1 ofThe American

Hillhouse H.-W. , "Ink formulation

CulnSe

S.; Wuerz R.; Menner R.; Wischmann

Chemicas1 Society, 130(49) , 16770-

and 10w-temperature incorporation

1.5 6%IJ 1. 68% '

W.; Powalla M. , "New wor1d record

16777 (2008).

of sodium to yie1d 12% efficient

efficiency for Cu (In ,Ga) Se,

thin film

[7 ]Chiang, M.-Y.; Chang, S.-H.; Chen, C.-

Cu (In , Ga)(S , Se ), solar cells from

solar ce l1 s beyond 20%", Progress in

Yuan, F.-W.; Tuan "Quatemary

su1fide nanocrysta1 inks" , Progress

Photovoltaics , 19 (11) , 894-897 (2011)

Culn(S ,.,Sex), nanocrysta1s: facile

in Photovoltaics: Research and

S.-J.; Kar, M.; Shafarman,

heating-up synthesis , band gap tuning ,

Applications 64-71

CIGS

W.N.; Birkmire , R.-W.; Stach , E.-

and gram-scale production" , The Joumal

[12]Jeong, S.; Lee, 8. -S.; Ahn, S.; Yoon,

A.; Agrawal , R.; Hillhouse , H.-W.

of Physica1 Chemistry C, 115(5), 1592-

K.; Seo, Y.-H.; Choi, Y.; Ryu, B.-H.,

"Deve10pment of CulnSe Nanocrystal

1599 (2011).

"An 8.2% efficient solution-processed

and Nanoring Inks for Low-Cost Solar

Ce l1 s", Nano Letters, 8 (9), 2982-2987

C.-C.; Yuan, F.-w.; Chen,

Chiu,

CulnSe nanoparticles" , Energy

(2008).

B.- Y.; Kao , T. -L.; Lai, C.-H.; Tuan,

Environmental Science, 5, 7539-7542,


(2012).

[3]G Q.; m

124

20 (22) , 6906-6910 (2008).

[8]Chang, S.-H.; Chiang, M.- Y.; Chiang,

c. -Y.;

(2013)

CulnSe solar ce l1 based on mu1tiphase

[4]Tang, J.; Hinds , S.; Kelley, S.O.;

H.- Y., "Facile colloida1 synthesis of

Sargent, E.-H. , "Synthesis of Co l1 oidal

quinary CUln,.,Gax(SySe,.y),(CIGSSe)

[13]Lee, J.-H.; Chang, J.; Cha, J.-H .; Lee,

CuGaSe" CulnSe" and Cu(lnGa)Se

nanocrysta1 inks with tunab1e band

Y.; Han , J.-E.; Jung, 0.- Y.; Choi E.C. ;

Nanoparticles", Chemistry of Materials,

gaps for use in low-cost photovoltaics" ,

Hong, B, Large-Scale, "Surfactant-

ISi 224

20144

125

Z!lII

AK1,

(-20%)

W.;

Am Chem Soc , "Synthesis of Cu-In-S

F.; Zogg H.; Meyer, T.;

CIGS

Ternary Nanocrysta1s with Tunable

"Low-cost CIGS solar ce l1 s by paste

Structure and Composition" , Joumal of

coating and selenization" , Thin Solid

The American Chemicas1 Society, 130

Films, 480, 486-490 (2005).

150

nm 3.1%1

Cha1cogenide-hydrazinium(MCC)
i

CulnSe

Energy

[5]Pan, D. C. ; An, L. J.; Sun, Z. M. ; Hou,


Yang ;

Yang, Z. Z.; Lu, Y. F., J

(17) , 5620-5621 (2008).

& Environmental

Science , 4 ,

4929-4932 (2011)
[9]Kael

M.; Rudmann , 0 .; Kurdesau


Tiwa A .

N. ,

[10]Guo, Q.; Ford, G.-M.; Hi l1 house, H.-

[6]Panthani , M. G.; Akhavan , V.;

Agrawa1 ,

R. ulfide

Nanocrysta1

Goodfellow , B.; Schmidtke , J.-P.;

Inks for DenseCu (I n,.,Ga ,)(S ,.ySe,),

[1]Schock, H.-w. ; Noufi, R. "CIGS-based

Dunn , L.; Dodaba1apur, A.; Barbara

Absorber Films and Their Photovoltaic

solar cells for the next millennium" ,

P.-F.; Korgel , B.-A. "Synthesis of

Performance", Nano Letters, 9(8), 3060-

CulnSe MCC

Progress in Photovoltaics , 8 (1), 151-

Cu1nS"

160 (2000).

(CIGS) Nanocrystal 'Inks' for Printable

[11]Guo, Q.; Ford, G.-M.; Agrawal, R.;

CulnS

and Cu(lnxGal-x)Se

3065 (2009).

MCC~

[2]Jackson , P.; Hariskos 0.; Lotter E.; Pate1

Photovo1taics" , Jouma1 ofThe American

Hillhouse H.-W. , "Ink formulation

CulnSe

S.; Wuerz R.; Menner R.; Wischmann

Chemicas1 Society, 130(49) , 16770-

and 10w-temperature incorporation

1.5 6%IJ 1. 68% '

W.; Powalla M. , "New wor1d record

16777 (2008).

of sodium to yie1d 12% efficient

efficiency for Cu (In ,Ga) Se,

thin film

[7 ]Chiang, M.-Y.; Chang, S.-H.; Chen, C.-

Cu (In , Ga)(S , Se ), solar cells from

solar ce l1 s beyond 20%", Progress in

Yuan, F.-W.; Tuan "Quatemary

su1fide nanocrysta1 inks" , Progress

Photovoltaics , 19 (11) , 894-897 (2011)

Culn(S ,.,Sex), nanocrysta1s: facile

in Photovoltaics: Research and

S.-J.; Kar, M.; Shafarman,

heating-up synthesis , band gap tuning ,

Applications 64-71

CIGS

W.N.; Birkmire , R.-W.; Stach , E.-

and gram-scale production" , The Joumal

[12]Jeong, S.; Lee, 8. -S.; Ahn, S.; Yoon,

A.; Agrawal , R.; Hillhouse , H.-W.

of Physica1 Chemistry C, 115(5), 1592-

K.; Seo, Y.-H.; Choi, Y.; Ryu, B.-H.,

"Deve10pment of CulnSe Nanocrystal

1599 (2011).

"An 8.2% efficient solution-processed

and Nanoring Inks for Low-Cost Solar

Ce l1 s", Nano Letters, 8 (9), 2982-2987

C.-C.; Yuan, F.-w.; Chen,

Chiu,

CulnSe nanoparticles" , Energy

(2008).

B.- Y.; Kao , T. -L.; Lai, C.-H.; Tuan,

Environmental Science, 5, 7539-7542,


(2012).

[3]G Q.; m

124

20 (22) , 6906-6910 (2008).

[8]Chang, S.-H.; Chiang, M.- Y.; Chiang,

c. -Y.;

(2013)

CulnSe solar ce l1 based on mu1tiphase

[4]Tang, J.; Hinds , S.; Kelley, S.O.;

H.- Y., "Facile colloida1 synthesis of

Sargent, E.-H. , "Synthesis of Co l1 oidal

quinary CUln,.,Gax(SySe,.y),(CIGSSe)

[13]Lee, J.-H.; Chang, J.; Cha, J.-H .; Lee,

CuGaSe" CulnSe" and Cu(lnGa)Se

nanocrysta1 inks with tunab1e band

Y.; Han , J.-E.; Jung, 0.- Y.; Choi E.C. ;

Nanoparticles", Chemistry of Materials,

gaps for use in low-cost photovoltaics" ,

Hong, B, Large-Scale, "Surfactant-

ISi 224

20144

125

Free Solution Syntheses of Cu (I n, Ga)

B.A. , "Spray-deposited CulnSe

Se )

Nanocrystals for Thin Film

nanocrystal photovoltaics" , Energy&

Solar Cells" , European Journal

Environmetnal Science, 3, 1600-1606

Inorganic Chemistry, 647-651 (2011)

(20 \0)

[l 4]Kind,

c.;

Feldmann C.; Quintilla, A.;

[1 Akhavan

Goodfellow ,

Nanoparti c\ es and It s Use for Thin-

Korgel , B.-A. , "Thickness-limited

Film Manufacturing of CIS Solar

performance of CulnSe nanocrystal

Cells" , Chem Mater, 23 , 5269-5274

photovoltaic devices" , Optical

(2011 )

Express , 18 , A411-A420 (20 \0)

B W.;

V-A.; Panthani , M.-G.;

Ahlswede , E. , "Citrate-Capped Cu ll In,

Reid , D.-K.;

) 1lt()

[15]Wang, L. -P.; Chiang C.-C.; Wang , Y.-

[20]Stolle, C. J.; Panthani , M.-G.; Harvey,

Y.; Yeh, T. -K.; Chen , w. -C.; Tsai , S.-Y. ,

T.-B.; Akhavan , V.-A.; Korgel , B.

"Flexible Cd-free Cu (In, Ga)Se, solar

A. , "Comparison of the Photovoltaic

(I rving Langmuir ' 1881

cells with non-vacuum process Surface

Response of Oleylamine and

1957' 1932) 1928 J (plasma)

and Coatings Technology" , 231 , 590-

Inorganic Li gand-Capped CulnSe

593 (2013).

Nanocrystals" , ACS Applied Materials

Interface, 4 , 2757-2761 (2012).

[16]Ahn , S.; Kim , K.; Cho , A.; Gwak ,


J.; Yun , J.-H.;

Sh

K.; Ahn , S.;

Yoon , K. , "CulnSe, (CIS)Thin Films

Prepared from Amorphous Cu-In-Se


Nanoparti c\ e Precursors for Solar Cell

Application" , ACS Applied Materials&

Interfac 4 1530-1536

(2012).

[17]Liu , S.-H.; Chen , F.-S.; Lu , C.-H. ,


"Synthesis of CulnSe2 films via
selenizing the Cu-In alloy-containing

nanopowders" , Joumal of Alloys and

Compounds, 517 , 14-19 (2012).

[18]Akhavan , V-A.; Goodfellow , B.W.; Panthani , M.-G.; Reid , D.-K.;


Hellebusch , D. J.; Adachi , T.; Korgel ,

125

224

'?
~

il!l. '

Free Solution Syntheses of Cu (I n, Ga)

B.A. , "Spray-deposited CulnSe

Se )

Nanocrystals for Thin Film

nanocrystal photovoltaics" , Energy&

Solar Cells" , European Journal

Environmetnal Science, 3, 1600-1606

Inorganic Chemistry, 647-651 (2011)

(20 \0)

[l 4]Kind,

c.;

Feldmann C.; Quintilla, A.;

[1 Akhavan

Goodfellow ,

Nanoparti c\ es and It s Use for Thin-

Korgel , B.-A. , "Thickness-limited

Film Manufacturing of CIS Solar

performance of CulnSe nanocrystal

Cells" , Chem Mater, 23 , 5269-5274

photovoltaic devices" , Optical

(2011 )

Express , 18 , A411-A420 (20 \0)

B W.;

V-A.; Panthani , M.-G.;

Ahlswede , E. , "Citrate-Capped Cu ll In,

Reid , D.-K.;

) 1lt()

[15]Wang, L. -P.; Chiang C.-C.; Wang , Y.-

[20]Stolle, C. J.; Panthani , M.-G.; Harvey,

Y.; Yeh, T. -K.; Chen , w. -C.; Tsai , S.-Y. ,

T.-B.; Akhavan , V.-A.; Korgel , B.

"Flexible Cd-free Cu (In, Ga)Se, solar

A. , "Comparison of the Photovoltaic

(I rving Langmuir ' 1881

cells with non-vacuum process Surface

Response of Oleylamine and

1957' 1932) 1928 J (plasma)

and Coatings Technology" , 231 , 590-

Inorganic Li gand-Capped CulnSe

593 (2013).

Nanocrystals" , ACS Applied Materials

Interface, 4 , 2757-2761 (2012).

[16]Ahn , S.; Kim , K.; Cho , A.; Gwak ,


J.; Yun , J.-H.;

Sh

K.; Ahn , S.;

Yoon , K. , "CulnSe, (CIS)Thin Films

Prepared from Amorphous Cu-In-Se


Nanoparti c\ e Precursors for Solar Cell

Application" , ACS Applied Materials&

Interfac 4 1530-1536

(2012).

[17]Liu , S.-H.; Chen , F.-S.; Lu , C.-H. ,


"Synthesis of CulnSe2 films via
selenizing the Cu-In alloy-containing

nanopowders" , Joumal of Alloys and

Compounds, 517 , 14-19 (2012).

[18]Akhavan , V-A.; Goodfellow , B.W.; Panthani , M.-G.; Reid , D.-K.;


Hellebusch , D. J.; Adachi , T.; Korgel ,

125

224

'?
~

il!l. '

Surface Trea!m ent Technology

.....

-..

500 'C '

: (1)

(structural morphology)'

' i

; (2)

(plasma modification) ;

(fibronec FN)

()

(l aminin)

Arg-Gly-Asp(RGD)

(plasma

Arg- Gl y- Asp- Ser(RGDS) , Tyr- Il e-

Gly- Se Arg(YIGSR) , Arg- Glu- Asp-

Val(REDV)

(hyaluronic

(collagen) (glycosamino

glycans , GAG) [2-4J

polymerization)

acid)

Yasudafll

Gazicki z

11

[51

{ Teflon

[I .

MCF-7

1t1iJ1

CF)'!Jft (poly

caprolactone , PCL)l!

CF

PCLl!1.(1 1

i [1]

128

224

20 4

:;:0

1 2

Surface Trea!m ent Technology

.....

-..

500 'C '

: (1)

(structural morphology)'

' i

; (2)

(plasma modification) ;

(fibronec FN)

()

(l aminin)

Arg-Gly-Asp(RGD)

(plasma

Arg- Gl y- Asp- Ser(RGDS) , Tyr- Il e-

Gly- Se Arg(YIGSR) , Arg- Glu- Asp-

Val(REDV)

(hyaluronic

(collagen) (glycosamino

glycans , GAG) [2-4J

polymerization)

acid)

Yasudafll

Gazicki z

11

[51

{ Teflon

[I .

MCF-7

1t1iJ1

CF)'!Jft (poly

caprolactone , PCL)l!

CF

PCLl!1.(1 1

i [1]

128

224

20 4

:;:0

1 2

2014
11;

Surface Treatment Technology

Kurniawan

po Iysul fone(PS f)-ml

l (

30-150

ili

2-20

'PVDF

(albumin)

It1 11 J

20W()

; PSf

t!lJ

I!7l<( CF )(

H!! 'PVDF PSf

poly(3 -hydrobutyrate-co-3-

0)( 1) . If

hydroxyvalerate )(PHBV)

(PTFE)

PVDF Magnidaan

( 2)

PVDF

tllJ polytetrafluoroethene

(HMDSO)1 9 . 10 1

nm 65-95 %

'

14 3
12 3
12 3
83
63
L: 4 3
? 3
3
33

0.5-1m '

IJ (drawing) 'I1(electrospinning)

(phase inversion) (template

synthesis)

114 If

224

Poly(vinylidene fluoride)(PVDF)

[ 12.13 1

30

23

<3

13

140
120
BC-CF. 120
80
60
40
201
40
c BC-N
30
20
10

43

BC-O

2j \

60

120 180 240

30

Treatment time (5)


(a)

BC-CF.

1:

0
40
30
20
10

BC-N 2

BC-O

20

40

60

80

100

Applied power (W)


(b)

(a)

(b)

20144

131

2014
11;

Surface Treatment Technology

Kurniawan

po Iysul fone(PS f)-ml

l (

30-150

ili

2-20

'PVDF

(albumin)

It1 11 J

20W()

; PSf

t!lJ

I!7l<( CF )(

H!! 'PVDF PSf

poly(3 -hydrobutyrate-co-3-

0)( 1) . If

hydroxyvalerate )(PHBV)

(PTFE)

PVDF Magnidaan

( 2)

PVDF

tllJ polytetrafluoroethene

(HMDSO)1 9 . 10 1

nm 65-95 %

'

14 3
12 3
12 3
83
63
L: 4 3
? 3
3
33

0.5-1m '

IJ (drawing) 'I1(electrospinning)

(phase inversion) (template

synthesis)

114 If

224

Poly(vinylidene fluoride)(PVDF)

[ 12.13 1

30

23

<3

13

140
120
BC-CF. 120
80
60
40
201
40
c BC-N
30
20
10

43

BC-O

2j \

60

120 180 240

30

Treatment time (5)


(a)

BC-CF.

1:

0
40
30
20
10

BC-N 2

BC-O

20

40

60

80

100

Applied power (W)


(b)

(a)

(b)

20144

131

:.l.... ".4; ",'"..;:." .*':..

Surface Treatment Technology

dvN

"'

:[

U
nL

(Z
)@E-m
z2OC
-

'"o
3

()

132

DN

cd

PSf'

(17J

3(b) .

PVDF PSf'

20W' 30

'PVDF

PVDF PS f:

iJ 1

PVDF( 4)

PVDF 2.5

M
H

EO()

E= D
TZ)
2uc

:~

24
)
E

w
m
m
H
{
E

(
0
)()
E
A

E
MW
C)

E
R
#
h
Z
Q)
mk(B
m
c
oz
wm
(
)E

(0
(0
)

U
N

NOE
U

PSf'

224

PVDF4

3(a) i

20W 30

PSf' PSf

PVDF

(b)

(a)

J....

E14
12

_n

_08
30 8
= 608
14 ~ f;:J 120 8
= 3008
_6008
I:J

36
t3

2 hr

1 hr

Culture time
3

4 hr

1 hr

2 hr

4 hr

Culture time

(a)PVDF (b)PSf

ili

2014 4

33

:.l.... ".4; ",'"..;:." .*':..

Surface Treatment Technology

dvN

"'

:[

U
nL

(Z
)@E-m
z2OC
-

'"o
3

()

132

DN

cd

PSf'

(17J

3(b) .

PVDF PSf'

20W' 30

'PVDF

PVDF PS f:

iJ 1

PVDF( 4)

PVDF 2.5

M
H

EO()

E= D
TZ)
2uc

:~

24
)
E

w
m
m
H
{
E

(
0
)()
E
A

E
MW
C)

E
R
#
h
Z
Q)
mk(B
m
c
oz
wm
(
)E

(0
(0
)

U
N

NOE
U

PSf'

224

PVDF4

3(a) i

20W 30

PSf' PSf

PVDF

(b)

(a)

J....

E14
12

_n

_08
30 8
= 608
14 ~ f;:J 120 8
= 3008
_6008
I:J

36
t3

2 hr

1 hr

Culture time
3

4 hr

1 hr

2 hr

4 hr

Culture time

(a)PVDF (b)PSf

ili

2014 4

33

1'111'

Surface Treatment Technology

(Z
)

(PPG)

-@
EE-

(PPA)

(PPP)
6 .6 2 . 0( 5) .

PVD PSf
( 100mm

10 mm)1

PPA

PPG

qu

"

'0

.r

..'

H . N
2 J

"

-.

....-.. . .

10

,--=

HN

PPP

HN./\

20
30
Power (W)

40

50

l1

1 18 1 [ "1

(20J ..

. m

6) . 11

~!ll!

FJ!

DNA [1

(21) 0

134

Mangindaan
6

m~

(precursor) l

: (propargylamine)

(allylamine) (propylamine)

iI!

-{

122) [2! 1 "1

) i(261

ISfi -

\00 mTorrfI!

m:~

0-50W

tr

( 22 4

(a) (b)m

20144

(c) (d)

135

1'111'

Surface Treatment Technology

(Z
)

(PPG)

-@
EE-

(PPA)

(PPP)
6 .6 2 . 0( 5) .

PVD PSf
( 100mm

10 mm)1

PPA

PPG

qu

"

'0

.r

..'

H . N
2 J

"

-.

....-.. . .

10

,--=

HN

PPP

HN./\

20
30
Power (W)

40

50

l1

1 18 1 [ "1

(20J ..

. m

6) . 11

~!ll!

FJ!

DNA [1

(21) 0

134

Mangindaan
6

m~

(precursor) l

: (propargylamine)

(allylamine) (propylamine)

iI!

-{

122) [2! 1 "1

) i(261

ISfi -

\00 mTorrfI!

m:~

0-50W

tr

( 22 4

(a) (b)m

20144

(c) (d)

135

"

(2012) 4(9): 1112

M.J .

[9]P. A. Ramires , L. Mirenghi , A.R

Romano , F. Palumbo , G. Nicolardi , J

Biomed Mater Res (2000) 51 :535.

[IO]M. T. Khorasani , H.

Mirzad

S. Irani ,

Chem. Ed. (1977) 15(1):8197.


[2]K. Cai , A. Rechtenbach , J . Hao , J

o. Jandt Biomaterials (2005)

26:5960.

[13 ]1. Shah , J r.

(2008) 112:10915

Polymerizati

Technomic

o.

[2 Z.

Zhang , W. Knoll , R. Frch , Sur f.

Coat. Techno l. (2005) 200:993.


[26]0. Mangindaan , W. H . Kuo , C
C. Chang , S. L.

Boyaci , P. Bilkova,

Slavinska , S. Mutlu , J. Zemek , M

M. J.

Wa

Wa

H. C. Liu ,

Surface Coating and

Technology (2011) 206: 1299

66(4) 352.

[3]S. Wang , J. Li , J. Suo, T. Luo Appl Surf


Sci (2010) 256:2293

[14] C. Eyholzer, N. Bordeanu , F. LopezSuevos ,

[4] 11. Miao , R.C. Pangule, E.E. Paskaleva ,


E. E. Hwang , R.S. Kane , RJ. Linhardt ,

o.

Rentsch , T. Zimmennann ,

K. Oksman , Cellulose (2010) 17:19.


[15]G. Helenius , H. Ba?ckdahl , A. Bodin ,

1. S. Oordick , Biomaterials (201 1)

U. Nannmark , P. Gatenholm , B

3(2):9557.

Risbe

[5] H. Yasuda H, M.

Tylus , Eur. Polym. J. (2002) 38:1937

Jn t. Ed. (1 997) 36:2198

[22)H . Biedennan ,

biology and Biotechnology (2005)

Pozni M. Bryj W.

H. 1. Griesser , 1. Phys. Chem. B

Switzerland , 1996

R!B. Applied !icro-

Gancarz , G.

Hambley, P.J. Saddler, Angew. Chem

Publishing Company, Inc. , Basel ,

(2002) II :355

App l. Polym. Sci. (2001) 81: 134 1.

[24]K. Vasilev, L. Britcher, A. Casanal ,

and Plasma

[12]1. Kim , Y. B.Se , Smart Mater Struct

..,

M. L. H. Green , H.A.O. Hill , T.W.

[21]N. Jnagal Plasma Surface Modifcation

44(22):3358.

Gazic

Biomaterials

(1 982) 3:68
[6]P. Favia , R. d' Agostino , Surf Coat
Technol (1 998) 98: II 02.

J Biomed Mater Res A (2006)

5a!l!

Cellulose (2012) 19(6) 1975.


[17]0. Mangindaan , 1. Yared , H.

Journal of Biomedical Materials

EIsevier Academic Pres s (2004) ,

Research PartA(2012) 100A:3177.

Lannutti , H. M. Powell , Integr Biol

'En

Wa

introduction to materials in medicine.

Lee , M. T. Nelson , R. T. Hart , J . J.

[16]H. Kumiawan , J. T. Lai , M. J.

Kurniawan , J. R. Sheu , M. J. Wang ,

[8]B. N. Blackstone , J . J . Willard , C. H.

76A:43I

[7]B. O. Ratner, Biomaterials science: An

London

136

. ...

...' ....... ,.,

Trchova , J. Klimovic , M. Mutlu , J

[2l.

[20]S.C. Tsang , Z.G. Guo , Y.K. Chen ,

A. Bohn. Angewandte Chemie (2005)

[I]H. Yasuda , T. Hsu , J. Polym. Sci. Polym.

R. E. Smalley,

123:6536.

Radiat Phys Chem (2008) 77: 280.

Bronikowsl

J.M. Tour, J. Am. Chem. Soc. (2001)

[11]0. Klemm , B. Heublein , H. P. Fink ,

Bossert, K.

.,

Surface Treatment Technology

~n
I

[18] W. Huang , S. Taylor, K. Fu , Y. Li n, 0


Zha

T. W. Hanks , A.M.

R Y.

Sun ,

Nano Lett. (2002) 2:311.


[l 9]J. L. Baher, J. Yang , O.V. Kosynkin ,

224

(Universit

du

Maine)

~ m

20144

37

"

(2012) 4(9): 1112

M.J .

[9]P. A. Ramires , L. Mirenghi , A.R

Romano , F. Palumbo , G. Nicolardi , J

Biomed Mater Res (2000) 51 :535.

[IO]M. T. Khorasani , H.

Mirzad

S. Irani ,

Chem. Ed. (1977) 15(1):8197.


[2]K. Cai , A. Rechtenbach , J . Hao , J

o. Jandt Biomaterials (2005)

26:5960.

[13 ]1. Shah , J r.

(2008) 112:10915

Polymerizati

Technomic

o.

[2 Z.

Zhang , W. Knoll , R. Frch , Sur f.

Coat. Techno l. (2005) 200:993.


[26]0. Mangindaan , W. H . Kuo , C
C. Chang , S. L.

Boyaci , P. Bilkova,

Slavinska , S. Mutlu , J. Zemek , M

M. J.

Wa

Wa

H. C. Liu ,

Surface Coating and

Technology (2011) 206: 1299

66(4) 352.

[3]S. Wang , J. Li , J. Suo, T. Luo Appl Surf


Sci (2010) 256:2293

[14] C. Eyholzer, N. Bordeanu , F. LopezSuevos ,

[4] 11. Miao , R.C. Pangule, E.E. Paskaleva ,


E. E. Hwang , R.S. Kane , RJ. Linhardt ,

o.

Rentsch , T. Zimmennann ,

K. Oksman , Cellulose (2010) 17:19.


[15]G. Helenius , H. Ba?ckdahl , A. Bodin ,

1. S. Oordick , Biomaterials (201 1)

U. Nannmark , P. Gatenholm , B

3(2):9557.

Risbe

[5] H. Yasuda H, M.

Tylus , Eur. Polym. J. (2002) 38:1937

Jn t. Ed. (1 997) 36:2198

[22)H . Biedennan ,

biology and Biotechnology (2005)

Pozni M. Bryj W.

H. 1. Griesser , 1. Phys. Chem. B

Switzerland , 1996

R!B. Applied !icro-

Gancarz , G.

Hambley, P.J. Saddler, Angew. Chem

Publishing Company, Inc. , Basel ,

(2002) II :355

App l. Polym. Sci. (2001) 81: 134 1.

[24]K. Vasilev, L. Britcher, A. Casanal ,

and Plasma

[12]1. Kim , Y. B.Se , Smart Mater Struct

..,

M. L. H. Green , H.A.O. Hill , T.W.

[21]N. Jnagal Plasma Surface Modifcation

44(22):3358.

Gazic

Biomaterials

(1 982) 3:68
[6]P. Favia , R. d' Agostino , Surf Coat
Technol (1 998) 98: II 02.

J Biomed Mater Res A (2006)

5a!l!

Cellulose (2012) 19(6) 1975.


[17]0. Mangindaan , 1. Yared , H.

Journal of Biomedical Materials

EIsevier Academic Pres s (2004) ,

Research PartA(2012) 100A:3177.

Lannutti , H. M. Powell , Integr Biol

'En

Wa

introduction to materials in medicine.

Lee , M. T. Nelson , R. T. Hart , J . J.

[16]H. Kumiawan , J. T. Lai , M. J.

Kurniawan , J. R. Sheu , M. J. Wang ,

[8]B. N. Blackstone , J . J . Willard , C. H.

76A:43I

[7]B. O. Ratner, Biomaterials science: An

London

136

. ...

...' ....... ,.,

Trchova , J. Klimovic , M. Mutlu , J

[2l.

[20]S.C. Tsang , Z.G. Guo , Y.K. Chen ,

A. Bohn. Angewandte Chemie (2005)

[I]H. Yasuda , T. Hsu , J. Polym. Sci. Polym.

R. E. Smalley,

123:6536.

Radiat Phys Chem (2008) 77: 280.

Bronikowsl

J.M. Tour, J. Am. Chem. Soc. (2001)

[11]0. Klemm , B. Heublein , H. P. Fink ,

Bossert, K.

.,

Surface Treatment Technology

~n
I

[18] W. Huang , S. Taylor, K. Fu , Y. Li n, 0


Zha

T. W. Hanks , A.M.

R Y.

Sun ,

Nano Lett. (2002) 2:311.


[l 9]J. L. Baher, J. Yang , O.V. Kosynkin ,

224

(Universit

du

Maine)

~ m

20144

37

R115'f\ 'U lII l:dR.1 X

2014

(|4| |

Heat Exchan

(shell tube heat exchanger)


(1)

E
llS

(plate heat

exchanger, PHE) 2

Jl I 7 1

1923

fl!

(corrugation)

GC-26 SW26 N Tl O'

0.8671 m' , 0.6721 m .6801 NTIO

N Tl O

GC26 67 % ' SW26 25% '

'NTIO GC26 2% SW26

4% 'NTIOE SW{

GC26

(1)

Jl W'

i'l

(2):

138

1j 224

10-25

20144

JII 7 1

39

R115'f\ 'U lII l:dR.1 X

2014

(|4| |

Heat Exchan

(shell tube heat exchanger)


(1)

E
llS

(plate heat

exchanger, PHE) 2

Jl I 7 1

1923

fl!

(corrugation)

GC-26 SW26 N Tl O'

0.8671 m' , 0.6721 m .6801 NTIO

N Tl O

GC26 67 % ' SW26 25% '

'NTIO GC26 2% SW26

4% 'NTIOE SW{

GC26

(1)

Jl W'

i'l

(2):

138

1j 224

10-25

20144

JII 7 1

39

2014

1 4| 1

Special Planning

Heat

_~.WJmlliil

(3):

- 1 /3

1923 Mr.Seligman

1/4-1 15

1930

0.93 ' 10C

0.5 ' 5 0 C

(6)

1m

100

Il< shan and

(a)

(b)

(c)

(e)

(d)

(Shan

and

"

(5): (effectiveness e)

IEI.

Fke"')

WJ

Focke (1)

200 (shear

layer)

: (a)

200 5(a)

(washboard) ; (b)Z (zig-zag) ; (c)

(chevron or herringbone) ; (d)

(protrusions and depressions) ;

(e) (washboard wilh

"

fn {

second corrugation)

1m

{1 "

(oblique washboard)( 4)

Shan and Focke

5(b) e

Focke Knibble l1

10 -800

uXsin2

Focl

ill

u xcos2

1886 1886 Mr. Mal vazin

tJ

=80 0 90 0 Focke Knibbe

(I)=90 0 20

=80 0

PH lm

J!n -

14

~ .

(4):

Exchangers

I 22 4

20144

(2)= 45 o J!n 30 72

141

2014

1 4| 1

Special Planning

Heat

_~.WJmlliil

(3):

- 1 /3

1923 Mr.Seligman

1/4-1 15

1930

0.93 ' 10C

0.5 ' 5 0 C

(6)

1m

100

Il< shan and

(a)

(b)

(c)

(e)

(d)

(Shan

and

"

(5): (effectiveness e)

IEI.

Fke"')

WJ

Focke (1)

200 (shear

layer)

: (a)

200 5(a)

(washboard) ; (b)Z (zig-zag) ; (c)

(chevron or herringbone) ; (d)

(protrusions and depressions) ;

(e) (washboard wilh

"

fn {

second corrugation)

1m

{1 "

(oblique washboard)( 4)

Shan and Focke

5(b) e

Focke Knibble l1

10 -800

uXsin2

Focl

ill

u xcos2

1886 1886 Mr. Mal vazin

tJ

=80 0 90 0 Focke Knibbe

(I)=90 0 20

=80 0

PH lm

J!n -

14

~ .

(4):

Exchangers

I 22 4

20144

(2)= 45 o J!n 30 72

141

2014

14 | h
Heat Exchangers

Special Planning
-~'~"jl

30400 Muley

(a)

Nu

= 1.6774 ();()O.SPTl () 0.144

30 0

< < 60 , 30 ::; Re ::; 400

f=

[(~5+(

(3)

1
7

(4)

30 0

(c)

(b)

<< 60 2 Re 300
0

(a)=90 (b)=45 (c )=800 (Focke 12l)

(3)= tz

0.0003625m2

5(c)

259

(Pr)

1880

Osbom Reynolds l4J

(Reynolds Number) :

Re

Ls

=-=-

(l )

Wang l 'l

142

Nu

= 0.00))
Mul ey l 6 J

8
t

.6

SOLIDWORKS

W th

Length

ThJckne..

Are e

(m)

()

(m)

(m' )

GC-26

375

779

0.008

0.8671

33

0.4 02

802

0.008

0.6808

64'

356

719

0.006

6721

61

FLOW SIMULATION '

i 0.045m'

400 i 130IJ290

NT-l0

2.5mm'

SW-26

22 4

20144

Re 1200-3700

143

2014

14 | h
Heat Exchangers

Special Planning
-~'~"jl

30400 Muley

(a)

Nu

= 1.6774 ();()O.SPTl () 0.144

30 0

< < 60 , 30 ::; Re ::; 400

f=

[(~5+(

(3)

1
7

(4)

30 0

(c)

(b)

<< 60 2 Re 300
0

(a)=90 (b)=45 (c )=800 (Focke 12l)

(3)= tz

0.0003625m2

5(c)

259

(Pr)

1880

Osbom Reynolds l4J

(Reynolds Number) :

Re

Ls

=-=-

(l )

Wang l 'l

142

Nu

= 0.00))
Mul ey l 6 J

8
t

.6

SOLIDWORKS

W th

Length

ThJckne..

Are e

(m)

()

(m)

(m' )

GC-26

375

779

0.008

0.8671

33

0.4 02

802

0.008

0.6808

64'

356

719

0.006

6721

61

FLOW SIMULATION '

i 0.045m'

400 i 130IJ290

NT-l0

2.5mm'

SW-26

22 4

20144

Re 1200-3700

143

mwE

14||
Heat Exchangers i

10

.7

50 0 C'
!IlI

20 0 C .

48

0.10

47

0.09

46

0.08

25 0 C

2
-

-+-

hot channel temperature


channel velocity

cold

.......

45

0.07 ~

44

k-:

Dk

P Dt

fr

Gk

Gb -

P-

(5)

D
rl
t\ 12
p = 11+ l 1+ C (G k + C3E Gb ) - C2E P7
Dt x; L\'k' x;J

M '1:

(6)

43

0.05

42
-0.15

G ;

plate right side

k ;

0.06

()

u kl

= x;l~+ ) xJ +

plate left side

224

plate center

0.04
-0.10

-0.05

0.00

0.05

0.10

0.15

20

0.25

plate position
10

20144

145

mwE

14||
Heat Exchangers i

10

.7

50 0 C'
!IlI

20 0 C .

48

0.10

47

0.09

46

0.08

25 0 C

2
-

-+-

hot channel temperature


channel velocity

cold

.......

45

0.07 ~

44

k-:

Dk

P Dt

fr

Gk

Gb -

P-

(5)

D
rl
t\ 12
p = 11+ l 1+ C (G k + C3E Gb ) - C2E P7
Dt x; L\'k' x;J

M '1:

(6)

43

0.05

42
-0.15

G ;

plate right side

k ;

0.06

()

u kl

= x;l~+ ) xJ +

plate left side

224

plate center

0.04
-0.10

-0.05

0.00

0.05

0.10

0.15

20

0.25

plate position
10

20144

145

2014

14 | h

Special Planning

Heat Exchangers

-~l

16

4500

_Re=1203

4 0

350

1 1

.c

2000

NT10>SW26>GC26 .

Re=1846

- . . . . - Re=2421
Re=3046
- Re=3727

N Tl O

- -

--.

SW26 NTl O

250

('

1500

1 00

SW26 GC26

500

11

12

40

50

?rate Position (mm)

GC26

()
5000

13-15

~-Re=1977

\TK

A
fe
tA\i\ FZAFFZ
\ ~\yv
T

12

3-D

1 00

(FE~EE

3 0

1000

50

1000

13

(2)

2
30
10
Plate Position (mm)

WC
SG

4 nuD

2000

I 1000

(1) SW26GC

N T1 0

2000

mDOJ

3000

M/

6000

4000

FT JZY

SW26

6830AVJJO

-zvo
/

EZ
E
hE 5000

15

wmm rdUJ

6000

+44//h/

I 7000

-Re=1094

10

J
RJ
n
nRFVT

8000

-thnw

20
30
40
Plate Position (mm)

146

'W\-~-Re=2379

32

-Re=1034
0
Re=1551

-.......-Re=1725

4000
(XNE~EE

()

.{g GC26

14

16

NT1 0

224

20144

..

1500 2000 2500 3000


Re

35 o

4000

(3)

147

2014

14 | h

Special Planning

Heat Exchangers

-~l

16

4500

_Re=1203

4 0

350

1 1

.c

2000

NT10>SW26>GC26 .

Re=1846

- . . . . - Re=2421
Re=3046
- Re=3727

N Tl O

- -

--.

SW26 NTl O

250

('

1500

1 00

SW26 GC26

500

11

12

40

50

?rate Position (mm)

GC26

()
5000

13-15

~-Re=1977

\TK

A
fe
tA\i\ FZAFFZ
\ ~\yv
T

12

3-D

1 00

(FE~EE

3 0

1000

50

1000

13

(2)

2
30
10
Plate Position (mm)

WC
SG

4 nuD

2000

I 1000

(1) SW26GC

N T1 0

2000

mDOJ

3000

M/

6000

4000

FT JZY

SW26

6830AVJJO

-zvo
/

EZ
E
hE 5000

15

wmm rdUJ

6000

+44//h/

I 7000

-Re=1094

10

J
RJ
n
nRFVT

8000

-thnw

20
30
40
Plate Position (mm)

146

'W\-~-Re=2379

32

-Re=1034
0
Re=1551

-.......-Re=1725

4000
(XNE~EE

()

.{g GC26

14

16

NT1 0

224

20144

..

1500 2000 2500 3000


Re

35 o

4000

(3)

147

2014

14 | |

Special Planning

Heat

-~.Ell.iiJl

Exchangers

Heat Transfer Equipment

transfer and pressure drop in p1ate

Design , edited by P.K.

condensers", Heat Transfer Engineering ,

Shan , E.C.Subbarao and

14(4): 32-41

R.A.

Mashe1kar , pp. 227-

[6]Mu1ey, A. and Manglik , R. M. , February

254 , Hemisphere Pub1ishing

1999 , "Experimenta1 Study ofTurbu1ent

Corp. ,Washington , DC.

Flow Heat Transfer and Pressure Drop

[2]Focke ,

W. Zacharirad

Transactions of the ASME , 121: II 0-

50

Ang1e on the Thermal-Hydraulic

117

12
r J

10:53-77 ' 2001

28:1469-1479
[3]Focke , W. W. and Knibbe , P

12

[7]

of Hear and Mass Transfer ,

U: W/m2K

12

of the Corrugation Inclination

Exchanger" , Intemational Jouma1

'kW

28

in a P1ate Heat Exchanger with Chevron

12

Pr:

11

P1ates" , Journa1 of Heat Transfer ,

Performance of Plate Heat

m'

21

and Olivier, 1., 1985 , "The Effects

Nu:

A: {

- RUW

12
6

13

G. , 1986 , "Flow Visualization

51

Qc kW

in Parallel-Plate Ducts With

12

[3:

Corrugated Walls" , Journa1 of

52

kglm's

Fluid Mechanics , 165:77-73.


[4]Reyno1ds , 0. , 188 "On

i5 : 'm

the Investigation of the

'Jf

Circumstances Which Determine

kglm's

kglm's

Whether the Motion of Water

p: kg/m'

Shall Be Direct or Sinuous ,

<5

and the Law of Resistance in

Parallel Channels" , Philosophical

Transactions of the Royal Society

ofLondon 174:935-82.

[5]Wan

Z. Z. and Zhao , Z.

12
9
12
12
51
12
12
ENR.Engineering News Record

52

12
12

[1]Shah , R.K. and Forcke W.\\ 1988 "Plate

1993 , "Analysis ofperformances

heat exchanger and their design theory" ,

of steam condensation heat

224

-n -u -m -n -m u -m

Qh: 'kW

148

(4)

20144

149

2014

14 | |

Special Planning

Heat

-~.Ell.iiJl

Exchangers

Heat Transfer Equipment

transfer and pressure drop in p1ate

Design , edited by P.K.

condensers", Heat Transfer Engineering ,

Shan , E.C.Subbarao and

14(4): 32-41

R.A.

Mashe1kar , pp. 227-

[6]Mu1ey, A. and Manglik , R. M. , February

254 , Hemisphere Pub1ishing

1999 , "Experimenta1 Study ofTurbu1ent

Corp. ,Washington , DC.

Flow Heat Transfer and Pressure Drop

[2]Focke ,

W. Zacharirad

Transactions of the ASME , 121: II 0-

50

Ang1e on the Thermal-Hydraulic

117

12
r J

10:53-77 ' 2001

28:1469-1479
[3]Focke , W. W. and Knibbe , P

12

[7]

of Hear and Mass Transfer ,

U: W/m2K

12

of the Corrugation Inclination

Exchanger" , Intemational Jouma1

'kW

28

in a P1ate Heat Exchanger with Chevron

12

Pr:

11

P1ates" , Journa1 of Heat Transfer ,

Performance of Plate Heat

m'

21

and Olivier, 1., 1985 , "The Effects

Nu:

A: {

- RUW

12
6

13

G. , 1986 , "Flow Visualization

51

Qc kW

in Parallel-Plate Ducts With

12

[3:

Corrugated Walls" , Journa1 of

52

kglm's

Fluid Mechanics , 165:77-73.


[4]Reyno1ds , 0. , 188 "On

i5 : 'm

the Investigation of the

'Jf

Circumstances Which Determine

kglm's

kglm's

Whether the Motion of Water

p: kg/m'

Shall Be Direct or Sinuous ,

<5

and the Law of Resistance in

Parallel Channels" , Philosophical

Transactions of the Royal Society

ofLondon 174:935-82.

[5]Wan

Z. Z. and Zhao , Z.

12
9
12
12
51
12
12
ENR.Engineering News Record

52

12
12

[1]Shah , R.K. and Forcke W.\\ 1988 "Plate

1993 , "Analysis ofperformances

heat exchanger and their design theory" ,

of steam condensation heat

224

-n -u -m -n -m u -m

Qh: 'kW

148

(4)

20144

149

2014

14 | |

Special Planning

Heat

-~.Ell.iiJl

Exchangers

Heat Transfer Equipment

transfer and pressure drop in p1ate

Design , edited by P.K.

condensers", Heat Transfer Engineering ,

Shan , E.C.Subbarao and

14(4): 32-41

R.A.

Mashe1kar , pp. 227-

[6]Mu1ey, A. and Manglik , R. M. , February

254 , Hemisphere Pub1ishing

1999 , "Experimenta1 Study ofTurbu1ent

Corp. ,Washington , DC.

Flow Heat Transfer and Pressure Drop

[2]Focke ,

W. Zacharirad

Transactions of the ASME , 121: II 0-

50

Ang1e on the Thermal-Hydraulic

117

12
r J

10:53-77 ' 2001

28:1469-1479
[3]Focke , W. W. and Knibbe , P

12

[7]

of Hear and Mass Transfer ,

U: W/m2K

12

of the Corrugation Inclination

Exchanger" , Intemational Jouma1

'kW

28

in a P1ate Heat Exchanger with Chevron

12

Pr:

11

P1ates" , Journa1 of Heat Transfer ,

Performance of Plate Heat

m'

21

and Olivier, 1., 1985 , "The Effects

Nu:

A: {

- RUW

12
6

13

G. , 1986 , "Flow Visualization

51

Qc kW

in Parallel-Plate Ducts With

12

[3:

Corrugated Walls" , Journa1 of

52

kglm's

Fluid Mechanics , 165:77-73.


[4]Reyno1ds , 0. , 188 "On

i5 : 'm

the Investigation of the

'Jf

Circumstances Which Determine

kglm's

kglm's

Whether the Motion of Water

p: kg/m'

Shall Be Direct or Sinuous ,

<5

and the Law of Resistance in

Parallel Channels" , Philosophical

Transactions of the Royal Society

ofLondon 174:935-82.

[5]Wan

Z. Z. and Zhao , Z.

12
9
12
12
51
12
12
ENR.Engineering News Record

52

12
12

[1]Shah , R.K. and Forcke W.\\ 1988 "Plate

1993 , "Analysis ofperformances

heat exchanger and their design theory" ,

of steam condensation heat

224

-n -u -m -n -m u -m

Qh: 'kW

148

(4)

20144

149

'-

~t*

(PEMFC)

-ft69

1 [1)

1 [IJ

PEMFC

R11!21iH

(AFC)

(DMF C) (PAFC)

(MCF C)

(1)

|l

OFC)

(Membrane

(2):

: (Mesoporous silica) p

El ectrode Assembly, MEA)(

(3)

(3-Aminopropyltrimethoxysilane APTMS)

Imm)

nano-

(4);

paicle) (Microwave reduction method)

(5);

(6)

(Chelating agent) (Pl

APTMS

XRD FTIR ICP HRTEM


i{

(1 );

(2)

O.6lnm PtPt

(3)

(4)
(5)

(6)

(0)

22 4

Ledje 1 93

20144

1'1

'-

~t*

(PEMFC)

-ft69

1 [1)

1 [IJ

PEMFC

R11!21iH

(AFC)

(DMF C) (PAFC)

(MCF C)

(1)

|l

OFC)

(Membrane

(2):

: (Mesoporous silica) p

El ectrode Assembly, MEA)(

(3)

(3-Aminopropyltrimethoxysilane APTMS)

Imm)

nano-

(4);

paicle) (Microwave reduction method)

(5);

(6)

(Chelating agent) (Pl

APTMS

XRD FTIR ICP HRTEM


i{

(1 );

(2)

O.6lnm PtPt

(3)

(4)
(5)

(6)

(0)

22 4

Ledje 1 93

20144

1'1

| J! | 1....

'~~...-

.................Qa

. co&11:;'811 1

~1

Reaotlon

Th9Qf. 1I!Cel I

H (K1 ')

mol") . G {1 mOl")

.1.

C .;. ;;O~ co
2

'

CO .. i O'l
3
2

CH + ~Ol
CH~O + 0

-t

C91

- . CO;J '"'" 2H~O

,-+ CO~ + HrO

HCO joz +H.

-21 4

+21 .4

32.61

0.71

7 .62

20 . 1

';;1 .4 5

1.33

-173.8

.23.5

11 B

1.2 1

-134.28

.32 .1

.12 7.7

1.3~

- 62

-64.66

1 1. 8

PEMFC ( 2)[2 1 :

PEM

; 3 MEA

:H2 2W + 2e- EO ~ O.OOV

+ 2W + 2e

H O EO = 1. 23V

, ,o E",, = 1. 23V

H + 1/20

"

: 112 0

f PE
rpc}
EH
ed
L-

H OM +

FLV

LE

1.23

56.69

..;;..

-39.0

MEA : Me mbranE c trod e...anbly

';;6.14

S ' (Kcal

", -+0 , - t H, O (Hq}

[3 [

"

Cala!~~t

Y'"

Gas d iff y.r


(C n clol:h ar p r)

M .;l m lt.t tt

MEA

MEA

PEMFC (Polymer

t t. i iiJ jf(

Exchange Membrane , PEM)

Phosphorlc Acid and


PEM Fue[ Cells

Electron Flow

(Pt)

--O-~

NFM

. 2

J..
j

1 5.2

~......-.. ..-..

(PEMFC) .'21

22 4

20 ml (PI23) 400

ml . 66.8 m137% 15 ml

[4.

TEOS 3l lJ50 C

24;] 1000C 24

-SiOH

(0.3g)

. f [9

500 mg APTMS

2014 4

153

| J! | 1....

'~~...-

.................Qa

. co&11:;'811 1

~1

Reaotlon

Th9Qf. 1I!Cel I

H (K1 ')

mol") . G {1 mOl")

.1.

C .;. ;;O~ co
2

'

CO .. i O'l
3
2

CH + ~Ol
CH~O + 0

-t

C91

- . CO;J '"'" 2H~O

,-+ CO~ + HrO

HCO joz +H.

-21 4

+21 .4

32.61

0.71

7 .62

20 . 1

';;1 .4 5

1.33

-173.8

.23.5

11 B

1.2 1

-134.28

.32 .1

.12 7.7

1.3~

- 62

-64.66

1 1. 8

PEMFC ( 2)[2 1 :

PEM

; 3 MEA

:H2 2W + 2e- EO ~ O.OOV

+ 2W + 2e

H O EO = 1. 23V

, ,o E",, = 1. 23V

H + 1/20

"

: 112 0

f PE
rpc}
EH
ed
L-

H OM +

FLV

LE

1.23

56.69

..;;..

-39.0

MEA : Me mbranE c trod e...anbly

';;6.14

S ' (Kcal

", -+0 , - t H, O (Hq}

[3 [

"

Cala!~~t

Y'"

Gas d iff y.r


(C n clol:h ar p r)

M .;l m lt.t tt

MEA

MEA

PEMFC (Polymer

t t. i iiJ jf(

Exchange Membrane , PEM)

Phosphorlc Acid and


PEM Fue[ Cells

Electron Flow

(Pt)

--O-~

NFM

. 2

J..
j

1 5.2

~......-.. ..-..

(PEMFC) .'21

22 4

20 ml (PI23) 400

ml . 66.8 m137% 15 ml

[4.

TEOS 3l lJ50 C

24;] 1000C 24

-SiOH

(0.3g)

. f [9

500 mg APTMS

2014 4

153

-4Ithnology

| | |

2 MPS

100T 24

'M

57 1. 83 1 6.66 nm 'L

i 0.93 cm 3 /g

(O .3 g) 10wt% Pt 5.93

(NIIO-MPS) i 57 1. 83

ml

m'/g 186.60 m'/g ; 0.93

; 50 ml 5

ml

cm 3 /g 0.37 cm 3 /g

24 /J

APTMS /

MPS

m 100.C

24/J

jj

17001600150014001300120011001000 900

N.H

8003400335033 0325032003100

C.H

i\~
Nll0-MPS :

300

29 o

28

HRFTIR

252.00 m'/g0 .44cm

1400 cm-

6.55 nm 5.94nm;

2900- 3000 cm- I 3200-3350 cm- I

1082 cm- I Si-O

3200-3400 cm- I N-HWVJ

2 Pt -NllO-MPS ICP

1400 cm- I

Pt-NIIO-MPS Pt

1455

2.02 wt% Pt

1550-1650 cmC-N ;

Pr"

(3)

2900-3000 cm- I C-H

Pt O

3200-3350 cm- I N-H

HRFTIR

[ 11-1 Si-O MPS

N-H

C-H

N-H C-N

APTMS

= HRFTIR

1082 cm- I

APTMS MPS

C-H C-N

4 MPS HRFTIR
ICP.i!I~Pt

MN

OO

2.023

Conc. 01 Pt (wt%)

nv

||

Sample

(1

Sample

154

Si.OH

(ESZE
E
CE

(3-Aminopropyltrimethoxysilane) 24

BETsu area

Pore BJH size (nm)

(m'/g)

MPS

571.83

6.66

Nll0-MPS

18 6.6

6.55

Pt-Nll0-MPS

252.0

5.94

1455 cm- I 1550-1650 cm- I

cm- I C-H ;

'

1550-1650 cm- I C-N

5 HRFTIR

APTMS

Pore volume (cm )

APTMS

93

1082 cm- I S

0.37

1400 cm- I 1455 cm C-H

0 .4 4

l 2900-3000 cm C-H

224

20144

155

-4Ithnology

| | |

2 MPS

100T 24

'M

57 1. 83 1 6.66 nm 'L

i 0.93 cm 3 /g

(O .3 g) 10wt% Pt 5.93

(NIIO-MPS) i 57 1. 83

ml

m'/g 186.60 m'/g ; 0.93

; 50 ml 5

ml

cm 3 /g 0.37 cm 3 /g

24 /J

APTMS /

MPS

m 100.C

24/J

jj

17001600150014001300120011001000 900

N.H

8003400335033 0325032003100

C.H

i\~
Nll0-MPS :

300

29 o

28

HRFTIR

252.00 m'/g0 .44cm

1400 cm-

6.55 nm 5.94nm;

2900- 3000 cm- I 3200-3350 cm- I

1082 cm- I Si-O

3200-3400 cm- I N-HWVJ

2 Pt -NllO-MPS ICP

1400 cm- I

Pt-NIIO-MPS Pt

1455

2.02 wt% Pt

1550-1650 cmC-N ;

Pr"

(3)

2900-3000 cm- I C-H

Pt O

3200-3350 cm- I N-H

HRFTIR

[ 11-1 Si-O MPS

N-H

C-H

N-H C-N

APTMS

= HRFTIR

1082 cm- I

APTMS MPS

C-H C-N

4 MPS HRFTIR
ICP.i!I~Pt

MN

OO

2.023

Conc. 01 Pt (wt%)

nv

||

Sample

(1

Sample

154

Si.OH

(ESZE
E
CE

(3-Aminopropyltrimethoxysilane) 24

BETsu area

Pore BJH size (nm)

(m'/g)

MPS

571.83

6.66

Nll0-MPS

18 6.6

6.55

Pt-Nll0-MPS

252.0

5.94

1455 cm- I 1550-1650 cm- I

cm- I C-H ;

'

1550-1650 cm- I C-N

5 HRFTIR

APTMS

Pore volume (cm )

APTMS

93

1082 cm- I S

0.37

1400 cm- I 1455 cm C-H

0 .4 4

l 2900-3000 cm C-H

224

20144

155

_..........._......." .................'.." .anotechnOIOgy

| | |

H 2

9- H
nu M

CG

(ESz EEE

--

MN

i
~

Em)CE
tE
E

(EZz
E
EELF

D't

C.H

1700 1600 1500 140 1300 1200 1100 1000 900 800 3400
3300
32 o
Wave num r(cm-')
Wave number(cm
Wave number(cm-')
o

')

3000 2900 2800


Wave number(cm-')

31 o

~h4

20
5

30

HRFTIR
7

50
60
2 theta(deg e)

70

PIXRD

(a)

(b)

PI

(a)

PNll0.MPS HRTEM: (a) 29KX(b)Dll 97KX

(b)

;;

400

MPS 8(b)

~{

M i?

XRDIJ

8 9 Pt-N 11 O-MPS

9(a) Pt-N110-MPS HRTEM

2 9 9.728.5

285KX MPS

Welgh

(K)

45 65

Si(K)
Pt(L)

37.589
17.345

4.

Pt

MPS

Pt

EC3U

HRTEM 8(a)

qJW

7M Pt-N 11 O-MPSXRD

Elemenl

20144

'

20
Energy(keV)

30

40

Pt-Nll0-MPS HRTEM: (a)285KX (b)EDX

157

_..........._......." .................'.." .anotechnOIOgy

| | |

H 2

9- H
nu M

CG

(ESz EEE

--

MN

i
~

Em)CE
tE
E

(EZz
E
EELF

D't

C.H

1700 1600 1500 140 1300 1200 1100 1000 900 800 3400
3300
32 o
Wave num r(cm-')
Wave number(cm
Wave number(cm-')
o

')

3000 2900 2800


Wave number(cm-')

31 o

~h4

20
5

30

HRFTIR
7

50
60
2 theta(deg e)

70

PIXRD

(a)

(b)

PI

(a)

PNll0.MPS HRTEM: (a) 29KX(b)Dll 97KX

(b)

;;

400

MPS 8(b)

~{

M i?

XRDIJ

8 9 Pt-N 11 O-MPS

9(a) Pt-N110-MPS HRTEM

2 9 9.728.5

285KX MPS

Welgh

(K)

45 65

Si(K)
Pt(L)

37.589
17.345

4.

Pt

MPS

Pt

EC3U

HRTEM 8(a)

qJW

7M Pt-N 11 O-MPSXRD

Elemenl

20144

'

20
Energy(keV)

30

40

Pt-Nll0-MPS HRTEM: (a)285KX (b)EDX

157

| | |

6.5 nm'

Ouiantikov 9(a)

0.61

MPS 9(b)

0 .4-0.85 nm

EDX

0.61 nm

Pt

area

diffraction)

10(a)Pt-NIIO-M

measurement XRD ICP HRFTIR

HRTEM

A Molecular DYl1 amics Stlldy , J. Phys

[14]

Chem. B, 106, 2002.

ilf

m (PEMFC)

(1)

lYI ' 2004

Pt 10(b) Optimas []

Pt

215

[2]

(4
0
EZE

64

'

259 '

SY l1 thesis a l1 d charac1erizatio l1 01 Ni-

slabili

Inorganic Materials , 43 , 2007.

[9]A. Ohosh , R.P.

Chit

P. Mukherjee ,

al1 d stabilizatio l1 01 gold l1 a l1 oparticles

mesoporous silica: Effect 01 pore size

lormed by i l1 si1u redllc1io l1 01

captll

Chemical

aqueous chloroaurate

;O I1 S

v!/ thin

Engineering Journal , 144(2): pp.336-

slllface-modijled mesoporolls silica ,

342 , 2008.

Microporous and Mesoporous Materials,


l1

ew lam 01

mesoporolls moleclllar sieves prepared

58(3), pp. 201-211 , 2003


[10]D. Liu , J.H. Lei , L.P. Ouo , X.D.

nu

db

5
" e

0 ?'ku
om
mmM
}
l
)OO
e
(
ic
i
t

nuMN
!a

Rd

nUA

4 nu

>

unU

AU

85

with liqllid c/ys1al templa1es , J. Am

Du and K.

Chem. Soc. , 114 , 1992.

I lII1c1io l1alized mesoporous silica

[5] D. Zhao , J. Feng, Q. Huo , N. Melosh ,


O.H. Fredrickson , B.F.

Chmell

and

(a)

158

[8]T. S. Jiang , Q. ZHao and H. B. Yin ,

M. Sastry and R. Kumar, Preparatio l1

[4]J. S. Beck ct a l., A

10

J. Phys. Chem. B, 109 , 2005

[3]V. Zelenk et al , Amil1 e-modified orded

011 carbo l1 dioxide

High F/ mework Del1si

mesoporous moleclllar sieves with high

2008

0.61 .o .01nm

01 MCM-22 Zeoli1e

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[6]0. Sastre , C.R.A. Catlow and A

il1 1he

: Pt( 111 ) (200) (222)

10

science, 279, 1998

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[14]

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Chit

P. Mukherjee ,

al1 d stabilizatio l1 01 gold l1 a l1 oparticles

mesoporous silica: Effect 01 pore size

lormed by i l1 si1u redllc1io l1 01

captll

Chemical

aqueous chloroaurate

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v!/ thin

Engineering Journal , 144(2): pp.336-

slllface-modijled mesoporolls silica ,

342 , 2008.

Microporous and Mesoporous Materials,


l1

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mesoporolls moleclllar sieves prepared

58(3), pp. 201-211 , 2003


[10]D. Liu , J.H. Lei , L.P. Ouo , X.D.

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I lII1c1io l1alized mesoporous silica

[5] D. Zhao , J. Feng, Q. Huo , N. Melosh ,


O.H. Fredrickson , B.F.

Chmell

and

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J. Phys. Chem. B, 109 , 2005

[3]V. Zelenk et al , Amil1 e-modified orded

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mesoporous moleclllar sieves with high

2008

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PI

[6]0. Sastre , C.R.A. Catlow and A

il1 1he

: Pt( 111 ) (200) (222)

10

science, 279, 1998

Pt i

adsorption/desorption

(spot)

Periodic 50 10 300 A I1 gs1rom Pores. ,

Corma, 1l1jluel1 ce ollhe 1111ermolecular

(2)

Pt-NllO-MPS Si 0 Pt

(selected

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224

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macrostrllctllre by trlle liqllid c/ystal


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r0 1l

Microporous and

O.D. Stucky , Triblock Copolyme/

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Sy l1 theses 01 Mesoporolls Silica with

67-74, 2009.

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[13]S. W. Song, K. Hidajat and S. Kawi ,

F lIl1 ctio l1 alized SBA-15 Materials

C rriers

Properties

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011

Matrix-Drllg Inter-

actio l1s , Langmuir, 21 , 2006


L

S.

C. H.

Huan

C.K. Huang ,

Hwang , Chelati l1 g age l1 t

assisted

4.

microw ve

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IC 111- V

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Comm., 200911 (2009) 1792-1795.

sY l1 thesis of

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w 1

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ZOUct ofsYl1this

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order of mesopo /"OlI S silica SBA-15


fll l1 ctio l1 alized by ami l1 0

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[13]S. W. Song, K. Hidajat and S. Kawi ,

F lIl1 ctio l1 alized SBA-15 Materials

C rriers

Properties

for CO l1 trolled Drllg

011

Matrix-Drllg Inter-

actio l1s , Langmuir, 21 , 2006


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S.

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Huan

C.K. Huang ,

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assisted

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)

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elect/'olyte fllel cells, E1ectrochem ,
Comm., 200911 (2009) 1792-1795.

sY l1 thesis of

carbo l1 sllpported Pt l1 a l1 oparticles

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Emall:hwamaw@m88.hlne t. net
Website:http://www.hwamaw.com.tw

320 31 6 !1l

FAX:886-4-26936222

1IIIIIIII.
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SAINT-GOBAIN

44

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.~'"Et. 1z..e;-....

H.'cell ('.276

Viton(FKM)

KAORI HEAT TREATMENT CO. , LTD


5.2

: 23
03-452.7005 852. 233
03-4 53.5021 1_ 03-453.5931
E-rnail : jim-tsai@kaori m.tw. afra@ m. 1w

www.kaor i. com.lw

8996

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ATOMIZER PUL ERIZER I

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www.mll m

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B~1I!1II1/!i!!i7

SHENZHEN XIEHONG MACHINE CO. , LTD


TEL:+8B6-2-2988-2475
FAX:+B86-2-2984-5891
E-mail: shehui99@ms32.hinet.net
TEL:+86-755-28073275-6
FAX:+86-755-28073277
E-mail:xiehongzh@mill-machine.ne t. cn

37 14

SHE HUI MACHINERY CO. , LTD

powder hand 1i ng

* p

established in 1982

powder handling

HORIBA PRECISA

a c h i n e. n et. c n

SHE HUI MACHINERY CO. , LTD.


SHENZHEN XIEHONG MACHINE CO. , LTD.
FAX:+886-2-2984-5891
TEL:+886-2-2968-2475
E-mail: shehui99@rn532.hinet.net
TEL:+86-755.2807327S....6
FAX:+86-755-2B073277
E_mail:xiehongzh@mill_machine.ne t. cn

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www.mll m

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B~1I!1II1/!i!!i7

SHENZHEN XIEHONG MACHINE CO. , LTD


TEL:+8B6-2-2988-2475
FAX:+B86-2-2984-5891
E-mail: shehui99@ms32.hinet.net
TEL:+86-755-28073275-6
FAX:+86-755-28073277
E-mail:xiehongzh@mill-machine.ne t. cn

37 14

SHE HUI MACHINERY CO. , LTD

powder hand 1i ng

* p

established in 1982

powder handling

HORIBA PRECISA

a c h i n e. n et. c n

SHE HUI MACHINERY CO. , LTD.


SHENZHEN XIEHONG MACHINE CO. , LTD.
FAX:+886-2-2984-5891
TEL:+886-2-2968-2475
E-mail: shehui99@rn532.hinet.net
TEL:+86-755.2807327S....6
FAX:+86-755-2B073277
E_mail:xiehongzh@mill_machine.ne t. cn

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13200 l 13900

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38 17 1

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100 CGMP() CIP SIP Jj K

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. 242 389 46

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SHANG YUH MACHINE CO. , LTD.

:244 14
lIt: (886-2)8601 - 4966 ()
: (886-2)8601-2866

COMPANY : NO.46 , LN .389 , HUACHENG RD.. XINZHUANG DIST.,


NEW TAIPEI CITY 242 , TAIWAN
FACTORY : NO. 14 , GONG 8th RD.. GONG 2 INDUSTRIAL DIS T.,
lI NKOU D IST, NEW TAIPEI CITY 244 , TAtWAN
TEL : (886-2)8601-4966 (REP.) FAX : (886-2)8601-2866

http://www.sha ng-yuh.com

E-mail: shang-yuh@shang-yuh_com

DAMNGHEATTEE-MACHINEKYE0., LTD IlIN


227 24 9 1

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:244 14
lIt: (886-2)8601 - 4966 ()
: (886-2)8601-2866

COMPANY : NO.46 , LN .389 , HUACHENG RD.. XINZHUANG DIST.,


NEW TAIPEI CITY 242 , TAIWAN
FACTORY : NO. 14 , GONG 8th RD.. GONG 2 INDUSTRIAL DIS T.,
lI NKOU D IST, NEW TAIPEI CITY 244 , TAtWAN
TEL : (886-2)8601-4966 (REP.) FAX : (886-2)8601-2866

http://www.sha ng-yuh.com

E-mail: shang-yuh@shang-yuh_com

DAMNGHEATTEE-MACHINEKYE0., LTD IlIN


227 24 9 1

TEL 863 666

Z:99

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"'" www.mmmpc.com .tw . TEL : 02-8712-5539 (686 688)

BUTK

Br-E--

..11

BLOTEK ELECTRIC MACHINERY CO. ,LTD

111 53 8 49 1

49. LANE 8. TIEN-MOU E. RD.. TAIPEI. TAIWAN. 11153


TEL: (02)2873-4729 Rep. FAX:(02)2875-1068
11

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"'" www.mmmpc.com .tw . TEL : 02-8712-5539 (686 688)

BUTK

Br-E--

..11

BLOTEK ELECTRIC MACHINERY CO. ,LTD

111 53 8 49 1

49. LANE 8. TIEN-MOU E. RD.. TAIPEI. TAIWAN. 11153


TEL: (02)2873-4729 Rep. FAX:(02)2875-1068
11

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12

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valve

Bulteryvalve

litX

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ZIVA

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FABA".PIUS , FABA"

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CONA.-Control

CONA' . -in-Qne"

NmM

M
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14

TEL:04-2359-7300
FAX:04-2359-7305 TEL:06-2719-900
http://www.airpower.com.tw
E-mail :email@airpower.com.tw

eam pw

TEL:03-4340-836

*11"

Steam trap th multi-valvlng


technolog y( lncl. spvalve.
iner eck va. drain valve)

407 + 39 1

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CODI"

43 LRMV
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Sleam traps (mechamcal ballfloat I


thennostatic I blmeta1lic d
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www.airpower.com.tw

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www.ari-armaturen.com
15

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~~

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JIHa

auxiliary power TEMPTROl

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valve

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lIi

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5AFE

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SAFE FN (FIno.

50 ty 1'1'"
SAFETCP

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f!Xil
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CONA.-Control

CONA' . -in-Qne"

NmM

M
GH
Ml

14

TEL:04-2359-7300
FAX:04-2359-7305 TEL:06-2719-900
http://www.airpower.com.tw
E-mail :email@airpower.com.tw

eam pw

TEL:03-4340-836

*11"

Steam trap th multi-valvlng


technolog y( lncl. spvalve.
iner eck va. drain valve)

407 + 39 1

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43 LRMV
4 H U

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www.airpower.com.tw

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15

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MODEL:CS~l 6

: 20-265ml./min ~-

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: 0.85-7mln

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110

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L : (02)2995.1167-9 . 2995-1036
FAX: (02)2995-7458 - 2995-6453
E i 1: shl.Ily imc 5.h i tnet(
E.mail: shL.rryi Oshu'l}

TEL: (07)226-9896

TEL: 592-710-9991-3

ru

TEL: 20-8551-2161

UM

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TEL: 86-512 -6 257-0717

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TEL (04)2359-1137

mu

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FAX: 20-8758-3416

18-23

(02)

2908-6129

:(02) 2904-2474

http://0229086129.com.tw/about-us_html
E-mail: n008009492@so-netnettw
17

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MODEL:CS~l 6

: 20-265ml./min ~-

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FAX: (02)2995-7458 - 2995-6453
E i 1: shl.Ily imc 5.h i tnet(
E.mail: shL.rryi Oshu'l}

TEL: (07)226-9896

TEL: 592-710-9991-3

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18-23

(02)

2908-6129

:(02) 2904-2474

http://0229086129.com.tw/about-us_html
E-mail: n008009492@so-netnettw
17

A TAIBON:G

C-20 ( DeDuster@)

peUetron

240mm

9kg

; SUS304 , SUS316 , SUS316L , SUS904 , SUS904L , SM0254 , Titanium ,


Titanium-Paladium , Nickel , Nickel alloy, Hastelloy-C , Hastelloy-B

I! :IE
:"am OV 220V
3A-5m 3 /hr

; NBR , EPDM , CR , Butyl , Viton- , Teflon , Silicon , Reflon-.

SPIRAL

PLASTIC

PLAIN PLATE

M.45kg/c !Tl'

450'C

PVDF PP PE

Mmmaq
900'C

.30'C~+ 140'C

1. 5-2bar

peUetron /

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(02)2708.7272
http://www.seru.com.tw

f
-

(02)2702.0199
E-mail:seru@ms37.hine t. net

SERU INTERNATIONAL CO. ,LTD.

201 6

nHHU3
nuno

E I1

700.C

(Ta)

230'C

MM

3mm--3m

-++

TANTALUM HEAT EXCHANGER

GRAPHITE

mm

ALL WELDED WIDE GAP


11

W ite: WWW.tc .com

19

A TAIBON:G

C-20 ( DeDuster@)

peUetron

240mm

9kg

; SUS304 , SUS316 , SUS316L , SUS904 , SUS904L , SM0254 , Titanium ,


Titanium-Paladium , Nickel , Nickel alloy, Hastelloy-C , Hastelloy-B

I! :IE
:"am OV 220V
3A-5m 3 /hr

; NBR , EPDM , CR , Butyl , Viton- , Teflon , Silicon , Reflon-.

SPIRAL

PLASTIC

PLAIN PLATE

M.45kg/c !Tl'

450'C

PVDF PP PE

Mmmaq
900'C

.30'C~+ 140'C

1. 5-2bar

peUetron /

' z

(02)2708.7272
http://www.seru.com.tw

f
-

(02)2702.0199
E-mail:seru@ms37.hine t. net

SERU INTERNATIONAL CO. ,LTD.

201 6

nHHU3
nuno

E I1

700.C

(Ta)

230'C

MM

3mm--3m

-++

TANTALUM HEAT EXCHANGER

GRAPHITE

mm

ALL WELDED WIDE GAP


11

W ite: WWW.tc .com

19

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7.

8.

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126 6
No.6, ln. J26, 00119 Rd.. DOnShU D NewTaipeiCity25 1. Ton

(02)8809.1100

'U : (02)8809-1005

http://www.maglcpump.com.tw
21

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3.
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8.

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126 6
No.6, ln. J26, 00119 Rd.. DOnShU D NewTaipeiCity25 1. Ton

(02)8809.1100

'U : (02)8809-1005

http://www.maglcpump.com.tw
21

Er.....:1
Globe Valves
FABA

r~..-1:1 ~~.

Control valves

FABA 90'

spindle

STEV I

Supra 1and "".

1 eee

STEVI

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Safety valves

Pducl l19

valves

ZETRIX.
e

PREDU

Steamtraps
,

CONA ' B
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ft

metat to

www.refsch.com

... 5 1: h@

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2RI 111111'1'
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Control valves

Model 520/521

I\IItII! M

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cv710' 11:I !I! ....Os

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8.211'"

Croesus lndustrial Corporation


a 144 5 5 9 3

TEL:(02)2557-9955

TEL:(07)312-1609

FAX:(02)2557-9959.2557-9653

E-mal:croesus9@ms35 .hnet.net
E-mail:croesus_tpe@yahoo.com.tw

22

256 9
FAX ( 07)312- 1 664

E-mail :croesus .ka@msa .hnet.net

Q I
tNlAYmmON

: 02-2771-8337 : 03-552 5300


: 04-2206-1113 : 07-555-2355

htt : 11 www .iSu n ~t~y":' m tw


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,23

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FABA

r~..-1:1 ~~.

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Safety valves

Pducl l19

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e

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,

CONA ' B
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metat to

www.refsch.com

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Croesus lndustrial Corporation


a 144 5 5 9 3

TEL:(02)2557-9955

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