SURFACE TREATMENT

1.1 ( Surface Treatment )

,,,
. ,,, ,,
,,
(surface treatment) (surface finishing).
1.1.1 (metal surface treatment)
, ,
,.(metal surface
finishing).
1.2
:
(1) (appearance).
(2) (protection)
(3) (special surface properties)
(4) (mechanical or engineering properties)
(1) (appearance)
,, (decorative plating) Au, Ag, Rh,
Ni, Cr, (electroplating).
(2) (protection)
,(coating),
(protective plating) Zn,Cd,Ni,Cr,Sn .
(3) (special surface properties)
1. (electrical conductiuity), Ag,Cu.
2. (soderability), Sn-Pb .
3. (light reflectivity ) , ,Ag Rh
.
4. (contact resistance) Au Pd .
(4) (mechanical or engineering properties )
1. (strenth),.
2. ( bearing propertries ) (porous chromium plating),
(piston) , Sn (cylinder).
3. (hardness)(wear resistance) ,( hard chromium plating).
4. ,,,,.
5. (carburizing) ,(nitriding) , (case hardening)
Cu.
1.3
,,.
(plating),(anodizing),(convesion coating),(coating),
,,,,.
,
1/83

.,,.
,.
1.4 :

____ ,,,,,,.
____ ,(,,),.
____ ,,,.

____ ,,,,,,
____ ,,,.
____,,.
1.5
70 ,, 4000 ,
1200 ,,,, ,, ,,
,, 15000 20000 , 1000 1500
.
1.5.1
,, 75% .
,,,,
.
1.5.2
,,, ,
.,,,
,,,,
.
,,
,,,,
,.,,
,,,,.
1.5.3
,,,,,
., ,,
.,,,
,,,,.
2/83

1.5.4
,,,
,,,,,
,.
1.5.5
, ,
,,,.,
,,, .
1.5.6
,,,
,,.
1.6
,.
,,
. ,,
,,,,.
1.6.1 (decorative plating)
,,, ,,
,,,,
. ,,,
,.
1.6.2 (engineering plating
,,.
, , (electroforming).,,
.
,
, a ,,,
,, .
, ,,
.,
.,,,
,.
1.6.3 (tin plating)
,
., ,,,,
,, ,,
,,(tin free steel).
3/83

1.6.4 (zinc hot dip coating)

,,
.(roofing),(siding ),,,
.,,,,
,,,,
.,,.
1.6.5 (anodizing)
,,,.
,,, T ,,.
,.
(hard anodizing),.
,,,,,,',
,,(brake disk),.,,
.,
.
1.6.6 (coating)
,,.
,.,
.,.
(, ).
1.7 ,
,,,,
,.,,.
,.,,.
1.7.1
:
(1) .
(2) .
(3) .
(4) .
(5) American, Electroplater Society.
(6) American, Electrochemical Society.
(7) American, National Association of Corrosion Engineers .
(8) Institute of metal fishing.
(9) Corrosion Science Society.
(10) Corrosion and Protection Association.
(11) .
(12) ().
(13) .
(14) .
4/83

(15) .
(16) .
(17) Bunsen Gesellechaff.
1.7.2
:
(1) :
.
.
.
.
.
.
(2) :
.
.
.
.
(3) :
Plating
Corrosion
Metal Finishing
Materials Protection
Product Finishing
Materials and Methods
Industrial Finishing
(4) :
Electroplating
Metal Industry
(5) :
Metalloberflanche
oberflachenentechnik
Korrosion und Metallschutz
Werkstoffe und Korrosion
1.7.3

ABS

ABS

10

11

12

13

5/83

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31
32

33

34

35

36

37

38

39

40

,,Cr

41

1.8
,,
,,.
,.
,,,
.,[].
6/83

.[],
.,.,,
,.

2.1
(electroplating)(electrodepos- ition process)
(electrode)
2.2
(deposit)


2.3

(electroplating)

(electroless plating)

(hot dip plating)

(spray plating)

(plastic plating)

(immersion plating)

(diffusion plating)

(cathode supptering)

(vacuum plating)

(alloy plating)

(composite plating

(selective plating)

(through-hole plating)

(pen plating)

(electroforming)

2.4
(solution) (aqueous solution)
30 , Cu Ni
Cr Zn Cd" Pb Au Ag Pt Co Mn Sb Bi Hg
Ga InAsSeTePdMnReRhOsIrNbW
LaTi
ZrGeMo

7/83

2.4.1 (solution)
(solute) (solute)
(aqueous solution)
(concentration)
(solubility)
(saturated solution)
(unsaturated solution)
(weight percentage) (molal concentration)
2.4.2 (reaction of matter)

2.4.3 (chemical formular)

2.4.4 (electrochemistry)
( electrodeposition ), electrolysis) (electrode)
,
(electrolyte) NaCl, (electrolytic solution)
(ions), (movement)(anode)
(anion),(cathode)(migrate) cations)
(particles)(ions) (anode),
(cathode)(electrolysis)
2.4.4.1 (electrode potentials)
(electrode potential)(electrolytic),
(electrode potential),
(standard electrode)
(hydrogen standard electrode) 0
Nernst equation :
E=E0+RT/nF ln aMn+/aM
E=
E0=(volt)
R=(8.3143 J.K-1MOL-1)
T=( K)
n=()
8/83

aMn+=(activity),,
(concentration)C
, a = r *c
, 1

2.4.4.2 (standard electrode potential)

(standard electrode potential) 1()
1
E=E0
E=E0+RT/nF ln 1/1
=E0+0= E0

0, (REFERENCE
ELECTRODE), 0, Li
,, ,, (basic metal) Au .
..(noble metal)

Rb?
K?
Ba?
Sr ?
Ca ?
0.000
Na ?
Mg ?
Al ?
Mn ?
Zn ?
Cr ?
Cr ?
Fe ?
Cd ?
In ?
Tl ?

Li+ -3.045
Rb+ -2.93
K+ -2.924
Ba+2 -2.90
Sr+2 -2.90
Ca+2 -2.87
Na+ -2.715
Mg+2 -2.37
Al+3 -1.67
Mn+2 -1.18
Zn+2 -0.762
Cr+3-0.74
Cr+2 -0.56
Fe+2 -0.441
Cd +3 -0.402
In+3 -0.34
Tl+ -0.336

Co ?
Ni ?
Sn ?
Pb ?
Fe ?
Pt/H2?
Sb ?
Bi ?
As ?
Cu ?
Pt/OH-?
Cu ?
Hg ?
Ag ?
Pd ?
Au ?
Au ?

2.4.4.2
9/83

Co+2 -0.277
Ni+2 -0.250
Sn+2 -0.136
Pb+2 -0.126
Fe+3 -0.04
H+
Sb+3 +0.15
Bi+3 +0.20
As+3 +3
Cu+2 +0.34
O2 +0.40
Cu+ +0.52
Hg2+2 +0.789
Ag+ +0.799
Pd+2 +0.987
Au+3 +0.150
Au+ +1.68

2.4.4.3 Nernst
,, ,
,, Nernst :
(electrolatic
solution pressure) p (osmotic pressure) p,
:
(1) P>P ,,,,

(2) P<P ,,
,
(3) P=P ,
E, 1 mole ,
nF , n ,,F ,
nFE,:

n F E=
ppVdp=
E=RT/nF ln P/P

RT

pp dp/p=-RTln P/P

(activity) aMn+ K, P=
KaMn+
E= - RT/nF ln p/KaMn+
=- RT/nF ln P/K +RT/nF ln a n+
M
E , aMn+=1, E ,
E0=- RT/ nF ln P/K + RT/nF ln 1
=-RT/nF ln P/R

:
:
E=E0+RT/Nf ln aMn+ / aM
aM
2.4.4.4
.
Cu ? Cu+++2e- :
Cu Cu+++2e
10/83

Cu Cu+++2e

1:
1/2O2+H2O+2e-? 2OH 2:
Hg2+2+2e-? 2 Hg
E=E0- RT/nF ln a

Hg(s)

/a

Hg2

+2

3:
1/2H2(g) ? H++eE=E0-RT/F ln aH+/aH21/2(g)

2.4.4.5
(1):
M/M+n :?
M+n , M+n xH2O,
,, Mg.Zn. Fe ..

Mt M(aq)+n+ ne M+n ,
,, o
(2) M MX , MX KX ,(M x MX,KX)
(Hg2Cl2) o
(3), Pt,,
Pt x Fe++ .FE++ Pt x Cr+2,Cr+3 o
2.4.4.6


2.4.4.7 liquid junction potential
(diffusion potential)

2.4.4.8 overvoltage)


(polarization)

11/83

1.activiation overvoltage

Tafel

g act=a+b log i

b i g act i
g act
g act
hydrogen overvoltage
H2
g H2=Ei-Eeq

g H2=
Ei=
Eeq=

2.concentration overvoltage



3.solution resistance overvoltage
IR IR
IR IR

4.passivity overvoltage
A1

2.4.4.9 decomposition potential

E (praticaldecomposition potential)
I
EI=E0+g TOTAL
g TOTAL= g c + g a + g conc. + IR
E0=Ec-Ea
12/83

:
E0=
Ec=
Ea=
g c=
g a=
g conc.=
I=
R=
: I
EI=E0+g c+g a+g conc.+IR
EI=g c+g a+g conc+IR
Ec=Ea Ea=0
: I
EI=E0+g a+g c+g conc+IR
EI=g a+g c+IR
Ea=Ec ? E0=0
? g conc=0
: 10c 10 -2Amp/c
g c 0.4450.065logI g a 0.3750.045logI R300

EI=g c+g a+IR

=0.445+0.65log(0.01*10)+0.375+0.045log(0.01*10)+(0.01*10)*300
=30.71volt
2.4.5



2.4.5.1

2.4.5.2

13/83

2.4.6

2.5

2.5.1
o

(work)(rack)
(bath solution)
(anode)
( plating tank )
(heating or colling coil )

2.5.1.1 ,:
2.5.1.2

14/83

2.5.2

2.5.3 plating bath

pH
pH 25.5
pH
2.5.3.1
1.
CuSO4NiSO4
NiSO4(NH4)2SO4
Na2Cu(CN)3
2.

3.

4. pH pH (pH5
8)pH
5.

6.

7.

8.
9. (wetting agent)
2.5.3.2

15/83


pH

2.5.3.3

Hull (Hull cell test)

2.5.4

(anode basket)



pH
(free cyanide)
pH

2.5.5 anode bag

pH

16/83


2.5.6

2.5.7
(pretreatment)
1.

2.
3.

4.
5.
2.5.8 rack
1.2.
3.4.

1.2.3.4.5.
7.
1.2.
3.
4.

1.2.3.4.5.6.
7.

251b

(anodizing)

1.
2.
3.
4.
5.
6.

1.
17/83

2.
3.
4.
5.
6.

1. (drag-out)
(drag-in)
2.
3.
4.
5.
6.
7.

2.5.9
1.
12.
2.
13.
3.
14.
4.
15.
5.
16.
6.
17.
7.
18.
19.
8.
9.pH
10.
11.
1.

2.

3.
4.

5. (PR)

6. (throwing power)

1.

2.
3.
4.
5.

1.
2.
18/83

3.
4.
5.
6.
7.
7.

8.

9. pH

10.
11. (polarization)

1.
2.
3.
4.

1.
2.
3.
4.
12.

13.

1.

2.
1530
3.

14.

15.

16.
(bipolar)
19/83

17.

18.

19. 9
12 15
2.5.10

1.
2.
3.
4.pH
2.5.11

1. (adhesion)

(1)
(2)
(3)
2. (cohesion)
(1)(3)

3. (continuity)(pore)

4. (uniformity)
Haring
Hull
5. (appearence)

6. (stress)
(1)(2)(3)
7.
2.5.12
(1)(2)(3)(4)(5)(6)
(7)(1)(2)(3)(4)
(5)
2.5.13

2.5.14

20/83


(1)(2)(3)
(1)(2)(3)(4)(5)
(6)(7)
2.6

1.
0C=5/9*(0F-32)
0F=1.80C+32
0K=0C+273

2.
D=M/V M= , V=
(3)
S.G=/ 40C
4. (baume')
Be=145-145/
=145/145-Be
20H2SO4 20 Be' 17
=145/145-17=145/128=1.13
(5)
NiSO47H2O
NiSO47H2O=280.87
7H2O=126
H2O%=126/280.87*100%=44.9%
(6)
400 500 100
400/500=100/X
x=125
125 1b
(7)
96 H2SO4 1.854 1 ml 96H2SO4
=98/2=49
49 /((1.8354 )/(ml*0.96))=27.82ml
27.82ml 96%H2SO4
(8)
1 14.4ml 1N HC1 310ml NaOH NaOH
14.4ml1N10mlxN
x1.44
N.OH 1.44N
2 1.1738N HC1 10ml 1.1034NNaOH HC1 ml
x ml1.1788N10ml1.1034N
x9.4
9.4ml 1.1738NHC1
(9)(Faraday's Law)

21/83

 1 5 5 100 =(/(
*96500))*(**)
W=(A/(n*96500))*(I*T*CE)
=(63.54/(2*96500))*(5*5*60*60*100%)=31.8(g)
31.8g
2 10 2.5g NiSO
100
I=( (n*96500)/(A))*((W)/(t*CE))
=((2*96500)/(58.69))*((2.5)/(10*60*100%))=13.7
13.7
3 1000cm2 15 100 5
l m
8.93g/cm3
t = ((n*96500*D)/(A))*((area*d)/(I*CE))
=((2*96500*8.93)/(63.54))*((1000*5*10-4)/(15*100%))
=900()=15()
? 15
4 1.5 1500 15 25 l m
7.14g/cm3 65.38
CE=WAct/WThen*100%
=((1.5m2*25l m*7.14g/cm3)/(((65.38)/(2*96500))*1500*15*60))*100%
=59%
59%
5 0.9m 500m/min 5000A/
4l m 100 7.31g/cm3 118.7
m
L=((n*96500*D)/(A))*((S*d)/(DI*CE))
=((2*96500*7.31g/cm3)/(118.7))*((500m/min*0.4l m)/(5000A/m2*100%)) =8( M )
8M.
6 18 1000
CrO2 52 16
W=((A/(n*96500))*(I*t*CE)
=((52)/(6*96500))*(1000*18%)
WCrO3=58.1*CrO3/Cr
=58.1*100/52
=112( g )
CrO3 112 g
7 15 10 1500cm2 100
8.93g/cm3 63.54 m
d=((A)/(n*96500*D))*((I*t*CE)/(area))
=((63.54)/(2*96500*893g/cm3))*((15*10*60*100%)/(1500cm2))
22/83

=0.00022(cm)
=2.2l m
2.2l m
(10)
100 300g/1 NiSO4,30 g/1NiCl2 40 g/ H3BO3.
220 /1NiSO4 25g/1 NiCl2 32g/1 H3BO3
NiSO4=((300-220)g/1*100gal*3.785 1/gal)/454 g/lb
=66.7( lb)
NiCl2=(30-25)g/1*100gal*3.785 1/gal/454 g /lb
=4.17 (l b)
H3BO3=(40-32) g/1*100gal*3.785 1/gal/454 g/lb
=6.67( lb )
11.
E=E0+ RT/nF ln aM+n/aM
1 0.5MCu(CN)3-2 25
1. 5-X X 3X
2.
Cu(CN)3-2 Cu++3CN
Kdiss=[Cu+][CN-]3/[Cu(CN)3-2]=5.6*10-28
X*(3X)3/0.5-X=5.6*10-28
X=5*10-8=[Cu+]
aCu+? [Cu+]=5*10-8
ECu=E0Cu+8.3144*(273+25)/1*96500 ln 5*10-8/1
12.
13.
g =EI-Eeg
EI I
Eeg
Eeg= Ec- Ea
Ec
Ea
g =a+b log I
a , b ,
EI=Eeg+g a+g c+g conc.+IR
pH5 1cm2 0.01 /cm2
g c 0.4450.065logI g a0.3750.045logI100
Eeg =Ec-Ea
=ENi-ENi=0
g conc=0 ()
I= 0.01 A/cm2*1cm2
? EI=Eeg+g a+g c+g conc+IR
=0+0.375+0.045log0.01+0.445+0.065log0.01+0+0.01*100
=1.6 ( V )
23/83


3.1
,
3.1.1

3.1.2
(1)(2)(3)(4)(5)
(7)(8)(9)
3.1.3

3.1.4
(1)
(6)
(2)
(7)
(3)
(8)
(4)
(9)
(5)
(10)
3.1.5
(water-beak test)
Nielson methodAtomizer test
Fluoresent methodweight of residual soilwip-ing methodresidual patlern method
Radioisotope tracer technique
3.1.6

(1)
(9)
(2)
(10)
(3)
(11)
(4
(12)
(5)
(13)
(6)
(14)
(7)
(15)
(8)
3.1.7
(1)
(2) ,
24/83

(3)
(4)

(5)
(6)

(7)
(8)
(9)
(10)
(11)
3.1.8
(1)
(2)
(3)
(4)
(5)
3.1.9
:1.(abrasive blasting),2.(tumbling),3.(brushing),4.
(acid pic- king),5.(salt bath descaling),6.(al-kline descaling),7.(acid
cleaning)
3.1.10
:1.,2.,3.,4.,5.
,6. ,7.,8.,9., 10.
3.2.1
:1.(alkaline cleaning),2.(solvent cleaning),3.3.9.7
(emulsion cleaning) ,4.(electrolytic alkaline cleaning),5.
(acid cleaning),6.(vapor degreasing),7. (abrasive blast

cleaning),8.(tumb- ling),9.(brushing),10.(picking),11.
(electrolytic picking),12.(salt bath descaling),13.
(alka;ine descaling),14. (ultrasonic cleaning),15.(paint stripping),16.(glass bead cleaning)

Nitric acid 66 vol %

Temperature room to 160 F
Sulfuric acid 78 vol %
Nitric acid 22 vol %
Temperature room
Sodium cyanide 3 ~ 4 oz / gal
Sodium carbonate 1 ~ 2 oz / gal
Sodium aluminum sulfate 6 oz / gal
25/83

Sodium potassium tattrate 6 oz / gal

Temperature 180 ~ 210 F
4~6 Volt 30 1
3.9.8
Chromic acid 30 ~ 40 oz / gal
Sodium sulfate 2 ~ 4 oz / gal
Temperature room
Time 5 ~ 30 sec
1%
Chromic acid 30 ~ 40 oz / gal
Hydrochloride 12 oz / gal
Temperature room
Time 1 min
40 oz/gal
3.9.9
(1) AISI 661 , 670 , 680 , 688
Hydrofluoric acid 48 ~ 58 oz / gal
Nitric acid 7 ~ 10 oz gal
Temperature room
Sodium hydric 1 ~ 2 wt %
Sodium hydroxide 98 ~ 99 wt %
Temperature 680 ~ 720 F
(2)
Hydrochloride acid 50 ~ 75 vol %
Temperature room
(3) ( bright dipping )
Sulfuric acid 5 vol %
Ferric sulfate 24 oz / gal
Temperature 180 F
Hydrochloride acid 25 vol %
Ferric sulfate 13 oz / gal
Temperature 160 ~ 180 F
3.9.10
( commercial inhibitors ) , ( amines ) ( nitrates )
( overetching ) ( pitting )
Hydrochloric acid 55 vol %
Inhibitor ( optional )
Temperature room
26/83

Time 1/2 ~ 1 min

Fe 5 oz / galCu 0.5 oz / gal
Sulfuric acid 25 vol %
Inhibitor ( optional ) as required
Temperature room
Time upto 10 min
( lead - lined )
(3) 400 pH
Ferric sulfate anhydrous 8.5 ~ 13.5 oz / gal
Hydrofluoric acid 1.5 ~ 2.5 oz / gal
Temperature 125 ~ 135 F
Time 1 ~ 5 min
Sodium chloride 2 ~ 4 oz / gal
Sulfuric acid 12 ~ 27 oz / gal
Temperature 160 ~ 180 F
Time min
Sulfuric acid 2 ~ 3 oz / gal
Potassium nitrate 2 ~ 3 oz / gal
Temperature 160 F
Time 5 ~15 min
( loosen heavy )
Potassium permanganate 8 ~ 12 oz / gal
Sodium hydroxide 8 ~ 12 oz / gal
Temperature 160 F to
Time 30 min
(1)(2)
(4)
Sulfuric acid 10 ~ 15 oz / gal
25 ~ 30 oz / gal
Nitric acid 4 ~ 5 oz / gal
Hydrofluoric 12 ~ 15 oz / gal
(5) ( bright dips )
Citric acid 10 ~ 12 oz / gal
ammonia pH 65 ~ 7
Oxalic acid 1 ~ 2 oz / gal
Hydrogen 0.5 oz / gal
Sulfate as brightener

3.9.11
(1) ( heavy scale )
Sulfuric acid 55 ~ 80 oz / gal
Nitric acid 10 ~ 15 oz / gal
27/83

Temperature room
3 oz / gal
(2) ( moderate scales )
Sulfutic acid 20 ~ 30 oz / gal
Chromic acid 3 ~ 4 oz / gal
Sodium dichromate 45 ~ 6 oz / gal
Temperature room
2 oz / gal
(3) ( light scales )
Sulfuric acid 19 ~ 26 oz / gal
Temperature room ~ 125 F
4 oz / gal
(4) 0.7 % Pb
Fluboric acid 15 ~ 24 oz / gal
Temperature room
1.5 oz / gal
5 % hydrogen peroxide
(5) ( circuit board )
Ammomium persulfate 32 vol %
Temperature room to 100 F
Nitric acid 30 ~ 36 oz / gal
Phosphoric acid 20 ~ 25 oz / gal
Temperature room to 100 F
(6) ( bright dipping )
Sulfuric acid 90 ~ 110 oz / gal
Nitric acid 20 ~ 25 oz / agl
water 33 vol %
Sodium chloride 0.25 oz / gal
( spotting )
Phosphoric acid ( 85 % ) 55 vol %
Nitric acid ( 40 Be^-1 ) 20 vol %
Acetic acid ( 98 % ) 25 vol %
Temperature 130 ~ 75 F
Sodium cyanide 4 ~ 6 oz /gal
Temperature 120 ~ 150 F

3.9.12

(substrate )
( scale loosening )
28/83

(1) ( scale loosening )

Sodium hydroxide NaOH 20 ~ 25 oz / agl
Sodium carbonate ( anhydrous ) 25 oz / gal
Potassium permanganate 6 ~ 8 oz / agl
Temperature 190 F
Sodium carbonate 20 oz / gal
Sodium hydroxide 5 oz / gal
Potassium permanganate 12 oz / gal
Temperature 190 F
Sulfuric acid 10 vol %
Temperature 180 F
(2) ( pickling )
Nitric acid 30 ~ 65 oz / gal
Hydrofluoric acid 4 vol %
Ammonium bifluoride 6.7 oz / gal
Temperature 120 ~ 140 F
Time 30 min
Dissolved metal Fe 3 oz / gal
(3)
Sulfuric acid 6.25 vol %
Hydrofluoric acid 6.25 vol %
Chromic acid 8 oz / gal
Temperature 180 F
Ferric sulfate 9 ~ 13 oz / gal
Hydrofluoric acid 1.7 vol %
Temperature 125 ~ 135 F
Sulfuric acid 10 oz / gal
Ferric sulfate 0.25 oz / gal
Temperature 160 ~ 180 F
Nitric acid 45 ~ 70 oz / gal
Molybdic acid 0.35 ~ 0.5 oz / agl
( foreign metals )
3.10
,,,(clearness),
300 .(cavitation)(implosion) ,
.
3.10.1
(1) :,,
10^c,.
29/83

(2) :,,
(wetting agent),.
(3) (surface tension)
(cavitation density).
(4) (viscosity).
(5) (ultrasonic power),.
(6) (frequency), 21~45kHz.
(7) (part exposure),, 1.
(gas pockets).,2.,,
,3.(baskets or fixtures for holding parts).
(8) (contaminants):
1.(soluble contaminamts).
2.(non-soluble,held by soluble binder contaminanys)
.).
3.(non-soluble contaminants).
(9) (cleaning chemical).
(10) (equipments).
3.10.2
:
, ,,
,,<
>(cavitation).
,,,
.,,,
.
:
(1):,,.
(2):,.
(3):,,
.
(4):,,.
(5):,,.
3.11 (Water Rinsing)
.,,.
(1)(rinsing equation)
D*Ct=F*Cr
D=(dragin)
Ct=(concentration of dragin)
F=(flow throufgh the rinsingtank)
Cr=(concentration in the rinse)
,(salt in)=(salt out).
(2)(effectivity of the rinse)E,
E=(F*Cr)/(D*Ct)
(3)(rinsing concentration ratio)Rc,
Rc=Ct/Cr
30/83

(4)(concentration limit)
.
(5)(flow of water throught a rining tan)
F=D*Ct/Cr
F=Rc*D
(6)(volume rining ratio)Rv,
Rv=F/D=====> E=Rv/Rc
(7)(multiple rining),,,
.
(8).
(9)(automatic control),(conductivity)(controller)
(rinse tank
controller) Cr F,
F=K*D
K
(10),,
:
1. .
2..
3..
3.12
,.,,,
,,.,
. 2~12 ,,
,., ,
,..,,,,
,:1. 2.
3. 4. 5. 6. 7.
.
3.14.4 (buffing)
(1)(hard buffing)
(2)(color buffing)
(3)(contact buffing)
(4)Mush buffing.
3.14.5 (buffing wheels)
:
(1)Bish buff
(2)Finger buff
(3)Full-disk buff
(4)Peced buff
(5)Finnel and sisal buffs
3.14.6 (buffing componds)
(1)Tripoli compound:
(2)Bobbing compounds:
31/83

(3)Cut or cutdown compounds:

(4)Cut and color compounds.
(5)Cut or color compounds.
(6)Stainless stell buffing compounds.
(7)Stell buffing compounds.
(8)Chromium buffing compounds.
(9)Rough compounds.
(10)Emery paste.
(11)Greaseless compounds.
(12)Liquid buffing compounds.
3.14.7
(1)Rotary automatic machines.
(2)Straight-line machines.
(3)Reciprocating straight-line machines.
(4)Horizontal return straight-line machines.
(5)Oversal or modular rectangular type straight-line equipment.
3.14.8 (automation of polishing and buffing)
,,
.
(1),(2),(3),(4),(5),(6) ,
,,(program- mable controller)(robots).
3.15 (Mass Finishing)
(1) :
1.
2.
3.
4.
5.
6.,
(2) :
1.
2.
3.15.1
(1)(barrel finishing)
(2)(vibratory finishing)
(3)Centrifugal Disc finishing
(4)Centrifugal Barrel finishing
(5) Spindle finishing
3.15.2
(1),,
(2)
(3)
(4)
32/83

(5)()
(6)()
(7)
(8)
3.15.3
(1)Open-end, tilting
(2)Bottienecked
(3)Horizontal actagonal
(4)Triple-action,polygonal
(5)Multiple drums
(6)Multi-compartment
(7)Endtoading
(8)Submerged
(media):
(1)(complexity)
(2)(possibility of media lodging)
(3)(possibility of parts nesting)
(4)
3.15.4
(1) :
1.
2.(batch size)
3.
4.(variety of parts)
5.
6.
(2) :
1.
2.
3.
4.
5.
6.
7.
(3)
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
33/83

12.
13.
14.
3.15.5 (mass finishing compounds)
(1) :
1.
2. ph ,
3.
4.
5.(tarnish)
6.
7.
8.(lubricity)
9.
10.
11.
(2) :,:
1.(batch)
2.(recirculation)
3.(flow-through)
3.15.6 (finishing media)
:1.(abrade),2.(burnish),3.(
separate)
1.natural media
2.agricultural)
3.(synthetic media):
4.(ceramic media)
5.(resin-boned media)
6.(steel media)
(1) :
1.
2.
3.
4.
(2) :
1.
2.
3.
(3) :
1.
2.
3.(reclassificatiopn)
4.(break)
5.(cushioning action)
3.15.7
34/83

(1)(excessive impingement)
1.
2.
3.
4.
5.
6.
7.
8.
(2):
1.
2.
3.
4.
5.
6.
(3):
1.
2.
3.
4.
1.
2.
3.
4.
5.
6.
3.16 (abrasive blast cleaning)
(conditjoning)
:
(1)
(2)
(3)
(4)(matte surface treatment)
(5)(flash)
(6)
(dry blast cleaning)(wet blast cleaning)
3.16.1 (dry blast cleaning)
:
1.(metallic grit)
2.(metallic shot)
3.(sand)
4.(glass)
5.(agricultural products)
3.16.2
:
35/83

(1)Cabinet mechine
(2)Continuous-flow mechines
(3)Blasting-tumbling mechines
(4)Portable Equipments
(5)Microabrasive Blasting machines
3.16.3 (wet blast cleaning)
:
(1)(burrs)
(2)(matle surface treatment)
(3)
(4)(tool marks)
(5)
(6)
(7)(welding scale)
3.16.4 (Abrasives)
20-mesh 500-mesh,:1.
,,2.
3.16.5 (liquid carrier)
(1)
(2)
(3)
(4) (anticlogging)
(5) ((antisettling)
(6)
3.16.6
(1) Cabinet-type mechines
(2) Horizpntal-plane turntable mechines
(3) Vertical wheel-type mechines
(4) Chain or belt conveyor mechines
(5) Shutte-type cabinets with cars and rail extensions
3.16.7
,,
, x- x
,,,,,,

3.17
(1) ASTM A380 Descaling and Cleaning of Stainlrss
Steel surfaces.
(2)ASTM B183 Preparation of Low Carbon
Steel for Electroplating.
(3)ASTM B242 Preparation of High-Carbon
Stell for Electroplating.
(4)ASTM B252 Preparation of zinc-based
die castings for Electroplating.
(5)ASTM B253 Preparation of and Electro36/83

plating on Aluminum alloys.

(6)ASTM B254 Preparation of and Electroplating on Stainless Steel.
(7)ASTM B281 Preparation of Copper and
Copper-Based Alloys for Electroplating.
(8)ASTM B319 Preparation of Lead and
Lead Alloys for Electroplating.
(9)ASTM B480 Preparation of Magnesium
and Magnesium Alloys for Electroplating.
(10)ASTM B322 Cleaning Metals before
Electroplating.

Baths)

4.1

4.2

4.4 (Copper Cyanide Baths)

(Copper Fluoborate Bath)

4.7

()

4.3 (Copper Sulfate

4.5
4.8

4.6
4.9

4.10

4.1

63.54

29

1
S22S22P63d104S1

8.94

1083

2582

Brinell 43-103

1.673 l W -cm20

220420MPa

12. Cu++e- Cu 0.52

Cu++ 2e-Cu 0.34V

37/83

4.2

1.

2.

38/83

P.S

4.3 (Copper Sulfate Baths)

(prepare)(operate) (printed
circuits)(electronics) (photogravure)(electroforming)(decorative)
(plating on plastics)

(strike)
(replacement diposits)

(0.02 0.08wtP) (copper anode nuggets)
(titanium baskets) (anode bag) 21
100

4.3.1 (standard acid copper plating)

(1)(general formulation)

Copper sulfate 195-248 g/l

Sulfuric acid 30-75 g/l
Chloride 50-120 ppm
Current density 20-100 ASF

(2)(semibright plating)Clifton-Phillips

39/83

Copper Sulfate 248 g/l

Sulfuric acid 11 g/l
Chloride 50-120 ppm
Thiourea 0.00075 g/l
Wetting agent 0.2 g/l
(3)(bright plating)beaver

Copper sulfate 210 g/l

Sulfuric 60 g/l
Chloride 50-120 ppm
Thiourea 0.1 g/l
Dextrin 0.01 g/l

(4)(bright plating)Clifton-Phillips

Copper sulfate 199 g/l

Sulfuric acid 30 g/l
Chloride 50-120 ppm
Thiourea 0.375 g/l
Wolasses 0.75 g/l

4.3.2 (High Throw Bath)

Copper sulfate 60-90 g/l

Sulfuric acid 172-217 g/l
Chloride 50-100 ppm
Proprietary additive

40/83

4.3.3
(Maintenance and Control)
1.
100
(polarization)
(throwing power)
110 11vol

(striated deposits)
# (plating range)
50
(electroforming)
# (solution jet)
(allowable current density)
# :(brighteners)
(stopoffs)(resists)
(potassium
permanganate)(cellulose filter)

(antimony)10-80 g/l(gelatin)(tannin)
(codeposition)
(arsenic)20-100 ppm
(bismuth)
(cadmium)500ppm
(immersion deposit)
1000 ppm
1000 ppm
500-1500ppm
500ppm
4.3.4
1.

2.
41/83

3.

4.

5.

6.

4.3.5

42/83

4.4 (Copper Cyanide Baths)

(free cyanide)(total cyanide)

K2Cu(CN)3 1.45
K2Cu(CN)3 1.1
: 2.0g/l 0.5g/l
2.01.450.53.4g/l

11 12
4.4.1 ()
(coprous cyanide)CuCN 20g/l
(sodium cyanide)NaCN 30g/l
(sodium carbonate)Na2CO3 15g/l
pH 11.5
40
3060
0.51A/cm2
4.4.2
(coprous cyanide)CuCN 60g/l
(sodium cyanide)NaCN 70g/l
(sodium hydroxide)NaOH 1020g/l
(free cyanide) 515g/l
pH 12.4
6070
12A/dm2
8090
4.4.3
CuCN 120g/l
NaCN 135g/l
NaOH 42g/l
Brightener 15g/l
free sodium cyanide) 3.75
11.25g/l
pH 12.412.6
7885
1.211A/dm2
9099
4.4.4
CuCN 60g/l
KCN 94g/l
43/83

 15g/l
KOH 40g/l
515g/l
pH 13
7885
37A/dm2
95
4.4.5

4.4.6
(Rochelle cyanide Buths)
CuCN 26g/l
NaCN 35g/l
Na2CO3 30g/l
NaKC4H4O66H2O 45g/l
510g/l
pH 12.412.8
6070
1.56A/d
5070

4.4.7
1.NaCu(CN)2 Na2Cu(CN)3
CuCNNaCNNaCu(CN)2 CuCN2NaCNNa2Cu(CN)3 Na2Cu(CN)3 ? 2Na + (aq)
+Cu(CN)3-(aq) Na2Cu(CN)3 ? 2Na+ (aq) +Cu(CN)3-(aq) Cu(CN)3- ? Cu++3CN- Cu(CN)2- ?
Cu++2CN Cu(CN)2- Cu(CN)3-

2. NaCNKCN

3.
44/83

4.
5.
6. Cu

7. 0.002g/l
8. 0.005g/l
9.
10.
10.

11. (0.20.4A/d )
12.

13.
14.
4.4.8
(1)
2.
(2)
(3)
(4)
4.4.9
1.

2.

3.

45/83

4.

4.4.10
(1)
NaCN 6589g/l
CuCN 4560g/l
Na2CO3 15g/l
NaOH 7.522.5g/l
(rochelle salt) 45g/l
1522.5g/l
6070
(2)
KCN 80110g/l
CuCN 4560g/l
K2CO3 15g/l
KOH 7.522.5g/l
(rochelle salt) 45g/l
1222.5g/l
6070
4.4.11
1.
(1) 0.0150.03g/l
(2) 1.92g/l
(3) 0.10.5g/l
(4) NaOH 0.050.1g/l
(5) NaOH 11.5g/l
(6) 310g/l
2.
(1)PR
a. 35 15
b. 15 5
(2)
a. 25 10
46/83

b. 20 6 1.2510cycle
(3)
4.5

P2O7Cu 101
(strike)
4.5.1 (Strike Bath)
Cu2P2O73H2O 2530g/l
K2P2O7 95.7176g/l
potassium nitrate 1.53g/l
Ammonium Hydroxide 1/21ml/l
pH 88.5
2230
0.61.5A/d


910.7g/l
63107g/l
P2O7/Cu 710.1
4.5.2 (Printed Circuit Bath)
Cu2P2O73H2O 57.873.3g/l
K2P2O7 231316.5g/l
8.215.8g/l
2.77.5m1/1

pH 88.4
4954
2.56A/d

4.5.3
1.
(1)(ammonia)
(2)(nitrate)
(3)pH
2. 60(ortho phosphate )
3.
4.


47/83

5.pH
4.6 (Copper Fluoborate Bath)
(plating
speed)(hard rubber)polypropylene PVC

4.6.1
Cu2P2O73H2O 57.873.3g/l
K2P2O7 231316.5g/l
8.215.8g/l
2.77.5m1/1

pH 88.4
4954
2.56A/d

(edge effects)

4.6.2

100

:
1.
(R) (R) (R) (R) (R) (R) (R)
1.
(R) (R) (R) (R) (R) (R) (R) (R)
(R) (R) (R) (R) (R) (R) (R)

48/83

4.7
4.8
(1)
CrO3 200300g/l
(NH4)2SO4 80100g/l

(2)
NaNO3 800100g/l
24A/d

4.9 ()
(1)
1863869 3084112 2287654 2347448
2255057 2451340 2451341 2680710
2854389 2774728 3021266 3030282
3111465 3179577 3219560 3216913
3269925 3309292 3296101 2701234
2861927 2861928 2885331 3532610

(2)

2525943 2853443 2954331 2799634

2294053 2391289 2842488 2798040
3000800 2563360 2455554 2882209
2733198 3051634 2462870 2840518
2871173 2972572 3288690 2317350
2852450 2363973 2400518 2482350
3267010

(3)

2081121 2250556 2437865 2493092

3157586 3161575 2871171 3660251

4.10

49/83


1.
2.
3.
4.
5.
6.
7.
8.
9.

43 1818

72 3065

35 1217

49 3540

49 7677
62 2628

79 4270

80 3639

84 7274
10.

44

2931

5.1
(1) :,
(2) :FCC
(3) :8.908
(4) :58.69
(5) :28
(6) :1S^2 2S^2 2P^6 3S^2 3P^6 3d^8 4S^2
(7) :1457 C
(8) :2730 C
(9) :6.84 uohs-cm
(10) :317 Mpa
(11)
(12) , 600 C
(13)
(14) ,
(15) ,
(16)
(17) -0.25 ,,

(18)
(19)
5.2
,

(1)

,(record
stampers),(printing screens) Ni+2e-Ni, Ni
100% ,
50/83

Ni pH (drag-out) Ni ,
, pH

5.3
( 5.4),(nickel sulfate)(nickel chloride)
(boric acid) Ni ,,
(anti-pitting)(wetting agent)
,
,,
(wattsath)
5.4
(fully-bright nickel)(semi-bright nickel)
(satin-like nickel) 0.06~0.1,,
benzene sulfonamide, enzene disulfonic acid,benzene
trisulfonic acid, napthalene trisulfonic acid
(leveling agent) formaldehyde, comarin, ethylene cyanohydrin
butynediol,
(codeposition),(selenium),
,,
(duplex nickel)
1:3(10),(0.15)
(triple layer nickel),
5.5 (Engineering Nickel Plating)
,
(defect-free)
:1.(tensile strength), 2.(elongation),3.(hardness),
4.(internal), 5.(fatigue life), 6. (hydrogen embrittlement),
,
,,

,
5.6
(1) (watts bath) NiSO47H2O
NiCl26H2O
60g/l

H3BO3
37.5g/l
pH
3

60C

430A/m^2
(2) (all-chloride bath)
(NiCl26H2O)
300g/l

H3BO3
37.5g/l
pH
3
51/83

300g/l


430A/m^2
(3) Sulfamate
Nickel Sulfamate Ni(H2NSO3)2

pH

400g/l
30g/l
4.5
57C
430A/m^2

5.7
(tensile strength):,
,pH ,
(elongation):, 55C
, 55C , pH
(hardness):, 55C , 55C
(internal stress):,,

6.1.
(1) :
(2) : 51996
(3) : 72
(4) : 1900 C
(5) : 800~10OOHB
(6) : 071
(7)
(8) ,,
(9)
(10)
(11) 480"C 50O 700"C
(12)
(13)
(14),

(15)

(16).
6.2
1.
2.
3.
5.
6.
7.
8.
9.
52/83

63
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)( 50-100% ) 2-3

64
(l) CrO3
(2)
(3) CrO3
(4)

(5)
1.
2.
3.
4.
(6)
1.
2.
3.
4.

5.
(7)
1. ,
10g/l
2. 3g/l
3.
(8)
1.
2.
3.
4.

5.

53/83

65 (Rack)

(l)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
66
(l)
1.
2.
3.
4.
5.
6.
(2)
1.
2.
3.
4.
(3)
1.
2.
3.
(4)
1
2
3
(5)
1.
2.
3.
4.
5.
(6)
1.
2.
3.
(7)
54/83

1.
2.
3.
4.
5.
6.

67

68
(1)
1.
2.
3.
4.
5. 15 J30
6.
(2)
1.
2.
(3)
1. (Zn Fe Cu Nj )
2.
3.
(4)
1.
2.
3.
4.
5.
69
,

(1)
(4)
(2)
(5)
(3)
:

55/83

(l) (stress relieving) :

(residual stre6s) 150 230"C
(2) (baking) : QQ-C-320B Mil-S-13165
610
( destroy ) :
(1)
(6) '
(2)
(7)
(3)
(8)
(4)
(9)
(5)
:
(1)
(4)
(2)
(5) (drag-in)
(3) (cupping action)
611
[pistonrings )
(cylinder bores) , 0.004 (porous)
(seizing) ( galling)
:
(I)
(2)
(3)

9.1
(1):118.69.
(2):50.
(3):1S22S22P63S23P63D104S24P64D105S25P2.
(4):231.9
(5):2270
(6):5.77( aSn) 7.29( bSn)
(7):13.2
(8):11.5
(9):15% IACS
(10):14 MPa
(11):Brinell 10kg , 20
(12)
(simple cubic)
BCT (body-centered tetragonal)
(13)
Sn+ + 2e Sn -0.136V
Sn4+ 2e Sn2+ +0.15 V
56/83

Sn(OH)=6 2e Sn(OH)4 2OH 0.9V

Sn(OH)=4 2e Sn 4OH 0.79V
, , 2
4 , , SnO2 .
xH2O , SnCl2 SnCl2 .2H2O,SnSO4 , Sn(BF4)2,K2(OH)6 N2Sn(OH)6.
9.2
(1):,,,
,,.
(2):,,.
(3):.
(4):,,.
(5).
9.3
(1)
:
1,.
2,,.
3,.
4.
5.
:
1.
2,.
3.
4,.
5,.
(2)
:
1. 5.
2. 6.
3. 7.
4.
:
1,.
2,.
3.
4,.
5.
6.
7,.
(3):.
9.4
,,,,
,,,,.
.
57/83

:
(1),.
(2),, sno2 .
(3), OH-.
(4), Sn++,.
(5),.
9.5
(1),,,.
(2),,,.
(3),.,.
(4),,,,
.
(5).
(6),.
(7),,.
(8),.
(9) 89~90,.
(10),,,.
9.6
(1)
90 g/l
7.5 g/l
0~15 g/l
g/l
60~80 g/l
4~8 Volt
37.5 g/l
PH 0.2
3~11 A/dm2
100%
2:1

6 Volt
(2)
SnSo4 54~69 g/l
100~75 g/l
C7H6OH.HSO3 100~120 g/l
B- 1~1.25 g/l
2~2.5 g/l
25
27~32 A/dm2
100
1:1

58/83

 6~12 Volt
9.8
SnCl2 63 g/l
NaF 25 g/l
KHF2 50 g/l
NaCl 45 g/l
45 A/dm2
PH 2.7
end 58202204

10.1
(1) 47
(2) 107.868
(3) 10.491g/cm3
(4) 960.8
(5) 2212
(6) 159-cm3
(7) FCC
(8) 0.7991V
(9) 1
(10)
(11) 80120Vicker
(12)
(13)
(14)
(15)
10.3 Silver Strike
(noble)
(free cyanide)
(double strike)(strike plating)(immersion deposit)
825
1535

1 (first strike)
2 (second strike)
10.4 Silver Plating
(decorative silver plating)(enginee-ring silver plating)
(semi-conductor
components)
59/83

(heavy-duty bearings)(galling)(seizing)
(sealing)(anodes) 999 (anode bag)
(black anodes) pH
(free cyanide)(bismuth)(antimony)(selenium)(tellurium)
(platinum) 100

10.5 Postplate Treatments

(tarnishes) (sulfide stain)
(soderability)(contact resistance)
(overlays)(rhodium) (passivation
treatments)(chromating)(beryllium)(colloidal)
10.6 Brighteners

(1) (carbon disulfide)0.010.02mg/1

(2) ()0.31.5g/1
(3) (60)12mg/1
(4)
(5) VA VIA (SeBiSb)(complex)
(electrical properties)(antimony)(selenium)

10.7 Formulation
(1) (tranditional electrolyte)
(2) (high speed baths)
(3) (non-cyanide systems)
10.8
(1)
(2) (polarization)
(3)
(4)
(5)
(6)
(7)
(8)
(9)

10.9
(free cyanide)

60/83

10.10

2666738 2777810 2613179 2735808

2735809 2850419 3410703 3567782

11.1
1.:79
2.:196.9665
3.:FCC
4.:1063
5.:2809
6.:19.302g/cm
7.:2.06-cm
8.:124MPA
9.:25Vickers
10.:+1.68
11.:+1 +3
12.,,
13.,,
14.
15.,,,,
,, 250,,
,,
16.,

17.,
18.,
11.2
, K ,
,,,,,,,
,,,

11.3
1.:
2.:
3.:,,,,,(10% KCN )
4.:,
5.:
11.4
1.:
2.:,,,
3.:,
4.:
11.5
61/83

1.:
2.:
3.
4.
5.:

(ALLOY Plating)

12.1

(complexing agents)
200mV (codeposit)
(1)
(2)
(3)
(4) pH
(5)
12.2

(1)
(2) ,(Inert anodes)
(3) ,
(4)
(5)
(6)
12.3 (Brass Plating)
,.
:
,70~80%:
Copper Cyanide 32g/l
Zinc Cyanide 10g/l Sodium Carbonate 7.5g/l
Ammonia 2.5-5ml/l
pH 10-10.2 Sodium Cyanide 50g/l
25-35C
2.2A/dm^2

,, pH
62/83

12.4
.(Nitriding)
...:
Copper Cyanide 30g/l
Potassium stannate 10g/l Potassium Cyanide 67.5g/l
Potassium Hydroxide 11.3g/l
Rochelle Salts 45g/l
145-160F
1-100A/ft^2

12.5 (Nickel-Iron Plating)
:
Nickel Sulfate 37.5-225g/l
Nickel Sulfate 75-225g/l
Boric Acid 45-52.5g/l
Ferrous Sulfate 7.5-75g/l
pH 3-4
43-71C
0.54-10.8A/dm^2



12.6 (Tin-Nickel Plating)
:
Stannous Chloride 49g/l
Nickel Sulfate 300g/l
Ammonium Bifluoride 56g/l
Ammonoium Hedroxide pH2-2.5
65-71
100-300A/m^2

12.7
()

1 103 69
2 61 69
3 61 75
4 72 49
5 79 42
6 Fe-Cr-Ni 3 10
7 11 23
8 Ni-Fe 33 25
63/83

9 35 12
10 Ni-Fe 75 67

13.1 13.2 13.3 13.4 13.5 13.6 13.7

13.8 13.8.1 13.8.2 13.8.3 13.8.4
13.8.5
13
13.1 (Barrel plating)
,,,,
.,.,.
,,.(1),(2)
,(3),(4),(5),(6),(7),(8),(9)
..
13.2 (Brush Plating)
(brush plating)(stylus plating),(contact plating)(repair
plating).(selective plating),,
,,.
,,."
13.3 (Hot Dipping)
.,
.,.
,.:
(1)(coating composition)
(2)(bath temperature)
(3)(time of immersion)
(4)(rate of cooling)
(5)(reheating)
:
(1)(tensile strenghth):
(2)(yied strenghth):
(3)(weld stress): 50-60%
(4)(formability):
(5)(fatique strenghth):
(6)(hydrogen embrittlement):
(7)(intercrystalline cracking):
13.4 (Mechanical Plating)
(peen plating)(impact plating). (mechanical
energy)(cold welding).(zine),
(cadmium),(tin),(lead)(copper),(brass)(aluminum),(parts),,
(surface conditioner),(metal powders),( promoter chemicals)
(impact beads)(barrel)(exch

64/83

14.1 (Electroless Plating)

(chemical plating)(autocatalytic plating)
(substrate)
ASTM B374 Autocatalytic plating deposition of a metallic coating by a
controlled chemical reduction that is catalyzed by the metal or alloy being deposited
(process)(immersion plating)(continu-ous)
(autocatalytic)
14.2

1. (throwing power)
(nodular deposits )
2.
3.
4 ()
5
6 (co-deposit)(polyalloy)
7
8
9
10

1.
2.()
3.

1.
2.
3.
4.
5.
14.3
1.(metal ions)
2.(reducing agent)
3. (catalyst)
4.(complexing agent)
5. (stabilizer)
6. (buffer) pH
7.(wetting agent)
8.(brightener)
14.4
1.
65/83

2.

3.pH
4.

5.
6.
14.6 (Electroless Nickel)

0.0020.005 23

14.6.1
(1) (Alkaline, Nickel-Phosphorus)
(2) (Acid, Nickel-Phosphorus)
(3) (Alkaline, Nickel-Boron)
(4) (Acid, Nickel-Boron)
(reducing agent)(Sodium Hypophosphite)
DBAB(n-Dimthylamine Borane)DEAB(n-Diethylamine Borane)(Sodium
Borohydride )(Hydrazine)
14.6.2 -
(soiderability)
(corrosion protection)(adhesion) pH
700VHN

1 -(High-Temperature, Alkaline, Electroless

Nickel-phosphorous Bath)
(Acid Nickel- Phosphorous Electroless Bath) 8894Ni
612P 7793pH4.45.2pH P
pH P P P
P 8 500600VHN 1 400
(post-heat-treatment) 950 VHN (Hydrogen Embrittlement) 116
(post-baking)
(tensile strength)(electrical conductivity) 250
(discolor)(lnert)
2.5250m
(Alkaline Nickel- Boron Electroless Bath)
(Sodium Borohydride) 569495
pH 12 9095pH 1214
4001 (post-heat treatment) 1200VHN
650750VHN
66/83

(Acid Nickel-Boron Electroless Bath)

DMAB DEAM 0.10.4 1
6577pH 4.87.5 1350
14.6.7

14.7 (Electroless Copper)

ABSPEPPPVC(Epoxy)
(circuit boards)(through-hole plating)EMI/RFI Shielding
14.7.1

(1)
(2) (Formaldehyde)
(3) EDTA
(4) SSeSCNCN

(5) pHpH pH
pH 1213 pH (14 )pH 9.5

pH

14.8 (Electroless Palladium)

(tarnish resistance)
(electronic switch contacts)
14.9 (Electroless Cobalt)
(Thin Electroless Cobalt Deposits)
(magne-tic properties)

67/83

(Electroless Metal Composites and Polyalloys)

(diamond)(ceramics)(Chromium Carbide)(Silicon
Carbide)(Aluminum Oxide)(Co-deposit)

(chemical vesistance)(high temper-ature resistance)(electrical

conductivity)(ma-gnetic and non-magnetic properties) Ni-Co-Fe-P
Ni-Fe-PNi-Co-PNi-Fe-BNi-W-PNi-Mo-BNi-WSn-P Ni-Cu-P
14.10 (Immersion Plating)
(Displacement Deposition or Cementation)
(nonadherent)(powdery)

15.1 (Method of Metalizing Nonconductors)
(Electroplating)(vacuum metalizing)
(cathode sputtering)(metal spraying),
(roughening)(interlocking surface)
1.(Bronzing),(binder),
,
2.(Graphiting)(wax)(rubber)(polymers)

3.(Metallic paints)(Flux)(fire)

4.(Metalizing)(metallic coating)
(Formaldehyde)
(Hydrazine)

15.2 (Plastic Plating)

1.
1. 5.
2.
6.
3.
7.
4.
2.
1.
2.
3.
4.
5.
(3)
68/83

15.4
(1)(cleaning)

(2)(solvent treatment)(wetting)(conditioner)

(3)(conditioning)

(4)(sensitization)(Stannous Chloride)
Sn^++
(5)(nucleation)()
(seed)

Sn+ + Pd+ Sn4+ + Pd

Sn+ +2Ag+ Sn4+ +2Ag
15.5
1.
1~2% . 40-65C 1~2

2. (conditioning)
1
CrO3 20 g/l
H2SO4 1.84 600cc/l
60
15~30
2
CrO3 20 g/l
H3PO3 100 cc/l
H2SO4 500 cc/l
69
10~20
3. (sensitizing) :
SnCL2 20~40 g/l
HCl 10~20 cc/l
4. (nucleation) (activating)
1
PdCL2 0.1~0.3g/l
HCl 3~5 cc/l
2
AgNO3 0.5~5 g/l

69/83

3
AuCL3 0.5~1 g/l
HCl 1~4 cc/l

16.1

1.(corrosion resistance):,
2.(paint adhesion) :
3.:,,,
,(interlocking)
4.(decorative appearance):,,

5.(electrical insulation):,
(capasitor)
6.(photographic substrates):,(light-sensitive
materials)(photographic film)
7.(emissivity and reflectivity)(aerospace),(electronics)(machinery)

8.(abrasion resistance),(-4~10)(hard
anodic coating),(gears),(pistons),(fanblade),(fuel
nozzles)
9.(surface analysis):(chromic acid)(surface
flaw)(metallurgical characteristics)
16.2
1.(conventional sulfuric acid anodizing electrolyte):
(protective), 2.5~30m
:
:H2SO4 12~25wt%
21
260A/m
12~22V
(chromic acid anodizing Electrolyte),
,, 10m,
chromic acid 3~10%
40
(30 ) 0~40V
0.3~0.5A/dm2
(phosphoric acid anodizing Electrolyte),
,
Phosphoric acid 3~20 Vol %
30~35
50~60V
15~30min
(hard anodizing Electrolyte)
250m ,
70/83

 Sulfuric acid 15Vol

temperature 0~3
current density 2~2.5A/dm2
20~60V
60~200
(oxalic acid anodixing Electrolyte)(yellow coatings)
,
3~10 wt%
24~35
1~2 A/dm
40~60
(boric acid anodizing Electrolyte)(electrical
capacitors) ,(Citrates)(Tastrates)(sulfonated Organic
Acid ),(bronze)(gold),(gray),
(dense)(hard)
16.3 (colring Anodic Coating )
(Electrolytic procedure),(organic dyes),(inorganic
pigments)(Electrolytically deposited metal)
16.4 (sealing )
(postanodizing treatment) ,(pores)
(nonabsorptive)
(sealing process) (dissolution)(hydroxide)(repreci pitation)

16.5
1.(electrical contact):,
2.(racks):,(overheating)(arcing),
(caustic soda)
3.(coolin)(agitation),,(operating
temperature)(cooling coil )(heat exchanger),

4.(tank linigs):316 ,(antimonial lead ),(Tellurium Lead)

,(inert lining)(rubber),(plastic),(Glass)
5.(power supply):(motor generators)(rectifiers)
, 24v, 100v,
(constant current and voltage )
6.(fume removal):

17.1
(electrochemical)(compound of the
metal)(coating).(corrosion protection)(paint bonding)
(metal coloring)(chemical polishing).

1.(Chromate conversion coatings)

2.(Phosphate conversion coating)
3.(Colaring of metals)
4.(Chemical polishing
71/83

17.2 (Chromate Conversion Coatings)

(Zinc),(Cadmium),(Silver),(Copper),(Brass),(Tin).
,(Zinc Die-cast) .
(immersion)(spraying),(brushing)(
electrolytic method).
17.3
1.(Effect of bases Metals)
2.pH (Effects of pH)
3.(Hexavalent Chromium Concentration)
4.(Activators)
5.(Treatment Time)
6.(Solution Temperature)
7.(Solution Agitation)
8.(Solution Contamination)
9.(Rinsing)
10.(Drying)
17.3.2 (Evaluation)
1.(visual test): ,(uniformity),(smoothness),
(adhesion)(iridescence).
2.(accelerated corrosion tests): ASTM B-117

3.(humidity tests): (marine atmospherp).

4.(water tests):
5.(chemical analysis):
6.(spot tests):
7.(performance tests for organic finishes):
(pencil-hardness)(tape tests)(bending tests)(impect
tests)
17.3.3
(immersion processes).
(Chromates),(Phosphates),(Fluorides), 100~200V
,(hardness),(heat resistance),(thickness),
(dielectric strength).(dark green).
17.4 (Phospate Coatings)
(metal substrates)(non-metallic)
(non-conductive).:
1.(precondition surfaces),(receive)(retain)
(under-paint corrosion).
2.(plastic coatings)(bonding).
3.(metal forming operation)(precondition),.
(wax)(rust-preventive oils)
17.4.1 (Mechanism)
(metal phosphates),(mineral acids),
72/83

,(pickling),,,,
.(activators)
(modify microcrystalline structure)(nitrates),
(peroxides).:
12Fe+8NaH2PO4+10H2O+7O2---2Fe3(PO4)2*8H2O+2Fe3O4+4Na2HPO4
Fe+2H3PO4---Fe(H2PO4)+H2
3Zn(H2PO4)---Zn3(PO4)+4H2O
2Zn(H2PO4)2+Fe(H2PO4)+4H2O---Zn2Fe(PO4)2*4H2O+4H3PO4
17.4.2

Clean Phosphating Rinse Acidified Dry off
17.4.3 (no
1.(non-alkaline condition).
2.(uniformity).
3..
4.(micro-cavities),(interlocking),(hold and retain)
.
5.(scoring and scratching).
6.(electrochemical and scratching).
7..
8..

,,,
:
1.;,, o
2...,,, o
3.,. o
4.: o
,(recovery), (desyruction)
o

.., ,
o , o

,,, o
:
(1) : (FeSO4 . 7H2O).(NaHSO3).
Cr^+6 Cr^+3 o
1.
2H2CrO4+6FeSO4.7H2O+6H2SO4 <---> Cr2(SO4)3+3Fe2(SO4)3+50H2O
Na2Cr2O7+6FeSO4.7H2O+7H2SO4 <---> r2(SO4)3+3Fe2(SO4)3+Na2SO4+49H2O
2.
NaHSO3 <---> Na^+ + HSO3^73/83

HSO^3- + H2O <---> H3SO3 + OH^2H2CrO4+3H2SO3 <---> Cr2(CO4)3+5H2O

3.
SO2+H2O<--->H2SO3
2CrO3+3H2SO3<--->Cr2(SO4)3+3H2O
2H2CrO4+3SO2<--->Cr2(SO4)3+2H2O
(2)
1.
2. Cr^+3 Cr^+6

,
PH,
O PH :

PH

PH

Fe^+3,Sn^+2,Al^+2
4
7
Cu^+2,Zn^+2,Cr^+3,Be^+2
6
9
Fe^+2
7
10
Cd^+2,Ni^+2,Co^+2,Cu^+2()
8
11
Ag^+,Mn^+2,Hg^+
9
12
(, Na2S o)
, o
o
,
Cu^++ + Fe<--->Cu() + Fe^++
O
:
(1)
(5)
(2)
(6)
(3)
(7)
(4)
(8)
(1). NaOH o :
1.
NaCN+Cl2<--->CNCl+NaCl
CNCl+2NaOH<--->NaCNO+NACl+H2O
NaCNO+4NaOH+3Cl2<--->6NaCl+2CO2+N2+H2O
2. NaClO
NaCN+NaClO=NaCNO+NaCl
2NaCNO+3NaClO+2NaOH=2Na2CO3+N2+3NaCl+H2O
3.:Ca(OCl)2().CaOCl2()
2NaCN+Ca(OCl)2=2NaCNO+CaCl2
4NaCNO+3Ca(OCl)2+H2O=2N2+2Ca(HHCO3)2+CaCl2+4NaCl
NaCN+CaOCl2=NaCNO+CaCl2
2NaCON+3CaOCl2+H2O=N2+Ca(HCO3)2+2CaCl2+2NaCl
(2): CN^(3)(O3),:
CN + O3 = NO^- + O2
74/83

2CNO + 3O3 + H2O = 2HCO3^- + N2 + 3O2

(4):,, 4A/dm^2, 4
, 50C 90C,:
CN^- + 2OH^- = CNO^- + H2O + e^2CNO^- + 4OH^- =2CO2 + N2 + 2H2O + 6e^CHO^- + 2H2O = NH4^- + CO3^(5): Cr^+6 CN^-,Cu^++, :
2Cr^+6 + 6CN^- + 6H2O ===(Cu^++)=== 2Cr^+3 + 3(CONH2)2
CN^- Cr^+6 , CN^-, Cr^+6 o
(6):(Ni^++,Fe^++) o :
6NaCN + FeSO4 = Na4[Fe(CN6)] + Na2SO4
3Na4[Fe(CN6)] + 2Fe2(SO4)3 = Fe4[Fe(CN)6]3 () + 6Na2SO4
CN^(7):CN^- CN^-, o
(8): CN^-,, o

, pH
o

, ,
,:
>>>>>
(1): PH 9 -- 10, o
(2):,,
o
(3):. o
(4): o
(5): o
(6),.. o
o o

:
(1)... o
(2) o
(3) o
,concentrate return methods. non-return
methodsregeneration. recyclingo :
(1)evaporation
(2)reverse osmosis
(3)electrodialysis
(4)ion exchange
(5)distillation
75/83

(1) (Hull cell test)

(2) (Haring cell test)
(3)
(4)
(5)
(6) PH
(7)
(8)
(9)
(10)
19.1

(1)
(2)

(1)
(2)
(3)
(4)

(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
19.2

()100
19.3
45
19.4

76/83

 88
(1) (7)
(2) (8)
(3) (9)
(4) (10)
(5)
(6)
19.5
(colorimetric method)(electrometric method)
19.6
(specific gravity)

19.7
(wetting agent)(anit-pitting agents)
(surfactants)
19.8
(rinse water)
(residual salts)

(1) (specifications)
(2) (test)
(3) (controls and analysis)
(4) (qulity controls)
(5) (cost controls)
(6) (safety and health hazards)
20.1
(specifications)
(1) (process specification)
(2) (product specification)
(3) (performance)
:
(1) CNS
(2) ASTM
(3) ANSI
(4) MIL
(5) JISDINISOSAEBSI

77/83


(1) (thickness)
(2) (coverage)
(3) (adhesion)
(4) (corrosion prevention)
(5) (appearance and surface finish)
(6) (quality of substrate)
(7) (supplementary requirements)
20.2
:
(1) (thickness tests)
(2) (adhesion tests)
(3) (hardness tests)
(4) (residual stress tests)
(5) (tensile tests)
(6) (ductility tests)
(7) (abrasion tests)
(8) ( corrosion tests)
(9) ( porosity tests)
(10) ( solderability tests)
(11) ( appearence tests)
(12) ( hydrogen embrittlement tests)
(13) (identification of deposits )
(14) ( brightness and levelling tests)
20.2.1
(1) (dest-ructive tests);(2)
(semidestructive tests);(3) (nond-estructive tests)

(1) (magnetic gages) ASTM B499 B530

(2) (eddy-current gages) ASTM B259 B244
(3) Bata (Bata-backscatter gages) ASTM B567
(4) (electrical conductance gages)
(5) (thermoelectric gages)
(6) X (X-ray fluorescence methods)
(7) (chemical methods for local thickness)
1. Spot Tests ASTM B566
2. Dropping and Jest tests ASTM B555
3. Coulometric tests ASTM B504
(8) (microscopic tests) ASTM B487
(9) Chord Method
(10) (interference microscope): ASTM B588
20.2.2
:
78/83

(1)
(2)
(3)
(4)

(ferroxyl test)
(immersion tests)
(electrographic tests)
(hot-water test)

20.2.3
:
(1) (salt spray test) ASTM B117
(2) Corrodkote (corrodkote test) ASTM B380
(3) (acetic acid salt spray test)ASTM B287
(4) CASS (copper-accelerated acetic acid salt spray test)
ASTM B368
(5) ECT (electrochemical exposure test)
(6) FACT (FACT test)ASTM B538
(7) (atomospheric exposure test)ASTM B537
(8) (tropical test)
(9) (sulphur dioxide test)
20.2.4
:
20.3
(statistics) (specifications) (tests)
:
(1) (to correct a process)
(2) (to improve an exosting process)
(3) (to leave process)
:
(1) (process control)
(2) (process capacity)
(3) (sampling inspection)
(4) (experimental and test design)

20.4

(1)
(2)
(3)
(4)

20.5
79/83

(1)
1. 3.
2.
4.
(2)
1.
2.
3.
4.
5.
6.
7.
(3)
1.
5.
2. 6.
3.
7 .
4.
(4)
1.
2.
3.
(5)
1.
4.
2. 5.
3.
6.
(6)
1. 4.
2. 5.
3.
(7)
1.
2.
3.
4.
(8)
(9)
(10)
20.6
(1)
(2)
(3)
(4)

80/83

(5)
20.7
:
(1)
(2)
(3)
, ,
:
(1) : ,
,
,, , ,
,
(2)
(cyanides):,,
, ,
,
:, ,
:,
(chromates):, , , ,
, , (0.1mg CrO3/m3)

1.?
2.?
3.?
4.?
5.?
6.?
7.
8.,?
9.(P-R )?
10. PR ?
11.?
12.?
13.?
14.?
15.?
16. PH ?
17. PH7 , PH7 ?
18. PH ?
19.
20.
21
22.
81/83

23.
24.
25.
26.
27.
28.
29.
30.
31
32.
33.
34.
35.
36.
37.
38.
39.,
40.
41.
42.
43.
44.
45.
46.
47.
48.
49.??
50.,,
51.
52.,
53.
54.
55.
56.,
57.
58.
59.
60.,,
61.,
62.
63.,
64.,
65.,?
66.
67.
68.
69.
82/83

70.
71. PH
72.PH ,
73.
74.,,
75.,?
76.,,?
77.
78.,
79.
80.,?
81.?
82.?
83.?
84.? ,, ?
85., ?
86.,?,?
87.?
88.,,?
89.,,,
90.,
91.,
92.
93.
94.,
95.
96.
97.
98..
99.
100.

83/83