Subject Code: EEC-604

B.Tech (EC) -Semester-VI 6. Explain solid source diffusion of Boron.

EVEN SEMESTER THEORY EXAMINATION, 2017
VLSI TECHNOLOGY 7. List all process steps of pattern transfer with diagram.

Time: 03 Hours Max. Marks: 70

8. Explain the reactive ION Beam Etching with suitable diagram.
Note: Attempt any five questions. All questions carry equal marks.

1. Discuss different steps in preparing wafers from raw silicon.

9. Explain the following terms:
(a) Dry Oxidtion
2. What are different defects that occur in silicon? (b)Wet Oxidation
(c)Plasma Oxidation
3. Explain the working of CVD reactors in detail.

10. Explain the difference between Dry and Wet Etching.

4. Give the process of silicon vapor deposition.

5. What do you mean by annealing and why it is required in IC

fabrication process?