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AO4604
Complementary Enhancement Mode Field Effect Transistor
D2 D1
S2 1 8 D2
G2 2 7 D2
S1 3 6 D1
G1 4 5 D1 G2 G1
S2 S1
SOIC-8
n-channel p-channel
2
A: The value of R JA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with TA=25C. The value
in any a given application depends on the user's specific board design. The current rating is based on the t 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R JA is the sum of the thermal impedence from junction to lead RJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 s pulses, duty cycle 0.5% max.
2
E. These tests are performed with the device mounted on 1 in FR-4 board with 2oz. Copper, in a still air environment with TA=25C. The SOA
curve provides a single pulse rating.
A: The value of R JA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25C. The
value in any a given application depends on the user's specific board design. The current rating is based on the t 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R JA is the sum of the thermal impedence from junction to lead RJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 s pulses, duty cycle 0.5% max.
2
E. These tests are performed with the device mounted on 1 in FR-4 board with 2oz. Copper, in a still air environment with TA=25C. The
SOA curve provides a single pulse rating.
30 20
10V 6V
25 5V
16 VDS=5V
4.5V
4V
20
12
ID (A)
ID(A)
15
3.5V
8
10
125C
VGS=3V 4
5
25C
0 0
0 1 2 3 4 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
VDS (Volts) VGS (Volts)
Fig 1: On-Region Characteristics Figure 2: Transfer Characteristics
60 1.6
VGS=10V
Normalized On-Resistance 1.5 ID=5A
50
1.4
VGS=4.5V
RDS(ON) (m)
40 VGS=4.5V 1.3
1.2
30
1.1
20 1
VGS=10V
0.9
10
0 5 10 15 20 0.8
0 50 100 150 200
ID (Amps)
Figure 3: On-Resistance vs. Drain Current and Gate Temperature ( C)
Voltage Figure 4: On-Resistance vs. Junction Temperature
70 1.0E+01
60 1.0E+00
ID=5A
1.0E-01
50
IS Amps
RDS(ON) (m)
125C 1.0E-02
40 125C
1.0E-03
30
25C
1.0E-04
20 25C
1.0E-05
10 0.0 0.2 0.4 0.6 0.8 1.0
2 4 6 8 10 VSD (Volts)
Figure 6: Body diode characteristics
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
10 1000
VDS=15V 900 f=1MHz
ID=6.9A VGS=0V
8 800
700
Capacitance (pF)
Ciss
VGS (Volts)
6 600
500
4 400
300
2 200 Coss
100
Crss
0 0
0 2 4 6 8 10 12 14 0 5 10 15 20 25 30
Qg (nC) VDS (Volts)
Figure 7: Gate-Charge characteristics Figure 8: Capacitance Characteristics
100 40
TJ(Max)=150C
TJ(Max)=150C
RDS(ON) TA=25C
TA=25C
limited
100s 30
10 1ms 10s
ID (Amps)
Power W
10ms
20
0.1s
1
1s
10
10s
DC
0.1 0
0.1 1 10 100 0.001 0.01 0.1 1 10 100 1000
VDS (Volts) Pulse Width (s)
Figure 9: Maximum Forward Biased Safe Figure 10: Single Pulse Power Rating Junction-to-
Operating Area (Note E) Ambient (Note E)
10
D=Ton/T In descending order
TJ,PK=TA+PDM.ZJA.RJA D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
Z JA Normalized Transient
RJA=62.5C/W
Thermal Resistance
0.1 PD
Ton
Single Pulse T
0.01
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
20 10
-10V -5V
-6V
-4.5V 8 VDS=-5V
15
-4V
6
-ID (A)
-ID(A)
10
-3.5V
4 125C
5 VGS=-3V
2 25C
-2.5V
0 0
0.00 1.00 2.00 3.00 4.00 5.00 0 1 2 3 4
-VDS (Volts) -VGS(Volts)
Figure 1: On-Region Characteristics Figure 2: Transfer Characteristics
100 1.60E+00
Normalized On-Resistance VGS=-4.5V
80 1.40E+00 VGS=-10V
VGS=-4.5V
RDS(ON) (m)
60 1.20E+00
VGS=-10V
40 1.00E+00 ID=-5A
20 8.00E-01
1 3 5 7 9 0 25 50 75 100 125 150 175
-ID (A) Temperature (C)
Figure 3: On-Resistance vs. Drain Current and Figure 4: On-Resistance vs. Junction
Gate Voltage Temperature
160 1E+01
100 1E-02
-IS (A)
80 125C 1E-03
25C
60 1E-04
40 25C 1E-05
20 1E-06
2 4 6 8 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2
-VGS (Volts) -VSD (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage Figure 6: Body-Diode Characteristics
10 1200
VDS=-15V
ID=-5A 1000
8 Ciss
Capacitance (pF)
800
-VGS (Volts)
6
600
4
400
Coss
2
200
Crss
0 0
0 2 4 6 8 10 12 14 16 0 5 10 15 20 25 30
-Qg (nC) -VDS (Volts)
Figure 7: Gate-Charge Characteristics Figure 8: Capacitance Characteristics
100 TJ(Max)=150C 40
TA=25C TJ(Max)=150C
10s TA=25C
RDS(ON) 30
10 100s
limited
Power (W)
-ID (Amps)
1ms
20
0.1s 10ms
1
1s 10
10s
DC
0
0.1
0.001 0.01 0.1 1 10 100 1000
0.1 1 10 100
-VDS (Volts) Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-to-
Figure 9: Maximum Forward Biased Safe
Ambient (Note E)
Operating Area (Note E)
10
D=Ton/T In descending order
TJ,PK=TA+PDM.ZJA.RJA D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
ZJA Normalized Transient
RJA=62.5C/W
Thermal Resistance
PD
0.1
Ton
T
Single Pulse
0.01
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
NOTE:
1. LEAD FINISH: 150 MICROINCHES ( 3.8 um) MIN.
THICKNESS OF Tin/Lead (SOLDER) PLATED ON LEAD
2. TOLERANCE 0.10 mm (4 mil) UNLESS OTHERWISE
SPECIFIED
3. COPLANARITY : 0.10 mm
4. DIMENSION L IS MEASURED IN GAGE PLANE
NOTE:
LOGO - AOS LOGO
4604 - PART NUMBER CODE.
LOGO 4 6 0 4 F - FAB LOCATION
A - ASSEMBLY LOCATION
FAYWLC Y - YEAR CODE
W - WEEK CODE.
LC - ASSEMBLY LOT CODE
Rev. A
ALPHA & OMEGA SO-8 Tape and Reel Data
SEMICONDUCTOR, INC.
SO-8 Reel
SO-8 Tape
Leader / Trailer
& Orientation