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Of the two streams, the fuel is normally used for cooling. This is for two reasons:
(a) Fuels tend to have higher specific heats, so more heat is removed for a given
∆T of the coolant, and
(b) Leakage from an oxidizer stream into the normally fuel-rich combustion gas
can produce a local flame that can be catastrophic, whereas leakage from a
fuel line into the same fuel-rich gas is inert. In addition, exposing hot metal
to oxygen or strong oxidants always carries some risk of accelerated chemical
attack, or even ignition. Some exceptions do exist where oxidizers are used
for cooling, though.
The fuel at high pressure from the fuel pump (FP) is sent through a series of narrow
passages carved into the nozzle and chamber walls, picks up the wall heat flux from
the gas, and is delivered eventually to the injector manifold. Since the nozzle region
Design Considerations
(a) The coolant should have sufficient thermal capacity to absorb the heat load
without exceeding some critical temperature, which may be a chemical
decomposition limit (thermal cracking for hydrocarbons) or the boiling point
(although, with care, boiling can be sometimes tolerated or exploited for its
strong heat absorption properties).
Suppose QLOSS is the calculated total heat loss from the gas. As seen in a
i
previous lecture, this amounts to 1-3% of m cp Tc , more for the smaller
i
engines. Suppose also the fuel only is used as coolant, with a flow rate mF .
i i i
i i m− mF i m
The O F ratio is defined as O F = mox mF = , and so mF = . If
1+O
i
mF F
the liquid fuel has a specific heat ccool , its temperature rise ∆T from inlet to
exit of the cooling circuit will be given by
i
QLOSS = mF ccool ∆T (1)
i
i ⎛Q ⎞ mF
m cp Tc ⎜⎜ LOSS ⎟⎟ = ccool ∆T
⎝ QTOT ⎠ 1 + OF
QLOSS cp
which must be kept within limits. For example, say =0.02, =1,
Q TOT ccool
O =4, T =3000K; we obtain ∆T = 0.02 × 1 × 5 × 3000 = 300 K . This may or
F c
may not be acceptable; for a cryogenic coolant it would most likely be, but a
hydrocarbon fuel, exiting the pump at 300K will then leave the cooling circuit
at 600K, probably too high for chemical stability.
(b) The local cooling rate at the most exposed location (the throat) must be
sufficient to avoid decomposition or boiling even at the contact point of the
liquid with the wall. The thermal situation in a cut through the front wall of
the cooling passages is as schematizes in Fig. 3.
q = hl ( Twc − Tl ) (3)
where hl is the liquid-side film coefficient, that can be calculated, for instance,
from Bartz formula using liquid properties. The same heat flux is supplied
from the gas through the gas-side film coefficient:
and yet the same flux must cross the wall by conduction:
Twh − Twc
q=k (5)
δ
⎧ q
⎪ Taw − Twh = h
⎪ g
⎪⎪ δ
Re-writing (3)-(5) as ⎨ Twh − Twc = q
⎪ k
⎪ q
⎪ Twc − Tl = h
⎪⎩ l
⎛ 1 δ 1⎞
Taw − Tl = ⎜ + + ⎟q;
⎜ hg k hl ⎟
⎝ ⎠
Taw − Tl
q= (6)
1 1 δ
+ +
hg hl k
which we can then use to calculate intermediate temperatures from (3), (4),
(5). Clearly, what we have done is adding the series “thermal impedances”
1 δ 1
, and of the gas boundary layer, the metal, and the liquid.
hg k hl
σ (z)
ε = (1 − ν ) + α ⎡⎣ T ( z ) − T0 ⎤⎦ (1)
E
Write (1) for both layers. We now “assemble” them with a tight fit, but zero stresses,
at T0 , which from now on means the assembly temperature. Upon heating or cooling,
thermal stresses will arrive, even with no loading or T gradients.
ε =0 by definition at
Both layers now have the same (constant) ε
assembly
σ1 ( z )
(1 − ν1 ) E1
+ α1 ⎡⎣ T1 ( z ) − T0 ⎤⎦ = ε (2)
σ2 ( z )
(1 − ν2 ) E2
+ α2 ⎡⎣ T2 ( z ) − T0 ⎤⎦ = ε (3)
dT2
−k 2 =q (4)
dz
σ2c − σ2h
(1 − ν ) E2
= α2 ⎡⎣ Twh − Twc ⎤⎦ (5)
Twh − Twc
q = k2 (6)
t2
so that
α2 E2 t2
σ2c − σ2h = q (7)
1 − ν k2
σ1
ε = (1 − ν ) + α1 ⎣⎡ Tl − T0 ⎦⎤ , which can be combined with
E1
σ2c
ε = (1 − ν ) + α2 ⎡⎣ Twc − T0 ⎤⎦
E2
⎛σ σ ⎞
to give (1 − ν ) ⎜ 1 − 2c ⎟ = α2 Twc − α1 Tl − ( α2 − α1 ) T0 (8)
⎝ E1 E2 ⎠
q = hl ( Twc − Tl ) (9a)
q
or Twc = Tl + (9b)
hl
⎛σ σ2c ⎞ q
(1 − ν ) ⎜ E1 −
E2 ⎠
⎟ = ( α2 − α1 ) ( Tl − T0 ) + α2
hl
⎝ 1
In all of this, q is taken as a given. It can be calculated from the given Taw , Tl , plus
hg , hl and t2 , k2 :
Taw − Tl
q= (11)
1 1 t
+ + 2
hg hl k 2
Equations (7) and (10) relate σ2h , σ2c , σ1 . We need one more equation
Force balance
Since T2 ( z ) is linear in z, so will σ2 ( z ) . For force calculations, then, we can use the
mean value
σ2c + σ2h
σ2 = (12)
2
From here, we either solve for σ2h , σ2c , σ1 (given geometry, Pg , Pl , q) or, for design,
go the reverse route and decide on the geometry for assigned stresses. We will
pursue here the second approach.
Design
As noted, σ1 will be positive and high, whereas σ2h (and less so σ2c ) will be
negative, and probably high too. We then take the view that
σ1 = σ1ult,tens. S (14)
⎧⎪σ2ult,comp. S (15a)
( −σ2h ) = least of ⎨
⎪⎩σ2buckling S (15b)
1
where I = Ht32 .
12
Dividing by A = Ht2 ,
⎛ 1 ⎞
4π2E2 ⎜ Ht23 ⎟ 2
⎝ 12 ⎠ π2 ⎛ t2 ⎞
σ2buckling = σ2buckling = ⎜ ⎟ E2 (16)
l 2 (Ht2 ) 3 ⎝ l ⎠
σ1 σ2h α t2 α2 q ( α2 − α1 ) ( Tl − T0 )
− − 2 q= +
E1 E2 1 − ν k2 1 − ν hl 1−ν
E α E ⎛1 t ⎞ E2 ( α2 − α1 ) ( Tl − T0 )
( −σ2h ) = − E2 σ1 + 1 2− ν2 ⎜ + 2 ⎟q+ (17)
1 ⎝ hl k2 ⎠ 1−ν
1 t
+ 2
E2 α2E2 hl k2 ( α2 − α1 ) E2 ( Tl − T0 )
( −σ2h ) =−
E1
σ1 +
1−ν 1 1 t
( Taw − Tl ) +
1−ν
(18)
+ + 2
hg hl k2
σ1ult.
(a) Once σ1 = is fixed, −σ2h will increase with t2 , although weakly, since
S
t2 1 1
, (the Cu wall offers little thermal impedance, compared to the
k2 hg hl
two boundary layers).
(b) This ( σ2h ) (middle term in (18)) arises from the heating of layer 2 relative to
1, due to heat flowing in.
(c) The positive stress σ1 (to counter Pg mostly) relieves this tendency to
compress layer 2, and might even reverse it.
(d) The last term in (18) arising from differential expansion coefficients α2 − α1 ,
could be used as a design aid. If 2=Cu, 1=steel, α2 = 2.3 × 10−5 K −1 ,
α1 = 1.4 × 10−5 K −1 , so α2 − α1 > 0 .
Then, if −σ2h is still too high despite σ1 , we could increase T0 , if possible above Tl ,
to reduce −σ2h . This implies assembly at high temperature.
⎧⎪(18 ) ⎫⎪
We can use ⎨ ⎬ to construct a plot like Figure 3, and select a viable t2 . Once this
⎩⎪(16 ) ⎭⎪
is done, equation (7) gives σ2c , equation (12) gives σ 2 , and equation (13) gives t1 .
Some data:
Material E ( Pa )
(at 500K)
( )
d k −1 σult ( Pa )
(at 500K)
ν
Z=
(1 − ν ) σult.
( K)
o
Eα
Cu 0.95 × 1011 2.3 × 10−5 1.1 × 108 0.3 35
St. Steel 302 1.61 × 1011 1.8 × 10−5 4.6 × 108 0.3 111
Ti 1.63 × 1011 1.7 × 10−5 5.4 × 108 0.3 136
Alloy Steel 1.09 × 1011 1.4 × 10−5 5.1 × 108 0.3 234
(SAE x4130)
The last column is a “figure of merit” extracted from equation (18) to give a
preliminary rough idea of materials expansion stress. The higher Z, the higher the
∆T to reach σult. in a double strip of this material subject to differential heating ∆T .
5.1 × 108
σ1 = Pa ( alloy steel) ; E1 = 1.09 × 1011 Pa ; α1 = 1.4 × 10−5 K −1
1.5
1.1 × 108
−σ2ult,comp. = Pa ( Cu) ; E2 = 0.95 × 1011 Pa ; α2 = 2.3 × 10−5 K −1
1.5
1.303 × 10−3 + t2
−σ2h = −2.96 × 108 + 8.740 × 109 + 1.221 × 106 ( 400 − T0 ) (19)
16.30 × 10−3 + t2
COMMENTS
t2 (mm) 0 0.2
1.1 × 108
T0 = 297 K −σ2h (Pa ) 5.33 × 108 6.26 × 108 Since −σult,com = , assembling at
1.5
−σ2buckling (Pa ) 0 7.80 × 108 room T0 is not acceptable for any t2 .
t2 (mm) 0 0.2
T0 = 500 K −σ2h (Pa ) 2.81 × 10 3.78 × 108
8
Closer, but still no solution
−σ2,buckl. (Pa ) 0 7.80 × 108
With the assumed l = 4 mm , buckling is not a problem in any case, but compressive
failure is hard to avoid. It may be possible to exceed the elastic limit and go into
plastic compressive yield if ductility is high enough to ensure no rupture. But this
means no reusability.