Professional Documents
Culture Documents
Metallography
Mr.Y.S.Gowaikar
Pune Chapter
WhatisMetallography
Why it is needed
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DifferentMetallography
Techniques
Sectioning
Mounting
Grinding
Polishing
Etching
Microscopy
Image analysing
Electro polishing
In situ metallography
Micro hardness Testing
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AbrasiveCuttingMachine
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Sectioning:AbrasiveCutting
Wheels Aluminium Oxide , Silicon Carbide
RPM 2800
Selection of cut angle
Cutting capacites 50 mm, 80 mm , more than 100 mm
Hardened cross section
Construction Sturdy , X Y cross slide , coolant circulation,
even illumination , extra long bar insertion.
Technology Chop type , pulsating type , oscillating type
Automation Electro Hydraulic for feed, vice
Safety Door , over load , motor out side the chamber.
Maintenance Routing cleaning , magnetic separation.
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Precautions
Enoughcoolantcirculation
Firmclamping
Rightwheelstoavoidburn
Righttechnology
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DiamondSectioning
Applications Ceramic,Soft,fragilesamples,
TEMsamplepreparation
Diamondwheels 3to8,thickness0.3
mm
Waferthickness200microns
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DiamondSectioningMachine
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RoughGrinding
Applications Removeallcuttingscratches,for
reworking
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Moulding Machine
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Moulded samples
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Mounting/Moulding
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Artifacts /DosandDonts
Edge rounding by relief. Loosing details like
Decarb , plating , coating , Nitrided layer etc.
Solution Use Hard compound.
Over etching the case hardening edge by
shrinkage. Solution Epoxy.
Micro alteration problem Over heating.
High load hardness checking Electro
Hydraulic press
In sufficient curing ( cold moulding ) Leading
to misleading the micro structures.
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ColdMoulding
Nomachinerequired
RoomTemperatureSetting
Duration 20mins
Applications HeatSensitivesamples,site
applications,rearuse,Aluminium
Problems Highshrinkage,curingissue
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ColdMoulding Die
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TransparentColdmoulding
Machine is required.
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FineGrinding/Polishing
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AutomaticGrinding/Polishing
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FineGrinding/Lapping
Manual , Semi automatic
Paper , diamond disc grinding 120 , 220 , 320 , 400, 600 , 800 , 1000,
1200 grits.
Dry / water proof , Plain or self adhesive ( PSA )
Sizes 9 x 11 , 8 round , 10 round , 12 round
Care taken even pressure , water flow , right rpm
( ferrous 400 / 300 , non ferrous 300 / 200 )
Lapping / polishing various cloths are used for different
applications. High nap , low nap , nap less etc
Consumables Alumina , Chromium oxide , Magnesia, diamond
paste or suspension , colloidal silica
Right cloths to be used right diamond particle
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SemiAutomaticPolishing
Advantages Operator independent process , multiple
samples, consistency of results, quality samples
preparation i.e. minimal scratches, complete flatness, for
long programs like aluminium, ceramics etc.
Samples produced 6 , 5 , 4 nos
Central or independent pressure
Relative velocity
Pressure up to 6 bar
Dispenser diamond suspensions
Limitations Only moulded samples taken, consumables
consumption little high.
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Caretakenwhilegrindingpolishing
Cleaning the samples after each grinding /
lapping step
Gentle pressure
Continuous flow of water.
Maximum grinding and minimal cloth
polishing
Cleaning with water followed by ethanol for
stain free samples
Subsequent air drying
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Etching
Nital
Picral
Precautions
High concentration may over etch the
samples, mask details
Judicious selection of etchant for various
applications
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Microscopy
Incidentlightmicroscopeorreflective
lightmicroscope
Uprightorinverted
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Upright Inverted
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AdvantagesandlimitationsofUpright
microscope
Canseetheareayouareobserving
Multiplesamplescanbeidentified
Whichobjectivethuswhatmagnificationisbeing
used
Stagemovementandspecimensizeandalso
weight
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InvertedmicroscopeAdvantages/
Limitation
Noneedofmounting
Moreweightcanbesustainedsodirect
componentcanalsobesubjected
Cannotseetheobjectives,areaunder
observation,multiplemouldedsamplescannot
beseenthusidentified(wirerods)
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Specifications
Magnifications100,200,400,1000X
Requirement goodresolutionathigher
magnifications,flatfield
Objectives Achromatic,PlanAchromatic,
Appochromatics
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Illuminationtechniques
BrightField
DarkField
DifferentialInterference
Contrast
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Precautions
Good resolution optics ( Plan )
Calibration of objectives
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Imagedocumentation/Analysis
Why analysis
Research
Chipsizeselection
Cameraresolutionselection(complexmicros,
inclusion,particlesizing)
Cameratechnology
Computerhardware(automatedstage)
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Thetypeofanalysisperformed
Gain size analysis
Phase analysis
Linear Measurements like decarburisation etc.
Graphite analysis (Grey and nodular cast iron)
Inclusion analysis
Particle size analysis
Weld penetration analysis
S Das Measurement
Micro hardness Estimation
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ElectroPolishing
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Electropolishing
Usedforsoftmetalsandalloys
Advantages Nodeformationofmicrostructure
Nostressesonsamples
(Residualstressanalysis)
Nomountingrequired
Lesstime
LimitationsInclusions,freegraphitecanberemovedbyan
electrolyte
Slightundulationaspertheelectropositeness ofparticular
phase
Edgerounding
Limitedareaofpolishing
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InsituMetallographyKit
PortableGrinder
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PortableElectroPolisher
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PortableMicroscope
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ReplicaKit
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Insitumetallography
Applications
Site
Wherethesamplescannotbedestructedor
broughttolaboratory(bigcasting,gears)
Remaininglifeassessmentofplant
components
Inspectionofpipelines
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Process
Pregrinding
Finegrinding/Polishing
Electropolishing(S.S)
Replicageneration
Imagingandanalysis
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THANK YOU
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