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Elastic deformation
Particle coarsening
2
FRACTURE MECHANICS
Commercial aircraft
Ship structures
Bridges
Pressure vessels and piping
3
FRACTURE MECHANICS
One important reason for the big difference in theoretical and experimental
values in fracture strength is cracks.
There always exists cracks or flaws in solid materials. Why?
Stress is enlarged at the crack tip (stress raisers).
5
FRACTURE TOUGHNESS
What is fracture toughness? Critical value of the stress-intensity factor at a crack tip
necessary to produce catastrophic failure under simple uniaxial load.
The stress intensity at the crack tip is dependent on both the applied stress and the
length of the crack. A new mechanical variable, Stress Intensity Factor, KI, is used to
describe the relationship:
KI f a
Where,
I stands for mode: uniaxial loading
C stands for mode: critical
f is a dimensionless constant (related to geometry of specimen and flaw)
is the applied stress
a is the crack length or half the length of an internal crack
KI is a variable but NOT a materials property
KI has unusual unit of Mpa(m) or psi(in) .
6
FRACTURE TOUGHNESS
Fracture Toughness
When the stress intensity, KI is increased to a critical value, KIC , crack
propagation will occur, which will lead to fracture.
Analogy: A balloon with a small pinhole will catastrophically fails starting from the
pinhole location when the pressure has reached a critical value.
K IC f a
Where,
KIC is a measure of a materials resistance to crack propagation.
It is a material property.
KIC is dependent on temperature, microstructure, and strain rate.
KIC usually increases with a reduction in grain size.
7
FRACTURE TOUGHNESS
How to use KIC ?
Fracture toughness is most useful in mechanical designs involving
materials with limited toughness or ductility.
Usually yield/n is good enough for ductile materials, which are
statically loaded.
Design criterion using KIC :
KI K IC
taking into account KIC , which is a material property, the allowable stress
and/or the allowable flaw size (a) can be determined.
Material Selection:
If the maximum applied stress, max , and maximum crack length are
specified for a certain application, then only the materials with KIC greater
than KI can be used:
K IC f max amax
8
FRACTURE TOUGHNESS
Highly brittle materials with
little or no ability to deform
plastically in the vicinity of a
crack tip have low KIC values
and are susceptible to
catastrophic failure.
9
FRACTURE TOUGHNESS
K IC
max
f amax
10
EFFECTS OF CRACKS ON STRENGTH
The value of KIC decreases with increasing strain rate and
decreasing temperature
11
DISPLACEMENT MODES ON CRACKED
BODY
12
13
MICROSTRUCTURE OF FRACTURE IN METALS
Most often ductile fracture occurs in a transgranular manner, which means
through the grains rather than only along grain boundaries.
In a simple tensile test, ductile fracture begins by the nucleation, growth and
coalescence of microvoids at the center of a sample (in the necked region).
The stress causes separation of the grain boundaries or the interfaces between
the metal and small impurity particles (inclusions or precipitates).
As the local stresses increase, the micro-voids grow and coalesce into larger
cavities.
Eventually the metal-to-metal contact is too small to support the load and
fracture occurs.
14
MICROSTRUCTURE OF FRACTURE IN METALS
15
CREEP
Note: Plastic deformation in amorphous materials occur by other mechanisms including flow (~viscous fluid) and shear
banding
High-temperature behaviour of materials
Designing materials for high temperature applications is one of the most challenging tasks
for a material scientist.
Various thermodynamic and kinetic factors tend to deteriorate the desirable microstructure.
This is because kinetics of underlying processes (like diffusion) are an exponential function
of temperature.
Hence, a small increase in temperature can prove to be catastrophic.
Strength decreases at high temperature and material damage (e.g. void formation) tends to
accumulate.
Phenomena like creep and accelerated oxidation kick-in.
Cycling between high and low temperature will cause thermal fatigue.
High temperature effects (many of the effects described below are coupled)
Increased vacancy concentration at high temperatures more vacancies are
thermodynamically stabilized (this will further increase the diffusion rate).
Thermal expansion material will expand and in multiphase materials/hybrids thermal
stresses will develop due to differential thermal expansion of the components.
High diffusion rate diffusion controlled processes become important.
Phase transformations can occur this not only can give rise to undesirable
microstructure, but lead to generation of internal stresses.
Precipitates may dissolve.
Grain related:
Grain boundary weakening may lead to grain boundary sliding and wedge cracking.
Grain boundary migration
Recrystallization / grain growth decrease in strength.
Dislocation related these factors will lead to decrease in strength
Climb
New slip systems can become active
Change of slip system
Decrease in dislocation density.
Overaging of precipitates and precipitate coarsening decrease in strength.
The material may creep (time dependent elongation at constant load/stress).
Enhanced oxidation and intergranular penetration of oxygen.
Etc.
Creep Creep is phenomenological term, which is responsible for plastic deformation.
In some sense creep and superplasticity are related phenomena: in creep we can think of
damage accumulation leading to failure of sample; while in superplasticity extended plastic
deformation may be achieved (i.e. damage accumulation leading to failure is delayed).
Creep is permanent deformation (plastic deformation) of a material under constant load (or
constant stress) as a function of time. (Usually at high temperatures lead creeps at RT).
Normally, increased plastic deformation takes place with increasing load (or stress)
In creep plastic strain increases at constant load (or stress)
Usually appreciable only at T > 0.4 Tm High temperature phenomenon.
Mechanisms of creep in crystalline materials is different from that in amorphous materials.
Amorphous materials can creep by flow.
At temperatures where creep is appreciable various other material processes may also
active (e.g. recrystallization, precipitate coarsening, oxidation etc.- as considered before).
Creep experiments are done either at constant load or constant stress and can be classified
based on Phenomenology or underlying Mechanism.
Phenomenology
Constant load (easier)
Creep can Harper-Dorn creep
Power Law creep Creep tests can
be classified
be carried out at
based on Constant stress
Mechanism
Constant load creep curve
In a typical creep test the load and temperature are kept constant and the elongation is
monitored with time. The strain (typically engineering strain) computed from the elongation
is plotted as function of time. The loads employed are typically below the elastic limit.
Three stages may be observed in such a plot: (i) decreasing rate with time, (ii)
approximately constant rate, (iii) increasing rate with time. These stages have to be
understood keeping in view underlying mechanisms (& necking in stage-III).
The instantaneous strain seen ( 0) is the elastic strain, which develops on the application of the load.
A technical term
III Stage-II
Stage of minimum creep rate ~ constant.
Work hardening is balanced by recovery.
The distinguishability of the three Stage-III
stages strongly depends on T and Absent (/delayed very much) in constant
stress tests (shown later).
0 Initial instantaneous strain
0
Necking of specimen starts in this stage.
t Specimen failure processes set in.
Constant Stress creep curve
In stage-III (due to necking) the engineering stress is no longer a correct measure of the
state of stress. To keep the stress constant, the instantaneous area has to be taken into
account.
If this is done, then the increasing strain rate part is not observed. Note: if load is kept
constant then in stage-III the stress is actually increasing (for the material it is stress which
matters and not load).
I II
Strain ( )
III
t
Effect of stress on the creep curve (constant load)
On increasing the load at which the experiment is conducted: (i) the instantaneous strain
( elastic) increases, (ii) for a given time (say t1) the strain is more, (iii) the time to failure (tf)
decreases (i.e. as expected, specimens fail earlier).
Fracture
Elastic strains
Strain ( )
Increasing stress
''
0
' ''
0 0 0
0
'
0
0 t1 t 'f' t t 'f t 0f
Effect of temperature
Strain ( )
E as T Increasing T
As decrease in E
with temperature
increases
is usually small
the 0 increase is
also small
0
0
' '' t1 t 'f' t t 'f t 0f
0 0 0
Creep Mechanisms of crystalline materials
Stress and temperature are the two important variables, which not only affect the creep rate,
but also the mechanism operative. Three kinds of mechanisms are operative in creep:
1 dislocation related,
2 diffusional,
3 grain boundary sliding.
These and their sub-classes are shown in the next page.
At high temperatures the grain boundary becomes weaker than the grain interior and two
grains can slide past one another due to shear stress. The temperature at which the grain is
as strong as the grain boundary is called the equicohesive temperature.
A combination of these mechanisms could also be responsible for the creep strain.
Depending on the stress and temperature other mechanisms of plastic deformation or
microstructural changes may occur concurrently with creep. These include plastic
deformation by slip and dynamic recrystallization.
Deformation mechanism maps can be drawn with homologous temperature (T/Tm) and
normalized shear stress ( /G) as the axis (other combination of variables may also be chosen
for these plots: T/Tm vs shear strain rate, normalized shear stress vs shear strain rate, etc.).
Typically these maps overlay descriptors, which are based both on phenomenology and
mechanism.
Creep Mechanisms of crystalline materials
Cross-slip
Glide
Coble creep
Grain boundary diffusion controlled
Cross-slip
This kind of creep is observed at relatively low temperatures. Herein screw dislocations
cross-slip by thermal activation and give rise to plastic strain as a function of time.
Dislocation climb
Edge dislocations piled up against an obstacle can climb to another slip plane and cause
plastic deformation. In response to stress this gives rise to strain as a function of time. It is
to be noted that at low temperatures these dislocations (being pinned) are sessile and
become glissile only at high temperatures.
Rate controlling step is the diffusion of vacancies.
Diffusional creep Nabarro-Herring creep high T lattice diffusion
Grains
Dynamic recrystallization
gives rise to strain-free
grains.
From Deformation Mechanism Maps: The plasticity and creep of Metals and Ceramics by H.J. Frost and M.F.Ashby, Pergamon Press, Oxford, 1982.
Creep Resistant Materials
The is a growing need for materials to operate at high temperatures (and in some
applications for long times). For example, higher operating temperatures gives better
efficiency for a heat engine. Hence, there is a need to design materials which can withstand
high temperatures.
It is to be noted that material should also be good in other properties for high temperature
applications (like it should possess good oxidation resistance). Factors like cost, ease of
fabrication, density, etc. play an important role in determining the final choice of a material.
Some of the material design strategies, which work at low temperature are not useful at
high temperatures (e.g. work hardening, precipitation hardening with precipitates which
coarsen, grain size reduction, etc.).
Some strategies which work are: (i) having grain boundaries aligned along the primary
loading axis, (ii) produce single crystal components (like turbine blades), (iii) use
precipitates with low interfacial energy for strengthen (which will not coarsen easily), (iv)
use dispersoids for strengthening.
V0
C
B
Instantaneous
elastic strain A
Time
Primary Secondary Steady- Tertiary
Creep State Creep Creep
When a load is applied at the beginning of a creep test, the
instantaneous elastic deformation (AB) is followed by
transient or primary creep (BC) then the secondary or
steady-state creep (CD) and finally by tertiary or accelerated
creep (DE).
E
n RT
A e
t
Tertiary creep occurs at an accelerated rate. Time to
rupture & stress relationship can be given as:
T2 or 2 T1<T2<T3<T4
T1 or 1
1<2<3<4
Time
Both temperature & applied stress adversely affect
the creep strains. Usually under the same
temperature different stress levels are applied & the
creep strains are determined.
Creep 3=69MPa
Strain
d/dt 2=62MPa
d/dt 1=55MPa
d/dt
Time
When the slope of two curves (d/dt) are determined the
material constants can then be determined. In practice,
however, three or more stress levels are usually used for
discrepancies in lab data.
Ex: In the creep test of an aluminum alloy at 180C various
stresses were applied and the corresponding creep rates were
determined.
Creep 62 MPa
Strain
0.0066 1/hr For 55 MPa 0.0025
t
55 MPa
0.0025 1/hr For 62 MPa 0.0066
t
Time (hrs)
So for = 59 MPa
2 10 17
59 8.1
0.0044 1/hr
t
FATIGUE
Fatigue is the lowering of strength or failure of a material due to repetitive stress, which may be
above or below the yield strength.
Many engineering materials such as those used in cars, planes, turbine engines, machinery, shoes,
etc are subjected constantly to repetitive stresses in the form of tension, compression, bending,
vibration, thermal expansion and contraction or other stresses.
Third a sudden fracture of the material occurs when the remaining cross-section of the material is
too small to support the applied load.
At a local size scale the stress intensity exceeds the yield strength.
For fatigue to occur at least part of the stress in the material has to be tensile.
Fatigue is most common in metals and plastics, whereas ceramics fail catastrophically without
fatigue because of their low fracture toughness.
44
FATIGUE
Fatigue failures are often easy to identify.
The fracture surface near the origin is usually smooth (Beach mark-crack
initiation point). The surface becomes rougher as the crack increases in size.
Striations (concentric line patterns): the slow cyclic build up of crack growth
from a surface intrusion. Striations are on a much finer scale and show the
position of the crack tip after each cycle.
Granular portion of the fracture surface: rapid crack propagation at the time
of catastrophic failure
45
DYNAMIC LOADING AND FATIGUE
46
FATIGUE UNDER CYCLIC/REPEATED
LOADING
Cracks generally grow under repeated loading
49
DEFINITIONS AND CONCEPTS
Constant amplitude
stressing
Mean stress
Stress amplitude (half of
the range) variation
about the mean
Stress ratio R, Amplitude
ratio
Completely reversed
stressing, R=-1
50
FATIGUE FAILURES
max min
Mean Stress, m
2
max min
Stress Amplitude, a
2
Stress Range, r max min
min
Stress Ratio, R
max
53
Fatigue Limit:
For some materials such as BCC steels and Ti alloys, the S-N curves become
horizontal when the stress amplitude is decreased to a certain level.
Fatigue Strength:
For materials, which do not show a fatigue limit such as Al, Cu, and Mg (non-ferrous
alloys), and some steels with a FCC structure, fatigue strength is specified as the stress
level at which failure will occur for a specified number of cycles, where 107 cycles is
often used.
54
55
DEFINITIONS
Solutions:
Polishing (removes machining flaws etc.)
58
59
60
Creep and
Superplasticity
Creep Strain vs.Time: Constant Temperature
Creep Strain vs. Time at Constant Engineering
Stress
Creep Machine
Master plot for LarsonMiller parameter for S-590 alloy (an Fe-
based alloy) (C = 17).
Activation energies for creep (stage II) and self-diffusion for a number of
metals.
(Adapted with permission from O. D. Sherby and A. K. Miller, J. Eng. Mater.Technol., 101 (1979) 387.)
Secondary Creep
(Adapted with permission from O. D. Sherby and A. K. Miller, J. Eng. Mater. Technol., 101 (1979) 387.)
FUNDAMENTAL CREEP MECHANISM
Different regimes for diffusion creep in alumina; notice that cations (Al3+) and
anions (O2) have different diffusion coefficients, leading to different regimes
of dominance.
(From A. H. Chokshi and T. G. Langdon, Defect and Diffusion Forum, 6669 (1989) 1205.)
Power Law Creep
Dislocation (Power Law) Creep: 10^(-2) < /G < 10^(-4)
Adapted with permission from S. N. Monteiro and T. L. da Silveira, Metalurgia-ABM, 35 (1979) 327.
Dislocations Overcoming Obstacles
Weertman Mechanism
(a) Steady-state
grain-boundary sliding with
diffusional accommodations.
(Reprinted with permission from M. F. Ashby and R. A. Verrall, Acta Met., 21 (1973) 149.)
Weertman-Ashby Map for Pure Silver
WeertmanAshby map for pure silver, established for a critical strain rate
of 108 s1; it can be seen how the deformation-mechanism fields are
affected by the grain size.
.
(From W.D. Nix and J. C. Gibeling, in Flow and Fracture at ElevatedTemperatures, ed, R. Raj
(Metals Park, Ohio: ASM, 1985).)
Heat-Resistance Materials
(Courtesy of L. E. Murr.)
Microstructural Strengthening Mechanism
in nickel-based superalloys
(From U. Glatzel, Microstructure and Internal Strains of Undeformed and Creep Deformed Samples of a Nickel-
Based Superalloy,
Habilitation Dissertation,Technische Universitat, Berlin,
1994.)
Stress-Rupture (at 1000 hours) vs.
Temperature for Heat Resistant Materials
(b) stresstime
predictions for
Maxwell and Voigt
models.
Viscoelastic Polymer
A master curve obtained in the case of stress relaxation, showing the variation in
the reduced modulus as a function of time. Also shown is the effect of cross-
linking and molecular weight.
Electromigration
(From D. M. R. Taplin, G. L. Dunlop, and T. G. Langdon, Ann. Rev. Mater. Sci., 9 (1979) 151.)
Cavitation in Superplasticity