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PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
TIPL760, TIPL760A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
thermal characteristics
PARAMETER MIN TYP MAX UNIT
RJC Junction to case thermal resistance 1.56 C/W
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.
PRODUCT INFORMATION
2
TIPL760, TIPL760A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
33
+5V
D45H11
BY205-400
BY205-400
33 RB
(on)
1 pF
180 H
vcc
V Gen 2N2222
1 k
68 0.02 F TUT
BY205-400
1 k Vclamp = 400 V
+5V
5X BY205-400
270 BY205-400 1 k
2N2904
Adjust pw to obtain IC
D44H11
47
For IC < 6 A VCC = 50 V
V
For IC 6 A VCC = 100 V BE(off)
100
I B(on)
A (90%)
A - B = tsv IB Base Current
B - C = trv
D - E = tfi
E - F = tti
C 90%
B - E = txo
B 10%
V Collector Voltage
CE
D (90%)
E (10%)
I Collector Current
C(on)
F (2%)
NOTES: A. Waveforms are monitored on an oscilloscope with the following characteristics: tr < 15 ns, Rin > 10 , Cin < 11.5 pF.
B. Resistors must be noninductive types.
PRODUCT INFORMATION
3
TIPL760, TIPL760A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
TYPICAL CHARACTERISTICS
VCE = 5 V IC = 4 A
IC = 3 A
IC = 2 A
30 IC = 1 A
10
20
10
10 0
01 10 10 0 05 10 15 20
IC - Collector Current - A IB - Base Current - A
Figure 3. Figure 4.
115
10
TIPL760A
105
VCE = 1000 V
01
095
TIPL760
VCE = 850 V
IC = 4 A 001
085 IC = 3 A
IC = 2 A
IC = 1 A
075 0001
0 02 04 06 08 10 12 14 16 -60 -30 0 30 60 90 120
IB - Base Current - A TC - Case Temperature - C
Figure 5. Figure 6.
PRODUCT INFORMATION
4
TIPL760, TIPL760A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
MAXIMUM FORWARD-BIAS
SAFE OPERATING AREA
SAP741AE
10
IC - Collector Current - A
10
0.1
tp = 10 s
tp = 100 s
tp = 1 ms
tp = 10 ms TIPL760
DC Operation TIPL760A
001
10 10 100 1000
VCE - Collector-Emitter Voltage - V
Figure 7.
THERMAL INFORMATION
10
50%
20%
10%
01
5%
0%
t1
duty cycle = t1/t2 t2
Read time at end of t1,
TJ(max) - TC = P D(peak) ( )
ZJC
R JC
RJC(max)
001
10-5 10-4 10 -3 10 -2 10-1 10 0
t1 - Power Pulse Duration - s
Figure 8.
PRODUCT INFORMATION
5
TIPL760, TIPL760A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
4,70
4,20
6,6
6,0
15,90
14,55
see Note C
6,1
3,5
14,1
1,70 12,7
0,97 1,07
0,61
1 2 3
2,74 0,64
2,34 0,41
5,28 2,90
4,88 2,40
VERSION 1 VERSION 2
NOTES: A. The centre pin is in electrical contact with the mounting tab. MDXXBE
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
Version 1, 18.0 mm. Version 2, 17.6 mm.
PRODUCT INFORMATION
6
TIPL760, TIPL760A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PRODUCT INFORMATION
7
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