HGTG12N60A4D, HGTP12N60A4D,

HGT1S12N60A4DS
Data Sheet December 2001

600V, SMPS Series N-Channel IGBT with Features

Anti-Parallel Hyperfast Diode >100kHz Operation . . . . . . . . . . . . . . . . . . . . . 390V, 12A
The HGTG12N60A4D, HGTP12N60A4D and
200kHz Operation . . . . . . . . . . . . . . . . . . . . . . . 390V, 9A
HGT1S12N60A4DS are MOS gated high voltage switching
devices combining the best features of MOSFETs and 600V Switching SOA Capability
bipolar transistors. These devices have the high input Typical Fall Time. . . . . . . . . . . . . . . . . 70ns at TJ = 125oC
impedance of a MOSFET and the low on-state conduction
loss of a bipolar transistor. The much lower on-state voltage Low Conduction Loss
drop varies only moderately between 25 oC and 150oC. The Temperature Compensating SABER Model
IGBT used is the development type TA49335. The diode www.fairchildsermi.com
used in anti-parallel is the development type TA49371.
Related Literature
This IGBT is ideal for many high voltage switching - TB334 Guidelines for Soldering Surface Mount
applications operating at high frequencies where low Components to PC Boards
conduction losses are essential. This device has been
optimized for high frequency switch mode power supplies. Packaging
JEDEC TO-220AB ALTERNATE VERSION
Formerly Developmental Type TA49337.
COLLECTOR
(FLANGE)
Ordering Information
PART NUMBER PACKAGE BRAND E
C
HGTG12N60A4D TO-247 12N60A4D G

HGTP12N60A4D TO-220AB 12N60A4D

HGT1S12N60A4DS TO-263AB 12N60A4D

NOTE: When ordering, use the entire part number. Add the suffix 9A JEDEC TO-263AB
to obtain the TO-263AB variant in tape and reel, e.g.
HGT1S12N60A4DS9A.
COLLECTOR
G (FLANGE)
Symbol
C E

JEDEC STYLE TO-247

G E
C
G

COLLECTOR
(FLANGE)

Fairchild CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS

4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,587,713

4,598,461 4,605,948 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637
4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986
4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767
4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027

2001 Fairchild Semiconductor Corporation HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS Rev. B

 HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS

Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified

HGTG12N60A4D,
HGTP12N60A4D,
HGT1S12N60A4DS UNITS
Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BVCES 600 V
Collector Current Continuous
At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC25 54 A
At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC110 23 A
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM 96 A
Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES 20 V
Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGEM 30 V
Switching Safe Operating Area at TJ = 150oC, Figure 2 . . . . . . . . . . . . . . . . . . . . . . . . SSOA 60A at 600V
Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD 167 W
Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.33 W/oC
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG -55 to 150 oC

Maximum Temperature for Soldering

Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 300 oC
Package Body for 10s, see Tech Brief 334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 260 oC

CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:
1. Pulse width limited by maximum junction temperature.

Electrical Specifications TJ = 25oC, Unless Otherwise Specified

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Collector to Emitter Breakdown Voltage BVCES IC = 250A, VGE = 0V 600 - - V
Collector to Emitter Leakage Current ICES VCE = 600V TJ = 25oC - - 250 A
TJ = 125oC - - 2.0 mA
Collector to Emitter Saturation Voltage VCE(SAT) IC = 12A, TJ = 25oC - 2.0 2.7 V
VGE = 15V
TJ = 125oC - 1.6 2.0 V
Gate to Emitter Threshold Voltage VGE(TH) IC = 250A, VCE = 600V - 5.6 - V
Gate to Emitter Leakage Current IGES VGE = 20V - - 250 nA
Switching SOA SSOA TJ = 150oC, RG = 10, VGE = 15V, 60 - - A
L = 100H, VCE = 600V
Gate to Emitter Plateau Voltage VGEP IC = 12A, VCE = 300V - 8 - V
On-State Gate Charge Qg(ON) IC = 12A, VGE = 15V - 78 96 nC
VCE = 300V
VGE = 20V - 97 120 nC
Current Turn-On Delay Time td(ON)I IGBT and Diode at TJ = 25oC, - 17 - ns
Current Rise Time trI ICE = 12A, - 8 - ns
VCE = 390V,
Current Turn-Off Delay Time td(OFF)I VGE = 15V, - 96 - ns
Current Fall Time tfI RG = 10, - 18 - ns
L = 500H,
Turn-On Energy (Note 3) EON1 - 55 - J
Test Circuit (Figure 24)
Turn-On Energy (Note 3) EON2 - 160 - J
Turn-Off Energy (Note 2) EOFF - 50 - J
Current Turn-On Delay Time td(ON)I IGBT and Diode at TJ = 125oC, - 17 - ns
Current Rise Time trI ICE = 12A, - 16 - ns
VCE = 390V, VGE = 15V,
Current Turn-Off Delay Time td(OFF)I RG = 10, - 110 170 ns
Current Fall Time tfI L = 500H, - 70 95 ns
Test Circuit (Figure 24)
Turn-On Energy (Note3) EON1 - 55 - J
Turn-On Energy (Note 3) EON2 - 250 350 J
Turn-Off Energy (Note 2) EOFF - 175 285 J

2001 Fairchild Semiconductor Corporation HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS Rev. B

 HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS

Electrical Specifications TJ = 25oC, Unless Otherwise Specified (Continued)

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Diode Forward Voltage VEC IEC = 12A - 2.2 - V
Diode Reverse Recovery Time trr IEC = 12A, dIEC/dt = 200A/s - 30 - ns
IEC = 1A, dIEC/dt = 200A/s - 18 - ns
Thermal Resistance Junction To Case RJC IGBT - - 0.75 oC/W

Diode - - 2.0 oC/W

NOTES:
2. Turn-Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending
at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
3. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E ON1 is the turn-on loss of the IGBT only. E ON2
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in
Figure 24.

Typical Performance Curves Unless Otherwise Specified

ICE , COLLECTOR TO EMITTER CURRENT (A)

60 70
VGE = 15V, TJ = 150oC, RG = 10, VGE = 15V, L = 200H
ICE , DC COLLECTOR CURRENT (A)

60
50

50
40
40
30
30

20
20

10 10

0 0
25 50 75 100 125 150 0 100 200 300 400 500 600 700
TC , CASE TEMPERATURE (oC) VCE , COLLECTOR TO EMITTER VOLTAGE (V)

FIGURE 1. DC COLLECTOR CURRENT vs CASE FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA
TEMPERATURE

500
tSC , SHORT CIRCUIT WITHSTAND TIME (s)

ISC, PEAK SHORT CIRCUIT CURRENT (A)

20 300
VCE = 390V, RG = 10, TJ = 125oC
fMAX , OPERATING FREQUENCY (kHz)

TC VGE 18 275
300
75oC 15V
16 250
14 225
ISC
100 12 200
fMAX1 = 0.05 / (td(OFF)I + td(ON)I)
fMAX2 = (PD - PC) / (EON2 + EOFF) 10 175
PC = CONDUCTION DISSIPATION 8 150
(DUTY FACTOR = 50%)
RJC = 0.75oC/W, SEE NOTES 6 125
tSC
4 100

TJ = 125oC, RG = 10, L = 500H, V CE = 390V 2 75

10 0 50
1 3 10 20 30 9 10 11 12 13 14 15
ICE, COLLECTOR TO EMITTER CURRENT (A) VGE , GATE TO EMITTER VOLTAGE (V)

FIGURE 3. OPERATING FREQUENCY vs COLLECTOR TO FIGURE 4. SHORT CIRCUIT WITHSTAND TIME

EMITTER CURRENT

2001 Fairchild Semiconductor Corporation HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS Rev. B

 HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS

Typical Performance Curves Unless Otherwise Specified (Continued)

ICE, COLLECTOR TO EMITTER CURRENT (A)

ICE , COLLECTOR TO EMITTER CURRENT (A)

24 24
DUTY CYCLE < 0.5%, VGE = 12V DUTY CYCLE < 0.5%, VGE = 15V
PULSE DURATION = 250s PULSE DURATION = 250s
20 20

16 16
TJ = 150oC
TJ = 150oC
12 12
TJ = 125oC
TJ = 125oC
8 8

TJ = 25oC
4 4
TJ = 25oC

0 0
0 0.5 1.0 1.5 2 2.5 0 0.5 1.0 1.5 2 2.5
VCE , COLLECTOR TO EMITTER VOLTAGE (V) VCE , COLLECTOR TO EMITTER VOLTAGE (V)

FIGURE 5. COLLECTOR TO EMITTER ON-STATE VOLTAGE FIGURE 6. COLLECTOR TO EMITTER ON-STATE VOLTAGE

700 400
RG = 10, L = 500H, VCE = 390V RG = 10, L = 500H, VCE = 390V

EOFF, TURN-OFF ENERGY LOSS (J)

EON2 , TURN-ON ENERGY LOSS (J)

600 350

TJ = 125oC, VGE = 12V, VGE = 15V 300

500
250 TJ = 125oC, VGE = 12V OR 15V
400
200
300
150

200 100

100 TJ = 25oC, VGE = 12V, VGE = 15V 50

TJ = 25oC, VGE = 12V OR 15V

0 0
2 4 6 8 10 12 14 16 18 20 22 24
2 4 6 8 10 12 14 16 18 20 22 24
ICE , COLLECTOR TO EMITTER CURRENT (A) ICE , COLLECTOR TO EMITTER CURRENT (A)

FIGURE 7. TURN-ON ENERGY LOSS vs COLLECTOR TO FIGURE 8. TURN-OFF ENERGY LOSS vs COLLECTOR TO
EMITTER CURRENT EMITTER CURRENT

18 32
RG = 10, L = 500H, VCE = 390V RG = 10, L = 500H, VCE = 390V
td(ON)I, TURN-ON DELAY TIME (ns)

17 28

16 24
trI , RISE TIME (ns)

TJ = 125oC OR TJ = 25oC, VGE = 12V

15 TJ = 25oC, TJ = 125oC, VGE = 12V 20

14 16

13 12

12 8
TJ = 25oC, TJ = 125oC, VGE = 15V TJ = 25oC OR TJ = 125oC, VGE = 15V
11 4

10 0
2 4 6 8 10 12 14 16 18 20 22 24 2 4 6 8 10 12 14 16 18 20 22 24
ICE , COLLECTOR TO EMITTER CURRENT (A) ICE , COLLECTOR TO EMITTER CURRENT (A)

FIGURE 9. TURN-ON DELAY TIME vs COLLECTOR TO FIGURE 10. TURN-ON RISE TIME vs COLLECTOR TO
EMITTER CURRENT EMITTER CURRENT

2001 Fairchild Semiconductor Corporation HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS Rev. B

 HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS

Typical Performance Curves Unless Otherwise Specified (Continued)

115 90
RG = 10, L = 500H, VCE = 390V RG = 10, L = 500H, VCE = 390V
td(OFF)I , TURN-OFF DELAY TIME (ns)

80
110

VGE = 12V, VGE = 15V, TJ = 125oC 70

TJ = 125oC, VGE = 12V OR 15V

tfI , FALL TIME (ns)

105
60

100 50

40
95
VGE = 12V, VGE = 15V, TJ = 25oC 30
TJ = 25oC, VGE = 12V OR 15V
90
20

85 10
2 4 6 8 10 12 14 16 18 20 22 24 2 4 6 8 10 12 14 16 18 20 22 24
ICE , COLLECTOR TO EMITTER CURRENT (A) ICE , COLLECTOR TO EMITTER CURRENT (A)

FIGURE 11. TURN-OFF DELAY TIME vs COLLECTOR TO FIGURE 12. FALL TIME vs COLLECTOR TO EMITTER
EMITTER CURRENT CURRENT
ICE , COLLECTOR TO EMITTER CURRENT (A)

250 16
DUTY CYCLE < 0.5%, VCE = 10V IG(REF) = 1mA, RL = 25, TC = 25oC
PULSE DURATION = 250s VGE , GATE TO EMITTER VOLTAGE (V)
14
200 TJ = 25oC
12
VCE = 600V
VCE = 400V
150 TJ = -55oC 10

8
TJ = 125oC
100
6 VCE = 200V

4
50
2

0 0
6 7 8 9 10 11 12 13 14 15 16 0 10 20 30 40 50 60 70 80
VGE , GATE TO EMITTER VOLTAGE (V) QG , GATE CHARGE (nC)

FIGURE 13. TRANSFER CHARACTERISTIC FIGURE 14. GATE CHARGE WAVEFORMS

1.2 10
RG = 10, L = 500H, VCE = 390V, VGE = 15V
TJ = 125oC, L = 500H,
ETOTAL = EON2 + EOFF
1.0 VCE = 390V, VGE = 15V
ETOTAL = EON2 + EOFF
ETOTAL, TOTAL SWITCHING

ETOTAL, TOTAL SWITCHING

0.8
ENERGY LOSS (mJ)

ENERGY LOSS (mJ)

ICE = 24A
ICE = 24A
0.6 1
ICE = 12A
0.4
ICE = 12A
ICE = 6A
0.2
ICE = 6A
0 0.1
25 50 75 100 125 150 5 10 100 1000
TC , CASE TEMPERATURE (oC) RG , GATE RESISTANCE ()

FIGURE 15. TOTAL SWITCHING LOSS vs CASE FIGURE 16. TOTAL SWITCHING LOSS vs GATE RESISTANCE
TEMPERATURE

2001 Fairchild Semiconductor Corporation HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS Rev. B

 HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS

Typical Performance Curves Unless Otherwise Specified (Continued)

VCE, COLLECTOR TO EMITTER VOLTAGE (V)

3.0 2.4
FREQUENCY = 1MHz DUTY CYCLE < 0.5%, VGE = 15V
PULSE DURATION = 250s, TJ = 25oC
2.5
2.3
C, CAPACITANCE (nF)

2.0
2.2
CIES
1.5 ICE = 18A
2.1
1.0 ICE = 12A
COES
0.5 2.0
ICE = 6A
CRES
0 1.9
0 5 10 15 20 25 8 9 10 11 12 13 14 15 16
VCE, COLLECTOR TO EMITTER VOLTAGE (V) VGE , GATE TO EMITTER VOLTAGE (V)

FIGURE 17. CAPACITANCE vs COLLECTOR TO EMITTER FIGURE 18. COLLECTOR TO EMITTER ON-STATE VOLTAGE
VOLTAGE vs GATE TO EMITTER VOLTAGE

14 90
DUTY CYCLE < 0.5%, dIEC/dt = 200A/s
PULSE DURATION = 250s 80
12
IEC , FORWARD CURRENT (A)

125oC 25oC
trr , RECOVERY TIMES (ns)

70 125oC trr
10
60 125oC tb
8 50

6 40
125oC ta
30
4 25oC trr
20
25oC ta
2
10
25oC tb
0 0
0 0.5 1.0 1.5 2.0 2.5 1 2 3 4 5 6 7 8 9 10 11 12
VEC , FORWARD VOLTAGE (V) IEC , FORWARD CURRENT (A)

FIGURE 19. DIODE FORWARD CURRENT vs FORWARD FIGURE 20. RECOVERY TIMES vs FORWARD CURRENT
VOLTAGE DROP

65 400
Qrr , REVERSE RECOVERY CHARGE (nc)

IEC = 12A, VCE = 390V VCE = 390V

60
350 125oC IEC = 12A
55 125oC tb
trr , RECOVERY TIMES (ns)

50 300
45 125oC IEC = 6A
250
40
35 125oC ta 200
30
150 25oC IEC = 12A
25
20 25oC ta 100
15
25oC IEC = 6A
25oC tb 50
10
5 0
200 300 400 500 600 700 800 900 1000 200 300 400 500 600 700 800 900 1000

diEC/dt, RATE OF CHANGE OF CURRENT (A/s) diEC/dt, RATE OF CHANGE OF CURRENT (A/s)

FIGURE 21. RECOVERY TIMES vs RATE OF CHANGE OF FIGURE 22. STORED CHARGE vs RATE OF CHANGE OF
CURRENT CURRENT

2001 Fairchild Semiconductor Corporation HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS Rev. B

 HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS

Typical Performance Curves

ZJC , NORMALIZED THERMAL RESPONSE
Unless Otherwise Specified (Continued)

100

0.50

0.20
t1
0.10
10-1
PD
0.05
t2
0.02
DUTY FACTOR, D = t1 / t2
0.01
PEAK TJ = (PD X ZJC X RJC) + TC
SINGLE PULSE
10-2 -5
10 10-4 10-3 10-2 10-1 100 101
t1 , RECTANGULAR PULSE DURATION (s)

FIGURE 23. IGBT NORMALIZED TRANSIENT THERMAL RESPONSE, JUNCTION TO CASE

Test Circuit and Waveforms

HGTP12N60A4D
DIODE TA49371

90%

VGE 10%
EON2
L = 500H EOFF
VCE

RG = 10
90%
DUT

+ ICE 10%
VDD = 390V td(OFF)I trI
- tfI
td(ON)I

FIGURE 24. INDUCTIVE SWITCHING TEST CIRCUIT FIGURE 25. SWITCHING TEST WAVEFORMS

2001 Fairchild Semiconductor Corporation HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS Rev. B

 HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS
Handling Precautions for IGBTs
Insulated Gate Bipolar Transistors are susceptible to
gate-insulation damage by the electrostatic discharge of
energy through the devices. When handling these devices,
care should be exercised to assure that the static charge
built in the handlers body capacitance is not discharged
through the device. With proper handling and application
procedures, however, IGBTs are currently being extensively
used in production by numerous equipment manufacturers in
military, industrial and consumer applications, with virtually
no damage problems due to electrostatic discharge. IGBTs
can be handled safely if the following basic precautions are
taken:
1. Prior to assembly into a circuit, all leads should be kept
shorted together either by the use of metal shorting
springs or by the insertion into conductive material such
as ECCOSORBD LD26 or equivalent. limiting condition for an application other than T JM . td(OFF)I
2. When devices are removed by hand from their carriers,
the hand being used should be grounded by any suitable
means - for example, with a metallic wristband.
3. Tips of soldering irons should be grounded.
4. Devices should never be inserted into or removed from
circuits with power on.
5. Gate Voltage Rating - Never exceed the gate-voltage
rating of VGEM. Exceeding the rated VGE can result in
permanent damage to the oxide layer in the gate region.
6. Gate Termination - The gates of these devices are
essentially capacitors. Circuits that leave the gate open-
circuited or floating should be avoided. These conditions
can result in turn-on of the device due to voltage buildup
on the input capacitor due to leakage currents or pickup.
7. Gate Protection - These devices do not have an internal
monolithic Zener diode from gate to emitter. If gate
protection is required an external Zener is recommended.
2001 Fairchild Semiconductor Corporation
Operating Frequency Information
Operating frequency information for a typical device
(Figure 3) is presented as a guide for estimating device
performance for a specific application. Other typical
frequency vs collector current (ICE) plots are possible using
the information shown for a typical unit in Figures 5, 6, 7, 8, 9
and 11. The operating frequency plot (Figure 3) of a typical
device shows fMAX1 or fMAX2 ; whichever is smaller at each
point. The information is based on measurements of a
typical device and is bounded by the maximum rated
junction temperature.
fMAX1 is defined by fMAX1 = 0.05/(td(OFF)I+ td(ON)I).
Deadtime (the denominator) has been arbitrarily held to 10%
of the on-state time for a 50% duty factor. Other definitions
are possible. td(OFF)I and td(ON)I are defined in Figure 25.
Device turn-off delay can establish an additional frequency
is important when controlling output ripple under a lightly
loaded condition.
fMAX2 is defined by fMAX2 = (PD - PC)/(EOFF + EON2). The
allowable dissipation (PD) is defined by PD = (TJM - TC)/RJC.
The sum of device switching and conduction losses must
not exceed PD. A 50% duty factor was used (Figure 3) and
the conduction losses (P C) are approximated by
PC = (VCE x ICE)/2.
EON2 and EOFF are defined in the switching waveforms
shown in Figure 25. E ON2 is the integral of the
instantaneous power loss (ICE x VCE) during turn-on and
EOFF is the integral of the instantaneous power loss
(ICE x VCE) during turn-off. All tail losses are included in the
calculation for EOFF; i.e., the collector current equals zero
(ICE = 0).
HGTG12N60A4D, HGTP12N60A4D, HGT1S12N60A4DS Rev. B