CHAPTER 1: INTRODUCTION

A. Introduction

Excelitas Technologies is a global technology leader focused on delivering innovative,

customized optoelectronics to OEMs seeking high-performance, market-driven technology
solutions. The company has decades of experience in the design, manufacture, and marketing of
high-performance products for demanding applications. They also produce a wide variety of
sensor products such as photodiodes, photodiode arrays, phototransistors, infra-red emitters, high
performance sensors, sensor hybrid assemblies. Excelitas Technologies has long produced
quality Laser Diodes sold as an individual or as assembled piece.

Typically, electrostatic discharge (ESD) causes more than one-third of the field failures in the
semiconductor industry. ESD-induced failures in semiconductors can be seen in the form of
leakage, short, burnout, contact damage, gate oxide rupture, and resistor-metal interface damage.

Transportation lengthens the time cycle of the process. Since the device, laser diode, is
sensitive to electrostatic discharge, having the units to move a lot causes defects.

C. Statement of the Problem

Problems arose when the demand for the laser diode increased. With the process being
manual, fewer machines compared to other devices, and areas far from each other, delays and
lengthening the time cycle is visible. In laser diode manufacturing, 430 ft. is the total
transportation which causes delays and fatigue for operators.

With the device being exposed to electrostatic discharge, defects of one lot of laser diode
is contributed by having the device move from one place to another.

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 D. Objective of the Study

Decrease the transportation in laser diode manufacturing.

Decrease the 430 ft. total transportation which causes delays and fatigue for
operators.
Figure out the effect of transportation and delays in the companys productivity.
Propose a new lay out for laser diode manufacturing.

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CHAPTER 2: DISCUSSION OF PRESENT SYSTEM

A. Present Process Flow

START

MANUAL DIE-ATTACH

CURING

MANUAL WIREBOND

CURING

CASTING

CURING

DAMBAR
SINGULATION

LAPPING

ELECTRICAL TEST

FINAL VISUAL INSPECTION

PACKING

PACKAGING

Figure 1. Flowchart of Present System

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 Laser diodes are usually for sensing and as a range finder. This device uses gold
lead frames and pure gold wires. It is the companys one of the most expensive product,
selling for $4 each. Laser diodes are sensitive to Electrostatic Discharge (ESD), thus
having more complicated processes and precautions.

Diodes consist of a chip and a lead frame in a form of metal strip. Lead frame is
the diodes skeleton. It has two parts the wedge and the post. The wedge is where the
die pad is. It holds the chip. The post is where a wire connects it to the wedge.

First step for laser diode is Die Attach. This is a process where the chips are
attached to the lead frames using epoxy as its glue. The needed equipment are: Wrist
strap, responsible in decreasing the ESD produced by the operators movements;
Microscope, for clearly guiding the operator; Epoxy dispenser, for easy squeezing of
epoxy in the lead frame.

Lead frame is placed under the microscope. With the microscopes help, the
operator will dispense epoxy on the die pad. After putting epoxy in the frames, attach the
chip on pad using tweezers.

To properly secure the chip on the die pad, lead frames are to be cured in a
convection type oven that should be 175 C to 185 C for an hour and a half.

Second step is for the laser diode to undergo wire bonding. Wire bonding is where
the machine connects the bonding pad to the post using a golden wire. In wire bonding,
the gold wire tip is melted, thus, forming a ball. The wire is then connected to the post. To
strengthen the wire bond, the lead frames are then transferred to an oven for curing.
Curing lasts for an hour and 10 minutes and should be 175 C to 180 C.

Third step is casting, wherein the lead frame is then encapsulated with an epoxy
gel. The mixture is then degassed. The degassed epoxy gel will be placed in an injection
used for encapsulation. The operator grabs a lead frame cup and sprays a mold release.
Lead frame is then pre-dipped into an epoxy gel, and then placed in the lead frame cups.
Epoxy gel will be then injected individually to the cups. To harden the gel, the lead
frames will be cured twice.

Fourth step would be the dambar trimming and singulation. 20 leads are in lead
frame connected through a dambar. In dambar trimming, the machines remove the
dambar. After removing the dambar, lead frame is then singulated.

In lapping, diodes are cleaned thoroughly. After the lapping, each diode is then
tested to know if its parameters are correct and accepted. When all diodes are properly
checked, diodes are then packed properly according to its limitations.
 B. Flow Process Charts

Process chart is a tool for describing the activities in a systematic way.

This chart identifies the non-value added operations. In improving the system,
flow process chart helps the researchers understand the flow. Different symbols
are used in this chart to summarize the process description Operation,
Transportation, Inspection, Delay, and Storage.
1. Manual Die Attach

The table shows that this process have a cycle time of 5,571.2 seconds. All
throughout manual die attach, 94 ft. was covered. 1.6% of the cycle time is used in
transportation that did not occur in the same area. This flow process chart limits to
one lead frame with 20 diodes.

Table 1.1 Flow Process Chart (Manual Die Attach)

 2. Manual Wirebonding

The table shows that this process have a cycle time of 115.1 seconds. All
throughout manual wire bonding, 100 ft. was covered. 82.9% of the cycle time is
used in transportation that did not occur in place. This flow process chart limits to
one diode in a leadframe.

Table 1.2 Flow Process Chart (Manual Wire Bonding)

3. Casting
 The table shows that this process have a cycle time of 26,860.1 seconds.
All throughout manual die attach, 61 ft. was covered. 0.2% of the cycle time is
used in transportation that did not occurred in place. This flow process chart limits
to one leadframe.

Table 1.3 Flow Process Chart (Casting)

4. Dambar Trimming
 The table shows that this process have a cycle time of 11.4 seconds. All
throughout dambar trimming, 1 ft. was covered. 7.9% of the cycle time is used in
transportation that did not occur in place. This flow process chart limits to one
leadframe

Table 1.4 Flow Process Chart (Dambar Trimming)

5. Singulation

The table shows that this process have a cycle time of 42.6 seconds. All
throughout singulation, 34 ft. was covered. 75.6% of the cycle time is used in
transportation. This flow process chart limits to one lead frame.
 1Table 1.5 Flow Process Chart (Singulation)

6. Lapping

The table shows that this process have a cycle time of 571.7 seconds. All
throughout lapping, 49 ft. was covered. 8.2% of the cycle time is used in
transportation that did not occur in place. This flow process chart limits to 45
units.

Table 1.6 Flow Process Chart (Lapping)

7. Electrical Testing

The table shows that this process have a cycle time of 91.6 seconds. All
throughout electrical testing, 54 ft. was covered. 57% of the cycle time is used in
transportation that did not occur in place. This flow process chart limits to 1
diode.

Table 1.7 Flow Process Chart (Electrical Testing)

8. Final Visual Inspection

The table shows that this process have a cycle time of 140.8 seconds.
All throughout final visual inspection, 21 ft. was covered. 14.1% of the cycle time
is used in transportation that did not occur in place. This flow process chart limits
to 1 diode.

Table 1.8 Flow Process Chart (Final Visual Inspection)

9. Packing

The table shows that this process have a cycle time of 701.1 seconds. All
throughout packing, 110 ft. was covered. 14.2% of the cycle time is used in
transportation. This flow process chart limits to 100 diodes.

Table 1.9 Flow Process Chart (Packing)

 C. Present
Process Lay-
out Plan

Figure 2.
Present Lay-
out (2nd floor)
Figure 3. Present Lay-out (3rd Floor)
LEGEND
1 Manual Die Attach
2 Oven
3 Manual
Wire Bonding
4 Oven
4 Epoxy
Preparation
5 Casting
6 Oven
7 Binder
Oven
8 Dambar
Trimming
9
Singulation
10 Lapping
11- Electrical
Testing
12 Final
Visual
Inspection
13 Packing
14 Vacuum
Table 2.
Distance
travelled by
operators
 TOTAL DISTANCE: 430 ft
D. Defects Chart

A lot size of laser diode consists of one thousand six hundred (1,600) units. An
average yield for one lot of laser diode is ninety-five percent (95%). As of current, the
defects mostly responsible for low yield are those induced by electrical overstress due to
exposure of device to electrostatic discharge. In every week, one lot of laser diode is
shipped.

This is how ESD works in semiconductor companies - when people walk on a

synthetic floor, they can accumulate up to 20 kV. Rubbing (friction) nylon and polyester
in dry air can produce 25 kV. When a person touches a grounded object, the charge
moves from the person to the object in a very short time (1 to 100 ns).
 Defects Chart
16

14

12

10

0
contact damage short leakage chip out misplaced die cracks

When a device is ESD sensitive, if not taken care of properly, major defects can
happen and will have poor feedbacks. The defect may then extend over time with the
device failing after several hours.

Figure 4. Defects Chart for Laser Diode

As seen in the figure the defect contact damage and short had the highest
percentage in the defects chart. Defects caused by being exposed to ESDs are contact
damage, short, and leakage. While other defects are due to mishandling, and machine
problems.

CHAPTER 3: PROPOSAL SYSTEM

A. Activity Relationship Chart

An activity relationship chart (ARC) is a tabular means of displaying the

closeness rating among all pairs of activities or departments. In an ARC there are six
closeness ratings which may be assigned to each pair of departments, as well as nine
reasons for those ratings (each is assigned by a reason code).

With the current lay-out, the researchers did an Activity Relationship Chart for the
laser diode manufacturing in order to know the essential relationships between processes.
 Figure 5. ARC in Laser Diode Manufacturing

Legend:

A= Absolute Necessary
E= Especially Important
I= Important
O= Okay
U= Unimportant
X= Undesirable

B. Relationship Diagram
Relationship diagram position the activities spatially. This diagram shows that
proximities are typically used to reflect the relationship between pair of activities
 Figure 6. Relationship Diagram of Laser Diode Manufacturing

The figure above shows the relationship diagram between processes of the Laser
Diode manufacturing

Table 3.1. Relationship Chart Table

 Table 3.2. Relationship Chart Table with Computation

The tables above shows the present layouts relationship chart with computations.
The present layout scoring a negative twenty eight (-28).

C. Alternative Layouts
According to observations and data, the researchers are seeing to
recommend to swap the Tin Dip area and the Lapping room, since it has the same
dimensions, there will be no encountered problems.
 Figure 7. Proposal
The figure above shows that the researchers would like to swap the lapping area
and the tin dip area. Lapping area is where only one process is done. The lapping process
is part of a re-designed process for one of their devices. Since its only an addition, the
area where it was placed have a big remaining space.

1. Alternative Block Layout

The researchers did two alternative layouts to choose from for the best
proposal layout of laser diode manufacturing.
 Figure 8. 1st Alternative Layout
Figure 9. 2nd Alternative Layout

CHAPTER 4: PRESENT VS. PROPOSAL

A. Proposal Lay-out
1. Proposal Layout Process Flow
According to data and activity relationship chart, the second alternative would be
the best for re-designing the layout of laser diode manufacturing.

For the proposal layout almost all processes involved in laser diode
manufacturing are placed in one area. Packing and packaging are left outside since this
processes should be near the shipping area. The figure below shows the new sequence of
laser diode manufacturing in parallel with the proposed layout

Figure 10. Proposed Layout with Sequence

The researchers proposed a lay-out where the room of lapping and tin dip
be swapped since both have the same dimensions. With the table 2 and table 4 compared,
the present lay-out covers 430 ft., while the proposed lay-out covers 40 ft. It decreased by
almost ninety percent (90%).
 TOTAL DISTANCE: 40 ft

Table 4. Proposed Layout Distance Travelled by Operators

2. Proposed Relationship Diagram

 Figure 11. Proposed Relationship Diagram

The figure above shows the new relationship diagram between processes of the
Laser Diode manufacturing

Table 5.1. Relationship Chart for Proposed Layout

Table 5.2. Relationship Chart of Proposed Layout with Computations

 The tables above shows the relationship chart of the proposed layout chosen by
the researchers. The proposed layout having a score of thirty four (34).

2. Cost Benefit Analysis

Cost-Benefit Analysis involves adding up the benefits of a course of action, and
then comparing these with the costs associated with it. The results of the analysis are
often expressed as a payback period this is the time it takes for benefits to repay costs.
Many people who use it look for payback in less than a specific period for example,
three years.

The researchers used this tool to evaluate the layout changes initiative.
Assumptions:
ESD related defects of laser diode manufacturing will decrease.
Weekly yield of one laser diode lot will be ninety-eight percent (98%)
Project will be finished in 1 week

Costs:
 Table 6.1. Costs Table

Benefits:

Table 6.2. Benefits Table

The tables above shows that for re-designing the laser diode manufacturing
processes would cost the company a total of Php 46,070 for a year. With the assumptions
of the proposed layout increasing the yield by 3% will benefit the company Php 469,248
within a year.

With this analysis, we could see that re-designing the layout greatly benefits the
company.

B. Summary of Changes
 This table shows the changes in transportation delays once the proposed changes
is applied. Massive difference is seen in transportation delays of present and proposed
method. It also shows the tabular summarization of changes that will occur once the
proposed method is applied in transportation delays for laser diode manufacturing.

Table 7. Changes in Transportation

C. Description of Proposed Method

 Having the same dimensions, Lapping Area and Tin Dip Area will be
interchanged. All machines used for Laser Diode Manufacturing are placed in the Tin Dip
Area. The packing process cant be placed in the new lay-out because all devices
produced in the company uses the packing area.

In the proposal, most of the processes that affects the transportation delays was
reduced. Almost all the machines being in one place helps the monitoring of orders and
operators. Thus, reduces the total cycle time.

Total
number of
Number of weeks weeks
Activity
consumed
1 2 3 4 5 6 7 8
1. Presentation of proposal to the 1
administrators.

1
2. Approval of the administrators

3. Instruct operators for extra 2

production of Laser diode and IReds.

4. Transferring of equipments in Tin 1

Dip area to Lapping area

5. Start again the normal production

3
for all devices

6. Monitor the effectiveness of the 2

proposal

7. Evaluation of the effectiveness of 1

alternatives
To make this proposal possible, the detailed course of action is given by the
researchers.

CHAPTER 5: CONCLUSION AND RECOMMENDATION

 A. Conclusion
The laser diode manufacturing causes fatigue for operators since the distance
travelled are always far.

With the new proposed lay-out, the distance travelled was decreased from 430 ft
to 40 ft.

Using the Cost Benefit Analysis, we have concluded that re-designing the layout
for laser diode manufacturing greatly benefits the company. Once the proposed plan is
initiated, it will increase the yield thus increasing profit.

B. Recommendations
A. Remove unnecessary elements

With the data gathered, elements such as transportation took up all the
effort in producing laser diodes.
To lessen the transportation experienced, the researchers recommend new
lay-out for laser diode production.
Facilities planning and design shall implemented for laser diode
production.

1. Advantages
The 27.5% of the total time cycle for laser diode production will
definitely decrease since transportations will be cancelled.
Machines needed for production will be near to each other.
The workplace will be ergonomically designed.
2. Disadvantages
Rearranging a workplace to be ergonomically designed requires
time and money. This will cost a lot of money for the company.

B. JIT
This methodology aims to reduce time cycle of the production.
 The present system in producing laser diode is not in the slightest
continuous flow. With this lean tool, the production will have continuous
flow.

1. Advantages
Production of laser diode will be as lean as other devices in the
company.
Time cycle will definitely shorten.
2. Disadvantage
Laser diode is one of their most expensive products but production
of this device is by batch sheet, thus, applying costly methods will
give doubts to the management.

C. Forecasting
In our research, the results say that one of the problem in laser diode is not
anticipating when the orders will be. Forecasting is an IE tool used as a
basis for any decision for the future. Recording past values and pattern
will help the company in buying raw materials.

D. Buy new machines

Since almost all machines are semi-automated, the company should invest
in buying special machines for laser diode production.
1. Advantage
This will definitely increase the machines utilization.
Customers will be satisfied since their orders will be earlier than
their given deadline.
Would reduce labor costs for the operators since having automated
machines require minimal attention.
2. Disadvantage
Companys expenses will be higher.