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TLC5940
SLVS515D DECEMBER 2004 REVISED NOVEMBER 2015
TLC5940 16-Channel LED Driver With DOT Correction and Grayscale PWM Control
1 Features 3 Description
CNT
VPRG
1 0 Constant Current
GS Register 12Bit Grayscale Driver OUT0
VREF =1.24 V
IREF Max. OUTn VPRG 0 11 PWM Control
Current 0 DCPRG Delay
1 x0
1
0 DC Register 6Bit Dot
0 5 0 Correction
GSCLK
BLANK GS Counter CNT
0 DC EEPROM 5 LED Open Detection
Input VPRG
Shift
Register CNT
Status 0 96
Constant Current
Information: 192 192 GS Register 12Bit Grayscale Driver OUT1
LOD, 12 23 PWM Control
TED, DCPRG
DC DATA 96 Delay
1 x1
191 95 96 DC Register 6Bit Dot
1 0 6 11 0 Correction
VPRG
6 DC EEPROM11 LED Open Detection
LED Open 96 VPRG
Detection
(LOD)
191 DC EEPROM
90 95 LED Open Detection
SOUT VPRG
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TLC5940
SLVS515D DECEMBER 2004 REVISED NOVEMBER 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.2 Functional Block Diagram ....................................... 13
2 Applications ........................................................... 1 8.3 Feature Description................................................. 13
3 Description ............................................................. 1 8.4 Device Functional Modes........................................ 18
4 Revision History..................................................... 2 9 Application and Implementation ........................ 23
9.1 Application Information............................................ 23
5 Pin Configuration and Functions ......................... 3
9.2 Typical Application ................................................. 23
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5 10 Power Supply Recommendations ..................... 25
6.2 ESD Ratings.............................................................. 5 11 Layout................................................................... 25
6.3 Recommended Operating Conditions....................... 5 11.1 Layout Guidelines ................................................. 25
6.4 Thermal Information .................................................. 6 11.2 Layout Example .................................................... 25
6.5 Electrical Characteristics........................................... 7 11.3 Power Dissipation Calculation .............................. 26
6.6 Switching Characteristics .......................................... 8 12 Device and Documentation Support ................. 27
6.7 Typical Characteristics .............................................. 9 12.1 Community Resources.......................................... 27
7 Parameter Measurement Information ................ 11 12.2 Trademarks ........................................................... 27
7.1 Test Parameter Equations ...................................... 12 12.3 Electrostatic Discharge Caution ............................ 27
12.4 Glossary ................................................................ 27
8 Detailed Description ............................................ 13
8.1 Overview ................................................................. 13 13 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
PWP Package
28-Pin HTSSOP NT Package
Top View 28-Pin PDIP
Top View
GND 1 28 VCC
OUT1 1 28 OUT0
BLANK 2 27 IREF
XLAT 3 26 DCPRG OUT2 2 27 VPRG
SCLK 4 25 GSCLK OUT3 3 26 SIN
SIN 5 24 SOUT OUT4 4 25 SCLK
VPRG 6 23 XERR OUT5 5 XLAT
Thermal 24
OUT0 7 22 OUT15
PAD OUT6 6 23 BLANK
OUT1 8 21 OUT14
OUT2 9 20 OUT13 OUT7 7 22 GND
OUT3 10 19 OUT12 OUT8 8 21 VCC
OUT4 11 18 OUT11 OUT9 9 20 IREF
OUT5 12 17 OUT10 OUT10 10 DCPRG
19
OUT6 13 16 OUT9
OUT11 11 18 GSCLK
OUT7 14 15 OUT8
OUT12 12 17 SOUT
OUT13 13 16 XERR
OUT14 14 15 OUT15
RHB Package
32-Pin VQFN
Top View
GSCLK
OUT15
OUT14
OUT13
OUT12
OUT11
SOUT
XERR
24
23
22
21
20
19
18
17
DCPRG 25 16 OUT10
IREF 26 15 OUT9
VCC 27 14 OUT8
NC 28 THERMAL 13 NC
NC 29 PAD 12 NC
GND 30 11 OUT7
BLANK 31 10 OUT6
XLAT 32 9 OUT5
SCLK 1
SIN 2
VPRG 3
OUT0 4
OUT1 5
OUT2 6
OUT3 7
OUT4 8
NC No internal connection
Pin Functions
PIN
TYPE DESCRIPTION
NAME DIP NO. PWP NO. RHB NO.
Blank all outputs. When BLANK = H, all OUTn outputs are forced OFF.
BLANK 23 2 31 I GS counter is also reset. When BLANK = L, OUTn are controlled by
grayscale PWM control.
Switch DC data input. When DCPRG = L, DC is connected to
EEPROM. When DCPRG = H, DC is connected to the DC register.
DCPRG 19 26 25 I
DCPRG also controls EEPROM writing, when VPRG = V(PRG).
EEPROM data = 3 Fh (default)
GND 22 1 30 G Ground
GSCLK 18 25 24 I Reference clock for grayscale PWM control
IREF 20 27 26 I Reference current terminal
12
13
NC No connection
28
29
OUT0 28 7 4 O Constant current output
OUT1 1 8 5 O Constant current output
OUT2 2 9 6 O Constant current output
OUT3 3 10 7 O Constant current output
OUT4 4 11 8 O Constant current output
OUT5 5 12 9 O Constant current output
OUT6 6 13 10 O Constant current output
OUT7 7 14 11 O Constant current output
OUT8 8 15 14 O Constant current output
OUT9 9 16 15 O Constant current output
OUT10 10 17 16 O Constant current output
OUT11 11 18 17 O Constant current output
OUT12 12 19 18 O Constant current output
OUT13 13 20 19 O Constant current output
OUT14 14 21 20 O Constant current output
OUT15 15 22 21 O Constant current output
SCLK 25 4 1 I Serial data shift clock
SIN 26 5 2 I Serial data input
SOUT 17 24 23 O Serial data output
VCC 21 28 27 I Power supply voltage
Multifunction input pin. When VPRG = GND, the device is in GS mode.
When VPRG = VCC, the device is in DC mode. When VPRG = V(VPRG),
VPRG 27 6 3 I
DC register data can programmed into DC EEPROM with
DCPRG=HIGH. EEPROM data = 3 Fh (default)
Error output. XERR is an open-drain terminal. XERR goes L when LOD
XERR 16 23 22 O
or TEF is detected.
Level triggered latch signal. When XLAT = high, the TLC5940 writes
data from the input shift register to either GS register (VPRG = low) or
XLAT 24 3 32 I
DC register (VPRG = high). When XLAT = low, the data in GS or DC
register is held constant.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC 0.3 6 V
Input voltage (2) V(BLANK), V(DCPRG), V(SCLK), V(XLAT), V(SIN),
0.3 VCC +0.3 V
V(GSCLK), V(IREF)
V(SOUT), V(XERR) 0.3 VCC +0.3 V
Output voltage
V(OUT0) to V(OUT15) 0.3 18 V
Output current (dc) 130 mA
EEPROM program range V(VPRG) 0.3 24 V
EEPROM write cycles 50
Storage temperature, Tstg 55 150 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operting Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(1) The deviation of each output from the average of OUT0-15 constant current. It is calculated by Equation 1 in Test Parameter Equations.
(2) The deviation of average of OUT1-15 constant current from the ideal constant-current value. It is calculated by Equation 2 in Test
Parameter Equations. The ideal current is calculated by Equation 3 in Test Parameter Equations.
(3) The line regulation is calculated by Equation 4 in Test Parameter Equations.
(4) The load regulation is calculated by Equation 5 in Test Parameter Equations.
(5) Not tested. Specified by design
10 k 4k
TLC5940PWP
7.68 k PowerPAD Soldered
Reference Resistor, R(IREF) - W
TLC5940RHB
TLC5940NT
1.92 k
1k 0.96 k 2k
0.64 k
0.48 k TLC5940PWP
0.38 k PowerPAD Unsoldered
1k
0.32 k
100 0
0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100
IO Output Current mA TA Free-Air Temperature oC
Figure 1. Reference Resistor vs Output Current Figure 2. Power Dissipation Rate vs Free-Air Temperature
140 65
TA = 25C, IO = 120 mA IO = 60 mA,
64
VCC = 5 V VCC = 5 V
120 TA = 85C
IO = 100 mA 63
IO - Output Current - mA
IO - Output Current - mA
100 62
IO = 80 mA
61
80
IO = 60 mA 60 TA = 25C
TA = -40C
60
59
IO = 40 mA
58
40
IO = 20 mA 57
20
IO = 5 mA 56
0 55
0 0.5 1 1.5 2 2.5 3 0 0.5 1 1.5 2 2.5 3
VO - Output Voltage - V VO - Output Voltage - V
Figure 3. Output Current vs Output Voltage Figure 4. Output Current vs Output Voltage
8 8
IO = 60 mA TA = 25C,
6 6 VCC = 5 V
IOLC - Constant Output Current - %
4 4
VCC = 3.3 V
2 2
0 0
-2 -2
-4 VCC = 5 V -4
-6 -6
-8 -8
-40 -20 0 20 40 60 80 100 0 20 40 60 80
TA - Ambient Temperature - C IO - Output Current - mA
Figure 5. Constant Output Current, IOLC Figure 6. Constant Output Current, IOLC
vs Ambient Temperature vs Output Current
TA = 85C
IO - Output Current - mA
IO - Output Current - mA
100 50
IO = 80 mA
80 40 TA = -40C
IO = 60 mA
60 30
40 IO = 30 mA 20
20 10
IO = 5 mA
0 0
0 10 20 30 40 50 60 70 0 10 20 30 40 50 60 70
Dot Correction Data - dec Dot Correction Data - dec
Figure 7. Output Current Figure 8. Output Current
vs DOT Correction Linearity (ABS Value) vs DOT Correction Linearity (ABS Value)
VCC
23 W
400 W
INPUT
SOUT
23 W
GND
GND
GND
GND
tr0, tf0, tpd0 tr1, tf1, tpd1, tpd2, tpd3, tpd4, tpd5, td
VO = 4V
SOUT Testpoint
RL = 51W
CL = 15pF
OUTn Testpoint
CL = 15pF
OUTn OUTn
VO = 1V VO = 1V to 3V
V(IREF) tpd3
XERR
8 Detailed Description
8.1 Overview
The TLC5940 is a 16-channel constant current sink driver. Each channel has an individually-adjustable, 4096-
step, pulse width modulation (PWM), grayscale (GS) brightness control, and a 64-step dot correction brightness
control. GS data and DC data are input via a serial interface port. The dot correction data is stored in an
integrated EEPROM. The TLC5940 has a 120-mA current capability. The maximum current value of all channels
is determined by an external resistor. The TLC5940 has a LED open detection (LOD) function that indicates a
broken or disconnected LED at an output terminal and a thermal error flag (TEF) indicates an overtemperature
condition.
CNT
VPRG
1 0 Constant Current
GS Register 12Bit Grayscale Driver OUT0
VREF =1.24 V
IREF Max. OUTn VPRG 0 11 PWM Control
Current 0 DCPRG Delay
1 x0
1
0 DC Register 6Bit Dot
0 5 0 Correction
GSCLK
BLANK GS Counter CNT
0 DC EEPROM 5 LED Open Detection
Input VPRG
Shift
Register CNT
Status 0 96
Constant Current
Information: 192 192 GS Register 12Bit Grayscale Driver OUT1
LOD, 12 23 PWM Control
TED, DCPRG
DC DATA 96 Delay
1 x1
191 95 96 DC Register 6Bit Dot
1 0 6 11 0 Correction
VPRG
6 DC EEPROM11 LED Open Detection
LED Open 96 VPRG
Detection
(LOD)
191 DC EEPROM
90 95 LED Open Detection
SOUT VPRG
XLAT
1st GS Data Input Cycle 2nd GS Data Input Cycle
DC DC GS1 GS1 GS2 GS2 GS3
SIN MSB LSB MSB LSB MSB LSB MSB
th2 tsu2 tsu1 th1 tsu0
twh0 th0
twh3
tpd3 twl1
tpd4 tpd1 Tgsclk
tpd3
OUT0
(current)
tpd1 + td td tpd3 + td touton
OUT1
(current)
tpd1 + 15 x td 15 x td
OUT15
(current)
tpd2
XERR
SCLK, XLAT,
BLANK,
GSCLK,
DCPRG,
VPRG
VPRG
XLAT
BLANK
1 4096 1
GSCLK
OUT0
(current)
OUT1
(current)
OUT15
(current)
XERR
MSB LSB
95 90 89 6 5 0
When VPRG is set to VCC, the TLC5940 enters the dot correction data input mode. The length of input shift
register becomes 96 bits. After all serial data are shifted in, the TLC5940 writes the data in the input shift register
to DC register when XLAT is high, and holds the data in the DC register when XLAT is low. The DC register is a
level triggered latch of XLAT signal. Since XLAT is a level-triggered signal, SCLK and SIN must not be changed
while XLAT is high. After XLAT goes low, data in the DC register is latched and does not change. BLANK signal
does not need to be high to latch in new data. XLAT has setup time (tsu1) and hold time (th1) to SCLK as shown
in Figure 15.
DC Mode Data
DC Mode Data
Input Cycle n
VCC Input Cycle n+1
VPRG
DC n1 DC n DC n DC n DC n DC n DC n+1 DC n+1
SIN LSB MSB MSB1 MSB2 LSB+1 LSB MSB MSB1
twh0
SCLK 1 2 3 95 96 1 2
twl0
DC n1 DC n1 DC n1 DC n1 DC n1 DC n DC n DC n
SOUT MSB MSB1 MSB2 LSB+1 LSB MSB MSB1 MSB2
twh2
tsu1
th1
XLAT
The TLC5940 also has an EEPROM to store dot correction data. To store data from the dot correction register to
EEPROM, DCPRG is set to high after applying VPRG to the VPRG pin. Figure 16 shows the EEPROM
programming timings. The EEPROM has a default value of all 1 s.
V(PRG)
VPRG VCC
DCPRG
XLAT
DC DC
SIN MSB LSB
1 96
SCLK
- DC
SOUT MSB
DCPRG
tpd5 tpd5
OUT0
(Current)
OUT15
(Current)
MSB LSB
191 180 179 12 11 0
When VPRG is set to GND, the TLC5940 enters the grayscale data input mode. The device switches the input
shift register to 192-bit width. After all data is clocked in, a rising edge of the XLAT signal latches the data into
the grayscale register (see Figure 11). New grayscale data immediately becomes valid at the rising edge of the
XLAT signal; therefore, new grayscale data should be latched at the end of a grayscale cycle when BLANK is
high.The first GS data input cycle after dot correction requires an additional SCLK pulse after the XLAT signal to
complete the grayscale update cycle. All GS data in the input shift register is replaced with status information
data (SID) after updated the grayscale register.
MSB LSB
0 15 16 23 24 119 120 191
XLAT
1 192 192
SCLK 193 1
GSCLK 1 4096
tpd3
OUT0
(current)
td
OUT1
(current)
15 x td
OUT15
(current)
tpd2
XERR
tpd3 + 15 x td + tpd2
GS PWM GS PWM
Cycle n Cycle n+1
BLANK
t wl1
t wh1 t h4 t wh3 t su4
GSCLK
1 2 3 4096 1
t wl1
t pd1 t pd3 t pd3
OUT0
(Current)
nxt d
t pd1 + td t pd3+ n x t d
OUT1
(Current)
t pd1 + 15 x td
OUT15
(Current)
t pd2
XERR
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
100 k
VPRG_OE
V(22V) V(22V)
50 k
50 k
50 k
50 k
50 k
50 k
VPRG
11 Layout
GND 1 28 VCC
BLANK 2 27 IREF
XLAT 3 26 DCPRG
SCLK 4 25 GSCLK
SIN 5 24 SOUT
VPRG 6 Thermal 23 XERR
Pad
OUT0 7 22 OUT15
OUT1 8 21 OUT14
OUT2 9 20 OUT13
OUT3 Via to
10 Heatsink 19 OUT12
Layer
OUT4 11 18 OUT11
OUT5 12 17 OUT10
OUT6 13 16 OUT9
OUT7 14 15 OUT8
12.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 15-Oct-2015
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
TLC5940PWP ACTIVE HTSSOP PWP 28 50 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940
& no Sb/Br)
TLC5940PWPG4 ACTIVE HTSSOP PWP 28 50 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940
& no Sb/Br)
TLC5940PWPR ACTIVE HTSSOP PWP 28 2000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940
& no Sb/Br)
TLC5940PWPRG4 ACTIVE HTSSOP PWP 28 2000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940
& no Sb/Br)
TLC5940RHBR ACTIVE VQFN RHB 32 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC
& no Sb/Br) 5940
TLC5940RHBRG4 ACTIVE VQFN RHB 32 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC
& no Sb/Br) 5940
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Oct-2014
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Oct-2014
Pack Materials-Page 2
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