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Inner layer retards heat flux to the heat sink. Heat sink’s T gradually rises during
firing (60-200 sec). Peak T of heat sink to remain below matl. limit. Back T of heat
sink to remain below weakening point for structure.
∂T ∂2 T ∂T ∂2 T
ρc =k 2 → =α 2
∂t ∂x ∂t ∂x
k
(α = , thermal diffusivity, m 2 / s )
ρc
we see that
x2
x2 ∼ αt , or x ∼ αt , or t ∼ .
α
δ12
So the layer 1 will “adapt” to its boundary conditions in a time t ∼ .
α1
J Kg 1
Say, c 710 and ρ 1100 3
( solid graphyte),
KgK m 2
1
so α = = 1.3 × 10−6 m2 / s .
710 × 1100
(3 × 10 )
2
−3
δ2
The layer “adapts” in t ∼ −6
= 7.0 sec (more like = 1.8 sec ).
1.3 × 10 4α
⇒ Treat front layer quasi-statically, i.e., responding instantly to changes in heat flux:
T (t) −T (t)
q (t)
wh1 wc1
k1
δ1
This also means we can lump the thermal resistances of BL and 1st layer in series:
1 1 δ
+ 1
(hg ) eff hg k1
k1
(hg )eff ∼
δ1
hg
For layer 2 (the heat sink), k2 is high (metal) and hg ( )eff is now small (thanks to 1st
layer) so, very likely,
k2
δ2
(hg )eff
W
(For instance, say Copper, k2 360 , with δ2 = 2 cm. We now have
mK
k2 W k W k
(hg )eff δ2
= 350 2 , but 2 = 36, 000 2 , so indeed, 2
mK δ2 mK δ2
(hg )eff ).
Under these conditions, the heat sink is being “trickle charged” through the high
thermal resistance of layer 1. Most likely, heat has time to redistribute internally, so
that T2 is nearly uniform across the layer. We can then write a lumped equation.
dT2 k1
ρ2c2 δ2
dt
= q = hg( )eff ( Taw − T2 ) δ1
( Taw − T2 )
t
−
T2 = Taw − ( Taw − T0 ) e τ
J
For our example, say ρ2 = 8900 Kg / m3 (Copper), c2 = 430 , δ2 = 2 cm
KgK
(60)
120 (989)
−
T2 (120 ) = 3300 − 3000 e 230 = 1520 K May need 4 cm
which is still (OK) for Copper (melts at 1360K, but no stress bearing, so can go to
~900. Also OK for steel on Carbon str member).
NOTE:
δ22
=
(0.02) 2
k2 360
→ uniform = = 9.4 × 10−5 m2 / s .
ρ2c2 8900 × 430
Consider Taw “turned on” at t=0. The B.L. has a film coefficient hg , and the first
hg k1
layer has δ1 , k1 , so that hg ( )eff =
δ
∼
δ1
. Layer 2 has thickness δ2 , and has
1 + hg 1
k1
k2 , ρ2 , σ2 , α2 . The back is insulated.
2 sin λn
where an =
λn + sin λn cos λn
(hg )eff δ2 k1 δ2
λn tan λn =
k2 k2 δ1
Graphically,
k1 δ2
For small ∆ ≡ , small λ1 , so tan λ1 λ1 , so
k 2 δ1
k1 δ2
λ12 ∆ λ1 ∆ =
k2 δ1
k /ρ c
α2 k1 δ2 2 2 2 = k1
and also a1 1 λ12 ≡τ
δ22 k δ1 2
δ2 ρ2c2 δ1δ2
2
from before
Taw − T2 ( x, t ) −
t
⎛δ −x ⎞
e τ cos ⎜ 2 λ1 ⎟
Taw − T0 ⎝ δ2 ⎠
1
For thermal protection of solid rocket nozzles read sec. 14.2 (pp. 550-563) of
Sutton-Biblarz, 7th ed., especially, pp. 556-563.
For the shuttle RSRM, the throat insert (C cloth phenolic) regresses ~ 1 inch/120 sec,
and the char depth is ~ 0.5° inch/120 s.
For application of data on slot-injected films, we need to define the initial film
thickness s, velocity uF , density ρF , or at least mass flux uF ρF .
i i i i
Assume we know the flow rates mc and mF , where mc is the “core” flow and mF the
“film” flow. We also know the fully-burnt temperatures and molecular weights
( Tc , TF ; Mc , MF ).
The areas occupied at the “fully burnt” section are not known; let them be Ac , AF .
From continuity,
i i
mc mc R
uc A c = = Tc (1)
ρc P Mc
P = Pc is common to both
Ac + AF = A (3)
We need some additional information to find uF . The two momentum equations are
(neglecting friction):
duc dP ⎫
ρcuc + = 0⎪
dx dx ⎪⎪ duc duF
⎬ ρcuc = ρFuF
⎪ dx dx
duF dP
ρFuF + = 0⎪
dx dx ⎪⎭
uF duF ρ
= c (4)
uc duc ρF
Both, ρF and ρc , have been evolving as drops evaporate and burn. We make now
the approximation of assuming their ratio to remain constant (equal to the fully-
burnt value). Then (4) integrates to
uF2 ρc uF ρc
= = (5)
u2c ρF uc ρF
i i
ρFuF AF mF ρ ρc AF mF
= i → F = i
ρcuc Ac ρc ρF Ac
mc mc
i
AF mF ρc
or = i (6)
Ac ρF
mc
ρFuF ρF
and also = (7)
ρcuc ρc
⎛ρu ⎞
This last ratio ⎜⎜ F F ⎟⎟ is called the “film cooling parameter”, MF :
⎝ ρcuc ⎠
AF = π ⎡D2 − (D − 2s ) ⎤ ⎫
2
⎢⎣ ⎥⎦ ⎪ 2
⎪ AF ⎛ D ⎞ 4s
⎬ = ⎜ ⎟ −1 (if s D)
⎪ A c ⎝ D − 2s ⎠ D
A c = π (D − 2s )
2
⎪
⎭
i
D AF D mF ρc
s = (9)
4 Ac 4 i ρF
mc
From Rosenhow & Hartnett, Chapter 17-B, we characterize film cooling by the
change it induces to the driving temperature ( Taw ) for heat flow. In the absence of a
0
film, Taw
⎛
= Tc ⎜1 + r
⎝
γ −1 2⎞
2
Mc ⎟ , and we calculate ( qw )No Film = hg Taw
⎠
0
( )
− Tw . The film
0 F F
changes Taw to Taw (lower, presumably). The lowest we could Taw to get is TF , so
we define a film cooling efficiency
0 F
Taw − Taw
η= (10)
Taw − TF
⎧⎪η = 0 F
if Taw 0
= Taw (no effect)
Limits: ⎨
F
⎪⎩η = 1 if Taw = TF (max imum effect)
F
Taw 0
= Taw 0
− η Taw (
− TF ) (11)
and then
F
qw = hg Taw(− Tw ) (12)
where x is the distance downstream of the film injection (here we assume this is
from the burn-out section), and
ρFuF s
ReF = (14)
µF
2
1.9 Pr 3
η= (15)
⎛ cp ⎞ 0.8
1 + 0.329 ⎜ c ⎟ζ
⎜ cp ⎟
⎝ F ⎠
Example
TF 1 M ρ 0.8
Say = ; F = 0.8 → F = = 1.6 → MF = 1.6 = 1.265
Tc 2 Mc ρc 0.5
i i
mF 1 mF
= 0.1 → i =
i 9
m (0.01) mc
(0.0101)
Mc = 0.2
1
uF = 253 = 200 m / s
1.6
8.53 × 200 × s
Say µF = 2 × 10−5 Kg / m / s → ReF = −5
= 8.53 × 107 s
2 × 10
ReF = 9.37 × 105
s=
D mF
i
ρc
=
0.5
×
1 1
= 0.0110 m
(8.51 × 10 ) 4
4 i ρF 4 9 1.6
mc OR 0.0101
0.000998
0.6
µF ⎛ TF ⎞
=⎜ ⎟ = 0.50.6 = 0.660
µc ⎜⎝ Tc ⎟⎠
1
0.5
( )
−
ζ= 9.37 × 105 × 0.660 4 = 1.282
1.265 × 0.0110
0.000998
(
8.51 × 104 ) (25.74)
epc µF
= 0.8 (say, rF rc ), Pr = 0.8
c pF µc
2
1.9 × 0.8 3
η= = 1.24 → η = 1
1 + 0.329 × 0.8 × 1.2820.8 0.368 0.361
(25.74 )0.8
F Tc
Taw = TF = = 1600 K
2
(3200-0.361(3200-700)=2296 K)
If the wall is made of Cu, and is at Tw = 700K , the reduction in heat flow is