Professional Documents
Culture Documents
Volume 20
S.C. Mukhopadhyay G.S. Gupta
123
Subhas Chandra Mukhopadhyay Gourab Sen Gupta
School of Engineering and School of Engineering
Advanced Technology (SEAT) and Advanced Technology (SEAT)
Massey University (Turitea Campus) Massey University (Turitea Campus)
Palmerston North Palmerston North
New Zealand New Zealand
S.C.Mukhopadhyay@massey.ac.nz G.SenGupta@massey.ac.nz
c 2008 Springer-Verlag Berlin Heidelberg
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Contents
Part VI Ultrasonic
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 401
List of Contributors
Derek Abbott
Centre for Biomedical Engineering (CBME), School of Electrical and Electronic
Engineering, University of Adelaide, Australia,
e-mail: dabbott@eleceng.adelaide.edu.au
Moawia O. Ahmed
School of Materials Science and Engineering, Nanyang Technological University
50 Nanyang Avenue, Singapore 639798
Said F. Al-Sarawi
Centre for High Performance Integrated Technologies and Systems (CHiPTec),
School of Electrical and Electronic Engineering, University of Adelaide, Australia,
e-mail: alsarawi@eleceng.adelaide.edu.au
C. Ambrosino
Engineering Department, University of Sannio, C.so Garibaldi 107 82100
Benevento, Italy, e-mail: carmen.ambrosino@unisannio.it
M. Andersson
Department of Physics, Chemistry and Biology, Linkoping University, Sweden
Kunihiro Asada
Department of Electronic Engineering, VLSI Design and Education Center
(VDEC), The University of Tokyo, e-mail: asada@silicon.t.u-tokyo.ac.jp
Syed Mahfuzul Aziz
School of Electrical and Information Engineering, University of South Australia,
Mawson Lakes, SA 5095, Australia, e-mail: mahfuz.aziz@unisa.edu.au
Takehito Azuma
Department of Electrical and Electronics Engineering, Utsunomiya University,
7-1-2 Yoto, Utsunomiya 321-8585, Japan, e-mail: tazuma@cc.utsunomiya-u.ac.jp
ix
x List of Contributors
J. Belmonte
Department of Materials, Imperial College London, UK
Francis Bony
Universite de Toulouse, LOSE, INPT, ENSEEIHT, Toulouse, France
Thierry Bosch
Universite de Toulouse, LOSE, INPT, ENSEEIHT, Toulouse, France,
e-mail: thierry.bosch@enseeiht.fr
G. Breglio
University Federico II Department of Electronic and Telecommunication
Engineering via Claudio 21, Naples, Italy
Graham M. Brooker
Australian Centre for Field Robotics, University of Sydney, Sydney, Australia,
e-mail: gbrooker@acfr.usyd.edu.au
K. Buchholt
Department of Physics, Chemistry and Biology, Linkoping University, Linkoping,
Sweden, e-mail: kribu@ifm.liu.se
X. Chen
Department of Pure and Applied Chemistry, Faculty of Science and Technology,
Tokyo University of Science, Yamazaki 2641, Noda, Chiba,
e-mail: xqchen39@hotmail.com
Moi-Tin Chew
School of Engineering and Technology, Massey University, New Zealand,
e-mail: M.Chew@massey.ac.nz
N. Cio
Dipartimento di Chimica Universit`a degli Studi di Bari, Bari, Italy
L. Colaianni
Dipartimento di Chimica Universit`a degli Studi di Bari, Bari, Italy
A. Cusano
Engineering Department, University of Sannio, C.so Garibaldi 107 82100
Benevento, Italy, e-mail: carmen.ambrosino@unisannio.it
A. Cutolo
Engineering Department, University of Sannio, C.so Garibaldi 107 82100
Benevento, Italy, e-mail: carmen.ambrosino@unisannio.it
A. Dawson
School of Chemical & Physical Sciences, Victoria University of Wellington,
P.O. Box 600, Wellington, New Zealand, e-mail: dawsonand@hotmail.com
Serge Demidenko
School of Engineering and Technology, Massey University, New Zealand; School
of Engineering, Monash University, Australia-Malaysia
List of Contributors xi
R. Dev Das
IC Design and Fabrication Center, Department of Electronics and
Telecommunication Engineering, Jadavpur University, Kolkata-700032,
e-mail: sahahiranmay@yahoo.com
G. Diodati
C.I.R.A. (Italian Aerospace Research Center), via Maiorise 81043 Capua CE, Italy
Don W. Dissanayake
Centre for High Performance Integrated Technologies and Systems (CHiPTec),
School of Electrical and Electronic Engineering, University of Adelaide, Australia,
e-mail: don@eleceng.adelaide.edu.au
Winncy Y. Du
San Jose State University, San Jose, USA, e-mail: winncy.du@sjsu.edu
S.K. Dutta
Department of Physics, City College, e-mail: swap9885@dataone.in
Anton Fuchs
Institute of Electrical Measurement and Measurement Signal Processing, Graz
University of Technology, Graz, Austria, e-mail: anton.fuchs@tugraz.at
Anuroop Gaddam
School of Engineering and Advanced Technology, Massey University, Palmerston
North, New Zealand, e-mail: anuroop24@gmail.com
M. Giordano
National Research Council, Institute for Composite and Biomedical Materials,
Naples, Italy
I. Gracia
National Centre for Microelectronics (CNM), Bellaterra, Spain
Milos Grcic
School of Electrical and Information Engineering, University of South Australia,
Mawson Lakes, SA 5095, Australia
G. Gouws
School of Chemical & Physical Sciences, Victoria University of Wellington,
P.O. Box 600, Wellington, New Zealand, e-mail: Gideon.Gouws@vuw.ac.nz
Gourab Sen Gupta
School of Engineering and Advanced Technology, Massey University, Palmerston
North, New Zealand
P. Harris
Industrial Research Ltd., P.O. Box 31-310, Lower Hutt, New Zealand,
e-mail: P.Harris@irl.cri.nz
Michael Healy
Optical Fibre Sensors Research Centre, Department of Electronic and Computer
Engineering, University of Limerick, Limerick, Ireland,
e-mail: michael.healy@ul.ie
xii List of Contributors
Steven Hinckley
Physics Research Group, Edith Cowan University, Joondalup, Western Australia
Gert Holler
Institute of Electrical Measurement and Measurement Signal Processing, Graz
University of Technology, Graz, Austria, e-mail: gert.holler@tugraz.at
E. Ieva
Dipartimento di Chimica Universit`a degli Studi di Bari, Bari, Italy
Makoto Ikeda
Department of Electronic Engineering, VLSI Design and Education Center
(VDEC), The University of Tokyo, e-mail: ikeda@silicon.t.u-tokyo.ac.jp
Aime Lay-Ekuakille
D.I.I. University of Salento (Italy), e-mail: aime.lay.ekuakille@unile.it
Muhammad Saqib Ikram
Department of Electrical and Computer Systems Engineering, Monash University,
Bldg. 72, P.O. Box 35, Clayton, VIC Australia 3800
David G. Johnson
Australian Centre for Field Robotics, University of Sydney, Sydney, Australia,
e-mail: d.johnson@acfr.usyd.edu.au
P.O. Kall
Department of Physics, Chemistry and Biology, Linkoping University, Linkoping,
Sweden
J. Kanungo
IC Design and Fabrication Center, Department of Electronics and
Telecommunication Engineering, Jadavpur University, Kolkata-700032,
e-mail: sahahiranmay@yahoo.com
Nemai Chandra Karmakar
Department of Electrical and Computer Systems Engineering, Monash University,
Bldg. 72, P.O. Box 35, Clayton, VIC Australia 3800,
e-mail: nemai.karmakar@eng.monash.edu.au
A. Laudati
Optosmart s.r.l., via Pontano 61, 80121 Napoli, Italy, e-mail: info@optosmart.com
Elfed Lewis
Optical Fibre Sensors Research Centre, Department of Electronic and Computer
Engineering, University of Limerick, Limerick, Ireland, e-mail: elfed.lewis@ul.ie
A. Lloyd Spetz
Department of Physics, Chemistry and Biology, Linkoping University, Linkoping,
Sweden
Craig Lobsey
Australian Centre for Field Robotics, University of Sydney, Sydney, Australia
List of Contributors xiii
S. Majhi
Indian Association of Cultivation of Science, Kolkata-700032
Kate McWilliams
University of Cape Town, South Africa
Tom Moir
School of Engineering and Advanced Technology, Massey University at Auckland,
Auckland, New Zealand
Shabbir Moochhala
DSO National Laboratories, 27 Medical Drive, Singapore 117510
Gareth Monkman
University of Applied Sciences Regensburg, Germany,
e-mail: gareth.monkman@e-technik.fh-regensburg.de
S. Motojima
Gifu University, Gifu 501-1193, Japan, e-mail: motojima@apchem.gifu-u.ac.jp
Subhas Chandra Mukhopadhyay
School of Engineering and Advanced Technology, Massey University, Palmerston
North, New Zealand
Thomas Newe
Optical Fibre Sensors Research Centre, Department of Electronic and Computer
Engineering, University of Limerick, Limerick, Ireland, e-mail: thomas.newe@ul.ie
Yoke-Fei Ng
School of Engineering, Monash University, Australia-Malaysia
Al. Palaniappan
Department of Mechanical Engineering, National University of Singapore,
Singapore, e-mail: alps@nus.edu.sg
R.E. Pearce
Department of Chemistry, Imperial College London, UK; Department of Physics,
Chemistry and Biology, Linkoping University, Sweden,
e-mail: ruth@ifm.liu.se
Somrak Petchartee
Ferderal Arms Force University Munich, Germany,
e-mail: somrak.petchartee@gmail.com
Nicky C.L. Phua
Department of Mechanical Engineering, National University of Singapore,
Singapore
Ziming Qi
Applied Technology Institute, Unitec New Zealand, Auckland, New Zealand,
e-mail: tqi@unitec.ac.nz
Sushim Mukul Roy
Department of Electrical and Computer Systems Engineering, Monash University,
Bldg. 72, P.O. Box 35, Clayton, VIC Australia 3800
xiv List of Contributors
H. Saha
IC Design and Fabrication Center, Department of Electronics and
Telecommunication Engineering, Jadavpur University, Kolkata-700032,
e-mail: sahahiranmay@yahoo.com
Shinsaku Saijo
Department of Electrical and Electronics Engineering, Utsunomiya University,
7-1-2 Yoto, Utsunomiya 321-8585, Japan
N. Sawada
Gifu University, Gifu 501-1193, Japan, e-mail: motojima@apchem.gifu-u.ac.jp
M.S.P. Shaer
Department of Chemistry, Imperial College London, UK
J. Shaw
Tyco Safety Products, UK
F. Soderlind
Department of Physics, Chemistry and Biology, Linkoping University, Linkoping,
Sweden
M. M. Stevens
Department of Materials, Institute of Biomedical Engineering, Imperial College
London, UK
Iwao Sugimoto
School of Bionics, Tokyo University of Technology, Tokyo, Japan,
e-mail: sugimoto@cc.teu.ac.jp
Anan Suebsomran
King Mongkuts University of Technology, North Bangkok, Thailand,
e-mail: asr@kmutnb.ac.th
C. RoyChaudhuri
Department of Electronics and Telecommunication Engineering, Bengal Engineer-
ing and Science University Shibpur, Howrah-711103,
e-mail: chirosreepram@yahoo.com
S. RoyChaudhuri
Consultant Physician, Anandalok Hospitals, Kolkata,
e-mail: soumyocardium@yahoo.com
Kazuhiko Takahashi
Department of Information Systems Design, Doshisha University, Kyoto, Japan,
e-mail: katakaha@mail.doshisha.ac.jp
Francis E.H. Tay
Department of Mechanical Engineering, National University of Singapore,
Singapore
Amerigo Trotta
D.E.E.-Polytechnic of Bari, Bari, Italy
List of Contributors xv
L. Torsi
Dipartimento di Chimica Universit`a degli Studi di Bari, Bari, Italy
Tharshan Vaithianathan
Mawson Institute, University of South Australia, Mawson Lakes, SA 5095,
Australia
Giuseppe Vendramin
D.I.I.- University of Salento, Italy
Graham Wild
Physics Research Group, Edith Cowan University, Joondalup, Western Australia,
e-mail: g.wild@ecu.edu.au
Yusuke Yachide
Department of Electronic Engineering, The University of Tokyo,
e-mail: yachide@silicon.t.u-tokyo.ac.jp
S. Yang
Gifu University, Gifu 501-1193, Japan, e-mail: smyang@apchem.gifu-u.ac.jp
Scott W. Yelich
San Jose State University, San Jose, USA, e-mail: swyelich@sbcglobal.net
Usman Zabit
Universite de Toulouse, LOSE, INPT, ENSEEIHT, Toulouse, France
Hubert Zangl
Institute of Electrical Measurement and Measurement Signal Processing, Graz
University of Technology, Graz, Austria, e-mail: hubert.zangl@tugraz.at
Guest Editorial
This special issue titled Smart Sensors and Sensing Technology in the book series
of Lecture Notes in Electrical Engineering contains the extended version of the
papers selected from those presented at the 2nd International Conference on Sensing
Technology (ICST 2007) which was held on November 2628, 2007 at Massey
University, Palmerston North, New Zealand. A total of 116 papers were presented
at ICST 2007, of which 25 papers have been selected for this special issue.
The first three papers are in the category of Sensors and Sensor Network. In the
first paper M. Healy et al. have compared the performance of securing data on a
sensor network by using hardware platform against using software implementations
of some of the most popular cipher algorithms suitable for WSN. In their paper
T. Azuma et al., have reported the development of an autonomous vehicle system
and demonstrated the use of congestion controllers for networks based on state pre-
dictive control. In the networked autonomous vehicle, images from a camera are sent
to a computer via computer networks and are processed to recognize circumstances
around the vehicle. A cost-eective power line communication system, based on
the use of the PowerBus technology, has been reported by Moi-Tin Chew et al. The
system employs a dedicated control networking originally intended by the manufac-
turer for mere electrical control purposes. In addition to the controlling functions,
the system provides textual and data transmission capabilities.
In the next category of Gas/Bio sensors we have five papers. Kazuhiko Takahashi
and Iwao Sugimoto have proposed a smart gas sensing system to achieve emo-
tion recognition using breath gas information. A breath gas sensing system has
been designed by using a quartz crystal resonator with a plasma-polymer film
as a sensor. For emotion recognition, machine learning-based approaches, such
as neural network (NN) and support vector machine (SVM), have been investi-
gated. The utilisation of electrochemically synthesised gold and palladium nanopar-
ticles as catalytically active gate material on gas sensitive field eect sensor de-
vices have been reported by K. Buchholt et al. The synthesised nanoparticles have
been characterised by TEM and XPS, and the morphology of the thermally treated
nano-structured sensing layers has been investigated using SEM and XPS.
Al. Palaniappan et al. have tested Cobalt Phthalocyanine (CoPc) functionalized
xvii
xviii Guest Editorial
The TRDS utilises both the transmitted and reflected signals from the FBG. A nar-
row line width laser source is tuned to one of the 3dB points of the FBG. The trans-
mitted and reflected signals are detected via two photoreceivers. The dierence be-
tween the transmitted and reflected signals is then taken, doubling the total received
signal. The TRDS improves the sensitivity and eciency of the FBG acoustic emis-
sion and transmission sensor. The TRDS and FBG sensor was used to successfully
receive actively generated ultrasonic signals, including acoustic communications
signals, and to detect acoustic emissions.
In the next paper S.M. Aziz and his group have presented the design and im-
plementation of a tracking system using multiple magnetic sensors for visualizing
the location of a magnetically marked diagnostic capsule in real time. The intended
application is the gastrointestinal (GI) tract which is regarded by gastroenterologists
as a black box. An endoscopic capsule capable of releasing diagnostic biomarker
probes to areas of the gastrointestinal tract, that are inaccessible via conventional
means, will enable gastroenterologists to accurately determine the changes in func-
tionality of the GI tract due to diseases. This requires a tracking system that can
show the location of the capsule in real-time as it travels down the digestive tract.
A. Dawson and his group have investigated the influence of high frequency
(3070 MHz) ultrasonic wave propagation through microstructure and presented an
ultrasound system, wave propagation simulation results and experimental results for
highly structured porous aluminium samples.
In the next paper A. Fuchs et al. have presented the applications of capacitive
techniques for moisture sensing of bulk solids. Based on experimental measurement
data for three test materials, theoretical considerations on moisture models in bulk
solids are undertaken and the reliability of these models is discussed. The sensitivity
of the capacitive setup on the moisture distribution within the particles is analyzed
by means of a multilayer model and Finite Element Analysis methods.
X. Chen et al. have produced biomimetic proximity/tactile sensors by mimicking
Meissners corpuscles, carbon microcoils (CMCs) embedded into an elastic resin.
The CMC sensors were found to have high elasticity, high sensitivity, high discrimi-
nation ability, and a high performance, as well as being easily made in a micron size.
These sensors have potential applications in robotic surgery, medical treatment, and
diagnosis, etc.
In the next paper Winncy Y. Du and Scott W. Yelich have reviewed the conven-
tional and emerging technologies used in pipeline leak detection. These technologies
are discussed in terms of the phenomena employed, principles, system applicability,
and positive and negative virtues of each when applied to various pipeline defect
detection.
Y. Yachide et al. have shown a camera and projector calibration scheme based
on the light section method using spheres for multiple rangefinders. The proposed
calibration method fits the scanning data, based on the light-section method, to the
shapes of each sphere. The procedure of the proposed calibration consists of two
steps in camera and projector calibration.
In the next paper Z. Qi and T. Moir have presented a real-time Wiener filter for
noise reduction, improving the signal to noise ratio by significant amounts in a car
xx Guest Editorial
environment. Somrak Petchartee et al. in the next paper have proposed a surface
recognition algorithm capable of determining contact surfaces types by means of
tactile sensor fusion. It is a recognition process for 3-dimensional deformations in
a 2-dimensional parametric domain. Tactile information is extracted by physical
contact with a grasped object through a sensing medium. Information is obtained
directly at the interface between the object and the sensing device and relates to
three-dimensional position and orientation of the object in the presence of noise.
The technique called eigenvalue trajectory analysis is introduced and adopted for
specifying the margin of classification and classification thresholds.
In the next paper N.C. Karmakar and his group have reported the state of the
art of the development of a smart antenna for RFID readers. The smart antenna
enhances the performance of automatic identification systems, asset tracking in real
time and inventory control in warehouses.
A. Lay-Ekuakille et al. have focussed on a proposal of a vehicle acoustic imaging
that allows the driver to recognize obstacles and other cars around him in a safe way.
The proposed front end electronic and sensing systems are included in a specific
architecture supervised by a microcontroller. The algorithm used for gathering data
belongs to LCMV and LCMP beam forming methods.
A novel idea of home monitoring, especially of elder people, using wireless sen-
sors and network has been reported by A. Gaddam et al. Smart sensors are employed
to monitor the use of electrical appliances at defined time intervals and based on
their use warning signals can be generated and sent to the caregiver.
In the last paper Usman Zabit and his group have reported the development of
a displacement sensor with a resolution of 32 nm using a laser diode self-mixing
sensor. In this paper, they have focussed on the signal processing required to reach
such a resolution and notably on the Nelder-Mead simplex method used for the joint
estimation of parameters like the linewidth enhancement factor and feedback level
described by the coupling factor.
We hope that the readers will find this special issue interesting and useful in their
research as well as in practical engineering work in the area of smart sensors and
sensing technology. We are pleased to be able to oer the readers such a diverse
special issue, both in terms of its topical coverage and geographic representation.
Finally, we would like to whole-heartedly thank all the authors for their contri-
bution to this special issue.
Subhas Chandra Mukhopadhyay, Guest Editor
School of Engineering and Advanced Technology (SEAT),
Massey University (Turitea Campus)
Palmerston North, New Zealand
S.C.Mukhopadhyay@massey.ac.nz
Gourab Sen Gupta, Guest Editor
School of Engineering and Advanced Technology (SEAT),
Massey University (Turitea Campus)
Palmerston North, New Zealand
G.SenGupta@massey.ac.nz
About the Editors
xxi
xxii About the Editors