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Department of Airline and Transport Service Management, Vanung University, No.1, Van-Nung Rd., Chung-Li, Tao-Yuan 32061, Taiwan, ROC
Department of Mechatronic, Energy, and Aerospace Engineering, Chung Cheng Institute of Technology, National Defense University, Tauyuan 33551, Taiwan, ROC
Department of Mechanical Engineering, National Taiwan University, Taipei 10617, Taiwan, ROC
d
Department of Marine Engineering, National Taiwan Ocean University (NTOU), Keelung 20224, Taiwan, ROC
b
c
a r t i c l e
i n f o
a b s t r a c t
The geometry and heat transfer effects on heat pipes embedded heat sinks-cooling system are investigated in the
present paper. In the forced convection system, two different heat pipe geometrical shapes of L and U congurations are taken into account. This study adopts a versatile superposition method and least-square estimators with
thermal resistance network analysis to design and experiment their geometry and heat transfer effects under
different fan speeds and heat source areas. The results suggest that the characteristics of system performance
under varying speeds and areas are signicantly different from those under altering speeds and areas. When
the thermal performances of these two congurations are 0.04 C/W of U-shaped heat pipes at 78.85 W, and
L-shaped heat pipes are lowest 1.04 C/W at 34 W, respectively, the lowest thermal resistances of the representative L- and U-shaped heat pipeheat sink thermal modules are respectively 0.25 C/W and 0.17 C/W under
twin fans of 3000 RPM and 30 30 mm2 heat sources. The result of this work is a useful thermal management
method to facilitate rapid analysis and has provided a useful insight into the design of heat pipe cooling systems.
2014 Elsevier Ltd. All rights reserved.
1. Introduction
The extended surface n is usually added to enhance the rate of heat
removal for traditional air cooling techniques. The conventional way to
dissipate heat from microprocessors especially in Central Processing
Units (CPUs) and Graphic Processing Units (GPUs) cooling was forced
convection using a fan with a heat sink directly. However, with the
advances in computer and semiconductor manufacturing industry,
integral circuit design is getting more and more complex so that the
electronic components of CPUs, GPUs, and LED lighting lamps (LEDs)
are made toward the small size, increased power and high efciency
development. They generate more and more heat and heat ux is significantly increased. Thus, the cooling problems of electronic device are
daily major [13]. The manufacture technology of embedded heat
pipes into heat sinks is rapid developments to ensure faster dissipation
of the heat which is a quite obvious application in high-performance
cooling devices. Therefore, heat pipe thermal modules that transfer
energy away from the heat source through convection mechanism
possessing simple metal heat sinks and fans are used to solve the hotspot problems [47]. Technical development related with the application of two-phase ow heat transfer assembly to thermal modules has
Communicated by W.J. Minkowycz.
Corresponding author at: No.2, Beining Rd., Keelung 20224, Taiwan, ROC.
E-mail address: jcwang@ntou.edu.tw (J.-C. Wang).
http://dx.doi.org/10.1016/j.icheatmasstransfer.2014.07.023
0735-1933/ 2014 Elsevier Ltd. All rights reserved.
become mature. Heat pipe absorbs large amounts of latent heat from a
heat source through the phase change of working uid inside and transfers rapidly heat ow to the other side by vapor form without any uid
machinery. The computer-aided thermal design of heat sink with heat
pipe/vapor chamber progresses a high-quality thermal condition development [8]. The heat pipe thermal module has better thermal performance and is that most of the heat rst transfers to the evaporator
of a heat pipe, so the evaporated liquid working uid of the heat pipe
produces steam. Steam releases heat through condensation and recondenses into liquid returning to the evaporator, driven by capillary
force, while the rest of the heat capacity is removed from the heat sink
through forced fan convection [9,10]. The thermal dissipation performance of some heat pipes bent into the required geometric shape and
embedded into the metal base plate or n stack compares well with
that of a vapor chamber. Wang et al. [11,12] had experimentally studied
the thermal resistances of an aluminum heat sink with horizontallyembedded two and four U-shaped heat pipes of 6 mm diameter under
xed heat source area and single fan. They showed that two heat
pipes embedded in the base plate carry 36% of the total dissipated
heat capacity from the heat source, while 64% of heat capacity was
delivered from the base plate to the ns. Moreover, if the temperature
of the heat source is not allowed to exceed 70 C, the total heat adsorption power of heat sink with two and four embedded heat pipes will not
respectively exceed 131 W and 164 W. Finally, a program was developed using Visual Basic to rapidly calculate the thermal performance
R.-T. Wang et al. / International Communications in Heat and Mass Transfer 57 (2014) 140149
Nomenclature
k
L
Q
Qb
R
Rt
Rh
T
Subscripts
a
air/ambient
b
base plate
f
n
s
heat source/dummy heater
n
position of embedded L-/U-shaped heat pipes
of a heat sink with embedded heat pipes [13]. Mohamed et al. [14,15]
investigated also the thermal performance of a heat sink with nned
U-shaped heat pipes for optimum L-ratio (ratio of the evaporator section length to the condenser section length) of the U-shaped heat
pipe, which was found to be dependent on heat pipe diameter and the
n spacing and was of practical engineering importance in the optimum
design of the heat sink. The performance analysis of a nned U-shaped
heat pipe used for desktop PC-CPU cooling was estimated for both
natural and forced convection modes under steady state condition.
Russel et al. [16] identied the effect of orientation on the performance of the U-shaped heat pipe with grooved and sintered wick structures. Thermal modules with U-shaped heat pipes are currently used for
CPU/GPU cooling. Natural and forced convection can both be used to obtain optimum results for minimum thermal resistance and lead to the
generation of high capillary forces for anti-gravity applications [17].
The thermal performance of a heat sink with nned U-shaped heat
pipes is carried out to compatible research for a wide range of highfrequency microprocessors. Besides, another heat pipe bent into metal
base plate is the L shape. One set of risers of the L-shaped heat pipes
functions as the evaporating section while the other set attached to
ns acts as the condensing section. This shape of heat pipeheat sink
is particularly well-suited for cooling electronic components such as
microprocessors using forced convection. Wang [18] vertically arranged
six L-type heat pipes in such a way that the bottom acts as the evaporating section and the risers act as the condensing section, and derived a
mathematical model including all major components from the thermal
interface through the heat pipes and ns. A Windows-based computer
program also uses an iterative superposition method to predict the
thermal performance. Thermal performance testing shows that a representative heat sink with six L-type heat pipes will carry 160 W and has
reached a minimum thermal resistance of 0.22 C/W. The total thermal
resistance varies according to the functionality of the L-type heat pipes.
In recent years, heat pipe-based two-phase ow heat transfer modules
have emerged to effectively reduce the temperature of small-area LED
lighting lamps with higher degrees of heat ux [19,20]. Wang [21,22]
analyzed and designed the optimum thermal performance of a
at heat pipe-thermal module application in a high-end VGA card
cooling system, which is able to cope with a heat ux GPU of over
62.5 W/cm2. The optimum total thermal resistance of a at heat
pipe-thermal module is 0.232 C/W at a high power GPU of 180 W
and inclination angle of 180. The technical development of two-phase
ow heat transfer assembly to thermal modules has matured and is
one of the best options, especially in LED thermal problems. Lu et al.
141
[23] used the at heat pipe (FHP or vapor chamber) to improve the thermal characteristics of a high power LED (light-emitting diode) package.
The obtained results indicated that the junction temperature of the LED
is about 52 C for an input power of 3 W and, thus, the total thermal
resistance of LED system is 8.8 K/W. Wang et al. [2426] presented a
successful experimental analysis with VCTM V1.0 to develop a 30 W
high-power LEDs vapor chamber-based plate, nding that the thermal
performance of the LED vapor chamber-based plate was an improvement over that of the LED copper-based plate with an input power
above 5 W. Results show that the maximum effective thermal conductivity is 870 W/mC and, compared with the experimental value, the
calculating error is no more than 5%. The LED vapor chamber-based
plate successfully resolved the hot-spot problem of 30 W high-power
LEDs.
142
R.-T. Wang et al. / International Communications in Heat and Mass Transfer 57 (2014) 140149
The heat pipe thermal module studied in the present study is shown
in Fig. 1. The present study is to experiment two serial fans set in the
opposite sides of the heat sink, providing a double volume ow rate of
a single fan different from the ones before and to investigate their
thermal performances by using the superposition and least square
smoothing methods [27].
The U-shaped heat pipe thermal module is composed of an aluminum base plate with ns, two heat pipes, and an aluminum n stack.
The dimensions of base plate are 52 42 7.5 mm3 and its ns are
10 42 7.8 mm3. The n stack is an array of 35 ns, 0.4 mm thick
with a 2.0 mm gap. Its dimensions are 42 mm 82 mm. This type of
thermal module has two parallel heat pipes. The total length of single
heat pipe is 265 mm with an evaporating length of 30 mm directly
contacting the heat source, and two condensing lengths of 117.5 mm
embedded in the ns. One end of the heat pipes is inserted into the
base plate to form the evaporation section, while the other end is embedded in the ns to form the condensation section. Another L-shaped
heat pipes heat sink consisted of a copper base plate, six heat pipes,
and an aluminum n stack. The overall dimensions of the L-shaped
heat pipes heat sink are 117 85 83 mm3, which consists of six
single heat pipes with aluminum ns 83 mm 70 mm, 0.4 mm of
thickness, a count of 27 and a pitch of 2.8 mm. The copper base plate
measures 66 51 7 mm3. These six L-shaped heat pipes are
156 mm in length, including 50 mm embedded in the base plate to
carry heat from the heat source to the ns for dissipation. The heat
pipe is bent at a right angle to be an L-shaped heat pipe and has a
51 mm evaporator and a 105 mm condenser. However, single U- or
L-shaped heat pipe has 6 mm diameter and is made of copper with a
sintered copper powder metal wick of 10 5 m effective pore radius
and pure water as working uid.
2. Methodology
2.1. Thermal resistance network and superposition method
Fig. 2 exhibits the thermal resistance network of the heat pipe thermal modules acquired by the superposition method [11]. The superposition rule is sufcient to present the given heat transfer geometry
problem geometry in Fig. 2 as the sum or difference of some geometry
with known conguration factors (Fig. 2 in Refs. [11,18]), which can
be expressed as the parameters. Therefore, superposition principle is
also often stated in the summation rule. We may divide the heat transfer
problem into a number of simpler problems each satised the required
homogeneity conditions and all adding up to the problem in the present
Qn
n1
2
or6
X
!
1
1
:
In Eq. (2), Rt is dened as the temperature difference (the temperature of heat source Th minus the ambient temperature Ta) divided by the
total heating power Q. The Rif is the interface resistance, dened as the
effective temperature difference at the interface (Th minus the temperature at the center of the lower surface of the base plate Td) divided by
Q. The Rb is the base plate thermal resistance, dened as the temperature difference (Td minus the average temperature at the upper surface
of the base plate Tu) divided by Qb. The Rhs is the base plate convection
resistance, dened as the temperature difference (Tu minus Ta) divided
by Qb. The Rbh,n is the base plate heat pipe thermal resistance, dened as
the temperature difference (Td minus the temperature of the evaporation section of the heat pipes Ten) divided by Qn. The Rh,n is the heat
R.-T. Wang et al. / International Communications in Heat and Mass Transfer 57 (2014) 140149
143
144
R.-T. Wang et al. / International Communications in Heat and Mass Transfer 57 (2014) 140149
heat pipe to total heat is utilized through Newton's method and the
GaussSeidel iteration method.
Rh
Thpe;n Thpc;n
Qn
4
0:5940:032 Q n 4:781 10
7
1:596 10
Q n
Q n
Table 1
Relationship between interface thermal resistances Rif and input power.
Heat input (W)
15 15
30 30
Two fans
One fan
Two fans
L-shaped
U-shaped
30
60
90
120
150
180
240
300
30
60
90
120
150
180
240
300
One fan
1000
2000
3000
1000
2000
3000
1000
2000
3000
1000
2000
3000
0.033
0.033
0.032
0.034
0.034
0.033
0.035
0.033
0.034
0.034
0.035
0.031
0.03
0.039
0.038
0.038
0.037
0.037
0.037
0.034
0.036
0.036
0.037
0.033
0.034
0.034
0.034
0.037
0.036
0.037
0.037
0.037
0.037
0.04
0.038
0.033
0.032
0.032
0.034
0.034
0.033
0.035
0.037
0.037
0.037
0.035
0.033
0.032
0.033
0.033
0.035
0.036
0.037
0.033
0.034
0.036
0.037
0.039
0.033
0.032
0.032
0.031
0.033
0.034
0.037
0.035
0.032
0.037
0.037
0.039
0.036
0.037
0.038
0.036
0.037
0.032
0.033
0.034
0.035
0.037
0.036
0.036
0.037
0.037
0.033
0.033
0.033
0.034
0.035
0.036
0.036
0.037
0.037
0.037
0.032
0.033
0.031
0.03
0.033
0.035
0.036
0.035
0.034
0.037
0.035
0.036
0.035
0.035
0.034
0.035
0.035
0.035
0.033
0.034
0.034
0.035
0.035
0.033
0.034
0.033
0.034
0.035
0.033
0.035
0.034
0.035
0.035
R.-T. Wang et al. / International Communications in Heat and Mass Transfer 57 (2014) 140149
145
Table 2
Relationship between total thermal resistances and input power.
Heat input (W)
15 15
30 30
Two fans
One fan
Two fans
L-shaped
U-shaped
30
60
90
120
150
180
240
300
30
60
90
120
150
180
210
240
300
One fan
1000
2000
3000
1000
2000
3000
1000
2000
3000
1000
2000
3000
0.55
0.5117
0.4956
0.49
0.4927
0.5
0.417
0.407
0.404
0.399
0.377
0.4367
0.42
0.4144
0.42
0.4353
0.4483
0.397
0.37
0.366
0.353
0.336
0.318
0.307
0.4133
0.3933
0.3867
0.3983
0.4187
0.4383
0.343
0.297
0.288
0.287
0.282
0.281
0.281
0.6433
0.62
0.6133
0.6117
0.6117
0.6217
0.557
0.507
0.501
0.491
0.49
0.5167
0.4717
0.4589
0.4642
0.47
0.4844
0.417
0.362
0.351
0.343
0.338
0.346
0.4367
0.415
0.4078
0.4192
0.432
0.45
0.363
0.312
0.303
0.301
0.298
0.298
0.3767
0.3733
0.3667
0.3617
0.29
0.276
0.271
0.268
0.274
0.275
0.2708
0.2656
0.2621
0.2613
0.207
0.196
0.19
0.188
0.184
0.245
0.2408
0.2477
0.2479
0.2497
0.175
0.17
0.164
0.161
0.158
0.47
0.4667
0.455
0.455
0.397
0.383
0.354
0.355
0.2983
0.295
0.2878
0.2867
0.286
0.233
0.228
0.228
0.222
0.222
0.26
0.2525
0.2478
0.2467
0.252
0.192
0.184
0.18
0.178
0.177
Table 3
The bypass heat ow ratios.
L-shaped
U-shaped
Area of Heat
Source(mm2)
Ratio
Two fans,
2000 RPM
One fan,
3000 RPM
One fan,
1000 RPM
30 30
I (n = 1,6)
II (n = 2,5)
III (n = 3,4)
Qb/Q
I (n = 1,6)
II (n = 2,5)
III (n = 3,4)
Qb/Q
28%
27%
30%
15%
35%
27%
25%
13%
27%
30%
29%
14%
33%
25%
25%
17%
47%
20%
10%
23%
38%
28%
20%
14%
15 15
Ratio
Two fans,
2000 RPM
Two fans,
3000 RPM
One fan,
2000 RPM
One fan,
3000 RPM
(n = 1 + 2)
68%
68%
69%
67%
Qb/Q
32%
32%
31%
33%
(n = 1 + 2)
67%
65%
72%
63%
Qb/Q
33%
35%
28%
37%
146
R.-T. Wang et al. / International Communications in Heat and Mass Transfer 57 (2014) 140149
150 W for 15 15 mm2 heat source, and the smaller heat source area
results in higher heat ux. After the heating power increases to 150 W
(67 W/cm2), Rt rises and launches because of the operating performance limits of the embedded heat pipes. This is the heating power
increasing to the point that the embedded heat pipes are starting to
function, and the total thermal resistance shows a decreasing trend.
The heat pipes are unable to sustain excessive higher heat capacity at
heating powers of above 150 W for 15 15 mm2 heat source, causing
the evaporation section to produce more amounts of vapor than that
of condensed liquid, resulting in the heat pipes losing performance,
thereby increasing total thermal resistance. Unlike the 30 30 mm2
heat source, Rt presents a mild parabolic curve because of the function
of the embedded heat pipes and higher heat ux. Thus, the Rt values
of 15 15 mm2 heat source are all higher than those of 30 30 mm2
heat source. Raising fan speed improves thermal performance of
present thermal module. Consequently, the fan should be kept above a
gradated speed to acquire better heat diffusion benets. The total thermal resistances of single fan operation are higher than those of dual fan
operation due to heat convection mechanism under identical heat
source areas and the fan speeds. Normally, twin-fan convection can
enhance the thermal performances than the usage of single fan at low
fan speeds. In present experimental results, the values of total thermal
resistance Rt are nearly identical levels between a single fan speed of
3000 RPM and twin fans of 2000 RPM. In addition to thermal interface
resistances Rif and total thermal resistances Rt, the rest of thermal resistances including base plate resistances Rb, n-base convective thermal
resistances Rhs, base to heat pipe resistances Rbh,n, heat pipe resistances
Rh,n, and n-pipe convective resistances Rf,n are able to obtain based on
the individual bypass heat ow. Table 3 shows the bypass heat ow
ratios of L- and U-shaped heat pipeheat sink thermal modules to the
total heat capacity according to superposition method and the same
experimental scheme as Ref. [11]. The single U-shaped heat pipe has a
higher heat dissipation ratio than that of single L-shaped heat pipe at
the identical condition.
From Table 3, three groups of dual L-shaped heat pipes are marked
as I of (Q1 + Q6) / Q, II of (Q2 + Q5) / Q and III of (Q3 + Q4) / Q. The
sum of the ratio of the six embedded L-type heat pipes is between 77%
and 87%. For large volume ow rates (two fan 2000 RPM and one fan
3000 RPM), each bypass heat ow ratio (groups IIII) is almost 30%.
Group I is dissipated heat capacity by the two L-shaped heat pipes closest to the air inlet with higher heat transfer coefcient at single fan condition, and group III is the furthest away from the air inlet as shown in
Fig. 3(b), which is why the ratio of group I heat-transfer path of 47%
and 38% is larger than that of the group III heat-transfer path of 10%
and 20% for single fan of 1000 RPM. At 1000 RPM, the impact of n impedance on the ow eld decreases the volume ow rate from the air
inlet to the heat pipe, while the volume ow rate to the six L-shaped
heat pipes increases from 77% (30 30 mm2 heat source) to 87% (15
15 mm2 heat source). For embedded two U-shaped heat pipe thermal
module, the bypass heat ow ratio of the single U-shaped heat pipe is
found to increase as the heat source area decreases. The reason is
when the heat source area is reduced; the ratio of the total area of the
contact area of the heat pipe to the heat source increases, the bypass
heat ow ratio will raise as the heat source area is decreased. The experimental results are good agreement with theoretical suppose. Table 4
displays the heat pipe thermal resistance regression curves of the Lshaped thermal module which applied the quadratic polynomial equations [27]. The heat pipe is a two-phase heat transfer element, and its
thermal resistance value will change with the heat ow resulting from
the multiphase behavior of the working uid inside heat pipe. Six Lshaped heat pipes have the lowest thermal resistances of the order of
1.04 C/W, 2.07 C/W, 1.92 C/W, 2.76 C/W 2.19 C/W, 1.7 C/W between 34 W and 40 W. And from Ref. [27] the U-shaped heat pipe has
the highest thermal resistance below 10 W, following a gradual decline as heat ow increases with the rate of decline slowing to
25 W, and then gradually increasing after 35 W. Therefore, the
Table 4
Theoretical thermal resistance equations of L-shaped heat pipes [27].
Rh1 (W/mK)
Rh2 (W/mK)
Rh3 (W/mK)
Rh4 (W/mK)
Rh5 (W/mK)
Rh6 (W/mK)
3.66 101
(Q1 = W)
6.31 101
(Q2 = W)
5.42 101
(Q3 = W)
8.46 101
(Q4 = W)
6.93 101
(Q5 = W)
6.42 101
(Q6 = W)
R.-T. Wang et al. / International Communications in Heat and Mass Transfer 57 (2014) 140149
147
148
R.-T. Wang et al. / International Communications in Heat and Mass Transfer 57 (2014) 140149
4. Conclusions
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