VBEAM Theory of Operation

SYSTEM OVERVIEW

The VBEAM system is a flashlamp excited pulsed dye laser which delivers energy at a
wavelength of 595 nm and a pulse width between 0.45 ms to 40 ms. This laser system has
the Dynamic Cooling Device (DCD) built into it which provides a short spray burst of cryogen
prior to firing the laser pulse. The laser head is designed to deliver a minimum of 100,000
pulses. A unique MegaDye cartridge stores enough dye to provide 100,000 pulses to the
customer before a replacement cartridge is required. Laser energy is delivered through a
handpiece and optical fiber which are both user replaceable parts. The handpiece contains
the cryogen spray valve, bubble sensor, fiber delivery system, and fingerswitch. Four spot
sizes are currently available. They are 5mm, 7mm, 10mm, and an elliptical spot of 3mm x
10mm. Single laser pulses can be delivered by pressing the trigger switch and then releasing,
or if the trigger switch is held, multiple pulses will be emitted.The nominal repetition rate of the
laser is up to 1.5 Hz. At higher energy density settings and after normal head degradation, the
repetition rate will be less than 1.5 Hz.

The VBEAM operates from an input line voltage of 185 VAC to 260 VAC at 50/60 Hz. There
are no adjustments required on the laser to operate over this voltage range. The VBEAM
system does not contain an isolation transformer. All of the components that are directly
connected to the AC input were chosen for low line leakage current to ensure the systems
meets the leakage current requirements of IEC-601 and UL2601. Maximum current drawn by
the laser system is 19 A at 230 VAC input. At this power consumption level, the thermal load
from the laser system is 15,700 Btu/hr. Under nominal consumption levels, the thermal load
in the Ready state will be 9231 Btu/hr. When the laser is in Standby state (non-pulsing), the
thermal load decreases to 1991 Btu/hr.

The VBEAM system is fully air cooled. All fans used are operated from 24 VDC so their
performance is constant for low or high AC input line voltage and for 50 or 60 Hz power
sources. There are a total of six fans in the system. One is built into the high voltage power
supply. Two fans are mounted to the front of the frame and cool the modulator area. One fan
is in the AC Section to cool the DCD canister. Two fans are mounted to the water cooled
heat exchanger and are the only fans that are switched on and off by the firmware. All other
fans turn on as soon as the system is powered on.

The deionized water system is maintained at 60C (140F) to provide optimum performance
from the laser head. The dye solution is also maintained at 60C (140F) through a liquid-to-
liquid heat exchanger. A 1000 watt heater and air-cooled heat exchanger regulate the water
at its proper temperature which in turn heat the dye solution to its proper temperature. An
initial warm-up time of approximately 20 minutes (from a cold start) is required for the
deionized water and dye solution to be at the correct operating temperature. This time varies
depending on the ambient temperature in the room and the line voltage. (At low line voltage
the heater's output power is less than 1000 watts). The warm-up time of the cryogen canister
is about 25 minutes. Thus the system warm-up time is typically 20 to 25 minutes depending
on whether the DCD is on or off.

A wavelength monitor assembly is included to monitor the wavelength in the system. When
the wavelength decreases, the firmware turns on the inject pump which adds triplet quencher

8501-00-1550 Revision C Candela PROPRIETARY Page1 of 22

VBEAM Theory of Operation

(COT) to the dye reservoir. The added COT displaces some of the dye from the dye cartridge
which increases the absorbance to its proper level to correct the wavelength.

An MC68HC812 microprocessor based system controller is used to monitor and direct all
system functions. A diagnostic connector located at the bottom center of the front panel will
provide a communications port for an external computer. It gives the service technician
access to system status and control functions for repair and maintenance. A DB9 male to
female communications cable can be used when connecting the diagnostic port to the
external computer.

For purposes of technical review, the laser can be divided into three major subsections. They
are: 1) Optics, 2) Fluids, and 3) Electronics. Each section will be addressed in this theory of
operation. The system firmware will not be discussed here unless it is required to explain the
functioning of the laser. For detailed information on the system firmware see the following
documents: 1) Firmware Requirements Specification (1010-06-1000), 2) Firmware Design
Specification (1010-01-1000), and 3) VBEAM Flowcharts (1010-02-1000).

OPTICAL SYSTEM

A block diagram of the optical system is shown in Figure 1. The optical components located
inside the laser system are the laser rail and the calibration port. The laser rail contains the
laser head, beam splitter assembly, beam shutter assembly and fiber receptacle assembly.
The delivery system, consisting of the optical fiber and handpiece are connected into the front
of the laser.

Laser Head

The laser head contains one flashlamp (5 mm bore, 400 torr), a dye cell, water jacket and two
mirrors. The max reflector, mounted at the rear of the laser head, is ideally a 100% mirror.
Laser light is reflected back and forth through the laser cavity between the max reflector and
the output coupler. The output coupler is a partial reflector that allows approximately 30% of
the laser energy to pass through it.

Operation of the laser head at higher energy output levels could reduce the lifetime of the
head. Therefore, maximum delivered energy and fluences are determined by a set maximum
head energy of 10J and realistic delivery system between 65 % to 85% transmission.

A metal cover is mounted over the laser rail to protect the optics from dust contamination. It
also protects the service technician from the high voltages present in the vicinity of the laser
head and from optical hazards. Unless required for trouble-shooting, the laser should not be
pulsed with the laser cover removed. If the cover is removed, it should be replaced as soon as
possible and the laser should never be left with the laser cover off.

8501-00-1550 Revision C Candela PROPRIETARY Page 2 of 22

VBEAM Theory of Operation

Figure 1 - Optical Block Diagram

The laser head is simmered when entering Ready. The simmer start pulse applies a high
voltage pulse (peak amplitude 10 KV) to the laser cavity. When the laser is in Ready state,
never touch the laser head or rest test equipment on it. It is only a triggerswitch away from
being pulsed. Also, whenever the laser system is in Ready, but not simmering there is 1300
VDC applied to two terminals of the flashlamp. Therefore, use extreme caution when
servicing the laser head.

8501-00-1550 Revision C Candela PROPRIETARY Page 3 of 22

VBEAM Theory of Operation

Beam Shutter

The beam shutter allows laser light to pass on to the fiber coupling lenses when it is
energized. Normally it is not energized so it blocks any laser light exiting the partial reflector
end of the laser head. A ceramic block is mounted to the surface of the beam shutter blade so
that it is in line with the laser beam when the shutter is in the blocking position. The ceramic
block reflects most of the laser energy that hits it and absorbs the rest. The reflected laser
light is dispersed in a divergent pattern. The beam shutter normally does not get hit with laser
energy. As a result, it is not designed to withstand repeated high energy pulses from the laser
head. The beam shutter is used solely as a safety device to prevent laser energy from exiting
the laser system under fault conditions.

The beam shutter is controlled by hardware and firmware. It cannot be opened unless the
triggerswitch is depressed and the firmware command is present. An optical switch on the
shutter assembly is used to sense the position of the shutter. The sensor is positioned so that
it detects infrared light from the LED side of the optical switch when the shutter is in the laser
beam path. When the shutter is energized and moves out of the beam path, the infrared light
is blocked by the back end of the shutter blade. The firmware will only allow the laser system
to enter the Ready state if the beam shutter is blocking the laser beam path in Standby state.

Fiber Receptacle

The fiber receptacle assembly contains two lenses that are used to couple the laser beam
onto the end of the fiber. The lenses are designed and located so that the proximal tip of the
fiber is at the image plane of the output end of the dye cell. This gives a uniform beam profile
on the fiber and causes the laser beam diameter to be 0.8mm diameter resulting in maximum
coupling efficiency and lifetime. The lenses are held in place with o-rings that help keep them
centered in the beam path, but fine alignment is still necessary. For new receptacles, this
alignment is done on a fixture at the factory. The lenses are designed to be field replaceable
and alignable. If lens replacement is performed, it is important to note the orientation of the
existing lenses so that the new lenses are installed properly. The proximal end of the fiber is
inserted into the fiber receptacle and locked into position with a threaded fitting on the fiber
assembly.

The beamsplitter assembly, beam shutter assembly, and fiber receptacle are all precisely
located on the rail, but an optical alignment is still required for the laser head and receptacle.

Beamsplitter and Wavelength Detector

The beamsplitter assembly is between the laser head and beam shutter assembly. This
assembly splits off 2 % from the main beam into two photodiodes - one for the head detector
and one for the wavelength monitoring. The head detector monitors the energy being
delivered to the patient and will send signals to the CPU I/O PCB; firmware will then
determine if there is a fault. The Wavelength detector monitors the wavelength being
delivered to the patient and will send a signal to the CPU I/O PCB; firmware will then
determine if there is a fault.

8501-00-1550 Revision C Candela PROPRIETARY Page 4 of 22

VBEAM Theory of Operation

Calport

The VBEAM Calport measures the energy out the handpiece. The Calport contains two
microswitches that sense when the handpiece is fully inserted in the Calport. A ball plunger in
the bottom of the Calport provides pressure against the handpiece to prevent it from falling
out after it is inserted.

Laser energy from the handpiece is directed through ceramic disks, then an acetal cylinder
and onto a photodiode sensor. The ceramic disks and acetal cylinder provide a scattering
volume that both attenuates and scatters the light. The high level of scattering nearly
eliminates Calport sensitivity to misalignment of the spot at the input face. The photodiode
sensor is mounted on the Calport Energy PCB. The photodiode circuit on the Calport Energy
PCB converts the optical sample of the laser beam energy to a current pulse. This current
pulse is sent to the Calport energy detector circuit on the CPU I/O PCB. There, it is processed
and calibrated before being sent on to the firmware to measure the actual energy into the
Calport.

The VBEAM operating fluence range is currently 3 - 25 J/cm2; depending on the spot size.
There are four difference spot sizes that correspond to specific fluence levels. The conversion
factors used to convert energy to fluence are shown in
Table 1.

Spot Size Conversion Factor

5 mm 5.09 x External Meter Energy

7 mm 2.60 x External Meter Energy

10 mm 1.27 x External Meter Energy

3X10 mm 4.24 x External Meter Energy

Table 1. Energy to Fluence Conversion Factors

The available energy density settings for each spot size and the external energy meter value
associated with that spot size are shown in Tables 2A and 2B.

8501-00-1550 Revision C Candela PROPRIETARY Page 5 of 22

VBEAM Theory of Operation

TABLE 2A: Spot Size Fluence Ranges (Pulse width = 1.5ms 40ms)
7mm Spot Size Tx = 80% 3x10mm Spot Size Tx = 80% 10mm Spot Size Tx = 80% 5mm Spot Size Tx = 40%
Fluence Delivered Head Fluence Delivered Head Fluence Delivered Head Fluence Delivered Head
Energy Energy Energy Energy Energy Energy Energy Energy
(J) (J) (J) (J) (J) (J) (J) (J)
4.0 1.54 1.92 7.0 1.65 2.06 3.0 2.36 2.95 4.0 0.79 1.96
4.5 1.73 2.16 7.5 1.77 2.21 3.5 2.75 3.44 4.5 0.88 2.2
5.0 1.92 2.41 8.0 1.88 2.36 4.0 3.14 3.93 5.0 0.98 2.46
5.5 2.12 2.65 8.5 2.00 2.50 4.5 3.53 4.42 5.5 1.08 2.7
6.0 2.31 2.89 9.0 2.12 2.65 5.0 3.93 4.91 6.0 1.18 2.94
6.5 2.50 3.13 9.5 2.24 2.80 5.5 4.32 5.40 6.5 1.28 3.2
7.0 2.69 3.37 10.0 2.36 2.95 6.0 4.71 5.89 7.0 1.37 3.44
7.5 2.89 3.61 10.5 2.47 3.09 6.5 5.11 6.38 7.5 1.47 3.68
8.0 3.08 3.85 11.0 2.59 3.24 7.0 5.50 6.87 8.0 1.57 3.92
8.5 3.27 4.09 11.5 2.71 3.39 7.5 5.89 7.36 8.5 1.67 4.18
9.0 3.46 4.33 12.0 2.83 3.53 9.0 1.77 4.42
9.5 3.66 4.57 12.5 2.95 3.68 9.5 1.87 4.66
10.0 3.85 4.81 13.0 3.06 3.83 10.0 1.96 4.9
10.5 4.04 5.05 13.5 3.18 3.98 10.5 2.06 5.16
11.0 4.23 5.29 14.0 3.30 4.12 11.0 2.16 5.4
11.5 4.43 5.53 14.5 3.42 4.27 11.5 2.26 5.64
12.0 4.62 5.77 15.0 3.53 4.42 12.0 2.36 5.9
12.5 4.81 6.01 15.5 3.65 4.57 12.5 2.45 6.14
13.0 5.00 6.25 16.0 3.77 4.71 13.0 2.55 6.38
13.5 5.20 6.49 16.5 3.89 4.86 13.5 2.65 6.62
14.0 5.39 6.73 17.0 4.01 5.01 14.0 2.75 6.88
14.5 5.58 6.98 17.5 4.12 5.15 14.5 2.85 7.12
15.0 5.77 7.22 18.0 4.24 5.30 15.0 2.95 7.36
18.5 4.36 5.45
19.0 4.48 5.60
19.5 4.59 5.74
20.0 4.71 5.89
20.5 4.83 6.04
21.0 4.95 6.19
21.5 5.07 6.33
22.0 5.18 6.48
22.5 5.30 6.63
23.0 5.42 6.77
23.5 5.54 6.92
24.0 5.65 7.07
24.5 5.77 7.22
25.0 5.89 7.36

8501-00-1550 Revision C Candela PROPRIETARY Page 6 of 22

VBEAM Theory of Operation

TABLE 2B: Spot Size Fluence Ranges (Pulse width = 0.45ms)

7mm Spot Size Tx = 80% 3x10mm Spot Size Tx = 80% 10mm Spot Size Tx = 80% 5mm Spot Size Tx = 40%
Fluence Delivered Head Fluence Delivered Head Fluence Delivered Head Fluence Delivered Head
Energy Energy Energy Energy Energy Energy Energy Energy
(J) (J) (J) (J) (J) (J) (J) (J)
4.0 1.54 1.92 7.0 1.65 2.06 3.0 2.36 2.95 4.0 0.79 1.96
4.5 1.73 2.16 7.5 1.77 2.21 3.5 2.75 3.44 4.5 0.88 2.2
5.0 1.92 2.41 8.0 1.88 2.36 4.0 3.14 3.93 5.0 0.98 2.46
5.5 2.12 2.65 8.5 2.00 2.50
6.0 2.31 2.89 9.0 2.12 2.65
6.5 2.50 3.13 9.5 2.24 2.80
7.0 2.69 3.37 10.0 2.36 2.95
7.5 2.89 3.61 10.5 2.47 3.09
8.0 3.08 3.85 11.0 2.59 3.24
11.5 2.71 3.39
12.0 2.83 3.53
12.5 2.95 3.68
13.0 3.06 3.83

Delivery System

The delivery system consists of two assemblies. The main part is the handpiece assembly
that contains the cryogen valve, bubble sensor, trigger switches, and the electrical cable and
cryogen tubing that connects to the front of the laser system. The fiber assembly with HP spot
size slider slides into the handpiece and is easily removable so that the customer can change
HP spot size sliders. Each HP spot size slider has an associated resistor mounted in it that is
connected to the handpiece cable. This allows the firmware to determine which HP spot size
slider is attached.

The VBEAM fiber is a 1.0 mm diameter fiber. A fiber scrambler is attached several inches
from the connector at the proximal end of the fiber to homogenize the beam profile. The
proximal end connector has a screw locking mechanism that slides into the fiber receptacle
on the front of the laser and secures it in place. The distal end of the fiber connects to the HP
spot sliders. A ball plunger in the handpiece and a slot in the HP spot size slider assembly
are used to lock the slider assembly in place. Nominal fiber transmission is 85%.

A distance gauge for each of the spot sizes is attached to the end of the handpiece and held
in place by an o-ring. The distance gauge serves as an aiming guide and also keeps the
cryogen spray confined to an area set by the size of the white circular plastic ring that is
attached at the end of the distance gauge. The circular ring is 2 mm larger in diameter than
the laser spot size.

The handpiece body can be disassembled by removing the three screws on the side of the
handpiece. All the internal parts can be serviced if required. The electrical cable connects into
the Handpiece PCB with an eight pin connector. The Handpiece PCB contains the optical
sensor used for the bubble detector, the two independent trigger switches, the switch cover
and mounting bracket, and the connector for the cryogen spray valve. The Handpiece PCB is

8501-00-1550 Revision C Candela PROPRIETARY Page 7 of 22

VBEAM Theory of Operation

press fit into the handpiece body and held into position when the two halves are screwed
together. The same method is used to hold the cryogen valve into position. The flat portions
of the valve head must be lined up against the inside of handpiece body sides in order for the
two halves to be closed properly. Also, the small piece of tubing protruding from the end of
the cryogen valve can be lined up with four set screws for correct cryogen aiming.

Whenever the handpiece is taken apart, several items must be re-tested. These include
checking that the valve functions properly, that the cryogen aiming is accurate, and that the
calibration of the bubble sensor is correct. The cryogen aiming should be tested with a 10 mm
distance gauge and the spray duration set at 20 ms. The spray can be tested by using the
purge button so lasing is not necessary. Spraying onto a black piece of paper generally gives
the most visible spray pattern. The cryogen spray should fill the diameter of the distance
gauge, be centered in the distance gauge, and it should not be spraying onto the edge of the
distance gauge ring. If the bubble sensor needs to be adjusted it can be done without opening
the handpiece. The bubble sensor adjustment potentiometer can be accessed through the
small hole in the side of the handpiece.

Whenever maintenance or repair of the laser system is required be sure to adhere to the
following safety statements:

WARNING

During servicing of the laser system use only safety eyewear known to have an
optical density of 5.9 or more at 591 - 597 nm. Safety eyewear designed for use
with other laser systems may not provide adequate protection.

During servicing of the laser head, the service technician should never contact
the laser head cavity while the system is on because it could be at voltages as
high as 10,000 volts.

8501-00-1550 Revision C Candela PROPRIETARY Page 8 of 22

VBEAM Theory of Operation

FLUID SYSTEM

The VBEAM contains two separate fluid systems; a deionized water system and dye solution system
that regulates the temperature of the laser head at 60C (140F). The total water capacity of this
system is approximately 1.8 liters and 1.4 liters for the dye solution without the dye cartridge volume.
A block diagram detailing the fluid system is shown in Figure 2.

Figure 2 - Fluid Block Diagram

8501-00-1550 Revision C Candela PROPRIETARY Page 9 of 22

VBEAM Theory of Operation

For the DI fluid system a centrifugal pump is used to circulate the deionized water in the
system. The pump is mounted directly under the water reservoir. Typical pump output
pressure generated is 15.8 PSI (measured at the pump outlet) with a nominal flow rate of 1.1
GPM. The water flow and pressure are not adjustable.

The pump output flows up to the laser head on the upper chassis. The tubing connection
between the pump and the laser head has several components in it. First a pressure switch is
located just after the DI pump to detect water pressure. If there is not enough pressure out of
the pump, the pressure switch will activate the software to display a fault. The DI fluid system
may be low on water or has a leak. The laser should be turned off at this point, until a service
technician can look at the laser. The DI pump is directly wired to the mains; therefore after
this fault is detected, the pump is still on and can damage the DI pump if there is no water in
the system.

Water then flows from the pressure switch to the laser head and enters a parallel path about
half way up to the head. The parallel path consists of a DI cartridge and a bypass tube. Most
of the water travels through the bypass tube. Approximately 5% of the flow is through the DI
cartridge. The cartridge contains a deionizing section to maintain the purity of the water (high
resistivity).

The laser head output is connected to the DI heat exchanger. The heat exchanger is cooled
with two 24 VDC fans which are controlled by the firmware. The fans are mounted on the
heat exchanger and pulls air up from the bottom of the laser fluid compartment. Exhaust air
exits the fluid compartment out the rear of the laser chassis. A foam filter in the bottom of the
fluid compartment minimizes the amount of dust picked up by the incoming air. The foam filter
must be changed at regular intervals to prevent restriction of the cooling air.

The output of the heat exchanger is connected to the heater manifold. The heater manifold
contains a single 1000 watt heater, the DI temperature sensor, and a thermal
overtemperature switch. If an overtemperature problem occurs that cannot be corrected by
the firmware or hardware, then the thermal overtemperature (OT) switch will open which
removes 24 VDC power from the main relay thus turning off the entire laser system. The OT
switch is self resetting. After it opens, it typically takes from 10 to 20 minutes for it to reset
itself. The heater is disabled by the firmware when the triggerswitch is depressed. This is
done to limit the AC input current drawn by the system during pulsing of the laser. The heater
is not required when pulsing since the majority of the pulsed energy goes into the DI water in
the laser head. The temperature sensor is a solid state device that is used in conjunction with
circuits on the CPU I/O PCB which allows the firmware to monitor the temperature of the
water. The temperature sensor operates with very low current levels (340uA). If the
connection between the temperature sensor and the system wiring harness becomes wet, the
calibration of the temperature circuit will be affected. The drain valve is located after the
heater manifold and is manually operated to remove water from the system. It is located at
the lowest point in the DI fluid system.

The output from the heater manifold flows through a liquid to liquid heat exchanger, then to
the DI reservoir; which completes the DI loop. This liquid to liquid exchanger will pass the
heat from the heated DI water to the dye solution. The dye solution will heat to the same
temperature as the DI water 60C (140F). The dye solution will track the DI water system.

The combination of the 1000 watt heater in the heater manifold and the heat exchanger fans
work together to maintain the water in the laser system at 60C (140F). The temperature is

8501-00-1550 Revision C Candela PROPRIETARY Page 10 of 22

VBEAM Theory of Operation

regulated to 2C to ensure good efficiency and stability and to minimize variations from
different laser heads. For best accuracy, the temperature sense circuit should only be
calibrated with both the heater and heat exchanger fans off. This ensures that the water
temperature measured by the external sensor in the reservoir is at the same temperature as
the sensor in the heater manifold.

The firmware uses two set points to control the heater and fans. The heater is turned on
whenever the water temperature is at 59.5C or less. The heat exchanger fans are turned on
whenever the water temperature is at 60.5C or greater. There is some undershoot and
overshoot in the water temperature at each of these set points. The firmware over
temperature fault is set for 66C. The laser will not go into the Ready state if this fault is
present. Normally, the firmware should declare an over temperature fault before the over-
temperature thermostat turns off the laser. If this does not happen, then most likely the
temperature sensor is bad or miscalibrated. The firmware will also declare an over-
temperature fault if the temperature read is less than 5C. This is because if the temperature
is less than 5C, the firmware assumes the temperature sensor has failed or become open
circuited. Also, if the temperature drops below 55.5C while in the Ready state, a fault will be
displayed.

The second fluid loop is the dye fluid system. The dye solution system consists of a 50/50
mixture of ethylene glycol and deionized water. This solution flows from a dye pump that is a
positive displacement pump continuously circulating the dye at 1.5 GPM. An adjustment
screw on the pump head allows for proper set up of the flow rate. At 1.5 GPM a typical
system will produce 36 PSI at the pump head. The output of the pump is sent to the Dye
cartridge, particle (bubble) filter, the laser head, the liquid-to-liquid heat exchanger then into
the dye reservoir; which completes the dye loop.

The COT inject pump is used to transfer COT from the COT bottle into the dye reservoir.
COT is required to maintain the correct dye absorbance, affecting the wavelength. The COT
concentration slowly decreases in a system, mostly as a function of time or usage due to
evaporation. Wavelength will be checked at the end of calibration. If the wavelength is low
but within specifications, sufficient COT will be added to bring the laser back to its target
wavelength. If the wavelength is found to be below specifications, an extended COT addition
and delay cycle will occur. During this time a flashing hourglass symbol will be displayed on
the calibration message. At this time sufficient COT will be added to restore proper
wavelength. The addition of COT takes place at a rate of 11.3 milliliters per nanometer. This
will be followed by a mandatory 3 minute mixing delay period. At the end of the mixing delay,
the laser will automatically repeat the calibration process. If the wavelength was not restored
after the extended COT cycle, a fault will be indicated. If the initial wavelength check shows
that the wavelength is significantly out of range, then a fault will be indicated and no COT will
be added to the system. COT is not user replaceable. Field Service must replace the COT
bottle.

The dye and water pumps are directly wired to the mains in the laser system so as soon as
the laser is turned on, the pumps will turn on. Again, damage to the DI pump can occur if it is
turned on with no water. A pressure switch is located just after the DI water pump to
determine when there is insufficient water to operate the laser.

8501-00-1550 Revision C Candela PROPRIETARY Page 11 of 22

VBEAM Theory of Operation

ELECTRICAL SYSTEM

Control System

A block diagram of the control system is shown in Figure 3. All the CPU circuits and
Input/Output interface circuits are located on the CPU I/O PCB that is the heart of the control
system. This PC board is located behind the front panel of the laser system. The board is
easily accessible by removing the front panel of the laser system. The CPU I/O PCB
interfaces with all the other PC boards in the laser system except the 24 VDC Power Supply
PCB. The user interface is accomplished with a touch screen display that allows the customer
to control the laser functions such as energy level, cryogen spray time, laser state, etc.
Feedback to the user is provided by a VGA display which provides status messages and
laser system operating parameters.

A brief description of the main circuits on the CPU I/O PCB follows. The SCR and Modulator
PCB will be discussed in the section on the Modulator.

CPU I/O PCB (Schematic 7111-80-2280)

The CPU I/O PCB functions as the brain of the laser system. It contains the EPROM that
stores the control system firmware for the VBEAM and an MC68HC812 microprocessor that
directs all commands for proper operation of the laser. It directly interfaces with the touch
screen and VGA display. An 8-bit microprocessor bus is used on the board to control and
monitor all laser system functions.

A single serial RS-232 port exists on the board so that a maintenance terminal or modem can
be connected to the laser. The port is located on the bottom center in the front of the frame.

The CPU I/O PCB also provides distribution of all the 24-volt power used in the laser except
for the modulator section. Connector J9 receives the 24 volts generated by the HVPS. It is
partitioned into three separate groups of 24 volts that are each fused either by a 3.15 A or a
5.0 A fuse. Fusing is required because the HVPS will source between 8 and 9 amps of
current if the 24 volts is shorted to ground. Fusing limits the amount of fault current a failed
component would be subjected too. It also allows larger gauge wiring (smaller diameter) to be
used on low current signals.

8501-00-1550 Revision C Candela PROPRIETARY Page 12 of 22

VBEAM Theory of Operation

Figure 3 - Control System Block Diagram

The CPU I/O PCB provides isolation and signal conditioning for the entire VBEAM systems
analog and digital signals. All digital output commands are buffered by U29, U36 and U44
which are driver ICs (integrated circuits).

Almost all the signals that interface with the CPU circuits are electrically isolated on different
grounds to prevent noise problems with the processor. The main exception to this is the
signals to and from the touch screen and VGA display. These are logic level signals that
are connected to the front panel and the display with short cables. The digital inputs and
outputs are all optically isolated using opto isolator ICs. The analog signals to and from the
high voltage power supply (HVPS) are isolated using op amp isolation ICs (U23 and U27 on
schematic page 5) which have a 1500 VAC isolation rating.

8501-00-1550 Revision C Candela PROPRIETARY Page 13 of 22

VBEAM Theory of Operation

To accomplish the signal isolation requirements, there are four isolated ground returns
present on this board. The various returns and their functions are listed below in Table 3.

Return Associated Power Supply Associated Circuits

D +5 VDC CPU and logic circuits

(+5 V/ 15 V DC/DC PS)

A 15 VDC Analog circuits

(+5 V/ 15 V DC/DC PS) (temp circuits, energy circuits)

B +24 VDC Digital I/O and Bubble Sense circuits

C Isolated 15 VDC ( 15VDC_HV) HVPS interface circuits

Table 3 - CPU I/O PCB Returns

The following CPU I/O circuits will be reviewed here: 1) Beam Shutter Circuit; 2) Trigger
Circuit; 3) Bubble Sense Circuit; 4) DAC and ADC Circuits; 5) High Voltage Power Supply
Interface Circuits; 6) Calport Energy Detector Circuit; 7) DI Temperature Circuit; and 8) DCD
Pressure Circuit. Due to their simplicity, the basic on/off I/O circuits will not be discussed.

1. Beam Shutter Circuit (schematic page 3)

The beam shutter can only be opened if both the firmware commands it and either the
fingerswitch or footswitch is depressed or the handpiece is in the cal port. The fingerswitch,
footswitch and handpiece in cal port signals are all generated by redundant switches. The
fingerswitch signals originate in the handpiece and are sent to the input of U39B. (They are
also connected to U35 so the firmware can sense the position of the trigger switch.) The
footswitch signals originate in the air footswitch, which then is converted to an electrical signal
by S1 and S2. (They are connected to the input U39C and also U35 so the firmware can
sense the position of the trigger switch.) The finger switch signals, which are normally high,
must both be low so that the output of U39B can change from a high to a low, indicating the
fingerswitch is depressed. The same situation is true for the cal port switches that are
connected to the input of U39D. The output of U39D will only be low when both cal port
switches are depressed, indicating the handpiece is fully inserted in the cal port. The output of
U39B, U39C and U39D are connected to the inputs of U40C. This IC functions as an NAND
gate so that if either input is low, the output will be high. The output of U40C is connected to
an RC circuit (R177, C138) providing a small delay to prevent timing problems between the
hardware and firmware beam shutter opening signals. After the RC circuit, the signal passes
through U40B that simply inverts the signal to a low when the hardware is commanding the
shutter to open. The output of U40B is connected to an input of U39A. The other input to
U39A is the firmware signal that commands the shutter to open. The output of U39A will only
be low if both inputs are low. A low is required to open the beam shutter. This provides the
safety feature that both the hardware and firmware commands must exist in order to open the
beam shutter. A low output on U39A draws current through the diode side of optoisolator U53.

8501-00-1550 Revision C Candela PROPRIETARY Page 14 of 22

VBEAM Theory of Operation

When diode current flows through U53 it turns on Q12 by raising the gate voltage to
approximately 15 volts. This makes Q12s drain terminal low, allowing current flow from
capacitor C156, through the beam shutter coil, then through Q12 and into ground. Initially, a
high current flows because C156 is charged to +24 volts. However, after a few hundred
milliseconds, C156 discharges to a level determined by the four dropping resistors (R238,
R239, R240, and R241) and the resistance of the shutter coil. This new voltage level is
approximately 15 volts. This circuit provides sufficient stored electrical energy to open the
shutter quickly. Then, after the shutter is opened, the current is reduced to limit the power
dissipated in the shutter coil.

2. Trigger Circuit (schematic page 4)

The four trigger pulses are generated by firmware depending on the front panel settings.
They are sent from the CPU chip through U29 a driver IC chip. The output from U29 is a low
signal that turns on an optical driver as in J15, J16, J17 and J18. The electrical signal is
converted into an optical signal for isolation purposes. This optical signal is then sent by a
1000 micron plastic fiber to the SCR Trigger PCB. This PCB will enable the lamp to fire. A
detail discussion of the SCR Trigger PCB is described in the Modulator section further on.

3. Bubble Sense Circuit (schematic page 7)

The bubble sense circuit uses a slotted optical switch located in the handpiece for the bubble
detection sensor. The cryogen tube is located in the center of the slot so the photosensor in
the switch detects the light transmitted through the cryogen tube. The sensor is calibrated
with cryogen in the tube. When the tube is empty the transmission of light through it drops by
approximately 50%.

The circuit works by having the slotted optical switch in the feedback loop of op amp U54A.
The phototransistor output of the optical switch is connected to the inverting input pin of U54A
through resistor R242. The noninverting pin of U54A is connected to a 10-volt reference
created by U61, R231, and R234. The output of U54A is connected to the LED portion of the
slotted optical switch through resistor R243. The output voltage of U54A adjusts itself to a
level that provides sufficient current in the LED of the optical switch so that its phototransistor
can generate 10 volts at pin 2 of U54A. Under this condition, the feedback loop is in
regulation and the output voltage of U54A is adjusted to 7.75 VDC with the cryogen tubing
full. The adjustment is a potentiometer in the handpiece that shunts some of the
phototransistor output current to ground. When the cryogen tube becomes empty (bubbles
exist), the phototransistors output drops and op amp U54A compensates for this by raising its
output voltage to drive more current into the slotted switch LED. Op amp U54As output
voltage is monitored by U54B which is configured as a comparator. The reference voltage for
this comparator is 10 volts, which is connected to its inverting input. The output of U54A is
connected to the noninverting input of U54B. When this input goes above 10 volts, then the
output of U54B switches from a low to high state. The high state stops current flow through
the diode half of optoisolator U50 which is the signal that eventually connects into the
firmware to inform it that a bubble exists. Resistor R222 provides a small amount of
hysteresis for U54B to prevent oscillations when it switches states.

8501-00-1550 Revision C Candela PROPRIETARY Page 15 of 22

VBEAM Theory of Operation

4. Digital-to-Analog Converter (DAC) and Analog-to-Digital Converter (ADC)

Circuits (schematic pages 14 and 16)

The only signal that requires the DAC (U24) is the high voltage power supply program voltage
signal. However, four analog signals are processed through an external 12-bit ADC chip U22.
Also there are five analog signals and one spare processed directly through an internal 8-bit
ADC port of the CPU chip U26. The energy signals, calport, head, WL and HV sample go
through the external 12-bit ADC chip U24. The water temperature, DCD pressure, HP
detection, and two touch screen signals go directly into the CPU chip to be processed. The
communication between the DAC and ADC to the CPU is obtained through the SPI bus. A
stable 5 volt reference chip U16 is use for the CPU analog port and the external ADC. Two
precision resistors R123 and R124 divide down this 5 volt reference to a 2.5 volt reference for
the DAC.

The DAC and ADC used in this laser system are both 12-bit types. Full scale on each device
is 5 VDC so the minimum resolution is 1/(212) x 5V = 1.22 mV. The DAC and ADC share data
transfers on the SPI bus to the CPU chip. The CPU chip can send data to and receive data
from the ADC chip; it is bi-directional. The CPU only sends data to the DAC chip. Once the
firmware selects either chip select then the data transfer begins.

5. High Voltage Power Supply (HVPS) Interface Circuits (schematic page 5)

There are four signals associated with the high voltage power supply (HVPS). Two of them
are analog signals (HVPS Program Voltage or HVPS Ref and HVPS Sample) and the other
two are digital (HVPS Inhibit and HVPS fault). HVPS Program Voltage is the signal that tells
the HVPS what voltage to charge to and HVPS Sample is the signal that provides feedback
on the actual high voltage level. HVPS Inhibit is basically an on/off input signal. It does not
remove AC line voltage from the HVPS but it will prevent it from charging. The HVPS fault
signal is generated if the HVPS experiences an over temperature or over voltage fault.

The Program Voltage signal comes from the firmware as a 12 bit digital number. It is
converted to an analog signal at the DAC (U24). The DAC output is isolated by U23 and then
its level is reduced by approximately 10% by the voltage divider consisting of R131, and
R130. Potentiometer R131 is used to calibrate the actual high voltage to the value set by the
firmware. For 3.5KV output, the DAC generates 5 volts which then is reduced to 4.5 volts by
the resistor divider. This results in a program voltage transfer function of 0.777KV/V at the
input to the HVPS.

The high voltage sample signal from the HVPS has a ratio of 8V=3500V. This signal is
divided down by R139 and R132 (potentiometer) to allow for adjustment of the signal. This is
then isolated by U27 and has a transfer function same as the Program Voltage 0.777KV/V.
So at 3.5KV the sample voltage is set for 4.5 volts. Then it is sent to the ADC chip U22 so it
can be processed and sent to the CPU chip to be read by the firmware.

6. Calport Energy Detector Circuit

There are three energy detector circuits on this board (labeled head, wavelength and calport).
The wavelength and head circuits are exactly the same. The calport circuit is the same as the
other two circuits except for the gain circuit. Since these three circuits are so similar only the
calport will be discussed.

8501-00-1550 Revision C Candela PROPRIETARY Page 16 of 22

VBEAM Theory of Operation

A photodiode on the Energy PCB located on the backside of the calport assembly converts a
sample of the laser light pulse directed into the calport to a current pulse. The current pulse
is sent to op amp U2B on this board. This op amp integrates the current pulse using C13 and
thus the amount of charge (or voltage) on C13 is proportional to the laser energy. The
firmware keeps C13 discharged just before the trigger pulse by controlling an analog switch
U5. The firmware opens U5 just before each trigger pulse; which allows C13 to charge up
proportional to the energy pulse. The output of U2B is a negative pulse with a decay time
constant much greater than the original laser pulse. Since the output of U2B is both a small
voltage and negative it is sent to an inverting op amp U2A for amplification gain=4.12 and
inversion to a positive signal. Potentiometer (R18) is used to adjust the amount of signal into
U2A for calibration to the laser energy. R10 is adjusted to remove any offsets in the circuitry
so the voltage level at TP2 is zero when the laser is not pulsed. Capacitor C8 and R22 form a
noise filter before the signal reaches the input of the peak hold circuit.

U3B, U3A, and their associated circuitry form the peak hold circuit which captures the peak
level of the output of U2A and holds it at TP1. The circuit only samples signals at its input
when the reset transistor (Q3) is off. The firmware controls Q3 through driver chip U36. After
the laser is pulsed, the peak hold circuit stores the voltage that is proportional to the energy in
the calport. The transfer function is 4 J per volt. The output of the peak hold circuit (TP1) is
connected to the ADC U22 so the firmware can read the energy level.

7. DI Temperature Circuit

The DI temperature sensor is an IC temperature transducer (AD590) with an output current of

1 A/K. The K stands for Kelvin degrees which are 273 degrees greater than Celsius
degrees (e.g. 0C = 273K). The temperature sensor is mounted in the DI heater manifold.
Electrically, it is connected between the -15 VDC and the inverting input of op amp U20B.
Connected to the inverting input of U20B is an adjustable current source formed by R83 and
R86. This current source is powered by the 5 volt reference from U19A. Potentiometer R83
is adjusted so that 273 A flows through R86. This 273 A current source is used to cancel
out 273 A of current from the temperature transducer which effectively changes its output
from 1 A/K to 1 A/C. Keep in mind that ideally no current flows in or out of U20B pin 6
and it is at zero volts (virtual ground). For temperatures above 0C the temperature
transducer draws more current than 273 A, so the output of op amp U20B must increase to
supply the required current through R102. Because R102 is a 100 K resistor the output of
U20B is 0.1 V/C. Capacitor C65 provides noise filtering for the circuit.

The output of U20B is sent through R95 to the input of the CPU (U26). This input of the CPU
is an ADC input and then the firmware can interpret the water temperature.

8. DCD Pressure Circuit

The DCD pressure sensor has a range of 0 to 150 PSI with a 300 PSI maximum over-
pressure value. This pressure sensor has internal circuitry which runs off 5 volts and has a
voltage output scale of 4.50 volts and a 0.5 volt offset. The sensor transfer function is 26.7
millivolts per PSI. The pressure sensor is mounted to the brass tee fitting that the DCD
canister output connects to. Electrically, it is connected between the +5 volt reference, analog
ground (A_GND) and its output voltage is across R84 a potentiometer and R79 a resistor to
analog ground which allows calibration of the pressure circuit. The circuit is calibrated with an
external pressure meter connected to the HP cryogen connector on the front bezel. The

8501-00-1550 Revision C Candela PROPRIETARY Page 17 of 22

VBEAM Theory of Operation

signaled is sent to the CPU (U26), to an ADC input so the firmware can interpret the DCD
pressure. The maximum pressure reading is at 4.5 volts which corresponds to 150 PSI. A
DCD pressure fault is declared by the firmware if the pressure exceeds 135 PSI.

MODULATOR

A simplified schematic of the modulator section is shown in Figure 4. When the laser goes
into the Ready State the simmer power supply is enabled. It automatically sends out trigger
pulses at a 30 Hz rate to the simmer start transformer in an attempt to initiate simmer current.
These pulses are stepped up to approximately 5 KV on the secondary of the simmer start
transformer. The high voltage secondary is connected directly to the laser head cavity.
These pulses create an electrical field inside the laser head which helps to breakdown the
flashlamp. The output voltage of the simmer power supply is 1300 volts before the lamp is lit.
After the lamp is lit the simmer output voltage drops down to approximately 300 volts.

The Pulse Forming Network (PFN) has four separate capacitors and one choke network that
produces four electrical pulse widths of approximately 250 microseconds (full width half
maximum or FWHM) at maximum voltage of 3.5KV. The PFN capacitor is constructed as a
single unit that houses all four capacitors. The PFN choke is a foil construction type which
helps reduce resistive losses in the PFN. The PFN, at its maximum voltage of 3.5 KV,
produces a peak current of 950 amperes per network. At maximum power, the RMS current
through the PFN and flashlamp is about 25 amperes. The PFN pulse discharge occurs when
each SCR s (silicon controlled rectifiers) is triggered on. There are four individual PFN
pulses, therefore four SCR modules. Each module contains two 2200 volt SCRs. The
modules are mounted directly to the laser chassis for heatsinking. Their triggers are
generated by the SCR Trigger PCB. These triggers are controlled by the firmware depending
on the front panel settings.

The high voltage power supply is rated for 2.5 KJ/s. For most energies, this allows laser
operation up to 1.5 Hz repetition rate. When the input energy is above approximately 1700
Joules, the repetition rate decreases due to an increase in the time it takes the power supply
to charge the PFN capacitor. The high voltage power supply also contains an integral 24-volt
DC power supply, rated at 6 amperes. The power supply is inhibited by the firmware for the
length of the set pulse width plus a fixed 50 milliseconds after all the PFNs discharge to
ensure the flashlamp current has reached zero before voltage is reapplied. The high voltage
power supply is built by an outside vendor and is covered by a one-year warranty by the
manufacturer. It has no field serviceable parts. The power supply features include: short
circuit protection, open circuit protection, internal over temperature shut down, air cooled, and
power factor correction circuitry. The internal power supply fan pulls up air from the bottom of
the laser system and blows it through the power supply. The air exhausts out through vents in
the back of the laser.

8501-00-1550 Revision C Candela PROPRIETARY Page 18 of 22

VBEAM Theory of Operation

Figure 4 - Modulator Block Diagram

The Modulator PCB (schematic 7111-80-2300), which is mounted on top of the SCR Trigger
PCB, has three charging channels which allow the capacitors to charge to specific voltage
levels. Each charging channel is controlled by the firmware dependent on the corresponding
laser energy set on the front panel. It also contains high value resistance bleeder resistors to
discharge any energy stored in the capacitors after the laser is turned off. There is a manual
dump resistor rod attached to this laser to provide a quick discharge of the high voltage. This
dump resistor rod is used by service personnel to discharge the high voltage. There is a neon
lamp on the board that illuminates whenever the high voltage is greater than approximately
300 volts on capacitor C4. This serves as a safety reminder that high voltage is present.
CAUTION: If the neon bulb is not lit, there may still be lethal voltages present on capacitors
C1, C2 or C3. Service personnel should always verify the voltage on the capacitors with a
meter and high voltage probe before servicing the modulator.

SCR Trigger PCB

The SCR Trigger PCB (schematic 7111-80-2320) receives the four trigger pulses from the
CPU I/O PCB and generates a signal to trigger the four dual SCR modules to pulse the
flashlamp. The four trigger timing signals are controlled by the firmware. The timing is
dependent on the input setting from the front panel by the user.

The primary function of the SCR Trigger PCB is to provide isolated trigger circuits for the four
SCRs modules that are used to trigger the four PFN pulses. This isolation is provided by
optical signals. The trigger pulses from the CPU I/O PCB are optically isolated by optical
drivers J17, J16, J15 and J13. The SCR Trigger PCB uses optical receivers J16, J22, J23
and J15 to receive the trigger signals from the CPU I/O PCB.

8501-00-1550 Revision C Candela PROPRIETARY Page 19 of 22

VBEAM Theory of Operation

There are four identical SCR trigger circuits on this PCB. Therefore only SCR trigger #1 will
be discussed. The optical signal received into J16, from the CPU I/O PCB, will allow Q8 to
turn on. Having Q8 on will put a low into the high-speed MOSFET driver chip U5 pin 2. U5
will put a high on the output pin 7 which in turn will turn on the FET Q6. T4 will then have
about 24VDC across its input. T4 has a dual output winding, which will turn on both SCRs in
the SCR #1 module.

There are two sets of balancing resistors used to ensure equal voltage sharing between the
two SCRs. Each set contains four 750K, 2W resistors. The SCRs also have snubber circuits
connected across them to prevent voltage spikes when they turn off. C31 is the snubber
capacitor for the first SCR. D46 and D33 are required to prevent a high current discharge of
C31 through the SCR when it first turns on. Instead, the capacitor is discharged through
resistors R83, R84 and R85, R76.

The high voltage output from the simmer power supply is routed through this board so that
the simmer current can be measured and a simmer sense signal can be created. The current
is measured across the 10 , 1% resistors R11 and R12. The simmer current is set to 150
milliamperes by measuring the voltage across these resistors while turning the adjustment on
the simmer power supply. The voltage should be 750 millivolts for 150 milliamps of simmer
current (20 mA/0.1V).

The simmer sense signal is developed by creating a 7.8 volt source using zener diodes D4
and D9. This provides current for the optical driver J8. The output of J8 is sent back to the
CPU I/O PCB. LED D1 lights to indicate when simmer current is flowing.

The 24VDC Power Supply PCB (schematic 7111-80-2330) supplies 24V to the simmer power
supply, Modulator PCB and the SCR Trigger PCB. This PCB has the simmer start
transformer mounted on it. Resistors (R4-R7) connected in parallel with the primary are used
to limit the voltage applied to the trigger transformer. If they are shorted or bypassed, the
simmer start pulse applied to the laser head cavity could increase to almost 10 KV. This
much voltage is not required to light the lamp for simmering and can cause high voltage
breakdown problems on the laser head.

LASER SAFETY INTERLOCK CIRCUIT

There is one hardware interlock circuits in the laser to prevent lasing. The safety interlock
circuit is performed in the system wiring. It consists of the CDRH connector and the DI heater
manifold overtemperature (OT) switch. Each of these devices functions as a normally closed
switch and they are connected in series with one another. They are part of the circuit that
provides coil current for the main relay. If one of them becomes open, the relay current flow is
interrupted. This opens the main relay and shuts down all power to the laser system except
the 24 VDC on the AC Distribution PCB. The laser cannot be turned on again until all the
interlock switches are closed.

8501-00-1550 Revision C Candela PROPRIETARY Page 20 of 22

VBEAM Theory of Operation

The CDRH interlock is a connector located on the back of the laser. It is provided so the
physician can connect an external door switch to it. If the door is opened while the physician
is lasing, the laser will be shut down and lasing prevented.

The DI heater manifold OT switch will turn off power to the laser if a fault occurs in the heater
circuit that allows the manifold temperature to exceed 79C. Normally the firmware would
declare a water overtemperature fault before the OT switch opens unless a serious fault
exists in the heater circuit.

DCD (Dynamic Cooling Device)

The DCD canister is warmed up with a 48-watt heater. Typical warm-up time is 25 minutes.
The number of pulses available per cryogen canister is shown in Table 4. These are the
values displayed on the front panel after the Canister Count has been reset. When the
canister count gets to zero, the firmware will not allow the laser to be pulsed unless the DCD
is turned off (or the reset button is pressed).

Spray Duration (msec) Pulses/Canister

20 16,217
30 10,812
40 8,108
50 6,486
60 5,405
70 4,633
80 4,054
90 3,603
100 3,243

Table 4. Cryogen Pulses Per Canister

The DCD purge duration is the same as the selected pulse duration setting. When the system
is purged, it counts as a pulse and deducts from the total pulses available.

LINE VOLTAGE REQUIREMENTS

The VBEAM operates over a wide input line voltage range of 185 to 260 VAC at 50/60 Hz. There are
no adjustments required for the laser to operate across this range since it has no isolation
transformer. Virtually all the AC power for the laser system is fused and distributed from the AC

8501-00-1550 Revision C Candela PROPRIETARY Page 21 of 22

VBEAM Theory of Operation

Distribution PCB. The only exception to this is the power for the HVPS which is taken off the load
side of the main relay. No fusing is required for the HVPS since it is fused internally.

Accuracy

The references made to components in the laser system and on pc boards was accurate at
the time this theory of operation was written. However, future changes and upgrades may
cause errors if they impact this document and it is not revised. Therefore, in the event a
discrepancy between the Theory of Operation and the actual system documentation is
discovered, it should be assumed that the system documentation is correct.

Service Note

Whenever maintenance or repair of the laser system is required be sure to adhere to the
following safety statement:

WARNING

The electrical hazards present during servicing of the VBEAM can be extremely
dangerous and lethal if proper precautions are not taken. The VBEAM should be
serviced only by qualified technicians who have received appropriate training on
the VBEAM from Candela, and who are familiar with the safety considerations
discussed in this section.

8501-00-1550 Revision C Candela PROPRIETARY Page 22 of 22