Aloka. ———————__ SERVICE MANUAL ECHO CAMERA SSD - 500 English Version Document Number: MN2- 0142 Manual Version =: 2 Copyright ALOKA Co.,Ltd Mure, Mitaka-shi, Tokyo, Japan YYsecnow section secnon section section SECTION 1 B ‘CONTENTS page nrRopucTION 11 Service Manual tea 12. Best use of Service Manual 4 13 Contents of tis Service Manual wa 14 Construction of this Service Marual 121 15 Contents of each section 12 PRECAUTION ( Pleae read without fail) 24 Precautions agninst electrical heards to serviceman 2-1 22 Precautions against mechanical hazards to serviceman 2-1 23° rections against germ hazards to serviceman uy 24 recautlons for keeping sect safety of $S0-500 2-7 25 Precautions for keeping mechan cal safety of $SD-500 2-1 28 Precautions for Keeping chemieas safety of SSD-500 2-2 2.7 Preparation to be made at service center 222 28 Gare to be taken in the eld 22 BEFORE REPAIRING 2:1 Handling of SALT. and SMD. DISASSEMBLING PROCEDURE 41 Disassembling procedure of the main body SYSTEM BLOCK DIAGRAM 541 Beplanation of system 52 System Block diagram PCB BLOCK DIAGRAM 61 Introduction 62 Panel Control e273 63 Re P2668 54 Te & Control P2865 6s ite 2670 es Bsc feast 67 MPU e282 68 Panel Board CKEV-16 A, 8 69 Gain & Power LED eP-2078 E10 Selec Key P2879 Et Contatt & Brightness e880 €12 Inout 2881 E13 Photo Cont Bright. e282 6-1 622 6.4 bc6 6210 6.12 6215 6216 6.18 6-20 6.22 6.28SECTION 7 SCHEMATIC DIAGRAM Symthetcal sxhematic of USL-11S mH Gain & Power LED ere m2 Selec Key E2073 a invout P2001 a Chev-ta a, 75 kev 8 775 cpza6e {device location ) 720 2.2869 {devi Feation ) an 9.2870 {device leeation ) ar 9.2871 { Beviee location ) 7213 287 ( deviee leetion ) 75 2873 ( devee lection ) 716 eeaere (doves leeation ) 718 er2e7s ( deviee leeation ) 79 Ee2ect ( doves leeation ) 3230 epee? ( deviee leation ) ae LKEV6 A (device Ieeation) ee LKEY-18 8 (device Ieeation ) a Cable iit 7a Cable Connection of £°-2873 ae Power Supply Unit su.s500 73 TV'menitor re-o7o2-TH 7235 SECTION 8 TROUBLE SHOOTING 21 Introduction 8 82 Attention 3 83 Tools and measures 8 84 Using method of Trouble shooting 3 83 Information for reparing 8 Bt Automate setting up @ 852 Condition of swith on PCB a 8.5.3 How to Ue the user function 2 854 Aftertlon of connecting optional units 3 BSS How to reset ackup RAM 2 856 Location of Pe 8 857 Location of RON 2 85. Disposition of locking up 8 86 PCB ( check) List Map 8 861 Phenomenon Code Tobie 8 862 MAP ©7 Weve form siogram 22 271 Introduction 8221 872 Atention B22 ara Re p-2668 Boa B74 Tx 8 Control P2668, 8.6 or IF ep2e70 830 B78 DiC eae 835SECTION 9 ALGGNMENT PROCEDURE 9:1 reduction o-1 92 Atertion on 9:3 Tools and measures oo 5:4 Alignment procedure 9-1 Set eP-2068 Rx 9-2 SECTION 10 PERFORMANCE CHECK. 10-1 troduction 10-1 {02 Attention wot 103 Performance check 10.1 104 Check Sheet 1-7 104 Check sheet 17 SECTION 11 MAINTENANCE INFORMATION 11-1 ntroducton net 112 Attention ot 113 Technical information wt 1331 Explanation of "STATUS" ma 1132 "Probe group” Moa 34 How to change the TV scanning lines na 1-3 How to chenge the absevieal Measurment 1174 4135 How to change the AC input veltoge nos 11-4 Manus Change Information ne SECTION 12 HISTORY OF tweRovEMENT SECON 13. PARTS UST Device location on PCB wet 11 Par Lit iBsts SECTION 14 OUTUNE OF svsTEM. 141 Design Poley wet 482 Construction of System wat SECON 15 PRINCIPLE OF OPERATION ( SYSTEIA) specication 15-1 152 Feature oa 1$:2-1 Multi Costed Probe 1-3 22 Electric Linear Searing 1503 2 Electee Convex Scanning 15-5 153 System explanation 15-6 AE37| Symem explanation 15.6 1532 Signal flow of receiving 15-8 41523 Panel information 15-5 153.8 Digital Sean Converter 1-7,15:35 Viewing monitor 153.6 Power supply unitSECTION 1 INTRODUCTION contents Best use of Service Manual Content of thi Service Manual Construction of this Service Manual Contents of each section secnon 13 SGCTON_1_tow ase se mat Service Manual 1) Ths sorvico manual has been prepared for persons in charge of servicing 580.500, 2) This service manual is compiled according tothe following basic principle "For service, lek out 8 faulty PCB ond replace Rt with 2 new PCB Best Use of Service Manual Make the best use ofthis service manual, making also reference to available ‘echnical support information Such as "Modifaton technology note.” Contents of Service Manual 1) 580-500 isthe equipment in which the surface mount technology ($2.7) is incorporate. Most of the printed cireult boards (PC) in this equipment use the surface meunt davies (5.0) Its Impossible to repair PCBS inelding SMLC. Any trouble couse by a faulty PCB must be repaired by replacement of the PCD a2 3 unt. From this point of view, no PCB wire connecion clagram fs Included in ths fervice manus 2) The manual version 1.0 contains descritions of products a8 of September 188, 3) Later products may somewhat deviate ‘rom the desriotion of this manual beeaure products are subject to change in specications and other For changes and modifications of a1 wll as adltions to specifeations, if any, prompt information will be given to you by means of "Manuel change Information "which Isto be inserted Into the manual Construction of This Manual To faclitate revisions according to the sbore mentioned “Manual change information," this service manual is elided ino several sections. Important + Alwoys observe the manner specified for replacement, alton, or deletion of "Manual Change’ to prevent missing Of nacerary information and keeping of erroneous information The structure of Service Manual i 2 follows: 1) Serica instructions 2) are list 4) Principle of operation000 1 Hon tow hase mene 15 Contents of Each Section secnon 1 secon ‘SECTIONS section 4 SECTIONS section 7 secnot section 9 How to Use this Service Manual Desrbes the purpose of the Service Manual Deserbes general precautions and preparations for maintenance service. Be sue to follow working procedures If mentioned Before repaiting Gives information peculiar to $80-500 anc care to be taken before starting repair work Disassembling Procedure Disessembly Procedure tlusrates the disassembly and assembly ‘of main components. Be sure t0 follow werking procedures it Spedited. System Block Diagram Gives the convenience of grasping flow of major signals nd ‘mutual communication between units inthe whole sistem. Block Diagrams Gives outline of individual PCRs, and block diagrams showing tes points (TP) and woveforms In PCBS Schematle Diagrems Gives the casing connection diagram incluing all cables used “rouble Shooting Describes precautions on actual repair work and shows the necessary teale and messuring. instruments. Also, Includes. many Rint on primary diagnose snd measures to be “aken in the fie Adjusiments Gives guides of austments of PCBS and urits which some PCBS ‘need winen they are replacedSECTION 10 seoTION 11 section 12 section 13 secmion 14 SECTION 15, SECON 16 Describes the procedure of checking for proper operation after repair and provides the forms cf check sheet. Maintenance Inform Provides technica information about maintenance service. History of improvement Describes in tabular form the history of modifications of 550-500 Pores ist LUss the mechanical pars and elecical part. outing of system Dercrbes the structure and operation of the equipment seen in broad perspective Pringpte of Operation system) Describes the principle of sistem operation Principle of Operation (acdware) Dearbes the microscopical views of structure and operation of the equipment.SEOUL _Mow toe ta ce al (this page i blank.22 23 a 2 26 27 28 SECTION 2 PRECAUTIONS ‘CONTENTS. Procsuions agnnst electric hazards to serviceman Precautions against mechonical hazard to serviceman Precautions against germ hazards to serviceman Precautions for keeping electcal sfety of $8500 Precautions for keeping mechanical safety of $s0-300 Procautions for keeping chemicals safety of SSD-500 Preparation to be made at service center Care to be taken in the Tele secon 2a 22 23 24 25 SETON_2_pescamnons Precautions Against Electrical Hazards to Serviceman _when disessembiing the $S0:500 after checking it for wovble symptom, give care to the flowing 1) Re sure to unplug the equipment before diessembly 2) Be sure to turnoff the main switch on the equipment when removing lecvicel parts such as PCBS, probe, and cable Precautions Against Mechanical Hazards to Serviceman When disassembling the equipment, giva care to the following 1) Keep the working environment net 2) Wear working grooves to protect your hands from geting injured by bores on the unit and casing 3) Use only proper took suited work being made 5) Be sure to observe the specified deastembly procedure, 5) Take sufficient care not to damage component with undue oad, Precautions Against Germ Hazards to Serviceman 1) When its necesary to touch the 550-500 equipment, options andor ‘other peripheral devices st a customer who uses body cavity probes thst ‘eed sterilization, take special care to protect your hers against germs, Itrespectve of the usage of the $S0:500 wheter itt used In the ‘operation room oF not 2) Service tools re subject to germ pollsten in hospitals and, therefore, eed pesodical sterilization 3) Be careful not to directly touch anything assumable to have germ pplltion, 1 necesary, ask the customer for effective protection against ‘erms. Precautions for Keeping Electrical Safety of SS0-500 1) Be sure to ground the equiament securely 2) _Pestecines in grounding, stew tightening, and cover installation i esential. Negligence of it could cause sposibility of leak current from ‘outer fitting which may lead to serious damage to » patient being Glagnoted, Precautions for Keeping Mechanical Safety of $50-500 ‘Take care tothe folowing to prevent the equipment from being damaged or broken during clsassembly and resternly work 2-26 27 28 1) Be sure to observe the specifi disstembly procedure 2) Take care not to damage component parts by undue lead 3) When reassembling the equipment, carefully check every part for loosening, ditordon and creak 4) Use only the spacifed serens and nuts. Using any other screws andor Futs would affect nat only mechanical performance, But aso sectrcs| performance of the equipment. Precautions for Keeping Chemicals Safety of $50-500 ‘Whenever grease, cil or other chemicals is used for maintenance service of ‘the 580-300, options andlor peripheral devices, be sure to clesy the equipment ‘aalor devices after service werk Preparation to be Made at Service Center 1) When called by « customer on the telephone, note the following: [1] Name of equipment 2] Seria! umber of equipment 1B] Name of horpital [a] Telephone number [5] Name of person in charge [6] Detail of trouble symptom a far as possibie [7] State of connection to optional devices 2) Go-aver he “Modification teemology note"ta see whether the famplained vouble can be mended by means of regula repsiing method Core to be Taken in the Field 1) check for trouble symptoms. 2) Check for connection to optional devices and other periphers devices 3) Record the contents ofthe bettery backup memory. 4) After working, ret the equipment according tothe atove mentioned ‘contents of memory 5) Alter completion of work, put back the peripheral davises ‘0 the orignal ‘conditionSECTION 3 BEFORE REPAIRING ..... ‘CONTENTS 34 Handling of SMLT, and SM. secnon 33-1 Handling of S.M.T. (Surface Mount Technology) and S.M.O. (Surface Mount Device) PCBs should not be repaired or modified ess rue in the field touch ICs on PORE unles its neces Since the pitch between leads is smaller than before, ICs invlve the Possibility of rusting by dirs and sweat tram hands. Also tivolves the ‘ossblity oF shorting due to fine selder chips jammed between leads When replacing ROM (read Only Memory) on 2 PCB, do not insert ROM Into it ocket forebly. Undue force applied to ROM would couse the following veriour trovbes (1) Damage to witing patterns an intermediate layers of PC. (2) Haking and falling of chip devies indluding resistance, condenser, fiode, te) (8) Damage to electrodes in chip devices (@) Faking ef lane which is made ‘emaler then belore (5) Faking and faling of parts on the back surface ‘Also, take care to install PCBs improperly or to install warped PCBs Athhough newly shipped equipment does nxt involve such problem s$ fling of of chip devices due to shock, such 8 problem may occasonaly rise the reconditioned or modifea equipment tecaure of Feselderng reese. Reuse of chip devices (including resistor, capacitor, diode, etc) for .M.0, is strictly avoided, Sine chip devices do not have pat leds such found fn conventional pars, heat caused by soldering of reuse chip device could ‘wanimit direct to the inside, witheut thermal damping by leads, and burn fine witing patterns. Hand Be sure to observe this caution to pravent the secondary trouble cause by damage 10 witing pattems.(itis page is blank}SECTION 4 ~— DISASSEMBLING PROCEDURE contents 441 Deasembling procedure af the main boty at section 441 80-500 Disassembling Procedure son 4 oases reoceoust Refer this “Disassembling Procedure” in oder to disassemble correctly In the ‘ase of repair, modifeation or readjustment. ssp-seo sista Disassembling Instructions 1aHoRt awass tone sohaR LORE Ar 9- Fan OMNI BOP 7 ar ORDI LE eu Ta omyAUme 27 0y be —OMD I LIE BPC RD SE Lasie apemomnst Litho, lated ery eo 9) REYIAD) Smt lancer 24279 —eeKEY.A4AyD ONC nigimpercm ee. zeszer-sm0 wns 2.CRT-PCHCUPC 610A} 8 LTR IMR 9 HesU-SsOOIONE HL IIE 12ers hentiestion ndividea units tagout “LP Helder dlsmounling procedure SConesar cover diameunting procedure Rin cover diamaunling procedure ‘LPront cover dismovating procedure {PO bounds clamounting precede PC board dinounting procedure, ra.cer-re (uPe-s6104) ‘pulout procedure 1.Pewer supply unit elamountng procedurea tetbn ee2229 bot 2individual units layout sc Powe EPsa7ouP 2071 BP.2872 rth croroe-sin ptiher seo 7I~ Whevany itner see 79 (EKEY-14A), ‘Operating paral Bens 2 geSpA Lo Teges 8.Cautions on disassambling and reassembling eee TR MaMAM 79% 9-4 9¢— we IISA PABA ve semi ko dem AN MULT IAF 7 WOH SB. PRUDENT ES WrsBhass, AcOH, FRE BwIshOM, Sok CHL SH CMMI, FOMT KT AWE MY, Mit 3 aE Lies, (BtSesA) Required ‘Tools Phillips type screw-drivar 1 ‘Small Mat blade sorew-deiver 1 Cautions on Disassembling and Reascembling ‘When fastening the screws of the plastic covers. use eaution so as to not apply ‘more than edequate force in order not to damage the covers. Use the folowing rule when fastening serews @7o turn the serewdriver gripping the handle using your thump aad two fingers will provide sufficient fastening force. Do not fully grip the hancle using the palm of the hand (See Fig.8) a Pesfelon pagrus mmoceoune AO ~ FMS OMY LHI 4 Probe holder dismounting procedure YFP FHM FOIA Ee, NA tems LMA IMIS LS EA FE Y@E Fie ROVE, (HO) OREM A 94 FEET. TL FL LOL IM ADEMAT. (HD) (AILIR the probe holder while pulling the claw of the holder. Then the ‘guide pin ® is released from the gourd shaped hele ®. (@ in Fig.) (2)Slide the holder forward of the device and remove the guide pin © from the gourd shapedhole D. (@ in Fig.) . eS SS UZ m5 f\~ genvuey ‘Gourd abe Tale were e Gaile pin © pu7kO Geile Oe vig5.285 9 WK OMDHLAIE S.Connector cover dismounling procedure (BAI INN O77 AIDE ATA EDA CMT B.ED) DRAPARIAN§ B97 7 ARO BPI LRA TH MRT (array (1)Loosen two locking claws of the cover with a flat-blade screwdriver. (@ in Fig.) (insert the fat-blade serew-driver Into the portion without lockiag claws and ‘oxtract the connector cover from the rear cover, (@ in Fig.) r: 1 SORBENT CEL caunion [en iene cover Taking i Bs resfasion 4 oisertus maocsoun auras 1 cover dismounting proved (OAIKAM OVIDEO INTEXTNER 4 9 FE LICH 3. (BED) QVACAKENL-TIT Noe RHA MEL. PO) HEATON OD BAI EY TA MERA LTR METRO L BCMET SM, (1yfurn up the VIDEO INTIEXT change-over switch on the back of the body. (@ in Fig) (2)Remove four eerews and extract the rear cover backwards. (D in Fig.) NOTE: In resssembling, confirm that the front cover-end the rear cover are ly engaged, and serew in Fig. yer ban pra Tear eer onnexie4 me meslon 4_psastevaua mnoceoune 7 By ba IRD I LI ‘Front cover dismounting procedure (7 BY PAM BA LERTY TERRANCE, LMA ETM DARVEE HBO 4, (EPO) IBY AKA HHO H, FUME A EMOTE IAO AC EMD AS. (BB) 7B Y FRAIL OH HA HNL RM (The front cover is fixed with four serews to the ch ‘namely one of the upper two screws and the @in Mig) (While Keeping the front cover from failing downward by hol remove the one remaining screw. (® in Fig.) (@)Bxtrate the front cover forwards while looking wiring. (© in Fig.) it with the hand, mya C ONKOL fam see ance gov rain dap atc nein rant ever Screw lo be lose ar retPCH DI LIE BPC board dismounting procedure iESUEPCIOEP-2866-EP-2869)0MK HH LIE (OPO FER EIREML TROT. (HD) (MPOME MELTS iL LAAT SALT. (HO) (OPOMIZHRIRE RCS 247 9 (P20L-P2OBPOLPIOSMA ESTs (BHO) PCHE LENS LEE FE LURUI. (EO) ‘Transmitting and receiving PC boards (RP-2868:EP.2863) dismounting procedure (Remove two screws and remove the PC guide, (In Fig.) (2)Remove two upper screws and three lower sorews which fix the PC board. (@ in Mig) ()Remove four connectors (P204-P208-P402-P403) connestad to the PC board. (O in Fig. (Remove the PC board so as to ifthe board. (@ In Fig.) BNKSx82 pews x Po poe Bux se PCK_(wo.zeas 2008) “Teaneniling and asiving PC ban aNKax0.8 Be Figo asDSO POIK(EP-2870-EP-2871-EP-2872) 01 95} LF (MPO FE LIR, POMMER Ea Ca TE NE AMIS, (MPD) (PCIE Cub 247 ¥ RPA PsOLPDOB)E ENE, (LD) COPORE LICE LVS EFC L CMON. (HO) “DSC PC boards (BP-2870:P.2871-RP.2872) dismounting procedure (Loosen two strews of the PC guide and loosen four serews of the PC relnforcing rietal fiting, and remove the guide and the metal Miting respectively, (@ in Fig.) (2)Remove three connectors (P218-P404:P208) connected to the PC board respectively. @ in Mg) (@)Remove the PC board from the body 20 as to lift the board, (© in Fig.) NKaxe2 poms. PC eelnfveng wal ng ws Pusmounting provedure, fembiy sPCHCEP.2079)M 9 HELI PCIR(PC-287a)& 7 — 7 HedcK(PBOL-PSOAPLOSPSON E777 hE TESLA CDE eAEL CRUD ILA, (ake) epolkade-2e78)me Wt Li POMPEI) 7 UTE AMO REAL, LER EH LCR UIT #PCHLCEP.2979)820 54 File PCIR(EP-2879)£ BCOKENL CROAT. (BHO) SPOIRCEP- 2880) HLF Y= RIED LIEIL CRY HY LPCHCRP. 2080) & 1a LOREM L TRY NT. aso) eM E tT 9 & 77) —(L-KEY-14B) OUR FEL Heer oe 77 SENET ibe CXOREN LCDI (HED 20 board (2245) dsmouniing proeedare Tenn tour cals (S001 POEIMOSEUON and the ft cable ofthe BC. bosrd WSETiap ang eal to remove io stew ond remeve the bosed (in ig) 006 Sonrd QEE 2898) danounting procedure ona ine nat an i Ran fle he ont cover ard remove, and remove two Loser af tag EC bontd GEE 2678 and remove te our (D i Big) o50" Waseda asi} Ucmauniing poceuore Tena ee seas af Use BC botre TEE D879) and remove the board. (© in Fig) or Tora bSHBD) dlnounting posses Fo ee taut Peel ond remove the pana, and remove two Beer He BG bosrd (EE 2500) and cemove the bourd {0 in Pig) acfvting poet any RY 0) lang ‘wocedure Smove ten serews and remave the operating panel assembly (L-KRY-14B). Gin rig) power 2970) c pod bp nnoxon ak hi ight reund heed Bild pao sernw 2.6462 Pea hreaxen P-Ugit round head pea synaxes Gh ound heal Power 2380) Pet branes Tigi round ead SS Ped bemnsxae PUght rowed head sera 20%0,10 eee Ktoer erry ing panel assembly (Caavaanonn ee: in ing procedure CORA ED OY ha ED YUM EAE, BUERIOMLT MOT. (ae) TTA EA PARI OE ECL ENED, (EB) EFA eRCCKENL TRIAT. (AO) (IRIE RT 9 Ae 7) — CL KRY-LAAVE a CLO L DIT, EB) (Loosen respective two hinge holders and remove them from the Iront cover, ‘and remove the operating panel. (® in Fig.) (2)Serapte our two patch rubber with a flat-blade serew. (in Fig) (GiRemove five screws of the upper ease cover and remove the cover. (O in Fig.) (W)Remove ten sorews and remove the operating pane! assembly (L-KEY-14A), (in Fig) eapary on yn nan sean 260,10 P94 be Boxes Pugh feraw 28662 fatecaer ser ry; eKevsi4Al ‘Operating pal aaron ses Patek raat Pod br wzaxes P Ught rome a Pigs‘setn__psassegungPeoceoung 11 WiRipPCHCEP 2982-EP-2881) 1L.Rear blading PC boards OMI Tie dismounting procedure VME E a CAEL CRO MT. (HO) CPCHCEP.2882)& BLZREAL TROT. (BHO) (OYPOM(RP.2081)€ a LSKENL D7 FPSO) USEL CDI. (BHO) (1)Remove two serews of the rear blocking plate and emove the plate, (@ in Fi (2iRemove two screws and remove the PC board (EP-2882). (B in Vig) (BiRemove three serews and the connector (P505), and remove the PC board @P-2861), (© in Fig) 1 Tight roond head sera 382 I HF PC board NK m2 rigssassmsuns rockoute 12.0R7-POMA(UPC-1610A) 12,0RP-PC (UPC-1610A) ome LHe pulhout procedure (07 7 PRM a COREA YT RINS ESC ERET OL ORD. (area) ()ORPPCHCUPC-1610A) £3) 817", (KB) (Loosen three direws and shift the fan fitting panel upward so that the gourd: shaped holes are released, and remove the fan fitting panel. (@ in Tig.) (2)pull out the CRT-PC (UPC-1610A), (@ in Fig) zee misie yuen Gaurd shape ale mis Fatsfasion 4 sassy moctoune 18,2 = 7 LORD 18. Power supply unit dismounting procedure (RMT 8 247 7 PAOTPAOOALMMRA= 7 LOMO. (BHO Oy = > FED LARENL CHIH ST ELT, (PB) (1)Remove twa connectors (P407-P408) on the Front side of the body from the power supply unit. ( in Fig) (Remove two serews and pull out the power supply unit from the body. (BD fn Fig.) ersussoo) ower spl wit sax 4 Fig(This page is blank.)SECTION 5 SYSTEM BLOCK DIAGRAM 52 Explanation of system Syetom block dageam5-1 Explanation of SYSTEM This system are organized by Te & Re, Interface, DSC, Panel, Moniter and Power supply. Timing signals of the electric scanning is generated in the Interface part. Tx & fx part accept these signals and generates the pulte for wansmission, This pulse brat the transzucer element af the probe ard generates the ullescund weve ‘This ultrasound wave reaches to inside of human body and the acho wove returns to rensducer again. After that, the echo signal fs procesed ad is outputted to DSC pan. [At DSC pert, the ultrasound dete which + coming trom Tk & Re part is ‘memorized into the frame memory alter passirg trough the A/D converter The ‘memorized data i read out by the TY system timing, and pace tough the Pos Proceso. After that the TV Composite Sgral'h generated by this ulasound eve, Character and Graphic. Finally, TV Composite signal is outputted 10 the viewing [At Pane part, any information, for example, sede information, MAG information ‘and so on, re gathered and outputted tothe Interface par Monitor partis organized by 7 inch moniter and the knobs for contrast and brightness 350-500 nas the nabs for the photograph In the case of using ACK 500 which is prepared to take 9 photograph drecty at the viewing monitor the Setting of contrast and brightness Is switched te the sting for the, photograph, This switching is done by the switen which located an EP-2090" Contrast & Brightness Pca ‘This power supply unit has the protector aquinst incressing current beyond the normal. “And als, the High voltage is cantlled by the switch whichis mounted on £P:2870 ITF PCB, 5-2 system block diagram The System Block Diagram is shown on next pepe Please use It for studying the operation of system and judgment on repairing Tame Rx P2569 Tx & Conte eae Ie Inverface p20 osc zn ose Panel £P.2873 Pent Contot LAEY-I0 AS Pane ER2078 Gain & Power LED 9.2879 Select Key £9-2880 Contrast Brightness £2681 inv Out FP.2682 Photo Cont. right. (2 cru)scious sre aoc os Monitor 'p-0702-TH Viewing Meniter (CEP 2000 is included in the mortor.) Power supaly PSUS5O0 Power suplySECTION 6 Introduction Ponel Control x Tn 8 Conte! Panel Board Gain & Power LED Selec Key Conwast & Brightness in/out PCB BLOCK DIAGRAM e283 268 2670 2 6 in6-1 Introduction In ths section, the simple explanations of PCH black diagram are described,Scion ence soc oeRa 62 £2873 Panel Control ‘This PCB is wed forthe contra panel and others switches [acts ata interface Between £92872 CPU and UKEY-1A oF se on. Function which this PCB covers areas fellows: (pew vo (2) Clock generator ©) =D arver (@) Track ball interfacey e143 ono) jours [envEp.2068, Rx ‘This PCO generates ultrasound transmission signal and convo! signal whichis sed for the received signal proceising creut in £P2868 Re ‘Ato, signals from varius gain controle srange on the panel and in front of ‘equipment are rant to this PCB and converted into convol signa whieh toe receiver circuit needs. Major processes made in this PCB are a follows: (1) Take aystem basic clock generation @) Focus contol Geir dine cc (@) Band pas iter contol signal generation (5) PRE STC signal generation (6) Gain signal generationsion 6_rca race aca 64 £92869 Tx & Control ‘his PCB generates ultrasound transmission signal and contel signal which i used forthe received signal processing cut in €P-2868 Rx ‘Als, signals from various gain controls arange on the pand and infront of cauipment are sent to thir PCB and converted into contol sgrals which the Feceiver cut Seeds. Major proceies made in ths PCB are a5 fllows: (1) Tax system basle eck generation 2) Fecus contd ()—Osallater ative circuit (@) Band pass fiter contro signal generation ()__PRESTC signal generation (8) Gain signa gererationSOEsecrou§_ ca aloe oncaas 65 P2870 mF This #8 functions os an interface between the TuRx unit, DSC and MPU, It tio Includes a pare hich generates Te unit contro signal. ‘roceses which this PCB caves out ae as follows: o @ o @ ua unit base cack goneration ‘gna! interface between the TURK unit and OSC ntroling the vorible Band ass flter Generation of contrat ignal for variable aperturesnon §_ nop tock omnes 66 eP-2871 se This BC8 fe used for dating the image of ultrasound echo. In 380-500, only cone ince of this PCB erves for storage of Images, TV synchronization, and siepay Lrasound images are sted inthe frame memory basically in the same. imethos at wed Yor $80-620 and $$0:630. However, there Iss considerably large Siference es viewed In detall becaue of @ eduction In function nd in number Df por use, Maso consolidation of OSC function is has been achieved by the use of many custom ic