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SPECIFICATION
Dimensions
7.0 G
LOWER
COLON
10.2 8.0
E C DP2 DP3
DP1
D
1 6
4.5 1.1 DIA.
UPPER
32.0 A
COLON
F B
G LOWER
COLON
MARK E
D
C DP1 DP2 DP3
2.54?5=12.7
Notes:
1. THE SLPE ANGLE OF ANY PIN MAY BE 5.0 MAX.
2. ALL DIMENSIONS ARE IN mm,TOLERANCE IS 0.25mm UNLESS OTHERWISE NOTED.
UPPER LOWER
A B C D E F G DP1 A B C D E F G COLON COLON A B C D E F G DP2 A B C D E F G DP3
.. .. .. ..
.. .. .. ..
.. .. .. ..
. . . . . . .. . .
11 7 4 2 1 10 5 3
LM2874-15-M1
12 9 8 6
DIGIT 1 DIGIT 2 DIGIT 3 DIGIT 4
UPPER LOWER
A B C D E F G DP1 A B C D E F G COLON COLON A B C D E F G DP2 A B C D E F G DP3
.. .. .. ..
.. .. .. ..
.. .. .. ..
. . . . . . .. . .
11 7 4 2 1 10 5 3
Description
LED Chip Face Color
Part No.
Material Emitting Color Surface Segments
Lead Soldering Temperature.(1.6mm from seating plane) Tsol. 260 for 5s MAX.
Derated DC Current
DERATING OF IDC
Ratio of Maximum
Relative Intensity
MAXIMUM
Temperature
0.5 10
IDC MAX
IF PEAK
10
10
1K
3K
30
0H
KH
HZ
0H
HZ
Z
1
Z
620 660 700 740 1 10 100 1000 10000
Wavelength (nm) tp - Pulse Duration - s
50
50
40 40
Forward Current IF(mA)
30
30
20 20
10 10
50
Relative Luminous Intensity
40
2.0
Normalized at 10mA
30 1.0
20 0.5
0.2
10
0.1
-30 -20 -10 0 10 20 30 40 50 60 70
0 10 20 30 40 Ambient Temperature Ta (C)
Fig.6 LUMINOUS INTENSITY VS.
Forward Current (mA) AMBIENT TEMPERATURE
Fig.5 RELATIVE LUMINOUS INTENSITY
VS. FORWARD CURRENT
Precautions in Use:
PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO
DEVICE TO HIGH RELIABILITY
1. Do not bend the lead. Bending leads could cause breakage of leads or the degradation of the chip.
When bending is unavoidable, strictly follow the cautionary instruction below.
(1)Bend the leads before soldering.
(2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part.
(3)The lead bending point must be more than 1.6mm away from the edge or the resin part.
(4)When a pin is tested for its endurance, bending degree should be 45and repeated no more than two times.
3. The hole pitch of a circuit board must fit into the lead pitch of products.
5. Flux could corrode the leads.Use flux that contains as little chlorine as possible (RA, RMA,
less than 0.2 wt%) and need not be washed way. When, however, washing is necessary, partially wash
around the leads, instead of the entire LED, by the following conditions.
Cleaning agent : Methyl Alcohol
Cleaning temp : 45MAX.
Cleaning time : 30Sec. MAX.
6. Minimum amount of soldering flux should be used. Soldering flux should be applied only to the pin portion.
7. The following may damage products or LED chips: Attachment or contact of residual flux solvent
onto the product surface or to LED chips, or invasion of the same into the product.