Semiconductor Engineering Homework 1 Due: 2017/3/24

The answer should be addressed the explanation

1. What is the difference between discrete devices and integrated circuits?

2. Nitrogen can be used as both a purge gas and a process gas in IC fabrication.
Does nitrogen for these two applications require the same purity?
3. List and explain the main purposes for the chip packaging.
4. At the same doping concentration, compare p-type and n-type semiconductor.
Which one has higher electric conductivity? Please also explain the reasons.
5. Please describe the operation of NMOS transistor
6. Describe a self-aligned source/drain process. Why it is still used today?
7. Draw the <100> and <111> crystalline plane from a cube.
8. Please compare the CZ and FZ methods in single-crystal ingot manufacturing.