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CHAPTER 2
OVERVIEW OF THE PROCESSES AND LITERATURE
REVIEW
2.1 PLASTICS AND POLYMERS. 15
2.2 OVERVIEW OF COMPOSITES 16
2.2.1 Classification of Composites 17
2.2.1.1 Polymer Matrix Composites 18
2.2.1.2 Factors Affecting Properties of PMCs 19
2.2.1.2.1 Interfacial Adhesion 19
2.2.1.2.2 Shape and Orientation of Dispersed Phase
Inclusions (Particles, Flakes, Fibres, and
Laminates) 20
2.2.1.2.3 Properties of the Matrix Properties 20
2.2.1.3 Fabrication of Composites 23
2.2.1.4 Effect and Functions of Fillers 26
2.2.2 ABS Poly (Acrylonitrile, Butadiene, Styrene) 28
2.2.3 Nylon (Polyamides) 29
2.2.4 Wollastonite / Calcium Meta Silicate 36
2.2.5 Water Absorption Studies on Polyamide Composites 40
2.2.6 Mechanical, Electrical and Tribological Properties of
Polyamide-6 Composite Materials 44
2.3 METALLIZATION OF PLASTICS 50
2.3.1 Overview 50
2.3.2 Plating of plastics 52
2.3.2.1. Electroless plating 52
2.3.2.1.1 Composition of Electroless Plating Bath
53
2.3.2.1.2 Advantages of Electroless Plating 54
2.3.2.1.3 Applications of Electroless Plating 55
2.3.2.1.4 Electroless Plating of Copper 55
2.3.2.1.5 Electroless Nickel Plating 57
2.3.2.2 Electroplating 59
14
CHAPTER 2
REVIEW
were ignorant of the true nature of the materials they had prepared.
Scientists for many years assumed that they were colloids, but it was
like fillers, fibres, plasticizers, etc. With the use of these additives the
and grilles.
meet up with the varied service conditions. The part designer has to
many reasons due to the benefits it offers like low weight, corrosion
concrete are some of the valuable materials used in our everyday life.
material [8].
divided into two types, viz., hybrid and textile composites [7, 8].
mechanical loads [12]. The only difficulty with PMCs is its low thermal
19
minerals like calcium silicate, Calcium carbonate, graphite, etc. [7, 8].
[7].
have no preferred directions. Josmin P Jose et al. [7] and Tabiei [14]
are made from two dimensional panels / sheets that are stacked and
(a) Elastomers:
low elastic modulus and high yield strain in comparison with other
elastomers [7].
the application of heat and pressure [12]. Today, 85% of the polymers
beyond their Tg. For instance, the Tg for PVC may be as low as 65 oC
110 oC and for polyetherketone (PEK) may be as high as 365 oC. [16]
faster rate to reduce the production time and maximize the profits.
[12].
(b) Bag moulding process (c) Filament winding (d) Pultrusion (e) Resin
According to Josmin P Jose et al. [7] and Tay [18], the bag
and cured by applying heat and pressure. Once, the curing cycle is
complete, the materials take the shape of the mould itself. There are
(c) Pultrusion
die rather than being forced out by pressure as in the extrusion. Using
25
produced.
patterns [7].
either from metals or composites and the resin is injected into the
tool. The reinforcements are also placed in the tool and due to the
injection the resin will come in contact with the reinforcements. RTM
(matrix and reinforcement) are fed into a heated barrel, churned and
pushed into a mould cavity where it cools and hardens and finally
26
takes the shape of the mould cavity. Through IM, many materials
such as mobile phone cases, spike busters, internet dongles, etc., are
more.
Josmin P Jose et al. [7] lists some of the pros and cons of IM
use a broad range of materials, low labour costs and minimal scrap
losses, but the tools and equipments involved are expensive; the need
are termed as fillers [20]. Fillers can be classified into two types viz.,
Inert and Reinforcing fillers. Inert fillers are added from the
economical point of view. Even though termed inert, inert fillers can
besides cost. Adding them into the matrix may increase the density of
China clay (kaolin), talc, and calcium carbonate are some examples of
inert fillers. On the other hand, reinforcing fillers are added from the
behaviour.
27
formed linking the polymer and the filler, in some cases and in other
significance. The particle shape and size, the surface chemistry of the
with virgin thermoplastics. It has also been observed that the shape of
particle size of 1 m [20]. Glass spheres, Talc, Kaolin, and Mica are
and mica usually have lamellar shapes [20]. Other fillers include
Table 2.1 presents some typical fillers and their forms. Table 2.5
ABS plastic is used for its impact resistance and toughness and
reinforcements into the matrix of ABS. ABS polymers are known for
properties of ABS.
The light weight of ABS and its ability to get it injection moulded
available to us today. For example: PVC, PP, PEEK, PAs, epoxy, etc.
society. They are rapidly reinstating many metals for making objects.
bond and creating new single covalent bonds between the monomers.
31
polymer may have one thousand to one million units linked together.
in its place. The new substance is given the trade name nylon, but
talc, mica, silica, flyash, kaolin, etc., one can make them usable in
textiles, etc.
nylon 6-6/6, nylon 6/12, nylon 11 and nylon 12 are the most
common ones [25]. Nylon6 and nylon 6/6 are the ones that are being
noted that nylon 6/12 has a lower melting point, lower strength, lower
But, one relationship which does not conform is price, i.e., nylon 6/12
is more costly than nylon 6/6. The property which gives nylon 6/12
attraction towards acid dyes than N6,6 [26]. The properties that make
phenol.
Applications of Nylon6
recreational equipments.
35
of its availability in grades with very fine particle size and high aspect
48.3% of calcium oxide (CaO) and 51.7% silicon dioxide (SiO2). The
CaO 47 44 47
SiO2 49.5 50 50
Property
Colour White
acicular shape of the wollastonite is the key contributing factor for the
viscosity for improved melt flow, easier dispersion for better property
and talc, having similar Youngs moduli, but platy shape of these
with proper selection of median diameter and control of top size of the
certain resins can be improved over the unfilled polymer and over
other fillers.
improvements expected:
Enhanced:
Stiffness and Impact Dimensional
flexural strength resistance stability
Wear / sliding Surface Melting
resistance appearance Temperature
Electrical
properties
Features Advantages Benefits
Low cost reinforcing filler Less expensive than Better economics for
40
applications [34]. In general, all PAs are hygroscopic [35] i.e., they
wt% at 23C, 50% RH and 9 wt% at 23C, 100% relative humidity (RH)
[36].
for a 0.060 inch (1.5 mm) thick part [25]. The absorbed water in the
group and enhance the molecular chain mobility [37], which in turn
dimensions and mass due to the stress and swelling that causes
driven off by drying them in ovens. The absorption rate varies with
fillers. There are varieties of fillers available and some of them have
been listed in the Table 2.5. The absorption effects can also be
[39, 40] and on the other hand, the material moisture content refers
Their observations say that water can act as a good lubricant for the
outcome of the tests indicates that the PTFE has better frictional traits
PE) [42].
resistivity [43].
have discussed issues related to PAs and say that Water can set
PAs are one of the most frequently used polymers used in many
such that they can be suited for end-use applications. But, on the
Over the years, several types of fillers have been in use with
PAs. Biobased fibres such as coconut fibre, wood flour, sisal, wheat
straw, kenaf, jute and minerals such as carbon fibres, mica, talc,
strength and modulus to the composite, and sometimes PAs are also
of reduced adhesion between the non polar matrix and the polar filler
with the aim of improving the bonding. Literature studies have shown
they have also been used in combination for specific applications [55,
56].
reinforced PA have found its use as bumper beams. Talc filled impact
content increases.
in the composites.
Abdul Razak Rahmat et al. [27] and Akay et al. [60] have
and voids in the materials that may be formed in the matrix or in the
properties. For this purpose, they have used different natural fibres
such as ax, jute, pure cellulose, and wood pulps with PAs to analyse
stated that the dielectric strength increases with the increase in filler
concentration.
material, embedded into the matrix of PA6. The resulting product was
was found that Kevlar fibre had improved the wear resistance of PA6.
48
was lower than that of the PA6 and increased slowly, while its friction
Jin Tong et al. [64] have discussed the effects of the wollastonite
were observed.
49
Synthetic fibres
Metallic oxides
spheres
Carbon black
Wollastonite
Sand/quartz
Carbon fibre
Glass Fibre
carbonate
Whiskers
Cellulose
Asbestos
Graphite
Calcium
powder
Kaolin
Silica
Mica
Talc
Glass
Tensile strength
Compressive
Modulus of
strength
Impact strength - - - - - - - - -
elasticity
Reduced
Better thermal
shrinkage
Electrical
conductivity
Electrical
conductivity
Chemical
resistance
Better abrasion
resistance
behaviour
2.3.1 Overview
decorative and aesthetic views to the plastics. In the early days of the
1960s, plating began on a commercial level and this was possible only
exploitation were mainly due to the reduced weight, lower cost, design
weight of the parts came in handy when the gasoline crisis occurred in
plated and today there are many plastics that can be plated, viz, ABS,
Phenolic [71].
metallization, plating, flame or arc spraying and painting, apart from the
ones discussed above. But, of all the processes, plating was the most
[70]. More about the plating has been discussed in the ensuing
paragraphs.
survey was that, the majority of the work on plating was done
view.
52
The reducing agent actually converts the metal ions (Mn+) to the
metal (M) which gets plated over a catalytic surface as shown in Eqn. 2.1.
+ + + 2.1
that an active surface is obtained [72] and for that, the electroless plating
other organic chemicals and make the surface of the polymer dirt
free.
(b) Chromic acid and/or sulfuric acid are some of the strong oxidative
of samples.
alternatively [72].
process.
(c) To improve the plating quality, complexing agents like tartrate and
(d) Exaltants like succinate / fluoride are added to the plating bath to
(e) Stabilizers (prevents the instability of the bath) e.g. lead, calcium,
The deposits are pore-free and have better corrosion resistance than
electroplated ones. They give rise to harder surfaces and as a result the
holes is required.
metals like gold, silver, platinum, palladium, rhodium, iron, cobalt and
nickel, and the deposition starts impulsively when it comes across these
case of PCBs, in PCBs the base object is a plastic material and upon
g/L), sodium hydroxide (15 g/L) and Rochelle salt (14 g/L), pH 11
Reactions
Cathode 2+ + 2 2.2
Anode 2 + 4 2 + 22 + 2 + 2 2.3
Overall reaction 2+ + 2 + 4 + 2 + 22 +
2 2.4
Plating Process
m h-1.
57
hot solution of 1:1 sulphuric acid. Magnesium alloys are given a thin
Reactions
Cathode 2+ + 2 2.5
Anode 2 2 + 2 2 3 + 2 + + 2 2.6
Overall reaction 2+ + 2 2 + 2 + 2 3 + 2 + 2.7
58
Sodium dodecylbenzene
Cleaning / 35 g/L
1 sulfonate (C18H29NaO3S)
degreasing
Disodium metasilicate
3 g/L
(Na2SiO3)
Nickel(II) acetate
---
Surface ((CH3CO2)2Ni.4H2O)
ammonium hydroxide
To adjust pH = 9
(NH4OH)
59
Plating process
Table 2.6. The cleaned surfaces are given acid treatment, followed by
of 20 m per hour. During the reaction, H+ ions are released and this
reaction changes the value of the pH of the solution. This mostly affects
the quality and the rate of plating. The buffer controls the pH during the
plating. The Plating will start only when the temperature of the bath
solution.
2.3.2.2 Electroplating
(iii) Composites
60
through the suitable electrolyte placed in the tank. The tank composes of
cathode and anode. The cathode is the substrate and the anode is the
metal ions due to the anode in the bath get transferred onto the
given by:
+
( ) ( ) + ( ) 2.8
+
( )+ 2.9
+ + 2.10
it is not maintained, then there are chances of oxygen evolution from the
1
2 2 +2 + + 2 2.11
2
61
1
+ + 2 2 2.12
Deposition of metal and the crystal growth are fairly similar. The
(ii) There will be further growth of these atomic layers, which may
grow up to 60 m thick.
they grow more swiftly at a lower overvoltage. The atoms so formed will
layers. These places / sites which the atoms occupy are called as kink
sites and here the atoms network themselves with the three
neighbouring atoms as shown in the fig. 2.4. There are also some places
like edge sites where the atoms reside, here it is believed that atoms
single atoms called adatoms which interact with only one neighbouring
(1) Atoms start to deposit on the surface of the electrode due to the
It is to be noted that the steps (2) and (3) play an important role in
adhesion (b) fine and equally grained structure (c) uniform thickness (d)
The current density (c.d.) is the current per unit area normally
and the adatoms move towards Kink sites that later result in excellent
diffusion of ions slows down and the adatoms may not be able to reach
formation that causes disordered plating, also when the current densities
are higher; there are chances of hydrogen evolution along with the loose
The plating bath contains a solution of the metal salt and also in-
order to improve the plating process, the plating bath is added with
deposit.
metal.
on surfaces.
finish for the plated surfaces. These when added into the
dislocations. These are the areas that attract the ions and
levellers are added into the plating bath. Levellers get into
hydrogen gas is released at the cathode and the reason for this
solution. Buffers like borate and citrate are used in nickel and
the bath can lead to the corrosion of the plating tank. It has
also been observed that due to the high temperature the organic
of 35 and 60 oC.
the plating bath. Haring Blum cell (fig. 2.5) is mainly used to
their distances measured from the anode are C1 and C2, where
C2.
100 ()
% = 2.14
(+2)
throwing power.
electroplated, the size and type of substrate material and its number, the
objective of plating and the economics. Depending on the size and the
fixtures are used. Some of the fixtures used are jig or rack mounting for
large scale routine jobs; barrel plating for routine processing of large
specialized work pieces (e.g. motor car parts and computer frames) and
tank (vat) lined with polymeric materials on the inner side of the
bags.
these cables and then dipped in the tank. Anodes are those
by electrolysis.
72
Pretreatment
(v) Rinsing and drying: The substrate is finally rinsed with hot
Electrolysis
electrodes that are dipped in the electrolyte. One of the electrodes will be
the substrate (cathode) on which the plating is to be carried out and the
other called anode dissolves in the electrolyte and helps in the deposition
varies from a few seconds to several minutes. The plating thickness can
vary from a few microns to 100 microns. There are various plating
processes known and practiced these days and few of them have been
Plating bath Chromic acid bath; chromic acid (CrO3) and H2SO4
in 100:1 proportion
Operating 45 - 60 0C
temperature
3 + 2 2 4 42 + 2 + 2.15
22 4 2 2 7 + 2 2.16
2 2 7 2 72 + 2 + 2.17
75
.(42 )
2 72 + 14+ + 6 2 3+ + 72 2.18
3+ + 3 2.19
2
2 3+ + 32 23 + 6 2.20
Electroplating of Copper
Sulphate bath Cyanide bath
Plating bath 200 - 250 g of CuSO4, 50 - 75 g H2SO4 per L of 40 - 50 g of CuCN, 20 - 30 g of KCN,
bath solution 10 g K2CO3 per L
Operating 20 - 400C 40 - 700C
temperature
Current density 20 50 mA / cm2 10 40 mA / cm2
Addition agents Gelatin, dextrin, sulphur containing brighteners, Sodium thiosulphate
sulphonic acids
Current efficiency (%) 95 99 60 - 90
Anode Phosphorous containing rolled Cu O2 free high conductivity Cu
Cathode Object to be coated pretreated Object to be coated pretreated
Applications In printed circuit boards, low throwing power As an undercoat for Cr plating, in
(not suitable for iron and iron alloy plating) printed circuit boards, good throwing
power
(suitable for iron and iron alloy
plating)
77
Electroplating of Nickel
Sulphate bath Cyanide bath
Plating bath 250 g of NiSO4, 45 g of NiCl2, 30 g of boric acid 600 g of Ni sulphamate, 5 g of NiCl 2,
40 g of boric acid per L, pH 4
Addition agents Coumarin, Saccharin, benzene sulphonamide Napthalene 1,3, trisulphonic acid
Electroplating Electroless
binder usually made of resin. Generally, present day CPs are based on
grease, some used in PCB repair kits, etc. Conductive Inks- Paste/
size of the metal powders range from 2 to 25 microns and will be 99.9
of networking with electronics and its applications. The CPs can today
[81].
using Ni paints when compared with silver and copper CPs is the
the use of Ni paints has been restricted from its use in many of the
present day electronic products. Among all the types of coats / paints,
inflated material costs linked with silver paint tend to confine its use
[69].
80
in cost of CPs are based on applications, for instance, use of CPs for
certain applications may find it very useful and for some it may be
the variables / elements of the process cost that can play a significant
role in influencing the overall cost. In some cases, the cost associated
less cost in plating, but at the same time requires exterior painting for
the product. Therefore, in such cases CPs can be used to avoid the
the product design changes and the convolution of the present day
81