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Simulation of Flow Inside Heat Pipe: Sensitivity


Study, Conditions and Configuration

CONFERENCE PAPER AUGUST 2011


DOI: 10.1115/ES2011-54295

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Pawan Singh Isam Janajreh


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Proceedings of ASME 2011 5th International Conference on Energy Sustainability & 9th Fuel Cell Science,
Engineering and Technology Conference
ESFuelCell2011
August 7-10, 2011, Washington, DC, USA

ESFuelCell2011-54295

SIMULATION OF FLOW INSIDE HEAT PIPE: SENSITIVITY STUDY, CONDITIONS


AND CONFIGURATION

Nouman Zahoor Ahmed Pawan K. Singh


Masdar Institute of Science and Technology Masdar Institute of Science and Technology
Abu Dhabi, U.A.E. Abu Dhabi, U.A.E.

Isam Janajreh Youssef Shatilla


Masdar Institute of Science and Technology Masdar Institute of Science and Technology
Abu Dhabi, U.A.E. Abu Dhabi, U.A.E.

ABSTRACT and solve these equations in a coupled conjugate heat


transfer set up. The geometry of heat pipe is divided in
Heat pipes are widely used as a heat transporting device two different regions which solve simultaneously. The
in a variety of applications. From space satellites, large first region is core region where only vapor flow is
industrial appliances to a heat sink for cooling electronic assumed. The second region consists of wall and wick
components and packages. Heat pipes are extremely structure through which the mass transfer due to
efficient because of their high effective thermal wettability and heat dissipates through conduction. Water
conductivity, compactness, low cost and reliability. was used as flowing fluids through wick porous structure.
Therefore, the designers of heat sinks are often required Previous experimental as well as numerical models
to optimize the performance of the heat pipe itself in regarding the heat pipes have been studied and used for
order to improve the overall thermal management system the verification of the present model along with a
of any particular equipment. However, the detailed standard grid convergence study. The effects of different
internal modeling of a heat pipe presents a challenging heat pipe length, heat fluxes, wall thickness, wall
problem for an engineer. It is a multi physics problem material and porosity are investigated. The pressure drop
including two phase flow within porous media and with and wall temperature increase with the value of heat flux.
conjugate heat transfer adding the solicited high capillary Similarly, porosity and wall material affect the wall
and surface tension effect. temperature distribution. The effect of wall thickness and
heat pipe length was not significant. In addition, a
In this present study, detailed modeling of the heat pipe theoretical model is developed for the pressure drop
considering the mentioned effects is pursued. A basic across the heat pipe in vapor region and the respective
review of the governing equations describing the output was used for the simulation. Finally, the
complete heat pipe operation is given. The commercially temperature distribution in wall and wick is shown and
available simulation tool Fluent 6.3 is used to describe discussed.

1 Copyright 2011 by ASME


NOMENCLATURE: c condenser, capillary
e evaporator
A Cross-sectional area, m2
h Characteristic dimension (half width or INTRODUCTION
radius), m Although heat pipe was invented much earlier, its
hfg Latent heat of vaporization, J/kg application in the electronics thermal management started
around 1990s [1]. Perhaps the drive towards
k Thermal conductivity miniaturization and increasing processing capacity for the
K(R) Constant of integration electronics has been the fundamental demand where heat
pipes serves extremely well as they can transfer large
L Length, m amount of heat from a heat source to heat sink effectively.
Leff Effective length of the heat pipe, m2 Since then it has become an integral part of the heat sink
mechanism for numerous devices. Fig. 1 shows a typical
m Mass flow rate, kg/s
cylindrical heat pipe similar to the one that has been
P Pressure, Pa chosen for our present study.
P Pressure drop, Pa
Previously several theoretical and experimental work has
Q Heat Flux, W been conducted with the aim of analyzing the fluid
behavior inside the heat pipe so as to optimize the device
Qmax Maximum heat flux, W/m2
for maximizing the heat transport. Thermal resistance
Rc Radius of curvature, m network analysis for a heat pipe has been used
successfully to estimate the temperature drop for a given
rp Radius of capillary or pore, m heat flux. Peterson [2] has used this approach to optimize
heat pipe cooling device for mobile computers by
Temperature, K comparing two different prototypes where the maximum
T
heat transport capacity for any heat pipe is limited by the
u Coordinate in the vertical (radial) direction of fundamental wicking or capillary limitation along with
heat pipe
sonic, entrainment and boiling limitations as given in
x Coordinate in the vertical (radial) direction of various references [3][4].
heat pipe
y Coordinate in the vertical (radial) direction of Faghri [5] and Layeghi [6] have given a detailed
heat pipe numerical model for the vapor flow analysis in a
concentric annular heat pipe. Similarly, a detailed review
Dynamic viscosity, N.s/m2 discussing the design, modeling, limitations and testing
Density, kg/m3 procedures has been performed by Borujerdi and Layeghi
[7]. Relying on the velocity correlations derived through
Tilt angle, Radians
these studies for concentric annular heat pipes, Shoeib &
Dimensionless radial coordinate Mahtabroshan [8] have performed a CFD simulation for a
Permeability, m2 cylindrical heat pipe as well. However it is possible to

perform the heat pipe CFD analysis by using less strict


Divergence and different boundary conditions suited to optimize the
device under different working conditions.
Surface tension, N/m
Peterson [3] has described pressure distribution within
the heat pipe in detail using analytical experimental or
numerical simulation. The capillary pressure developed at
Subscripts the liquid interface and its variation along the length of
a adiabatic section, axial the heat pipe is described in detail. The vapor pressure
distribution has also been studied by Leong [9] for a flat

2 Copyright 2011 by ASME


heat pipe. The appropriateness of these pressure Where or Del is called the divergence
correlations as a boundary condition for the CFD = dissipation function
simulations and the associated velocities has also been q = internal heat generation rate per unit volume
addressed in this work.
qr = radiation heat flux
As the area of current interest is the use of heat pipe for
optimizing the microprocessor cooling in laptops and The pressure drop through the porous medium follows
typical heat sinks in laptops usually have one more heat Darcys law [10]:
pipe arranged with very little or no inclination angle.

Therefore the gravity effects have not been considered in l Leff m


Pl (4)
this analysis. l Aw
In the present study, effort has been made to simulate the
heat pipe mechanism with the actual temperature Finite volume based approach is used in this study. The
conditions that a heat pipe is subjected to in a typical simulations have been performed using Fluent 6.3. The
notebook computer for example. Reference values have system dimensions are supposed to follow continuum and
been selected from data obtained through latest processor hence the macroscopic properties of fluids are considered
specifications available on the Intel website [14]. for the analysis.

Pressure Distribution inside a heat pipe

For any heat pipe, the difference in capillary pressures at


the liquid vapor interface between evaporator and
condenser is given by Peterson [3],
2 2
Pc (5)
Rc ,e Rc ,c
And the maximum capillary pressure generated inside
heat pipe is,
Figure1. Illustration of heat pipe and its components 2
Pc ,max (6)
(evaporator section, adiabatic/convicted section, and Rc ,e
condenser section)
Where Rc ,e becomes the radius of the pore at the
evaporator. At this condition and according to the
GOVERNING EQUATIONS
standard steady state working condition for any heat pipe,
The governing equations that describe the behavior of
heat pipe are those which govern mass, momentum and Pc Pg Pl Pv (7)
energy conservation. That is, Where Pg is the gravitational head, the vapor phase
Conservation of Mass (continuity equation)
d pressure drop Pv can be neglected and the liquid phase
(.V ) 0
dt (1) pressure drop, Pl is given by Darcys Law Eq. (4).
Hence by using the relationship Qmax mmax h fg and
Conservation of momentum (Newtons second law of
putting in the values from Eq. (6) and Eq. (4) into Eq. (7)
momentum) or Navier Stokes Equation of fluid motion,
the maximum amount of heat flux that a heat pipe can
DV transport is given by [4],
P g 2V
Dt (2) l h fg Aw 2 l g Leff sin
Q max
r
l
Conservation of Energy
DT eff p
L
Cv P.V 2T .qr q (3)
(8)
Dt

3 Copyright 2011 by ASME


The variation of surface tension between the liquid The substitution for the inlet radial velocities, Ve , Vc ,
water and vapor at specified pressure is available through
literature. However, the variation of the radius of and the average axial velocity ua in the above equation
curvature Rc that affects the capillary pressure and further simplification yields the following results,
depends not only upon the pore size and temperature but Q 1 Le 2 2 La 1
P Lc 2 or
also on the saturation level of wetting fluid inside the h h fg Ae 2
2
Aa 2hAc
porous medium [11].
Q
Hence various mathematical formulations have been P 2 C1
made to show the general pressure distribution inside a h h fg (15)
heat pipe by simplifying the momentum equations The calculated value for constant C1 according to the
substituting velocity with heat flux values associated with
the latent heat [9] such that: parameters given in the Table 1 gives,
Q Q
V (9) P 3294 2
Ah fg h h (16)
fg
The theoretical correlations developed by Leong [9] for a For different values of heat flux, the associated pressure
flat heat pipe can be used to predict the vapor pressure drops and the radial velocities are given in the tabulated
distribution by replacing the characteristic dimension h form in Table 1.
from half width to the radius for a conventional
cylindrical heat pipe.
x2 NUMERICAL MODEL DETAILS
P( x, ) P(0, ) V
3 e
k ( R)
h 2 (10)
Numerical simulations of the descritized equation (1-3)
0 x Le have been performed in CFD software package, Fluent
6.3.26 under 2D, double precision axi-symmetric
P( x, ) P( Le , ) 2ua ( x Le )k ( R) (11) conditions to take advantage of the symmetry for
h2
cylindrical heat pipe. Fig 1 and Fig 2 shows the front and
Le x Le La
the side view of the geometry with the details and

P( x, ) P( Le La , ) Vc k ( R) ( Lx 12 x 2 ) 12 ( L2 Lc 2 ) specifications listed in Table 2.
h3
Le La x L
(12)
By the above equation, the pressure at the condenser end
can be given as-


L2e L2
P( L, ) P(0, ) 2 2ua La 3 V c
V
h 3 e
2 h h 2 c (13)
Hence by adding these individual pressures the total
vapor pressure difference between the start of the
evaporator and the condenser end can be given as,

P P( L, ) P(0, )
L2e L2
V
3 e
2 2ua La 3 V c (14)
h 2 h h 2c

4 Copyright 2011 by ASME


Outer evaporator wall: constant heat flux
Outer condenser wall: constant heat flux
Outer adiabatic section wall: natural convection

Typically heat flux values for processors ranges between


50 to 100 Watts [12]. Considering an average chip size of
3X3 cm2, this translates into the flux values between
50,000 to 100,000 Watts per cubic meters roughly.
Reference flux values given in table 1 are selected
keeping in view the above mentioned considerations.
However, localized flux on the silicon chip may rise quite
FIG 2. The geometry of heat pipe with mesh significantly up to 1,000 Watts per cm2 and this requires
Flux (Watts) Vapor Pressure Velocity at novel cooling techniques as discussed by [13]
Drop (Pa) evaporator Inlet
(m/s) At the interface between wick and vapor section,
81 0.1495 0.096 Clausisus clayperon equation describes the temperature
conditions.
108 0.1992 0.127 1
Tint
1 R P
135 0.2490 0.159 ln v (17)
Tv , sat h fg Pv , sat
Table 1: Pressure drop with available heat dissipation Corresponding to the different flux values, inputs from
Table 1 have been used to capture the fluid motion and
Parameter Value pressure drop effects.
Total length 0.2 m
Evaporator 0.025 m Since the thickness of the heat pipe is very small as
Adiabatic Section 0.115 m compared to the length hence the heat losses from the
Condenser 0.06 m sides can be assumed as negligible. Constant heat source
and heat sink are added to incorporate the effect of latent
Wick thickness 0.15e-3 m heat.
Wall thickness 0.75e-3 m
Inner core radius 4e-3 m Heat pipe analysis is carried out under steady state
conditions.
Saturated Temperature 323 K
Water density 1000 kg/m3 VALIDATION OF NUMERICAL SCHEME
Vapor density 0.5974 kg/m3
viscosity 121e-7 Pa.sec Figure 3 shows the pressure variation inside the core
hfg 2260 KJ/kg vapor region. The vapor pressure distribution conforms to
the general trend shown by the previous experimental,
Table 2: Details of heat pipe with properties values. studies conducted by Faghri and Layeghi for concentric
annular heat pipe which showed the comparison of
INITIAL AND BOUNDARY CONDITIONS normalized pressure distribution [5] [6]. Here, the values
are not compared since the geometries for both the
For a heat pipe, typical boundary conditions include the analysis were different. The trend shows a nonlinear
isothermal temperature conditions at the evaporator and pressure drop in evaporator section which is due to the
condenser section. This can be replaced with the constant change in velocity. In the adiabatic region, pressure drop
heat flux condition at one or both of these sections such is linear; demonstrating that the velocity in this region is
that: in axial direction with constant value. The condenser

5 Copyright 2011 by ASME


region again shows the increase in pressure drop due to
decrease in velocity. Here the present graph differs from
the results of Faghri et. al. [5] because the values selected
for Radial Re number in their study were very low, which
made the velocity in condenser region almost constant
and hence no significant pressure drop was observed,
while our present study is done for moderate radial Re
and so the pressure try to recover in condenser section.
This increase is again nonlinear due to same reason given
for the evaporator. The solution has been checked with
three different grids with 1407 nodes, 3000 nodes and
5213 nodes.

No. of nodes Variable Error %


1 1407 Vapor Pressure -
2 3000 Vapor Pressure 2 FIGURE 4 (A). Validation of numerical scheme with
3 5213 Vapor Pressure 0.5 avaiable results.

Table 3: Grid sensitivity analysis

FIGURE 3. Grid sensitivity study.


FIGURE 4(B). Validation of numerical scheme with
It is found that the change in vapor pressure distribution avaiable results.
is less than 0.5 % while increasing the number of nodes
from 1407 to 5213 nodes. Hence the core vapor region is a. Pipe length
solved with 5213 nodes. Similarly for wall-wick region
also, the grid independence test is carried out and it is Since in a heat pipe, the length of evaporator and
found that 4207 nodes are sufficient to carry out the condenser cannot be changed due to geometric
simulation. The mesh scheme adopted for both the consideration, the length of heat pipe can be changed
regions was quadrilateral mesh. only by changing adiabatic length. Fig. 5 describes the
variation of wall temperature for different lengths of heat
Results and Discussion: pipe. The variation of wall temperature is shown for three
The working and efficiency of heat pipe depend on a lot different heat pipe lengths, 0.2 m, 0.225 m and 0.25 m. It
of parameters like length, radius, material, heat can be seen here, the trend and values of wall temperature
dissipated, wick structure etc. The following section does not change with different heat pipe length. Only
shows the effect of these parameters one by one. they shift according to adiabatic length. The probable

6 Copyright 2011 by ASME


reason for this behavior lies in the basic heat transfer c. Heat flux
mechanism of heat pipe. Since the heat dissipated Fig. 7 shows the temperature variation at wall against
through evaporator and condenser is not changed and the length of heat pipe for different values of powers. The
heat transfer through adiabatic part is negligible, the
value takes are actual and taken from INTEL [14]. It can
trend of wall temperature remains constant with different
heat pipe length. be seen here that the trend of temperature is same for all
the fluxes. The evaporator section wall shows a steep
variation in wall temperature, indicating that the
maximum heat transfer occur in the evaporator section. It
is expected, since to simulate the real condition, a heat
source is added in the evaporator section in addition of
normal steady heat conduction. The values of
temperatures are constant in adiabatic section. Since the
heat transfer from this section is only through natural
convection, so the heat dissipated through this section is
low and does not make any change in the temperature.
The condenser region also shows the same trend as
adiabatic section except that it is at lower values than that
of adiabatic region. The mechanism of heat transfer in
this section is force convection. This makes the heat
FIGURE 5 Wall temperatures against different Pipe transfer better compared to adiabatic section, but it is still
length not enough to make any significant change in variation of
temperature. As expected, the temperature is highest for
b. Wall diameter the 135 watt power and lowest for the 75 W powers. It
The change in pipe diameter will change the surface area clearly demonstrate that the maximum heat transfer and
available for heat transfer. The variation of wall so the wall temperature occur with maximum power.
temperature with wall thickness is shown in Fig. 6. Three
wall thickness, 0.15 mm, 0.25mm and 0.35 mm are taken
for analysis and it can be seen from fig. 6 that the change
in variation of wall temperature with wall thickness is
negligible. It shows that the conduction heat transfer
through wall does not change much with wall thickness.

FIGURE 7. Wall temperature against Pipe length with


different heat
FIGURE 6 Wall temperatures against different Pipe
length

7 Copyright 2011 by ASME


d. Porosity
The effect of porosity on the variation of temperature is Copper. The reason for this difference lies in the thermal
also investigated. Fig. 8 is plotted by considering three conductivity of the material used. The value of thermal
different wick structures having different porosity for conductivity is highest for Copper and lowest for Steel.
same heat flux. Here also the nature of graphs is same as Also the difference in the values of thermal conductivity
figure 7. is of one order for Steel and Copper and so the values of
It is clearly visible that the values of wall temperature are wall temperature are maximum for Steel and lowest for
higher with higher porosity and lowest for the lowest Copper.
porosity of wick in evaporator wall. It means that the heat
pipe with lower porosity is better. In other words, the
void fraction should be lower and mesh in wick will be
having more solid region. This will help in increasing
capillary pressure and flow will be easy. But at the same
time, it will decrease mass flow rate due to less space
available for flow and hence decrease the heat
dissipation. There is a need of optimum porosity to get
maximum heat dissipation. Also the change in the wall
temperature is very steep with porosity.

e. Wall material
The following graph shows the effect of wall material on FIGURE 9. Wall temperature against different wall
distribution of temperature. It is a well known fact [3] material
that we cannot choose the wall and liquid materials. Their
compatibility needs to be checked before using them. Figure 10 shows the axial distribution of vapor pressure
From the literature, [3] three most common wall for different heat flux along the length of heat pipe. It can
materials; Copper, Aluminum and Steel are chosen. It can be seen here that the variation of pressure is highest for
be seen from Fig. 9 that the wall temperature varies the maximum heat flux. This is expected, since to co-up
significantly with wall material. The values of
temperature are the highest for Steel and the lowest for

FIGURE 10. Pressure distribution in vapor region with


FIGURE 8. Wall temperature against Pipe length with
different heat flux
different values of porosities

8 Copyright 2011 by ASME


with high heat dissipation the flow area needs to be
increased and hence the pressure drop.
Figure 11 shows the temperature distribution inside the
wick and wall structure for three different heat flux. As
expected the values of temperature is highest for higher
heat flux. The contour also shows that the values of
temperature is higher towards wall and it decrease
axially. The value of temperatures decreases also towards
y axis. This shows that the heat transfer is in both
(a)
directions. Also these heat transfers are mainly due to
conduction inside the wall and wick.

CONCLUSION

In this work the numerical analysis of heat pipe is carried


out. The governing mass, momentum and energy equation
for conjugate heat transfer are descritized and solved
using Fluent 6.3 commercial code. The geometry is
divided in two regions. First one is core region through
which vapor flows and second one is wall wick region. In (b)
addition, the equation for pressure drop in vapor region is
developed and the inputs for numerical model are taken
from this analysis. The effects of various parameters like
heat flux, porosity, wall thickness, pipe length and wall
material are discussed. The variation of wall temperature
with different pipe lengths and wall thickness was not
significant. It is found that the wall temperature increases
with heat flux. The porosity plays a major role in
heatpipe and as it increases temperature of the evaporator
(c)
decreases. The material of wall is an important concern
while designing the heat pipe since it changes FIGURE 11. Temperature distributions inside wall and
significantly the variation of wall temperature. From the wick for different heat flux (a) 90, (b) 120 and (c) 150
theoretical analysis, it is found that pressure drop across kW/m2.
the vapor region increases with higher heat dissipation.
The temperature distribution in the wall and wick region ACKNOWLEDGEMENTS
is shown. The regions, vapor and wall-wick are coupled The financial support from Masdar Institute to carry this
through velocity. Still they are now coupled directly and work is highly acknowledged. The author would like to
solved separately. The further analysis is going on to extend his gratitude for the help and support received
make the heat pipe simulation more real and accurate. from the Waste to Energy Group at Masdar Institute.

9 Copyright 2011 by ASME


REFERENCES
[1] Scott D. Garner, September 1, 1996, Heat Pipes for
Electronics Cooling Applications, Electronics
Cooling.
[2] Y. Wang, G. P. Peterson, 2003, Flat Heat Pipe
Cooling Devices for Mobile Computers,
Proceedings of ASME International Mechanical
Engineering Congress, Washington, D. C.
[3] G. P. Peterson, 1994, An Introduction to Heat Pipes
Modelling, Testing and Applications, John Wiley &
Sons Inc., NY.
[4] A. F. Mills, 1999, Heat Transfer, Prentice Hall Inc.,
NJ.
[5] A. Faghri, 1989, Performance characteristics of a
concentric annular heat pipe: Part II- vapor flow
analysis, Journal of Heat Transfer Vol. (111).
[6] A. Borujerdi & M. Layeghi, 2004, Numerical
Analysis of Vapor Flow in Concentric Annular Heat
Pipes, Journal of Heat Transfer Vol. (126).
[7] A. Borujerdi, M. Layeghi, 2005, A Review of
Concentric Annular Heat Pipes, Heat Transfer
Engineering, Vol. (26), No. 6,
[8] S. Mahjoub & A. Mahtabroshan, 2008, Numerical
Simulation of a conventional heat pipe, World
Academy of Science, Engineering and Technology
Vol. (39).
[9] K. C. Leong, C. Y. Leong, 1996, Vapor Pressure
Distribution of a Flat Heat Pipe, Int. Comm. Heat
Mass Transfer, Vol. (23), No. 6, pp. 789-797.
[10] James A. Fay, 1994, Introduction to Fluid
Mechanics, The MIT Press.
[11] G. F. Pinder, W. G. Gray, 2008, Essentials of
Multiphase Flow and Transport in Porous Media,
John Wiley and Sons Inc., NJ
[12] Intel corporation website:
http://www.intel.com/products/processor/index.htm,
last visited in Jan 2011.

[13] A. B. Cohen, P. Wang, 2009, Thermal management


of on-chip hot spot, Proceedings of 2nd
Micro/Nanoscale Heat and Mass Transfer
International Conference.
[14] Fluent Inc., Fluent 6.3 Users Guide 2006.

10 Copyright 2011 by ASME

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