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2. HARDWARE DEVELOPMENT
The 25mm WIMU has been designed based upon Tyndalls 25mm
modular wireless sensor node [iv7] technology. The 25mm
wWireless node has been used to develop a platform for low
volume prototyping and research in the wireless sensor network
domain. It has been developed for use as a platform for sensing
and actuating, for use in scalable, reconfigurable distributed
autonomous sensing networks in a number of research projects
currently underway at the institute [v8].
The modular nature of the Tyndall hardware lends itself to the
development of numerous layers for use in various application
scenarios. Layers can be combined in an innovative plug and
play fashion and include communication, processing, sensing and
power supply layers.
Figure 1. CELERITAS Concept
The 25mm Wireless node has an integrated ATMEL ATMega128
[vi9] microcontroller for the networking of the modules. This
feature coupled with the 2.4GHz transceiver, RF Nordic
nRF2401 [vii10], produces a very powerful customisable wireless
node. Alternative implementations enable the Zigbee (IEEE
802.15.4) communications in the 25mm form factor if required.
An FPGA layer can be integrated into the system where high-
speed DSP processing is required such as in the implementation
of Kalman filtering for conditioning of inertial measurement
data.
3. 25MM WIMU
The 25mm WIMU is a 6 DOF IMU module, which is made up of
an array of inertial sensors coupled with a high resolution Analog
to Digital converter (ADC). The 25mm WIMU module utilises
the wireless communication capabilities of the 25mm Wireless
Node to realise a fully autonomous WIMU module. The 25mm
WIMU can be seen in Figure 3.
Figure 3. 25mm WIMU module
The inertial sensor array that makes up the 25mm IMU consists Figure. 5. The Berries concepts
of three single axis gyroscopes, ADXRS150 [viii] [11] from
Analog Devices, two dual axis accelerometers, ADXL202 [ix]
[12] from Analog Devices, and two dual axis magnetometers,
HMC1052L [x] [13] from Honeywell. The sensor array was
designed with a novel 3D structure, which produces the 6 DOF
functionality. The module also has a 12-bit ADC chip, AD7490
[xi] [14] from Analog Devices, handling the data conversion. This
chip has a Serial Peripheral Interface (SPI), which allows easy
interfacing to the ATMEL microcontroller. The 3D structure was
implemented using a motherboard/daughterboard configuration.
Miniature slots were drilled in the motherboard to accept the
daughterboard at 90. The motherboard and daughterboard were
designed so that their respective pads would match accurately Figure. 6. Cube demonstrators developed at Tyndall
and allow for a 90 solder connection. The motherboard was
configured so the sensors would make up the relevant array to
generate the 6 degrees of freedom required for the module. The 5. BODY SUIT DEVELOPMENT
interconnection method can be seen in Figure 4. Eight WIMU modules will be deployed on the dancers body in
the final wearable implementation, placed at the elbows, knees,
hands and feet. The suit will have integrated 25mm connectors
placed, on flexible substrates, at the specified locations. The
interconnect and power lines are to be built into the suit with the
power being provided by an innovative belt unit stacked with
slim line battery packs. With the connectors in place the dancer
will be able to suit up and then be connected to the eight WIMU
units. This configuration will also allow easy replacement of
nodes in the event of a node failure. A customised networking
protocol will connect the WIMU network with a base station.