2815thermal-Management

Thermal management
for high power LEDs
M. Scheubeck / C. Rafael / H. Varga,

6.06.2014, Istanbul
Agenda
Thermal considerations for high power LEDs
1 Thermal characteristics of LEDs
2 PCB technologies and PCB layouts for OSLON SSL / Square
3 Estimation of junction temperature
4 Practical examples
High Power LED Thermal Management | 6.06.2014| Page 2

OS SSL AE | Manfred Scheubeck / Christine Rafael / Horst Varga
Energy conversion
LED* Incandescent bulb

8%
30% 19%
Visible light
IR
73%
70% Heat
Heat
Light
Light
Heat
Tj ~ 60 -120C
T ~ 3000 K
* Varies depending on LED efficacy.

Light output
decreases with higher junction temperature
Data sheet LCW CQAR.EC Effect in the design (3000K)
400
300
Luminous flux [lm]

250 lm
238 lm
200
100
TJ = 25C TJ = 85C
0
LCW CQAR.EC: 250 lm @ 700 mA

Chromaticity shift
shift to lower values with higher junction temperatures
Data Sheet LCW CQAR.EC Effect in the design
Cy
Tj = 25C
Tj = 85C
Cx

Dominant wavelength
increases with higher junction temperature
Data Sheet LA CPDP Effect in the design
TJ= 85C: Ddom = 4nm
~20% radiant power

-20%
loss at TJ=120C
~60% loss caused by
LDom displacement
0.8 * 0.4 = 0.32 32%
lum. flux at 120C
-60%
32%V@120C

Forward voltage
drops down with higher junction temperatures
Data Sheet LCW CQ7P.PC Effect in the design
LCW CQAR.EC
IF = 700mA
typ. VF = 3.05 V
TJ= 85C: DVF = -0.11 V
typ. VF (700 mA; TJ = 85C) = 2.94 V

Lifetime
v(T,t)
Higher temperatures
accelerate the degradation of an
LED
For maximum lifetime Tj should be

as low as possible!
But:
Good LEDs still have a design life
of >50 000h at Tj=100C

Example of life time testing according to LM80 (necessary
for Energy Star)
OSLON SSL LUW CQ7P

Agenda

Network of thermal resistances
Overview
TJunction
Rth JS
TSolderpoint
Rth SB
TBoard
Rth BC
TCase
Rth CA
TAmbient

Thermal resistance
Small cross-sectional area Large cross-sectional area
Q Q
thickness
Rth
area * thermal conductivity Larger area lower resistance

Thermal conductivity
Thermal conductivity of typical materials within LED-Systems
Air Aluminum
0.026 200
PC Aluminum Alloy
0.2
Housing 120 - 180
PSA MCPCB
0.2 2.2
FR4 SAC Copper
0.3 60 385
Printed Circuit Board PI Thermal Adhesive
0.2 1
Resin Germanium AlN

0.20 60 170
LED Package Premold Al2O3 Copper Alloy

0.25 10 - 25 280 - 350
0.01 0.1 1 10 100 1000

Thermal conductivity [Wm-1K-1]

PCBs: Base materials
Isolated Metal Sheet (IMS)
Info Thermal simulation
Pro: - high thermal conductivity

- widely used
Con: - high thermal expansion
Dielectric: 2W/mK
100m
The thermal performance is strongly Rth S-B = 6 K/W
influenced by the used dielectric!
Dielectrics diversify in thickness from 35m
to more than 150m and in thermal
conductivity from 0,3W/mK to 10W/mK.
Typical thermal conductivity is about Dielectric: 4W/mK 35 m
1W/mK to 2W/mK Rth S-B = 2,5 K/W

Ceramic PCB
Pro: - electrically isolating

- good thermal conductivity
- matched thermal expansion to
ceramic LED
Con: - brittle
- expensive Al2O3: Rth S-B = 3,6 K/W
No dielectric necessary! Circuit path is

directly attached to the ceramic.
Commonly used ceramics:
Al2O3, ~20W/mK,
AlN, ~180W/mK,
AlN: Rth S-B = 0,9 K/W

FR4
Pro: - electrically isolating

- widely-used
- cost-effective
-electrical & thermal vias
Con: - very bad thermal conductivity
Rth S-B = ~ 42K/W

FR4 thermal improvements by layout (0,8mm FR4)
35m copper layer 35m copper layer 70m copper layer
Rth S-B = 42 K/W Rth S-B = 37 K/W Rth S-B = 31 K/W

FR4 thermal optimization

effective thermal conductivity
Thermal Vias (0,8mm FR4 board, 25m Cu plating in vias)
140,0
120,0 via diameter
thermal conductivity [W/mK]

0,1mm
100,0 0,2mm
0,3mm
80,0 0,4mm
0,5mm
60,0 0,7mm
1,0mm
40,0
20,0
The effective vertical -

thermal conductivity is - 0,2 0,4 0,6 0,8 1,0
influenced by density and via pitch [mm]
diameter of the thermal
vias!

FR4 thermal improvements
Variants with thermal vias (300m, pitch 700m, 25m plating, 0,8mm FR4)
35m
35m 35m
35m
70m 70m

FR4 thermal improvements
Variants with capped thermal vias (300m, pitch 700m 25m plating)
70m 70m
35m
35m 70m
Capped vias:
filled with epoxy
(complex and expensive)
Rth S-B = 14 K/W Rth S-B = 8 K/W

PCB: Base Materials
Overview
Base Material Pro Con Rth- Range

FR4 Widely-used Low thermal conductivity 20 .. 50 K/W
Cost effective Thermal improvement adds costs 5 .. 20 K/W
Aluminium IMS Widely-used High thermal expansion 2 .. 15 K/W
High thermal conductivity Costs
Copper IMS Very high thermal conductivity High costs 1 .. 10 K/W
Thermal expansion
Aluminium oxide Electrical isolating, thermal expansion High costs 3 .. 5 K/W
ceramic (Al2O3) matched to ceramic LEDs Brittl
Aluminium nitride High thermal conductivity, electrical Very high costs 1 .. 2 K/W
ceramic (AlN) isolation, thermal expansion matched Brittl
to ceramic LEDs
Flexboard Flexible Bending could be dangerous to 20 .. 30 K/W
(similar to FR4) solder joint
Referenzlayout: OSLON SSL

PCB base materials: Comparison in price
5,00
4,50
4,00
3,50
Price index
3,00
2,50
2,00
1,50
1,00
0,50
0,00
FR4 IMS IMS IMS 3W/mK Al2O3 AlN
0,9W/mK 1,3W/mK
PCB material

Heatsink
Rth =16,3 K/W
Rth =19,5 K/W
Rth =15 K/W

Rth =17,3 K/W

Agenda

Definition of Rth
~30%
Important for high power LEDs:
Consideration of radiated power Pel Light e
Q
~70%
Real thermal resistance Electrical thermal resistance
T1 T2 T1 T2
RthP1P2 real RthP1P2 el
Pel e Pel
RthJS-real OSLON SSL ~ 10 K/W RthJS-el OSLON SSL ~ 6..7,5 K/W

Estimating the junction temperature
T junction Q Rth _ real Ts Q Pel e
Tjunction Pel Rth _ el Ts

Measuring Ts of an OSLON LED
location for Ts measurement

OSLON with glued thermocouple (TC)

Ts measurement with IR camera
TC measurement: 28,7C
IR camera measurement: 28,9C
(at cross, (e = 0,9))
In the flat
region(green)
the temperature
of the silicone is
equivalent to Ts
Flir i60

Accesories
As thermocouple we use Omega 5TC-TT-KI-36-

0,13mm wire diameter
http://www.omega.com/pptst/5TC.html
As adhesive we use Arctic Silver Thermal Adhesive:

http://www.arcticsilver.com/arctic_silver_thermal_adhesive.htm

Agenda

Temperature compensation for Brilliant Mix
Visual Impression of CCT

t = 0 min
Visible Visible Visible

Color Color Color
shift shift shift
Visual Impression of CCT

t = 30 min
Brilliant Mix WITHOUT Brilliant Mix WITH Phosphor only

Temperature Compensation Temperature Compensation Warm White LED
Compared to a single phosphor warm white LED the Brillitant Mix without
temperature compensation has a significant and visible change in CCT!
Brilliant Mix basics
Mixing of EQ White and amber LEDs enables warm white light sources.
MW
0,510
EQ White Groups
MU
MV (operating temperatures)
MS MT
MQ
MR
0,460
MN E. g. Target Color
MP
Point at 2700 K
ML MM Warm-white
MJ MK
Cy
MH MI 2700K
0,410
MF MG 3000K
3500K
MD ME
MB MC
4000K Amber
LED
MA
0,360 M9
M8
0,310
0,300
0,350
0,400
0,450
0,500
0,550
0,600
0,650
Cx

Main reasons for color shifts (Lum. flux ratio)
Different LED technology and behavior
InGaN / UX3 InGaAlP

Brilliant Mix simulation and design in SPICE
Without Temp. Comp.
With Temp. Comp.
High Power LED Thermal Management | 6.06.2014| Page 35 Temperature in Volt C

Brilliant Mix simulation and design in SPICE
CIE x
w/o Temp. Comp.
CIE y
CIE x
With Temp. Comp.
CIE y
High Power LED Thermal Management | 6.06.2014| Page 36 Temperature in Volt C

CCT shift (Monte Carlo Analysis)
Tolerances
Resistors: 5 %
NTC: 3%
v LED: 5%
With temperature compensation
Without temperature compensation

Color shift over time
Due to the temperature compensation circuitry, the CCT shift versus
temperature is significantly lower and in the same range like for white
LEDs!
CCT Variation of Bulb Retrofit
3000
2950
2900
2850
2800
2750
2700
2650
2600
2550
CCT in K
2500
2450
2400
2350
2300
2250
2200
Brilliant Mix with Temperature Compensation
2150
2100 Brilliant Mix without Temperature Compensation
2050 LCW CQDP.EC 6T
2000
0 200 400 600 800 1000 1200 1400 1600 1800 2000
Time in s

A) Temperature compensation for Brilliant Mix
Luminous flux versus time
The drop in luminous flux of a temperature compensated brilliant mix

setup is similar to a white LED
Flux Variation of Bulb Retrofit
100%
95%
90%
85%
Relative Luminous Flux in %
80%
75%
70%
65%
60% Brilliant Mix with Temperature Compensation

Brilliant Mix without Temperature Compensation
55% LCW CQDP.EC 6T
50%
0 200 400 600 800 1000 1200 1400 1600 1800 2000
Time in s


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Thermal management

for high power LEDs

M. Scheubeck / C. Rafael / H. Varga,

Thermal considerations for high power LEDs

1 Thermal characteristics of LEDs

2 PCB technologies and PCB layouts for OSLON SSL / Square

3 Estimation of junction temperature

High Power LED Thermal Management | 6.06.2014| Page 2

LED* Incandescent bulb

* Varies depending on LED efficacy.

High Power LED Thermal Management | 6.06.2014| Page 3

Data sheet LCW CQAR.EC Effect in the design (3000K)

Luminous flux [lm]

High Power LED Thermal Management | 6.06.2014| Page 4

Data Sheet LCW CQAR.EC Effect in the design

High Power LED Thermal Management | 6.06.2014| Page 5

Data Sheet LA CPDP Effect in the design

TJ= 85C: Ddom = 4nm

~20% radiant power

High Power LED Thermal Management | 6.06.2014| Page 6

Data Sheet LCW CQ7P.PC Effect in the design

TJ= 85C: DVF = -0.11 V

typ. VF (700 mA; TJ = 85C) = 2.94 V

High Power LED Thermal Management | 6.06.2014| Page 7

For maximum lifetime Tj should be

High Power LED Thermal Management | 6.06.2014| Page 8

OSLON SSL LUW CQ7P

High Power LED Thermal Management | 6.06.2014| Page 9

Thermal considerations for high power LEDs

1 Thermal characteristics of LEDs

2 PCB technologies and PCB layouts for OSLON SSL / Square

3 Estimation of junction temperature

High Power LED Thermal Management | 6.06.2014| Page 10

High Power LED Thermal Management | 6.06.2014| Page 11

High Power LED Thermal Management | 6.06.2014| Page 12

Resin Germanium AlN

LED Package Premold Al2O3 Copper Alloy

0.01 0.1 1 10 100 1000

High Power LED Thermal Management | 6.06.2014| Page 13

Info Thermal simulation

Pro: - high thermal conductivity

High Power LED Thermal Management | 6.06.2014| Page 14

Info Thermal simulation

Pro: - electrically isolating

No dielectric necessary! Circuit path is

High Power LED Thermal Management | 6.06.2014| Page 15

Info Thermal simulation

Pro: - electrically isolating

Con: - very bad thermal conductivity

Rth S-B = ~ 42K/W

High Power LED Thermal Management | 6.06.2014| Page 16

FR4 thermal improvements by layout (0,8mm FR4)

35m copper layer 35m copper layer 70m copper layer

Rth S-B = 42 K/W Rth S-B = 37 K/W Rth S-B = 31 K/W

High Power LED Thermal Management | 6.06.2014| Page 17

FR4 thermal optimization

120,0 via diameter

thermal conductivity [W/mK]

The effective vertical -

High Power LED Thermal Management | 6.06.2014| Page 18

Rth S-B = 42 K/W Rth S-B = 29 K/W Rth S-B = 26 K/W

Rth S-B = 25 K/W Rth S-B = 17 K/W Rth S-B = 8 K/W

High Power LED Thermal Management | 6.06.2014| Page 19