Professional Documents
Culture Documents
SERVICE Manual
YEPP CONTENTS
1. Precaution
2. Product Specification
4. Troubleshooting
6. PCB Diagram
7. Schematic Diagram
YP-T10
Refer to the service manual in the GSPN (see the rear cover) for the more information.
GSPN (Global Service Partner Network)
Area Web Site
North America service.samsungportal.com
Latin America latin.samsungportal.com
CIS cis.samsungportal.com
Europe europe.samsungportal.com
China china.samsungportal.com
Asia asia.samsungportal.com
Mideast & Africa mea.samsungportal.com
1. Precaution
1-1 Safety Precautions............................................................................................. 1-1
1-2 Static Electricity Precautions..............................................................................1-2
2. Product Specification
2-1 Product Feature.................................................................................................. 2-1
2-2 Specifications.....................................................................................................2-2
2-3 Specifications Analysis.......................................................................................2-4
2-4 Accessories........................................................................................................2-5
4. Troubleshooting
4-1 Checkpoints by Error Mode................................................................................4-1
4-2 Upgrade Methods............................................................................................... 4-14
6. PCB Diagram
6-1 PCB Top.............................................................................................................6-1
6-2 PCB Bottom........................................................................................................6-3
7. Schematic Diagram
7-1 Overall Block Diagram........................................................................................7-2
7-2 POWER..............................................................................................................7-3
7-3 CPU PWR & MEM INF.......................................................................................7-4
7-4 CPU....................................................................................................................7-5
7-5 MEMORY...........................................................................................................7-6
7-6 AUDIO................................................................................................................7-7
7-7 24PIN I/O, Interface............................................................................................ 7-8
7-8 LCD Block...........................................................................................................7-9
7-9 Bluetooth Block...................................................................................................7-10
Precaution
1. Precaution
1-1 Safety Precautions
1. To remove dust from cabinet, use a dry cloth without using liquid and aerosol cleaner.
2. You should not use attachments not recommended by the company. Otherwise, it may cause critical damage.
3. You should not use this product near water such as bathtub, swimming pool or lake etc.
4. Power supply: A type of battery as displayed on the label should be only used.
5. You should not put any object or liquid into product. Otherwise, it may cause failure or mal-operation.
6. If replacement material is required, service engineer should use materials with the same standard.
The use of non-standardized materials may cause failure of product.
1. Contact and emit all the grounding objects with static electricity from your body before handling with elements
for semi-conductor or devices with elements for semi-conductor. You should purchase and use static electricity
arm rings or commercially available. You should remove it due to potential shock before supplying power to the
device under test.
2. You should place appliance on the conductive surface like aluminum film to prevent that static electricity is
accumulated or the device is disclosed outside after removing electrical appliance with the ESD device.
3. You should use only soldering iron that is ground when soldering the ESD device.
4. Minimize physical operation when handling with the ESD device for replacement without packing (Otherwise,
namely friction between cloth fibers or lifting of the foot from the carpet floor may cause static electricity enough
to damage the ESD device).
2. Product Specification
2-1 Product Feature
Advanced Video
- 1.8 2.0"
- QCIF+/15f QVGA/30fps
Advanced Bluetooth
B/T support to Video/Game
Best Audio
YP-T9 Tone quality embodiment more YP-T10
than K5
Various Accessory
Various Fashion and Technical
accessory support
2-2 Specifications
Basic Specification
YP-T10
Model Name
JQB JAB JCB JQG JAG JCG JQR JAR JCR JQU JAU JCU JQW JAW JCW
Capacity 2G 4G 8G 2G 4G 8G 2G 4G 8G 2G 4G 8G 2G 4G 8G
Color Midnight Black Lime-Yellow Maple Red Mystic Purple White Cloud
Rating DC 5.0V / 500mA
Built-in Battery Power 550 mAh / DC 3.7V
AUDIO: MPEG1/2/2.5 Layer3(8kbps~320kbps, 22kHz~48kHz)
WMA(5kbps~320kbps,8kHz~48kHz)
VIDEO: SVI (Video: MPEG4, Audio: MP3(44.1kHz, 128Kbps),
File Compatibility WMV(Video: WMV9 Simple Profi le, Audio: WMA Spec (Max
860kbps), Resolution: 320X240, Frame Rate: 30fps)
IMAGE: JPEG(ISO/IEC 10918-1/Annex F-Sequential DCT-based mode of
operation)
Earphone Output 20mW (16)
Output Frequency
20Hz ~ 20KHz
Range
Signal to Noise Ratio 90dB with 20KHz LPF(based on 1kHz 0dB)
Maximum of 30 hours for music playback
Play Time (based on: MP3 128kbps, Volume 15, Normal sound mode), Maximum of 4 hours for
video playback
Temperature
-5 ~ 35C (23 ~ 95F)
Characteristics
Case Plastic , Aluminum
Weight 43g
Dimensions (WxHxD) 41.5 x 96 x 7.9 mm
LCD QVGA 2" TFT-LCD (30fps)
FM
87.5 ~ 108.0MHz
Frequency
FM Signal to
FM 50dB
Noise Ratio
RADIO
FM T.H.D 1%
FM Useable
30dB
Sensitivity
Wireless System
Emission Type F1D
RF Power CLASS II
Transmit Frequency 2402MHz ~ 2480MHz
Receive Frequency 2402MHz ~ 2480MHz
No. of channels 79 CH
Temperature -10C ~ +50C (14 ~ 122F)
Modulation System GFSK
Communication Mode Semi-duplex Operation
Humidity 95%
Spec Version Supported 2.0
Module BTEM48B2SA
Photo
Dimensions
41.5 x 96 x 7.9 mm 42.6 x 83 x 11 mm 40.6 x 88.9 x 6.6 mm 44.5 x 88.0 x 9.6 mm
(WxDxH)
Midnight Black
Mystic Purple
Black, Pink, Lime, Blue, Black, White, Silver, Blue,
Color Maple Red Black, Purple, Pink
Silver, Red Pink
Lime-Yellow
White Cloud
Capacity 2GB / 4GB / 8GB 1GB / 2GB / 4GB / 8GB 2GB / 4GB / 8GB 2GB / 4GB / 8GB
Enabled
(Audio & Video) Enabled (Only Audio)
Bluetooth X X
Bluetooth 2.0 Bluetooth 1.2
(1:2 Support)
2-4 Accessories
- Be careful to follow the disassembly sequence described in the manual. Otherwise, the product
may be damaged.
- Be sure to carefully read and understand the safety instructions before performing any work as
the IC chips on the PCB are vulnerable to static electricity.
- Assemble in the reverse order of disassembly.
4. Troubleshooting
4-1 Checkpoints by Error Mode
4-1-1 No Power
Yes
No
Completion
4
2 Check power.
Yes When power Key is on, No L300: 1.08V(CORE)
check key signal as HIGH? L301: 3.0V(MAIN)
(More than 2.5V) L302: 1.8V(MEMORY)
No
Refer to wave pattern Refer to wave pattern
image of Table 4-1. Yes image of Table 4-1.
3
Check DDCON enable Yes
pin signal as HIGH
(More than 2.5V)
1
Yes Yes
Check MAIN 12Mhz clock Check BATTERY power.
TP301, TP300
No No
Refer to wave pattern
image of Table 4-1.
Completion
Recheck after replacing the battery.
2 3 4 4
2
4
L301
4
4
L302
2
CON300
4
IC302
3
4
CON801 IC303
IC900
IC600
PCB Top Page, 6-1 PCB Bottom Page, 6-3
<Table 4-1>
IC701
Samsung Electronics 4-3
IC601
Troubleshooting
4-1-2 No Sound
No Sound
1 2
Is audio codec No Is audio codec No
voltage a normally? voltage a normally? Power Defective
DCVDD: 1.8V Check AVDD1, AVDD2: 3.0V
Check
Yes Refer to wave pattern
image of Table 4-2.
Yes
Yes Yes
Yes
Does the
same symptom persist
even after upgrading the
firmware to the latest
version?
Yes
CON801
IC900
1 IC701 2
<Table 4-2>
Yes
Yes
No
Are the earphones plugged in? Connect an earphone & check again
Yes
1
Is BTEM48B2SA CHIP set to No
Check the power terminal.
ENABLE?(IC100 20PIN) C152 : 1.0V
Yes
Refer to wave pattern
image of Table 4-3.
2
Is 32.768 KHz CLOCK being No Is RTC CLOCK functioning No
inputted normally? normally?
Yes
Yes Refer to wave pattern
image of Table 4-3.
1
IC602 Bluetooth Block Page, 7-10
2 CON
CON900 IC900
IC601
IC701
IC101
IC100
1 2
IC500
<Table 4-3>
No LCD Backlight
No
Check Power is OK Check No Power 4-1-1
Yes Yes
CON801
CON900 IC900
IC701
<Table 4-4>
FET700
Cannot Recharge
Yes Yes
Yes
Yes
3 Check
#CHARGE_STOP PIN No
(IC302 12PIN): HIGH CHARGING,
LOW STOP
Completion
1 1
2
N300
2
3 IC302
IC303 IC602
1
IC600
<Table 4-5>
USB connection
Yes Yes
Yes
No Can formatting be No
Is it accessible? Defective
done in Explorer?
Yes Yes
Completion
If the product does not power on and shows any of the following symptoms, you may try the upgrade methods
in this chapter without having to disassemble the product:
- The product does not turn on when the power switch is pressed.
- The product powers on normally but no USB connection can be made.
- The products icons appear garbled or malfunction.
- Files are corrupted, or the product shows as a removable storage in Windows but cannot be accessed.
If the battery power is low, the upgrade will not start. In this
case, you need to connect a USB or charging cord for the
upgrade to start.
Through this hard-recovery process, all data in the device will be totally deleted. You should be cautious.
1. If you use FWDN program for the first time, you should install VTC driver on your computer.
8) Press OK button.
1) Set Preference.
( MENU Options > Preference ) 1
3. Finishing
1) Turn on the device. You can see the message Upgrading Firmware then the device turns down.
2) Turn on the device again. You can see the messages like Image Upgrading..., AUI Upgrading...,
Font Upgrading... for a while. After that, the device will operate normally.
When do you perform this procedure?: When NAND data is corrupted and after the FWDN Update
1. Disassemble the YP-T10 case and check the MAC Address sticker inside.
2. Enter the following MAC Address in a blank text file and save it with the name shown below.
3. Establish the USB connection and copy and paste the file to the Root Folder.
5. Go to Menu Bluetooth Bluetooth Settings My Device Info and check the MAC Address.
AA001
AA005
AH388
AT050
AC010
AC010 AC357
AH280
AS108
AA900
AK200
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Exploded View & Part List
Part List
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Exploded View & Part List
Loc. No. Part No. Description;Specification Qty SNA Remark Loc. No. Part No. Description;Specification Qty SNA Remark
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Exploded View & Part List
Loc. No. Part No. Description;Specification Qty SNA Remark Loc. No. Part No. Description;Specification Qty SNA Remark
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Exploded View & Part List
Loc. No. Part No. Description;Specification Qty SNA Remark Loc. No. Part No. Description;Specification Qty SNA Remark
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PCB Diagram
6. PCB Diagram
6-1 PCB Top
TP1
0
CON801
1 CON900 IC900
9
TP14
2 8
7
TP10
3
1 LCD Connector
4
TP11 FET700
2 BATTERY TP -
5 BATTERY TP +
5 6 MIC
7 Audio Codec
8 BLUETOOTH ANTENA
0 Touchpad Connector
1 LCD Connector
TP1 TP14
Pin No. Signal Pin No. Signal Pin No. Signal
1 GND 15 P3.0V 29 LCD_GRN2 TP1
TP14
2 LCD_VSYNC 16 GND 30 LCD_GRN3
3 LCD_HSYNC 17 LED1- 31 LCD_GRN4
4 LCD_PCLK 18 LED2- 32 LCD_GRN5
5 LCD_DE 19 LED+ 33 LCD_BLU0
6 GND 20 LCD_DETECT 34 LCD_BLU1
TP10
7 LCD_RST 21 LCD_RED0 35 LCD_BLU2
8 LCD_CS 22 LCD_RED1 36 LCD_BLU3
9 I2C_CLK1 23 LCD_RED2 37 LCD_BLU4
10 GND 24 LCD_RED3 38 LCD_BLU5 TP10
11 P3.0V 25 LCD_RED4 39 I2C_DAT1
12 P3.0V 26 LCD_RED5 40 GND
13 LCD_STATUS 27 LCD_GRN0
TP11
14 P3.0V 28 LCD_GRN1
0 Touchpad Connector
TP11
Pin No. Signal
1 GND
2 T_CLK
3 T_DATA TP12
4 T_ACK
TP12
5 NC
6 P3.0V
TP13
TP13
TP3
TP7
1
CON300
TP8
IC302 TP2
2
0
TP5
TP4 IC303 IC602
9
3
IC600 TP6
IC601
IC101
IC100
8
IC400
TP15
7 1 BATTERY Connector
4
BATTERY CHARGER
TP9 2
IC500
DCDC CONV
3 SDRAM 32MB
4 MAIN CPU
5 USB Connector
6 EARPHONE JACK
5 CON800
6 7 RESET SWITCH
8 BLUETOOTH MODULE
9 NAND FLASH
0 POWER/HOLD SWITCH
5 USB Connector
TP2
Pin No. Signal Pin No. Signal
1 BATT ID 13 Uart RX1
2 DEVICE DET/CE 14 Uart TX1
3 JTAG_TCK/DC3.3V OUT 15 USB D+/HOST D+ TP2
4A NC
4B L-CH
5B HD-DET
TP9
TP9
TP15
TP15
7. Schematic Diagram
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Schematic Diagram
The Main System contains basic circuit blocks, such as Processor(TCC7801), SDRAM, Flash Memory,
Power Block, Audio DAC, etc., and function blocks, such as Bluetooth Block, 24pin I/O, and etc. The display is
Battery Charge & connected to a 2-inch TFT LCD.
> P 1.2V
> P 2.9V Dual Buck Converter FM ANT
> P 1.8V EAR JACK
LT3559, MAX8670, MAX8740 Serial Interfaces between ICs are implemented with various Protocols throughout the System.
> P 3.3V
A host processor (TCC7801) UART is used to implement CODEC and FM Tuner features.
LITHUM BATTERY WM1808L The interface between the Bluetooth Module and the Host Processor is achieved through UART, and the audio DAC
3.7V ~550mA
achieves mode setting and data transfer through I2C and I2S, respectively.
Power I2 S T
R
GPIO UA Power can be turned On and Off with the Power S/W located at the top of the set. Either the built-in battery or the
Management ADC
RTC BCM2048 power adapter can be used for power supply. The power adapter is capable of 5V input. Power from the power adapter
USB 2.0/1.1 is used to recharge the battery at AAT2550 and generates power for the system (3.0V, 1.2V).
SPDIF, DAI
I2S
I2S
UART
UART
SKUFBG
SD/MMC/SDIO
2 QVGA LCD
2 QVGA LCD RGB VIDEO I/O
TIMER
Bluetooth + FM
I2C/I2S
320X240
320X240 6:6:6
PCM
UART
PWM
MEMORY I/O
ARM926 LCD CTRL
Touch Key
Touch Key
CORE
192MHz
I
I-MEM
ARM946 /E
E-MEM
- NAND- FLASH
NAND-FLASH
(SUB) MEMORY
MEMORY
TCC 7801
256 BALL BGA
14 X14mm 0.8mm PITCH
0.40~0.45mm BALL PI
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Schematic Diagram
7-2 POWER
POWER
TP1 / TP2
TP1
TP6 TP2
TP7
TP3
TP1
TP6
TP7
TP8
TP2
TP5
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Schematic Diagram
POWER
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Schematic Diagram
7-4 CPU
POWER
TP11
TP10
TP9 / TP10
TP9
TP9
TP10
TP11
TP11
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Schematic Diagram
7-5 MEMORY
POWER
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Schematic Diagram
7-6 AUDIO
TP12
POWER
AUDIO
TP12
TP12
TP13
TP13
TP13
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Schematic Diagram
POWER
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Schematic Diagram
TP14
POWER
TP14
TP14
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Schematic Diagram
TP15
POWER
TP15
TP15
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