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NEMA ICs 1.1

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NEMA Standards Publication ICs 1.1-1984 (R1988, R1993, R1998)

Safety Guidelinesfor the Application, Installation, and Maintenance


of Solid State Control

Published by:

National Electrical Manufacturers Association


1300 North 17th Street
Rosslyn, VA 22209

O Copyright 1999 by the National Electrical Manufacturers Association.


All rights including
translation into other languages, reserved under the Universal Copyright Convention, the Berne
Convention for the Protection of Literary and Artistic
Works, and the International and Pan

m American Copyright Conventions.

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Foreword
This StandardsPublication has been written to assist the user of solid state components
in industrial control applications to a better understanding of the unique characteristics
of solid state devices or packaged assemblies incorporating solid state components. The
thrust of this document is personnel safety.The product standard for components for solid
state logic systems is contained in Part ICs 2-230. Standards for industrial systems are
in Publication ICs 3.
In the preparation of this Standards Publication, input ofusers and other interested par-
ties has been sought and evaluated.
Comments will be welcomed. They should be addressed to:
Manager, Engineering Department
National Electrical Manufacturers Association
2101 L Street, N.W.
Washington,D.C. 20037

This publication is taken in its entirety from Part ICs 1- 150, NEMA Standards Publica-
tion No. ICs 1-1983.

Scope
This StandardsPublication is intended to provide general guidelines for the application,
installation, and maintenance of solid state control in the form of individual devices or
packaged assembliesincorporating solid state conlponents. The emphasis of the guidelines
is personnel safety. Applicable NEMA standards and product related instructions should
be carefully followed.

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ICs 1.1-1984
Page 1

SAFETY GUIDELINES FOR THE APPLICATION, INSTALLATION


AND MAINTENANCE OF SOLID STATE CONTROL
Section 1
DEFINITIONS
(This section is classified as NEMA Standard 11-15-1984.)

Electrical Noise-Unwanted electrical energy which has On-State Condition-The condition of a solid state device
thepossibilityofproducingundesirable effects in the con-whenconducting.
trol, its circuits and system.
Surge Current-A current exceeding the steadystate cur-
Eleemrical Noise Immunity-The extent to which the con- rent for a short time duration, nomally described by its
trol is protected from a stated electrical noise. peak amplitude and time duration.
Off-Sfate Current-The current that flows in a solid state
device inoff-state
the condition. Transient
Overvoltage-The
peak voltage in excess
of
steady state voltage for a short time during the transient
~ " S t a f Codifion-The
e conditionsofasolidstatedevice conditions (e.g., resulting from the operations of a
where no signal
control is applied. switching device).

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Section 2
GENERAL
(Sections 2 through 5 are classified as Authorized Engineering Information 11-15-1984.)

Solid State andelectro-mechanical controls canperform similar control functions, but there are certain unique
characteristics of solid state controls which must be understood.
In the application. installation and maintenance of solid state control, special consideration should be given to the
characteristics described in 2.1 through 2.7.

2.1 AMBIENT
TEMPERATURE 2.4 POLARITY
Careshould betakennotto exceedtheambient Incorrect polarityof applied voltages may damage solid
temperature range specified bythe manufacturer. state controls. The correct polarity of solid state controls
should be observed.

2.5 RATEOFRISE-VOLTAGEORCURRENT
2.2 ELECTRICALNOISE (DV/DT or DI/DT)
Performance of solid state controls can be affected by Solid state controls can be affected by rapid changes
electrical noise. In general, complete systems are designed of voltage or current if the rate of rise (DV/DT and/or
with a degree of noise immunity. Noise immunity can be DI/DT) is greater than the maximum permissible value
determinedthroughtestssuch as described in 3.4.2. specified by the manufacturer.
Manufacturerrecommendedinstallation practices for
2.6 SURGECURRENT
reducing the effect of noise should be followed.
Current of a value greater than that specified by the
manufacturer can affect the solid state control. Current
limiting means may required.
2.3 OFF-STATECURRENT
Solid state controls generally exhibit a small amount 2.7 TRANSIENTOVERVOLTAGE
of current flow when in the off-state condition. Precau- Solid state controls may be affected by transient over-
tions must be exercised to ensure proper circuit perfor- voltages which are in excess of those specified by the
mance and personnel safety. The value of this current is manufacturer.Voltagelimitingmeansshould be con-
available from the manufacturer.
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ICs 1 .l-1984
Page 2

Section 3
APPLICATION GUIDELINES

3.1 GENERALAPPLICATIONPRECAUTIONS 3.2CIRCUITISOLATIONREQUIREMENTS


3.1.1CircuitConsiderations 3.2.1SeparatingVoltages
The consequences of some malfunctions such as those Solid state logic uses low level voltage(e.g., less than
caused by shortedoutput devices, alteration, lossof 32 volts dc) circuits. In contrast, the inputs and outputs
memory, or failure of isolation within components or logicire-often high level (e.g.; 1 2 0 ~ 0 l tac) s voltages. Proper
devices, require that the userbe concerned with the safe- design of the interface protects+.against an unwanted in-
ty of personnel and the protection of the electronics. teraction between the low level and high level circuits;
It is recommended that circuits which the user considers such an interaction can result
in a failure of the low voltage
to be critical to personnel safety, such asend oftravel circuitry. This is potentially dangerous. An input and out-
circuits and emergency stop circuits, should directly put circuitry incorporating effective isolation techniques
control their appropriate functionsthrough an elec- (which may include limiting impedance or Class 2 sup-
tromechanical device independent of the solid state logic. plied circuitry) should be selected.
Such circuits should initiate the stop function through de-
energization ratherthan energization of the control device. 3.2.2IsolationTechniques
This provides a means of circuit control that is indepen- The most important function of isolation components
dent of system failure. is to separate high level circuits from low level circuits
in order to protect against thetransfer of a fault from one
3.1.2 PowerUp/PowerDownConsiderations level to the other. I
,
Consideration should be given to system designso that Isolation transformers, pulse transformers, reed relays,
unsafe operation does not occur under these conditions or optical couplers are typical means to transmit low level
since solid state outputsmay operate erratically for
period of time after applying or removing power.

3.1.3 RedundancyandMonitoring
a short logic signals to power devices in the high level circuit.
Isolation impedance means also are used to transmit logic
signals to power devices.

3.3SPECIALAPPLICATIONCONSIDERATIONS
e
Whensolid state devices are beingusedtocontrol
operations, which the user determines to be critical, it is 3.3.1ConvertingLadderDiagrams
strongly recommended that redundancy and some form Converting a ladder diagram originally designed for
of checking be included in the system. Monitoring cir- electromechanical systems to one using solid state con-
cuits should check that actual machine or process opera- trol must account for the differences between elec-
tion is identical to controller commands; andin the event tromechanical and solid state devices. Simply replacing
of failure inthemachine, process, or themonitoring each contact in the ladder diagram with a corresponding
system, the monitoring circuits should initiate
a safe shut- solid state contact will not always produce the desired
down sequence. logic functions or fault detection and response. For ex-
ample, in electromechanical systems, a relay having a
3.1.4OvercurrentProtection mechanically linked normally open (NO) and normally
To protect triacs and transistors from shorted loads,a closed (NC) contact can be wired to check itself. Solid
closely matched short circuit protective device (SCPD) state components do not have a mutually exclusive NO-
is often incorporated. These SCPDs should be replaced NC arrangement. However, external circuitry can
be *

only with devices recommended by the manufacturer. employed to sample the input and contact state and
compare to determine if the systemisfunctioning
3.1.5OvervoltageProtection properly.
To protect triacs, SCRsand transistors from over- 3.3.2Polarity andPhaseSequence
voltages, it may be advisable to consider incorporating Input power andcontrol signals shouldbe applied with
peak voltage clamping devices such as varistors, zener polarity andphase sequence as specifiedby the manufac-

e
diodes, or snubber networks in circuits incorporating these turer. Solid state devices can be damaged by the applica-
devices. tion of reverse polarity or incorrect phase sequence.

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ICs 1.1-1984
Page 3

a 3.4
Planning
Electrical
Noise
Rejection
The low energy levels of solid state controls may cause
3.4.3DesignofWiringforMaximum
Protection
them to be vulnerable to electrical noise. This should be Once the installation site and power conductors have
considered in the planning stages. been examined, the system wiring plansthat will provide
noise suppression should be considered.
3.4.1AssessingElectricalEnvironment Conducted noiseenters solid statecontrol at the points
Sources of noise are those pieces of equipment that have where the control is connected to input lines, output lines,
large, fast changing voltages or currents when they are and power supply wires.
energized or de-energized, such as motor starters, welding Input circuits arethe circuits most vulnerable to noise.
equipment, SCR type, adjustable speed devices and other Noise may be introduced capacitatively through wire to
inductive devices. These devices, as well as the more com- wire proximity, or magnetically from nearby lines car-
mon control relays and their associated wiring, all have rying large currents. In most installations, signal lines and
the capabilityof inducing serious current and voltage tran- power linesshould beseparate. Further, signallines
sients on their respective power lines.It is these transients should be appropriately routedand shielded according to
which nearby solid state controls must withstand and for the manufacturers recommendations.
which noise immunity should be provided. When planning system layout, care must be given to
An examination of the proposed installationsite of the appropriate groundingpractice.Becausedesign dif-
solid state control should identify equipment that could ferences may call for different grounding, the control
contaminate power lines.All power lines that will be tap- manufacturers recommendations should be followed.
ped by the proposed solid state control should be examined
for the presence, severity, andfrequencyofnoise occur- 3.5COUNTERINGTHEEFFECTSOF
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rences. If found,systemplansshouldprovideforthecon- OFF-STATECURRENT


se.
I such trol of 3.5.1Current
Off-State
Solid state components, such astriacs, transistors, and
3.4.2 SelectingDevicestoProvideNoise thyristors, inherentlyhave in theoff-state a small current
Immunity off-state called flow current.
Installationplanningis not complete withoutexamina- Off-state current may also be contributed by devices
tionofthenoiseimmunity characteristics ofthesystem used to protect these comPOnents* as RC snubbers*
devices under consideration. Results of tests to determine
relative immunity to electrical noise maybe requested 3.5.2Off-StateCurrentPrecautions
from the manufacturer. Two such standardized tests are Off-state currents in a device in the off-state may pre-
theANSI(C37.90a-1974) Surge Withstand Capabiliq sent a hazard of electrical shock and the device should
Test and the NEMA (ICs 1-1983) noise test referred to be disconnected from the power source before working
as The Showering Arc Test. These are applied where direct on the circuit or load.
connection of solid state control to other electromechanical Precautions should be taken to prevent the off-state cur-
control circuits isintended. Circuits involvinganalog rent of an output device which is in the off-state from
regulating systemsor high speed logicare generally more energizing an input device.
sensitive to electrical noise; therefore, isolationand
separation of these circuits is more critical. 3.6AVOIDINGADVERSEENVIRONMENTAL
Further information on electrical noise and evaluation CONDITIONS
of the severity ofnoisemaybefoundin ANSIAEEE 3.6.1
Temperature
Publication No. 518-1982. Solid state devices should onlybe operated within the
Where severe power line transients are anticipated or temperature rangesspecified by the manufacturer.
noted, appropriate filters such as commercially available Because such devicesgenerate heat, care should be taken
line filter, isolation transformers, or voltagelimiting to see that the ambient temperature atthe device does not
varistors, should be considered. exceed the temperature range specified by the
All inductive components associated with the system manufacturer.
should be examined for the need for noise suppression.

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Page 4

The main source of heat in a solid state system is the not


adequately protected
against
atmospheric
energy dissipated in the power devices. Since the life of contaminants.
the equipment can be increased by reducing operating If these contaminants are allowed to collect on printed
temperature, it is important to observe the manufacturers circuit boards, bridging between the conductors may result
maximum/minimum ambient temperatureguidelines, in malfunction of the circuit. This could lead to noisy,
where ambient refers to the temperature of the air pro- erratic control operation or, at worst, apermanent
viding the cooling. The solid state equipment must be malfunction. A thick coating of dust could also prevent
allowed to stabilize to within the manufacturers recom- adequate cooling on the board or heat sink, causing
mended operating temperature range before energizing malfunction. A dust coating on heat sinks reduces their
control functions. thermal efficiency.
When evaluating a systemdesign, other sources of heat Preventive measures include a specially conditioned
in the enclosure which might raise the
ambient room or a properly specified enclosure for the system.
temperatureshouldnotbeoverlooked.Forexample,
power supplies, transformers, radiated heat, sunlight, fur- 3.6.3 Shock andVibration
naces, incandescentlamps.and so forthshould be
evaluated. Excessive shackor vibration may cause damageto solid
In instances where a system will have to existin a very state equipment. Special mounting provisions may bere-
hot ambient environment, special cooling methods may quired to minimize damage.
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have to be employed. Techniques that are employed in-


cludecooling fans (with adequate filtering), vortex
3.7 TheNeedforEducation-Knowledge
coolers, heat exchanges, and air conditioned rooms.
Over-temperature sensorsare recommended for systems Leads to Safety
where special cooling is employed. Useof air condition- Planning for an effective solid state circuit requires
ing should include means for prevention of condensing enough knowledgeto make basic decisions that will render
moisture. the system safe as well as effective.
Everyone who works with asolid state control should
3.6.2
Contaminants be educated in its capabilities and limitations. This in-
Moisture, corrosive gases and liquids, and conduc- cludes in-plant installers,operators, service personnel, and
tive dust can all have adverse effects on a system that is system designers.

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Page 5

Section 4
INSTALLATION GUIDELINES

4.1INSTALLATIONANDWIRING The manufacturers recommendations should be follow-


PRACTICE ed for the selection of enclosures, ventilation, air filter-
4.1 .1 Proper installation and field wiring practices are ing (if required), and ambienttemperature. These recom-
of prime importanceto the application of solid state con- mendations mayvary from installationto installation, even
trols. Proper wiring practice will minimizethe influence within the same facility.
of electrical noise,whichmaycausemalfunctionof
equipment. 4.3 SPECIAL HANDLING OF ELECTROSTATIC
Users and installers shouldfamiliarizethemselves with SENSITIVE DEVICES
and follow installation and wiring instructionsin addition Some devicesmay be damaged byelectrostaticcharges.
to requirements of all applicable codes, laws, and stan- These devices are identified and shouldbe handled in the
dards. The manufacturer of the device or component in special manner specified by the manufacturer.
question should be consulted whenever conditions arise NOTE: Plastic wrapping materials used to ship these
that are not covered by the manufacturers instructions. devices may be conductive and should notbe used as in-
sulating material.
4.1.2 Electrical noise is a very important consideration
in any installation of solid state control. While wiring
practices may vary from situationto situation, the follw- 4.4COMPATIBILITY OF DEVICESWITH
ing are basic to minimizing electrical noise: APPLIED VOLTAGES AND FREQUENCIES
l . Sufficient physicalseparation should be maintained Prior to energization, users and installers should verify
between electrical noise sources andsensitive equipment that the applied voltage and frequency agree with the rated
to assure that the noise will not cause malfunctioning or voltage and frequency specified by the manufacturer.
unintended actuation of the control. NOTE: Incorrect voltage or frequency may cause a
2. Physical separation should be maintained between malfunction of, or damage to, the control.
sensitive signal wires and electrical power and control
conductors. This separation can be accomplished by con- 4.5TESTINGPRECAUTIONS
duits, wiring trays, or as otherwise recommended by the When testing solid state control, the procedures and
manufacturer. recommendations setforth by the manufacturer shouldbe
3. Twisted-pair wiring shouldbe used in critical signal followed.
circuits and noise producingcircuits to minimize magnetic When applicable, instrumentation and test equipment
interference. should beelectrically equivalent to that recommendedby
4. Shieldedwireshould be used to reduce the the manufacturer forthe test procedure. A low impedance
magnitude of the noise coupledinto the low level signal voltage tester should not be used.
circuit by electrostatic or magnetic coupling. High voltage insulationtests and dielectric tests should
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5. Provisions of the 1984 National Electrical Code* never be used to test solid state devices. If high voltage
with respect to grounding shouldbe followed. Additional insulation of field wiring is required, solid state devices
grounding precautionsmay be required to minimize elec- should be disconnected. Ohmmeters should only be used
trical noise. These precautions generally deal with ground whenand as recommended by the equipment
loop currents arising from multiple ground paths. The manufacturer.
manufacturers recommendations should be followed. Testing equipment should be grounded; if it isnot,
special precautions should be taken.
4.2ENCLOSURES(COOLINGAND
VENTILATING)
4.6 STARTUPPROCEDURES
Suitableenclosuresand control of the maximum
operating temperature, both of which are environmental Checks and tests prior to startup and startup procedures
variables, may be neededto prevent malfunctionof solid recommended by the manufacturer should be followed.
state control.

* Available from National Fire Protection Association, Batterymarch


Park, Quincy, MA 02269.

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Page 6

Section 5
PREVENTIVE MAINTENANCE AND REPAIR GUIDELINES

5.1 GENERAL be taken to avoid damaging any delicate components and


A well-planned and executed maintenance program is to avoid displacing dust, dirt, or debris in a way thatper-
essential to the satisfactory operation of solid state elec- mits itto enter or settle into parts of the control equipment.
trical equipment. Thekind
and
frequency
of
the 7. Enclosures should be inspected for evidence of
maintenance operation will vary with the kind and com- deterioration. Accumulated dust anddirt should be remov-
plexity ofthe equipment as well as with the nature of the ed from the top of the enclosures before opening doors
operating conditions. Maintenance recommendations of or removing covers.
the manufactureror appropriate product standards should 8. Certain hazardous materials removed as partof
be followed. maintenance or repair procedure (e.g., polychlorinated
Useful reference publications for setting up a biphenyls (PCB) found in some liquid filled capacitors)
maintenance programare NFPA 70B-1983,Muinrenance must be disposed of as described in Federal regulations.
ofElectrical Equipment, and NFPA 7OE-1983,Elecrrical
Safety Requirements for Employee Workplaces. 5.3 REPAIR
If equipment conditionindicates repair or replacement,
5.2 PREVENTIVEMAINTENANCE the manufacturers instruction manual should be follow-
The following factors should be considered when for- ed carefully. Diagnostic information within such a manual
mulating a maintenance program: shouldbeused to identify the probable source of the
1. Maintenance must be performed by qualified per- problem, and to formulate arepair plan. The level of field
sonnel familiar withthe construction, operation, and repair recommendedby the manufacturershould be
hazards involved with the control. followed.
2. Maintenance should be performed with the control When solid state equipment is repaired, it is important
out of operation and disconnected from all sources of that any replacementpart be in accordance with the recom-
power. If maintenance must be performed while the con- mendations ofthe equipment manufacturer. Care should
trol is energized, the safety related practices of NFPA 70E be taken to avoid the use of parts which are no longer
should be followed. compatible with other changes in the equipment. Also,
3. Care should be taken when servicing electrostatic replacement parts should be inspected for deterioration
sensitivecomponents. The manufacturers recommenda- due to shelf life and forsigns of rework or wear which
tions for these components should be followed. may involve factors critical to safety.
4. Ventilationpassagesshouldbekeptopen. If the After repair, proper start-up proceduresshould be
equipmentdependsupon auxiliary cooling, e.g., air, followed. Special precautions should be takento protect
water, or oil, periodic inspecticn (with filter replacement personnel from hazards during start-up.
when necessary) should be made of these systems.
5 . The means employedfor grounding or insulating the 5.4 SAFETYRECOMMENDATIONSFOR
equipment from ground should be checked to assure its MAINTENANCE PERSONNEL
integrity (see 4.5).
All maintenance work should be doneby qualified per-
6 . Accumulations of dust and dirt on parts,
all including
sonnel familiar with the construction, operation, and
on semiconductor heat sinks, should be removed accor-
hazards involved with the equipment. The appropriate
ding to the manufacturers instructions,if provided; other-
work practices of NFPA 70E should be followed.
wise, the manufacturer should be consulted. Care must

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