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NEMA Standards Publication ICs 1.1-1984 (R1988, R1993, R1998)
Published by:
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Foreword
This StandardsPublication has been written to assist the user of solid state components
in industrial control applications to a better understanding of the unique characteristics
of solid state devices or packaged assemblies incorporating solid state components. The
thrust of this document is personnel safety.The product standard for components for solid
state logic systems is contained in Part ICs 2-230. Standards for industrial systems are
in Publication ICs 3.
In the preparation of this Standards Publication, input ofusers and other interested par-
ties has been sought and evaluated.
Comments will be welcomed. They should be addressed to:
Manager, Engineering Department
National Electrical Manufacturers Association
2101 L Street, N.W.
Washington,D.C. 20037
This publication is taken in its entirety from Part ICs 1- 150, NEMA Standards Publica-
tion No. ICs 1-1983.
Scope
This StandardsPublication is intended to provide general guidelines for the application,
installation, and maintenance of solid state control in the form of individual devices or
packaged assembliesincorporating solid state conlponents. The emphasis of the guidelines
is personnel safety. Applicable NEMA standards and product related instructions should
be carefully followed.
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ICs 1.1-1984
Page 1
Electrical Noise-Unwanted electrical energy which has On-State Condition-The condition of a solid state device
thepossibilityofproducingundesirable effects in the con-whenconducting.
trol, its circuits and system.
Surge Current-A current exceeding the steadystate cur-
Eleemrical Noise Immunity-The extent to which the con- rent for a short time duration, nomally described by its
trol is protected from a stated electrical noise. peak amplitude and time duration.
Off-Sfate Current-The current that flows in a solid state
device inoff-state
the condition. Transient
Overvoltage-The
peak voltage in excess
of
steady state voltage for a short time during the transient
~ " S t a f Codifion-The
e conditionsofasolidstatedevice conditions (e.g., resulting from the operations of a
where no signal
control is applied. switching device).
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Section 2
GENERAL
(Sections 2 through 5 are classified as Authorized Engineering Information 11-15-1984.)
Solid State andelectro-mechanical controls canperform similar control functions, but there are certain unique
characteristics of solid state controls which must be understood.
In the application. installation and maintenance of solid state control, special consideration should be given to the
characteristics described in 2.1 through 2.7.
2.1 AMBIENT
TEMPERATURE 2.4 POLARITY
Careshould betakennotto exceedtheambient Incorrect polarityof applied voltages may damage solid
temperature range specified bythe manufacturer. state controls. The correct polarity of solid state controls
should be observed.
2.5 RATEOFRISE-VOLTAGEORCURRENT
2.2 ELECTRICALNOISE (DV/DT or DI/DT)
Performance of solid state controls can be affected by Solid state controls can be affected by rapid changes
electrical noise. In general, complete systems are designed of voltage or current if the rate of rise (DV/DT and/or
with a degree of noise immunity. Noise immunity can be DI/DT) is greater than the maximum permissible value
determinedthroughtestssuch as described in 3.4.2. specified by the manufacturer.
Manufacturerrecommendedinstallation practices for
2.6 SURGECURRENT
reducing the effect of noise should be followed.
Current of a value greater than that specified by the
manufacturer can affect the solid state control. Current
limiting means may required.
2.3 OFF-STATECURRENT
Solid state controls generally exhibit a small amount 2.7 TRANSIENTOVERVOLTAGE
of current flow when in the off-state condition. Precau- Solid state controls may be affected by transient over-
tions must be exercised to ensure proper circuit perfor- voltages which are in excess of those specified by the
mance and personnel safety. The value of this current is manufacturer.Voltagelimitingmeansshould be con-
available from the manufacturer.
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sidered and may be required.
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Page 2
Section 3
APPLICATION GUIDELINES
3.1.3 RedundancyandMonitoring
a short logic signals to power devices in the high level circuit.
Isolation impedance means also are used to transmit logic
signals to power devices.
3.3SPECIALAPPLICATIONCONSIDERATIONS
e
Whensolid state devices are beingusedtocontrol
operations, which the user determines to be critical, it is 3.3.1ConvertingLadderDiagrams
strongly recommended that redundancy and some form Converting a ladder diagram originally designed for
of checking be included in the system. Monitoring cir- electromechanical systems to one using solid state con-
cuits should check that actual machine or process opera- trol must account for the differences between elec-
tion is identical to controller commands; andin the event tromechanical and solid state devices. Simply replacing
of failure inthemachine, process, or themonitoring each contact in the ladder diagram with a corresponding
system, the monitoring circuits should initiate
a safe shut- solid state contact will not always produce the desired
down sequence. logic functions or fault detection and response. For ex-
ample, in electromechanical systems, a relay having a
3.1.4OvercurrentProtection mechanically linked normally open (NO) and normally
To protect triacs and transistors from shorted loads,a closed (NC) contact can be wired to check itself. Solid
closely matched short circuit protective device (SCPD) state components do not have a mutually exclusive NO-
is often incorporated. These SCPDs should be replaced NC arrangement. However, external circuitry can
be *
only with devices recommended by the manufacturer. employed to sample the input and contact state and
compare to determine if the systemisfunctioning
3.1.5OvervoltageProtection properly.
To protect triacs, SCRsand transistors from over- 3.3.2Polarity andPhaseSequence
voltages, it may be advisable to consider incorporating Input power andcontrol signals shouldbe applied with
peak voltage clamping devices such as varistors, zener polarity andphase sequence as specifiedby the manufac-
e
diodes, or snubber networks in circuits incorporating these turer. Solid state devices can be damaged by the applica-
devices. tion of reverse polarity or incorrect phase sequence.
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ICs 1.1-1984
Page 3
a 3.4
Planning
Electrical
Noise
Rejection
The low energy levels of solid state controls may cause
3.4.3DesignofWiringforMaximum
Protection
them to be vulnerable to electrical noise. This should be Once the installation site and power conductors have
considered in the planning stages. been examined, the system wiring plansthat will provide
noise suppression should be considered.
3.4.1AssessingElectricalEnvironment Conducted noiseenters solid statecontrol at the points
Sources of noise are those pieces of equipment that have where the control is connected to input lines, output lines,
large, fast changing voltages or currents when they are and power supply wires.
energized or de-energized, such as motor starters, welding Input circuits arethe circuits most vulnerable to noise.
equipment, SCR type, adjustable speed devices and other Noise may be introduced capacitatively through wire to
inductive devices. These devices, as well as the more com- wire proximity, or magnetically from nearby lines car-
mon control relays and their associated wiring, all have rying large currents. In most installations, signal lines and
the capabilityof inducing serious current and voltage tran- power linesshould beseparate. Further, signallines
sients on their respective power lines.It is these transients should be appropriately routedand shielded according to
which nearby solid state controls must withstand and for the manufacturers recommendations.
which noise immunity should be provided. When planning system layout, care must be given to
An examination of the proposed installationsite of the appropriate groundingpractice.Becausedesign dif-
solid state control should identify equipment that could ferences may call for different grounding, the control
contaminate power lines.All power lines that will be tap- manufacturers recommendations should be followed.
ped by the proposed solid state control should be examined
for the presence, severity, andfrequencyofnoise occur- 3.5COUNTERINGTHEEFFECTSOF
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Page 4
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Page 5
Section 4
INSTALLATION GUIDELINES
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ICs 1 .l-1984
Page 6
Section 5
PREVENTIVE MAINTENANCE AND REPAIR GUIDELINES
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