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Features Description
Superior gate charge x Rdson product (FOM) The Power JFET transistor from Lovoltech is a device that
Trench Power JFET with low threshold voltage Vth. presents a Low Rdson allowing for improved efficiencies in DC-
Device fully ON with Vgs = 0.7V DC switching applications. The device is designed with a low
Optimum for Low Side Buck Converters threshold such that drivers can operate at 5V, which reduces the
Excellent for high frequency dc/dc converters driver power dissipation and increases the overall efficiency.
Optimized for Secondary Rectification in isolated DC-DC Lower threshold produces faster turn-on/turn-off, which
Low Rg and low Cds for high speed switching minimizes the required dead time. A PN Diode is added for
applications where a freewheeling diode is required.
This product has tin plated leads.
Applications
DC-DC Converters
Synchronous Rectifiers
PC Motherboard Converters
Step-down power supplies
VRM Modules
D
G
S
1
2 3 N Channel PowerJFET
Case TO251 (IPAK) with PN Diode
Pin Definitions
Pin Number Pin Name Pin Function Description Product Summary
1 Gate Gate. Transistor Gate VDS (V) Rdson () ID (A)
2, 4 Drain Drain. Transistor Drain 24V 0.0065 501
3 Source Source. Transistor Source
Absolute Maximum Ratings
Parameter Symbol Ratings Units
Drain-Source Voltage VDS 24 V
Gate-Source Voltage VGS -12 V
Gate-Drain Voltage VGD -28 V
Continuous Drain Current ID 501 A
Pulsed Drain Current ID 100 A
Single Pulse Drain-to-Source Avalanche Energy at 25C EAS 200 mJ
(VDD= 6VDC, IL=60APK, L=0.3mH, RG=100 )
Junction Temperature TJ -55 to 150C C
Storage Temperature TSTG -65 to 150C C
Lead Soldering Temperature, 10 seconds T 260C C
Power Dissipation (Derated at 25C) PD 69 W
Electrical Specifications
(TA = +25C, unless otherwise noted.)
The denotes a specification which apply over the full operating temperature range.
Symbol Parameter Conditions Min. Typ. Max. Units
Static
BVDSX Breakdown Voltage ID = 0.5 mA 24 28 V
Drain to Source VGS= -4 V
BVGDO Breakdown Voltage IG = -50A -32 -28 V
Gate to Drain
BVGSO Breakdown Voltage IG = -50A -14 -12 V
Gate to Source
RDS(ON) Drain to Source On IG = 40 mA, ID=10A 4.6 6.5 m
Resistance2 IG = 10 mA, ID=10A 4.8 7.0 m
IG = 5 mA, ID=10A 4.9
VGS(TH) Gate Threshold Voltage VDS=0.1 V, ID=250A -1 V
TCVGSTH Temperature Coefficient of VDS=0.1 V, ID=250A -2.6 mV/oC
Gate Threshold Voltage
Dynamic
QGsync Total Gate Charge Sync JFET VDrive =5V,VDS=0.1V (Fig. 2) 9.8 nC
QG Total Gate Charge VDrive =5V, ID=10A,VDS=15V 12.4 nC
QGD Gate to Drain Charge VDS=13.5V to VDS=1.5V 8.1 nC
QGS Gate to Source Charge VGS =-4.5V to VDS=13.5V 4.3 nC
QSW Switching Charge VGS =-2V to VDS=1.5V 9.1 nC
RG Gate Resistance 0.7
TD(ON) Turn-on Delay Time 5.5
TR Rise Time VDD=15V, ID=10A 12.6 ns
TD(OFF) Turn-off Delay VDrive = 5 V 10.3
TF Fall Time Resistive Load 6.6
CISS Input Capacitance 1147
COSS Output Capacitance 467
CGS Gate-Source Capacitance VDS=10V, VGS= -5 V, 1MHz. 784 pF
CGD Gate-Drain Capacitance (see Fig. 4) 363
CDS Drain-Source Capacitance 104
PN Diode
IR Reverse Leakage VR=20V, Vgs = -4V 0.3 mA
VF Forward Voltage IF = 1 A 812 mV
VF Forward Voltage IF = 10 A 932 mV
VF Forward Voltage IF = 20 A 1010 mV
Qrr Reverse Recovery Charge Is = 10 A di/dt = 100A/us, 7 nC
Trr Reverse Recovery Time Is = 10 A di/dt = 100A/us, 13.3 ns
Notes:
1. Current is limited by bondwire; with an Rthjc = 1.8 oC/W the chip is able to carry 80A.
2. Pulse width <= 500s, duty cycle < = 2%
0.0
6
-0.5
-1.0
5
Vgs(V)
-1.5
4 -2.0
-2.5
3 -3.0
-3.5
2 -4.0
1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 -4.5
1 3 5 7 9 11 13 15
IG(A) Qg(nC)
Figure 1 RDSON vs Gate Current at ID 10A Figure 2 Gate Charge Qgsync for VDS=0.1V
50
LD1014D Capacitance vs. Vds, Vgs=-5v
45
1600
40
1400
35
1200 Ciss
30
ID (mA)
25 1000
C (pF)
20 800
15 600 Coss
10 400
5 Crss
200
0
0
0 5 10 15 20 25 30 0 5 10
10 15
15 20
20 25
25
V D S (V ) Vds (volts)
0.05 0.30
ID(A)
VDS = 0.1V
0.04 0.25
0.20
0.03
0.15
0.02
0.10
0.01
0.05
0.00
0.00
0.00 0.20 0.40 0.60 0.80
-5 -4 -3 -2 -1 0 1
VGS(V)
VGS(V)
1.6
Normalized Rds
40
35 V GS = 0V
1.5
30
1.4
ID(A)
25
1.3 20 V G S =- 0.5V
1.2 15
10
1.1 V G S = -1V
5
1.0 0
0 50 100 150 0 1 2 3 4 5
T emp(C) VDS(V)
0 100
-2
10s
-4
Id, Drain Current (A)
-6 Ig = 40mA
ID (Amps)
1.E+00
60 D = 0.5
0.2
45
Ptot (W)
ZthJA (K/W)
0.1
30 1.E-01
0.05 P(pk)
tp
0.02
15 T
0.01 Note:
1. Duty Factor D = tp/T
Single Pulse 2. Peak Tj = P(pk)*ZthJA + TA
0
1.E-02
0 50 100 150 200 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Temperature (C) tp (s)
L2
A 2.19 2.40 0.086 0.094
A1 0.89 1.14 0.035 0.045 LU1014D
IPAK
XXXXX
D
XXXX
b 0.76 1.14 0.030 0.045
L3
b1 0.64 0.90 0.025 0.035
L1
B2 5.20 5.46 0.205 0.215
C 0.45 0.60 0.017 0.023
L
L
C2 0.45 0.60 0.017 0.023
D 5.97 6.22 0.235 0.244 C
e
D1 5.64 0.222 A1
b
E 6.35 6.73 0.250 0.265 b1
e 2.28 0.090
Back View
H 13.19 13.06 13.32 0.514 0.525
L 5.95 7.6 0.234 0.300
L1 2.03 2.29 0.079 0.090
D1
L3 0.63 1.14 0.025 0.045