Review on Highly Integrated

Solutions for Power

Electronic Devices
Part I
Topics

Higher integration by improving the thermal performance

How to improve the thermal performance
Liquid cooling by cold plates
Jet impingement and finned base plates
Liquid cooled micro-channel base plates
Double side cooling
Stacked Modules
Reliability Aspects
Conclusion
Topics

Higher integration by improving the thermal performance

How to improve the thermal performance
Liquid cooling by cold plates
Jet impingement and finned base plates
Liquid cooled micro-channel base plates
Double side cooling
Stacked Modules
Reliability Aspects
Conclusion
Higher Integration of Power Semiconductor Devices

Main targets:
Reduce space and weight
Reduce costs
Tools:
Chip improvements
Passive component improvements
Novel packaging concepts
Novel cooling concept

Subject of presentation
includes
Topics

Higher integration by improving the thermal performance

How to improve the thermal performance
Liquid cooling by cold plates
Jet impingement and finned base plates
Liquid cooled micro-channel base plates
Double side cooling
Stacked Modules
Reliability Aspects
Conclusion
How to Improve the Thermal Performance

A Increase the heat transfer area by heat spreading

B Eliminate thermal barriers

C Decrease the thickness of thermal barriers

D Increase the thermal conductivity by using new materials

E Combine above mentioned improvements

Heat Spreading

Chip 10 x 10 mm Chip 10 x 10 mm

0.3 mm 2 mm Heatspreader
(Cu)
Isolator Isolator
FHT = 106 mm2 FHT = 144 mm2

R th F1 106
= = = 0,74
R th F2 144
General Design of a Power Module

Thermal grease Thermal Resistance

Current contact
Silic on

Solder

Gate contact Copper of DBC Substrate

Al thick wire bond AlN Ceramic

Copper of DBC Substrate

Solder
Diode IGBT
Cu Baseplate
DBC /AMB substrate
Thermal Grease
Cu base plate
Heatsink Aluminium
Heat sink
0 100 200 300 400
Thermal Resistanc e [ K/kW ]
 How to Eliminate Thermal Barriers

A Replace heatsink by cold plate and high efficient liquid-air heat

exchanger Thermal grease

Current contact

B Eliminate thermal grease layers by Gate contact

Al thick wire bond
direct liquid cooling base plates backside
direct liquid cooling substrates backside Diod IGBT
DBC e/AMB substrate
solder attach of the substrate to the Cu base plate
cold plate Heat sink

C Replace solder layer between substrate and liquid cooler by direct

integration of the substrate into the liquid cooler system
double side chip cooling and use methods A and B (and C?)
Topics

Higher integration by improving the thermal performance

How to improve the thermal performance
Liquid cooling by cold plates
Jet impingement and finned base plates
Liquid cooled micro-channel base plates
Double side cooling
Stacked Modules
Reliability Aspects
Conclusion
 Standard Power Module on a Liquid Cooled Plate

Current contact

Gate contact
Al thick wire bond

Diode IGBT
DBC AMB substrate

Liquid Cold plate

Courtesy: Aavid Thermal Solutions

Air and Liquid Cooling Systems Compared HydroSinkTM

600 x 300 x 250 mm = 45 l 500 x 300 x 200 mm = 30 l

1.5 kW power loss 2 kW power loss
Tj = 125 C Tj = 110 C
Rth = 40 C/kW Rth = 20 C/kW
20 kg 5 kg
0.6 kW/l (efficiency 95%) 1.3 kW/l (efficiency 95%)
Rth as a Function of Water Flow

Normalized Thermal Resistance

[C x m 2/W] 0,1 Tube cold plates

0,01

Macro/microchannelcold plates

0,001
0 2 4 6 8 10 12 14
Water Flow Rate [l/min]
Topics Part II (coming soon)

Higher integration by improving the thermal performance

How to improve the thermal performance
Liquid cooling by cold plates
Jet impingement and finned base plates
Liquid cooled micro-channel base plates
Double side cooling
Stacked Modules
Reliability Aspects
Conclusion
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