SonoAce 6000II System Manual Contents Guide

SonoAce 6000II Contents.
Contents
Chapter1. BASIC INFORMATION

1-1. PRE-INSTALLATION
1-2. INSTRUCTION
1-3. INSTALLATION GUIDE
SA6000II PRELIMINARY INSPECTON
SA6000II PRELIMINARY INSPECTON LIST
Chapter 2. DESCRIPTION OF SYSTEM

2-1. PSA BOARD
2-2. BF & RX BOARD
2-3. DSC BOARD
2-4. KEY INTERFACE & MATRIX
2-5. REAR BOARD
2-6. PC BOARD
2-7. MOTHER BOARD
2-8. SYSTEM SET -UP DIALOGUE
2-9. MAIN BOARD PICTURE
Chapter 3. SUB-APPARATUS
3-1. MAIN POWER SUPPLY
3-2. MONITOR
3-3. MOD
Chapter 4. DIAGRAMS
4-1. ASSEMBLING DIAGRA MS
4-2. CABLE DIAGRAMS
Chapter 5. SPECIFICATION
5-1. MAIN FEATURES
5-2. TECHNICAL SPECIFICATIONS
Service Manual Published by Customer Service Department

SonoAce 6000II Section 1-1. Pre- Installation
1. PRE-INSTALLATION
1.1 INSPECTION
Upon arrival, inventory the shipment with the carriers driver.
?? Carefully inspect the packing material for obvious signs of damage such as crushed,
punctured, torn, broken, wet or rattling packages.
?? If damage is not evident, sign and stamp a bill of lading condition of contents unknown
subject to inspection.
?? If damage is evident, contact your Purchasing Department for action, have the carriers driver
indicate the damage on the damage on the freight bill, and sign all copies of the bill.
During formal inspection, you should :
?? Open all packages within 15 days of receipt for a complete inspection of the consignment.
?? Report concealed damage to the carrier within 15 days of receipt or the carrier may not
accept liability.
1.2 UNPACKING
Please, unpack the system like following draw.
<Unpacking draw>
1.3 Basic features
?? 12 inch B/W monitor and main unit equipped with keyboard

?? Power cord, connection cable and fuse (2)
?? Users Guide (1)

?? Ultrasound gel (0.25 L)
?? Set cover
Item Description Quantity Location

226-P -089A PANEL BASKET SA6000II 1 Inside of Box
235-P -007A BRACKET CLAMP LFT 1 Inside of Box
235-P -007B BRACKET CLAMP RHT 1 Inside of Box
334-M -011A CLAMP FILTER LFT 12MTR 1 Inside of Box
334-M -011B CLAMP FILTER RHT 12MTR 1 Inside of Box
311-R -003A RUBBER GUIDE FILTER 12MTR 2 Inside of Box
271-Z -006C ACCESSARY BOX - ALL 1 BOX
275-K-859A ST ACCESSARY BOX-MEDISON 1 Stacker on Box
CBL-GROUND-NEW GROUND CABLE 1 Inside of Box
CORD-PWR -3-250V EUROPE AC CORD 250V 1 Inside of Box
CORD-316-MNT MNT PWR CORD 1.4M KKP1603 1 Inside of Box
GEL-0.25L SONO GEL 0.25L 1 Inside of Box
CNN-BNC-RCAJ BNC/MALE TO RCA/FEMALE 2 Inside of Box
RU-48P -BNC CAP CAP BNC 4800HD 4 On System
215-Z -715A SET COVER SA6000II 1 Inside of Box
12.5 MONITOR FILTER SEO IL (GLASS)
325-Z -010A 1 Inside of Box
SA6000II
FUSE-50T3.15L TRIAD 50T T3.15L250V 2 Inside of Box
FUSE-50T6.3L TRIAD 50T T6.3L250V 2 Inside of Box
MANUAL-6000II-E SA6000II MANUAL ENGLISH 1 Inside of Box
Table) Part List

1.4 Option features
?? Linear Probe
Model Name Specification Application

HL5-9ED 7.5 MHz / 40mm Small Parts
L5-9EC 7.5 MHz / 40mm Small Parts
L5-9ER 7.5 MHz / 50mm Small Parts
?? Convex Probe
Model Name Specification Application

C2-4ES 3.0 MHz/30R/90D Cardiac
EC4-9ES 6.5 MHz/10R/140D Trans -Vaginal
C3-7ED 4.5 MHz/50R/70D General
?? Software : DICOM
?? External VGA Monitor
?? Echo Printer : Sony UP890, MISTUBISH P91W Video Printer

?? Line Printer : HP DeskJet Series
?? VCR : VHS Type
?? Foot switch

SonoAce 6000II Section 1-2. Instruction
2. INSTRUCTION
2.1 NOTES TO USERS
Thank you for purchasing the SA6000II Ultrasound system. To ensure safe operation and long
term performance stability, it is essential that you fully understand the functions, operation and
maintenance instructions by reading this manual before operating your equipment.
?? Incorrect operation, or failure of the user to maintain the equipment relieves the
manufacturer or his agent of the system's non-compliance with specifications or of
responsibility for any damage or injury.
?? The following conventions are used throughout the manual to denote information of special
emphasis.
WARNING !
Warning is used to indicate the presence of a hazard which can cause
severe personal injury, death, or substantial property damage if the
warning is ignored.
CAUTION !
Caution is used to indicate the presence of a hazard which will or can
cause minor personal injury or property damage if the warnings ignored.
NOTE
Note is used to notify the user of installation, operation, or maintenance
information which is important but not hazard-related. Hazard warnings
should never be included under the Note signal word.

2.2 SAFETY PRECAUTIONS
2.2.1 Biological safety
This s ection contains information about biological safety and a discussion of the prudent use of
the system.
A list of precautions related to biological safety follows; observe these precautions when using
the system.
Do not use the system if an error message appears on the video display indicating
that a hazardous condition exists. Note the error code, turn off power to the system,
and call your customer service representative.
Do not use a system that exhibits erratic or inconsistent updating. Discontinuities in
the scanning sequence are indicative of a hardware failure that must be corrected
before use.
Perform ultrasound procedures prudently. Use the ALARA (as low as reasonably
achievable) principle.
WARNING Use only acoustic standoffs that have been approved for use by MEDISON.
Verify the alignment of the biopsy guide before use. See the [Probes] section of this
manual.
Verify the condition of the biopsy needle before use. Do not use a bent biopsy
needle.
Biopsy guide sheaths contain natural rubber latex. These sheaths may cause allergic
reactions. Refer to the FDA Medical Alert on Latex Products, dated March 29, 1991,
in the Sheaths section of this manual.
ALARA Education Program
The guidance for the use of diagnostic ultrasound is defined by the as low as reasonably
achievable (ALARA) principle. The decision as to what is reasonable has been left to the judgement
and insight of qualified personnel. No set of rules can be formulated that would be sufficiently
complete to dictate the correct response to every circumstances. By keeping ultrasound exposure as
low as possible, while obtaining diagnostic images, users can minimize ultrasonic bioeffects.
Since the threshold for diagnostic ultrasound bioeffects is undetermined, it is the sonographer s
responsibility to control total energy transmitted into the patient. The sonographer must reconcile
exposure time with diagnostic image quality. To ensure diagnostic image quality and limit exposure
time, an ultrasound system provides controls that can be manipulate d during the exam to optimize the
results of the exam. The ability of the user to abide by the ALARA principle is important. Advances in
diagnostic ultrasound not only in the technology but in the applications of that technology, have
resulted in the need for more and better information to guide the user. The output indices are
designed to provide that important information
There are a number of variables which affect the way in which the output display indices can be
used to implement the ALARA principle. These variables include values, body size, location of the
bone relative to the focal point, attenuation in the body, and ultrasound exposure time. Exposure time
is an especially useful variable, because it is controlled by the user. The ability to limit ht e index
values over time supports the ALARA principle.


2.2.2 Electronic Safety
This equipment has been verified as a Class I device with Type BF applied part. For maximum
safety observe these warnings
Shock hazards may exist if this s ystem, including all externally mounted
recording and monitoring devices, is not properly grounded. In a hospital, doctors
and patients are subjected to dangerous, uncontrollable compensating currents.
WARNING These currents are due to the potential differences between connected equipment
and touchable conducting parts as found in medical rooms. The safe solution to the
problem is accomplished with consistent equipotential bonding. Medical equipment
is connected with connecting leads made up with angled sockets to the equipotential
bonding network in medical rooms.
Connection Lead
(Socket)
M
Ground A
I
Connector N
Earth in Medical Room B
O
~
~
D
Y
Detail 2. SA6000II Main Console Safety Ground

Do not remove the protective covers on the system; hazardous voltages are present
inside. Cabinet panels must be in place while the system is in use. All internal
adjustments and replacements must be made by a qualified MEDISON customer
service representative.
Do not operate this system in the presence of flammable gases or anesthetics.
Explosion can result.
To avoid risk of electrical shock hazards, always inspect all the probes before use;
check the face, housing, and cable before use. Do not use, if the face is cracked,
chipped, or torn, the housing is damaged, or the cable is abraded.
To avoid risk of electrical shock hazards, always disconnect the system from the wall
outlet prior to cleaning the system.
To avoid risk of electrical shock, do not use any probe that has been immersed
beyond the specified cleaning or disinfection level. See [Appendix A.
MAINTENANCE] manual.
WARNING To avoid risks of electrical shock and fire hazards, inspect the system power cord
and plug on a regular basis. Ensure that they are not damaged in any way.
To avoid risk of electrical shock hazards, accessory equipment connected to the
along the digital in terfaces must be certified according to the representative IEC
standards (I.e. IEC60950/EN60950 for data processing equipment and IEC60601 -
1/EN60601-1 for medical equipment). Furthermore all configurations shall comply
with the system standard IEC60601-1-1/EN60601-1-1. Everybody who connects
additional equipment to the signal input part or signal output part configurations a
medical system, and is therefore responsible that the system complies with the
requirement of IEC60601-1-1/EN60601-1-1. If in doubt, consult the technical
services department or your local representative.
Do not touch the SIP/SOP and patient simultaneously. It may cause a leakage current
exceeding the maximum allowable values.
Although your system has been manufactured in compliance with existing EMI/EMC
requirements, use of this system in the presence of an electromagnetic field can
cause momentary degradation of the ultrasound image. If this occurs often, MEDISON
suggests a review of the environment in which the system is being used, to identify
possible sources of radiated emissions. These emissions could be from other
electrical devices used within the same room or an adjacent room. Communication
devices such as cellular phones a n d pagers can cause these emissions. The
exis tence of radio, TV, or microwave transmission equipment located nearby can
cause emissions. In cases where EMI is causing disturbances, it may be necessary to
relocate your system.
Electrostatic discharge (ESD), commonly referred to as a static shock, is a
CAUTION naturally occurring phenomenon. ESD is most prevalent during conditions of low
humidity, which can be caused by heating or air conditioning. During low humidity
conditions, electrical charges naturally build up on individuals and can create static
shocks. An ESD condition occurs when an individual with an electrical energy build-
up comes in contact with objects such as metal doorknobs, file cabinets, computer
equipment, and even other individuals. The static shock or ESD is a discharge of the
electrical energy build-up from a charged individual to a lesser or non-charged
individual or object. The level of electrical energy discharged from a system user or
patient to the ultrasound system can be significant enough to cause damage to the
system or probes. The following precautions can help to reduce ESD: anti -static spray
on carpets; anti -static spray on linoleum; anti-static mats; or a ground wire
connection between the system and the patient table or bed.

2.2.3 Mechanical Safety
Be aware of the casters, especially when moving the system. The system can weigh
approximately 70kg, depending upon configuration, and it could cause injury to you
or others if it rolls over feet or into shins. MEDISON recommends that you exercise
WARNING caution when going up and down ramps.
The monitor has been designed so that it can be easily removed from the system if
needed.
?? System breake
The system has a brake for the front wheels. Press down on brake with foot to lock and lift up to
release. Release the brake when moving the system. However, if you apply more power then a
certain limit to the system, the break may not work properly..
?? Moving the system
Only the front wheels are steerable on the system. Therefore to maneuver the system in tight
spaces, use repeated back-and -forth movements to position the system into the desired space.
If the system behaves abnormally after moving the system, please contact the technical services
department or your local representative. On rare occasions a component may have become
disconnected inside the system and may cause a problem. The components are installed securely
and can withstand considerable shock, but excessive shock may cause a system failure.
2.2.4 SYMBOLS
The international Electrotechnical Commission (IEC) has established a set of symbols for medical
electronic equipment, which classify a connection or warn of potential hazards. The
classifications and symbols are shown below.
Isolated patient connection (Type BF applied part).
I and O on power switch represent ON and OFF, respectively.
This symbol identifies a safety note. Be sure you understand the function of this
control before using it. The control function is described in the appropriate
operation manual.
Identifies equipotential ground.
Indicates dangerous voltage over 1000 VAC or over 1500 VDC.

Identifies the point where the system safety ground is fastened to the
chassis. Protective earth connected to conductive parts of Class I
equipment for safety purposes.
Output port fo r VGA or Parallel port
Input/Output(I/O) port used for modem or RS232C port.
Left and right audio input.

Video input
Left and right audio input

Video output
Print remote output
Connection for foot switch
Protection against the effects of immersion.
Protection against dripping water.
Connection for probes

2.3 MAINTENANCE
2.3.1 PROBE
Always use protective eyewear and gloves when cleaning and disinfecting probes
WARNING and biopsy guide adapters.
Probes must be cleaned after each use. Cleaning the probe is an essential step prior
to effective disinfection or sterilization. Be sure to follow the manufacturers
instructions when using disinfectants.
CAUTION Do not allow sharp objects, such as scalpels or cauterizing knives, to touch probes
or cables.
When handling a probe, do not bump the probe on hard surfaces.
The probe that you select is the most important factor in image quality. Optimal imaging cannot
be attained without the correct probe. The system is optimized for use based on your probe
selection.
?? CLEANING
Do not use a surgeons brush when cleaning probes. The use of even soft brushes
can damage the probe.
CAUTION During cleaning, disinfection, and strilization, orient the parts of the probe that must
remain dry higher than the wetted parts until all parts are dry. This will help keep liquid
from entering non-liquid-tight areas of the probe.
Disconnect the probe from the system.

Remove any sheaths, biopsy guide adapters, or biopsy needle guides(biopsy guide
adapters are re-usable portion of the biopsy guide and can be sterilized.)
Discard sheaths(sheaths are single-use item)
Use a soft cloth lightly dampened in a mild soap or compatible cleaning solution to
remove any particulate matter or body fluids that remain on the probe or cable.
To remove remaining particulates, rinse with water up to the immersion point.
Wipe with a dry cloth; or wipe with a water-dampened cloth to remove soap residue, and
then wipe with a dry cloth.

?? DISINFECTION OR STERILIZATION
-6
Only the EC4-9ES probe can be sterilized. A 10 reduction in pathogens should be reached
following the sterilization procedures in this manual and using the following MEDISON recommended
solutions. The following disinfectants are recommended because of both its biological effectiveness
(as qualified through the FDA 510(k) process) and its chemical compatibility with MEDISON ultrasound
product materials.
Solutions Country Type Active ingredient FDA 510(k)

Cidex USA Liquid Gluteraldehyde K934434
Cidex Plus USA Liquid Gluteraldehyde K923744
If a pre-mixed solution is used, be sure to observe the solution expiration date.

The level of disinfection required for a device is dictated by the type of tissue it will
contact during use. Ensure that the solution strength and duration of contact are
WARNING appropriate for disinfection or sterilization. Be sure to follow the manufacturers
instructions.
In neurosurgical application, sterilized probes should be used with a pyrogen-free
sheath.
Using a n o n -recommended disinfection solution, incorrect solution strength, or

immersing a probe deeper or for a period longer than recommended can damage or
discolor the probe and will void the probe warranty.
CAUTION Do not immerse probes longer than one hour, unless they are sterilizable. Probes
may be damaged by longer immersion times.
Sterilize probes using only liquid solutions. Using autoclave, gas(EtO), or other non-
MEDISON-approved methods will damage your probe and void your warranty.
Mix the disin fection solution (or sterilization solution, for sterilizable probe) compatible
with your probe according to label instructions for solution strength. A disinfectant
qualified by the FDA 510(k) process is recommended.
Immerse the probe into the disinfection solution (or sterilization solution, for sterilizable
probe) as shown in the figure below for your probe.
Follow the instructions on the disinfection (or sterilization, for sterilizable probe) label for
the duration of probe immersion. Do not immerse probes longer than one hour, unless
they are sterilizable.
10. Using the instructions on the disinfectant or sterilization label, rinse the probe up to
the point of immersion, and then air dry or towel dry with a clean cloth (or a sterile cloth,
for sterilizable probe).
11. Examine the probe for damage such as cracks, splitting, fluid leaks, or sharp edges
or projections. If damage is evident, discontinue use of the probe and contact your
customer service representative.


2.3.2 BIOPSY GUIDE ADAPTOR AND NEEDLE GUIDE
The external surfaces of reusable biopsy guide adapters can be sterilized using one of the
-6
following procedures. A 10 reduction in pathogens should be reached by following the sterilization
procedures in this manual.
Always use protective eyewear and gloves when cleaning and disinfecting probes
WARNING and biopsy guide adapters.
Biopsy guide must be cleaned after each use. Cleaning the biopsy guide adapter is
essential steps prior to effective disinfection or sterilization. Be sure to follow the
CAUTION manufacturers instructions when using disinfectants.
Do not use bleach to clean or sterilize the biopsy guide adapter. Using bleach on the
adapter may cause damage and will void your warranty.
To clean and sterilize stainless steel biopsy guide
?? CLEANING
After use, remove the biopsy guide assembly from the probe.
Disassemble the biopsy guide into its component parts, if applicable. Discard the single-
use parts. These parts cannot be resterilized.
Using a small brush and water, scrub each part to remove trapped material from the
reusable components.
Rinse with water to remove remaining particulates.

?? STERILIZITION
Sterilize the biopsy guide adapter by autoclaving (Steam) or using gas (Ethylene Oxide).
After sterilization, follow the proper post-sterilization procedure for the sterilization
method used.
Inspect the biopsy guide adapter for damage such as cracks, rust or breakage. If
damage is evident, discontinue use of the biopsy adapter and contact your local
MEDISON representative.
To clean and sterilize stainless plastic biopsy guide
?? CLEANING
After use, remove the biopsy guide assembly from the probe.
Disassemble the biopsy guide into its component parts, if applicable. Discard the single-
use parts. These parts cannot be resterilized.
Using a small brush and water, scrub each part to remove trapped material from the
reusable components.
Rinse with water to remove remaining particulates.

?? STERILIZATION
Reusable plastic biopsy guide adapters can be sterilized only by using a chemically
CAUTION compatible cold-sterilization solution. Sterilization by autoclaving or by using gas or
radiation will permanently damage these parts.
Sterilize the components by using a chemically compatible cold-sterilization solution. A

sterilant qualified by the FDA 510(k) process is recommended. Ensure proper contact
time (usually 10 hours) and solution temperature used.
The following disinfectants are recommended because of both its biological effectiveness (as
qualified through the FDA 510(k) process) and its chemical compatibility with MEDISON
ultrasound product materials.
Solutions Country Type Active ingredient FDA 510(k)
Cidex USA Liquid Gluteraldehyde K934434
Cidex Plus USA Liquid Gluteraldehyde K923744
After sterilization, follow the proper post-sterilization procedure for the sterilization
method used.
Inspect the components for damage such as cracks, rust or breakage. If damage is
evident, discontinue use of the biopsy adapter and contact your local MEDISON
representative.
??
2.3.3 SYSTEM SURFACES
The exterior surfaces of most MEDISON ultrasound systems can be disinfected using a
recommended disinfectant with a wipe method.
You can use the following procedure to disinfect system surfaces on these systems.
Always use protective eyewear and gloves when cleaning and disinfecting any
WARNING equipment.
CAUTION Use only recommended disinfectants on system surfaces.
?? CLEANING
Turn off the system and disconnect the system power cord from the wall outlet.
Use a soft cloth lightly dampened in a mild soap or detergent solution to clean exterior
surfaces on the system.
?? DISINFECTION
Mix the disinfection solution compatible with your system according to label instructions
for solution strength. A disinfectant qualified by the FDA 510(k) process is recommended.

Wipe the system surfaces with the disinfection solution, following disinfection label
instructions for wipe durations, solution strengths, and disinfectant contact duration.
Ensure that the solution strength and duration of contact are appropriate for the intended
clinical application.
Air dry or towel dry with a sterile cloth according to the instructions on the disinfectant
label.
2.3.4 Protect Circuit
?? Fuse Replacement
Open the fuse drawer on the upper side of the appliance inlet, there will be the two small
fuse holder.
Push the fuse holder toward the arrow direction, and Pull the fuse holder toward the
upper side of the appliance inlet.
Remove the old fuse by pulling up.
Install the new fuse by pushing to the fuse holder.
Insert the fuse holder to the appliance inlet. At this time, the arrow direction on the upper
side of the fuse holder should be in accordance with that on the fuse draw. Also, the
same method is used to exchange the other fuse holder.
Close the fuse drawer
?? Regular Fuse Electricity
Input Electricity Fuse Electricity
100-120VAC 50T6.3L / 250V
200-240VAC 50T3.15L/250V

Kauttu. Box Fuse

Drawer
Nur Sicherung 250V
Use Only With A 250V Fuse
Employer Uniquement Avec
Fusible De 250V
AC
INLET
Figure-A. Appliance INLET
Close
x 2EA
Open
Fuse Holder Fuse
Figure-B. Side view of Figure-C. Inserting Fuse and

Appliance INLET Fuse Holder @ s.h.kim 1996 Feb

SonoAce 6000II Section 1-3. Installation Guide
3. SA6000II INSTALLATION GUIDE

3.1 System location and check-out
Avoid the following environments for operation or storage
Where the equipment is exposed to water vapor.

Where the equipment is exposed to direct sunlight.
Where the equipment is exposed to dust.
Where the equipment is exposed to high humidity.
Where there is a ventilation problem.
Where the equipment is exposed to a salty atmosphere.
Where the equipment is exposed to chemicals or gas.
Maintain following temperature and humidity.
Using temperature : 10C ~ 35 C (Recommend temperature : 17C ~ 23C), When transfer or
storage : -25C ~ 60C
Using humidity : 30% ~ 75%, When transfer or storage : 20% ~ 90%
Avoid strong impact or the place to exist oscillation.
NOTE : Try to place the system far from power generators, X-ray machines,
broadcasting stations, and transmission line to avoid electrical noise during scanning.
Otherwise, abnormal images may result. An independent circuit and a safely grounded
outlet are strongly recommended for the SA-9900. Poor or abnormal images may occur
if the system shares a power source with other electrical or electronic equipment.
3.2 System Installation
1) Unpacking main box

SA6000ii main box is consisted of main system, accessory box, probe box.
2) Monitor installation
Picture3)
Picture 1) Picture 2)
Install the monitor base to monitor (Picture 1)

Set the monitor to the system. (Picture 2)
Screw the monitor to main system (Picture 3)
Connect the monitor power cable and signal cable to system.

SonoAce 6000II Section 1-3. Installation Guide.
3) PROBE Installation
Unpack the probe and connect the probe to system. (Picture 4)
Turn the knob to arrow direction to fix.
4)
3) Power connect
110V/220V
Select Switch
Monitor/
Printer
Power
Main
Power
4) Before using the system please, check the following.

Check the power is suitable with system power specification (110V/220V).
Check all connector is connected in position.
Check the system is grounded exactly. (If not, there are possibility noise occur)
Check the power is off status when connect the probe.

SonoAce 6000II Section 1-3. Installation Guide.
3.3 PERIPHERAL DEVICES
3.3.1. Rear Panel
You can connect the system with peripherals, such as monitor, printer, or VCR through the Rear
Panel at the rear part of the system.
MONITOR (Output) :
This sends video signal to Main Monitor
ECHO PRINTER (Output) :

This sends video signal to B/W Echo Printer
VCR VIDEO (Input Output) :

This sends video signal to VCR
FOOT SWITCH :
This is port for foot switch
RS-232C (Input/Output) :
This can control VCR by the Serial port
PARALLEL (Output) :
This is port for Line Printer
USB (Input/Output) :
This is USB port.
LAN (Input/Output) :
This is the access to the Internet Line (Ethernet), and can be
applied to the option, DICOM
VGA (Output) :
This sends VGA signal to the monitor.
PRINT REMOTE :
This is B/W printer remote cable port.

SonoAce 6000II MEDISON Co.Ltd.,
3.3.2 Echo Printer
You can print B/W images and any information on the screen just as they look on the screen.
Connect each end of the provided cable to ECHO PRINTER [VIDEO OUT] jack and [VIDEO
IN] jack located at the back panel of SA-6000II
Connect the provided cable between ECHO PRINTER [PRINT REMOTE] jack and [REMOTE]
jack located at the back panel of SA-6000II.
Press <FREEZE> key in the desired screen to freeze the image. Then, press <PRINT> key to
print the image. Alternatively press PRINT key of echo printer
Echo printer uses different types of power (110V or 220V ) according to the area
NOTE where the system is produced. Currently this system is set to 110V, thus please
make sure of it before connecting.
3.3.3 VCR (Video Cassette Recorder)
This feature allows you to record the images on the screen onto any plain video tape in real
time so as to retrieve or use it at any time, in particular for seminar presentation/ discussion,
and clinical data
For recording, connect the provided cable between VCR [VIDEO OUT] signal jack and [VIDEO
IN] jack located at the pack panel of SA-6000II.
Press VCR RECORD button.
To stop recording, press VCR STOP button
If you wish to view the images recorded on SA-6000II monitor, connect the provided cable
between VCR [VIDEO OUT] jack and [VIDEO IN] jack located at the back panel of SA-
6000II,If you want to view VCR playing image directly on the internal monitor, press [Z] on
the alphanumeric keyboard.
In order to stop VCR PLAY, press [X] on the alphanumeric keyboard or [EXIT] button on the
control panel.
Service Manual Published by SERTECH

- 12 -
3.3.4 Line Printer
You can print all the letters offered by Report function and images on the screen on a plain
paper just as they look on the screen. You can save the printing cost by using Line printer
since the cost for one- time use of echo printer is usually higher than that for Line printer.
Connect the provided cable between [PARALLEL] located at the back panel of SA-6000II and
[PARALLEL interface] jack at the back of Line printer.
To print report or images on the screen through Line printer, press <SET> key after
confirming with trackball.
Never press <PRINT> key on the keyboard.

NOTE Pressing the <PRINT> key on the keyboard makes echo printer work. Dont be
confused when you use Line printer.
3.3.5 External Monitor
Plain Monitor
External monitor is designed for allowing even the people in a waiting room to view the
ultrasound image from the operating room. Generally, VGA monitor for PC is used for the
external monitor.
Connection: Connect a cable with the [VGA] port at the rear panel.
3.3.6 Foot Switch
Foot Switch is designed to let you use the pedal for the execution of simple functions while
examining patients.
Connect the provided Foot Switch to jack located at the back panel of SA6000II

- 13 -
Preventive Maintenance Procedure for SA6000II
This procedure should be completed using the same environment that is used when the customer is
performing daily exams, for example: Use the same examination room, the same wall outlet, and
especially during image quality evaluation, the same room background lighting conditions.
A. Functional Operation & Test
1. Press the Power On switch on the main side panel and confirm the following :
Keyboard lights up.
LED on monitor lights up green color.
At first the MEDISON logo will appear and then the System executes up in the standard
B-mode format.
2. On the Display Monitor, confirm the following :
Adjustment of the monitor brightness and contrast controls from the minimum to
maximum results in no distortion(blooming) on the display.
Display is centered on the screen, with good vertical and horizontal resolution (linearity).
There is no tearing or bedding at the corners.
B. Probe Test
1. For each Probe attached to the system, perform the following tests, and confirm proper operation :
Visually Inspect the head of the probe to insure that there are no cracks, separation, or
peeling of the insulating material on the face of the probe.
Knife test : With a light coating of Echo Gel on the face of the probe, slowly scan across
the elements with a thin flat blade, while observing the display for the resulting bright
columns of echoes, with no blank lines that would indicate missing or faulty channels in
the probe.
Screen image

- 14 -
PROBE CABLE .
Connector housing screw .
2. For each Mechanical Sector Probe attached to the system, confirm the following:
Observe that the nose cone is not marred, scratched, or peeling.
Observe that there are no air bubbles (smaller than 3 mm in size are acceptable) visible
in the face of the probe.
Observe that there are no signs of fluid leakage around the seals or nose cone.
3. Obtain a suitable image on the display and confirm the following:
There are no missing lines of information (drop out) in the sector.
The motor runs smoothly and quietly with no abnormal knocking sounds.
Examine the probe cable and confirm that there are no cuts, crimps, or tears in the
insulation.
Inspect the connector housing and confirm that screws, fasteners, and clamps are all
secure.
C. Operational Mode Tests
Please check the each function of the system by operation manual.

- 15 -

- 16 -
SA6000II Preventive Maintenance Check List
Date : Name of Distributor :

Name of Hospital System Serial #
Name of User Version #
Address Warranty
Expiration
Phone #
Instructions :
All of this information is necessary for the warranty.
Check appropriate box below upon the completion of each section of the procedure.
Items Good Bad Remarks

. Check the packing items (compare with packing list)
. System exterior cleaning procedure
. Probe appearance
A. Functional operation & test (system initialization state)
1. Power on Sequence and system diagnostics
2. Monitor display
3. Key Board Test
B. Probe test (with each probe)
1. Appearance Condition
2. Knife test
C. Operational Mode Tests
1. 2D Mode
2. M Mode
3. Measurement Test
4. Zooming & Cine memory Function Test
5. Image Filing Function Test
D . Electrical Test & Calibration
1. Power Supply
2. System Calibration
3. Power Cord/Plug and 110/220 switch
E. Mechanical operation
1. Circuit boards, plugs, jacks, and connectors seated
2. Handles & probe holders, monitor, metal panels and wheels

- 17 -
3. Seating & connection of cables & cords to peripherals

F. Echo printer, External monitor, Multi-form camera, VCR
Please send this form to MEDISON by FAX or Air Mail after Fill out the above boxes completely,
Confirmation Signature
Name of Distributor
Service Representative Customer

- 18 -
SonoAce 6000II Section 2-1. PSA Board
1. PSA BOARD
PSA (Probe Select Array) has the function which interface System and Probe. Probe Select Board
has two 156-pin cannon connectors, and each pin is defined to divide Probe ID and Port A/B, and it
is made by Relay circuit to select either of th e two probes.
1.1 Generic Pin outs
1.1.1 Slot connector
It can define various kinds Probe ID and Slot Connector Pin outs according to Port Select like
below table.
Pin Signal Function

J1(182) /R_A Port A Select
J1(181) /R_B Port B Select
J1(176) /PINSA Port A Insert
J1(175) /PINSB Port B Insert
J2(175) PIDA0 Port A ID
J2(176) PIDA1 Port A ID
J2(181) PIDB0 Port B ID
J2(182) PIDB1 Port B ID
J1,J2 ECHO 1 ~ 128 Echo

1.1.2 Cannon Connector
Connector use 156-pin connector of ITT cannon
Linear/Curved Array
1 2 3 4 5 6
EL97 EL105 GND GND EL2 EL10 A

EL65 EL73 EL33 EL34 EL42 EL66 B
GND EL41 EL1 EL74 EL98 GND C
EL9 EL99 EL107 EL106 EL4 EL12 D
EL35 EL75 GND GND EL36 EL44 E
EL3 EL43 EL67 EL68 EL76 EL100 F
GND EL11 EL101 EL108 EL6 GND G
EL109 EL69 EL77 EL14 EL38 EL46 H
EL37 EL45 GND GND EL70 EL78 J
EL5 EL13 EL103 EL102 EL110 EL8 K
GND EL111 EL71 EL16 EL40 GND L
EL47 EL39 EL79 EL48 EL72 EL80 M
EL7 EL15 PIDA0 PIDA1 EL104 EL112 N
EL113 EL121 /PINSA GND EL18 EL26 P
EL49 EL89 EL81 EL50 EL58 EL82 R
GND EL57 EL17 EL90 EL114 GND S
EL25 EL115 EL123 EL122 EL20 EL28 T
EL83 EL91 GND GND EL52 EL60 U
EL51 EL59 EL19 EL84 EL92 EL116 V
GND EL27 EL117 EL124 EL22 GND W
EL125 EL85 EL93 EL30 EL54 EL62 X
EL53 EL61 GND GND EL86 EL94 Y
EL21 EL29 EL23 EL118 EL126 EL24 Z
GND EL31 EL55 EL32 EL56 GND a
EL63 EL87 EL95 EL64 EL88 EL98 b
EL119 EL127 GND GND EL120 EL128 c

1.2 Probe Switching
1.2.1 Probe Switching
It uses Relay AGN21012 to do switching either of the two Probes. Relay AGN21012 have two 1-
pole/2-thow switch in one chip, and it is Latched type. These Relays make /R_A_1, /R_A_2, /R_A_3,
/R_A_4 signal after receiving two /R_A, /R_B signal from BF board. And it makes Grouping each
Relay, and switching. /R_A_A and /R_A_B, /R_AB_A and /R_AB_B are same signal. These switching
table is same as below table.
/R_A /R_B Probe Port
0 1 A
1 0 B
Switching of Table Relay

1.2.2 Probe ID and Port recognition
The resistance value of Probe ID is connected from PSA to RX B/D.

BF reads the value of /PINSA,/PINSB, to recognize Port, and Port Main S/W output Prot Out.
/PINSA /PINSB Probe Port
0 0 A,B
0 1 A
1 0 B
1 1 No Probe
Probe Port recognition

1.2.3 Relay Switching Diagram
System Probe
Element Switching
Port A
ECHO
+ - Port B
/R_A +
Relay switching diagram

1.3 PSA B/D Configuration Diagram
SA6000II PSA
J3 J4
J2 J1

SonoAce 6000II Section 2-2. BF & RX Board
2. BF and RX Board
2.1 BF and RX in the whole system
SA6000-II is developed only B/W mode ultrasound diagnosis system.

Ultrasound system has standard flow as Tx -> Beamformation -> Mid -processing -> Digital Scan
Conversion -> Video Manager -> Monitor.
Tx Pulse
TARGET
Transducer delay line
Tx
Focus
RF -> MONITER
Baseband
Time Gain
Compensation Rx Focus MID Proc DSC V M
Focused
signal
target
Transducer delay line

FM FM
Standard structure of Ultrasound system

SA6000-II is very simple compared with SA9900, because it is only B/W mode ultrasound
diagnosis system. And it is possible that integrate Mid-processing, Digital Scan Conversion, and
Video Manager in one board.
So, the main board of SA6000-II is three boards (DSC, BF, RX), and the other boards are Power, PC,
Key, Mother Board (Back Plane), PSA (Probe Select Assembly, Front Plane)
SA6000-II
Structure
MONITER
RX
Mother Board (Back Plane)
BF
PSA (Front Plane)

DSC
Rear Board PC
POWER
NETWORK
Standard structure of SA6000-II
This chapter explains about BF and RX.
2.2 Feature of BF and RX in SA6000-II
SA6000-II is only B/W mode popular ultrasound diagnosis system. It is not necessary Steering,
because this system is not support Color/Doppler Mode and Phased Array Probe. Also, this system
has Folding structure. Then it can make 64-channel resolution image, although internal structure is
32-channel. Moreover this system makes 128-channel effect, because it supports Synthethic. Also, it
is possible to support Apodization, maximum 64-step Receiving Dynamic Aperture, maximum 16 Tx
Focal Point. Now, the Sampling frequency of RF signal is 30.8 MHz, but it is possible to be upgrade to
61.6MHz without changing circuit.
The BF and RX of SA6000-II has very simila r function to BF of SA9900. But that of SA6000 -II used
Folding Structure to reduce price and number of board. If Rx is 64-channel, it is necessary that

MCB014 is 16ea, ADC is 64ea, TGC is 64ea. But SA6000-II used just 8ea MCB014, 32EA ADC, 32ea
TGC by using Analog Switch of 16ea MT8816.
M/B
DSC
MID
PROCESSING
MODULE
RF_DATA
[0..15]
B/F
RO_OUT AD[0..31] TX_PN ECHO

A/D C BFICs Tx Pulser ASICs
[0..31] _D[0..7] [0..127] [0..127]
PSA
RX
TGC_OUT TGC_IN ECHO

RO_OUT
TGC REORDERING Rx S/W
[0..63] [0..63] [0..127]
[0..63]
Data Flow of BF and RX
Above picture is the data flow of BF and RX. Tx trigger signal to be made at BFIC of BF shoots
pulse through Tx pulser ASIC. Also, Echo signal to come from probe is passed Pre-amp step, and in
this step it performs Reordering(or Folding) to reinforce weak signal. Signal to be performed
Reordering is transmitted TGC - M/B(Mother Board) - BF, perform ADC at BF, and is became
summing at BFIC.

2.3 BF Board
BF of SA6000-II can divide four part functionally, Tx Part, BFIC, ADC Group, and BF-RX Board
Controller. Tx part is part to shoot High Voltage(+/ - 80V) in suitable condition. BFIC is part that it
sends Trigger signal to Tx Pulsing according some Focal point, and performs summing AD input
signal to come from each Channel by Dynamic Focusing method according to Geometry of each
probe, and transmits the result to Mid-processing Module of DSC. ADC Group is Analog circuit part to
be included LC filter to have AD Converter (AD9283-50). BF-RX controller is part that controls each
Digital device by using XC95144-TQ144 CPLD to be possible Hardware programming.
Block[7]
BF-CTRL
/METRG /M_ETRG
M_MCLK BUF's M_CLK Block[1]
p_mdata[15..0] p_data[15..0]
h_maddr[2..0] h_addr[2..0]
h_mdata[15..0] h_data[15..0] Block[0]
M_CLK /ETRG
Block[0]
p_data[15..0] p_data[15..0] M_CLK /ETRG LVC08's
h_addr[2..0] h_addr[2..0] +HV TX
Pulser
h_data[15..0] h_data[15..0]
MCB014(BFIC) -HV TX echo[n+71,n+64]
tgc_out[n+3] Anti-aliasing Pulser
ADC ad(n+3)_data[7..0]
Filter +HV TX
tx_out_p[7..0]
Filter -HV TX echo[n+7..n]
tx_out_n[7..0]
Filter elem_sel[7..0]
MFC019's
tgc_out[n] Anti-aliasing
ADC ad(n)_data[7..0] LV04's
Filter
BF Block Diagram
Above picture is Block Diagram of BF. Exciting signal from MCB014 (BFIC) is transmitted to
LV04(TTL, NOT gate) and LVC08(TTL, AND gate), and to probe element after conversion to High
voltage at High Voltage Pulser ASIC(MFC019). Also, 32ea ADC to be below part of picture is became
Path that Analog signal to come from Rx board goes to input of MCB014. Buffers are became Gate at
Host, DSC, and Interfacing. XC is CPLD to be composed XC95144-TQ144, and it is Controller. There
are more detail explanation at next section.

2.3.1 Controller
Because BF and RX work as if one board, it uses just one XL95144 TQ -144 in Controller. This
Controller control Digital Device as decoding of PC command when PC performs setting MCB014 inter
register of BF or downloading data at memory of RX board. Also, it contains version information of BF.
BF Controller works with two part Host Model(it is said to be CPU model, or Halt model) and Real
Mode. Timing Spec of input signal to be matched Host Model is same below picture.
/CPU_CS
/CPU_WR
CPU_ADDR ADDR
CPU_DATA DATA
Ts TH Ts TH
When it is Host Mode, Time Spec Diagram of input Signal
Real Mode have two input signal, and it is necessary /ETRG and Time Spec of Master Clock to
make accurate bf_delay signal. 8ea BFIC of SA6000-II performs input RF signal Beamforming from
each channel. Bf_dealy is at a minimum time to necessitate at BFIC.
/EX_TRG
MM_CLK
When Real Mode, Time Spec Diagram of Input Signal
As below picture, the signal of data_out_ready is connected to output pin of BFIC. This pin is the
signal to announce, which BFIC performed summing to focus RF signal came from 4ea channel and
preparation to add with BFIC is finished. Before preparation step, the signal is High Impedance state.
But finished preparation step, the signal become LOW state. But the Driving ability of this output pins
is shortage, so it makes bf_delay signal at BF_CTRL. So bf_delay has more long time than point in
time which all of data_out_ready become LOW. The last data_en_b signal is delayed as number of
BFIC * 3 M_clk, and it become rf_dvs(RF Data Valid Strobe) to go to Mid.

/ETRG
M_CLK
BF CTRL
BF_DELAY
DATA_READY_OUT
DATA_OUT_READY DATA_OUT_READY DATA_OUT_READY DATA_OUT_READY
Board_DIR Board_DIR Board_DIR Board_DIR
DATA_EN_A DAT_EN_B
DATA_EN_A DATA_EN_B DATA_EN_A DATA_EN_B DATA_EN_A DATA_EN_B DATA_EN_A DATA_EN_B
(RF_DVS)
BFIC #7 BFIC #6 BFIC #(---) BFIC #0
EXT_B[ ]
EXT_A[ ] EXT_B[ ] EXT_A[ ] EXT_B[ ] EXT_A[ ] EXT_B[ ] EXT_A[ ] EXT_B[ ]
(RF_DATA[ ])
Summing Chain and bf_delay of BFIC

2.3.2 BFIC
The Beamformation of SA6000-ll is made at MCB014 similar Cell -based ASIC. MCB014 perform
output necessary signal after Tx Focusing and Rx Focusing calculation. Each 8-bit of tx _p_out,
tx_n_out, and elem_se charge Output about TX. Delay is based on Scan line is calculated by Micro-
processor of MCB014 with Geometry of probe. Micro code to calculate Tx Delay is a litter complex,
because it has different Delay according to Scanline. But the value is just physical Delay. MCB014 at
Rx Focusing is not necessary different Dynamic Focusing according to Scan line, because the signal
is finished reordering from Rx board. MCB014 can Programming about various Scan line, Tx focal
point, Tx focusing calculation, and Rx Dynamic focusing calculation. This program is Microcode. It is
Binary Code. It is necessary time to calculate Tx/Rx Focusing depend on Type. Therefore Scanline
and Line Type information to use at MCB014 come out before one PRF than Scanline to use at DSC.
T1 T2 T3 T4
LT[ ]
SC[ ] A A
/ETRG
P_WR
1.0-us 160.8-us
3.0-us
Timing Diagram for Microcode Execution
When T1, As see above picture, P_WR takes Scanline A with Rising. During T2, it calculates Data
to Tx/Rx Focusing of scanline A. And it saves at special regis ter (RX_INIT_MEM, TX_INIT_MEM) of
BFIC. When T3, this saved Data, it is wrote another special Register (RX_WORK_MEM,
TX_WORK_MEM) of BFIC. During T4, it is used at Tx or Rx Dynamic focusing.

2.3.3 Tx Part
SA6000-II has 64ea MFC019 Chip same as Full Custom ASIC, because it supports maximum 128-
element Probe. One chip has two independents Pulser, and Triggering Input is 3.3-V level signal. One
MCB014 can support maximum 12-channel Tx, but SA6000-II has just 8ea MCB014. So, it use below
method to support 128 Pulser. SA6000-II can perform maximum 64ea Tx firing at once, and Rx
element switching is not performed by 12ea elem_sel Bus of MCB014 like SA9900. Therefore it can
use 128ea Pulser independently after dividing 64ea by 64ea by using elem_sel Bus. Below picture is
diagram.
LVC08
MCB014 +HV TX
Pulser
-HV TX echo[n+64]
Pulser
tx_out_p[n] +HV TX
Pulser
tx_out_n[n] -HV TX echo[n]

Pulser
elem_sel[n]
MFC019
LV04
One channel Tx Part Diagram
2.3.4 AD Converter Group
All of the signal to come from Rx board to BF board is Analog signal. Therefore, it is necessary
ADC to A/D Conversion. SA6000-II needs 32ea ADC, because it is 64-channel Folding structure. And
it needs 8ea MCB014. Bf of SA6000-II uses AD9283-50 to ADC. The present time, Sampling Clock is
30.8-MHz. But if you change L and C of Anti -aliasing Filter and AD9283-80, you can use 61.6 -MHz
Sampling Clock. This ADC input part has Anti -aliasing Filter to be composed 4-order LC Low -pass
Filter. And the structure and spectrum is same below picture. f3dB = 10-MHz.

Anti -aliasing Filter in SA6000-II BF
Anti -aliasing Filter Frequency Response for SA6000-II BF
2.4 RX Board
RX Board compose Analog Device except SRAM Controlling part. Echo Signals from Element of
Probe transmit to Pre-amp to compose with 2ea NPN-transistor. And it performs Reordering, and
goes to BF after passing Time-gain Compensator. The standard structure is same below picture.

echo[n+64] Latch
RX-S/W (HC164) MEMORY
(32KB) TGC_D[..]
pre_sel[n+64]
DAC
D.F/F
AX[..]
(HC175)
TGC-Curve
pre_sel[n]
echo[n]
RE- to BF
RX-S/W pre-Amp ORDERING TGC
ANALOG
SWITCH
AD604AR
MT8816
SA6000-II RX Board Block Diagram
2.4.1 Element Selection and Pre-amp Part
SA6000-II is 64 Channel, but it can support maximum 128-element Probe. So. It uses one-after-
the-other method to choose for input signal of Pre-amp. Effective Echo Signal to come either of the
two (Echo(n) and Echo(n+64)) become Inactive, because PRESEL(n+64) become to LOW when
PRESEL(n) become HIGH ACTIVE. This Device is performed at Controller of BF.
2.4.2 Reordering Part
SA6000-II is 64-channel System, but it can reduce the number of TGC Device, AD Converter, and
Beamforming IC(MCB014) until half by Reordering. The mean of Reordering is to relocate sequence. It
transmits to be changed Echo Signal according to Scanline always at same locate by Analog switch
(MT8816). SA6000-II doesn
t use Steering Technique like Trapezoidal Mode or Phased Array. So,
when it performs Reordering at CD2M3494, It transmits summing data to TGC n
i put part. This is
Folding. And it is possible to reduce TGC Device, AD Converter, and BFIC until half by Folding
Technique. And it can use Beamformation. This method is same below picture.

TGC - TGC - TGC -

channel(0) channel(1) channel(2)
Analog Switch (CD22M3494)
elem(n-2) elem(n-1) elem(n) elem(n+1) elem(n+2) elem(n+3)
sc = 4 n
When scanline is 0,4,8 ---, Folding and Reordering
TGC - TGC - TGC -

channel(0) channel(1) channel(2)
Analog Switch (CD22M3494)
elem(n-2) elem(n-1) elem(n) elem(n+1) elem(n+2)
sc = 4 n + 2
When scanline is 2, 6, 10, ---, Folding and Reordering
At the above picture, CD2M3494 Analog switch which charge Folding/Reordering is composed
with total 16ea. The structure and Time Diagram of Control Signal is same below two pictures.
SA[6..0], CS[7..0], AY[2..0], RST, and STRB signals are made at Controller of BF. AX[0..3], DATA
signals come from SRAM(UM61256) in RX Board.

AX[0..3] AY[0..2] AX[0..3] AY[0..2]
IN[0..7] Y[0..7] X[0..15] IN[32..39] Y[0..7] X[0..15]
RST CS STRB DATA RST CS STRB DATA
CS0 CS4
AX[0..3] AY[0..2] AX[0..3] AY[0..2]
IN[8..15] Y[0..7] X[0..15] IN[40..47] Y[0..7] X[0..15]
CS1 CS5
AX[0..3] AY[0..2] AX[0..3] AY[0..2]
IN[16..23] Y[0..7] X[0..15] IN[48..55] Y[0..7] X[0..15]
CS2 CS6
AX[0..3] AY[0..2] AX[0..3] AY[0..2]
IN[24..31] Y[0..7] X[0..15] IN[56..63] Y[0..7] X[0..15]
CS3 CS7
OUT[0..15] OUT[16..31]
Reordering / Folding Structure
/ETRG
SL[0..9]
SA[6..0] 0 1 2 3 4 5 6 7 78 79 7A 7B 7C 7D 7E 7F
CS[0..7] 0 F
AX[0..3] ax0 ax1 ax2 ax3 ax4 ax5 ax6 ax7 ax0 ax1 ax2 ax3 ax4 ax5 ax6 ax7
AY[0..2] ay0 ay1 ay2 ay3 ay4 ay5 ay6 ay7 ay0 ay1 ay2 ay3 ay4 ay5 ay6 ay7
RST
STRB
DATA
AX
STRB
10-ns 20-ns 10-ns
Control Signal Time Spec. for CD2M3949

s

2.4.3 Time -gain Compensation Part
The Echo signal to be reflected from far Target is very small size than signal to be reflected from
near Target, because it occurs Attenuation at medium. Theoretically, if it suppose that Depth is z, it
has relation exp -2z / z. And according to Depth, it compensates Attenuation by multiply it by z exp 2z.
It is Time -gain Compensation(or TGC). The main component is AD45003 (it is same AD604).
2.4.4 Memory Part
Memory is 32 Kbyte SRAM(UM61256), and it has information about Reordering Data and Element
Selection. Below picture is signals to control SRAM, and flow of signal to be controlled by SRAM data.
CPU_DATA DIR S/R pre_sel[0..7]

DATA[8]
A B D Q D Q
/EN
SR_CLK psel_clk0
BUF
/SR_EN
LATCH
/MEM_EN DATA[6..4]
/OE /OE
DATA[3..0]
DATA AX[0..3] AY[0..2]

SRAM
D Q ADDR Y[0..7] X[0..15]
MA_CLK /CS /OE /WE RST CS STRB DATA pre_sel[8..15]

D Q
/MEM_CS R/O S/W
LATCH
/MEM_OE psel_clk1
/OE
/MEM_WE
LATCH
/OE
SC[8..0] DIR
A B
addr_cnt [6..0]
BUF
pre_sel[56..63]
/OE D Q
psel_clk7
LATCH
/psel_oe
/OE
Data on the SRAM(UM61256) circumstances
At the above picture, Address and Data of SRAM are information on h_data[15..0](cpu_data and
h_data is same meaning). Control Signal from BF divide two signals.
8-bit Data Bus have like below information according to each Bit.
?? D[7..6] ? There is Element Selection information to be saved in series.
?? D[5..4] ? it has Control Bit information to be called Data of CD2M3494.
?? D[3..0] ? There is AX[3..0] information of CD2M3494.

Below part is 15ea Address Bit Map.
?? A14 - Synthetic On/Off
?? A[13..6] ? scanline[8..1]
?? A[5..0] Because AX[3..0] of CD2M3494, DATA Control and Element Selection information
is saved in series, it takes out in turn by using external 6-bit Counter. This Counter exists in
Controller of BF. To take out this Data faster, it reduced time by dividing Shift Register.
?? Data to be going to enter SRAM is saved to Binary Format of /mainsys/data/set00/common/

ro.dat. And it is wrote at SRAM by Host when it performs main or changes Probe.
2.4.5 Probe Identification Part
When you see in front of the system, right probe port is A-port and left probe port is B-port. It is
necessary to select which port the system has to read. At this time, A-port is 0(zero) and B port is
1(one). The Data to read with Probe ID Port is Probe ID only low rank 6-bit. If there is probe on B -
port, Bit-7 become Low Active Signal. But there is probe on A-port, Bit-6 become Low state. Bit-7
and Bit-6 Data are signals to come from BF and Back Plane. The Algorithm to know if there is probe
only on A-port, or B -port, or all port, or nothing any port, and what is probe ID, is made by C code.

SonoA c e 6 0 0 0 I I Section 2-3. DSC Board
3. DSC BOARD
3.1 Specification
?? 640 * 480 screen mode (dont support 800*600 mode)
?? Overlay to VGA (RGB 16bit Data)
?? PC interface with PCI not ISA (Address expansion)
?? Support Synthetic Mode (128 Channel Mode)
?? Support left/right format & top/bottom format in BM mode
?? Support 3D Data Acquisition for Volume Rendering (PCI Read)
?? Support VM Data Acquisition for Image Save (PCI Read)
?? Support Non-interlace display with VGA sync signal
?? Support Edge Enhancement & Read Zoom
?? Support Dual Cine( Left : 64 Frame , Right : 64 Frame)
?? Maximum CINE Frame is 256 ( Density : 128 Frame , Fast : 256 Frame )
?? Maximum LOOP Line is 4096
?? Gray scale resolution is 256

3.2 Feature and Concept of DSC
Scan conversion in Ultrasound scanner means the procedure from mapping echo informa tion to
Frame memory to displaying to monitor. This scan conversion actualizes to high technology then
need conversion from sampling data to pixel data.
Conventional DSC writes to F/M as vertical direction and reading from F/M as Horizontal direction.
But this DSC of SA6000II it writes from F/M and reading from F/M as Horizontal direction.
Why this DSC different conventional DSC writes and reading method
For the moment, DSC of SA6000II used new type component.
FFO FM
FM
C o n v e n tional type (a basis Write)
SSRA FM
FM
SSRAM
SA6000 II type (a basis Write)
SSRAM FM

3.3 DSC description & Block Diagram
3.3.1 Overall Block Diagram
DSP DSC VM
(Synthetic)
CINE VCR Scan Image

SRAM SRAM
SDRAM
SSRAM 3D FIFO IN Converter Grabber
(Even) (Odd) (128K) (PCI)
(128M x 2) (I-->NI) (SDRAM)
Image
Image Filing
Acq (PCI)
FIFO
NI Video
INPUT Video Out
DATA(B,M) DAC
MID ASIC InputCTR FM,LOOP CTR POST CTR
(MGA015) (XC2S200) (XC2S200) (XC2S100)
VGA(16bit) Video RGB
R(5bit) DAC Out
G(6bit)
B(5bit)
InputCTR
FM (B) LOOP(M) Mode
DSC DSP
FM,LoopCTR (SDRAM) (SDRAM) Converter
PostCTR
Scanline
RTC CTR Linetype ,

DSC DSP
(XC2S30) RLinetype
/OF , /RP , XSYNC
SA6000 II DSC Overall Block Diagram
Above picture of one DSC of the SA6000II showing be made with MGA 015 of MID processor,
SRRAM part for Synthetic of DSC and Video manager board.
This DSC of SA6000II is make B/W part of SA9900 (DSP, DSC and V/M board)

3.3.2 Block Diagram & Signal Flow of each part
1) DSP PART (MGA015 : MID Processor)

MGA015A makes I and Q data to process B/W image, spectral doppler and color doppler with RF
data to be transmitted from Beamformer.
But this DSC of SA6000II handled B/W data.
(1) BLOCK DIAGRAM
Synthetic
To
Aperture ATGC
Memory BF
Decimation DC Cancel
BF Synthtic 1/N Quadrature
DTGC FIR FIR
Data Aperture Decimation Mixer
Filter Filter
Dynamic
Zone M/N Pixel Log
Envelop FIR
Blend Decimation Decimation Compressi
Detection Filter
on
BHF BW To
NSF Post DSC
Mid-Processor(MGA015A) Block Diagram of BW Part
(2 )MGA 015A Function
Synthetic Aperture Control
First TX/RX CYCLE Second TX/RX CYCLE
RAM SUM
RX B/F RX B/F
TX
? OUTPUT ?

The signal to execute first TX/RX is stored in RAM like above diagram. After it sums
second TX/RX data with first data to be stored in RAM, transmit it to Output.
DTGC(DIGITAL TIME GAIN COMPENSAION)

Response of Ultrasound becomes attenuation as deeper more and more. Using TGC to
compensation this state.
MGA015A executes DTGC(Digital Time Gain Compensation), but Front-end executes
ATGC(Analog Time Gain Compensation).
DTGC executes output by multip lication RF(Radio Frequency) from Beamformer and
DTGC gain.
B/F RF output
DTGC
?? Feature of DTGC
? TGC gain control range : -inf dB ~ 30dB

? start (or Initial) gain value range : -inf dB ~ +30dB
? Gain update rate : 62MHz
? TGC curve type : piecewise linear
? Minimum gain increment/step : <0.1dB/step when step= data rate, at 0dB
? initial value resolution : Same as Minimum Gain increment/step
? Max possible gain change : 10dB/cm @less than 0.1dB/step,at 0dB
? SGC(scanline-gain compensation) :two 128 word look-up table, values,
between 0~4095.0dB=128 indexed by
DECIMATION FIR FILTER

MGA015A executes to 61.6Mhz clock.
If noise component to contain in RF signal becomes decimation, it is transmitted after
changing low frequency rate.
In this case, SNR is dropped, so use LPF(Low-Pass Filter) to reduce the noise.

1/N DECIMATION
Noise
f
30.8Mhz 30.8Mhz
The clock of MGA015A uses 61.6Mhz.

It is difficult next calculation because the time to can next calculation is 61.6Mhz. So it
uses 1/N.
Decimation executes 1/N Decimation.
When N is 2, for example, it indicates following diagram. It is meaning to select either of
two data. The time to be transmitted data is 61.6Mhz. The time to be transmitted id
divided by this method ; 61.6Mhz/2=30.8Mhz.
: Output Data
: Input DATA
DATA
t
61.6Mhz

DC CANCEL FIR FILTER

There are DC component around frequency zero. To reject this DC component, it uses
HPF(high-Pass filer). And it executes maximum cut-off.
High High
pass pass
filter filter
Nosie
30.8Mhz
f
0 30.8Mhz
QUADRATURE MIXER
The operation to change RF data to component of base band is
quadrature
demodulator
. Mixer in quadrature mixer is demodulator in other word. Main signal has to
be loaded at center of frequency. If main signal is not located at center of frequency, you
have to transfer that center of frequency. This is demodulator. It is method like following
diagram.

Demodulator
Nosie
30.8Mhz f
30.8Mhz
The signal to execute quadrature demodulator has to use Low-Pass Filter like following
diagram. Because of it needs to reject Noise component and unnecessary signal. After
passed this Dynamic filter, it is separated into route to make BW image data and I, Q
data.
LOW
Pass
Filter
30.8Mhz
30.8Mhz

DYNAMIC FIR FILTER
It is called Dynamic filter, because it is changed cut-off according to the depth.
3.5MHz f
ENVELOPE DETECTION
When the wave is transmitted like following le ft diagram, make it positive direction wave
to reject negative direction wave like following right diagram.
0 t 0 t
0
t
LOG COMPRESSION
OUTPUT
INPUT
0

Dynamic range of BW data to become Envelope detection is very large. It is impossible to
display image directly. So it compresses the data. This course is compression. In this
time, it executes log compression. If the value is small, raises the Dynamic range, and
value is large, makes saturation. As image depth is deeper, the noise becomes heavy
and the contrast small. Raising the contrast of deep depth and shallow depth makes
changeless. So it makes the whole contrast similarly.
PIXEL DECIMATION
Real pixel number to execute out from M/N decimation to nearest is transmitted over
minimum 2000. But pixel number to receive at DSC is 1000~2000 degree. Before
transmit to DSC, calculate real entered number as number of the pixel to need at DSC.
And transmit it to DSC.
Zone Blending
ZONE
When there are several TX focusing, it has to focus several times. In this time, curve
occurs like above left diagram. The section between curve them is called Zone section. It
mixes overlap section of Zone naturally. This is Zone blending. Following diagram shows
gain to be given in each zone during mixing.

a 0(n)
1
0 n
a 1(n) (depth)
1
0 n
a 2(n) (depth)
1
0 n
a 3(n) (depth)
1
0 n
n n n (depth)
1 2 3
BHF(BLOCK-HOLD-FILLTERING), NSF(NOISE-SPILCE FILLTERING)
Above diagram is BHF method. BHF(Block-hold-filtering) can take off the hole to be any
place in image. It uses the method that compensate similarly with around gain after
average around data. NSF(Noise-Splice Filtering) is opposite method with BHF. If the
gain in any place is very larger than around, we can think it is noise. In this case, it
rejects pixel.

BW POST FILLTER
BW data to be finished all processing pass LPF (Low -pass filter) to reject noise or
unnecessary signal before transmitting to DSC.
2) DSC PART
Each FPGA block diagram of DSC as following;
(1) Input Controller
Input Controller FPGA

SSRAM_Addr
Data SSRAM
Generator (256M Word)
BW_D[0..10]
(from MID Asic) AZM_D0..7]
Bit Shift
B
Input (to MEMCTR)
Even Frame Azimuth
& FIFO
FIFO Averaging Intp
Saturation (1k)
(1k)
B 3D Acq
Odd FIFO
FIFO (MGA 015
(1k) x 2)
CINE
SDRAM
(128M x 2)
Loop_D0..7]
(to MEMCTR)
First, Input controller is Input data process Bit shift and saturation from MID processor. Bit shift
feature use for small bit more th an available bit of MID processor of the DSC. In case Channel or
Gain is small, effective bit of Data to be executed by Mid Processor comes out small.
The number of Mid Processor Data to come over for DSC is 11bit. If DSC uses just 8bit, it takes
8bit of Mid Processor Data.

B Even FIFO and B Odd FIFO is write one side by PRF and read other side by Hsync, likes ping
pong method, to perform the Data by PRF module. At this time, writing data to FIFO is write
1024EA by sampling CLK. (SA9900 write 2048 EA)Next step of Frame Averaging perform reading
the Previous frame
s 1024 row data from Sampling Data 1024EA and CINE Memory.
As you see above Block Diagram, Cine Memory is not the same location with Frame Memory. It
is same location with SSRAM, Row Data (Sampling Data) is saved on Cine memory.
Therefore Frame Averaging use Row Data, Finally Frame Averaging data is saved to SSRAM and
Cine memory. But Address of SSRAM is 18bit(256Kword Memory), so there are some problem
appear to OF and Vsync is different when SSRAM Read/Write.
To solve it, like old 9900 DSC, write with Ping-Pong method and read with each Vsync with for
OF. This memory structure control WEB to manage Even frame and Odd frame data, because
SRAM
s Data is 18bit. (Ping-Pong method) SSRAM Address is come from Data Generation part of
Input Controller. This Data Generation part write value, which concerned with Data generation to
FPGA every times when image format is change when DSP initial time or mode change. Then
SSRAMM address is made per each Hsync.
6000 II DSC is made from BW Part of 9900 Revision DSC, but it has two different parts. One is
Frame Averaging, and the other is 3D Read Pass.
As you see above Block Diagram, FA circuit of 6000 II DSC is composed of Interpolator in FPGA.
But SA9900 is composed of SRAM. If it uses SRAM, it is not match Margin of Data on Timing.
And 9900 Revision DSC is able to support Real Time 3D, and it is not use 3D Pass of old method.
So 6000 II DSC uses different Pass to 3D Acquisition.
At the above Block Diagram, it doesn
t have Pass to go from 3D Acquisition FIFO to CINE Memory
directly. Also, it is necessary Scan Conversion because it has saved Row Data.
To make this, it makes Pass to write from CINE Memory to SSRAM directly. When it uses 3D, it
uses this Pass. But this Pass is able to use at Freeze mode. When it performs 3D Acquisition, first
set Freeze, and move CINE Bank to SSRAM, and read Data at SSRAM like Real Mode, and perform
Azimuth Interpolator, save Data to 3D Acq FIFO. And next step is to move Data to PC by PCI CLK
Cycle like 9900 old Version. It is possible to carry Data by setting ROI box during 3D Data
Acquisition. This method reduces 3D Acquisition time.
1024ea Sampling Data to get every PRF is saved at SSRAM in serial order by /OF. Namely, it is
necessary capacity of maximum 256 Scanline x 1024 Sampling = 256 Kbytes. To get Frame
Memory Data(A , B , C , D , E) equivalent Pixel of Monitor, it is necessary SSRAM Address like a1
and a2 , b1 and b2, and so on.
This Address comes out to Row direction (Horizontal direction) every Hsync at Data Generation,
and the difference of Previous Address and Current Address becomes maintenance as sampling

point (SA6000 II is 1024 Sampling).
It uses 61.6MHz CLK to Azimuth, but the Output is 61.6MHz/2. Namely, 1ea(one) Interpolation
Data (Z) comes out per 30.8MHz.
SL0
SL4 SL8
a1
1st H line
A a2
b1
c1
C d1 D d2 2nd H line
B b2
e1 e2
c2 E
Sampling Point
Monitor Pixel Point
(2) Memory Controller

Memory & Loop controller processing Read / Write of Loop memory, Frame memory, read zoom
and edge enhance.
First, writing to Frame memory for has 4byte data bus and each 1byte saved different data of
Frame. Azimuth data from Input control FPGA write to In FIFO of memory controller
This FIFO is use for don
t lost the data during memory cycle (Refresh, Pre charge and Act, etc.)
Because of, this FIFO Length is shorter than the other FIFO. Next, Demux is demuxing 1Byte Data
bus to 4Byte Data bus in order to Frame interpolation by Frame memory.

FM & LOOP Controller FPGA
AZM_D0..7] BW_SD0..7]
(from MemCtr) B (to PostCtr)
DEMUX 32 16 Frame DT FIFO Read Edge Out
IN FIFO FI MUX
(1 : 4) Interpolator (512) Zoom Ehnance FIFO
(63 x 8) (4:2)
(512)
FM
(SDRAM
64Mbit)
Loop_D0..7]
(from MemCtr) M LoopM M
Input (SDRAM Out
FIFO 16Mbit) FIFO
(512 ) (512 )
Loop
CTR
TMP_ABWSD
(D0-D7)
FABW_D
(D0-D7)
Frame 1* 4 Demux (Wr) TMP_BBWSD Frame
Average 4 * 2 Mux (Rd) (D0-D7) Intp
Fm
_W
FMB_D
r
(D0-D7,
d
FM_R
D8-D15,
D16-D23,
D24-D32)
FM
FI_MUX Block Diagram
Above picture are Block Diagram of FI_Mux and FI_Dem.

The role of FI_MUX is to switch required Frame during Frame Interpolation. Because the data of
Frame memory used now is 32 Bit and 8 bit us used for one Frame, 4 Frame could be stored at
Frame memory. The 1 x 4 DEMUX of FI_MUX operates this function (WR). The 4 x 2 MUX (RD) has

the role of sending only two Frames of four Frames. The 4 x 2 Mux(RD) is controlled by FI_sel.
The Frame Interpolation is to interpolation one Frame with the other Frame. The reason to execute
frame interpolate is that the gap between present Frame and next Frame is so large that the image
is not good.
Read FM we can know which Frame is interpolation. FI_Sel determines the selection of this Frame.
The picture below is regarding Frame Interpolation.
F.M
F.M0
( A )
A
F.M1
( B ) A
Z
F.I MUX (interpol
( 4 * 2 )
F.I ation)
F.M2
( C ) B
F.M3 FI_SEL 0,1

( D ) " 00 "
FI Block Diagram
Because Vsync is 60Hz, DSC DSP gives FI vector for one Frame Interpolation. Then the
FI_Sel(0,1) is
00and give Frame A and Frame B to Frame Interpolation input in the Frame
Interpolation MUX. The next Frame Interpolation makes Frame Z by interpolating Frame A and
Frame B. Output one Frame for each Vsync like A->Z ->B.
This DT FIFO using when data erase of B Image like B -M mode.

Read Zoom Block Diagram
s_rz_hintp_cur0
s_RZ_InputB Read H
Zoom s_rz_hintp_prv0 Interpolator
FIFO 0 0
Latch
PXL_CLK s_H_OutputB0 OutputB
V
Interpolator
s_H_OutputB1
s_rz_hintp_cur1
Read H
Zoom s_rz_hintp_prv1 Interpolator
FIFO 1 1
Latch
PXL_CLK
Read zoom send data with signal of Sdout_En when active HS.
First, edge Enhancement wait for active of Sdout_En, when active HS.(Maximum 1us)
Edge Enhance Block Diagram
s_rz_data_out_b s_serial_data0
s_ee_fifo_wen0 EE FF 0 Serial Adder
0
s_serial_center0
s_serial_data1
s_ee_fifo_wen1 EE FF 1 Serial Adder Mean
1
s_serial_center1
EE
EE
s_serial_data2 Parallel EE_Data_Out
Filter
s_ee_fifo_wen2 EE FF 2 Serial Adder Adder
2
s_serial_center2 Center
s_serial_data3
3
s_serial_center3
s_serial_data4
4
s_serial_center4
EEfifo_REN
s_serial_center0
s_serial_center1
s_serial_center2 MUX
s_serial_center3
s_serial_center4
EECenter_Sel

Serial Adder Block Diagram
s_ee_fifo_data0 s_Data_A
Latch
s_Adder_out1
Adder
s_Data_B
Latch
s_Adder_out3
Adder
s_Data_C
Latch
Adder s_Adder_out2
s_Serial_data0
s_Data_D Adder
Latch
s_Data_E s_Data_E_1d
Latch Latch Latch
s_Data_E_2d
s_Serial_center0
s_Data_C s_Data_C_1d s_Data_C_1d
Latch Latch Latch
Above Block diagram show serial adder part of Edge enhance. For serial adding, delay 2 adding
Input signal by latch. And make output sustenance of latency serial center of Serial Adder.

Parallel Adder
s_Serial_data0
s_Adder_out1
Adder
s_Serial_data1
s_Adder_out3
Adder
s_Serial_data2
Adder
s_Adder_out2
s_Parallel_mean_data
s_Serial_data3 Adder
s_Serial_data4 s_Serial_data4_1d
Latch Latch
s_Serial_data4_2d
th
For parallel adder, delay 2 adding each Input signal by latch. And last adding 5 sustenance of
latency.
EE Filter
InputOrg
s_Sub_out s_mult_out s_add_out s_sat_out

Sub Adder Saturation
InputMean
D_Alpha
Latch_6d
s_mean_6d
EE filter process using final output of parallel and final output of Center data
Last, B out FIFO and M Out FIFO uses for reading Data as signal of FM_se and Loop_se from
VM part. Video Manager will be process data from signal of FM_se and Loop_se.

3) V/M PART
(1) Concept of VM.
?? VGA clock : Using 25Mhz and standard 640 x 480
?? Image clock : Using 25Mhz and standard 640 x 480
?? Image Grabber Memory : Using 256K x 32bit x 2bank(KM416S1120) and clock is 50Mhz
?? VCR In : Receiving input video signal by KM0127 and using after transformation to BW
8bit format by AL422 field memory.
?? VCR out : Using VGA to NTSC / PAL converter chip(AL422)
?? VGA and VCR expression type : VGA expression is Non interlace type. It is normal PC
monitor type. But VCR input/output is Inte rlaced type.
(2) VM Function
?? Executing Keying image to receive from DSC and VGA data. And it makes final output
after making Interlace / Non Interlace signal. It has the function that executing A/D after
receiving VCR input data, and display it after Decoding.
?? Also it has the function to save DSC input data in Image Grabber after changing to BW
8bit by Post control FPGA and Post Map.
?? It has the function that does DT saved DATA in image Grabber, and writes it in Field
Memory, display to monitor after MUX with VGA data. (It displays to monitor after Keying
VGA 640 x 480 signal and Image grabber signal)
(3) Block Diagram
Video Manager
Scan
Video Image Image Filing
VCR IN Converter Image
Input Grabber
(I-->NI) Acq
Decoder (SDRAM)
Field FIFO
(KS0127)
Memory
640*480(1HS:37us) -->640*480(1HS : 30us)

BW_SD[0..7]
(from MemCtr) Mode
Post Image Converter
Map Grabber Ctr (Field
Memory)
VGA[0..7]
R:5
G:6 NI Video Out
B:5 Video (VGA Monitor)
Video
DAC
Key
(BT121)
Post Control FPGA

Scan
Converter Video
(NI->I) DAC
Field (BT121)
Memory

(4) Function of each part
VIDEO & IMAGE PART
SA9900 can display 800 x 600 full size at monitor. But ultrasound image expression zone
is just 640 x 480 size. Also this part can display external input such as VCR input.
SA6000II can display 640 x 480 size with ultrasound image, VCR input and VGA data
640
64 512
32
480
Below picture is real image format of SA6000II

VCR INPUT
Analogue video signal (VHS, S-VHS) to be transmitted from VCR is TV signal and
Interlace type signal. And TV image signal is divided NTSC, PAL and SECAM type by
character of each region. So, it uses exclusive using chip like One chip front
end(KS0127) to process each different input data, and executes A/D conversion in the
inside. And it makes UV/Y format from input analogue video signal by internal
Chrominance circuit and Luminance circuit. And it transmits to be changed data.
B,M INPUT (DSC INPUT)
In image part, B-mode image and M-mode data to be transmitted from DSC board
transmit to Post control. In this part, it transmits input signal according mode(B, M) to
Post map after separating signal.
( V/M part output /IMGHS, /IMGVS, IM GdotClk, /FM_se, FM_sc, /Loop_se, Loop_sc to
DSC part)
Post control use Post FPGA (SC2S100-FG256)
IMAGE GRABBER
Real image signal and VCR signal is saved in Image grabber and image grabber data
works to make Video signal after transmitting to Output FIFO . Also, it works to
transmitting image of image grabber to main PC or receiving that.
SDRAM clock using 50Mhz. Reason is save and output at /HS 1 circle at same time.
Image Grabber memory using KM4132G512(256K x 32bit x 2bank) and clock is 50Mhz.
It stored 512 COLUMN to under ROW and stored 128 COLUMN to upper A bank. This is
storage B-mode. Gray bar area is 0~39 and Image size is 512 so, Start 1 is 40 end 1 =
512 and Start 2 is 0 end 39. But real input end2 is 128.
left area : start 1=40 end 1=295 start 2=0 end 2=0
right area : start 1=296 end 1=511 start 2=0 end 2=40

512
256
A bank B bank
512
1024
FIELD MEMORY
It has to transform the signal after matching synchronism with Sync to display at VGA
monitor. Field memory works this function. And Field memory uses AL422 and supports
suitable resolution to use VGA and TV signal. It is set for synchronize signal.
AL422 is 3M -bits FIFO field memory and it is possible to operate each read/write.
VIDEO KEY
Image/VCR signal of 640 x 480 size to be transmitted from field memory is displayed at
monitor in 640 x 480 size with overlay or other Menu signal. In this time, it is the part to
do MUX with VGA signal.
NON-INTERLACE DAC
Digital BW signal to be executed Keying is transmitted to VGA monitor after changing into
Analogue BW through Video DAC(BT121).
INTERLACE Output
It is necessary output signal to display at Echo printer or Interlace monitor separately VGA
signal, and it uses chip AL442. Also it is necessary field memory to display 640 x 480
size of Interlace sync.

3.4 DSP description
3.4.1 DSC DSP

1) DSC DSP
?? DSC DSP controls memory controller and in/out SSRAM controller and makes address
and various kinds of frame memory, line memory and cine memory.
?? It also controls the signal path of DSC board by standard of Hsync interrupt and OF
interrupt before sending data from input SSRAM to video manager through frame
interpolation.
3.4.2 RTC DSP

1) Functions of RTC DSP
?? HOST Interface
- Receiving the cycle of PRF, EADC, XSYNC, EDFDLY sync from host.
- Sends the condition of RTC FPGA and sequence to host
- Receive the sequence of operation of each mode.
- Receiving operation sequence of each mode from host.
?? Sequence Change
- Carries out sequence table and specific mode transmission.
- Reads send data and register data is controlled by RTC FPGA
?? RTC FPGA Control

- Post out to RTC FPGA various data.
- Sets register of RTC FPGA by determined value.
RTC makes standard signal for whole system operation in real time and controls system
operation.
BF, DSP, PRF, OF, RP, Line type, scan line and Mid_PRF, ATGC_PRF for MGA015 of DSP are
made and controlled.
In addition, it has the role of making signal to control data stream in the DSC board internally.
RTC(Real time controller) makes standard signal for whole system operation in real time and
controls system operation.
It makes the various standard signals essential to system operation because PC is the main
HOST and controls FPGA by DSP. Because these standard signal are used for whole system
operation, it should be easy to control and operated according to basic frequency. R T C i s
composed of DSP and RTC FPGA DSP part is commanded by HOST(PC) and carried out. Or

receives Sequence(operation order for each mode) at the form of table and makes progress. And
controls cycle of each signal by register setting of FPGA. FPGA is commanded by DSP and makes
a real signal.
Below block diagram is RTC part.
RTC-DSP
Host Interface
(ADSP2183)
LNTYP
RLNTYP
Scanline
/OF
61.6Mhz /RP
HSYNC /prf
RTC-FPGA
VSYNC /ETRG
(XC2S30-TQ144)
/BW_RDY SWEEPRATE
xsync
/MID_TRP
/ATGC_PRF
ATGC_INFO
Fig1. Overall Structure of RTC

2) Structure of RTC-DSP
Below flow chart is RTC-DSP.
Variable
Init.
Host
command
process
No
PRF Interrupt ?
Yes
Prf Process
Set Port Value
Port out to PLD
Set Next Sequence
Change Sequence Table
Flow chart of RTC-DSP

This shows processing of flow receiving data and command from Host.
?? Command Process
It receives Command and Data from HOST and the definition of the Command and Data
will be described in the RTC-DSP command list of Appendix A. There are three parts on
the command list.
1st part is RTC control signal generation part
2nd part is receiving data for port out to RTC FPGA
3rd part is command for DSP debugging purpose.
?? PRF Process
If interrupt occurred by /PRF signal from RTC FPGA, the PRF process will function. In this
part, it controls overall data flow to be processed whenever the PRF interrupt occurred.
IF the PRF interrupt occurred, it assigns scan line and line type to be occurred next step,
the frequency of PRF, /EADC and /RP. And prepare to the value for next PRF.
?? Set Port Value
It assigns proper value per each Mode among the transferred values from Host and
preparing value transfer to RTC FPGA. It should assign proper value to the applicable port
that is presented by port map list per each PRF.
?? Port Out to FPGA
It is the part to transmit the assigned value from the Set port value block to RTC FPGA.
?? Change Sequence Table
After checking the simulation of each PRF, changing of sequence table is organized to
state change form. Following diagram show each transfer stipulation and possible
process.
seq_Utable
&
lag
1
ult=
c_f
sim
syn
le
nab
&x
t&
me
xis
t
t
exis
ist
exis
e
_ex
_d_
_b_
_b_
_m
seq_Mtable seq_Dtable
State Diagram of Sequence Table

3.4.3 RTC FPGA
1) RTC
All commands are sent from RTC-DSP and are written at internal register. The function of each
command is defined in port map table. First, TPRT and XPRT must make reference signal. It is
made by counter MCLK(61.6Mhz). And all signals are made synchronous to MCLK.
2) Structure of RTC FPGA

?? DSP interface
Data to receive from DSP write data that it will send to Port map table of internal Register
or Host.
?? PRF
Xprt_n makes system clock, PRT period is made from DSP.
Xprt_n makes Tprf_n, PRF blank period is made from DSP.
?? sweep_rate , xsync
Makde sweep rate signal and xsync signal
It is made with input clock and delay value from Hsync.
?? MID_PRF , ATGC_PRF , ATGC_INFO
It is made signal needs MID processor(MGA015)
It is exist MID part in DSC board and make by RTC FPGA.
3) DSP Interface
Below picture is structure of part to receive data from DSP. There are two registers part. So,
they store data to be transmitted from DSP. And when PRF changes, transmit data to all internal
register. Therefore all internal registers are changed synchronous with every PRF. The whole
movement is stabilized to match PRF, because we selected this structure.
DSP_D[15:0]
TPRF
/PRF_WIDTH_CS GENERATION /TPRF
16BIT CNT
MCLK
/PRF_BLANK_CS XPRF /XPRF_N

GENERATION
/TPRF 16BIT CNT
RPEN
DSP_D[15:0]
LATCH LATCH FIREEN
/PRTCTRCS0 LSTPRF
FSTPRF
/TPRF
DSP Inteface of RTC-FPGA

4) PRF
61.6MHz
20.53MHz
=MCLK
prf period
/tprf
prf prf
blank blank
/xprf
Firing Start
eof_n
etrg_delay
/etrg_dy
focusing start
/prf
eadc enable
/eadc
eadc
delay
Timing Diagram of Main Signal
Picture 20
Above picture show timing relation of PRF and EADC to be main signal. First, receiving system
clock of 61.6Mhz and making MCLK(master clock) of 20.53Mhz to divide it by 3. It determines
reference clock of RTC FPGA. It makes reference /tprf and /xprf according to PRF period value to
be transmitted from MCLK and DSP. And it makes /etrg_dy to be delayed as setting value in
ETRG-delay register to /prf of system. So, make /eadc signal.
3.5 Checking issue of each function
(1) Check mode image : B mode , Dual B , B -M left/right , B -M top/down , Depth Change,
128ch mode
(2) Cine , Loop operation : cine fast 256frams, density 128frams, Loop 4096 lines
(3) Check save of cine memory : Using debug menu
(4) Check save of VM Image : Using debug menu
(5) Check of External VGA Monitor, check Echo Printer, VCR recording / Playing, PAL/NTSC
(6) Check Probes : convex and Linear

SonoAce 6000II Section 2-4. Key Interface & Matrix
4. Key Interface & Matrix
4.1 Key Interface & Matrix construction and function

SA6000II KI/M is consists of two parts with one board.
One part is Key Interface that supports UI and the other part is Alpha Numeric Key.
The Key Interface Part that 89C51 ta ke the lead in the work and Alpha Numeric Key Part that
HT82K28A take the lead in the work. The Key Interface Part that 89C51 take the lead in the work
through MAX239 The Key Interface Part that 89C51 take the lead in the work through MAX239 /
through Serial Port of 89C51 MAX239(RS -232C Interface)/ to the side of PC B/D and
COM2( T/B ),COM3( System Key )/ as Serial / Data exchange.
Alpha Numeric Key Part that HT82K28A take the lead in the work HT82K28A have itself Serial Port
and by it through MAX239(RS-232C Interface) Alpha Numeric Key Part pass the key value to PC.
HT82K28A have itself Serial Port and by it. And, SA6000II Key Interface & Matrix / is consists of
each keys to apply Multi -language/each keys/ as Macro Key (one Key has value of many keys
and key S/Ws are consists of pushing key pad and attach a point of contact to key pad / send
electric current into part again /form to work/ not push-button.
Diagram1. SA6000II KIM

4.2 Block Diagram & Description
+3.3V
TTXA,B
Track TTYA,B
Ball SR[8..15]
Key Matrix
Key
TBR,TBL contol
CPLD
XC9572X
SC[0..7] L-TQ100
Power Control Signal
DATA[0..7]
SD[0..7]
SA[0..7]
TGC
Volume
Track Ball & Key

ADC SD[0..7]
0808 Power Control
uP Foot s/w
89c51 Alpha Nemuric
Key
+5VA Connector
TXD,RXD
DATA[0..7]
UART RS-232C
8250 MAX239
MSOUT
POWER
+5V , +12V
KEY INTERFACE PART
Diagram 2. SA6000II KEY INTERFACE PART Block Diagram

PC_KEY_CLK PC_KEY_DATA
From:PC To :PC
HT82K28A
Alpha C[0..7]
Numeric
Key Matrix
R[0..17]
Alpha Numeric Key Part

Diagram 3. SA6000II Alpha Numeric PART Block Diagram
Above diagram 1,2 shows Block Diagram about SA6000II Key Interface & Matrix
At first, we will explain about Key Interface Part.
As you see the BD, Key Interface Part 89C51 take the lead in the work and it consist of Key
Interface Controller ( CPLD),ADC0808,82C50,MAX239.
Key Interface discharges as followings.
Track Ball Counter
Key Button( Scan )
TGC Volume Control
Power Control
PC to Key Panel Communication
4.2.1 Track Ball Counter
( A phase ) Clock 8 Bit

( B phase ) Up/Down Counter cnt_data[7..0] cpu_data [7..0]
Clear Try State
8Bit
Buffer
/RD
TRACK BALL PART

Diagram 4. Track ball part

A direction in A, B direction to input from X,Y axis of Track Ball.

According to the condition of direction B, fix Up/Down of counter.
At this time, data is converted into a form of 2
complement and transmit to Main. ( a high position
bit is Direction )
A Phase
B Phase
ClockWise
A Phase
B Phase
CounterClockWise
Diagram 5. T/B wave form ( direction relation )
4.2.2 Key Button( Scan )

Key Button is constructed as and (for reference, Map ) send Scan Line (SR8 ~15) that is on ROW
side signal in order and is input Column side decodes Data (SC0~7) and interpret to input
existence and nonexistence of each Button.
At this time if the value of SC is not FF, interpret that Data is input and go on next work.
# Key map
SC6 SC5 SC4 SC3 SC2 SC1 SC0

SR8 ID END PROBE I/F
EXAM
SR9 MENU SETUP APPL. SAVE
SR10 USER1 USER2 BODY INDICATOR BODY CLR
SR11 USER3 USER4 CALIPER CHANGE
SR12 USER5 REPORT MEASURE DOCUMENT MEA.CLR DOC.CLR
SR13 DEPTH+ DEPTH- SPEED HARMONIC FREQ. FOOTSWA
SR14 ZOOM+ ZOOM- DIRECTION B M FOOTSWB
SR15 FOCUS+ FOCUS - APEX B/B 3D FREEZE
Table 1. Key Matrix Map

# Between Track Ball& Key Button and PC of transmitting and receiving connect to COM Port of
(MAX239) PC through RS-232 Level.
Port Setting Usage
COM 2 0x2F8 / IRQ 15 Track Ball
COM 3 0x3F8 / IRQ 14 Key Panel
Table 2. COM Port
4.2.3 TGC Volume Control
It is use 50K? Slide VR, accounts and send with A/D Converter (ADC0808) potential difference of
both ends of VR (GND ~ +5VA). VR number to use is 7pcs.
4.2.4 Power Control
POWER_DOWN PC_DOWN
CPLD
Power PC
XC9572
POWER_ON_OFF PC_ON_OFF
Power Control
Diagram 6. Power Control
Key Panel observes POWER_DOWN signal that is input from Power and when Power Switch is off
( Low ? High ) it is let PCIO of PC know.
PCIO that senses it complete to practice all Windows Programs (POWMAN.EXE should practice at
this time) and it is let Key Panel know.
After Key Panel observes PC_ON_OFF signal that receive from PC and this signal become high
after 2seconds it is let Power know that it is OFF.
4.2.5 PC to Key Panel Communication
?? - Track Ball : transmit Data by 82C50.
> Serial Mouse Mode

1200 bps , non parity , 1 stop 7bit data length
Bit No 6 5 4 3 2 1 0
st
1 word 1 L R Y7 Y6 X7 X6
nd
2 word 0 X5 X4 X3 X2 X1 X0
rd
3 word 0 Y5 Y4 Y3 Y2 Y1 Y0
Button status : 1 = pressed, 0 = released
Table 3. Track Ball Serial Data Construction

> Initial Timing
Diagram 7. Serial Timing
?? Transmit Data by Serial port with built-in 89C51.
Next, we will explain about Alpha Numeric Key Part.
Alpha Numeric Key discharges General PC Key Board function and there is use HT82K28A is
Standard Win98 Keyboard is the exclusive use of IC.
This IC is consists of Row 18bit, Column 8bit as Matrix form and is fixed according to Key Map
Key values transmit in PC side. (Serial communication) by compounding of Row and Column.
Key Map is as followings.
C7 C6 C5 C4 C3 C2 C1 C0
R0 F5 L-CRL PAUSE
R1 !/1 ~/` Z ESC A TAB Q
R2 @/2 F1 X S CAPLOCK M
R3 #/3 F2 C F4 D F3 E
R4 $/4 %/5 B V G F T R
R5 &/7 ^/6 N M H J Y U
R6 */8 +/= </, F6 K }/] I
R7 (/9 F8 APP >/. L F7 O
R8 )/0 _/- ?//
/ :/; {/[ P
R9 PRINT R-ALT L-ALT SCRLOCK
R10 F10 F9 F12 ENTER F11 |/\ BACKS
R11 DEL D- NUMLOCK SPACE
ARROW
R12 INSERT R-
ARROW
R13 PG-DN PG-UP
R14 END HOME L- U-
ARROW ARROW
R15 R-SHT L-SHT
Diagram 5. Alpha Numeric Key Map

4.3 Key Main program Description
Following is a description of Main program.
START
initialize 89C51
Main Loop
Start
TrackBall
yes
scan_trackball
Event
Key Button yes scan_button_

Event matrix
TGC yes
scan_tgc
Event
Shutdown yes manage_system_

Event power
Command yes process_

Event command
D i a gram 8.Key Main S/W Flowchart
First, main S/W Flowchart show 89C51 doing early time setting and each parameter initializing as
soon as system start.
Second, Main loop run, sensing the event flag and call it.
SA6000II use following 5 events.

Track ball
Key button
TGC
Power (shutdown)
Command
If this five event flag is sensed, call the subroutine and return to main loop.
4.4 Data sheet
The following data sheet is important IC used for SA6000II Key Interface & Matrix.
4.4.1 CPLD XC9572XL-TQ100 Pin Description
75 51
76 50
XILINX R
XC9572XL-
TQ100
10
0 26
1 25

Pin Name Pin NO I/O Description

P2_6 20 I SCAN COLUME DIRECTION
/RD 25 I CPU READ
/WR 23 I CPU WRITE
/RESET 13 I PLD RESET
ALE 12 1 ADDRESS LATCH ENABLE
XCLK 22 I SYSTEM CLOCK(11.0592MHz)
PC_ON_OFF 28 I PC ON/OFF SIGNAL
POWER_DOWN 29 I POWER SWITCH OFF SIGNAL
/EOC0 18 I A/D CONVERTER END FLAG
PADCSTT_1D_I 36 I A/D CONVERTOR START_1D_I
PADCSTT_2D_I 33 I A/D CONVERTOR START_2D_I
TTXA 14 I TRACK BALL X AXIS A PHASE
TTXB 15 I TRACK BALL X AXIS B PHASE
TTYA 16 I TRACK BALL Y AXIS A PHASE
TTYB 17 I TRACK BALL Y AXIS B PHASE
TBL 32 I TRACK BALL LEFT BUTTON
TBR 30 I TRACK BALL RIGHT BUTTON
D [0..7] 1,3,4,6,8,9,10,11 I/O CPU DATA
SA [0..5] 93,94,95,96,97,99 I SCAN ADDRESS
SC [0..7] 82,85,85,87,89,90,91,92 I SCAN COLUME DATA
SD [0..7] 64,63,61,60,59,58,56,55 O SCAN DATA
SR [8..15] 74,72,71,70,68,67,66,65 O SCAN LINE SELECT
A[0..2] 42,41,40 O CPU ADDRESS
FRZLED 81 O FREEZE LED ON
/FRZLED 79 O UNFREEZE LED ON
SVO_6 53 O A/D CONVERTOR OE
PADCSTT 37 O A/D CONVERTOR ALE
PADCSTT_2D 52 O A/D CONVERTOR START
PADCSTT_1D_O 35 O A/D CONVERTOR START_1D_O
/8250CS 39 O 8250 CHIP SELECT
PC_DOWN 50 O PC OFF SIGNAL
POWER_ON_OFF 49 O POWER ON/OFF SIGNAL
RESET 77 O CPU RESET
/TMRINT 78 O TGC INTERRUT
ADCLK 54 O ADC0808 CLOCK

4.4.2 MAX239 ( RS-232C )
The function of this part is to convert normal signal into RS-232C Serial.

4.4.3 8250 ( UART )
#Pin Description
# Clock : 1.8432 Mhz

4.4.4 A/D Converter ( ADC0808 )
# Pin Description

4.4.5 Alpha Numeric Key Controller ( HT82K28A )

SonoAce 6000II Section 2-5. Rear Board.
5. REAR BOARD
The function of this board is to communicate with sub-apparatus. ( Echo printer, Line printer, LAN,
USB, RS-232C,Video,VGA Monitor, Main Monitor, Foot SW) and composed of PCB and various
Connector. It doesn
t have internal circuit Logic.
Rear B/D is connected with BNC, Foot SW and Cable at Rear Panel.
5.1 Rear B/D Configuration Diagram
J3 Serial Port
(RS-232C)
JP3
Pararell Port
P1 (Printer)
JP2 USB
JP1 LAN
(DICOM)
J2 VGA
(External)
J4 Echo Printer
Remote Jack

SonoAce 6000II Section 2-5. Rear Board.
5.2 Rear Panel Configuration Diagram
RS
Monitor 232C
P
Echo Printer a
r
a
r
e
l
l
Video out
USB
Video in
LAN
Foot SW
VGA
E.P
Jack

SonoAce 6000II Section 2-6. PC Board.
6. PC BOARD
6.1 Introduction
6.1.1 External PC board
There has IO and bus as like general PC main boards. It is just different that ethenet card and
VGA card mount on this board.
6.1.2 PART OF PC
?? SYSTEM CONTROL.
?? USER & PERIPERAL INTERFACE
?? VGA
6.1.3 DESIGN CONCEPT (SPEC)
1) BASIC DESIGN CONCEPT

?? Low Cost System
?? High Performance for Embedded Application
?? Simply Design
?? Supply the interface for using easily
?? Can be use various Application
2) Memory
?? Main Memory (SDRAM)
?? Minimum 16Mbyte, Max 256Mbytes
?? Fast SDRAM (PC 133)
?? Use 1 DIMM Socket (Service man up-gradable)
?? Flash ROM : 512K x 16bit, 3.3V
3) Supply internal PCI bus/ISA bus

4) External peripheral connection supply Serial, Parallel
5) VIDEO
?? Basic resolution: 640 x 480, Color 24bit mode operation
6) Storage
?? 2 EIDE Connector for HDD
?? Extendable 4 Hard disk
6.2 General Description
6.2.1 H/W
1) PC specification
Parameter Specification Remark
Processor Strong ARM (RISC processor) SA110 (21281-EB)

OS Linux Kernel 2.4.3-rmk1
Memory 64MB (DIMM) 64, 128, 256MB
VRAM 1M x 16 Dynamic EDO RAM IS41C16100
Hard drive 20GB Quantum
VGA 640*480 color 16bit CHIPS F65550

ROM 512K*16bit (1MB) Flash ROM
Power +3, +5, +12, -12V
Network Interface Ethenet 10/100 base TX Fast ethernet card
Serial RS-232C DB -9 Connector
Parallel Standard EPP, ECP compatibleness DB -25 Connector
Keyboard 86/103 keyboard 6pin DIN connector(PS2)
Mouse PS/2 Mouse 6pin DIN connector (PS2)
IDE port 4 HDD support
LCD 16bpp Using only Signal
2) Block diagram
Flash ROM 168pin DIMM
39VF800A SDRAM
CPU
North Bridge
SA110 SYSTEM BUS 50MHz 21285 COM0
PCI BUS 33MHz
South Bridge Ethernet VGA PCI to ISA Bridge
VIA82C686A RTL8139 F65550 PLX9054
- 2 Serial ports
- PS/2 - 10/100B T, 1 RJ45 port - 256K*16*2 VRAM
- 1 Parrallel port
- 2 USB ports
- RTC DSC
- 2 IDE controller
EXPENSION SLOT, ISA BUS
PC bus
RX
BEAM
In general PC, PCI bus

s function of network and VGA mount on CPU board as slot. But, in this
case, each function chip is built-in of PCI bus on Board.

3) CPU
?? Intel strong ARM SA110: High performance RISC processor
?? Core clock: 233MHz
?? It is useful for power consumption. That is to say, calorific value is little. So, It doesnt
need cooler, and if users touch it when it is running, user doesnt feel hot.
?? 3V I/O
?? It has clock and bus as like general Pentium PC. But, floating -point operation is very
slow, because it has no FPU.
?? Memory management unit (MMU) support virtual memory systems
?? 16KB of instruction cache and 16KB write back data cache
?? Write buffer enhancing performance
?? Static operation low power consumption ideal for power sensitive app
?? Fast sub microsecond interrupt response for real-time application
?? Excellent high-level language support
?? Big and Little endian operating mode
?? IEEE 1149.1 boundary scan
?? 144pin TQFP package

SA-110 microprocessor is general purposes microprocessor. It is one chip that is a built-in
16KB instruction cache, 16KB write back data cache, 8-entry write buffer with 16 bytes per entry, and
memory management unit (MMU).
SA-110 play a role ARM V4 architecture processor family and software compatible, and it can be
use with ARM support chip for I/O, memory and video. On -chip Cache can be rise execution speed
with write buffer, and to reduce average memory bandwidth requested by processor. Above things
make possible to use external memory for supplying additional processor and direct memory access
(DMA). This instruction can be use for assessing memory management, configuration, and cache
control register. S A -110 have 16KB instruction cache (lcache) by 32-byte block and 32 -way
associatively. Lcache supports flush-all-entry function. The Icache enables when memory
management is disable. If Memory management disables, all memory was cacheable by Icache. And,
SA-110 have 16KB data cache (Dcache) by 32-byte block and 32-way associatively.
Dcache supplied flush-all, flush-entry, and copyback-en try function. But, in case of copy
back-entry, it supplied by software. Not hardware.
Strong ARM has 8 type of basic instruction.
4) North Bridge
?? Exclusive PCI bridge for SA110: 21285
?? Substantial all device control
?? PCI bridge (PCI revision 2.1 compliant interface: 32bit, 33MHz)
?? SDRAM interface
?? Flash ROM interface

?? DMA controllers
?? Serial port (For COM0, debugging)
?? Interrupt controller
?? PCI bus Arbiter
?? IEEE 1149.1 boundary scan and JEDEC
?? 21285 control all device of PC board include CPU. Therefore, 21285 is the point of
Debugging. But, It is big problem that it cant check all pins cause of BGA type.
5) South Bridge
?? Supply all peripheral interface
?? USB
?? 2 Serial ports
?? Primary and Secondary IDE
?? Parallel port
?? RTC
?? Keyboard/Mouse
?? Power monitor (Use for reset control)
?? Floppy disk (Not use)
?? AC97 link (Not use)

6) VGA
?? Flat panel / CRT GUI Accelerator: CHIPS F65550
?? 640X480 16bpp
?? NTSC / PAL support
?? YUV / RGB output
?? System used only digital RGB, and send digital RGB to DSC MUX for summing DSC image
data.
?? F65550: 1M X 16 EDO / RAM(IS41C16100) used 2ea
MONITOR
640*480 Displays
Whole VGA FORMAT IMAGE DATA

DSC MUX
All DISPLAY TRANSMIT TO

EXCEPT PC DSC BOARD
IMAGE ONLY RXIMAGE

7) Ethernet
?? Fast Ethernet controller: RTL8139
?? Complaint PCI Revision 2.2
?? 10/100B -TX
?? Use 93C46 ROM for appointing Mac address
?? Mac(Media Access Control) address : It find specified port, and make rounding table
and data structure through this address. It is possible to confirm the system as
giving specific number each system. It was managed by IEEE, and defined by IEEE
802.2.
?? Medison Mac address Received address officially from Medison
?? 00 05 B2 XX XX XX
?? XX XX XX defined as below.
?? FF FF 00 ~ FF FF FF : The system only for R&D.
?? 00 00 00 ~ FF FE FF : shipped system
?? Shipped system has exclusive MAC address correspondence with serial number.
Mac address generation
# mac_generate.exe : Mac address generation program
It makes system to write mac address on ROM.
Remark making date and serial number

8) PCI-ISA bridge
?? PCI I/O accelerator: PLX9054
?? PCI dual address cycle (DAC)
?? Two independent DMA channel
?? Use for PCI to ISA bridge
?? DSC, RX, Beamformer control and interface between each data
?? ISA bus (16MHz, 16bit bus) It is slower than PCI bus.
?? Why this system use ISA bus.
??SA bus is very useful for programmer. Because, SA bus was always controlled by
programmer with same address. And, each device
s address is always same. But,
PCI bus can change the address with using virtual address. However, PCI is faster
than ISA.

9) Flash ROM
?? 512K X 16 multi purpose flash ROM : Use SST39VF800A
?? Supply JEDEC sta ndard
?? Boot ROM
?? ROM file
?? BIOS : In the early Booting, It can be initialize to CPU and important DIVICE, and it
lode the Linux Kernel on system.
?? Kernel : Linux kernel 2.4.3-rmk1 is go to RAM after BIOS.

10) Lock source
33MHz
SA110 33MHz
U8
OSC
3.68MHz 33MHz
U43
ICS9169M
21285 33MHz
U2
OSC
50.0MHz 33MHz
PLX9054
X2
OSC
48.0MHz
Y2
VIA82C686 RTC XTAL
X3 14.31MHz
OSC Y3
14.3MHz
XTAL
F65550 32.68KHz
X1 Y4
OSC XTAL
14.3MHz 32.68KHz
RTL8139 Y5
XTAL
25.00KHz
?? They have clock generator at need except PCI clock/33MHz.
?? Although ICS9169M is 33, 66, 48MHz frequency generator, It just take 33MHz for PCI clock.
?? Y3 is RTC (Real Time Clock). When power turn on, it takes external voltage, but when
power turn off, it takes battery voltage.
?? U2 supply system bus clock. RAM -CPU-North bridge interface between each data using
mentioned clock.

11) Clock source Analysis

Below table is type of clock for Main Board.
Name Source Frequency Remark

SA-110 Oscillator 3.6864Mhz +3.3V
DC21285 Oscillator 50Mhz Memory clock
PCI_CLK_21285 33Mhz PCI clock
CT65550 PCI_CLK_VGA 33Mhz PCI clock
Oscillator 14.318Mhz Memory clock
Crystal 32.768Khz
RTL8139C PCI_CLK1 33Mhz PCI clock
Crystal 25Mhz
PCI9054 PCI_CLK2 33Mhz PCI clock
VT82C686A PCI_CLK0 33Mhz PCI clock
Crystal 14.318Mhz RTC
Oscillator 48Mhz USB
Oscillator 32.768Mhz
?? PCI CLOCK SOURCE
?? It is Clock Generator for making 33Mhz that is delivery to PCI DEVICE using Y2
(14.318Mhz). In that time, Each interface about PCI Device connected through 33R
s
Damping Register (RN96, RN98).
?? PCI DEVICE
?? It means PCI Device for SA6000II System. All 4 PCI device received 33Mhz PCI Clock.
And, each oscillator is clock for driving sub-system(VIDEO RAM, ISA, USB etc..) in
Device.
?? SYSTEM
?? When user uses U8, user has to use 3.3V. Because, SA-110 works with 3.3V Level.
And U2 s 50 MHz is very important clock as U1
s North Bridge. If U2 is unstable, it
exert a bad influence to the whole system function, and moreover, system can be
Halt.
Reference: User must use at lease under 50PPM Crystal and Oscillator. Each Device detail is as
below.
Strong ARM
?? CLK: 3.68Mhz Clock input. After making a change 233Mhz inside, It used to be Core
Clock. And it uses +3.3V as 3.68Mhzs Oscillator. If use 5.0V s OSC, CPU needs 3.3V

case of Level change.
?? MCLK : 48Mhz Clock Input, 21285 Output, 21285 for driving BUS control the Cycle through
MCLK. Not Wait Signal.

2 DC21285
?? PCI_CLK : 33Mhz Clock Input from Clock Generator(CY2260)
?? OSC : 48Mhz Clock Input, 21285 Core clock, FCLK, MCLK, SDCLKs
?? Generation.FCLK : 48Mhz Clock Output for sync
?? FCLK_IN : 48Mhz Clock input, FCLK and FCLK_IN should be shorted externally.
?? 21285s MCLK Output is used to MCLK Input, in that time, happen to delay depend on PCB
Pattern Capacitance. 21285 generated SDRAM s Clock and Control Signal, in that time, It
occur discord between CPUs SDRAM Access Cycle and 21285s Clock and Control Signal
case of mentioned delay. For preventing discord, the length that is from FCLK to FCLK_IN
makes the same as length that is from 21285s MCLK Ou tput to CPUs MCLK Input.
?? M C L K : 48Mhz Clock output for CPUSDCLK [3:0] : 48Mhz Clock Output for SDRAM
Modules
DIMM
?? SDCLK[3:0] : 48Mhz Clock Input from 21285
VGA
?? PCI_CLK : 33Mhz Clock Input from Clock Generator, System Bus Clock
?? OSC : Use for 14.318Mhz Clock Input form Osc, Video Timing Control.
?? XTAL : 25Mhz Clock Input PCI-to-ISA Bridge for 10/100Base-T
?? OSC : 14.318Mhz Clock Input from Oscillator, I/O Device and ISA Bus ClockRTC_CLK :
?? 32.768Mhz Crystal Input for RTCUSB_CLK : 48Mhz Clock Input for USB
Clock Generator
?? XTAL : Clock Generator Input Clock, 14.318Mhz
?? PCI_CLK : 33Mhz Clock Output for PCI Device,

12) Memory architecture
?? Main Memory (SDRAM)
It is basic Memory for SA6000II System. When this memory run, it reads or writes data in
there.
?? Memory Type : SDRAM(60Mhz)
?? DIMM Socket : 1ea
It is possible to use SDRAM DIMM : 16,32, 64,128,256Mbtes
?? Memory Map is composed of below 4article.
21285 General Memory Map

Memory Map for CPU
When 21285 is Master, Memory Map is on PCI Bus
When other Devices are mater except 21285, Memory Map is on PCI Bus.
13) Power part
?? Supplied +5, +3.3, +12, -12V from Power B/D
?? Each power used FUSE case of protecting over current .
?? Change 5V to 2V by LM317 for supplying voltage to CPU
?? User is must to check 2V output. Because, It was reflected by character of LM317 or

Resistance.
?? +12V and 12V is use for only serial communication.

1) Linux
128 B/W system be used Linux OS program so it is very important know to peculiarity Linux
command.
Basic command
Command describe Linux Dos / Window
Search for directory Ls Dir
Change directory CD CD
Make to directory Mkdir MD
Remove Rmdir rm
Copy Cp copy
2) Module
?? Powerman : Shutdown process
?? iop480 : ISA bus read / write
?? hdd_info : Reading serial number from HDD
?? ide-scsi : MO driver
6.3 Booting Sequence
6.3.1 H/W booting Sequence

Power good signal is supplied to south bridge
Picture 1.1.1 Picture 1.1.2
?? Originally, power good signal generated from ATX power, but artificially obtain 400ms by reset
delay chip(Pic.1.1.1) for following reasons.(other surrounding equipments stability a n d
easiness of debugging.). Pic. 1.1.2 shows how power good signal moves into south bridge.

1) Reset
This deals with the Global Reset of whole board(signals up to
CPUare reset). System Reset is
as followings.
(1) Power On Reset

ISA Bridge does the monitoring Power State through POWER_GOOD Input Pin and drives
PCI Reset (Low Active) and RSTDRV (High Active) when Power is
On
, and finally
Releases. RSTDRV is reversed by In verter and becomes RSTDRV_L (Active Low). After
making DC21285 reset, put 21285 ready. By two times Inverter (delay), CPU comes to be
reset. Before this stage, other devices are already reset (Ethernet, PLX, VGA, ISA) and wait
for starting in CPU.
Considering time, CPU is finally reset and other devices can start code at stable condition.
(2) South bridge receives power good signal and transfers reset signals into north bridge, CPU,
HDD.
(3) 21285 makes chips at PCI bus reset after receiving reset signal.
(4) Read commands from memory address
41000000Hand practice.
(5) Memory initial
(6) PCI bus initial (Device initial and address mapping)
(7) H/W operating.
6.3.2 S/W booting Sequence
1) When Power on, firstly BIOS have authority of control
- POST (power on self test)

- Memory CHECKING
- Address mapping of each device
- Interrupt vector table
- Page table
2) After BIOS is over, jump to Kernel

s start point.
3) Kernel decompress
?? Initialize Stec and Resister.
?? Call decompress_kernel of misc.c and decompressed automatically.
?? Increase to 0x100000 at memory.

?? From this point, output original booting message. Uncompressing Linux OK, booting the
kernel.
4) After this, Kernel from memory takes this function.
?? Kernel is essential for computers operating and provides basic many basic services with
other operating parts. Generally, Kernel obtains as followings.
Input/Output process
Interrupt management. (All requests for Kernel

s service.)
Scheduler. (Which program and order will use Kernel

s management time. )
Supervisor. (After scheduler, give the rights to use computer)
Kernel also manage address room for memory and storage and give to all surrounding
equipments and others.(Memory Manager). Kernel
s service requested by other operating
parts and consecutive program interface,
System Call
.
?? Kernel has path to all application H/W device for user.
5) IDE device mount (MO, HDD) for use of HDD
?? Linux needs mounting for use of HDD, Floppy, CDROM.
6) HDD init file start (Freeing init memory 212K)
?? Practice module for system.
?? Because Kernel is at Bios, Boot Loader is not necessary (LILO).
6.4 PC DEBUGGING
6.4.1 CHECK POINT
Check if parts are connected correctly.
Ex) Resistance value, Parts and Chipsconnection, Condenser

s polarity.
After parts insertion, Short & Open Check
Check Jumper setting
Ex) System boot error.
After insertion, check power source of board.
Ex) Power short

Power is supplied with board.
Check if each chip

s clock is generated correctly.
Check reset input.
Ex ) Check if each chip

s reset is input.
At this point, power is approved. If no error, message about booting shows to debug port.
To see output of debut port, set other computer
s serial port as baud rate = 38400, data
bit = 8bit, No Parity, 1 Stop bit. After that, you can obtain exact message. If the message
is broken or abnormal, setting process above should be checked.
From this, think normal booting is done.
If the booting fails, check the followings.
?? Check ROM
s Chip Enable (CE) and Out Enable(OE).
?? CE & OE should be active as Low (about 50 ?60nS) at the same time.
?? Check 8 data lines from ROM.
?? Check Serial Controller (U53)
?? Power, Condenser, Resistance (Open or Short)
?? Connection of Debug Port
?? Message will be shown into debug port
00xx : 0000
00xx : 0000
00xx : 0000
00xx : 0000
Connect RAM on board
When connecting RAM on board and error like 10, ram interface is not exact.
?? U3, U4, U5, U6 check (Open & Short).
?? PCI Device pci_clk check.
?? SDRAM Clock Damp check (RN 14)
?? U3 and U4 is No.1 pin and check output from 21285(U1).
After checking this, ram check will be normal. During ram check, if Clock is very bad, add
condenser (100uF) because this problem is caused by power near ram input.
Check ram carefully.
ISA Device check

?? ISA is at interior VT82C686 and interface with exterior is related to PS2 Key B/D &
Mouse , Serial 1, Serial 2, Parallel, HDD1&2 . And do the initialization of device.
VGA Device check
Initialize VGA Device, F65550 (U54), and output on LCD and CRT. If format is broken or no
image,
?? Jumper setting check (J10)
?? Check video RAM

s Open & Short.
?? Check Clock.
?? Check Hsync, Vsync, R,G,B

s output of U54.
?? VGA Connector check.
Copy Kernel from ROM to RAM.
Practice Linux Kernel
16 During Kernel
s operating, boot by HDD. Booting is done.
17 Ethernet (U100) check.
?? Clock input check
?? U100
s Open & Short check.
?? U100 operating check- After power on, at least one of LED1, LED2, LED3 (Link,
Active, 10/100B) should be working.
6.4.2 Detail debugging
1) POWER
(1) Power Source

: ATX Power Supply Input (+12V, -12V, +5V, -5V, +3.3V, -3.3V)
(2) Useable Power

+12, -12V : serial communication
+5V : PCI Bus System
+3.3V : PCI Device Power Source
+2V : CPU Core Voltage Only
(3) CHECK list before supply to power

Before power-on, FUSE and each power
s GND, short with power check is needed.
FUSE CHECK

fuse check for F1, F2, F3, F4
GND SHORT CHECK about each of power
# F 4 ( -12V) and GND # F3(12V) and GND # F2(5V) and GND

# F1(3V) and GND # L12(2V) and GND
Each power
s short check.
Following is measurement by multimeter. Check the power.

# F 4 ( -12V), F3(12V) # F4( -12V), F2(+5V) # F4( -12V), F1(3V)
# F 4 ( -12V), L12(2V) # F3(12V), F2(5V) # F3(12V), F1(3V)
# F3( 12V), L12(2V) # F2(5V), F1(3V) # F2(5V), L12( 2V)
# F1(3.3V), L12(2V)
POWER CHECK ( -12V, 12V, 5V, 3V)
After power-on, check the power is correctly input by OSCILLOSCOPE. F1, F2, F3, F4
check and check the same signal.
F4 signal VCC_ -12V F3 signal VCC_12V
F1 signal VCC_3V F2 signal VCC_5V
< picture > each power signal form

CPU Power check (2V)

CPU
s power should be 1.8 ~ 2.0V from Regulator(SC1117)
s No 2 PIN. So, CPU can
work normally.
B y m e a s u r ing L12 with OSCILLOSCOPE, check the signals are as following.
<Picture> VCC_2V
If output voltage is incorrect, need check to the R144(100 1%), R145(62 1%)
<Picture> SC1117CM Circuit Diagram
2) RESET
(1) RESET progress
When power on, RSTDRV Signal (U62 J1 pin) is input to the IC 5 pin of 7404(U64) , RSTDRV
Signal came out from VIA Chip 21285 (T17 pin: RESET) had RESET by inverting signal ( 6 pin:
RSTDRV_ L ) ,RESET signal active is
L

(2) Each of RESET signal form
<Picture>RESET signal

SonoAce 6000II Section 2-7. Mother Board
7. MOTHER BOARD
System Mother B/D perform the interface function between boards and cables and power and
sub-apparatus.
Mother B/D is consisted of PCB parts and connectors without electronic component.
There are DIN 96pin Connectors and Flat type, Mole type Connectors. Specially, SA6000II power is
designed by board type, and connect to mother B/D directly. So AC power input/output paths is used
on Mother B/D.

7.1 Mother B/D Configuration Diagram
AC POWER
FRONT
(From TRANS)
JP10
K
I
/
M
J3 JP3 J6 J11 J12 J15
J
P
JP9 8
JP1
JP2
J8
J
T
J A
P G
J1 4 J4 J9 J14 J17
R
E
A
H
R
D
D
FAN &
M
JP11 O
JP12
JP14 JP15
J2 J5 J10 J13 J16
JP13
J J
T T
A A
System Power
( +5V,+12V ) G G
P
O D
P B R
W S
C F X
E C
R
Picture 1. Mother B/D Configuration Diagram

7.2 Connection Diagram between Mother B/D and TRANS
M O T HER B/D
8mm
AC220_IN1
JP
AC_GND 8mm
10
AC220_IN2 8mm
8mm
MONITOR_AC_IN1
MONITOR_AC_OUT1 JP
3 6mm
MONITOR_AC_IN2
T
MONITOR_AC_OUT2 R
A
8m
AC15_IN2 N
JP
S
AC15_IN1 9
8mm
AC15_IN1
AC15_IN2 JP
2
AC15_SW1
4mm
AC15_SW2
8mm
Picture2. Connection Diagram between Mother B/D and TRANS

SonoAce 6000II Section 2-8. System Setup Dialogue.
8. System Setup Dialogue
System Setup Dialogue is a kind of tool to setting the system setup when product the system or
change the system setting.
User can
t use this program, usually product engineer or service engineer use this.
8.1 How to use System Setup Dialogue
8.1.1 How to go to System Setup Dialogue Shell
Picture1. Enter to System Setup Dialogue
1) Press
Ctrl + Shift + F1after system finish the booting.
2) Then you can see dialogue box like picture1.
3) Enter the password
SILICAGEL
.
? Notice : Password is a confidential, Don
t tell normal user.

4) You can see

System Setup Dialog Shelllike picture 2.
Picture 2. System Setup Dialogue Shell
On System Setup Dialogue Shell, there are tab dialogue menu for Admin, SW, Probe, Mode.
If you select each Tab Dialogue menu, you can see each detail menu. Picture 2 show us Admin
menu, it is default when you comes to System Setup Dialogue Shell
Followings are details of each Tab Dialogue.

8.1.2 MAdmin Tap Dialogue
Admin Tap Dialogue use Admin of Administrator, and it can chage something concerned with
System Setup.
8.1.2.1 Linux Setup
SA6000II System use Linux by OS and this menu is possible to setting the Linux for SA6000II
System.
1) Press Button
2) You can see Picture 3. Linux Setup
Picture 3. Linux Setup

On this menu, you can modify 4 kind things.
In this part, you have to use keyboard -direction key and Tab key, Enter key- Mouse doesn
t work.
Select one of menu by direction key and go to
Run Tool by Tab key. And press
Enterthen
you can s etting each part.
If you press space bare when curser is on option, option is selected with
* mark.

@ Authentication configuration
This part manage authentication part, and very important on security.
1) Select
Authentication configuration
, then Picture4. will appear.
Check [*]Use Shadow Passwords option
This option encode and save password field of /etc/passwd to
shadow file in order to other
user can
t see. This option must be checked.
2) Press Button and exit.
? Notice : This option is default.
Picture 4. Authentication configuration

@ Keyboard configuration
On this menu, we can select keyboard type to each country.
SA6000ii use Multilanguage on one keyboard.
Usually, we select America
US
If you select
Keyboard configurationthen Picture 5 will appear.
1) Select
us and press button.
? Notice :
us is a standard.
Picture 5. Keyboard configuration

@ System services
System service is called demon management on Linux.
SA6000II systems use following 4 demons basically.
- lpd : Print service daemon to use printer on system.

- inetd : this is internet super server demon which charge internet, it manage telnet, FTP, rlogin
service.
- network: this script load the network interface when system booting.
- mysql : This used when save the sonoview image or patient data.
1) If you select
System services
, picture6 will be appear.
Picture 6. System services
2) Select
inet,lpd,mysql,networkand press button.
? Notice : This option is standard.

@ Timezone configuration
This option is possible to select time bend on Linux consol, check time to each country.
In case of Korea, ROK was selected.
We don
t use Hareware clock set to GMT option.
1) If you select
Timezone configurationPicture7. will be appear.
2) Select
ROK and press button.
? Notice : This option is standard
Picture 7. Timezone configuration
When all Linux setup is finished, exit to

Quit
.

8.1.2.2 Network Setup

To use networking, something setting value will be setup on this menu.
Before start Network Setup menu, note the Network setting value on setup information.
Picture 8. Network information
1) Press Button on System Setup Dialog Shell (Picture 1, 2 )
2) Then Network Setup menu will appear like Picture 9.
Picture 9. Network Setup

3) System ask
Would you like to set up Networking?If you select
Yes
, old networking setup
value will be delete. So, It is better note to old setting value.
4) Then Picture 10. will be appear. I
If you use DHCP to receive IP automatically, select [ * ] U s e d y namic IP configuration
( BOOTP/DHCP ). If you use static IP address enter like followings.
IP address : xxx.xxx.xxx.xxx
Default gateway ( IP ) : xxx.xxx.xxx.xxx
Primary namesever ( DNS ) : xxx.xxx.xxx.xxx
(x : given addressed number)
5) When finish Network setting, press button.
6) You have to turn Off/On the system to use new network setting value.
Picture 10.Network Setting
8.1.2.3 HDD Checking
Use this option when you want to do scan disk on HDD like Win98 or Win2000.
1) Press Button.
2) Turn Off/ON power then system check the HDD during booting.

8.1.2.4 Printer Setup

Use this option when use line printer on SA6000II system.
1) Press button
2) Then you can see like picture 11. Printer Setup. Normally, there are no list because product
setup don
t include it.
Picture 11. Printer Setup
3) Press button to install the new printer.
Picture 12.Printer Add

Connect the parallel port to printer and press button.
4) Picture 13. show there are one Parallel port detected. If there are noting find, you have to
check system and printer.
13.Printer Detect
5) Select button.
6) Select a printer name you want on

Names
. Usually write
lp
(local printer) on LINUX.
Picture 14. Local Printer Entry
7) Select button.
8) Select a printer type which you want to install.
If there is exact printer, select that.
If not, select HP DeskJet 550C/560C/6xxC (HP deskjet type) or
Epson Stylus
Color(UP)(Epson printer)
Picture 15.Printer Select
9) Press button.
Picture 16. Printer Select Result

10) When finish all setup, exit with

Quitbutton on
Print Toolmenu.
Picture 17.Printer Setup Exit

8.1.2.5 Lock Manager
Lock Manager used when Lock or Unlock SA6000II System Option S/W.
1) Select button.
2) Lockman window will be appear like picture 18.

3) Enter the Password to dialog box
XXXXXXXXXXXXX
.
4) Select the option which you unlock.
Selected option is change to , unselected option is .

5) Press button and rebooting.
6) Check the option on Setup.
Picture 18. Lock Manager

8.1.2.6 Biopsy
Use this menu to setting biopsy on probe.
1) Press button.
2) Biopsy setting menu appear like Picture 19.

3) Select the start point by track ball and press
setkey.
4) Select the end point by track ball and set key to save biopsy data.
Picture 19. Biopsy Setting
5) Check the result on Menu ? Biopsy On .
Picture 20. Biopsy Setting Result

# Delete biopsy setting
1) Select button
2) Biopsy setting picture show like picture 21.

3) Press
Set Keytwo times without Biopsy Line.
Picture 21 Biopsy Setting
Menu ? Biopsy Onto make biopsy Off status.( Biopsy Clear )

4) The other way is
22. Biopsy Clear

8.1.2.7 Upgrade
Use this menus to up-grade SA6000II system
1) Insert the MO diskette which contain Upgrade file.

2) Wait until MO lamp off.
3) Press button.
4) Enter /mnt/mo/* on Filter.

You can see where is upgrade file and directory on MO diskette.
5) Select the version directory and file and press button.
Picture 23. Upgrade
6) During Up-garde, file was installed to mainsys directory.

? During Up-grade, all program is closed so, power off is impossible.
7) Following menu appear when press left key of Track Ball. ( Exit Key )

8) Select New Window and make a prompt shell.

9) Execute
./powermanon prompt. (When press New Window, go to /mainsys/bin directory)
Picture 24. Prompt Shell
10) Execute
eject /dev/sdaand remove the MO diskette.
11) Turn Off/On the power. (System check the HDD when reboot.)

8.1.2.8 Country
It need to setting the system to each country (Measure, Logo, Application, System
configuration..), Standard is Mediosn.
? It is not useful now.
1) Click by track ball, then you can see Picture25.
2) Select Country and click button.
3) System will allow saved value after Rebooting.
Picture 25. Country

8.1.2.9 NTSC/PAL
NTSC(60Hz),PAL(50Hz) is selected by each countrydisplay sync.

Usually America, Korea, Japan use NTSC, Europe use PAL.
1) Click the icon by track ball, then you can see like Picture 26.
2) Select NTSC or PAL and click button.
Picture 26. NTSC/PAL

8.1.2.10 language
It use when you select the language. (Multi Language)

System supply 5 language(English, German, French, Italian, Spanish)
1) Click the icon by track ball then you can see like Picture 27.
2) Select the language and click

.
Picture 27. Language

8.1.2.11 System Serial
System serial number is booked when product.

You can install the system serial number like Picture 28.
Picture 28.System Serial

8.1.2.12 Miscellaneous
Let
s check others.
There are 3 button on bottom side, we will check how to use these.
1) button make all setting value to beginning status. Usually this button
executed before delivering on factory side. When you click this button, following password
box will be appear.
If you enter the password

initokand press
OK
, all setting value will be back to factory
setting. You have to pay attention because patient ID information and Image filing Data will
be lost.
2) button is used to close the Main Program. When you click this button,
password box appear. If you enter the password

quitokthen press
OKsystem go to
Shell. In order to back to Main write down
./runmainand enter.
3) is used to go to Shell mode without close Main Program. Also it need
password
shellokand press
OK then go to Shell mode. If you come back to main
program, write
exitand press enter.

8.1.3 SW Tab Dialogue

This shows the information of system SW.
There are three part on Picture 9. - RUN OPTION/OPTION/EVENT FILTER -
Picture 29. SW
1) RUN OPTION
This part show the option when execute
./main
.
Foramt : ./main ?XXXXX

1is option is selected
0is not selected.
- nohardware : To turn on the system without Hardware,
ex )./main -nh
- no_probe : To turn on the system without Probe,
e x ) . / main -np
- debug : To use debug Mode,
ex )./main --debug
- noprbdchk : Don
t check when take off the probe during using System
- e x ) . / m a i n --noprbchk
- nochkprb : Don
t check the probe when turn on the system
ex )./main --nochkprb
2) OPTION
This part shows option status,
1is selected and
0is not selected.
3) EVENT FILTER
This part used by researcher.

8.1.4 Probe Tap Dialogue
This part shows probe information, there are all probe information.
Ex) Probe ID, Probe name, Element, others
Picture 30. Probe

8.1.5 Mode Tap Dialogue
Picture 31. Mode
Mode Tap Dialogue used by researcher or debugger to use main S/W command.
It is not allow to normal user.

8.2 MO Diskette
SA6000II use MO Drive & Diskette to image backup me dia. Now we use MO diskette is FAT32
formatted 540MB. (near future we use 640MB,1.3GB)
In order to us MO on Shell mode, need MO mount.
?? 540MB MO mount method
1) Insert MO Diskette (wait until LED off)

2) bash-2.03# mount ?t vfat /dev/sda /mnt/mo ?
This command means do mount MO (sda(scsi) in derive) to /mnt/mo by FAT32.
3) bash-2.03# cd /mnt/mo
This command means access the MO in /mnt/mo.
4) bash-2.03# ls
This command list up to all file and directory in MO it looks like
dir command.
?? MO mount which higher than 640MB
1) Insert MO Diskette (wait until LED off)

2) bash-2.03# mount /dev/sda /mnt/mo ?
This command means do mount MO (sda(scsi) in derive) to /mnt/mo by FAT32.
3) bash-2.03# cd /mnt/mo ?
This command means access the MO in /mnt/mo.
4) bash-2.03# ls ?
This command list up to all file and directory in MO it looks like
dir command.
?? MO eject (540MB, 640MB)
1) bash-2.03# cd ?
This command means go to root directory.
2) bash-2.03# eject mo ?
This command remove MO Diskette from MO Drive.
In order to remove MO Diskette, need unmount. Eject mo is a command to unmount.
Eject button doesn
t work in this status.
?? MO Format (540MB, 640MB)
MO Diskette formats on Shell mode.

1) Insert MO Diskette. (wait until LED off)
2) bash-2.03# mke2fs /dev/sda ?I
This command means format the MO Diskette by e2fs type (linux partition type)
3) Then you can us MO by use MO mount.

8.3 SA6000II S/W Directory Structure
Let
s check SA6000II S/W directory.
1st 2nd 3rd

CONTENTS
directory directory directory
debug There are script for debug dialogue
data
set00 There are probe application data
./main : SA6000II main program
./lockman : Option lock manager program
bin ./powerman : System shutdown program
root ./runmain : batch file(script) program

mainsys ./formatmo : MO diskette format(fat32) program
system_config.ini : Regist current system setting
ini
password.ini : Option password is recorded
image Image filing data
system
sonoview Image filing directory
measure GA table data and measurement data
bodymark body mark drawing file
Under /bin directory, there are system file and remember back up the image filing data when up-trade
the system.
`

SonoAce 6000II Section 2-9. Main Board Picture.
9. MAIN BOARD Picture
9.1 Position of each BOARD

9.1.1 PSA BOARD

9.1.2 RECEIVER BOARD
9.2.2 BEAMFORMER BOARD

9.2.3 DSC BOARD
9.3.4 POWER BOARD

SonoAce 6000II Section 3-1. Main Power.
1. MAIN POWER
1.1 GENERAL
THIS UNIT SUPPLY INPUTTING AC POWER (90V -132V/180V -264V SINGLE PHASE) BY PWM
CONTROL OUTPUT (5V,12V, +3.3V 1080V POWER) AND SUPPLY HIGH VOLTAGE TO (LEGO
MODEL) SWITCHING MODE POWER SUPPLY
1.2 FUNCTION
?? AC INPUT AUTO DELAY OFF

?? ONSTANT VOLTAGE OUTPUT
?? VARIABLE ARRAY OUTPUT VOLTAGE
?? OVER CURRENT PROTECTION OVER VOLTAGE
?? PROTECTION
1.3 ELECTRONIC CHARACTERISTICS
1.3.1 INPUT CHARACTERISTICS
1) VARIABLE INPUT VOLTAGE RANGE

AC90V 132V & AC180V AC264V SINGLE PHASE
2) RATED INPUT VOLTAGE
AC110V FIX & AC220V FIX
3) MAX INPUT CURRENT
9.4 MAX AT 90V AC
4) INRUSH CURRENT
100A MAX AT MAX OUTPUT/AC 110V INPUT
5) EFFICIENCY
65% AT MAX LOAD, MAX OUTPUT VOLTAGE, RATED INPUT
6) LEAKAGE CURRENT
100uA MAX at AC264V INPUT
1.3.2 OUT PUT CHARACTERISTICS
1) OUTPUT VOLTAGE CURRENT

POWER AC110V/AC220V

CURRENT
VOLTAGE
MIN TYP MAX MAX POWER
+ 3.5VF 0A 8A 12A 42W
+5.2VD 0A 6A 8A 41.6W
+ 12.2VD 0A 1.5A 2A 24.4W

- 12.2VD 0A 0.8A 1A 12.2W
+ 5.2VA 0A 3.8A 5A 26W
- 5.2VA 0A 3.5A 4.6A 23.9W

+10V 80V 0A 0.1A 0.2A 16W
-10V 80V 0A 0.1A 0.2A 16W
TOTAL 202.1W
2) REGULATION
LINE REGULATION ( 1% )`
INPUT AC90V 132V / AC180V AC264V
OUTPUT TYP LOAD
LOAD REGULATION ( 2% +0.1V )
INPUT AC110V/AC220V , OUTPUT MINMAX LOAD
CROSS REGULATION ( 3% +0.1V )
OUTPUT MIN,TYP,MAX LOAD
3) PROTECTION
OVER VOLTAGE PROTECTION : 120% 10% +1V
HV : 110% 5% +1V
OVER CURRENT PROTECTION : SHORT PROTECTION
4) RIPPLE NOISE
AC INPUT : AC110V
TEST POINT : 1/250V CAP
SCOPE PLUG : SHORT PLUG
OUTPUT LOAD : MAX LOAD
VOLTAGE RIPPLE NOISE

+5.2V D 50mVP-P 100mVP-P
+3.5VBF 35mVP-P 70mVP-P
12VD 120mVP-P 240mVP-P
5VA 50mVP-P 100mVP-P
80V 800mVP-P 1.6V
5) RISING TIME (+3.5VBF,+5.2VD)

30mS MAX AT RATED LOAD, MIN INPUT VOLTAGE
6) FAIL TIME (+3.5VBF,+5.2VD)

200mS MAX AT TYP LOAD, RATED INPUT VOLTAGE
AC INPUT
AC FAIL TIME
FAIL TIME
V
200mS MAX
DC OUTPUT
90%
10%
DC OFF TIME
7) OVER SHOOT (ALL OUTPUT)

MAX 5% AT RATED OUTPUT
AC INPUT
AC FAIL TIME
OVER
SHOOT
RATED
DC OUTPUT
OFF TIME
8) POWER SEQUENCE
IN PUT : AC110V/60HZ

OUTPUT : TYP LOAD

AC ON
| +------------------------
+--------+------------------------
| | T a O N ( + 3 . 3 V BF)
| | +-------------------
+--------+----+-------------------
| | T b O N ( + 5 .2VD)
| | +-------------------
+--------+----+-------------------
| | T c O N ( + 1 2 V D)
| | +-------------------
+--------+----+-------------------
| | T d O N ( -12VD)
| | +--------------------
+--------+----+-------------------
| | T e o n ( -5VA)
| | +--------------------
+--------+----+-------------------
+----+
S E T U P T I M E : 1 0 0 m S 450mS *Ta , Te Deflection : 150mS
9) LOGIG DIAGRAM
ON OFF
POWER
SWITCH
AC
OUTUT
DelayStart
P/O SIGNAL (Output)

OUTUT
Delay End(Input)
P.B SIGNAL
INPUT
Delay Time
10) BURN-IN TEST

CONDITION : LOAD - TYP LOAD , TEMPERATURE - 40 , TIME-8HR
M A X - LOAD NORMAL TEMPERATURE
* Component temperature must be lower than 90.

1.3.3 SAFETY
1) * IEC 601-1 (SAFTY OF ELECTRIC MEDICAL EQUIPMENT)

* CISPR 11 CLASS A, VDE 0871 CLASS B
2) INSULATION RESISTANCE
20M ohm MIN AT 500V DC
3) WITHSTANDING VOLTAGE
AC 1.5KV PRIMARY FG
AC 4KV PRIMARY SECONDARY
1.3.4 ENVIRONMENT
1) TEMPERATURE
OPERATING : 0 40
STORAGE : -20 60
(+) STORAGE TEMPERATURE : SYSTEM NO OPERATION
60
48HR 2 HR
25
TEST POINT
(-) STORAGE TEMPERATURE : SYSTEM NO OPERATION
25 48HR
4 HR
-20 TEST POINT
(+) OPERATING TEMPERATUR E
40 48HR
25

End Time

(-) OPERATING TEMPERATURE
25

48HR End Time
0
2) HUMIDITY
OPERATION : 10% -90% RH
STORAGE : 10% -90% RH
90%
48HR
10%

END TIME

D39 C99
1N4001 C104
Q15 D38 R112

BD2 BU806
1/8W100
W02
+ D35 D40 1N4001
R107 1N4001 R113
1N4001 1/4W 120
AC15V 1/8W100
U25
R105 R110
1 2 4 U24 3 BR-950C
- C67 2W 1.8K D36
1/8W1K
220/63 + 1N4001
AC15V R114 ACIN 3
Q16 4 3 1 2 POWER RY3
D37 POWER CONTROL 1/4W1K
A708
1N4001 OFF PC817 SIGNAL
1 R111 PC817
LD1 SIGNAL
1/8W 390 ACOUT 3
R106 ZD4 LED LED CH22-MD12F
MAIN12V
1/2W 8.2K 1N4742
ACIN 4
2
R108 U23 RELAY ON/OFF TIME
KA431
C68 1% 47K R109 POWER ON = 1 - 2 - 3
+ D45
RY1 ACOUT 4
22/63 C69
1% 4.7K 1N4001
C104 POWER OFF = 3 - 2 - 1
D41 1N4001 R116 1/4W470K
CH22-MD12F
3 4 1 2 R118 R104
Q17
RY2
D42 C2383 2W10
C71 1/4W3K D46 CR1
1N4001
MN105 1N4001 BTA16-600
D43 1N4001
R117 1/4W100K CH22-MD12F
9 8 5 6 R119
Q18
D44 ACIN 1
R115 1/4W220K C2383
C72 1/4W3K
MN105 TH1
U26 MC14584
1N4001 NTC10D11
ACOUT 1
R120
1/8W 1K R103
CR2
2W10
BTA16-600
+5VA
OVP -5VA
+HV ACIN 2
-HV
TH2
NTC10D11
ACOUT 2
D47
1N4001 -12
+12
+5VD
1/8W680
1/8W2.4K 1/8W330
1W30K
1W30K +3.5VD
1/8W680 1/8W680 1/8W2.4K
P/O C
R126
R129R130
R128 R127 R123R124 R125
P/O E
PB+
POSKOM CO.,LTD
LD10LD11LD12 Title
PB-
SA-6000II OFF
LD5 LD7 Size Document Number Rev
LD6 LD9 B
LD8 SA-6000II 00
GR GR GR GR GR GR GR GR
Date: Friday, August 17, 2001 Sheet 1 of 1

POWER
POWER

110 AC15V
INLET CR2 L1 O02 0

110V 3 AC15V
1 2 S2
ACINPUT 2
C2 C4 220V 1
224/AC250V 221/AC250V 471/AC250V
FG C1
C5
221/AC250V
ACINPUT 1 2 110V 3 AC110V
2
C3 471/AC250V
R1 220V 1 110 OUTLET1
VOLTAGE
1/2W 470K SELECTOR AC110V
INPUT 0

AC110V
OUTLET2
AC110V
POSKOM CO.,LTD
Title
SA-6000II RACK
Size Document Number Rev
B 00
SA-6000II

T4 R84 C45
1/2W 47 M102
PQ2625
D15 L2
+DC +12.2V 2A
+ C96 OB630 1.0 MAX
R44 D10LC20U C19 + +
47/400
2W 24K C9 C13 + 2200/16 C44 C87
C103/1KV 2200/16 R50 C224 100/16
2W 270
-DC
D14
1N4937
Q10 TOP225 R56 R49
1/8W 100 1/8W 15K
Control Source Drain
1 2 3 R48
C16 R55
D10 1N4937 M104 1/8W 10K 1/8W 3.3K
C15 + U15
47/25 R54
2 1/8W 4.7K VR6
PC817B U16 2K
R53 MN104 3
KA431
1/4W 6.8
C80
R88 C50
1/2W 47 M102
T3
L8
EI2219
+ C97 D3 DRUM 10PIE 0.6MAX
R90 D10SC4M C48 + +
47/400
2W 24K C97 C47 + R86 1000/16 C49 C88
C103/1KV 1000/16 1W 470 C224 100/16
-12.2 1.3A
D29
Q3 TOP223 1N4937 R28 R24

1/8W 100 1/8W 15K
1 2 3 R23
C7 R27
D30 1N4937 M104 1/8W 10K 1/8W 3.3K
C52 + U9
47/25 R26
2 1/8W 4.7K VR3
PC817B U10 2K
R89 MN104 3
KA431
1/4W 6.8
C79
POSKOM CO,.LTD
Title
SA-6000II +12.2,-12.2
B SA-6000II 00

T2 R94 C58
1/2W 47 M102
EER2834
D2 L9
+DC +5.2V 5A
+ C98 DRUM 10PIE 1.0 MAX
R91 D10SC4M C56 + +
47/400
2W 24K C54 C55 + R93 3300/10 C57 C89
C103/1KV 3300/10 1W 51 C224 100/16
-DC
D32
Q2 TOP225 1N4937
R10 R7
1/8W 100 1/8W 2.4K
1 2 3 R6
C2 R9
D31 1N4937 M104 1/8W 10K 1/8W 2k
C53 + U4
47/25 R8
2 1/8W 4.7K VR2
PC817B U3 500
R92 3
C78 KA431
1/4W 6.8
MN104
1
R97 C61
1/2W 47 M102
T1
L8
EER2834
+ C93 D1 DRUM 10PIE 1.0MAX
R96 D10SC4M C63 + +
47/400
2W 24K C59 C62 + R98 3300/10 C64 C90
C103/1KV 3300/10 1W 51 C224 100/16
-5.1V 4.6A
D34
Q1 TOP225 1N4937 R5 R2
1/8W 100 1/8W 2.4K
1 2 3 R1
C1 R4
D33 1N4937 M104 1/8W 10K 1/8W 2k
C60 + U2
47/25 R3
2 1/8W 4.7K VR1
PC817B U1 500
R95 3
C77 KA431
1/4W 18
MN104
1
POSKOM CO,.LTD
Title
SA-6000II +5VA,-5VA
B SA-6000II 00

L11 LINE FILTER L12 INDUCTOR

T7 R80 C39
AC IN 1/2W 47 M102
C65
PQ2625
C76 CR3 D27 L7
222/AC250V
C75 9G471 +3.5VF 12A
104/AC250V 104/AC250V BD1 OB630
C66 + + C94
KBPC2506 C30P04Q
47/400 R73 R83 C33 + +
C36 + C37 + 2W 24K C30 C31 + + 4700/10 C42 C85
AC IN 5W 22
222/AC250V C103/1KV 4700/10 C32 C224 100/16
470/400 470/400 3300/10
-
D26
1N4937
Q13 TOP227 R79 R76
1/8W 10 1/8W 1K
1 2 3 R135 R75
2W 15 C35 R78
1/8W 2.2K
D28 1N4937 M104 1/8W 10K
C34 + U21
R77
47/25 2 1/8W 4.7K
VR9
PC817B U22
R74 MN105 3 1K
KA431
1/4W 18 C82
R82 C41
T5 1/2W 47 M102
EER2828
L5
+DC
+5VD 8.5A
D20 DRUM 10PIE MAX
+ C95
D10SC4M
47/400 R62 C29 + +
2W 24K C21 C25 + R64 3300/10 C43 C86
C103/1KV 3300/10 2W 33 C224 100/16
-DC
D19
1N4937
Q12 TOP226 R72 R69
1/8W 100 1/8W 3.3K
Control SourceDrain
1 2 3 R136 1W 20 R68
C28 R71
1/8W 2.2K
D25 1N4937 M104 1/8W 10K
C26 + U19
R70
47/25 2 1/8W 4.7K VR8
PC817B U17 1K
R67 MN104 3
KA431
1/4W 6.8 C81
POSKOMCO,.LTD
Title
SA-6000II 3.5VF,5VD
B
SA-6000II 00

D7
1N4002
R39 IRF9640
+HV
Q6 47/100V 1/250
A 1W1.5 ZD2 R29 + + RELAY 4
+DC S3L60 L4 R42
T6 CN101 Pin9 1N4744 1/4W10K R35 C4 C91
D21 -HV
+ C84 1/2W200K
+97V Q9 1/8W1M
47uF/400 OB630 0.8pie
C17 MPSA92 2 +HV ADJ
R4 U11AA -
C22 + R45
-DC Q11 LM358 VR5 R37
+ 47/200V 1/2W39K 1
MJE340 1/8W4.7K + 2K 1/8W9.1K
47/200V 3
. C18 R40
D11
D10
1N4002
D13
U7
PC817
R121 103/100V C23 + + R46 1/4W1K 1N4002 1N4002
2W24K 47/200V 1/2W39K
C74 L13
D22 47/200V
D8 R36
Q4 TOP-225
1N4937
D48 . S3L60
OB630 0.8pie
R25
1N4002
D9
U6
PC817
1/8W4.7K
U12
+14V 1/8W1K 1N4002
D23 1 3
I LM7812 O +12V R34 1/8W1M
D12
Control Source Drain R33
1N4002 -HV ADJ
1N4937 U11BB 1/8W10K
+ R58 + C11 6
G MJE350 R32 -
1 2 3 C24 1/4W1K 100/16V 7
Q7 LM358 VR4
1000/25V MPSA42 1/8W4.7K + 2K
2 5
D48
U20
+ Q8
C73 C20 + R65 + C10 ZD1 R22 IRF640
47/25 470/25V 1/4W1K U13 100/16V 1N4744 1/4W10K C3 + + C92
1N4937 R30 R31 47/100V 1/250
PC817
R122
1/4W 6.8
MN104
C83
. D24
1N4937
-14V
1
I LM7912 O
3
-12V 1W1.5
1N4002
D4 Q5
1/2W200K
G
. 2
+12V
R18
224/50V
SHORT PROTECTION 5SEC C5
1/8W1K
1N4002 R16 1/8W47K
+12D
D5 D6 R20
U7 U6
1N4002 1/8W1K
+5.2A -12V
5
+5.2D D60
R17 U8B 1/8W56K KA741
1N4003 1N4003 +HV PC817 PC817 5 4 8
D57 D56 +3.5V D64 + 7 Q99 R14 2 1
1/8W330K LM358 -
OVP
C100 +
1N4937 D58
1N4003 . D61
1N4003
1N4937
R19 10/50V
C6 +
6
-
1/8W3.3K
R21
C3198
R13
1/8W3.3K
3
+
6
Q19 100/16 1/8W2.2K

ZD8 D59
2N5064 +12 1N4729 1N4937 1N4728 D55 ZD10 7
ZD9 1N4003 1N4740 ZD11 -12V -12V LD2
R133 TRIP +12V
1/8W56K 1N4762 LED RED
R131 R51 R12
U14A
+14V R134 1/4W 680 1/4W 2.7K 3pie 1/8W 3.3K
A KA358
1/8W 5.6K 8
D17 3 R43 CH22-MD12F +12
+
R66 1 1/4W 1K RY4 0-5V
1/8W680 R57 2 SIGNAL INPUT
-
1/2W82K C12 R85 R15
1N4937 HV CONTROL
ZD3 +1/50 + C14 D4
R52 1/8w 2k
1N4729 1/50 1N4002
4 1M 8 R11
3
1% 5.1K +
R47 R38 1
C27 VR7 -12 2 1/8W 56K
1% 2K 1/4W 1K -
20K Q20 R87
D18 6 C2383 1/8W 10K U27A R80
-
7 KA358
M104/100V R61 1/8W 200
5 + C8 4
+
R63 1/50 ZD6 ZD7
1/8W10K 1N4937
U18 1% 1K 1N4740 1N4762
TL431 R60 D52 D53 D62
R59 1N4003 1N4003 1N4937
1/8W4.7K
1/8W2.4K
D65
1N4003
POSKOMCO,.LTD
Title
D51
-HV SA-6000II HIGH VOLTAGE
-12A Size Document Number Rev
-5.1A B 00
1N4937 SA-6000II

AC INPUT RELAY
LINE FILTER RECTIFIER TRANS RECTIFIER FILTER +5.2VA
(AC110~220V) TOP S/W
AC INPUT
RELAY
PWM CONTROL
TOP S/W TRANS RECTIFIER FILTER -5.2VA
PWM CONTROL
AC INPUT RELAY
(15V) RECTIFIER CONTROL
AC INPUT
SIGNAL
+HV
RECTIFIER FILTER REGULATOR +HV
TOP S/W
high voltage 0V-5V

& CONTROL
TRANS SHORT PROTECTION CONTROL
-HV -HV
RECTIFIER FILTER REGULATOR
PWM CONTROL
POKSOM CO,.LTD
Title
LEGO BLOCK DIAGRAM
B
LEGO POWER 00
Date: Wednesday, January 31, 2001 Sheet 1 of 1

7. BLOCK DIAGRAM
AC INPUT RELAY
LINE FILTER RECTIFIER TRANS RECTIFIER FILTER +3.5VBF
(AC110~220V) TOP S/W
AC INPUT
RELAY
PWM CONTROL
TOP S/W TRANS RECTIFIER FILTER +5.2VD
PWM CONTROL
AC INPUT RELAY
(15V) RECTIFIER CONTROL
AC INPUT
SIGNAL TRANS RECTIFIER FILTER
TOP S/W +12.2V
PWM CONTROL
TOP S/W TRANS RECTIFIER FILTER -12.2V
PWM CONTROL
POSKOM CO.,LTD
Title
LEGO BLOCK DIAGRAM
B
LEGO POWER 00
Date: Wednesday, January 31, 2001 Sheet 1 of 1

AC_220V_IN(55cm) 1
2
3
AC_GND(55cm) 4
5
AC_220V_IN(55cm) 6
GND
220V
AC_110V_IN(51cm) 1
2
3
4
LEGO TRANS 5
AC_110V_IN(51cm) 6

7
8
AC_15V_IN(45cm) 1
2
AC_15V_IN(45cm) 3
INLET AC LINE
AC_110V_OUT(51cm)
Monitor
AC_110V_OUT(51cm)
Echo_Printer

SonoAce 6000II Section 3-2. Monitor.
2. MONITOR
2.1 APPLY MODEL

This model is using MEDIOSN SONOACE SA6000II (SA-6000II) DISPLAY MONO MONITOR MODEL
GM-12LD (12 inch).
2.2 UNIT CONTENTS
?? * ENCLOSURE (PLASTIC CASE)
?? * 12 inch MONO TUBE
?? * CHASSIS
?? * POWER SWEEP AND SOCKET MODULE
2.3 STANDARD TEST STATUS

Temperature : 23 2deg C , humidity : 50 5%.
2.4 ELECTRONIC CHARACTERISTICS
2.4.1 INPUT PORT : BNC CONNECTOR
2.4.2. INPUT SIGNAL :

a. INPUT IMPEDANCE : 75 ohm
b. INPUT LEVEL : COMPOSITE VIDEO : 0 to 0.7 Vp-p
Sync on VIDEO : 0.3 Vp-p
c. POLARITY
c-1. VIDEO --- POSITIVE
c-2. SYNC --- NEGATIVE (HORIZONTAL. VERTICAL)
2.4.3 VIDEO Amp BAND WIDTH : 28 MHZ
2.4.4 DEFLECTION STAGE CHARACTERISTICS
Freq RETRACE TIME FULL-IN RANGE

HORIZONTAL 31.50KHz 3.9uS 300 Hz
VERTICAL b. 60 Hz 0.5mS 2 Hz

2.4.5 POWER SUPPLY
?? AC INPUT : AC 90V -265V / 50-60Hz
?? CONSUMPTION : 47 Watts MAX
2.5 CRT CHARACTERISTICS
?? T Y P E : R12KP45 ( KEC )
?? SIZE : 12 inch SCREEN
?? DEFLECTION ANGLE : 110 Deg
?? PHOSPHOR : P4
?? LIGHT TRANSMISSIO N : 46 / 34
?? FACE TREATMENT : GLARE
?? H E A T E R : DC 6.3V / 248 mA
2.6 DISPLAY CHARACTERISTICS
2.6.1 DISPLAY SIZE

?? H-SIZE : 210mm 1.5mm
?? V-SIZE : 158mm 1.5mm
2.6.2 SIZE REGULATION
?? W 2% (with VARIATIONS OF EXTERNAL CONTROLS MINIMUM to MAXIMUM)
2.6.3 DISPLAY CENTERERING
?? H-CENTER : 1mm
?? V-CENTER : 1mm
2.7 SETTING POINT
2.7.1 INTERNAL SETTING POINT
?? SUB-BRIGHTNESS
?? VERTICAL SIZE

?? VERTICAL CENTER
?? VERTICAL LINEARITY
?? HORIZONTAL HOLD
?? HORIZONTAL PHASE
?? HORIZONTAL WIDTH
?? FOCUS
?? SUB CONTRAST
?? V-SIZE COMPENSATION
2.7.2 EXTERNAL SETTING POINT
?? BRIGHTNESS CONTROL
?? CONTRAST CONTROL

2.9 PROBLEM CHECK LIST

Followings are in case of simple problem, serious problem need to repair by expert engineering.
2.9.1. NO RASTER
DC INPUT LINE a. POWER CN 301 CHECK

b. D312 DIODE CHECK
N.G
CHECK c. +12V, +40V CHECK
INPUT SIGNAL a. SYTEM CHECK

N.G
CHECK b. VIDEO CABLE CHECK
(CN101 ARROUND) (INCLUDE BNC)
HD 101 NEAR a. HD101 CHECK

N.G
b. HD101 NEAR PART BAD
PARTS CHECK SOLDERING CHECK
IC 101 OR a. IC101 FAIL

N.G b. AROUND CONDENSER
PART PROBLEM OR BAD
AROUND PARTS SOLDERING
H. DRIVER (Q301) a. Q301 FAIL

N.G
H.OUTPUT (Q302) b. Q301 FAIL
OR ARROUND PARTS c. FBT ARROUND CHECK
VIDEO CIRCUIT a. HD102, Q501, Q502

N.G b. CRT SOCKET CONNE-
CTION OR EACH PART
ARROUND CIRCUIT POWER CHECK
FBT HV NEED A EXPERT

N.G REPAIRING
CHECK

2.9.2 There are one horizontal line
IC 201 +24 V
N.G
a. R201 OR D201 OPEN
CHECK
IC 201 OR ARROUND a. IC 201 FAIL

N.G
b. C209, R217 FAIL
PARTS CHECK
H-DY CONNECTION & a. V -DY WIRE OPEN

N.G
V-DY CHECK b. V -DY OPEN
NEED A EXPERT REPA-

IRING

2.9.3 There are one vertical line
FBT ARROUND CIRCUIT
CHECK
H-DY CONNECTION & a. H-DY WIRE OPEN

N.G
H DY CHECK b. H-DY OPEN
WIDTH COIL a. WIDTH COIL OPEN

N.G
LINEARITY COIL b. LINEARITY COIL
CHECK OPEN
C307, 308 CHECK a. C307, 308 FAIL

N.G
b. T301 BAD SOLDERING
NEED A EXPERT REPAI-

RING

2.9.4 Vertical synchronization broken
SYSTEM a. SYSTEM FAIL

b. SYNC CABLE
N.G
SYNC OUTPUT CHECK OPEN OR SHORT
IC 201 SYNC a. HD101, Q201

N.G
b. IC 201 FAIL
INPUT CIRCUIT CHECK
IC 201 OCILLATOR a. R204, 205

N.G
b. D202 FAIL
CIRCUIT CHECK C. IC201 FAIL
IC 201 CHECK

RING

2.9.5 Horizontal synchronization broken
SYSTEM SYNC a. SYSTEM FAIL

b. SYNC CABLE
N.G
OUTPUT (CN101) CHECK OPEN OR FAIL
HD 101 ARROUND a. R107, 101 OPEN OR

N.G BAD SOLDERING
b.IC101 ARROUND COMP-
CIRCUIT CHECK ONENT FAIL OR BAD
SOLDERINGT
a. R115, 117, 118 FAIL

N.G OR BAD SOLDERING
IC 101 CHECK b. IC101 FAIL OR BAD
SOLDERING
c. VR 102 FAIL OR BAD
SOLDERING
d. VR 102 SETTING PRO-
BLEM
RING

2.9.6 Monitor is too bright when setting brightness volume.
INPUT a. POWER SUPPLY POWER

VOLTAGE CHECK (+12V) CHECK
N.G
a. CN303 CONNECTION FAIL

N.G
CN 301 CHECK b. CN301 OPEN
c. EXTERNAL B R I G H T N E S S
VOLUME FAIL
VR 301 NEAR PART a. R 309 FAIL OR BAD SOL -

N.G DERING
CHECK b. VR 301 FAIL OR BADSOL-
DERING
c. VR 301 SETTING FAIL
CN 304 NEAR PART a. CN304 G1 LINE

N.G CONNECTINO PROBLEM
CHECK b. R507 OPEN OR BAD
SOLDERING
c. SG502 SHORT
CRT SOCKET ARROUND a. CRT SOCKET CONNEC-

N.G TION PROBLEM
CHECK b. CRT SOCKET BAD SOL-
DERING

RING

2.9.7 Monitor is too dark when setting brightness volume.
a. If horizontal display size

DISPLAY SIZE CHECK bigger than spec, CRT HV
N.G
down (decrease)

RING
a. If horizontal display size

smaller than spec, +40V
CHECK
a. If no problem on power
(+40V 0.2V), need a
expert repairing
a. VR 103 FAIL
N.G
VR 103 SETTING FAIL
b. VR 103 READJUSTING

2.9.8 Noise appear when external impact or movement.
Checking followings.
?? CN 101 connection fail or bad soldering.
?? CN 101 and all CONNECTOR check.
?? PCB SOLDER side check to find bad soldering and re-soldering with SOLDER IRON
(30W~40W).
?? CHASSIS SCREW check and screw to tight.
?? CRT AQUADAG ground plate (CRT ground copper plate) and CRT backside AQUADAG
part connection check , connect to tight.

SonoAce 6000II Section 3-3. Magneto Optical Drive.
3. MOD
3.1 MCD3130AP : Magneto -Optical Drive Characteristics
MCE/MCF3064AP/MCE3130AP
Magneto-Optical Drive
Fujitsu's MCE3064AP/MCF3064AP series provides capacities of up to 640 mega-bytes on a single disk and
data transfer rates of up to four megabytes per second.
Fujitsu also introduces the MCE3130AP, featuring 1.3GB capacity in 3.5-inch disks. This capacity is
achieved by incorporating magnetically-induced super resolution (MSR) technology, which allows
significantly greater linear and tracking densities.
?? Internal data transfer rates of up to 4.96MB/s (MCE3064AP) and 5.92MB/s (MCE3130AP)

?? Up to 30% faster write performance with O (Direct-Overwrite) media
?? 1.3GB formatted capacity on a single-sided 3.5" disk (MCE3130AP)
?? Full read/write compatibility with conventional ISO standard media (640/540/230/128MB)
High-Performance Rewritable Storage

The MCE3064AP and MCE3130AP optical drives provide high-capacity, high-reliability storage. They are
ideal for backup, archiving, data acquisition, and software distribution. With a native data transfer rate of up
to 4.96MB/s, the MCE3064AP meets the requirements of many of today's demanding applications.
The MCE3130AP provides two transfer rates depending on the MO disk used. With a standard 1.3GB
-1
GIGAMO-standard disk, the maximum transfer rate is 5.92MB/s with 3,214min [RPM] rotational speed. With
-1
a standard ISO disk, the maximum transfer rate is 4.96MB/s with 4,558min [RPM] rotational speed.
Main Features
The MCE/MCF3064AP and MCE3130AP are fully compatible with conventional ISO-standard disks
(640MB/540MB/230MB/128MB). Additionally, the MCE3130AP supports a standard 1.3GB GIGAMO disk,
allowing storage of high volumes of user data. The lightweight carriage enables a high-speed seek time of
-1
23ms, and can even handle high rotational speeds of 4,558min (RPM).
No other storage solution offers as many options to tailor the media selection to the application while
providing such a high level of investment protection. In addition, servo-generated noise has been
greatly reduced; the MCE3130AP is 16dBA quiter than its predecessor, MCD3130AP.

3.2 M CE3130AP SPEC
Specifications
Functional MCE3064AP/MCF3064AP MCE3130AP
Storage capacity 128MB 230MB 540MB 640MB 1.3GB
Sector capacity 512 bytes 2,048 bytes
Standard ISO/IEC ISO/IEC ISO/IEC 15041 -
Interface ATAPI
Drive / 1.37 MB/s 1.65 - 2.95 - 2.94 - 3.46 - 5.92
Drive / 1.09 MB/s 1.3 - 2.1 2.33 - 2.32 -
Interface 16.6MB/s (PIO mode 4 with IORDY),
Recording density 1.04 0.87 0.48 0.285
Track density (m/bit) 1.60 1.39 1.10 0.90
Random 23 ms (typical)
Full stroke 44 ms (typical)
Rotational Speed (RPM) 3,600 min -1 {RPM} (MCF3064AP) / 4.558 3,214 min -1
Average Latency time 8.3 ms (MCF3064AP)/6.6 ms 9.3 ms
Recording code 2 - 7 RLLC 1 - 7 RLLC
Load time MCE/MCF3064AP-7 sec (typical) 12 sec (typical)
Unload time 4 sec (typical)

Unload time 4 sec (typical)
Buffer size 2 MB
Physical Specification
Power Requirement 5VDC5% 1.1A (typical); 2.5A (max.)
Power Random
5.3 W (typical) 5.5 W (typical)
consumptio R/W
n Sleep 0.65 W
Dimensions 25.4 x 101.6 x 150.0 mm
Weight 480 g
Operation 5C - 45C
Ambient
Non-
temperature 0C to 50C
operation
Operation 10% to 85% (non-condensing)

Relative
Non-
humidity 10% to 85% (non-condensing)
operation
Operation 3.92 m/s {0.4 G} (5 -500Hz, sine sweep)
Vibration Non-
9.80 m/s {1.0 G} (5 -500Hz, sine sweep)
operation
Operation 19.61 m/s {2.0 G} (10 ms, half -sine pulse)
Shock Non-
490 m/s {5.0 G} (10ms, half-sine pulse)
resistance operation
Transport 490 m/s {50 G} (10ms, half -sine pulse)
Operation Less than 3,000 m
Alt itude Non-

Less than 12,000 m
operation
Acoustic noise Less than 26dBA
Air flow requirement 0.02m/min or lower, 0.3 m/s or lower
Reliability Specifications
MTBF 120,000 power on hours
MTTR < 30 minutes
Component life 5 years

3.3 JUMPER SETTING
3.3.1 Default setting (slave setting)
Figure 1 shows jumper settings at factory shipping.
3.3.2 Mode setting
1) Setting master device mode

Figure 2 shows the setting for recognizing the master device.
(device 0)
Figure 2. Master device setting
2) Setting slave device mode

Figure 3 shows the setting for recognizing the slave device.
(device 1)
Figure 3. Slave device setting
3) Setting cable select mode

Figure 4 shows the master device/slave device setting when the CSEL signal is
connected to the interface. In the example shown in Figure 5 this setting requires a
special interface connection.
Figure 4. Cable select mode setting
Figure 5 shows a cable select example using a special interface cable.

The example connects CSEL of the master device to the CSEL line (conductor) of the
cable, then ground it so that the device recognizes that it is the master. At this time,
the CSEL conductor of the slave device is removed and cannot be connected to CSEL
of the cable, so that the drive recognizes that it is the slave.
Example 1
Example 2
Figure 5. Cable select example

SonoAce 6000II Section 4-2. Cable Diagrams.
2. CABLE DIARGAMS
Shrink Tube 25pie 7cm Shrink Tube 5pie 2cm

MOTH(JP2) Shrink Tube 8pie 3cm POWER S/W
BROWN 18cm Core / 11cm

BLUE Shrink Tube 16pie 4cm
BLUE BROWN
BROWN 60 cm BLUE BROWN
BLUE
Notice : 25 Tubing A-BAND-SMALL
Name WH-335-PWR -01 Connection MOTH ? POWER SWITCH
MOTH(JP13) KEY(J1)
9 Orange
Sticker
10 Black
12 Black
100 cm 11 Red
8 Black
7 Red
6 Black
MO_PWR
Sticker
5 Orange
4 Black
5 Orange
Sticker
3 Red
6 Black
2 Black
8 Black
1 Orange
7 Red
95 cm
HDD_PWR
15 cm 1 Orange
Sticker
2 Black
4 Black
3 Red
Notice1: Twist Pair 3/10cm

Notice2 : 30pie Tubing A-BAND-SMALL
Notice3 : Core Turn 3
Name WH-335-PWR -02 Connection MOTH ? HDD,MO,KEY

MO_SIG HDD_SIG * Signal Cable

MOTH(JP4)
.
7cm
Shrink Tube Core /
Shrink Tube
10pie 15cm Shrink Tube 18pie 4cm
10pie 3cm
Shrink Tube
10pie 3cm
24 cm 78 cm
Name WH-335-SIG-01 Connection MO ? HDD ? BP
Shrink Tube 30pie 7cm
KEY(JP1) MOTH(JP8)
Sticker
96 cm 4 cm
Notice1 : 30pie Tubing A-BAND-SMALL

Notice2 : Core Turn 1
Name WH-332-SIG-19 Connection BODY CHASSIS ? KEY PANEL
TRACK BALL
(TRACK BALL) KEY(JP3)
Sticker
Sticker
10 cm
Name WH-335-SIG-03 Connection TRACK BALL ? KEY

Shrink Tube 3pie

1.5cm Foot S/W
1 VIOLET
3 2 2 VIOLET
4 1 3 PINK
4 PINK
REAR 18 cm
(JP3)
VCR Video IN
4
16 cm
Sticker
VCR Video OUT
3
14 cm
Echo Printer
5 PINK(4)
5 PINK(3) 2
5 VIOLET(2)
5 VIOLET(1) 12 cm
4 GND(-)
4 SIGNAL(+)
3 GND(-)
3
2
SIGNAL(+) Monitor
GND(-) ShrinkTube 3pie 1cm
2 SIGNAL(+)
1 GND(-) 1
1 SIGNAL(+)
10 cm
Name WH-335-SIG-04 Connection REAR ? ONITOR, RINTER,

IDEO, FOOT S/W
UL1007 18AWG
Twist Pair 7 /20cm Twist Pair 5 /5cm
33cm 11cm
(FAN1)
BLACK
Sticker
RED
MOTH(JP11)
22cm
(FAN2)
Name AY-FAN-335-BACK Connection MOTH ? FAN

UL1007 18AWG
Twist Pair 7 /20cm
20cm 5cm 10cm

(FAN1)
BLACK Twist Pair 5 /5cm

Sticker
RED
MOTH(JP12)
A-BAND-SMALL
10cm
(FAN2)
Name AY-FAN-335-BOTT Connection MOTH ? FAN

SonoAce 6000II Section 5-1. Main Features.
1. SA6000II main features
Premium Image Quality
Fine Digital Beamforming System

Full Digital Signal Processing
128 channel system
Application Specific Image
Multimedia Ultrasound
Image filing(management) : More than 40,000 image storage capability

DICOM(network) : DICOM 3.0 Compatibility
DICOM Print, Save, Send
Connection to PC image management software support for DICOM display.
Remote Service
ASIC technology
Increase system reliability

Decrease complexity
Power Full Digital Signal Processing
ASIC lists
Mid signal processing ASIC
Beamforming ASIC
Wide Band & High Sensitivity Transducers
High resolution & High sensitivity image

Wide Band Image
High Density probe
User interface
Easy to learn : In tuitive Operation

Reduce scanning time
Variety application program :OB/GYN, Urology, Basic Caliper

SonoAce 6000II Section 5-2. Technical Specification.
2. Technical Specifications
Dimensions
Height : 1011 mm (without monitor), 1309 mm (with monitor)

Width : 508 mm
Depth : 610 mm
Weight : 70Kg
Power
Input voltage : 100 ~ 120Vac,

200 ~ 240Vac,
Power
1) 100-120VAC 50/60Hz: Max 215.5(W), Max 317(VA)
2) 200-240VAC 50/60Hz: Max 216.1(W), Max 380(VA)
Beamformer
Transmitter
Frequency Range : Wide band system, 1 to 30MHz, depend on probes
Transmit channel : 64 channels
Sound Field parameter : limited by FDA 510K
Simultaneous selective 4 transmit focal points (max. 8 points)
Receiver
Frequency Range : Wide band & Low noise System
Focusing : Fine Digital Beamforming
Sampling Rate : 61.6MHz
Receiver channel : 64 channels
Beamformer ASIC
Dynamic Range : 110 dB
Dynamic Aperture & Apodization
Scan Converter
Memory size : 512 x 512 x 8

Gray scale resolution : 256 levels
Depth range : min. 2cm ~ max. 24cm (depend on probe)

Apex control : Up / Down
Direction control : Left / Right
Sweep Speed contr ol : 3 steps
Write zoom ( Maximum depth : 3CM)
Loop format change (Top/Bottom, Left/Right)
Cine & Loop Memory
Cine memory : 256 Frames (fast mode)

Loop memory : 4096 Lines
Auto save
Auto run capability : same as acquisition time
Display Cine Frame
Viewing Monitor
12 inch Non Flickering B/W Monitor
Number of Probe Connections
2 ports , Auto freeze

Probe auto recognize
Languages
English, German, Spanish, Italian, French
DATA entry
Hospital name
Patient ID
Patient DATA
Text Annotation
Body Marker
User Interface
Track Ball
Standard Alpha-numeric keyboard
6 TGC slide Volumes

Menu-driven operation
Fousing Velocity Change
1580 m/sec
1540 m/sec
1460 m/sec
1500 m/sec
Display Modes
2D mode : Single(2D), Dual(2D/2D)

M mode : 2D/M,
Bidirectional Harmonic Image
Caliper & measurements
Caliper
B mode : Distance, Angle, Area, Ellipse, Circumference, Volume
Measurements (Calculations)
OB measures
Early Gestation : CRL, GS, YS
Fetal Biometry : CRL, GS, YS, BPD, OFD, HC, APD, TAD, AC, FTA,
FL, TTD, APTD
Fetal Cranium : Cerebellum, OOD, IOD
Fetal Long Bones : HUM, ULNA, TIB, RAD, FIB, CLAV, LV
AFI
Umbilical Artery
Mid Cerebral Artery
Observations and Comments
Obstetric Biometry table list
BPD : HADLOCK, HANSMANN, JEANTY, KOREAN, MERZ,
SABBAGHA, TOKYO, No table, User
HC : HADLOCK, HANSMANN, KOREAN, MERZ, No table, User
AC : HADLOCK, HANSMANN, MERZ, No table, User
TAD : HANSMANN, No table, User
FL : HADLOCK, HANSMANN, HOHLER, JEANTY, Korean

MERZ, TOKYO, No table, User
CRL : HADLOCK, HANSMANN, KOREAN, NELSON, ROBINSON,
TOKYO, No table, User
GS : HANSMANN, HELLMAN, KOREAN, NYBURG, TOKYO
No table, User
APTD : HADLOCK, No table, User
TTD : HADLOCK, No table, User
Orbital : MAYDEN, No table, User
OFD : HANSMANN, No table, User
Cereberium : HILL, No table, User
APD : HANSMANN, No table, User
Humerus : JEANTY, No table, User
Tibia : JEANTY, No table, User
Ulna : JEANTY, No table, User
F.W. : Tokyo1, OSAKA, Mertz, Shepard, HADLOCK, HOCDLOCK1~4
HASMANN, TOKYO2
Trend function :Display and Print trend graph with independent growth table and trend data
table
Report pages : print, Save to Sonoview II Lite, Serial transfer
Cardiology measures
M mode study : Left ventricle, Ao/LA, MV,
Report function :
Gynecology Measures
Menu : Uterus, Rt. Ovary, Lt. Ovary, Rt. Follicles, Lt. Follicles
Rt. Kidney, Lt. Kidney, Rt. Ovarian A., Lt. Ovarian A.
Report function
Urology Measures
Residual Pre/Post, PSA-Density Vol, Endorectal Vol
Report Function : Print, and save to floppy diskette

2D Specifications
Scan Mode : Electronic Linear/Curved Linear

Image mode : 2D, 2D/2D, 2D/M,
Bi directional Harmonic Image
Frame average : 4 steps (Off, Low, Middle, High)
Edge Enhancement : 0 ~ 9 step 1
Dynamic Range control : 50 dB ~ 110 dB, step 1 dB
Apex control : Up / Down
Wide, Normal, Narrow1, Narrow2, Narrow3, Narrow4
Real Zooming
Probe connection :2 ports
Gray Scale : 256 levels
2D Post curves : 7 types
M mode Specifications
Depth : same as B mode depth

M Post curves : same as B post curves
Sweep speed : 120, 180, 240 Hz
Peripheral Signals
VHS (in/out) : BNC

NTSC/PAL
1.0 V pp / 75 ohms / unbalanced
Serial port
Parallel port
LAN port
USB(Reserved for future use)
B/W printer remote control
Foot switch
Environment
Storage Range of Temperature and humidity : 5?C ~40?C, 5~9 % RH

Usable Range of Temperature and humidity : 10?C~35?C, 30~85%RH
The most optimal recommended range of temperature and humidity:17?C ~ 23?C, 40~60RH

Multimedia
Operating system : Linux
Image management system
Features
2D image save, review, back up

- More than 40,000 image storage capability to built-in HDD
DICOM send, print
Basic caliper : distance, ellipse
Export images to BMP or JPEG format
Search, delete, preview, sort exam
E mail send
Image & report print
Report save
PC PART
Main CPU : Strong ARM

MOD : 1.3 Gbytes (optional)
HDD : 20 Gbytes
Network
Networking by DICOM 3.0 Connectivity

DICOM Storage, Print, Send
Integration with n -SONO Ultrasound PACS Solution
Remote Diagnostics and Service
Probe Lists
C3-7ED
EC4-9ES
C2-4ES
L5-9ER
L5-9EC
HL5-9ED (TBD)
HC2-5ED(TBD)

3D Package
3D Scan method
Free Hand 3D
Photo mode
3D functions
Rotate
Magic Cut
Low/High Threshold Adjusting
Surface/Volume Rendering Mode Adjusting

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SonoAce 6000II Contents.

Chapter1. BASIC INFORMATION

Chapter 2. DESCRIPTION OF SYSTEM

Service Manual Published by Customer Service Department

Upon arrival, inventory the shipment with the carriers driver.

During formal inspection, you should :

Please, unpack the system like following draw.

1.3 Basic features

?? 12 inch B/W monitor and main unit equipped with keyboard

?? Users Guide (1)

Item Description Quantity Location

Table) Part List

Service Manual Published by Customer Service Department

1.4 Option features

Model Name Specification Application

Model Name Specification Application

?? Echo Printer : Sony UP890, MISTUBISH P91W Video Printer

Service Manual Published by Customer Service Department

Service Manual Published by Customer Service Department

2.2 SAFETY PRECAUTIONS

2.2.1 Biological safety

ALARA Education Program

Service Manual Published by Customer Service Department

Service Manual Published by Customer Service Department

2.2.2 Electronic Safety

Detail 2. SA6000II Main Console Safety Ground

Service Manual Published by Customer Service Department

Service Manual Published by Customer Service Department

2.2.3 Mechanical Safety

?? Moving the system

Isolated patient connection (Type BF applied part).

I and O on power switch represent ON and OFF, respectively.

Identifies equipotential ground.

Indicates dangerous voltage over 1000 VAC or over 1500 VDC.

Service Manual Published by Customer Service Department

Output port fo r VGA or Parallel port

Input/Output(I/O) port used for modem or RS232C port.

Left and right audio input.

Left and right audio input

Print remote output

Connection for foot switch

Protection against the effects of immersion.

Protection against dripping water.

Connection for probes

Service Manual Published by Customer Service Department

Disconnect the probe from the system.

Service Manual Published by Customer Service Department

Solutions Country Type Active ingredient FDA 510(k)

If a pre-mixed solution is used, be sure to observe the solution expiration date.

Using a n o n -recommended disinfection solution, incorrect solution strength, or

Service Manual Published by Customer Service Department

Service Manual Published by Customer Service Department

2.3.2 BIOPSY GUIDE ADAPTOR AND NEEDLE GUIDE

To clean and sterilize stainless steel biopsy guide

Rinse with water to remove remaining particulates.

To clean and sterilize stainless plastic biopsy guide

Rinse with water to remove remaining particulates.

Service Manual Published by Customer Service Department

Sterilize the components by using a chemically compatible cold-sterilization solution. A

2.3.3 SYSTEM SURFACES

CAUTION Use only recommended disinfectants on system surfaces.

Service Manual Published by Customer Service Department