Professional Documents
Culture Documents
2.1. Fundamentals of copper and copper alloys 9 6.1 Hot-air solder levelling of printed circuit boards 48
2.2 Filler materials 10 6.2 Strip tinning 49
2.2.1 Soft solder 11 6.3 Fabricating heat exchangers from copper 49
2.2.2 Brazing filler metals 13 6.4 Manufacture of compact high-performance
2.3 Soldering or brazing pure copper 16 radiators from copper 49
2.4 Soldering / brazing copper alloys 18
2.4.1 Low-alloyed copper alloys 18 7. Terminology 50
2.4.2. High-alloyed copper alloys 22
8. Appendix 51
3. Design suitability for soldering/brazing 26
References 57
4. Soldering and brazing methods 29
Index of figures 58
4.1 The soldering/brazing principle 29
4.2 Surface preparation 30 Index of tables 59
4.3 Surface activation 32
4.3.1 Fluxes 33
4.3.2 Protective atmosphere / Shielding gases 35
4.4 Applying the solder or brazing filler metal 36
4.5. Soldering and brazing techniques 37
4.5.1 Soldering with soldering iron 38
4.5.2 Dip bath soldering or brazing 38
4.5.3 Flame soldering or brazing 40
4.5.4 Furnace soldering or brazing 40
4.5.5 Electric resistance soldering or brazing 43
4.5.6 Induction soldering or brazing 44
4.5.7 Electron beam brazing 45
4.5.8 Arc brazing 45
4.5.9 Laser beam soldering or brazing 46
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List of abbreviations
Abbreviations
Ag Silver
Al Aluminium
Ar Argon
Be Beryllium
C Carbon
CO2 Carbon dioxide
Cr Chromium
Cu Copper
H2 Hydrogen
H2O Water
HF Hydrofluoric acid
Mn Manganese
Ni Nickel
O2 Oxygen
P Phosphorus
Pb Lead
S Sulphur
Sb Antimony
Si Silicon
Sn Tin
Te Tellurium
Zn Zinc
Zr Zirconium
KUPFERINSTITUT.DE | 3
1. Introduction
Copper is a material that has been used by man for thousands of years because of its
special properties. As a native metal, i.e. one that is also found naturally in its pure me-
tallic form, copper was used early in human history because of its good malleability and
formability and because of its colour. Copper thus became mans first working metal.
With increasing industrialisation, other technique to be used, the choice of filler This booklet aims to reflect the current
properties of copper became important, material and any preparative or state of soldering and brazing copper and
such as its excellent electrical and thermal after-treatment procedures, need to be copper alloys in industrial applications, but
conductivity and its resistance to carefully selected on the basis of the does not claim to be complete. As research
atmospheric corrosion, and its generally materials to be joined. The factors that and development work in this field is
high resistance to chemical attack. influence the solderability or brazeability of continuing, enquiries should be directed to
Copper can form alloys with many a material are shown in figure1 and need the German Copper Institute or corre-
different metals and a large numbers of to be taken into account both individually sponding organisations.
alloy systems are now available that enable and in combination.
mechanical and technological properties, A component is considered solderable or
such as hardness, tensile strength, yield brazeable if the parent material is suitable
strength, chemical resistance, resistance to for soldering or brazing, and one or more
wear, to be modified in a controlled way. soldering or brazing techniques can be
If their particular physical and mechanical applied, and if the parts to be joined are
characteristics are taken into account, designed so as to facilitate the soldering/
copper and the majority of copper alloys brazing process and to ensure that the
show a high degree of solderability or soldered/brazed part is safe under the
brazeability. Fabrication process variables, conditions in which it is to be used [1].
such as the particular soldering or brazing
4 | KUPFERINSTITUT.DE
Chemical and metallurgical Physical
properties properties Mechanical properties
Solderability or
brazeability of a
workpiece
KUPFERINSTITUT.DE | 5
Like welding, soldering and brazing are Soldering and brazing do not involve any The following points should, however, be
important methods of thermally joining melting of the parent material, i.e. of the noted: the strength of a soldered or brazed
materials, typically metals. As it is the surfaces to be joined. Instead, the joint is typically not as great as that of the
resulting joint irrespective of the method workpieces are joined by introducing an parent material; the parent metal and the
used to make it that ultimately deter- additional molten metal, the filler metal, solder/braze metal have different chemical
mines the properties of the part being possibly in combination with a flux and/or potentials; there is a risk of chemical
fabricated, the two methods are classified in a protective gas atmosphere [4]. corrosion due to the presence of flux
(see e.g. [3]) in terms of the chemical residues; design restrictions may be
nature of the joint, the chemical composi- Some of the advantages of soldering or relevant because of factors such as narrow
tion of the parent metal (or metals) and brazing compared to other joining soldering/brazing gaps and tight dimen-
the type of filler material used, if any. Both methods are: [5] sional tolerances at the joint. Extensive
welding and soldering/brazing lead to the soldering/brazing enables dissimilar preparatory and after-treatment proce-
formation of a metallic joint, however the materials to be joined; dures are often required, such as degreas-
chemical composition of these joints differ. ing, etching, removal of flux residues, etc. [6].
Whereas a welded joint has the same as less heat is applied in the joining The related joining techniques of soldering
chemical composition as that of the two process, soldered or brazed parts tend and brazing are distinguished in the
identical parent metals being joined, the to exhibit greater dimensional accuracy DINISO857-2 standard by the liquidus
use of a filler alloy in a soldering or brazing and less distortion; temperature of the filler metal used. In
procedure means that the soldered or multiple soldered/brazed joints can soldering, the liquidus temperature of the
brazed joint has a different chemical be created on a single workpiece in a filler metal is below 450C; in brazing it is
composition to that of the parent single operation; above 450C. Up until February 2007,
materials. A soldered or brazed joint intricate assemblies can be soldered/ high-temperature brazing (at temperatures
comprises the heat-affected parent brazed without damage; above 900C) was defined in the earlier
materials, the diffusion/transition phase and now withdrawn DIN8505 standard.
soldered/brazed joints exhibit good
and the solder/braze metal. The solder Today, high-temperature brazing is
thermal and electrical conductivity; and
metal or braze metal can be formed by the classified simply as brazing.
action of heat either with or without a as soldering/brazing directs less heat
filler material. into the joint than welding, there is
less residual stress and distortion in the
component.
Brazed joint
Cu Ag
Diffusion zone
Heat-affected zone
Figure 2 Example of a brazed copper-silver joint.
(Note that no filler metal was used; the alloy Ag72Cu28 is formed by diffusion during the brazing process.)
6 | KUPFERINSTITUT.DE
Both physical and chemical processes are Heat is applied to melt the filler metal and
1,2 1
involved in soldering/brazing. Soldering/ any flux being used. The method used to
brazing joints are created through surface heat the parts to be joined will depend on
chemical reactions and diffusional processes the type of join to be created (see 1,3 2,3 2
of the liquid filler metal and the solid parent Section4.3). Fluxes serve to activate the
material. The soldering/brazing mechanism surfaces to be joined. The molten filler
comprises the following steps: [7] metal will only be able to wet the surfaces 3
1. Heating of the parts to be joined to be joined if they are clean and free from
oil, grease and other surface deposits. The
2. Surface activation, e.g. by a flux or a wetting process is also influenced by 1 Surrounding vapour phase
shielding gas capillary action of the molten filler, 2 Molten filler
3 Parent material
3. Flow of filler metal and wetting the adhesion and diffusion processes between
Contact angle
molten filler metal flows into the gap the liquid phase and the parent material.
between the mating surfaces or spreads figure3 shows the wetting of the surface 1,2 Surface tension between molten filler and the
across the surface by the molten filler metal. The contact surrounding atmosphere
1,3 Surface tension between the solid base metal and
4. Formation of the solder/braze metal angle is determined by the interaction
the surrounding atmosphere
through (physical and chemical) inter- between the three surface tensions 2,3 Surface tension between molten filler and solid
action between the molten filler and involved in the wetting process: 1,2 base metal
the parent material (vapour-liquid surface tension), 1,3
(vapour-solid surface tension) and 2,3 Figure3 - Wetting of a metallic surface with a
5. Solidification of the liquid solder/braze liquid filler metal [7]
(liquid-solid surface tension).
metal.
= 0 30 > 90
The smaller the contact angle, the better does not melt, a diffusion zone is (the holding time) should be as short as
the wetting of the surface. Table 1 defines established in the wetted area. An alloying possible to prevent extensive alloying
the three regimes perfect wetting, element in the parent material and at within the parent metal or the formation
adequate wetting and dewetting in terms least one of the alloying elements in the of brittle phases in the transition zones.
of the corresponding contact angle. filler alloy combine to form a solid To achieve optimum strength in the
solution, a eutectic system or an soldered/brazed joint, the filler metal
After soldering or brazing, alloying intermetallic compound. Phase diagrams needs to remain in its liquid phase for
elements from the filler metal can be can be consulted prior to soldering/ several seconds so as to create a
found in the parent material and alloying brazing to determine whether any sufficiently deep diffusion zone [1] [6] [9].
elements from the parent metal are diffusion will occur between the metal
detectable in the filler metal. This change pairs. Diffusion is both time- and
in the chemical composition is referred to temperature-dependent. The time spent
as diffusion. Although the parent material at the soldering/brazing temperature
KUPFERINSTITUT.DE | 7
Figure 4 depicts the cross-section of a
locally heated soldered/brazed joint. The
parent material was heated only in the
region of the joint, as would be the case in
torch brazing or torch soldering. This
localised heating can increase the level of
residual stress within the part. If the whole
assembly is heated, as in furnace brazing
or furnace soldering, the result is lower
residual stress and less distortion. In this
case, the entire assembly is heated and
cooled uniformly, which means that the
heat-affected zone covers the entire
structure (i.e. all of the parent material).
An advantage of this approach is that
soldering/brazing can be carried out at
the same time as heat treatment
(e.g. precipitation hardening) of the
workpiece.
1 2 3 A B 4
1 Parent material
2 Parent material affected by the soldering/brazing process
3 Diffusion zone / Transition zone
4 Solder/braze metal
A Soldering/brazing seam
B Heat-affected zone W
t Component thickness 1 2 3 B
j Effective joint width
W Overlap or lap length
8 | KUPFERINSTITUT.DE
2. Material engineering fundamentals
2.1 Fundamentals of copper and Copper alloys may be classified in terms of Copper alloys are also classified as casting
copper alloys the treatment they have undergone: alloys, wrought alloys (e.g. strip, wire,
Copper is a non-ferrous metal with a Precipitation hardening alloys tubing, forgings) and sintered alloys. Some
density of 8.94kg/dm3. Copper has a (e.g. CuBe alloys) and of the best-known copper alloys are
face-centred cubic (fcc) crystal lattice brasses (copper-zinc alloys) and bronzes
structure and as such retains its excellent Work-hardened alloys (=cold-worked (copper-tin alloys), but alloys of copper
ductility and cold-working capacity down alloys), with nickel, manganese, aluminium, iron,
to low temperatures. Cold working copper or in terms of their chemical composition: beryllium, chromium and silicon are also
causes an increase in hardness (strain Single-phase materials ((e.g. pure Cu) common. It should be noted that the terms
hardening, work hardening). or alloys that exist as a solid solution brass, bronze, Gunmetal and nickel
Copper also exhibits high electrical and of the elements (e.g. CuNi alloys, sing- silver are not standardised, though these
thermal conductivity (the ratio of le-phase brass) and designations are still common commer-
electrical to thermal conductivity is cially and elsewhere.
constant) and shows good corrosion Multiphase materials (e.g. two-phase
resistance to a wide variety of chemical brass alloys) [11].
media.
Material group Coefficient of Electrical Thermal conduc- 0.2% yield Tensile strength Elongation after
expansion conductivity tivity at 20C strength Rp0.2 Rm min. fracture
10 -6/K [MS/m] W/(m K) approx. N/mm N/mm A min. %
Additional information on these materials is available from the DIN Handbooks 456-2 and 456-3 and from the corresponding material data sheets issued by the German Copper
Institute (www.kupferinstitut.de)
Table 2 - Comparison of the physical and mechanical properties of copper, important copper alloys and unalloyed steel
KUPFERINSTITUT.DE | 9
2.2 Filler metals Phase diagrams can be consulted in order chemical composition (72% silver, 28%
Copper can form alloys with numerous to determine key temperatures (melting copper). The eutectic alloy solidifies like a
metallic elements. Many of these alloys are points, eutectic temperature), the mutual pure metal, i.e. there is no solidus
sold commercially as semi-finished solubility of the elements and the phases temperature and no liquidus temperature,
products or brazing and soldering filler present (solid solution, eutectic phases). It the molten mixture undergoes an
metals. Filler metals are available in a is important to realise that the phase instantaneous phase transition from the
variety of forms: wires, strips, preforms diagrams only apply under equilibrium liquid to the solid state. Solidification at
(see figure 5), powders, pastes, etc. conditions. The phase diagram for the 780C is significantly below the melting
Copper-based filler metals are character- binary silver-copper system is shown in points of the pure elements in the alloy (Cu
ised by their good flow properties, good figure 6. The phase diagram has a number and Ag). When the eutectic mixture
gap-filling ability and good ductility. of different phase fields that are separated solidifies, numerous crystal nuclei are
from one another by phase boundary lines. formed that hinder each others growth
Important phase boundary lines are the resulting in a uniform, finely divided
liquidus and the solidus curves. The microstructure with good mechanical
liquidus curve separates the higher lying properties. This is the reason why eutectic
region L, which represents the homogene- alloys, such as Ag72Cu28, are frequently
ous liquid phase and the liquid-solid phase used in technical and engineering
lying below. The solidus line represents the applications [13].
boundary between the solid phase and the
liquid-solid phase. The phase diagram for
the copper-silver binary system also shows
that there is a eutectic point at one specific
Figure 5 Filler metal preforms [11]
800 780C
tolerances of the workpiece
Stresses at the soldered/brazed joint
Operating temperatures and pressures 600
Ambient conditions at the soldered/
brazed joint (e.g. aggressive media)
Cost-efficiency 400
Work safety
10 | KUPFERINSTITUT.DE
2.2.1. Soft solder alloys crystals (diameter: approx. 1m; length:
The filler metals used for soldering melt at several millimetres) that can cause short
temperatures below 450C. The low circuiting and thus damage to electronic
strength of soft solder alloys and of the components. These crystals grow very
resulting soldered joint make these filler slowly so that they may take years to
materials suitable for applications that are appear. Possible reasons for whisker
subjected to low mechanical loads. They growth include residual stresses in plating
find most frequent use in electrical and layers due to the presence of organic
electronic applications. Soft solder alloys inclusions/contamination, and mechani-
can be selected using the cally induced stresses when tinned
DINENISO9453(2014) or the DIN1707- materials are processed. Lead-free
100(2011) standards. alternatives for soft solders include
tin-copper, tin-silver and tin-copper-silver
In the past lead solders were often used to alloys. It should be noted that the price of
solder copper pipes and tubing. The the solder increases the more silver it
presence of lead improves the flow contains. In its technical application note
characteristics of the solder, produces GW2, the German Technical and Scientific
bright smooth surfaces and requires only Association for Gas and Water (DVGW)
moderate soldering temperatures. stipulates the use of the solders Sn97Ag3
However, lead is environmentally harmful and Sn97Cu3 for drinking water applica-
and a recognised carcinogen. Since 1July tions. Antimony-free solders are used for
2006, the inclusion of lead in solders has fine soldering applications, antimony-con-
been prohibited by the RoHS Directive taining solders and low-antimony solders
2002/95/EC of the European Parliament are used for coarse soldering work in, for
and of the Council on the restriction of the example, the manufacture of condensers
use of certain hazardous substances in and cooling units, in the electrical industry
electrical and electronic equipment (later or for plumbing and installation work.
superseded by Directive 2011/65/EU in Zinc-based and cadmium-based soft
2011). At present, exceptions exist that solders are used but are less common.
permit the use of high-lead solders in Unlike brazing filler materials that contain
certain sectors, such as medical, security cadmium, cadmium-containing solders are
and aerospace technologies. In the not prohibited. However, as cadmium is
electronics industry, lead-free tin solders regarded as harmful to health, the accident
are now frequently used as a an alterna- prevention regulations (as published in
tive. There is, however, a risk of the Germany by the relevant employers
formation of tin whiskers on the surface of liability insurance associations) must be
the metal. Whiskers are filiform single observed [15].
KUPFERINSTITUT.DE | 11
Group Alloy designation in acc. with Melting range Average chemical Preferred Areas of use
(solidus/ liquidus) composition soldering method
in C
DIN
DIN EN ISO
1707-100
9453 (2014) Sn Pb Cu T I H D
Part 100 (2011)
Sn50Pb49Cu1 Electrical,
183/ 215 50 bal. 1,4 X
(162) electronics
S-Sn60Pb40Cu 183/190 60 bal. 0,15 X Electrical,
Soft solders Sn60Pb39Cu1 electronics,
with copper 183/190 60 bal. 1,4 X X PCBs
(161)
Installation of copper
Sn97Cu3
227/310 bal. 0,07 3 X X X X piping/tubing, metal
(402)
goods
Sn Pb Ag
S-Sn50Pb46Ag4 178/210 50 bal. 3,5 X X Electrical, electronics,
S-Sn63Pb35Ag2 178 63 bal. 1,4 X X X PCBs
Sn96,3Ag3,7
221/228 bal. 0,07 3,7 X X X X Installation of copper
(701)
piping/tubing;
Sn97Ag3 electrical
221/224 bal. 0,07 3 X X X X
(702)
Ag Cd Zn
S-Cd82Zn16Ag2 270/280 2 bal. 16 X X
Soft solders Electrical,
S-Cd73Zn22Ag5 270/310 5 bal. 22 X X
with silver electric motors
S-Cd68Zn22Ag10 270/380 10 bal. 22 X X
Ag Pb Others
Pb98Ag2 Sn Electrical,
304/305 2,5 bal. X X
(181) 0,25 electric motors
Pb95Ag5 Sn for high operating
304/370 5,5 bal. X X
(182) 0,25 temperaturesr
Sn Electrical,
S-Pb95Sn3Ag2 304/310 1,75 bal. X X
2,0 electric motors
bal. for high operating
S-Cd95Ag5 340/395 5 0,1 X
Cd temperatures
Sn Pb P
S-Pb50Sn50P 183/215 50 bal. X
Soft solders Electronics, PCBs,
S-Sn60Pb40P 183/190 60 bal. X
with particularly drag,
phosphorous S-Sn63Pb37P 183 63 bal. X wave and dip
soldering
S-Sn60Pb40CuP 183/90 60 bal. X
Sn Pb Others
Sn50Pb32Cd18 Fine soldering
145 50 bal. Cd18 X X X X
Other soft (151) and cable
solders S-Sn80Cd20 180/195 bal. 0,05 Cd20 X X X Electrical engineering
Sn95Sb5
235/240 bal. 0,07 Sb 5 X X X Industrial refrigeration
(201)
D-Dip soldering; H-Hot-iron soldering; I-Induction soldering; T-Torch soldering
Table 3 - Soft solders for copper and copper alloys as classified in the DINENISO9453 (2014) and DIN 1707-100 (2011) standards
12 | KUPFERINSTITUT.DE
2.2.2. Brazing filler metals As an alloying element, phosphorous of the parent copper to yield copper
The filler metals used to braze copper and shows low solubility in copper and is metaphosphate. By chemically reducing
copper alloys are typically copper-based, present mainly as the intermetallic the oxide layer in this way, the surface of
silver-based and brass-based alloys that compound copper(I) phosphide (Cu3P). The the parent copper becomes wettable.
are suitable for fabricating joints able to mechanical properties of copper-phospho- Silver alloy filler metals and copper-phos-
withstand higher levels of mechanical rous filler metals are determined by size, phorus filler metals with the appropriate
stress. Brazing temperatures are usually shape and arrangement of the Cu3P DVGW or RAL quality mark are used for
within the approximate range 500 particles, whose precipitation is a function brazing gas and water pipes. Silver alloy
1000C. DIN EN ISO 17672 (2010) divides of the phosphorous content. If the filler metals have relatively low melting
brazing filler metals into classes. The filler phosphorous content of the filler metal is temperatures and exhibit good wettability
metal classes suitable for brazing copper above 7%, the brazed structure cannot be and adequate corrosion resistance in a
are: Class Cu (copper), Class CuP cold worked. However, at temperatures of variety of media. Silver-copper-phospho-
(copper-phosphorus), Class Ag (silver about 300C and above, all copper-phos- rus filler metals are particularly well suited
alloy) and Class Au (gold alloy). phorus brazing filler metals exhibit for brazing copper, Gunmetal, copper-tin
Copper-zinc brazing filler metals are excellent formability. Filler metals with a and copper-zinc alloys. Up until 2011,
recommended for brazing pure copper and wide melting range (e.g. CuP179) can be cadmium was added to brazing filler
high-melting copper alloys. As the amount used for brazing assemblies with large metals to further lower the melting
of zinc in the brazing alloy rises to about joint clearances. As phosphorus has a temperature. Since December 2011, the
40%, the melting temperature decreases deoxidising effect, copper-phosphorus use of cadmium-containing filler metals
while the strength of the material filler metals tend to be self-fluxing and for brazing applications has been
increases, which is why brass filler rods can therefore be used to braze copper and prohibited by EU (Regulation (EU)
typically have a zinc content not exceeding to a certain extent bronze (CuSn6) 494/2011). They may only be used for
40%. Small amounts of silicon (0.1% to surfaces without requiring the use of a safety reasons or for defence or aerospace
0.2%) are often added to avoid the forma- flux. This is because at high temperatures applications.
tion of voids in the joint caused by zinc the phosphorus in the copper reacts with
vaporisation and hydrogen absorption. the oxygen in the air to form phosphorus
Torch brazing (also known as flame pentoxide, which itself then reacts with
brazing) is carried out using a slightly the Cu(I) and Cu(II) oxides on the surface
oxidising flame of moderate intensity [16].
KUPFERINSTITUT.DE | 13
Average chemical Melting range in C
Designation in acc. with composition Brazing Usage notes
(mass fractions in %) temperature in C
DIN EN 1044
DIN EN ISO DIN EN ISO Application of
(1999; previ- Sol. Liq. Parent material Gap width
17672 (2010) 3677 (1995) filler metal
ous standard)
Copper-based brazing filler metals Cu-Zn-alloys
B-Cu60Zn narrow
Cu 470a Cu 301 60Cu; 0,3Si; Rest Zn 875 895 Copper and
(Si)-875/895 or wide
copper alloys
hand-fed or
B-Cu60Z- 58*1 Cu/ 60*2 Cu; with a solidus
inserted
n(Sn)(Si) 0,175*1 Si/0,275*2 temperature narrow or
Cu 471*1 Cu 304*2 870 900 above 950C
(Mn)- Si; 0,35Sn; 0,15Mn; wide
870/890 bal. Zn
Copper-phosphorus brazing filler metals CuP-alloys
B-Cu92P- Preferentially
CuP 182 CP 201 bal. Cu; 7,8 P 710 770
710/770 copper,
Gunmetal,
B-Cu93P- hand-fed or
CuP 180 CP 202 bal. Cu; 7P 710 820 copper-zinc narrow
710/820 inserted
alloys (brasses),
B-Cu94P- copper-tin alloys
CuP 179 CP 203 bal. Cu; 6,2P 710 890 (bronzes)
710/890
Copper-phosphorus brazing filler metals Ag-CuP-alloys
B-Cu80AgP-
CuP 284 CP 102 15Ag; 5P; bal. Cu 645 800 Copper, narrow
645/800
Gunmetal,
B-Cu89AgP- copper-zinc hand-fed or
CuP 281 CP 104 5Ag; 6P; bal. Cu 645 815
645/815 alloys (brasses) narrow or inserted
and copper-tin wide
B-Cu92AgP-
CuP 279 CP 105 2Ag; 6,3P; bal. Cu 645 825 alloys (bronzes)
645/825
Silver alloy brazing filler metals Ag-Cu-Zn-alloys
B-Cu48ZnAg(Si) 12Ag; 48Cu; 40Zn;
Ag 212 AG 207 800 830 narrow
-800/830 0,15Si Copper and hand-fed or
B-Cu55ZnAg(Si) 5Ag; 55Cu; 40Zn; copper alloys narrow or inserted
Ag 205 AG 208 820 870
-820/870 0,15Si wide
Table 4 - Selection of copper-based filler metals for brazing copper and copper alloys
14 | KUPFERINSTITUT.DE
Average chemical
Designation in acc. with composition (mass Melting range in C Usage notes
fractions in %)
DIN EN 1044
DIN EN ISO DIN EN ISO Application of
(1999; Vor- Sol. Liq. Parent material Gap width
17672 (2010) 3677 (1995) filler metal
gngernorm)
Ag-Cu-Zn-Sn-alloys
B-Ag56CuZ- 56Ag; 22Cu; 17Zn; narrow hand-fed or
Ag 156 AG102 620 655 Copper alloys
nSn-620/655 5Sn inserted
B-Ag45CuZ- 45Ag; 27Cu; 2,5Sn;
Ag 145 AG 104 640 680
nSn-640/680 25,5Zn
B-Ag40CuZ- 40Ag; 30Cu; 2Sn;
Ag 140 AG 105 650 710
nSn-650/710 28Zn
B-Cu36AgZ- 34Ag; 36Cu; 2,5Sn;
Ag134 AG 106 630 730
nSn-630/730 27,5Zn
B-Cu36ZnAgSn- 30Ag; 36Cu; 2Sn;
Ag 130 AG 107 665 755
665/755 32Zn Copper and
B-Cu40ZnAgSn- 25Ag; 40Cu; 2Sn; copper alloys
Ag 125 AG 108 680 760
680/760 33Zn
B-Ag44CuZn-
Ag 244 AG 203 44Ag; 30Cu; 26Zn 675 735
675/735
B-Cu38Z-
Ag 230 AG 204 30Ag; 38Cu; 32Zn 680 765
nAg-680/765
B-Cu40Z-
Ag 225 AG 205 25Ag; 40Cu; 35Zn 700 790
nAg-700/790
Ag-Cu-Zn-Ni-Mn-alloys
B-Ag50CuZn-
Ni-660/705 hand-fed or
Ag 450 660 750 Copper alloys narrow
50Ag; 20 Cu; inserted
28Zn
Zinkfreie Ag-Cu-Lalloys (without zinc)
B-Ag- Copper and
Ag 272 AG 401 72Ag; 28Cu 780 780 narrow inserted
72Cu-780 copper alloys
Table 5 - Selection of silver alloy filler metals containing more than 20% silver for brazing copper and copper alloys
KUPFERINSTITUT.DE | 15
2.3. Soldering or brazing pure copper
Copper is very well suited to both
soldering and brazing. Care must be taken
to ensure that the oxide layers on the
surfaces to be joined have been properly
removed by mechanical or chemical
cleaning. The most commonly used
cleaning agents are: isopropanol, ethanol,
acetone, aqueous cleaner and nitric acid.
The soldering/brazing (or tinning) process
should take place immediately after the
surfaces have been prepared. Table 6
presents a selection of copper metals that
are particularly well suited to soldering or
brazing.
16 | KUPFERINSTITUT.DE
Soldering Components of electric motors that are refrigeration applications. In some cases,
Electronics is one of the main areas of subjected to high temperatures during the strength of a soldered lap joint between
application of copper soldering. The solders operation should be preferentially soldered two tubular parts is greater than that of a
most commonly used for soldering using soft solders that have a higher solidus brazed joint, as the brazing process can
electronic components are the tin-based temperature. Soldered joints made with reduce the strength of the copper parent
filler alloys as defined in DIN EN ISO 9453 these solders usually tend to show a higher metal. Soldered joints that will be subjected
(2014) and DIN 1707-100 (2011). The filler shear strength than those made with to higher temperatures should be made
alloys used for electrical and electronic tin-lead solders. The short-term shear with lead-free, thermally stable solders that
soldering applications are usually unleaded. strengths of lap joints made with these can withstand permanent temperatures of
Lead-containing solders may only be used solders have been shown to be about 20N/ up to 120C without damage.
in exceptional cases, as listed in the Annex mm. Lead-free soft solders are also Like wrought copper, copper casting alloys
to Directive 2011/65/EU of the European preferred when joining copper piping that as defined in DINEN1982 (2008) can be
Parliament and of the Council of 8June carries drinking water (see DVGW technical soldered without difficulty.
2011 on the restriction of the use of certain application note GW2) or when the
hazardous substances in electrical and soldered joint will be exposed to low
electronic equipment (RoHS). temperatures, e.g. in industrial
KUPFERINSTITUT.DE | 17
Brazing content of the parent copper when to form water. As hydrogen embrittlement
Brazing is used if the joint will be selecting the brazing method. Brazing is more likely to occur in torch brazing or
subjected to high mechanical and thermal oxygen-containing copper can cause when brazing in a reducing atmosphere,
stresses. When brazing copper, the filler hydrogen embrittlement, i.e. the formation induction brazing or vacuum brazing are
metals of choice are brass brazing alloys, of cracks and voids after contact with preferred. If torch brazing has to be
copper-phosphorus and silver brazing hydrogen-containing gases. Types of performed, the parent metal should be an
alloys. Silver brazing filler metals have copper susceptible to this problem include oxygen-free and/or deoxidised copper in
lower brazing temperatures, which reduces those used in electrical and electronic order to avoid hydrogen embrittlement.
the risk of forming coarse grains and applications. At high temperatures (above
enables faster brazing speeds 500C), hydrogen diffuses into the copper
It is important to consider the oxygen and reacts with the oxygen in the copper
2.4. Soldering / brazing copper alloys to -200C. Copper alloys not included in can be improved not only by suitable heat
A copper alloy consists of copper and at this group are CuZn5, CuSn2, CuSn4, treatment (precipitation hardening), but
least one other metal. Alloying produces a CuSn5, CuAl5As and CuNi2, as these are also by cold working. In contrast, the
new material with new properties. Some of classified as belonging to the copper-zinc, strength of the non-heat-treatable
the most well-known copper alloys include copper-tin, copper-aluminium and wrought copper alloys, such as CuAg0,10,
brass, nickel silver, bronze and Gunmetal. copper-nickel alloy groups. The composi- CuSi1 and CuSn0,15, can only be achieved
tions of low-alloyed coppers are specified by cold working [17]. Further information
2.4.1. Low-alloyed copper alloys in DIN CEN/TS 13388 (2013). A distinction on low-alloyed copper alloys is available in
Low-alloy coppers contain up to about is made between heat-treatable/hardena- the DKI monograph i8 (2012).
5% of alloying elements. One characteris- ble and non-heat-treatable/ hardenable
tic feature of these alloys is their wrought copper alloys. In the case of
behaviour at low temperatures, with no heat-treatable alloys, such as CuBe2,
embrittlement observed even down CuCr1Zr and CuNi1Si, material strength
18 | KUPFERINSTITUT.DE
Cold-worked (work hardened) alloys brazing should be kept as small as possible Copper-lead
so that any reduction in material strength The CuPb1P (CW113C) alloy contains between
Copper-silver is localised, though it is very important to 0.7% and 1.5% lead to improve its
Copper-silver alloys such as CuAg0,10 make sure that the brazing temperature is machinability. A trace phosphorus content in
(CW013A) and CuAg0,10P (CW016A) are attained across the entire area to be the range 0.003% to 0.012% ensures a high
characterised by their high electrical and brazed. level of deoxidation in the material and
thermal conductivity values. These alloys safeguards against hydrogen embrittlement.
are particularly well suited to applications Copper-iron CuPb1P has a very high electrical conductiv-
in which they are subject to continuous The copper-iron alloy CuFe2P (CW107C) ity. It is often used instead of pure copper
loads at high temperatures, as is the case contains between 2.1% and 2.6% of iron whenever both good machinability and good
in many electrical engineering applica- as well as the alloying elements phospho- electrical conductivity are required, such as
tions. The presence of silver raises the rus and zinc. This material exhibits high when fabricating screw-machine products
alloys softening temperature (to about thermal and electrical conductivity as well from a high-conductivity material. The
350C in an alloy with 0.1% Ag) without as high tensile strength and a high presence of lead means that this alloy shows
having a detrimental effect on electrical softening temperature. CuFe2P is therefore only limited weldability. CuPb1P is also not
conductivity. Copper-silver alloys are mainly used for electrical applications and well suited for brazing, but it can be soldered
standardised in DIN CEN/TS 13388 (2013) large quantities are used in the fabrication of successfully.
and are very well suited to both soldering lead frames in chip packages (see figure 8).
and brazing. As is the case with pure copper, soldering
is carried out using tin-lead soft solders
Soldering is best carried out with containing between 40% and 60% tin.
lead-free, tin-based solders (e.g. Sn99Cu1). Class 3.1.1 fluxes are recommended. For
Suitable fluxes for electrical applications electrical applications, lead-free tin-based
are those in the classes 3.1.1, 2.1.1 and 1.1.1 solders are used in combination with
and 1.2.3. Because of the high softening non-corrosive fluxes (e.g. 1.1.2 or 1.1.3).
temperature of the parent metal, soldering,
if performed correctly, does not have a If brazing cannot be avoided, it is recom-
detrimental effect on the high strength mended that a silver alloy brazing filler metal
achieved through cold working. with a low brazing temperature (e.g. Ag156)
is used together with a flux of type FH10.
Brazing, however, is carried out at higher
temperatures and thus produces a Copper-Sulphur
significant reduction in the strength of The copper-sulphur alloy CuSP (CW114C)
work-hardened copper-silver alloys. contains between 0.2% and 0.7% sulphur
Oxygen-free deoxidised alloys such as to improve the machinability of the alloy
Figure 8 Lead frames [17]
CuAg0,10P (CW016A) containing 0.001% while maintaining the materials high
to 0.007% of phosphorus or another electrical conductivity. The phosphorus
deoxidising element, like lithium, are the content of between 0.003% and 0.012%
most suitable parent metals for brazing Soldering can be carried out using tin-cop- makes the alloy resistant to hydrogen
applications. Generally speaking, brazing per solders that conform to DIN EN ISO embrittlement.
can be carried out with most silver alloy 9453:2014, such as Sn99.3Cu0.7, and using
brazing filler metals using a flux such as fluxes in class 3.1.1. For information on solders, see section on
FH10. If the electrical conductivity of the copper-silver.
brazed joint is particularly crucial, fluxless For brazing applications, silver alloy,
brazing can also be carried out using the copper and phosphorus brazing filler Silver alloy filler metals in combination
filler metal Ag272 (Ag72Cu28) under metals may be used in combination with with FH10 fluxes are recommended for
vacuum or in a reducing atmosphere. No FH10 fluxes. brazing applications. Brazing reduces the
flux is required when brazing with a strength of the cold-worked copper-sul-
phosphorus-containing brazing filler phur alloy back to that of the material in
metal. The heating zone created when its original not cold worked condition.
KUPFERINSTITUT.DE | 19
Copper-tellurium Heat-treatable/hardenable alloys Where possible, brazing should be carried
The copper-tellurium alloy CuTeP (CW118C) If cold-worked wrought copper alloys are out between the solution treatmentstage
with 0.40.7% tellurium and 0.0030.012% brazed, they tend to suffer some loss of and the precipitation hardening (heat
phosphorus has the same properties as the material strength in the region that is treatment) stage. In most cases, low-melt-
copper-sulphur alloy described above. heated. In the case of heat-treatable/ ing silver alloy filler metals with low
hardenable alloys, in contrast, certain brazing temperatures in the range
For information on solders, see section on types of brazing can be used without 650670C, such as Ag156, are used in
copper-silver. having a negative impact on the materials combination with low-melting fluxes that
mechanical properties. In fact in furnace contain high-activity fluorides. In order
By adding tellurium to the alloy composition, brazing, the brazing step and the heat not to compromise the later precipitation
the temperature at which tempering causes treatment can be combined into a single hardening stage, the brazing joint must be
a loss of strength in the material (stress operation. heated rapidly (it may even be necessary
relaxation resistance) can be raised to about to cool the areas surrounding the joint)
300C. If soldering is performed correctly, it Copper-beryllium and the part quenched once the filler
is possible to avoid any significant reduction The copper-beryllium alloys CuBe 1.7 metal has solidified. Rapid brazing is
in the strength of the cold-worked alloy. (CW100C) and CuBe2 (CW101C) with essential, as even a brazing time exceeding
1.62.1% beryllium exhibit average 30seconds will impair the ability of the
Brazing is usually carried out using silver electrical conductivity, very high tensile parent material to respond to precipitation
alloy filler metals and a type FH10 flux. strength in their hardened state and a high hardening. High-melting brazing alloys,
However, brazing reduces the strength of the degree of thermal stability. Copper-beryl- such as Ag272 (Ag72Cu28) which melts at
worked-hardened parent metal back to that lium is used in a wide variety of applica- 780C, are available for special cases.
of the material in its original untreated state. tions, such as in the manufacture of Though high, the melting temperature is
membranes, wear-resistant components always within the solution annealing
Copper-zinc and non-sparking tools. Parts that are to be range. Because of the greater propensity
The alloy CuZn0.5 (CW119C) contains soldered or brazed should be free of grease for oxidation at these temperatures,
between about 0.1% and 1.0% zinc and up and cleaned by acid pickling. Once the brazing under a shielding gas with a flux is
to 0.02% phosphorus. CuZn0.5 exhibits high parent alloy has been prepared, soldering or recommended. In order to ensure that the
electrical conductivity, has excellent cold brazing should be carried out immediately material can undergo subsequent
working properties, is resistant to hydrogen before the surfaces to joined become precipitation hardening, the brazed parts
embrittlement and is also well suited for both tarnished. If it is not possible to solder or are held at about 760C until the filler
welding and brazing. Its main area of braze the parent material immediately, the metal has solidified and are then quenched
application is therefore semiconductor surfaces to be joined should be plated with in water.
technology where the alloy is used for a thin protective coat of copper, silver or tin
manufacturing lead frames. As the alloy also that acts as a compound layer and improves Copper-beryllium-lead
exhibits good deep-drawing capabilities it surface wettability. The alloy CuBe2Pb (CW102C) has
also finds frequent use in the production of properties similar to those of CuBe2. The
hollow ware of all kinds and of heat Soldering is always carried out after the presence of lead does, however, improve
exchanger elements. hardening stage using solders with a flow the machinability of the alloy. CuBe2Pb
temperature below the typical softening can be soldered and brazed in a manner
For information on solders, see section on temperature of the copper-beryllium analogous to the copper-beryllium alloys.
copper-silver. parent metal. Soldering is typically carried
Rapid soldering does not lead to any out using the lead-free solder Sn60P-
softening of the cold-worked parent b39Cu1. Copper-containing solders such
material. as Sn97Cu3 can also be used. Depending
on the nature of the surfaces to be joined,
Brazing is usually carried out with silver alloy fluxes of type3.2.2 or 3.1.1 can be used.
filler metals and a type FH10 flux. Pre-tinned parts can be soldered using
rosin-based (colophony-based) fluxes of
type 1.1.2 or 1.1.3.
20 | KUPFERINSTITUT.DE
Copper-cobalt-beryllium are also being used increasingly for to avoid the time-dependent softening of
The alloy CuCo2Be (CW104C) with between connector plugs in the automotive the parent metal at the elevated tempera-
2.0 and 2.8% cobalt and 0.4 to 0.7% industry. tures used in brazing.
beryllium is a highly conductive cop-
per-beryllium alloy. Compared with the Here, too, soldering temperatures are Copper-zirconium
binary copper-beryllium alloys, CuCo2Be is below the precipitation hardening The copper-zirconium alloy CuZr
of slightly lower strength but exhibits temperature so that soldering does not (CW120C), which contains between 0.1%
more than double the electrical conductiv- have any appreciable effect on the and 0.3% zirconium, is insensitive to
ity while also having a significantly higher mechanical properties of the parent annealing in a hydrogen-containing
thermal stability. This alloy is used mainly material. Suitable solders are tin-lead atmosphere. The alloy exhibits a very high
to manufacture electrically conducting solders used in combination with fluxes electrical conductivity and stress
and thermally stressed springs, as well as in class3.1.1. relaxation resistance as well as superior
components for the plastic processing strength and creep rupture strength. At
industry and resistance welding elec- It is recommended that brazing is carried high temperatures, however, there is a risk
trodes. out using low-temperature silver brazing of oxidation due to the high affinity of
alloys together with fluxes of type FH10. zirconium for oxygen.
The information on soldering and brazing The strength of the parts being brazed
copper-beryllium alloys applies for the can be detrimentally affected at high No special aspects need to be taken into
most part also to copper-cobalt-beryllium. brazing temperatures or if brazing times account when soldering this alloy. As the
If it is important to retain the strength of are long. alloy has a high softening temperature,
the precipitation hardened state, high-melting solders can be used. If fluxes
low-melting silver alloy filler metals should Copper-chromium-zirconium of type 3.2.2 are not permitted because of
be used and soldering/brazing times kept The alloy CuCr1Zr (CW106C) contains corrosion, a flux of type 2.1.2, 2.2.2 or 1.1.2
short. 0.51.2% chromium and 0.030.3% should be used.
zirconium. In contrast to the binary
Copper-nickel-beryllium copper-chromium alloy, copper-chromi- If brazing is performed with a filler metal
Shortages in the supply of cobalt led to um-zirconium shows higher notch whose melting temperature is above the
the development of the alloy CuNi2Be strength at elevated temperatures and is softening temperature of copper-zirconium,
(CW110C), in which the cobalt in cop- often now preferred in applications in brazing times must be kept short to avoid
per-cobalt-beryllium alloy is replaced by which CuCr1 (CW105C) was formerly used. reducing the strength of the hardened
nickel. The mechanical and physical The alloy exhibits high strength at room parent metal. The softening temperature
properties of this alloy are equivalent to temperature, has a high softening rises the more zirconium is present in the
those of CuCo2Be. In terms of soldering temperature and improved creep rupture alloy; with 0.2% zirconium, the softening
and brazing, the two alloys behave very strength, even at elevated temperatures. temperature is around 575C.
similarly. The advantage of a CuNi2Be alloy
compared with a CuCo2Be alloy is that the As the heat-treated (i.e. precipitation
former exhibits slightly higher electrical hardened) parts have a high stress
and thermal conductivity values. relaxation resistance, soldering can
normally be carried out without any loss of
Copper-nickel-silicon material hardness. Suitable solders include
Copper-nickel-silicon alloys, such as the tin-lead solders, but more common
CuNi1Si (CW109C), CuNi2Si (CW111C), solders are the lead-free varieties, such as
CuNi3Si (CW112C) with between 1.0 and Sn95Ag5 , Sn97Ag3 or Sn95Sb5 in
4.5% nickel and 0.4 to 1.3% silicon, combination with a flux of type 3.1.1.
are materials that have average
electrical conductivity values but high For brazing applications, low-melting silver
tensile strengths. They are used brazing filler metals are used with type
primarily for the production of screws, FH10 fluxes. The brazing heating cycle
bolts and overhead line hardware. They should be kept as short as possible in order
KUPFERINSTITUT.DE | 21
Copper-chromium Copper-zinc alloys (Brasses) brittle when the parts to be joined are
The copper-chromium alloy CuCr1 Of all the copper alloys, the copper-zinc wetted with liquid solder. The risk of
(CW105C) contains between 0.5% and alloys (commonly known as brasses) are soldering embrittlement is particularly large
1.2% chromium. It is a wrought copper the most common and the most widely when the parts to be soldered are worked
alloy that because of its reduced notch used. The ubiquity of these alloys is due to or reshaped while they are being wetted
strength at elevated temperatures has now the appealing colour, the ease with which with the molten solder. The binary
been largely replaced by the copper-chro- they can be processed and their favoura- copper-zinc alloys with a pure phase
mium-zirconium alloy described above. The ble physical and strength properties. (alpha brasses), e.g. CuZn30 (CW505L), are
soldering and brazing properties of the Copper-zinc alloys are classified into more susceptible to liquid metal embrittle-
two alloys are very similar. The copper ment (LME) than those with an +
binary copper-zinc alloys (containing
casting alloy CuCr1-C (CC140C) continues structure, e.g. CuZn37 (CW508L). If in
no other alloying elements),
to be used, however, as it has proved very doubt, the stresses present in the parent
difficult if not impossible to produce copper-zinc-lead alloys that contain metal should be relieved by annealing the
copper-chromium-zirconium casting added lead and cold-worked parts before soldering.
alloys. The copper-chromium casting alloy complex (multi-element) copper-zinc Experience shows that this effectively
is rarely soldered or brazed, but its alloys that contain a number of additi- eliminates the risk of LME.
suitability for soldering and/or brazing is onal alloying elements.
no different to that of the wrought alloy. Soldering is carried out using fluxes in
Copper-zinc alloys are available as both classes 3.1.1, 3.1.2, 2.1.2 and 2.2.2.
The alloy can be soldered with lead-tin wrought and casting alloys.
solders or with higher melting lead-free Copper-zinc wrought alloys containing
solders in combination with a flux without Soldering additional alloying elements (special brasses)
detrimentally affecting the strength of the Despite the fact that the elements zinc and can be soldered without difficulty. One
parts being joined. tin are incompatible in solders, both binary exception to this rule is the aluminium-con-
Brazing is typically performed with and lead-bearing copper-zinc alloys (brass taining copper-zinc alloys where the higher
low-melting silver alloy filler metals. If the and leaded brass) can be soldered without oxygen affinity of the aluminium (propensity
filler alloy Ag156 is used and if brazing difficulty. If possible, copper-zinc alloys to form oxide films) can cause a number of
times are kept short, the loss of strength is should be soldered using low-antimony problems. However, fluxes can be used to
relatively small. solders (containing no more than 0.5% remove these aluminium oxide films.
antimony). If solders with a higher amount Brass casting alloys are rarely soldered.
2.4.2. High-alloyed copper alloys of antimony are used, tensile stresses in the Their ability to be soldered is very similar to
Copper alloys that contain more than 5% soldered structure may lead to the that of wrought copper-zinc alloys of
of alloying elements are referred to as formation of brittle antimony-zinc crystals comparable composition.
high-alloyed coppers. They are standard- causing solder embrittlement in both the
ised in DIN CEN/TS 13388 (2013). Examples joint and the parent material. Depending on
include the copper-zinc alloys (brasses), the particular application, tin-lead, lead-tin,
copper-tin alloys (bronzes) and cop- tin-copper and tin-silver solders can be
per-nickel-zinc alloys (nickel silvers). used. The solders Sn97Ag3, Sn95Ag5 and
Sn97Cu3 can be used for soldering
applications in the food industry, e.g. brass
fittings and taps for copper drinking water
pipe systems. In contrast to pure copper,
cold-worked brasses tend to exhibit
soldering embrittlement if extended
soldering (or brazing) times are used or if
large amounts of solder (or brazing alloy)
are applied. If there is a non-uniform
distribution of stresses at the joint to be
made, the parent material may become
22 | KUPFERINSTITUT.DE
Brazing Phosphorus-containing filler metals flow Copper-tin alloys (Bronzes)
Brazing is used to join brass workpieces freely on pure copper. When used to braze Copper-tin alloys (commonly known as
that are subjected to greater mechanical brass, however, these filler metals need to bronzes) are important materials in the
and thermal stresses. The risk of liquid be combined with a flux. Leaded cop- electrical engineering (e.g. electrical springs)
metal embrittlement can, however, be per-zinc alloys, particularly those with a and mechanical engineering (e.g. slide
avoided by stress relief annealing, by using lead content above 3%, are harder to bearings, bearing linings, membranes). They
low-melting brazing alloys and by braze than the binary alloys and may well are classified into wrought alloys and casting
minimising external stresses. The brass exhibit brittle joints. With certain alloys.
brazing filler metals Cu470a and Cu680 limitations, leaded brasses can be brazed
are suitable for brazing binary copper-zinc using low melting silver brazing alloys and Soldering
alloys with low zinc content, as their a flux of type FH10. Copper-zinc alloys Like pure copper, copper-tin wrought alloys
brazing temperatures are below the solidus containing aluminium can be brazed can be soldered with little difficulty,
temperatures of the parent metals. without difficulty. If the alloy contains although surface wetting is not as rapid. In
Low-melting silver brazing alloys may also more than 1% aluminium, fluxes of type some situations (e.g. wave soldering), it is
be used depending on the brazing FH11 must be used. Brazing can be carried proves expedient to tin the surfaces to be
temperature and the required ductility at out with low-melting filler metals. If the joined beforehand with the lead-free solder
the joint. As a result of the heat generated parts are likely to be subjected to a Sn99Cu1. Soldering is normally carried out
during brazing, the strength of the brazed corrosive environment, silver brazing alloys using lead-free solders, such as Sn96Ag3Cu1
joint is lower than that of the parent with a higher silver content should be or Sn99Cu1.
metal. If the amount of overlap between used. For parts exposed to a marine
the surfaces being brazed is large enough, environment, brazing filler metals with a For fine soldering applications, fluxes in the
embrittlement will not be located at the silver content of about 4056% are classes 1.1.2, 1.1.1 or 1.1.3 may be used.
joint but in the peripheral annealed area recommended. Suitable filler metals For general soldering applications, fluxes in
(heat affected zone). In plumbing include Ag140, Ag155 and Ag244. The classes 3.1.1 and 3.1.2 should be used.
installations, fittings made from cop- VG 81245-3 (1991) standard lists all Bronze casting alloys are hardly ever
per-zinc alloy are typically brazed to non-ferrous heavy-metal filler metals for soldered, however, their solderability is very
copper pipes using the filler metals welding and brazing that are suitable for similar to that of wrought copper-tin alloys
CuP279, CuP179, Ag145, Ag134 or use in shipbuilding or in the construction of comparable composition.
Ag244 in combination with a flux of type of other floating equipment [19]. The
FH10. US-AWS5.8 specification recommends the Brazing
use of the nickel-bearing silver brazing Brazing copper-tin wrought alloys also tends
alloy BAg-3 (50% silver) for marine to cause softening in the joint. The filler
applications. However, BAg-3 contains metals of choice are low-melting silver
cadmium, which is prohibited in the brazing alloys, such as Ag156. For capillary
European Union by EU Regulation brazing applications copper-phosphorus filler
494/2011. A cadmium-free alternative is, metals such as CuP179 or CuP182 are used.
for instance, Ag450. The brazing of If other filler metals are used, there is a risk
copper-zinc casting alloys is carried out in of localised melting of the parent material
the same way as brazing the correspond- and associated embrittlement through the
ing wrought alloys. formation of coarse grains. For brazing
temperatures below 800C fluxes of type
Selected areas of use FH10 are appropriate; above 800C, fluxes of
Figure 9 Metallographic longitudinal section through a Soldered/brazed components made from type FH20 are preferred. Castings from
brazed joint between a pipe and a pipe fitting copper-zinc alloys are fabricated in very copper-tin alloys that do not contain more
(filler alloy: Ag-CuP) [18]
large volumes for a very wide range of than 1.5% of lead are well suited to brazing
applications in the electrical and automo- with silver brazing filler metals. For parts
tive industries, communications and exposed to marine environments, the same
domestic appliance technologies, and for recommendations apply as for copper-zinc
electrical and mechanical systems. alloys (see section on the brazing of
copper-zinc alloys above).
KUPFERINSTITUT.DE | 23
Copper-nickel-zinc alloys (Nickel silvers) Copper-nickel alloys (Cupronickels) copper as the filler metal. Generally,
Copper-nickel-zinc wrought alloys (also Copper-nickel alloys (also known as however, copper-based filler metals, such
known as nickel silvers) are used in cupronickels) are some of the most as Cu470a to Cu680 or Cu681, are used
electrical engineering applications (for corrosion-resistant copper materials in combination with fluxes of type FH21,
springs), in the construction industry, in known. The wrought alloys are important or silver brazing alloys are used with fluxes
precision engineering e.g. as spectacle materials in marine construction (particu- of type FH10 that prevent oxidation at the
temples and hinges, in the arts and crafts larly for condensers and undersea piping), brazing surfaces. The filler metals should
sector, and for jewellery. The casting alloys in the plant construction sector and in the be phosphorus-free in order to avoid
are used, for instance, for marine electrical engineering sector (e.g. as embrittlement. For iron-bearing cupronick-
hardware, fixtures and fittings, and cast resistance wire). In addition to marine els, brazing is usually carried out with the
ornamental ware. The solderability of the applications, cupronickel casting alloys are filler metals Cu773 and Ag244.
copper-nickel-zinc casting alloys is very used in the mechanical engineering and CuNi13Sn8 is a CuNiSn alloy with higher
similar to that of the corresponding chemical industries. nickel and tin content that is used for
wrought alloys. manufacturing high-quality, thin
Soldering lightweight spectacle frames with
Soldering The solderability of these alloys is similar excellent flexibility and is brazed using
Soldering is best carried out either with to that of pure copper. The somewhat silver alloy filler metals. For marine
lead-tin solders or with lead-free Sn97Ag3 sluggish wetting of these alloys with soft applications, the brazing filler metal
or Sn95Ag5 solders, as they have better solders can be improved by the addition of should have a silver content of about 40%
bonding and wetting characteristics. The a flux. In particularly difficult cases, the to 56%. The VG 81245 Part3 (1991)
temperatures reached during soldering are surfaces to be joined should be pre-tinned. standard Filler metals for welding and
not high enough to cause any softening of Suitable solders are the lead-free tin-silver brazing applications in shipbuilding and
the work-hardened parent material. For and tin-copper solders, such as Sn95Ag5, the construction of other floating
wetting to be successful, the joint to be Sn97Ag3 or Sn97Cu3. Compared to the equipment [19], specifies the use of the
soldered must be free of grease and leaded tin solders used previously, the silver brazing alloys Ag140, Ag155 and
oxides. To facilitate optimum wetting, the lead-free solders exhibit improved Ag244 as defined in the ISO 17672 (2010)
surfaces to be soldered should be prepared hardness, higher corrosion resistance and standard. For marine applications, the
by very careful acid pickling (e.g. with a greater temperature stability. Fluxes of US-AWS 5.8 specification recommends the
10% sulphuric acid solution) and type 3.2.2 or 3.1.1 are appropriate. In use of the nickel-bearing silver brazing
degreased. Strongly activating fluxes of electrical applications, copper-nickel alloys alloy BAg-3 (50% silver). BAg-3 is a
type 3.2.2 or 3.1.1 should be used.. are frequently pre-tinned or pre-silvered, cadmium-containing brazing filler metal;
then soldered with rosin-based (colopho- the cadmium-free alternative is the filler
Brazing ny-based) fluxes of type 1.1.2 or 1.1.3. The metal Ag450 as defined in DIN ISO 17672
Copper-nickel-zinc alloys can be brazed alloy CuNi9Sn2 (CW351H), which is used (2011). A brazing flux of type FH11 is
with silver-bearing brazing filler metals. particularly for the fabrication of spring recommended. The brazeability of the
The most commonly used brass filler metal components, exhibits excellent tarnish cupronickel casting alloys is similar to that
Cu681 has the same silver-grey colour as resistance and therefore very good of the copper-nickel wrought alloys of
the copper-nickel-zinc parent metal. solderability even after storage for a long comparable composition.
Suitable fluxes are those of type FH10. If period. Higher-melting solders are used for
the parts are brazed in a furnace, there soldering electrical resistors that are
may be some deterioration in the hardness exposed to elevated temperatures. The
characteristics achieved through prior cold cupronickel casting alloys are rarely
working of the material. Leaded nickel soldered.
silvers have a tendency to crack when
annealed, particularly if they have been Brazing
significantly cold worked prior to brazing. The solidus temperature of the cop-
These alloys should therefore be brazed per-nickel alloys is higher than that of
using low-melting silver alloy filler metals copper. This is the reason why cop-
and heating should be carried out per-nickel alloys, particularly those with a
gradually. high nickel content, can be brazed with
24 | KUPFERINSTITUT.DE
Copper-aluminium alloys Copper-tin-zinc casting alloys Brazing and soldering of copper and
(Aluminium bronzes) (Gunmetal) copper alloys to themselves and to
Copper-aluminium alloys (also referred to The copper-tin-zinc casting alloys other materials
as aluminium bronzes) exhibit an (Gunmetal) exhibit low friction and good There are many practical applications in
exceptionally high resistance to cavitation anti-seizure properties, as well as high which copper and copper alloys are joined
erosion and are some of the most resistance to cavitation, wear and to other metals. One of the most common
corrosion-resistant copper alloys known. salt-water corrosion. Typical uses include procedures involves brazing copper-based
Both the wrought and casting alloys are water taps, valve and pump housings, materials to steel. As steels and nickel
therefore indispensable materials in the fittings and sliding bearings. Depending on alloys can both form brittle phases, they
chemical and mechanical engineering the particular application, Gunmetal can be cannot be joined together by brazing with
industries. Brazing and soldering of soldered with selected tin-lead solders a CuP filler metal. The choice of brazing
copper-aluminium alloys always requires containing at least 60% tin. Fluxes from filler metal is determined by the parent
the use of fluxes to remove the highly the flux classes 3.1.1 and 3.1.2 are material of lower brazeability. When
chemically resistant oxide films. Cop- appropriate. In the plumbing sector, fittings designing the joint and the soldering/
per-aluminium casting alloys are rarely and tap components used in drinking water brazing method to be used, the different
soldered or brazed, however, their piping systems are soldered using lead-free properties of the materials to be joined
solderability or brazeability is very similar and antimony-free solders. Castings that (e.g. thermal conductivity, thermal
to that of wrought copper-aluminium contain less than 1.5% lead can be brazed expansion, specific heat capacity) must be
alloys of comparable composition. effectively using silver alloy brazing filler taken into account.
metals containing at least 30% silver and The increasing significance of metal/
Soldering fluxes of type FH10. Brazing of copper ceramic composites in industrial applica-
Copper-aluminium alloys are rarely tubing with flanges made of Gunmetal is tions has led to the study of these material
soldered, as the wettability of the parent common in the equipment manufacturing combinations and has driven the develop-
metal deteriorates as the amount of sector. Undersea piping is subject to the ment of appropriate soldering and brazing
aluminium in the alloy increases, making regulations of the classification societies, solutions. Copper and alumina (Al2O3) can
bonding difficult and necessitating the use which stipulate, for instance, that the now be brazed using active filler metals or
of special fluxes. If soldering is performed, brazing filler metals used must have a soldered with tin-lead solders. Active filler
it can be carried out using the solders silver content of around 50%. If Gunmetal metals generally contain the metal
Sn97Cu3 or Sn97Ag3; for applications in fittings are used in the copper piping for titanium, which reacts at the interface
which the parts will be subjected to higher drinking water supply systems, the filler between the filler metal and the ceramic,
temperatures, CdAg5 can be used. metals CuP279 or CuP179 in combination making the surface more amenable to
Cadmium-containing solders are, however, with a flux of type FH10 are recommended. wetting [9].
no longer readily available as they are
regarded as a health risk. Special fluxes for Copper-lead-tin casting alloys
aluminium alloys belonging to flux classes (High-leaded tin bronzes)
2.1.2 or 2.1.3 can be used. The leaded tin bronzes are important
engineering and bearing materials that are
Brazing rarely joined by brazing or soldering.
Brazing can be carried out without Soldering can be performed using tin-lead
difficulty provided that appropriate fluxes solders with 5060% tin and a flux of
are used. Suitable brazing filler metals are class 3.1.1 or 3.1.2. Brazing is possible using
the silver brazing alloys with low to low-melting silver brazing alloys (e.g.
medium brazing temperatures, such as Ag156) and a flux of type FH10, though
Ag156. For parts exposed to marine the brazeability of leaded tin bronzes is
environments, the same recommendations limited. If alloys with a higher lead content
given for copper-zinc alloys apply (see are brazed, very significant diffusion
section on brazing copper-zinc alloys should be expected.
above).
KUPFERINSTITUT.DE | 25
3. Design suitability for brazing
Design suitability for brazing is concerned In normal (narrow-gap) brazing, the gap between the surfaces to be joined (the faying or
with design characteristics that influence mating surfaces) should not be more than 0.5mm. If the distance between the surfaces is
the brazing process, such as the shape and larger, the joining technique is referred to as braze welding. Braze welding uses a larger
structure of the joint and the forces acting quantity of filler metal than normal brazing. Braze welding frequently involves single-V, square
on it. This requires giving consideration to and double-V butt joints The gap/joint widths for different joining techniques are shown in the
the operational stresses involved, the type following figure:
of parent material to be joined and the
brazing technique to be used. A distinction (Narrow-gap) brazing, gap <0.5mm Braze welding, gap >0.5mm
Brazing
in a protective gas
atmosphere
Vacuum brazing
Braze welding
A wider gap between the parts to
be joined, which is filled with filler Assembly gap Brazing gap Brazing seam
metal primarily by gravitational Narrow, mainly parallel gap Narrow, mainly parallel gap May be wider than the
spreading [9]. between the components to between the components to assembly gap due to
The liquid braze metal is held inside be brazed, measured at be brazed, measured at the surface melting.
the joint by surface tension. room temperature [10]. brazing temperature [10].
Table 9 - Difference between standard (narrow-gap) Table 10 - Distinction between the terms assembly gap, brazing gap and brazing seam
brazing and braze welding
26 | KUPFERINSTITUT.DE
200
50
500
100
KUPFERINSTITUT.DE | 27
When designing the assembly to be be configured so that the flux can flow Other factors that need to be taken into
joined, the direction of flow of the filler out again and any air can escape. In account when designing a soldered or
metal should be considered. There should general, the solders and filler metals used brazed joint are the detailed shape of the
be no discontinuities in the gap that and the solder/braze metal in the finished gap and the condition of the mating surfa-
would prevent the filler metal from joint are not as strong as the parent ces. Score marks and grooves on the
flowing and filling the joint area. The material. The joining surface should surfaces to be joined are generally
region around the joint should be therefore be as large as possible in order undesirable. If there is scoring on the
designed so as to minimise stress concen- to achieve a strong, secure join. This is surface, it is important that the score
tration factors, bending loads and frequently achieved by designing a lap or marks are aligned with the direction of
geometric notch sensitivity factors. Shear insertion joint. Other geometrical variants flow of the molten filler metal. Any
stressing of soldered/brazed joints is of soldered/brazed joints are listed in component after-treatment procedures
beneficial. If a flux is used, the gap must table11. should also be taken into account when
designing the brazing joint and/or
assembly. Any residual flux, binder or
solder mask should be readily removable.
= 0 / 180 0 < < 90 = 90 90 < < 180 As with welded joints, the fatigue strength
of a brazed or soldered joint is enhanced
Square butt joint Inclined joint T-joint Inclined joint
when there are no sharp changes in the
cross-section and the joint is smoothly
contoured (e.g. by forming a concave
fillet). The rules governing the symbolic
Suitable for Angular or Angular or Angular or
representation of brazed and soldered
soldering/ corner joint corner joint corner joint
joints can be found in DIN EN 22553
Possible brazing and (1997) [6].
soldered/brazed braze welding
joints Relatively
small joining Suitable for Suitable for Suitable for
surfaces soldering/ soldering/ soldering/
brazing and brazing and brazing and
braze welding braze welding braze welding
Relatively small Relatively small Relatively small
joining surfaces joining surfaces joining surfaces
Lap joint
Insertion joint
Parallel or fully
overlapping joint
Suitable for
Preferred Large soldering/brazing surfaces
soldering/
soldered/brazed ensure a strong joint
brazing and
joints
braze welding
Large joining
surfaces can
be achieved
Preferred joint
type for sheet
metals and
tubing
Table 11 Geometric configurations of common soldered/brazed joints [6]
28 | KUPFERINSTITUT.DE
4. Soldering and brazing methods
4.1. The soldering/brazing principle figure 13 illustrates the characteristic The reflow temperature of the solder/braze
Melting the solder or brazing filler metal temperatures and times during soldering/ metal corresponds roughly to the melting
requires the uniform application of brazing and the terminology as defined in temperature of the solder/filler metal
thermal energy to the entire soldering/ DIN ISO 857-2 is explained in Section6. applied. If the soldered/brazed assembly
brazing zone. A specific temperature-time The thermal profile shown below is typical will be subjected to high service stresses, a
profile is followed that consists fo the of that observed during furnace soldering higher reflow temperature is desirable in
following sequence of steps: [6] or furnace brazing. order to optimise the quality of the
1. Melting the flux soldered/brazed joint. This can be achieved
For reasons of cost, the holding time at by significantly extending the holding
2. Activating the surface the soldering/brazing temperature is temperature, which leads to a diffusi-
3. Melting the solder or filler metal usually restricted to the time needed to on-driven change in the chemical
4. Wetting of mating surfaces by the achieve a uniform temperature in the composition of the solder/braze metal and
molten solder or filler metal assembly. After a relatively short holding thus to a shift in the solidus and liquidus
time, the assembly is allowed to cool in temperatures of the solder/braze metal.
5. Flowing of solder or filler metal into the
still air at room temperature or under The soldered/brazed joint can then be
soldering/brazing gap
defined cooling conditions. During this subjected to diffusion annealing at the
6. Filling of soldering/brazing gap by the period the soldered/brazed metal solidifies. soldering/brazing temperature [1].
solder or filler metal.
Soldering/brazing temperature
Dwell temperature
Temperature [C]
Dwell time
Holding
Heating time time Cooling time
Soldering/brazing time
Total time
Time
Figure 13 - Characteristic temperatures and times during soldering/brazing [20]
KUPFERINSTITUT.DE | 29
4.2. Surface preparation and other auxiliary materials; the structure Table13 contains recommendations for
In order to achieve a high quality soldered/ and condition of the mating surfaces; and pickling the surfaces of copper and
brazed joint between metallic materials, heat transfer during the soldering/brazing copper alloys. The surfaces must always
the mating surfaces need to carefully process. Soldering/brazing should be be degreased prior to pickling and rinsed
prepared. Surface preparation can involve carried out as soon as possible after the thoroughly afterwards. Further recom-
chemical, mechanical or thermal cleaning surfaces have been prepared. Once mendations regarding surface prepara-
procedures or a combination thereof (see cleaned, the parts should be protected tion techniques are described in the DVS
table 12 for a list of available procedures). from recontamination and from contact technical leaflet 2606 (2000) [21].
The parts to be soldered or brazed must be with sweaty hands. Parts should be stored
clean and free from any residues that preferentially in an inert and dry atmos-
might inhibit wetting, such as oxides, oil, phere. The following procedures can be
grease, dirt, rust, paint, cutting fluids, etc. used to prepare the surfaces of copper and
(see figure 14). Furthermore, the wetting copper alloys. Which procedure(s) to adopt
behaviour of the solder or brazing filler will depend on the type and extent of the
metal also depends on the following contamination, the cleanliness requirements
factors: the properties of the parent and the geometry of the surfaces to be
material, the solder or brazing filler metal cleaned [21].
Degreasing with commercially available solvents (e.g. isopropanol, acetone); Steam degreasing
with hydrocarbons and chlorinated hydrocarbons;
Chemical cleaning Cleaning with aqueous alkaline solutions; emulsion cleaning using mixtures of hydrocarbons, fatty
acids, wetting agents and surface activators;
Pickling treatments using acids, acid mixtures or salts (see table13)
30 | KUPFERINSTITUT.DE
Parent material Notes Formulation
Table 13 - Recommended pickling solutions for copper and copper alloys that will undergo fluxless brazing [21]
KUPFERINSTITUT.DE | 31
4.3. Surface activation take place. This process is known as
Proper contact between the solder or surface activation. Some of the most
brazing alloy and the surface of the common methods of surface activation
parent metal is an essential requirement are the use of fluxes, soldering/brazing in
in any high-quality soldered or brazed a reducing atmosphere or soldering/
joint. However, sufficient contact brazing in a vacuum. Other techniques
between the molten solder or filler metal include soldering/brazing under an inert
and the surface is not always established shielding gas, arc brazing, and soldering
in all cases. Figure 14 represents a methods involving mechanical activation
realistic cross-sectional view through the of the faying surface, as in ultrasonic
surface of an engineering metal. The dirt, soldering or abrasion soldering. Surface
contamination and adsorbed layers activation always involves the absorption
present on the surface have to be of solid, liquid and gaseous layers.
removed before soldering or brazing can
32 | KUPFERINSTITUT.DE
4.3.1. Fluxes about 50C below that of the solder or Solder fluxes (classified according to
According to DIN ISO 857-2 (2007), a flux brazing filler metal as this ensures that DIN EN 29454-1 (1994)
is defined as a non-metallic material the surface has been activated before it is A flux is normally required for soldering
which, when molten, promotes wetting by wetted and before the solder or filler operations. Solder fluxes are classified in
removing existing oxide or other metal starts to flow. As there is no terms of their chemical composition [4].
detrimental films from the surfaces to be universal flux, the composition of the flux
joined and prevents their re-formation must be carefully selected for the In practice, solder fluxes area also
during the joining operation [10]. Fluxes proposed joining operation [1]. A categorised according to their chemical
are available as powders, pastes, liquids distinction is made between fluxes for function.
or as solder-flux mixtures. soldering DIN EN 29454-1 (2004) and
The melting range of the flux should be fluxes for brazing DIN EN 1045 (1997).
Table 14 - Solder fluxes (classified according to DIN EN 29454-1 (1994) (1994) [23]
KUPFERINSTITUT.DE | 33
Brazing fluxes (classified according to molybdenum and tungsten. Fluxes in
DIN EN 1045 (1997) classFL are used when brazing light
The DIN EN 1045 (1997) standard metals, such as aluminium and aluminium
classifies brazing fluxes into two classes: alloys. Only classFH fluxes should be
FH and FL. Class FH fluxes are used in the used for brazing copper and copper
brazing of heavy metals, such as steels, alloys.
stainless steels, copper and copper alloys,
nickel and nickel alloys, precious metals,
Effective
Type Brazing temperature Description / Areas of use After-treatment
temperature range
34 | KUPFERINSTITUT.DE
Table 17 lists substances that are contained covered by the legislation, boric acid will be cation and labelling rules for brazing fluxes
in a number of fluxes and which, since generated in the brazing torch flame and containing boric acid, borax pentahydrate
1December 2010, are classified as will deposit on the workpiece and in the or boron trioxide is available (in German) in
Category1B reproductive toxins if present workplace. Boric acid deposits are toxic. For the DVS technical leaflet 2617 [26]. Table 17
in the amounts given in the table. Products this reason, brazing operations involving a also specifies the concentrations above
affected must be marked with the symbol product containing trimethyl borate are which the product is classified as hazardous.
T and the R phrases R60 and R61. subject to the same regulations that apply
Although products containing trimethyl to brazing fluxes that contain boric acid
borate (EC No.: 204-468-9) are not directly [26]. Further information on the reclassifi-
233-139-2
Boric acid 5,5 %
234-343-4
215-540-4
Borax anhydrate 235-541-3 4,5 %
237-560-2
reducing inert
KUPFERINSTITUT.DE | 35
4.4. Applying the solder or brazing by dipping the parts into the molten filler
filler metal material, or by positioning filler metal
In addition to selecting the correct method preforms where the joint is to be made.
of surface cleaning and surface activation, Filler metals are available in a variety of
choosing the most suitable way to forms (e.g. wire, rod, strip, film, paste) and
introduce the filler metal into the joint is sizes to suit the design and dimensions of
also an important aspect of the soldering the soldering or brazing gap.
or brazing process. In most cases, the
application of the filler metal is dictated by Table 19 shows a number of different ways
the design of the assembly. The solder or of introducing the filler metal to the joint.
brazing alloy can be introduced manually,
Table 19 - Different ways of introducing the filler metal to the soldering or brazing joint (based on [10]
36 | KUPFERINSTITUT.DE
4.5. Soldering and brazing techniques method of application of the filler
Soldering and brazing techniques can be metal (e.g. dip soldering/brazing,
classified in different ways, such as by the soldering/brazing with filler metal
heating method (energy source) used (see applied to the joint)
table 20). Other classification schemes are method of fabricating the joint (e.g.
based on the: manual, partially automated or fully
nature of the soldering/brazing joint automated soldering/brazing)
(cladding, (narrow-gap) soldering/braz-
ing, braze welding)
method of oxide removal
(e.g. soldering/brazing in a protective
gas atmosphere, vacuum soldering/
brazing, flux-assisted soldering/brazing)
Dip soldering
Soldering using a liquid heat source Wave soldering
Drag solderingn
Soldering
Soldering with a gaseous heat source Flame soldering
KUPFERINSTITUT.DE | 37
4.5.1. Soldering with soldring iron tion of the parts and greater erosion of
Hot-iron soldering is a soldering technique 4 the parent material. The workpiece is
in which the thermal energy is supplied by 3 typically immersed for between 20 and
a solid medium. 2 60seconds. Dipping speed needs to be
The joint is heated and the solder is melted 1 carefully controlled. It should be selected
by applying heat from a hot iron that is so that the workpiece reaches the
controlled either manually or by a soldering or brazing temperature during
machine. Hot-iron soldering is not suitable all stages of the dipping process. A visible
for fabricating narrow-gap joints with sign that the correct dipping speed has
large overlap zones. been chosen is the presence of a concave
1. Conductor 2. Printed-circuit board meniscus at the interface of the molten
Most soldering irons are equipped with a 3. Tip of soldering iron 4. Flux-cored solder solder of filler metal and the workpiece.
built-in electrical heating element or with Large parts should be preheated prior to
Figure 15 - Example of hot-iron soldering on a
a small tank containing a combustible gas printed-circuit board (based on [10]) dipping to avoid too great a drop in the
such as natural gas, acetylene or propane. bath temperature when the workpiece is
The heat capacity and the shape of the immersed. Dip brazing is typically used in
soldering iron and its tip (also known as the manufacture of condensers, cooling
Advantages
the bit) must be suitable for the assembly units and metal vessels [16].
Low cost
to be soldered. The more pointed the tip is,
Reproducible
the easier it is to access the joint, though
Suitable for hard-to-access 1
heat losses are also higher. Soldering iron
joints 3
tips have masses ranging from about 20g 2
Suitable for temperature-
to 1kg and used to be almost exclusively
sensitive components
made of copper due to its excellent
Good for single soldered joints
thermal conductivity and good wettability.
In high-volume soldering work, these
Disadvantages
copper tips would eventually dissolve in
Scaling on the iron tip due to
the tin solder and the tips would need to
high-temperature oxidation
be reconditioned or replaced. For this
Operators must have a high
reason, copper-containing solders and tips
degree of skill and manual dexterity
plated with other materials were devel-
oped. When soldering with lead-free 1. Workpiece 2. Concave meniscus
solders, the hot iron needs to be removed 3. Bath of molten solder or brazing filler metal
Table 21 - Advantages and disadvantages of
from the joint more quickly than with hot-iron soldering Figure 16 Dip soldering/brazing (based on [10])
leaded solders to prevent spiking or solder
pull-out, as the lead-free solders in use
today have different flow characteristics 4.5.2. Dip soldering or brazing Advantages
than the SnPb solders used previously. The he parts to be soldered or brazed are Fully automated
melting range of lead-free solders is mechanically cleaned and placed into Application and melting of solder
narrower than in lead solders so that position. Flux is then applied before the or filler metal in a single step
solidification occurs more rapidly [6]. assembly (workpiece) is dipped into a Cost-efficient
bath of molten solder or filler metal. The
The soldering time is usually less than temperature of the dipping bath should Disadvantages
60seconds. Depending on the specific be between 60K and 100K above the Can cause high thermal stressing
soldering application to be performed, liquidus temperature of the solder or filler of workpiece
between 15W and 2000W of thermal metal. Higher temperatures will lead to High maintenance
energy needs to be applied. The tip of the increased oxide formation on the surface
iron can reach temperatures in the range of the bath. Higher temperatures are also
200600C [6]. associated with a greater risk of distor- Table 22 - Advantages and disadvantages of dip
soldering or dip brazing
38 | KUPFERINSTITUT.DE
Wave soldering source, the high reflectivity (up to 96%)
Wave soldering is chiefly used to solder of the shiny metallic components is not
electronic components onto printed conducive to heating and needs to be
circuit boards. taken into account when designing the
process. The actual soldering stage
The process comprises four stages with a occurs when the PCB assembly is
conveyor transporting the printed circuit transported through the solder wave
board (PCB) to the different zones. The zone. The final stage involves cooling the
process begins with flux being applied to PCB assembly in the cooling zone, either
the PCB assembly. In the second stage, naturally under ambient conditions or by
the PCB assembly is pre-heated using a forced cooling. [27]. Experience has
convection heater or an infrared lamp to shown that the PCB assembly is best
compensate for the different heat drawn across the surface of the solder
capacities and thermal expansion inclined at an angle of 7 [10].
coefficients of the materials on and in
the PCB. PCBs contain epoxides, which as Drag soldering is a variant of wave
poor conductors of heat make it difficult soldering. In drag soldering, the solder is
to raise the temperature of the assembly. applied not by contact with the solder
The PCB laminate therefore acts to cool wave, but by immersion in a static solder
the surrounding metal components bath. The angle at which the assembly
making it impossible to heat the assembly enters and exits the bath is typically
uniformly up to the soldering tempera- between 8 and 10, and the immersion
ture. In addition, hot flux vapour causes a depth is usually about half the thickness
rise in temperature of the tempera- of the PCB. A rigid strip is used to remove
ture-sensitive electronic components. If the oxides (dross) from the surface of
infrared radiation is used as the heat the solder bath [10].
1
=7
1. Printed-circuit board
4 2. Dryer
3. Solder bath with solder wave
4. Wave fluxer or foam fluxer
7 Conveyor angle
KUPFERINSTITUT.DE | 39
4.5.3. Flame soldering or brazing work is available in the technical application reducing thermal stresses and distortion in
Flame soldering or brazing (or Torch notes GW2 and GW7 issued by the the workpiece. The temperature-time
soldering/brazing) can be performed by German Technical and Scientific Association profile is relatively easy to control.
hand or by machine. The heat is applied by a for Gas and Water (DVGW). For example, Workpieces with complex shapes and large
flame of combustible gas (e.g. acetylene). drinking water installations are subject to numbers of joints can be soldered or
The gas is fed to the torch head through a special requirements: copper piping larger brazed without difficulty. Additionally,
pressure regulator. The choice of torch than 28x1.5mm must only be joined by heat treatment and soldering/brazing can
depends on the workpiece, material and gas brazing [28] [29]. be carried out in a single operation. The
being used. The first stage involves applying solder or brazing filler metals should have
flux to the surfaces to be joined. The joint 2 a narrow melting range in order to prevent
1
gap must be dimensioned accordingly. The liquation and erosion [6].
parts to be soldered or brazed must be fixed
in position to prevent them from slipping. Furnace soldering or brazing carried out in
The workpiece should be pre-heated at the a controlled atmosphere (using inert gases
location of the joint and its immediate such as argon, helium or nitrogen, or
vicinity so that the solder or filler metal can reducing gases like hydrogen or carbon
flow easily. If the area to be soldered/brazed monoxide) is well suited to high-volume
is not hot enough, the solder or filler metal 3 soldering or brazing jobs in which multiple
will contract when it comes into contact joints need to be made, such as the
with the cold surface and no wetting will 1. Components to be joined fabrication of condensers, cooling units,
2. Flux and solder 3. Flame
occur. Pre-heating is done with a neutral or heat exchangers and in automotive
with a reducing or slightly reducing flame. Figure 18 Torch soldering (based on [10]) construction [6].
The solder or filler metal is fed to the joint Advantages A variety of furnace types are available,
in the form of a rod or wire. If the solder or Process can be easily mechanised including retort-type, batch-type and
filler metal is to be inserted into the joint Low equipment costs continuous-type furnaces. The tempera-
(e.g. as a pre-form), consideration must be ture in the furnace should be approxi-
given to the right type of solder or filler Disadvantages mately 50C above the relevant soldering
metal and to the design of joint. In general, Working with a naked flame or brazing temperature. It is important
the soldering time or brazing time should Components need to be held in that the surfaces to be joined are
not exceed three minutes. The flame should place with a jig thoroughly cleaned prior to furnace
not be aimed directly at the joint as this Time-consuming preparation soldering or brazing. Furnace soldering or
could damage the flux. Most fluxes need to and after-treatment of the brazing of brass components is only
be removed once the soldering or brazing workpiece possible if a flux is used [6].
process is finished. Copper-copper joints
are best made with phosphorus-containing Soldering or brazing in a vacuum furnace
Table 23 - Advantages and disadvantages of
solders or filler metals, as no flux is then torch soldering or torch brazing is a flux-free method of joining compo-
required. Appropriate solders can be found nents that need to meet exacting quality
in the following standards: DIN EN ISO 4.5.4. Furnace soldering or brazing specifications. It is commonly used in the
17672 (2010) for brazing filler metals; DIN Furnace soldering or brazing is nearly aviation, aerospace, electronics, automo-
1707-100 (2011) and DIN EN ISO 9453 always carried out either in a protective tive, machine tool, plant equipment
(2014) for soft solder alloys. Torch soldering gas atmosphere or in a vacuum; it is rarely construction, and power engineering
and brazing are used in numerous industrial done in an air atmosphere. industries. Vacuum furnaces also come in
sectors, including refrigeration and a variety of types. Examples include
air-conditioning, mechanical construction It offers a number of advantages over radiation-heated glass vessels, resist-
of small-scale and large-scale equipment, other soldering or brazing processes. If ance-heated and induction heated
plumbing and heating installations, and gas due consideration is given to the materials furnaces. Soldering or brazing is usually
and water installations. Information and workpiece geometries used, uniform carried out under a low to moderate
pertaining to gas and water installation heating and cooling can be achieved, thus vacuum (1mbar to 10-3mbar) or high
40 | KUPFERINSTITUT.DE
vacuum conditions (10-3...10-7mbar). In Medium Vacuum Reducing gas Inert gas Flux
the majority of cases, the heating power of
a vacuum furnace lies between 50kW and
500kW. Before any soldering or brazing Flux X X X
can take place, the heating chamber needs
to be cleaned and the components
Reducing gas X
carefully positioned within it. The
temperature of the furnace is then Inert gas O X
increased rapidly to about 50C below the
solidus temperature. The furnace is then Vacuum X
held at this temperature for a short time to
facilitate temperature equilibration. This is
followed by rapid heating to approximately X can be used simultaneously
2030C above the soldering or brazing O can be used sequentially
temperature of the solder or brazing filler Table 24 - Surface activation in furnace soldering or brazing
metal. Depending on the work being
carried out, the soldering or brazing
temperature must be held for a period of
520minutes. Process times can be
shortened by heating and cooling under a 3 4 5 6 7 8
protective gas atmosphere. In such cases, 2
the vacuum in the furnace chamber is 9
generated at higher temperatures [6]. 1
10
1. Infeed 2. Extractor hood 3. Exit port for protective gas 4. Pre-heating zone 5. tube port
6. Soldering/brazing zone 7. Cooling water 8. Cooling zone 9. Exit 10. Entry port for protective gas
Figure 19 Vacuum soldering/brazing furnace [30] Figure 20 - Schematic diagram of a continuous-feed furnace with an inert gas atmosphere (based on [6])
KUPFERINSTITUT.DE | 41
Reflow soldering of solder pastes containing, for example,
Reflow soldering is an important SnAgCu or SnAg alloys. In a reflow oven,
technique in the electronics industry. It is the solder in the solder/flux paste melts
a common method of attaching surfa- creating a material bond between the
ce-mounted components to printed electronic components and the circuit
circuit boards. The technique makes use board (see figure 21).
Condensation
Radiation Convection Conduction
(vapour phase)
Simultaneous
X X X
process
Simultaneous
X X
batch process
Sequential
X
process
Maximum
TP can be T can be control-
achievable TP can be control- TP is limited by the P
controlled led precisely
temperature Temperature can Temperature can led very precisely choice of medium
very precisely (max. hot-plate
relative to the slightly exceed TP slightly exceed TP (max. gas temp. (max. temp.
(max. gas temp. temperature
temperature TP on 350C) 260C)
350C) 350C)
the PCB assembly
Flexibility in
controlling the
High Low Very high Very high Medium Medium to low
temperature
profile
Component
Solder paste and Requires a flat,
Special specifications
No substrate must No No bare contact
requirements must be taken
be suitable surface
into account
The following heat sources may be used: light/radiation (e.g. infrared), convection (e.g. hot Table 26 - Comparison of the different reflow
soldering heating modes [31]
nitrogen), vapour-phase condensation (latent heat) and conduction. Table 26 lists some of
the characteristic properties of the various heat sources.
42 | KUPFERINSTITUT.DE
Convection reflow soldering in a nitrogen controlled externally by fans, blowers and soldering can also be done under vacuum.
atmosphere has gained in importance in injector nozzles. As can be seen in figure 22, Nevertheless, soldering faults can still
recent years. The nitrogen partially a convection reflow oven has multiple arise, such as solder skips, tombstoning
displaces the air from the reflow oven thus process zones that can be controlled (unbalanced solder melting and wetting
reducing the oxygen content in the individually [31]. behaviour at the mounting pads on
chamber. As nitrogen itself does not react different sides of the component), solder
chemically with the other elements present, No matter which type of reflow soldering bridges and solder balls [15] [31].
it effectively prevents oxidation on the oven is chosen, the reflow process is
metallic surfaces to be soldered and always composed of the following steps:
therefore improves the solder wetting pre-heating, solder reflow, and cooling. To
process. The convection of the hot gas is achieve pore-free soldered joints, reflow
KUPFERINSTITUT.DE | 43
4.5.6. Induction soldering or brazing Table 29 shows how the heat penetration
Induction soldering or brazing can be depth (or skin depth) in copper and brass
used to join all types of metal and varies with frequency. It is readily apparent
typically uses a flux in an air or that lower frequencies are more suited to
controlled atmosphere. The technique is heat generation at greater depths, while
primarily used, however, for copper, higher frequencies are better for processing
brass, steel and aluminium. The solder or at the workpiece surface.
brazing filler alloy selected should have
a narrow melting range or a fixed Material Temperature [C] Skin depth [mm] at the following frequencies:
melting point and good flow properties.
50 Hz 500 Hz 10 kHz 1 MHz
The cleaned joint is surrounded by a
single-turn or multi-turn water-cooled Copper 600 17 5,5 1,2 0,12
induction coil. The induction coil must
be shaped appropriately to fit the form Brass 600 26 8,5 1,8 0,18
of the workpiece. The technique is Table 29 - Skin depth as a function of operating frequency [32]
therefore particularly well suited for
rotationally symmetric parts. An AC Induction soldering/brazing offers a number temperature-sensitive parts. Drawbacks
current flows in the coil, generating an of advantages over other soldering/brazing include the creation of an electromagnetic
alternating magnetic field that induces techniques. There is no exposure to high field during the soldering/brazing process
electric currents and therefore heat in levels of light, heat or noise at the workplace, and the high initial cost of the equipment,
the part being soldered or brazed [6]. induction heating systems can be readily which makes the technique more suited to
mechanised or automated, the process is the mass production of assemblies [6].
The technique requires a medium- energy efficient, heating is fast and localised,
4
frequency or high-frequency generator. which is beneficial when dealing with
3
44 | KUPFERINSTITUT.DE
4.5.7. Electron beam brazing 4.5.8. Arc brazing
Electron beam brazing is carried out in a Advantages Electric arc brazing can be performed as
medium or high vacuum environment. It is Highly localised heating of a MIG or TIG process. The arc is created
characterised by high power densities and parent material between a wire electrode and the parts
a small beam diameter. The electrons are Good reproducibility to be brazed, transforming electrical
thermally emitted from the cathode and Minimal distortion of components energy into heat at the brazing joint. The
accelerated by the strong electric field that No complex preparation or filler metal is typically a copper-based
results from the high voltage (1575kV) after-treatment required alloy wire or rod whose melting range is
applied between the cathode and anode. below that of the parent metal. The
The electron beam exits the beam Disadvantages solidus temperature of common filler
generator through a hole in the anode. Process carried out in a vacuum metals of this type is in the range 830C
When the tightly bundled electron beam Potential x-ray hazard to 1060C. Electric arc brazing is
impacts the target material, the kinetic Requires use of filler metal generally used for braze welding
energy of the fast-moving electrons is preforms or pre-coated parts applications. The most important filler
converted into thermal energy, generating metals are listed in table 32.
heat in the material. In electron beam
brazing, the parts to be joined must be Table 31 - Advantages and disadvantages of electron
pre-coated with filler-metal or filler metal beam brazing
preforms must be inserted at the location
of the joint. Electron beam brazing is used DIN EN ISO 17672
for applications in which the joints have Filler metal alloy DIN ISO 24373 (2009)
(2013)
tight dimensional tolerances, where
high-power, highly localised heating is Designation Material number Material number
required, or where heating has to be
Silicon bronze CuSi2Mn1 Cu 6511 Cu 521
achieved extremely rapidly [6].
Silicon bronze CuSi3Mn1 Cu 6560 Cu 541
2
1 Tin bronze CuSn6P Cu 5180A Cu 922
Table 32 - Overview of important filler metals used in laser and electric arc brazing
Figure 25 Electron beam brazing [10] Figure 26 - Fuel tank from a Honda VT 1300CX with CuAl8
brazing filler metal [33]
KUPFERINSTITUT.DE | 45
Studies have shown that when electric 1
arc brazing is carried out under a Advantages
shielding gas, the commonly used High productivity 2
3 7
copper-based (bronze) filler metals cause Little preparation or after-treatment 5
diffusion and partial dissolution to occur required (no flux involved) 4
at the interface of the parent metal and Minimal distortion of components
the coating and filler metals. The metal Can be readily mechanised
surfaces that come into contact with the High brazing speed
brazing filler alloy should be clean and Low investment costs
bare so as to facilitate metallurgical Optically well-finished joints 6
interaction between the parent metal and 1. Power source 2. Laser beam 3. Focusing lens
the wetting filler metal. Fluxes are not Disadvantages 4. Shielding gas 5. Brazing joint
required as the surfaces are activated by Precision electrode feeding required 6. Components to be joined 7. Filler wire
the burning arc. The DVS technical leaflet Arc blow may need to be taken Figure 28 Laser beam brazing (based on [6])
0938-1 (2012) contains further informa- into account
tion on the principles and details of the Laser brazing is commonly used in the
process as well as the equipment automotive industry to join zinc galvanised
Table 33 - Advantages and disadvantages of electron
requirements. Application notes on arc body panels, as it enables high brazing
arc brazing
brazing are available in DVS technical speeds to be achieved while the small heat
leaflet 0938-2 (2005). One of the 4.5.9. Laser beam soldering or brazing affected zone minimises panel distortion
advantages of electric arc brazing While both laser beam soldering and issues [36]. The images in table 34 show a
compared with laser beam brazing is brazing techniques are used, most of the roof seam fabricated using laser brazing
the lower capital investment costs applications in the automotive industry and a CuSi3Mn1 silicon bronze filler. Filler
[6] [34] [35]. involve laser beam brazing. The technique metals that are suitable for use in electron
enables high temperatures to be reached beam brazing (see table 32) can also be
so that high-melting copper-based filler used for laser beam brazing [37].
metals can be processed without difficulty.
A highly focused laser beam generates
1 high power densities but only a small
heat-affected zone. A particularly suitable
radiation source for copper-based filler
metals is a Nd:YAG solid-state laser as it
generates laser radiation at a wavelength
Laser-brazed roof seam Laser-brazed roof seam
of 1.06m by the filler alloy. It is
on a Volkswagen Passat on an AUDIQ5 (2008)
important that the parts to be joined are CC (2008)
2 5 pre-coated with filler metal or that the
Table 34 - Examples of a laser brazed seam [33] (above)
3 filler metal is precisely positioned. Laser Table 35 - Advantages and disadvantages of laser beam
4 beam soldering and brazing techniques are brazing (below)
used primarily in the electrical, automotive
and precision engineering sectors. Very
short soldering or brazing times are Advantages
possible. For example, single soldering Very high productivity
1. Wire electrode (filler metal) 2. Shielding gas
3. Arc 4. Brazing joint 5. Power source times in the millisecond range are possible Minimal preparation or after-treatment
for surface mounted electronic compo- required (no flux involved)
Figure 27 - Electric arc brazing (MIG) (based on [6]) Can be readily mechanised
nents [6].
Minimal distortion of components
High brazing speed
Disadvantages
High capital investment costs
Positioning and feeding of filler wire
has to be done very precisely
46 | KUPFERINSTITUT.DE
5. Quality assurance
Quality assurance is one of the main contains all of the relevant standards and data are, however, essential when the
elements of a quality management system DVS technical leaflets relating to soldering soldering or brazing process is mechanised
and is concerned with verification. The aim and brazing. or fully automated, such as in a completely
of quality assurance is to prevent the encased continuous-feed furnace.
production or supply of defective products. In addition to the standards, the German
As in welding, the quality of a brazing or Welding Society DVS (Deutscher Verband Another important aspect when assessing
soldering process depends on the skill and fr Schweien und verwandte Verfahren the quality of a soldered or brazed
experience of the operator. Soldering and e.V.) also issues technical leaflets and connection concerns of the geometry and
brazing are physicochemical processes in guidelines. There are fewer rules and metallurgical structure of the joint.
which a material bond is created through accepted methods of quality assurance for Dimensional and visual inspections are
interactions between the solid parent soldering and brazing than for welding. The obligatory. The presence of cracks and
material and the molten solder or filler primary criteria are: appropriate qualifica- pinholes (pores) are typically demon-
metal. Phenomena such as capillary action tion and training of operating personnel; strated using dye penetration and
and surface wetting are exploited in production monitoring; checking on magnetic particle inspection techniques. If
soldering and brazing processes. If the assessing the quality of the joints made. soldering or brazing defects are to be
parent material and solder or filler alloy are assessed and the wetted joint area
properly matched, and if the joint is The objective is to fabricate a high-quality determined, x-ray and ultrasonic testing
properly designed and made, a soldered or soldered or brazed joint in a reproducible are used. The different materials and the
brazed joint can provide a more reliable join fashion while taking cost efficiency factors thicknesses of the parts must be taken
than that achievable by welding [38]. This into consideration. The need for well- into account if these non-destructive
section aims to provide an overview of trained and skilled personnel is important testing methods are deployed. Metallo-
quality assurance issues but does not claim not only for producing well-executed graphic sections are prepared in order
to be complete. soldered or brazed joints, but also for fixing check the condition of the microstructure,
The following faults and defects can arise in or jigging the components of the soldered the transition zone, the seam width and
a soldering or brazing process: or brazed assembly. The following any erosion. If brazing is used in the
flux burning when the temperatures guidelines and standards govern the construction of tanks, containers and
used are too high, procedures to be followed in training piping, pressure and leak testing is
courses: DVS Guideline 1183 (2004), DIN required [6]. Destructive testing methods
inadequate wetting by the solder or ISO 11745 (2011) and DIN EN ISO 13585 suitable for evaluating soldered joints are
filler metal alloy, (2012). set out in the standard DIN 8526 (1977);
wrong choice of solder/filler or flux, those used to assess brazed joints are
no preparation or improper preparation By identifying and, where necessary, described in DIN EN 12797 (2000).
of the mating surfaces, correcting workflow irregularities early, Non-destructive testing methods must
monitoring procedures play an important conform with DIN EN 12799 (2000).
de-wetting caused by oxidation at the
role in ensuring that the soldering or
joint because soldering/brazing times
brazing process meets the required quality Other defects that can occur include
were too long.
specifications while remaining cost-effec- cracking, lack of fusion, and voids.The DIN
It is therefore important to produce and tive. Monitoring involves capturing key EN ISO 18279 (2004) standard provides a
maintain quality assurance documentation. process parameters (e.g. temperature time comprehensive classification system for
The documentation should provide profile is) and observing the state of listing imperfections in brazed joints.
safeguards against potential claims and soldering is, the filler alloys and other Permissible defects and imperfections are
provide the necessary proof that a fault or auxiliary materials and consumables. detailed in DIN 65170 (2009). This standard
defect could not have occurred during the Manual processes, such as hot iron also specifies permissible wetted joint
fabrication or production process. soldering, demand highly trained operators areas, which are an important criterion for
Important recommendations are contained with good manual dexterity as, in most assessing the quality of a brazed joint [6].
in the standards governing quality cases, devices measuring and displaying the
management systems: DIN EN ISO 9001 temperature at the workpiece are not used.
(2008) and ISO/TS 16949 (2009). The Measuring instruments that can monitor
DIN-DVS Manual196 (Parts 1 and 2) also process parameters and record process
KUPFERINSTITUT.DE | 47
6. Case studies
48 | KUPFERINSTITUT.DE
6.2. Strip tinning
Tinned strips of copper or copper alloys The adapter tube on a heat exchanger CuproBraze process joints are created
are the raw materials for plug-in can be fabricated by brazing a flexible by brazing with the filler alloy CuNiSnP.
connectors that are used in a wide inner copper tube with a protective Once the tubes and fins have been
variety of applications, such as connec- woven bronze shield using fluxless fabricated, a filler metal paste is applied
tors for vehicle wiring looms, for electric arc brazing (TIG). Appropriate to them. Once brazed, the elements are
computers and other electronic devices. filler materials are the high-tin bronze then assembled to make the heat
Component miniaturisation has placed rods, such as CuSn12P. In TIG brazing, exchanger and held in position by a jig.
increasingly tough demands on the the arc burns above a sharp-tipped Brazing paste is then applied again and
quality of the strip tinning process. tungsten rod and the filler metal is fed the assembly is brazed in a conti-
Meeting these quality specifications to the joint by hand. Well-executed nuous-feed furnace. There is no need for
requires the strip to be hot-dip tinned brazes have a visually appealing fluxes and subsequent rinsing proce-
with non-corrosive, no-clean fluxes (see appearance [33]. dures [40] [41].
table 15), which have to be carefully
selected for the particular strip tinning
line and for the copper alloy being
tinned. Corrosive fluxes are rarely
selected, as customers who use tinned
strips frequently demand a chloride-free
tinning process. Layer thicknesses can
be adjusted individually to satisfy
customer specifications [24].
KUPFERINSTITUT.DE | 49
7. Terminology
50 | KUPFERINSTITUT.DE
8. Appendix
The tables below present a selection of standards and guidelines relating to soldering and brazing
Graphical Representation of Welded, Soldered and Brazed Joints Concepts and Terms for
DIN 1912-4
Soldered and Brazed Joints and Seams (DIN 1912:1981)
DIN EN ISO 17672 Brazing Filler metals (ISO 17672:2010; German version EN ISO 17672:2010
DIN 1707-100 Soft solder alloys Chemical composition and forms (DIN 1707-100:2011-09)
Parent materials /
Solders and filler Soft solder alloys Chemical compositions and forms (ISO 9453:2014;
DIN EN ISO 9453
metals / Fluxes German version EN ISO 9453:2014)
Brazing for aerospace applications Qualification test for brazers and brazing operators
DIN ISO 11745
Brazing of metallic components (ISO 11745:2010; DIN ISO 11745:2011-01)
DIN EN 12797 Brazing Destructive tests of brazed joints (German version EN 12797:2000)
DIN 8526 Testing of soldering joints Gap soldered joints, shear test, creep shear test (1977)
Test procedures
DIN EN 12799 Brazing Non-destructive examination of brazed joints (German version EN 12799:2000)
KUPFERINSTITUT.DE | 51
Regulations / Technical guidelines / Technical leaflet
Lten in der Hausinstallation Kupfer Rohre und Fittings Ltverfahren Befund von Ltnhten
Richtlinie
[Technical guidelines: Soldering/brazing in domestic installation work Copper Pipes and fittings Soldering/brazing
DVS 1903-2
procedures Inspecting soldered/brazed joints] (10/2002)
Merkblatt Hinweise auf mgliche Oberflchenvorbereitungen fr das flussmittelfreie Hart- und Hochtemperaturlten
DVS 2606 [Technical leaflet: Information on surface preparation methods for flux-free brazing and high-temperature brazing] (12/2000)
Merkblatt Visuelle Beurteilung von Weichltstellen SMD auf Leiterplatte Kriterien im synoptischen Vergleich
DVS 2611 [Technical leaflet: Visual assessment of soldered joints SMDs on printed-circuit boards Comparison criteria] (05/1993)
Table 39 Regulations, technical guidelines and leaflets covering soldering and brazing processes
52 | KUPFERINSTITUT.DE
Temperature in acc.
with DIN Process Filler materials Soldering / brazing method Example applications
ISO 857-2 (2007)
Manufacture of condensers,
Soft solders mostly
Hot-iron soldering, cooling units and metal
tin-based; commonly used in
450 C Soldering wave soldering, vessels; Electronics;
combination with a flux:
dip soldering Fabrication of PCBs;
joint strength is relatively low
Tinning
Refrigeration and
air-conditioning;
Typically used with a flux; Gas and water installations;
suitable brazing filler Mechanical construction
metals (BFMs) are: of small-scale and
silver-based BFMs, brass Torch brazing, large-scale equipment;
BFMs, copper alloy BFMs; induction brazing, Plumbing and heating
> 450 C Brazing
copper and copper alloys can electric resistance brazing, installations; Cooling
be brazed in air without a furnace brazing systems; Heat exchangers;
flux using phosphorus- Automotive and aviation
containing BFMs; construction;
high-strength joints Power engineering; Electrical
engineering / electronics
KUPFERINSTITUT.DE | 53
Parent
Solder / Brazing filler metal (BFM)
material
Silver-
Copper-
Tin-lead Silver-alloy copper- Copper-zinc Copper-nickel Copper alloy
Lead solders phosphorus
solders BFMs palladium BFMs BFMs BFMs
BFMs
BFMs
Aluminium
X X
alloys
Beryllium X
Gold X
Cast iron X X
Malleable
X X
iron
Carbide X X
Copper X X X X X
Copper alloys X X X X X
Brass X X
Molybdenum X
Nickel X X X X X X
Nickel alloys X X X X
Unalloyed
X X X X X
steel
Alloyed steel X X X X X
High-
X X
strength steel
Corrosion-
X X ()
resistant steel
Creep-
X
resisting steel
Titanium X
Tungsten X
Zirconium X
54 | KUPFERINSTITUT.DE
Solder or brazing
Advantages Disadvantages
filler metal
high plasticity
poor resistance to corrosion
good processability
Soft solders Lead solders toxicity concerns (harmful to health and
better thermal stability than tin-lead solders
the environment)
good low-temperature stability
Table 42 Summary of some advantages and disadvantages of selected solders/brazing filler metals
KUPFERINSTITUT.DE | 55
Regulation / Directive /
Hazardous substance Notes
Technical rules
Boric acid
Regulation (EC) No. 1272/2008
Boron trioxide
(CLP Regulation); 67/548/EEC
since 2012 Borax (sodium borate, anhydrate) Frequently contained in fluxes
(30th/31st DVS technical leaflet
Borax decahydrate
2617
Borax pentahydrate
Conversion tables
56 | KUPFERINSTITUT.DE
References [15] H. Bell, Reflowlten, Bad Saulgau: [29] Merkblatt DVS 2602 - Hartlten mit der
[1] D. e. R. Muhs, Maschinenelemente. Eugen G. Leuze Verlag, 2005. Flamme, 2011.
Normung, Berechnung, Gestaltung,
Wiesbaden: Vieweg+Teubner GWV [16] W. Mller und J.-U. Mller, Lttechnik. [30] Gnther-Khler-Institut fr Fgetechnik
Fachverlag, 2009. Leitfaden fr die Praxis. Band 127., und Werkstoffprfung GmbH, Jena, 2012.
Dsseldorf: DVS-Verlag GmbH, 1995.
[2] DIN 8514 - Ltbarkeit, 2006. [31] H. Bell; Rehm Thermal Systems GmbH,
[17] Deutsches Kupferinstitut Berufsverband Reflowlten, Blaubeuren, 2012.
[3] K. Wittke und U. Fssel, Kombinierte e. V., Niedriglegierte Kupferwerkstoffe -
Fgeverbindungen, Berlin: Eigenschaften, Verarbeitung, [32] Ltverfahren, Umicore AG & Co. KG,
Springer-Verlag, 1996. Verwendung, 2012. [Online]. Available: http://www.technicalma-
terials.umicore.com/de/bt/brazingCenter/
[4] H. J. Fahrenwaldt, Praxiswissen Schwei- [18] Wieland-Werke AG, show_de_V_03_Loetverfahren.pdf. [Zugriff
technik. Werkstoffe, Prozesse, Fertigung. Schliffbild Rohr-Fittings, 2012. am 25 09 2012].
4. Auflage, Wiesbaden: Vieweg+Teubner
GWV Fachverlag, 2011. [19] VG 81245-3 - Nichteisen-Schwermetalle; [33] Berkenhoff GmbH, 2013.
Schweizustze und Hartlote; Auswahl, 1991.
[5] H. J. Fahrenwaldt, Praxiswissen Schwei- [34] Merkblatt DVS 0938-1 - Lichtbogenlten
technik. Werkstoffe, Prozesse, Fertigung, [20] DVS Merkblatt 2607 - Prozesskontrolle - Grundlagen, Verfahren, Anforderungen an
Wiesbaden: Vieweg+Teubner GWV beim Hochtemperaturlten, 2007. die Anlagentechnik, 2012.
Fachverlag, 2009.
[21] DVS Merkblatt 2606 - [35] Merblatt DVS 0938-2 - Lichtbogenlten
[6] K.-J. Matthes, Fgetechnik. berblick, Hinweise auf mgliche Oberflchen- Anwendungshinweise, 2005.
Lten, Kleben, Fgen durch Umformen, vorbereitungen fr das flumittelfreie
Leipzig: Carl-Hanser-Verlag, 2003. Hart- und Hochtemperaturlten, 2000. [36] U. Berger und R. Mainhardt,
Welding Journal, 2009.
[7] M. Trpe, Lttechnik. Vorlesung Lten, TU [22] H. Kleinert, Klebtechnik, Lehrmaterialien
Dresden, 2008. der Fakultt Machinenwesen, Professur [37] E. Schmid, Proceedings 9. Int.
Fgetechnik und Montage, 2010 Aachender Schweitechnik Kolloquium
[8] DVS Fachgruppe 3.3, Fgetechnik Fgen im Fahrzeugbau, 2004.
Schweitechnik, Dsseldorf: DVS Media [23] DIN EN 29454-1 - Flussmittel zum
GmbH, 2012. Weichlten, 1994. [38] Petrunin, Handbuch Lttechnik, Moskau:
Verlag Technik GmbH Berlin, 1984.
[9] D. Schnee, Umicore AG & Co. KG, [24] A. Ament; Ltmittel Techno Service
Businessline BrazTec, Grundlagen des Ltens, GmbH & Co.KG, 2012. [39] VDE/VDI Schulungsbltter fr die
2010. Leiterplattenfertiung, 1999.
[25] DIN EN 1045 - Flussmittel zum
[10] DIN ISO 857-2 - Schweien und Hartlten, 1997. [40] L. Tikana und A. Klassert, Kupfer-Khler
verwandte Prozesse - Teil 2: Weichlten, fr Leistungsstarke Motoren, Metall, Bd. 62.
Hartlten und verwandte Begriffe, 2007. [26] DVS Merkblatt 2617 - Neueinstufung Jahrgang, 10/2008.
und Etikettierungsvorschriften fr Flussmit-
[11] G. Schulze, Die Metallurgie des tel zum Hartlten, die Borsure, Boraxpen- [41] www.cuprobraze.com, 2013. [Online].
Schweiens, Berlin: Springer-Verlag, 2004. tahydrat oder di-Bortrioxid enthalten, 2012. [Zugriff am 07 05 2013].
[12] Umicore AG & Co.KG, Businessline [27] A. Rahn, Bleifrei lten. Ltprofile fr Bilder Deckblatt:
BrazeTec, 2013. bleifreie Lote, Legierungen, Parameter, www.iew.eu
Prozesse. Band 2., Bad Saulgau: Eugen G.
[13] W. Schatt und H. Worch, Werkstoffwis- Leuze Verlag, 2005.
senschaft, Weinheim: Wiley-VCH Verlag
GmbH & Co. KGaA, 2003. [28] Flammlten mit der Acetylenflamme,
Linde AG, [Online]. Available: http://www.
[14] ASM International, linde-gas.de/international/web/lg/de/
Binary Alloy Phase Diagrams. like35lgde.nsf/repositorybyalias/praktiker-
tipps_flamml%F6ten/$file/flammloeten.pdf.
[Zugriff am 20 09 2012].
KUPFERINSTITUT.DE | 57
Index of figures
58 | KUPFERINSTITUT.DE
Index of tables
Table 1 Relationship between contact angle and Table 31 Advantages and disadvantages of electron
degree of wetting [7] 7 beam brazing 45
Table 2 Comparison of the physical and mechanical Table 32 Overview of important filler metals used
properties of copper, important copper alloys in laser and electric arc brazing 45
and unalloyed steel 9 Table 33 Advantages and disadvantages of electron
Table 3 Soft solders for copper and copper alloys as arc brazing 46
classified in the DIN EN ISO 9453 (2014) Table 34 Examples of a laser brazed seam [33] 46
and DIN 1707-100 (2011) standards 12 Table 35 Advantages and disadvantages of laser
Table 4 Selection of copper-based filler metals for beam brazing 46
brazing copper and copper alloys 14 Table 36 Summary of a number of important
Table 5 Selection of silver alloy filler metals containing more quality requirements 48
than 20 % silver for brazing copper and copper alloys 15 Table 37 Process steps in vertical and horizontal
Table 6 Selected types of copper 16 HAL systems 48
Table 7 Soft solders suitable for soldering copper 17 Table 38 Selected standards covering soldering and
Table 8 Filler metals suitable for brazing copper 18 brazing processes 51
Table 9 Difference between standard (narrow-gap) Table 39 Regulations, technical guidelines and leaflets
soldering/brazing and braze welding 26 covering soldering and brazing processes 52
Table10 Distinction between the terms assembly gap, Table 40 Examples of soldering and brazing applications 53
soldering/brazing gap and soldering/brazing seam 26 Table 41 Matrix for selecting commonly used
Table 11 Geometric configurations of common combinations of parent metals and solders or
soldered/brazed joints [6] 28 brazing filler metals 54
Table 12 Cleaning procedures for copper and copper alloys [21] 30 Table 42 Summary of some advantages and
Table 13 Recommended pickling solutions for copper and disadvantages of selected solders/brazing
copper alloys that will undergo fluxless brazing [21] 31 filler metals 55
Table 14 Solder fluxes (classified according to Table 43 Hazardous substances 56
DIN EN 29454-1 (1994) (1994) [23] 33 Table 44 Soft solders 56
Table 15 Chemical function of solder fluxes [24] 33 Table 45 Flux designations 56
Table16 Brazing fluxes (classified according to
DIN EN 1045 (1997) [25] 34
Table 17 Concentration levels for hazard
classification purposes [26] 35
Table 18 Protective atmospheres used in soldering/
brazing operations 35
Table 19 Different ways of introducing the filler metal
to the soldering or brazing joint (based on [10]) 36
Table 20 Classification of soldering/brazing processes
(based on [10]) 37
Table 21 Advantages and disadvantages of
hot-iron soldering 38
Table 22 Advantages and disadvantages of dip
soldering or dip brazing 38
Table 23 Advantages and disadvantages of torch
soldering or torch brazing 40
Table 24 Surface activation in furnace soldering or brazing 41
Table 25 Advantages and disadvantages of furnace
soldering or brazing 41
Table 26 Comparison of the different reflow soldering
heating modes [31] 42
Table 27 Advantages and disadvantages of electric
resistance soldering or brazing 43
Table 28 Characteristic features of induction soldering
or brazing [6] 44
Table 29 Skin depth as a function of operating frequency [32] 44
Table 30 Advantages and disadvantages of induction
soldering or brazing 44
KUPFERINSTITUT.DE | 59
Copyright 2015. Deutsches Kupferinstitut
Prepared by:
Theresa Khne
Evelyn Hofmann
Prof. Dr.-Ing. habil. Uwe Fssel
Technische Universitt Dresden
Deutsches Kupferinstitut
Berufsverband e. V.
Am Bonneshof 5
40474 Dsseldorf
Germany
technik@kupferinstitut.de
www.kupferinstitut.de
www.copperalliance.de