1

SPCC
SECC
SUS 301
SUS304
------ .
.
SECC
:

( .
:

1- 2
1.

S ABC

S for Steel
A:
EG Electro Galvanized Steel---
JIS

EG

SECC

EG

SECC

GI (Galvanized Steel) ------

GI LG

GA ALLOY

SGCC 3
SGCC 4

2>3>4>1

2>4>1>3

4>2>1>3

1>2>3>4

B:

C (Cold rolled) :
H
C:

D:

(Hot rolled):

C:

D:

E:

H:

M:
C:

---

D:

---

P:

---

U:

()--- ---

A:

()---

FX: ---
FS: ---
E:

1- 4
--- 0.00356mm .
(ASTM B499), (ASTM B504), ASTM B487
--- 0.1 /.
1- 5
---- 100mmX150mmX1.2mm, 24
72 5%
48
6mm

1-7 .
1. ---. ()
2. ---.
3. ---

4. --- .
1-10
1.


2.

Water lreakage test
.
3.

Water promer.
2

---
.

--- PE PS
PVDC
ABS:
1. ----
2. ---
3. ---


.
10 .
2-3


1.
2.

3.

NORYL---PPO HIPS , 240~300 70~90

ABS--- 170~220 40~60.
2-5 ABS
t=70%T
R=3/2*T, R=T/2 , T .
6.35mm,

(mm)

mm

250

9.5

75~250

7.9

75

6.0

ABS ( 7mm)
0.762mm.
25~50mm 0.05~0.064mm,
.
11.1~14.3mm, 1.5
.
P20 H13 .


200. .
2:1~2.5:1, L/D 20:1 24:1,
5.5. 40~55RPM.
PVC

80 50.
221~232 243,

1.

2.
--- 2%
--- .
.
--- PCB
800.
---

---

---
.
---

---
.
---
---
---
---

------ .
.
---
---

3-4

PVC PVCD

1. , 50mg/kg PBB PBBO.
2.

SPCC SECC

1. PVC Cable
2. PCBV
3.
4.
5.

(PC)

PC safety UL CSA
2mm. SLOT 1.5mm, 20mm .

 EMI EMI
.

(1)

(2)

1/10 1/30 1 ~2

(3)

1/120 ( 0.5)

(4)

0.001
INCH(0.025mm), 1.

.
R

: mm

0.9~4.0

1.5~5.0

0.6~3.5

1.5~5.0

0.6~3.0

1.5~5.0

1.5~5.0

1.0~4.0

1.0~4.0

ABS

1.5~4.5

AS

5.
R 0.5mm , R/T=0.6 , R
.
R=0.5T , R=1.5T
6.

0.5 T , R=0.125T, 0.5~1.5, GATE
. .
7. Boss
Boss
Boss .
Boss Boss


8.
,
.
LED .

.

ESD , (Lens) Lens

.

1. EMI (Electro Magnetic Interference) .
2.
FCC Federal Communication Commision
VDE (Verband Deutscher Electrotechniker)
IEC() CISPRComite International Spe Ciai Des Perturbationss Dadioelectriques
3.
Class A.
Class B
4.

2~3dB

Layout

Pattern

FILTER

1 OW PASS FILTER

CABLE

CABLE

Connector

Connector
ZINC SPRAY

.
5.
Impact UL746C 4 5%

6.
Rr=V/I * S/ l
Rs=Rr/t ()
7
SdB=20 log E1/E2
SdB=20 log H1/H2
E1, H1 E2H2
(Shielding Effectiveness)
SE=R+A+B
R: R=168+10log(c/p * 1/f)
A: : A=1.38 * tf*c*p
B: :
, c f , p t .

(C)

C*P

C/P

1.05

1.05

1.05

1.00

1.00

1.00

7.
.

d , n, c, t, r, f, d, n, f
c, t, r .

1.
2. 5
3. /201.5cm

.
5 milli Gauss ( 1mG=100nT)
8.
.

9
.
EMI I/O,

1. ---


>500kHz
.
---

()

6dB, 12dB,
.
ESD
ESD(Electrostatic Discharge)

Gradient of Field (Arc), Mechanical Attraction.
ESD
8-1
1.
---
---Recombination,.

Dielectric Constant
Triboelectric Table
109 ohms/square .
0 ohms/square~106 ohms/square
106 ohms/square~109 ohms/square
109 ohms/square~

PE FOAM

104~106 ohms/square

108~1012 ohms/square

10~108 ohms-cm

2.
ESD
1.
ESD V=Q/C
Q Q ESD
80pfd~500pfd .
2.
ESD IC
10~15kV, ESD 35~40kV ESD
3~4kV
3.
W=1/2 *CV2
ESD 17 milijoules, C=150 pfd, V=15kV
W=1/2 * 150 *1012 * (15 * 103)2 =17 * 103 joules ()
4.
Reverse Bias .
5. RISE TIME ( tr )
RISE TIME---ESD (PULSE)10% 90%ESD .
Duration--- ESD 50% 50%

 ESD Rise time .

ESD :
1. Corona Discharge , RF .
2. Pre-discahrge E-Field
3. Collapse
4. (Discharge H-Field)
5. Transient Voltage
8-2 ESD
1.

(1) MOSMetal Oxide SemiconductarDEVICE

(2) ESD SiO2 Breakdown Voltage .
(3)

(1) BIPOLAR ( Schottky , TTL) DEVICE

(2) ESD 2~5A I2t, IC JUNCTION .
(3)
2.
ESD
GROUND,
ESD /
.
3.
----
ESD PILSE .
8-3 ESD
1. (Component Level)
2. (PCB Level)
3. CABLING
4. Housing Level
12
1. cabling
Flat Cable Power Cable,
1. Cable.

2. ESD Noise, Cable .

3. cable ESD Cable .
4. Cable Shielding
2.
Shielding(Grounding). Shielding ESD EMI
ESD
1. Switch Floating,
(1)

ESD PCB.

(2)

2. ESD .
3. ESD ESD
4.