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MAX202
SLLS576F JULY 2003 REVISED SETPEMBER 2016
MAX202 5-V Dual RS-232 Line Driver and Receiver With 15-kV ESD Protection
1 Features 3 Description
1 Meets or Exceeds the Requirements of The MAX202 device consists of two line drivers, two
TIA/EIA-232-F and ITU v.28 Standards line receivers, and a dual charge-pump circuit with
15-kV ESD protection pin to pin (serial-port
ESD Protection for RS-232 Bus Pins: 15-kV connection pins, including GND). The device meets
Human-Body Model the requirements of TIA/EIA-232-F and provides the
Operates at 5-V VCC Supply electrical interface between an asynchronous
Operates Up to 120 kbit/s communication controller and the serial-port
connector. The charge pump and four small external
Two Drivers and Two Receivers capacitors allow operation from a single 5-V supply.
Latch-Up Performance Exceeds 100 mA Per The device operates at data signaling rates up to
JESD 78, Class II 120 kbit/s and a maximum of 30-V/s driver output
slew rate.
2 Applications
Device Information(1)
Battery-Powered Systems
PART NUMBER PACKAGE BODY SIZE (NOM)
Notebooks MAX202CD
SOIC (16) 9.90 mm 3.91 mm
Laptops MAX202ID
Palmtop PCs MAX202CDW
SOIC WIDE (16) 10.30 mm 7.50 mm
MAX202IDW
Hand-Held Equipment
MAX202CPW
TSSOP (16) 5.00 mm x 4.40 mm
MAX202IPW
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Block Diagram
5V POWER
2 2 DOUT
DIN TX RS-232
2 2 RIN
ROUT RX
RS-232
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MAX202
SLLS576F JULY 2003 REVISED SETPEMBER 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................... 8
2 Applications ........................................................... 1 8.4 Device Functional Modes.......................................... 8
3 Description ............................................................. 1 9 Application and Implementation ........................ 10
4 Revision History..................................................... 2 9.1 Application Information............................................ 10
9.2 Typical Application .................................................. 10
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 10 Power Supply Recommendations ..................... 13
6.1 Absolute Maximum Ratings ...................................... 4 11 Layout................................................................... 13
6.2 ESD Ratings.............................................................. 4 11.1 Layout Guidelines ................................................ 13
6.3 Recommended Operating Conditions....................... 4 11.2 Layout Example .................................................... 13
6.4 Thermal Information .................................................. 4 12 Device and Documentation Support ................. 14
6.5 Electrical Characteristics........................................... 5 12.1 Receiving Notification of Documentation Updates 14
6.6 Switching Characteristics .......................................... 5 12.2 Community Resources.......................................... 14
6.7 Typical Characteristics ............................................. 6 12.3 Trademarks ........................................................... 14
7 Parameter Measurement Information .................. 7 12.4 Electrostatic Discharge Caution ............................ 14
12.5 Glossary ................................................................ 14
8 Detailed Description .............................................. 8
8.1 Overview ................................................................... 8 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagram ......................................... 8
Information ........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
Removed the Ordering Information table; see POA at the end of the data sheet ................................................................. 1
Changed values in the Thermal Information table to align with JEDEC standards................................................................ 4
D, DW, or PW Package
16-Pin SOIC or TSSOP
Top View
C1+ 1 16 VCC
V+ 2 15 GND
C1 3 14 DOUT1
C2+ 4 13 RIN1
C2 5 12 ROUT1
V 6 11 DIN1
DOUT2 7 10 DIN2
RIN2 8 9 ROUT2
Not to scale
Pin Functions
PIN
I/O DESCRIPTION
NO. NAME
1 C1+ Positive lead of C1 capacitor
2 V+ O Positive charge pump output for storage capacitor only
3 C1 Negative lead of C1 capacitor
4 C2+ Positive lead of C2 capacitor
5 C2 Negative lead of C2 capacitor
6 V O Negative charge pump output for storage capacitor only
7 DOUT2 O RS-232 line data output (to remote RS-232 system)
8 RIN2 I RS-232 line data input (from remote RS-232 system)
9 ROUT2 O Logic data output (to UART)
10 DIN2 I Logic data input (from UART)
11 DIN1 I Logic data input (from UART)
12 ROUT1 O Logic data output (to UART)
13 RIN1 I RS-232 line data input (from remote RS-232 system)
14 DOUT1 O RS-232 line data output (to remote RS-232 system)
15 GND Ground
16 VCC Supply voltage, connect to external 5-V power supply
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage, VCC (2) 0.3 6 V
(2)
Positive charge pump voltage, V+ VCC 0.3 14 V
Negative charge pump voltage, V (2) 14 0.3 V
Drivers 0.3 V+ + 0.3
Input voltage, VI V
Receivers 30
Drivers V 0.3 V+ + 0.3
Output voltage, VO V
Receivers 0.3 VCC + 0.3
Short-circuit duration, DOUT Continuous
Operating junction temperature, TJ 150 C
Storage temperature, Tstg 65 150 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
0.7 5
0.65
0.6 4.8
0.55
0.5 4.6
ROUT Voltage (V)
-3
-6
-9
-12
0 2 4 6 8 10 12 14 16 18
Time (us) D005
Figure 5. Driver and Receiver Loopback Waveforms
3V
RS-232 Input 1.5 V 1.5 V
Generator Output 0V
(see Note B) 50 W
CL tPHL (D) tPLH (D)
RL (see Note A)
VOH
Output 50% 50%
VOL
TEST CIRCUIT VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns,
tf 10 ns.
3V
Input 1.5 V
1.5 V
Output 3 V
Generator
(see Note B) 50 W tPHL (R) tPLH (R)
CL
(see Note A)
VOH
Output 50% 50%
VOL
TEST CIRCUIT VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
8 Detailed Description
8.1 Overview
The MAX202 device is a dual driver and receiver that includes a capacitive voltage generator using four
capacitors to supply TIA/EIA-232-F voltage levels from a single 5-V supply. Each receiver converts TIA/EIA-232-
F inputs to 5-V TTL/CMOS levels. These receivers have shorted and open fail safe. The receiver can accept up
to 30-V inputs and decode inputs as low as 3 V. Each driver converts TTL/CMOS input levels into TIA/EIA-
232-F levels. Outputs are protected against shorts to ground.
5V POWER
2 2 DOUT
DIN TX RS-232
2 2 RIN
ROUT RX
RS-232
11 14
DIN1 DOUT1
10 7
DIN2 DOUT2
12 13
ROUT1 RIN1
9 8
ROUT2 RIN2
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
1 VCC 16
C1+
+ CBYPASS
= 0.1 mF,
C1 + 2 15
0.1 mF, C3 + V+ GND
6.3 V 0.1 mF
16 V
3 14
C1 DOUT1
13
RIN1
4
C2+
C2 + 5 kW
0.1 mF,
16 V
5 C2
12
ROUT1
6 11
C4 V DIN1
0.1 mF,
16 V +
7 10
DOUT2 DIN2
8 9
RIN2 ROUT2
5 kW
1.5 kW
+ CS
VHBM DUT
- 100 pF
1.5
VHBM = 2 kV
DUT = 10-V, 1-W Zener Diode
|
1.0
IDUT - A
0.5
0.0
0 50 100 150 200
Time - ns
-3
-6
-9
-12
0 2 4 6 8 10 12 14 16 18
Time (us) D006
11 Layout
Ground
C3
1 C1+ VCC 16 VCC
PF
C1 2 V+ GND 15 Ground
3 C1- DOUT1 14
4 C2+ RIN1 13
C2
5 C2- ROUT1 12
Ground 6 V- DIN1 11
C4
7 DOUT2 DIN2 10
8 RIN2 ROUT2 9
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 24-Feb-2016
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 24-Feb-2016
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
MAX202IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX202I
& no Sb/Br)
MAX202IDW ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX202I
& no Sb/Br)
MAX202IDWG4 ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX202I
& no Sb/Br)
MAX202IDWR ACTIVE SOIC DW 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX202I
& no Sb/Br)
MAX202IPW ACTIVE TSSOP PW 16 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB202I
& no Sb/Br)
MAX202IPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB202I
& no Sb/Br)
MAX202IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB202I
& no Sb/Br)
MAX202IPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB202I
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 24-Feb-2016
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Feb-2016
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Feb-2016
Pack Materials-Page 2
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