Professional Documents
Culture Documents
74LVT646
3.3V Octal bus transceiver/register
(3-State)
Philips Semiconductors Product specification
FEATURES DESCRIPTION
Combines 74LVT245 and 74LVT574 type functions in one device The LVT646 is a high-performance BiCMOS product designed for
VCC operation at 3.3V.
Independent registers for A and B buses This device consists of bus transceiver circuits with 3-State outputs,
Multiplexed realtime and stored data D-type flip-flops, and control circuitry arranged for multiplexed
transmission of data directly from the input bus or the internal
Output capability: +64mA/32mA registers.
TTL input and output switching levels Data on the A or B bus will be clocked into the registers as the
appropriate clock pin goes High.
Input and output interface capability to systems at 5V supply Output Enable (OE) and DIR pins are provided to control the
Bus-hold data inputs eliminate the need for external pull-up transceiver function. In the transceiver mode, data present at the
resistors to hold unused inputs high impedance port may be stored in either the A or B register or
Live insertion/extraction permitted
both.
The Select (SAB, SBA) pins determine whether data is stored or
No bus current loading when output is tied to 5V bus transferred through the device in realtime. The DIR determines
Latch-up protection exceeds 500mA per JEDEC Std 17 which bus will receive data when the OE is active (Low).
In the isolation mode (OE = High), data from Bus A may be stored in
Power-up 3-State the B register and/or data from Bus B may be stored in the A
Power-up reset register.
When an output function is disabled, the input function is still
ESD protection exceeds 2000V per MIL STD 883 Method 3015 enabled and may be used to store and transmit data. Only one of
and 200V per Machine Model the two buses, A or B may be driven at a time. The examples on the
next page demonstrate the four fundamental bus management
functions that can be performed with the 74LVT646.
QUICK REFERENCE DATA
CONDITIONS
SYMBOL PARAMETER TYPICAL UNIT
Tamb = 25C; GND = 0V
tPLH Propagation delay 2.8
CL = 50pF; VCC = 3.3V ns
tPHL An to Bn or Bn to An 2.7
Input capacitance
CIN VI/O = 0V or 3.0V 4 pF
CP, S, OE, DIR
CI/O I/O capacitance Outputs disabled; VI/O = 0V or 3.0V 10 pF
ICCZ Total supply current Outputs disabled; VCC = 3.6V 0.13 mA
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER
24-Pin Plastic SOL 40C to +85C 74LVT646 D 74LVT646 D SOT163-1
24-Pin Plastic SSOP Type II 40C to +85C 74LVT646 DB 74LVT646 DB SOT399-1
24-Pin Plastic TSSOP Type I 40C to +85C 74LVT646 PW 74LVT646PW DH SOT360-1
SV00045
A0 A1 A2 A3 A4 A5 A6 A7
4 1 5 4D 20
1 CPAB 1
2 SAB 5 1
3 DIR 6D 7 1
2
23 CPBA 1 7
22 SBA 5 19
21 OE
6 18
B0 B1 B2 B3 B4 B5 B6 B7
7 17
8 16
20 19 18 17 16 15 14 13
9 15
SV00046
10 14
11 13
SV00047
LOGIC DIAGRAM
21
OE
3
DIR
23
CPBA
22
SBA
CPAB 1
2
SAB
1of 8 Channels
1D
C1
Q
4 20
A0 B0
1D
C1
Q
5 19 B1
A1
A2 6 18 B2
A3 7 17 B3
A4 8 16 B4
DETAIL A X 7
A5 9 15 B5
14
A6 10 B6
A7 11 13 B7
SV00048
1998 Feb 19 3
Philips Semiconductors Product specification
REAL TIME BUS TRANSFER REAL TIME BUS TRANSFER STORAGE FROM TRANSFER STORED DATA
BUS B TO BUS A BUS A TO BUS B A, B, OR A AND B TO A OR B
A B A B A B A B
}
}
OE DIR CPAB CPBA SAB SBA OE DIR CPAB CPBA SAB SBA OE DIR CPAB CPBA SAB SBA OE DIR CPAB CPBA SAB SBA
L L X X X L L H X X L X L H X X X L L X H or L X H
L L X X X L H H or L X H X
H X X X
SV00049
FUNCTION TABLE
INPUTS DATA I/O
OPERATING MODE
OE DIR CPAB CPBA SAB SBA An Bn
Unspecified
X X X X X Input Store A, B unspecified
output*
Unspecified
X X X X X Input Store B, A unspecified
output*
H X X X Store A and B data
Input Input
H X H or L H or L X X Isolation, hold storage
L L X X X L Real time B data to A bus
Output Input
L L X H or L X H Stored B data to A bus
L H X X L X Real time A data to B bus
Input Output
L H H or L X H X Stored A data to B bus
H = High voltage level
L = Low voltage level
X = Dont care
= Low-to-High clock transition
* The data output function may be enabled or disabled by various signals at the OE input. Data input functions are always enabled, i.e.,
data at the bus pins will be stored on every Low-to-High transition of the clock.
1998 Feb 19 4
Philips Semiconductors Product specification
1998 Feb 19 5
Philips Semiconductors Product specification
DC ELECTRICAL CHARACTERISTICS
LIMITS
TYP
MIN NO TAG MAX
VIK Input clamp voltage VCC = 2.7V; IIK = 18mA 0.9 1.2 V
VOH High-level output voltage VCC = 2.7V; IOH = 8mA 2.4 2.5 V
VOL Lowlevel output voltage VCC = 3.0V; IOL = 16mA 0.25 0.4 V
VRST Power-up output low voltage5 VCC = 3.6V; IO = 1mA; VI = GND or VCC 0.13 0.55 V
VCC = 3.6V; VI = 0 1 -5
Power up/down 3-State output VCC 1.2V; VO = 0.5V to VCC; VI = GND or VCC;
IPU/PD 15 100 A
current3 OE/OE =Dont care
ICCL Quiescent supply current VCC = 3.6V; Outputs Low, VI = GND or VCC, IO = 0 3 12 mA
1998 Feb 19 6
Philips Semiconductors Product specification
AC CHARACTERISTICS
GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500; Tamb = 40C to +85C.
LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 3.3V 0.3V VCC = 2.7V UNIT
MIN TYP1 MAX MAX
fMAX Maximum clock frequency 1 150 180 MHz
tPLH Propagation delay 1.8 3.8 5.7 6.7
1 ns
tPHL CPAB to Bn or CPBA to An 2.1 3.8 5.7 6.4
tPLH Propagation delay 1.3 2.8 4.7 5.4
2 ns
tPHL An to Bn or Bn to An 1.0 2.7 4.6 5.3
tPLH Propagation delay 2 1.4 3.7 6.2 7.2
ns
tPHL SAB to Bn or SBA to An 3 1.4 3.8 6.2 6.8
tPZH Output enable time 5 1.0 4.0 5.8 7.2
ns
tPZL OE to An or Bn 6 1.0 4.1 6.0 7.3
tPHZ Output disable time 5 2.3 4.3 6.5 6.9
ns
tPLZ OE to An or Bn 6 2.2 3.8 5.8 5.9
tPZH Output enable time 5 1.0 3.4 6.5 7.5
ns
tPZL DIR to An or Bn 6 1.2 3.4 6.3 7.1
tPHZ Output disable time 5 1.7 4.1 7.2 8.1
ns
tPLZ DIR to An or Bn 6 1.5 3.5 5.8 6.3
NOTE:
1. All typical values are at VCC = 3.3V and Tamb = 25C.
AC SETUP REQUIREMENTS
GND = 0V, tR =2.5ns, tF = 2.5ns, CL = 50pF, RL = 500; Tamb = 40C to +85C
LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 3.3V 0.3V VCC = 2.7V UNIT
Min Typ Min
ts(H) Setup time1 1.5 1.0 1.6
4 ns
ts(L) An to CPAB, Bn to CPBA 2.0 1.0 2.4
th(H) Hold time1 0.0 1.0 0.0
4 ns
th(L) An to CPAB, Bn to CPBA 0.0 1.0 0.0
tw(H) Pulse width, High or Low 3.3 1.0 3.3
1 ns
tw(L) CPAB or CPBA 3.3 2.0 3.3
NOTE:
1. This data sheet limit may vary among suppliers.
1998 Feb 19 7
Philips Semiconductors Product specification
AC WAVEFORMS
VM = 1.5V, VIN = GND to 2.7V
1/fMAX
2.7V
An
2.7V or 1.5V 1.5V 1.5V 1.5V
CPBA or Bn
CPAB 1.5V 1.5V 1.5V 0V
0V ts(H) th(H) ts(L) th(L)
tw(H) tw(L)
2.7V
tPHL tPLH CPBA
VOH or
CPAB 1.5V 1.5V
An or Bn 1.5V 1.5V 0V
VOL NOTE: The shaded areas indicate when the input is permitted
to change for predictable output performance.
SV00050
SV00123
Waveform 1. Propagation Delay, Clock Input to Output, Clock Waveform 4. Data Setup and Hold Times
Pulse Width, and Maximum Clock Frequency
0V tPZH tPHZ
tPLH tPHL VOH
VOH VOH 0.3V
An or Bn 1.5V
An or Bn
VM VM
0V
VOL
SV00124
SV00121 Waveform 5. 3-State Output Enable Time to High Level and
Waveform 2. Propagation Delay, SAB to Bn or SBA to An, An Output Disable Time from High Level
to Bn or Bn to An
SV00125
SV00122 Waveform 6. 3-State Output Enable Time to Low Level and
Waveform 3. Propagation Delay, SBA to An or SAB to Bn Output Disable Time from Low Level
1998 Feb 19 8
Philips Semiconductors Product specification
SWITCH POSITION
VM = 1.5V
TEST SWITCH Input Pulse Definition
tPLH/tPHL Open
tPLZ/tPZL 6V
tPHZ/tPZH GND
1998 Feb 19 9
Philips Semiconductors Product specification
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
1998 Feb 19 10
Philips Semiconductors Product specification
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1
1998 Feb 19 11
Philips Semiconductors Product specification
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1
1998 Feb 19 12
Philips Semiconductors Product specification
NOTES
1998 Feb 19 13
Philips Semiconductors Product specification
Objective Development This data sheet contains the design target or goal specifications for product development.
specification Specification may change in any manner without notice.
Preliminary Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date.
specification Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make
specification changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
yyyy mmm dd 14
This datasheet has been download from:
www.datasheetcatalog.com