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Wave soldering is a bulk soldering process used in the manufacture of printed circuit
boards. The circuit board is passed over a pan of molten solder in which a pump produces
an upwelling of solder that looks like a standing wave. As the circuit board makes contact
with this wave, the components become soldered to the board. Wave soldering is used for
both through-hole printed circuit assemblies, and surface mount. In the latter case, the
components are glued onto the surface of a printed circuit board (PCB) by placement
equipment, before being run through the molten solder wave.
As through-hole components have been largely replaced by surface mount components,
wave soldering has been supplanted by reflow soldering methods in many large-scale
electronics applications. However, there is still significant wave soldering where surface-
mount technology (SMT) is not suitable (e.g., large power devices and high pin count
connectors), or where simple through-hole technology prevails (certain major
appliances).

Contents
[hide]
1Wave solder process
2Fluxing
3Preheating
4Cleaning
5Finish and quality
6Solder types
7Effects of cooling rate
8Thermal profiling
9See also
10References
11Further reading

Wave solder process[edit]

A simple wave soldering

machine.

There are many types of wave

solder machines; however, the basic components and principles of these machines are the
same. The basic equipment used during the process is a conveyor that moves the PCB
through the different zones, a pan of solder used in the soldering process, a pump that
produces the actual wave, the sprayer for the flux and the preheating pad. The solder is
usually a mixture of metals. A typical solder has the chemical makeup of 50% tin, 49.5%
lead, and 0.5% antimony.[1]

Fluxing[edit]
Flux in the wave soldering process has a primary and a secondary objective. The primary
objective is to clean the components that are to be soldered, principally any oxide layers
that may have formed.[2] There are two types of flux, corrosive and noncorrosive.
Noncorrosive flux requires precleaning and is used when low acidity is required.
Corrosive flux is quick and requires little precleaning, but has a higher acidity.[3]

Preheating[edit]
Preheating helps to accelerate the soldering process and to prevent thermal shock.[4]

Cleaning[edit]
Some types of flux, called "no-clean" fluxes, do not require cleaning; their residues are
benign after the soldering process.[5] Typically no-clean fluxes are especially sensitive to
process conditions, which may make them undesirable in some applications.[5] Other
kinds of flux, however, require a cleaning stage, in which the PCB is washed
with solvents and/or deionized water to remove flux residue.

Finish and quality[edit]

Quality depends on proper temperatures when heating and on properly treated surfaces.
Defect Possible causes Effects
Cracks Mechanical Stress Loss of Conductivity
Contaminated surface
Reduction in strength
Cavities Lack of flux
Poor conductivity
Insufficient preheating

Wrong solder temperature
Wrong solder thickness
Wrong conveyor speed
Susceptible to stress
Too thin for current load
Undesired bridging between paths

Poor Conductor Contaminated solder Product Failures

Solder types[edit]
Different combinations of tin, lead and other metals are used to create solder. The
combinations used depend on the desired properties. The most popular combinations are
SAC (Tin(Sn)/Silver(Ag)/Copper(Cu)) alloys and Sn63Pb37 (Sn63A) which is 63% tin,
37% lead. The latter combination is strong, has a low melting range, and melts and sets
quickly. Higher tin compositions give the solder higher corrosion resistances, but raise
the melting point. Another common composition is 11% tin, 37% lead, 42% bismuth, and
10% cadmium. This combination has a low melting point and is useful for soldering
components that are sensitive to heat. Environmental and performance requirements also
factor into alloy selection. Common restrictions include restrictions on lead (Pb) when
RoHS compliance is required and restrictions on pure tin (Sn) when long term reliability
is a concern. [6] [7]

Effects of cooling rate[edit]

It is important that the PCBs be allowed to cool at a reasonable rate. If they are cooled too
fast, then the PCB can become warped and the solder can be compromised. On the other
hand, if the PCB is allowed to cool too slowly, then the PCB can become brittle and some
components may be damaged by heat. The PCB should be cooled by either a fine water
spray or air cooled to decrease the amount of damage to the board.[8]

Thermal profiling[edit]
Thermal profiling is the act of measuring several points on a circuit board to determine
the thermal excursion it takes through the soldering process. In the electronics
manufacturing industry, SPC (Statistical Process Control) helps determine if the process
is in control, measured against the reflow parameters defined by the soldering
technologies and component requirements.[9] Products like the Solderstar WaveShuttle
and the Optiminer have been developed special fixtures which are passed through the
process and can measure the temperature profile, along with contact times, wave
parallelism and wave heights. These fixture combined with analysis software allows the
production engineer to establish and then control the wave solder process.

See also[edit]
Dip soldering
Thermal profiling
Solder mask

References[edit]
1. Jump up^ Robert H. Todd, Dell K. Allen, Leo Alting (1994). Manufacturing
Processes Reference Guide. p. 393.
2. Jump up^ http://www.ipctraining.org/dvd/47c/script.pdf
3. Jump up^ Todd p. 396
4. Jump up^ Michael Pecht (1993). Soldering Processes and Equipment. p. 56.
5. ^ Jump up to:a b Giles Humpston, David M. Jacobson (2004). Principles of
Soldering. p. 118.
6. Jump up^ Todd p. 395
7. Jump
up^ http://www.aimsolder.com/sites/default/files/soldering_handbook_rev_10-
13.pdf
 8. Jump up^ Todd, Robert H.; Allen, Dell K.(1994). Manufacturing Processes
Reference Guide. New York: Industrial Press Inc.
9. Jump up^ http://www.ipc.org/TOC/IPC-7530.pdf

Further reading[edit]
Seeling, Karl (1995). A study of lead-free alloys. AIM, 1, Retrieved April 18,
2008, from http://www.aimsolder.com/techarticles/A%20Study%20of%20Lead-
Free%20Solder%20Alloys.pdf
Biocca, Peter (2005, April 5). Lead-free wave soldering. Retrieved April 18, 2008,
from EMSnow We