RAKSHA MANTRALAYA

MINISTRY OF DEFENCE

JOINT SERVICES SPECIFICATION

ON

GENERAL REQUIREMENTS FOR PRINTED WIRING BOARDS

JSS 52300: 1992

(Revision No. 1)
Reaffirmed 2003

MANAKIKARAN NIDESHALAYA
RAKSHA UTPADAN TATHA POORTI VIBHAG
RAKSHA MANTRALAYA, 'H' BLOCK, NIRMAN BHAWAN PO
NEW DELHI - 110 011

DIRECTORATE OF STANDARDISATION
DEPARTMENT OF PRODUCTION & SUPPLIES
MINISTRY OF DEFENCE, 'H'- BLOCK, NIRMAN BHAWAN PO
NEW DELHI - 110 011
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

RAKSHA MANTRALAYA
MINISTRY OF DEFENCE

JOINT SERVICES SPECIFICATION

ON

GENERAL REQUIREMENTS FOR PRINTED WIRING BOARDS

MANAKIKARAN NIDESHALAYA
RAKSHA UTPADAN TATHA POORTI VIBHAG
RAKSHA MANTRALAYA, 'H' BLOCK, NIRMAN BHAWAN PO
NEW DELHI - 110 011

DIRECTORATE OF STANDARDISATION
DEPARTMENT OF PRODUCTION & SUPPLIES
MINISTRY OF DEFENCE, 'H'- BLOCK, NIRMAN BHAWAN PO
NEW DELHI - 110 011

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RECORD OF AMENDMENTS

Amendment Amendment Amended by

Signature
pertains to: Sl.No./
Authority Name & Appointment &
No. Date Para No./ Column Date
No. (IN BLOCK LETTERS)

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CONTENTS

S.No. Page
No.

0. FOREWORD 1

1. SCOPE 2

2. RELATED SPECIFICATIONS AND DOCUMENTS 2

3. INFORMATION TO BE SUPPLIED BY PURCHASER 3

4. ILLUSTRATIONS AND DRAWINGS 3

5. PATENTS 4

6. DEFINITIONS 4

7. MATERIALS, PROCESSES AND FINISHES 27

8. MARKING 27

9. PACKAGING 28

10. QUALIFICATION APPROVAL AND MAINTENANCE OF 28

QUALIFICATION APPROVAL PROCEDURE

11. BATCH ACCEPTANCE PROCEDURE 28

12. TEST PROCEDURE 29

13. TEST DETAILS 30

14. SUGGESTION FOR IMPROVEMENT 45

APPENDIX A 46

APPENDIX B 54

FIGURES 56

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0. FOREWORD

0.1 This specification has been prepared by Electronic Components

Standardisation Organisation (LCSO) on behalf of Electronic Standardisation Sub
Committee on the authority of Standardisation Committee, Ministry Of Defence.

0.2 This specification has been approved by the Ministry of Defence and is
mandatory for use by the Defence Services.

0.3 This JSS would be used for design, manufacture, quality assurance and
procurement of the item.

0.4 This JSS supersedes JSS 52300: 1975.

0.5 Quality Assurance Authority for the item covered by this Specification is
CQA (L) for Army, DRAN for /Navy and DGAQA for Air Force. Enquiries regarding
this specification relating to airy contractual conditions should be addressed to the
Quality Assurance Authority named in the tender or contract. Other technical enquiries
should be referred to: -

The Officer-in-Charge
LCSO
DRDO Complex
C.V. Raman Nagar,
Bangalore-560 093

0.6 Copies of this specification can be obtained on pay-

The Controller
Controllerate of Quality Assurance (Electronics)
Jayachamrajendra Nagar PO
Bangalore -560 006

0.6 This specification holds good only for the supply order for which it is issued.

0.7 This specification holds good only for the supply order for which it is issued.

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1. SCOPE

1.1 This specification relates to the detailed requirements for printed wiring
boards, plated through hole consisting of 4 to 10 layers of conductor patterns on
insulating bases separated one from the other by an insulating material and
interconnected by a continuous metallic interlayer connection. It is to be used in
conjunction with JSS 52300 - General requirements for printed wiring boards.

1.2 For the purpose of interpretation or construction in case of any omissions,

conflicts, ambiguities or inconsistencies to the extent the contract consists of any or all of
the following documents, such documents shall rank in the following order of
precedence.

(a) Detailed specifications

(b) This specification and

(c) Other applicable documents

2. RELATED SPECIFICATIONS AND DOCUMENTS

2.1 Joint Services Specifications

JSS 50101: 1996 - Environmental test methods for Service

(Revision No. 1) electronic components.
Reaffirmed 2001
JSS 50102: 1985 - General specification and procedure for
Reaffirmed 2000 the qualification approval and
acceptance of electronic components.
JSS 52301: 1993 - Detailed specification for printed
(Revision No. 1) wiring boards, single and double-sided.
Reaffirmed 1999
JSS 52302: 1994 - Detailed specification for printed
(Revision No. 1) wiring board, multi-layer.
Reaffirmed 1999
JSS 51701: 1975 Detailed specification for metal-clad
Reaffirmed 1999 base material (for printed wiring boards
of thickness 0.8 mm or greater)

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JSS 51702: 1975 - Detailed specification for metal-clad

Reaffirmed 1999 base material (for printed wiring boards
primarily for multi layer) of thickness
less than 0.8 mm

2.2 Other Specifications

IS 9938: 1981 Recommended colours for PVC

Reaffirmed 1999 insulation for wires and cables
IS 10673: 1983 Sampling plans and procedures for
Reaffirmed 1996 inspection by attributes for electronic
items.

2.3 Source of Supplies

2.3.1 Copy of the Joint Services Specifications are obtainable on payment from:-

The Controller
Controllerate of Quality Assurance (Electronics)
JayachamraJendra Nagar PO,
Bangalore - 560 006

2.3.2 Copies of Indian Standard are obtainable on payment from :-

Bureau of Indian Standards,

Manak Bhavan
9, Bahadur Shah Zafar Marg
New Delhi = 110 002
Or
their regional/branch offices.

3. INFORMATION TO BE SUPPLIED BY THE PURCHASER

3.1 As given in the relevant details specifications.

4. ILLUSTRATIONS AND DRAWINGS

4.1 Dimensions - Dimensions are in millimetres .

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4.2 Drawings - where drawings are quoted, they are mandatory. Copies of the
drawings are obtainable from Officer-in-Charge, LCSO, DRDO Complex, CV Raman
Nagar, Bangalore-560 093.

5. PATENTS

5.1 Patents or design rights or copy-rights may subsist in connection with the
items defined as standards and the issue of this specification does not convey or imply
any licence to use information which is the subject of such rights.

6. DEFINITIONS

6.1 Access Holes - A series in successive layers, each set having a common centre
or axis. These holes in a multiplayer printed board provide access to the surface of the
land in one of the layers of the board. (See figure 1)

6.2 Activating - A treatment that renders non-conductive material receptive to

electroless deposition. (Non-preferred synonyms: "Seeding", "Catalyzing" and
"Sensitizing")

6.3 Additive Process - A process for obtaining conductive patterns by the

selective deposition of conductive material on the unclad base material. (see also: "Semi-
Additive Process" and "Fully-Additive Process")

6.4 Adhesion Promotion - The chemical process of preparing a plastic surface to

provide for a uniform, well-bonded metallic overplate.

6.5 Anchoring Spurs - Extensions of lands on flexible printed wiring extending

beneath the cover layer to assist in holding the lands to the base material.

6.6 Annular Ring - That portion of conductive material completely surrounding a

hole.

6.7 Arc Resistance - The resistance of a material by the effects of a high voltage,
low current arc (under prescribed conditions) passing across the surface of the material.
The resistance is stated as a measure of total elapsed time required to form a conductive
path on the surface (material carbonized by the arc).

6.8 Artwork - An accurately scaled configuration which is used to produce the

Artwork Master or Production Waster.

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6.9 Artwork Waster - An accurately-scaled (usually 1:1) pattern which is used to

produce the Production Waster.

6.10 Backplane - An interconnection device having terminals (such as solderless

wrapped connections) on one side and usually having connector receptacles on the other
side, used to provide point-to-point electrical interconnections. The point-to-point
electrical interconnections may be printed wiring. (See also "mother board")

6.11 Base Material - The insulating material upon which the conductor pattern may
be formed. The base material may be rigid or flexible. It may be a dielectric sheet or
insulated metal sheet.

6.12 Base Material Thickness - The thickness of the base material excluding metal
foil or material deposited on the surface.

6.13 Basic Dimension - A numerical value used to describe the theoretical exact
location of a feature or hole. It is the basis from which permissible variations are
established by tolerances on other dimension, in notes or by feature control symbols.

6.14 Bellow Contact - A connector contact which is a flat spring folded to provide
a uniform spring rate over the full tolerance range of the mating unit,

6.15 Bent Lead - A lead that is bent either at an approximate 45 degree angle or
when used with offset lands is formed to be in direct contact with the land.

6.16 Bifurcated Contact - A connector contact (usually a flat spring) which is

slotted lengthwise to provide additional, independently operated points of contact.

6.17 Blank - An unprocessed or partially processed piece of base material or metal-

clad base material cut from a sheet or panel and having the rough dimensions of a printed
board.

6.18 Bleeding - A condition in which a plated hole discharges process material or

solution from crevices or voids.

6.19 Blister - A localized swelling and separation between any of the layers of a
laminated base material or between base material and conductive foil (It is a form of
delamination).

6.20 Board Thickness - The thickness of the metal-clad base material including
conductive layer or layers. (May include additional platings and coatings depending upon
when the measurement is made).

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6.21 Bond Layer - An adhesive layer used in bonding together other discrete layers
of a multilayer printed board during laminations.

6.22 Bond Strength - The force per unit area required to separate two adjacent
layers of a board by a force perpendicular to the board surface. (See also: "Peel
Strength")

6.23 Bow - The deviation from flatness of a board characterized by a roughly

cylindrical or spherical curvature such that if the board is rectangular, its four corners are
in the same plane. (See also: "Twist")

6.24 B-staged Resin - A resin in an intermediate state of cure (The cure is normally
completed during the laminating cycle).

6.25 Bus Bar - A conduit such as a conductor on a printed board for distributing
electrical energy. (A plating Bar is a subcategory of this term)

6.26 Butter-Coat - A commonly used term to describe a higher than usual surface
resin. (See also: "Resin-rich").

6.27 Camber - The planar deflection of a flat cable or flexible laminate from a
straight line of specified length. (A flat cable or flexible laminate with camber is similar
to the curve of an unbanked race track)

6.28 Capacitive Coupling - The electrical interaction between two conductors

caused by allowances. Plated-through holes passing through internal foil planes (ground
and voltage) and thermal planes shall meet the same minimum clearance between the
plated through hole and foil or ground planes as required for spacing between internal
conductors.

6.29 Centre-to-Centre Spacing - The nominal distance between the centres of

adjacent features on any single layer of a printed board. (See also "Pitch")

6.30 Circumferential Separation - A crack (1) in the plating extending around the
entire circumference of a plated-through hole or (2) in the solder fillet around the lead
wire or (3) in the solder fillet around an eyelet or (4) at the interface between a solder
fillet and a land.

6.31 Chamfer - A broken corner to eliminate an otherwise sharp edge.

6.32 Characteristic Impedance - The ratio of voltage to current in a propagating

wave i.e. the impedance which is offered to this wave at any point of the line. (In printed

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wiring, its value depends on the width of the conductor, the distance from the conductor
to ground planets) and the dielectric constant of the media between them)

6.33 Chemical Hole Cleaning - The chemical process for cleaning conductive
surfaces exposed within a hole. (See also: "Etchback")

6.34 Clad - A condition of the base material to which a relatively thin layer or a
sheet of metal foil has been bonded to one or both of its sides e.g. a metal-clad base
material.

6.35 Clearance Hole - A hole in the conductive pattern larger than, but coaxial
with, a hole in the printed board base material.

6.36 Clinched Leads - Component leads which extend through the printed board
and are formed to effect a spring action, metal-to-metal electrical contact with the
conductive pattern prior to soldering.

6.37 Clinched-Wire Through Connection - Connection made by a wire which is

passed through a hole in a printed board and subsequently formed or clinched, in contact
with the conductive pattern on each side of the board and soldered.

6.36 Cold Solder Joint - Solder connection exhibiting poor wetting and a grayish,
porous appearance due to insufficient heat, inadequate cleaning prior to soldering or due
to excessive impurities in the solder solution.

6.39 Component Density - The quantity of components on a printed board per unit
area.

6.40 Component Lead - The solid or stranded wire or formed conductor that
extends from a component and service as a mechanical or electrical connection or both.

6.41 Component Hole A hole used for the attachment and electrical connection of
component terminations including pins and wires to the printed board.

6.42 Component Side - That side of the printed board on which most of the
components will be mounted.

6.43 Conductive Foil - A thin sheet of metal that may cover one or both sides of the
base material. (Includes conductor, lands and through connections when these
connections are an integral part of the manufacturing process)

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6.44 Conductive Pattern - The configuration or design of the conductive material

on the base material. (Includes conductors, lands and through connections when these
connections are an integral part of the manufacturing process)

6.45 Conductor - A single conductive path in a conductive pattern.

6.46 Conductor Base Width - The conductor width at the plane of the surface of the
base material. (See also: "Conductor Width" and "Design Width of Conductor")

6.47 Conductor Layer - The total conductive pattern formed upon one side of a
single layer of base material.

6.48 Conductor Layer No.l - The first layer having a conductive pattern, of a
multilayer printed board, on or adjacent to the component side.

6.49 Conductor Side - The side in a single sided printed board containing the
conductive pattern.

6.50 Conductor Spacing - The distance between adjacent edges (not center line to
center line) of isolated conductive patterns in a conductor layer.

6.51 Conductor Thickness - The thickness of the conductor including all metallic
coatings. (It excludes non-conductive protective coating)

6.52 Conductor Width - The observable width of a conductor at any point chosen at
random on the printed board, normally viewed from vertically above unless otherwise
specified. (Imperfections for example nicks, pinholes or scratches allowable by the
relevant specification shall be ignored. (See also a "Design Width of Conductor" and
"Conductor Base Width")

6.53 Conductor to Hole Spacing - The distance between the edge of a conductor
and the edge of a supported or unsupported hole.

6.54 Conformal Coating - An insulating protective coating, which conforms to the

configuration of the object coated, applied o the completed board assembly.

6.55 Connector Area - That portion of printed wiring used or the purpose of
providing external electrical connections.

6.56 Contact Area - The common area between a conductor and connector through
which the flow of electricity takes place.

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6.57 Contact Resistance - The electrical resistance of the metallic surfaces at their
interface in the contact area under specified conditions.

6.58 Contact Spacing - The distance between the centerlines of adjacent contact
areas.

6.59 Continuity - An uninterrupted path for the flow of electrical current in a

circuit.

6.60 Corner Mark (Crop Mark) - The mark at the corners of a printed board
artwork, the inside edges of which usually locate the borders and establish the contour of
the board.

6.61 Cover Lay, Cover Layer, Cover Coat - An outer layer(s) of insulating material
applied over the conductive pattern on the surface of the printed board.

6.62 Cracking - A condition consisting of breaks in metallic or non-metallic

coatings or both that extend through to an underlying surface.

6.63 Crazing - An internal condition occurring in the laminated base material in

which the glass fibres are separated from the resin at the weave intersections. This
condition manifests itself in the form of connected white spots or "crosses below the
surface and the base material and is usually related to mechanically induced stress.

6.64 Crazing (Conformal Coating) - A network of fine cracks on the surface or

within the conformal coating.

6.65 Crosshatching - The breaking of large conductive areas by the use of a pattern
of voids in the conductive material.

6.66 Crosstalk - The undesirable interface caused by the coupling of energy

between signal paths.

6.67 Current-carrying Capacity - The maximum current which can be carried

continuously, under specified conditions, by a conductor without causing objectionable
degradation of electrical or mechanical properties of the printed board.

6.68 Datum Reference - A defined point, line or plane used to locate the pattern or
layer for manufacturing, inspection or for both purposes.

6.69 Delamination - A separation between plies within the base material or

between the base material and the conductive foil or both.

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6.70 Dent - A smooth depression in the conductive foil which does not
significantly decrease foil thickness.

6.71 Design Midth of Conductor - The width of a conductor as delineated or noted

on the master drawing.

6.72 Device - an individual electrical element, usually in an independent body,

which cannot be further reduced without destroying its stated function.

6.73 Dewetting - A condition which results when molten solder has coated a
surface and then receded leaving irregularly shaped mounds of solder separated by areas
covered with a thin solder film, base metal is not exposed.

6.74 Dielectric Breakdown - A complete failure of a dielectric material

characterized by a disruptive electrical discharge through the material due to a sudden
and large increase in voltage.

6.75 Dielectric Constant - The ratio of the capacitance (C) of a given configuration
of electrodes with a specified dielectric to the capacitance <C) of the same electrode
configuration with a vacuum or air as the dielectric.

6.76 Dielectric Strength - The maximum voltage that a dielectric can withstand,
under specified conditions, without resulting in a voltage breakdown, (usually expressed
as volts/unit dimension)

6.77 Digitizing - Any method of reducing feature locations on a flat plane to give
digital representation of X-Y coordinates.

6.78 Dimensional Stability - A measure of dimensional change caused by such

factors as temperature, humidity, chemical treatment, age or stress (usually expressed as
(units/unit).

6.79 Dimensioned Hole - A hole in a printed board where the means of

determining location is by co-ordinate values not necessarily coinciding with the stated
grid.

6.80 Dip Soldering - A process whereby printed boards with attached components
are brought in contact with the surface of a static pool of molten solder for the purpose
of soldering the entire exposed conductive pattern and component leads in one operation.

6.81 Dissipation Factor - The Dissipation Factor is proportional to the power loss
per cycle (f) per potential gradient (E) squared per unit volume as follows :

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Diss. Fac. = power loss

-----------------------------
E x f x volume x constant

6.82 Double-Sided Board - A printed board with a conductive pattern on both

sides.

6.83 Drag Soldering - A process whereby supported moving printed circuit

assemblies or printed wiring assemblies are brought in contact with the surface of a static
pool of molten solder.

6.84 Dross - Oxide and other contaminants which form on the surface of molten
solder.

6.85 Dual In-Line Package (DIP) - A component which terminates in two straight
tows of pins or lead wires.

6.86 Edge-Board Connector - A connector designed specifically for making

removable and reliable interconnections between the edge board contacts on the edge or a
printed board and external wiring.

6.87 Edge-Board Contacts - A series of contacts printed on or near any edge of a

printed board and intended for mating with an edge-board connector.

6.88 Edge Definition - The fidelity of reproduction of a pattern edge relative to the
production master.

6.89 Edge Spacing - The distance of a pattern, components or both from the edges
of the printed board.

6.90 E Glass - A low alkali lime alumina borosilicate glass, noted for its good
electrical properties. (It has the following chemical formulation in percentage by mass.
B2O3 5-10%, CaO 16-25%., Al2O3 12-16%.,SiO2 52-56%, NaO2 and K2O 0-2%.,
TiO2 0-0.8%., Fe2O3 0.05-0.4%., F2 0-1.0%)

6.91 Electroless Deposition - The deposition of metal from an autocatalytic plating

solution without application of electrical current.

6.92 Electrodeposition - The deposition of a conductive material from a plating

solution with application of electrical current. (Non-preferred synonyms: "Electrolytic
deposition" and "Galvanic deposition")

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6.93 Etchant - A solution used to remove by chemical reaction, the unwanted

portion of material from a printed board.

6.94 Etchback - A process for the controlled removal of nonmetallic materials

from sidewalls of holes to a specified depth. It is used to remove resin smear and to
expose additional internal conductor surfaces.

6.95 Etch Factor - The ratio of the depth of etch (conductor thickness) to the
amount of lateral etch. (Undercut).

6.96 Etched - Etching - Printed Board - A board having a conductive pattern

farmed by the chemical removal of unwanted portions of the conductive foil.

6.97 Etching - A process wherein a printed pattern is formed by chemical, or

chemical and electrolytic removal of the unwanted portion of conductive material bonded
to a base.

6.98 Etching Indicator - A wedge shaped or other specified pattern affixed to the
conductive foil to indicate the quantity of etching.

6.99 Extraneous Copper - Unwanted copper remaining on the base material after
chemical processing.

6.100 Eyelet - A hollow tube inserted in a terminal or printed board to provide

mechanical support for component leads or electrical connection.

6.101 Fibre Exposure - A condition in which reinforced fibres within the base
material are exposed in machined, abraded or chemically - attacked areas.

6.102 Flat Cable - A cable with two or more parallel, round or flat conductors in the
same plane encapsulated by an insulating material.

6.103 Flexible Printed Circuit - A random arrangement of printed circuit and

components utilizing flexible base material with or without flexible cover layers.

6.104 Flexible Printed Miring - A random arrangement of printed wiring utilising

flexible base material with or without flexible cover layers,

6.105 Flexural Failure - A conductor failure caused by repeated flexing. It is

indicated by an increase of resistance measured for a specified time.

6.106 Flush Conductor - A conductor whose outer surface is in the same plane as the
surface of the insulating material adjacent to the conductor.
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6.107 Flux - A chemically active compound that is capable of promoting the Metting
of metals with solder.

6.108 From-to-List - Written wiring instructions in the form of a list indicating

termination points.

6.109 Fully-Additive Process (non-preferred synonym: Fully Electroless) - An

additive process wherein the entire thickness of electrically isolated conductors is built-
up by electroless metal deposition.

6.110 Fused Coating - A metallic coating (usually tin or solder alloy) which has
been melted and solidified forming a metallurgical bond to the base metal.

6.111 Fusing - The melting of a metallic coating (usually electro-deposited),

followed by solidification.

6.112 Gel Time - The time expressed in seconds, required for a resin to change its
physical state from a solid through a liquid to a solid again due to the action of thermal
input.

6.113 Glass Transition Temperature - The temperature at which an amorphous

polymer (or the amorphous regions in a partially crystalline polymer) changes from a
hard and relatively brittle condition to a viscous or rubbery condition. (This transition
generally occurs over a relatively narrow temperature range; it is not a phase transition.
In this temperature region, many physical properties undergo significant rapid changes.
Some of these properties are hardness, brittleness, thermal expansion, specific heat etc.).

6.114 Grid - An orthogonal network of two sets of parallel equidistant lines used for
locating points on a printed board,

6.115 Ground Plane - A conductor layer or portion of a conductor layer (usually a

continuous sheet of metal with suitable ground plane clearances), used as a common
reference point for circuit returns, shielding or heat sinking.

6.116 Ground Plane Clearance - Ground-plane clearance is the etched portion of a

ground plane around a plated-through or non-plated through hole that isolates the plane
from the hole.

6.117 Haloing - Mechanically induced fracturing or delaminating on or below the

surface of the base material; it is usually exhibited by a light area around holes, other
machined areas or both.

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6.118 Heat Sinking Plane - A continuous sheet of metal on or in a printed board that
functions to dissipate heat away from heat sensitive components.

6.119 Hole Breakout - A condition in which a hole is not completely surrounded by

the land.

6.120 Hole Density - The quantity of holes in a printed board per unit area.

6.121 Hole Location - The dimensional location of the center of a hole per unit area.

6.122 Hole Pattern - The arrangement of all holes in a printed board.

6.123 Hole Pull Strength - The force necessary to rupture a plated through hole
when loaded or pulled in the direction of the axis of the hole.

6.124 Hole Void - A void in the metallic deposit of a plated through hole exposing
the base material.

6.125 Immersion plating (Galvanic Displacement) - The chemical deposition of a

thin metallic coating over certain base metals by a partial displacement of the base
metals.

6.126 Inclusion - A foreign particle, metallic or non-metallic, in a conductive layer,

plating or base material.

6.127 Insulation Resistance - The electrical resistance of the insulating material

(determined under specified conditions) between any pair of contacts, conductors or
grounding devices in various combinations.

6.128 Interlayer Connection - An electrical connection between conductive patterns

in different layers of a multilayer printed board.

6.129 Internal Layer - A conductive pattern which is contained entirely within a

multilayer printed board.

6.130 Interstitial via Hole - A plated-through hole connecting two or more conductor
layers of a multilayer printed board but not extending fully through all the layers of base
material comprising the board.

6.131 lonizable Contaminants - Process residues such as flux activators, finger

prints, etching and plating salts etc. that exist as ions and when dissolved increase
electrical conductivity.

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6.132 Jumper - An electrical connection between two points on a printed board

added after the intended conductive pattern is formed.

6.133 Jumper Wire - A wire used as a Jumper.

6.134 Key - A device designed to assure that the coupling of two components can
occur in only one position.

6.135 Keying Slot - A slot in a printed board which permits the printed board to be
plugged into its matting receptacle but prevents it from being plugged into any other
receptacle.

6.136 Keyway - A general term covering both keying slot(s) and polarizing slot(s).

6.137 Laminate - A product made by bonding together two or more layers of

material.

6.136 Laminate Thickness - Thickness of the metal-clad base material, single or

double-sided, prior to any subsequent processing.

6.139 Land - A portion of a conductive pattern usually, but not exclusively, used for
the connection or attachment of components or both.

6.140 Landless Hole - A plated-through hole without a land(s).

6.141 Layer-to-Layer Spacing - The thickness of dielectric material between

adjacent layers of conductive circuitry in a multilayer printed board.

6.142 Lead Projection - The distance which a component lead protrudes through the
printed board on the side opposite from which the component is mounted.

6.143 Legend - A format of letters, numbers, symbols and patterns on the printed
board primarily used to identify component locations and orientation for convenience in
assembly and replacement operations.

6.144 Margin - The distance between the reference edge of a flat cable and the
nearest edge of the first conductor.

6.145 Marking - A method of identifying printed boards with part number, revision
letter, manufacturer's code etc.

6.146 Master Drawing - A document that shows the dimension limits or grid
locations applicable to any or all parts of a printed board (rigid or flexible) including the
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arrangement of conductive and nonconductive patterns of elements, size, type, and

location of holes and any other information necessary to describe the product to be
fabricated.

6.147 Mealing - A condition at the interface of the conformal coating and base
material; it is in the form of discrete spots or patches which reveal separation of the
conformal coating from the surface of the printed boards or from the surfaces of attached
components or from both.

6.148 Measling - An internal condition occurring in laminated base material in

which the glass fibers are separated from the resin at the weave intersection. This
condition manifests itself in the form of discrete white spots or "crosses" below the
surface of the base material and is usually related to thermally induced stress.

6.149 Metal-clad Base Material - Base material covered with foil on one or both of
its sides.

6.150 Metallization - A deposited or plated thin metallic film used for its protective
or electrical properties.

6.151 Microstrip - A type of transmission line configuration which consists of a

conductor over a parallel ground plane and separated by a dielectric.

6.152 Microsectioning - The preparation of a specimen for the microscopic

examination of the material to be examined, (usually by cutting out a cross-section
followed by encapsulation, polishing, etching, staining etc.)

6.153 Minimum annular Ring - The minimum width of metal, at the narrowest point,
between the edge of the hole and the outer edge of the land. This measurement is made
to the drilled hole on internal layers of multilayer printed boards and to the edge of the
plating on outside layers of multilayer boards and double sided boards.

6.154 Minimum Electrical Spacing - The minimum allowable distance between

adjacent conductors that is sufficient to prevent dielectric breakdown or corona or both,
between the conductors at any given voltage and altitude.

6.155 Misregistration - The lack of dimensional conformity between successively

produced features or patterns.

6.156 Module - A separable unit in a packaging scheme displaying regularity of

dimensions.

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 JSS 52300: 1992
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6. 157 Mother Board - A printed board assembly used for interconnecting arrays of
plug-in electronic modules.

6.158 Mounting Hole - A hole used for the mechanical mounting of a printed board
or for the mechanical attachment of components to the printed board.

6.159 Multilayer Printed Board - The general term for completely processed printed
circuit or printed wiring configurations consisting of alternate layers of conductive
patterns and insulating materials bonded together, with conductive patterns in more than
two layers and with the conductive patterns interconnected as required. The term
includes both flexible and rigid multilayer boards.

6.160 Multilayer Printed Board, Sequentially Laminated - A multilayer board which

is formed by laminating through-hole-plated double sided or multilayer boards together.
The circuitry layers are interconnected with interstitial via holes and through connections.

6.161 Multilayer Printed Circuit Board - A part manufactured from rigid base
material upon which a completely processed printed circuit has been formed on more
than two layers, each separated by insulating material and bonded together.

6.162 Multilayer Printed Miring Board - A part manufactured from rigid base
material upon which completely processed printed wiring has been formed on more than
two layer, each separated by insulating materials and bonded together.

6.163 Nail Heading - The flared condition of copper on the inner conductor layers
of a multilayer board caused by hole drilling.

6.164 Negative - An artwork, art workmaster or production master in which the

intended conductive pattern is transparent to light and the areas to be free from
conductive material are opaque.

6.165 Negative Etchback - Etchback in which inner conductor layer of material is

recessed relative to the surrounding base material. (See Figure 12)

6.166 Negative-acting Resist - A resist which is polymerized (hardened) by light and

which, after exposure and development, remains on the surface of a laminate in those
areas which were under the transparent parts of a production master.

6.167 Nonconductive Pattern - A configuration formed by functional nonconductive

material of a printed circuit, (e.g. dielectric, resist etc.)

6.168 Nonfunctional Land - A land on internal or external layers not connected to

the conductive pattern on its layer.
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JSS 52300: 1992
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6.169 Nonpolar Solvents - Solvents which are not ionized sufficiently to be

electrically conductive and which cannot dissolve polar compounds such as inorganic
salts but can dissolve nonpolar compounds such as hydrocarbons and resins.

6.170 Nonwetting - A condition whereby a surface has contacted molten solder but
the solder has not adhered to all of the surface and base metal remains exposed.

6.171 Offset Land - A land which is intentionally not in physical contact with its
associated component hole.

6.172 Opaquer - A material that when added to the resin systems renders a laminate
sufficiently opaque so that the yarn or weave of the reinforcing material cannot be seen
with the unaided eye using either reflected or transmitted light.

6.173 Outgassing - De-aeration or other gaseous emission from a printed board

assembly (printed board, component or connection) when exposed to a reduced pressure
or heat or both

6.174 Outgrowth - The increase in conductor width at one side of a conductor

caused by plating build-up, over that delineated on the production master.

6.175 Overhang - The sum of outgrowth and undercut. (If undercut does not occur,
the overhang is the outgrowth only)

6.176 Packaging Density - Quantity of functions (components, interconnection

devices, mechanical devices) per unit volume usually expressed in qualitative terms such
as high, medium or low.

6.177 Panel - A rectangular or square base material of predetermined size intended

for or containing one or more printed boards and when required, one or more test
coupons.

6.178 Panel Plating - The plating of the entire surface of a panel (including holes).

6.179 Pattern - The configuration of conductive and non-conductive materials on a

panel or printed board. (Pattern denotes also the circuit configuration on related tools,
drawings and masters)

6.180 Pattern Plating - The selective plating of a conductive pattern.

6.181 Peel Strength - The force per unit width required to peel the conductor or foil
from the base material.

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 JSS 52300: 1992
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6.182 Permanent Mask - A resist which is not removed after processing (e.g. plating
resist used in the fully additive process)

6.183 Photographic Reduction Dimension - Dimensions (e.g. the distance between

lines or between two specified points) on the artwork master to indicate to the
photographer the extent to which the artwork master is to be photographically reduced,
(The value of the dimension refers to the HI scale and must be specified)

6.184 Pin Density - The quantity of pins on a printed board per unit area.

6.185 Pinhole - A small hole occurring as an imperfection which penetrates entirely

through a layer of material.

6.186 Pit - A depression in the conductive layer that does not penetrate entirely
through it.

6.187 Pitch - The nominal distance from centre-to-centre of adjacent conductors.

(Where conductors are of equal size and spacing is uniform, the pitch is usually measured
from the reference edge of a conductor to the reference edge of the adjacent conductor)

6.188 Plate Finish (pertaining to laminating) - The finish present on the metallic
surface of metal-clad base material resulting from direct contact with the laminating press
plates without modification by any subsequent finishing process.

6.189 Plated Through Hole - A hole in which electrical connection is made between
internal or external conductive patterns or both, by the deposition of metal on the wall of
the hole.

6.190 Plated-Through Hole Structure Test - A visual examination of the metallic

conductors and plated-through holes of a printed board after the glass-plastic laminate has
been dissolved away.

6.191 Plating Bar - The temporary conductive path interconnecting areas of a

printed board to be electroplated, usually located on the panel outside of the borders of
such a board.

6.192 Plating Up - The process consisting of the electrochemical deposition of a

conductive material on the base material (surface holes etc.) after th6 base material has
been made conductive.

6.193 Plotting - The practice of mechanically converting X-Y positional

information into a visual pattern such as artwork.

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JSS 52300: 1992
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6.194 Polarisation - A technique of eliminating symmetry within a plane so that

parts can be engaged in only one way in order to minimize the possibility of electrical
and mechanical damage or malfunction.

6.195 Polarizing Slot - A slot at the edge of a printed board, used to assure proper
insertion and location in a mating connector.

6.196 Polar Solvents - Solvents which are ionized sufficiently to be electrically

conductive and which can dissolve polar compounds such as inorganic salts but cannot
dissolve nonpolar compounds such as hydrocarbons and resins.

6.197 Positive - An artwork, artwork master or production master in which the

intended conductive pattern is opaque to light and the areas intended to be free from
conductive material are transparent.

6.198 Positive-acting Resist - A resist which is decomposed (softened) by light and

which, after exposure and development, is removed from those areas which were under
the transparent parts of a production master.

6.199 Prepreg - Sheet material (e.g. glass fabric) impregnated with a resin cured to
an intermediate stage. (B-stage resin)

6.200 Press-fit Contact - An electrical contact which can be pressed into a hole in an
insulator, printed board (with or without plated-through holes) or a metal plate.

6.201 Printed Board - The general tern) for completely processed printed circuit or
printed wiring configurations. It includes rigid or flexible, single, double, and
multiplayer boards.

6.202 Printed Circuit - A conductive pattern comprised of printed components,

printed wiring or a combination thereof, all formed in a predetermined design and
intended to be attached to a common base. (In addition, this is a generic term used to
describe a printed board produced by any of a number of techniques)

6.203 Printed Circuit Board - A part manufactured from rigid base material upon
which a completely processed printed circuit has been formed.

6.204 Printed Component - A part such as an inductor, resistor, capacitor or

transmission line which is formed as part of the conductive pattern of the printed board.

6.205 Printed Contact - A portion of a conductive pattern formed by printing,

serving as one part of a contact system.

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 JSS 52300: 1992
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6.206 Printed Miring - The conductive pattern intended to be formed on a common

base to provide point-to-point connection of discrete components but not to contain
printed components.

6.207 Printed Wiring assembly Drawing - A document that shows the printed board
(rigid or flexible), the separately manufactured components which are to be added to the
board and any other information necessary to describe the joining of these parts to
perform a specific function.

6.208 Printed Miring Board - A part manufactured from rigid base material upon
which completely processed printed wiring has been formed.

6.209 Printed Wiring Layout - A sketch that depicts the printed wiring substrate, the
physical size and location of electronic and mechanical components and the outing of
conductors that electrically interconnect components, in sufficient detail to allow the
preparation of documentation and artwork.

6.210 Production master -A 1 to 1 scale pattern which is used to produce one or

more printed boards (rigid or flexible) within the accuracy specified on the Waster
drawing.

6.210.1 Single-Image Production Waster - A production master used in the process for
making a single printed board.

6.210.2 Multiple - Image Production Master - A production master used in the process
for making two to more printed boards simultaneously.

6.211 Reference Edge - The edge of cable or conductor from which measurements
are made (Sometimes indicated by a thread, identification stripe, or printing).
Conductors are usually identified by their sequential position from the reference edge
with number one conductor closest to this edge.

6.212 Reflow Soldering - process for Joining parts by finning the mating surfaces,
placing them together, heating until the solder fuses and allowing to cool in the joined
position.

6.213 Register Mark - symbol used as a reference point to maintain registration.

6.214 Registration - The degree of conformity of the position of a pattern or a

portion thereof, with its intended position or with that of any other conductor layer of a
board.

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JSS 52300: 1992
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6.215 Repairing - The act of restoring the functional capability of a defective part
without necessarily restoring appearance, interchangeability and uniformity.

6.216 Resin Recession - The presence of voids between the barrel of the plated-
through hole and the wall of the hole, seen in micro sections of plated-through holes in
boards that have been exposed to high temperatures.

6.217 Resin-rich - Significant thickness of non-reinforced surface-layer resin of the

same composition as that within the base material.

6.218 Resin Smear - Resin transferred from the base material onto the surface or
edge of the conductive pattern normally caused by drilling.

6.219 Resin Starved area - In area in a printed board that has an insufficient amount
of resin to wet out the reinforcement completely evidenced by low gloss, dry spots or
exposed fibres.

6.220 Resist - Coating material used to mask or to protect selected area of a pattern
from the action of an etchant, solder or plating.

6.221 Resistance Soldering - Method of soldering in which a current is passed

through and heats the soldering area by contact with one or more electrodes-

6.222 Reverse Image - The resist pattern on a printed board used to allow for the
exposure of conductive areas for subsequent plating.

6.223 Reversion - Chemical reaction in which a polymerized material degenerates at

least partially, to a lower polymeric state or the original monomer. It is usually
accompained by significant changes in physical and mechanical properties.

6.224 Reworking - The act of repeating one or more manufacturing operations for
the purpose of improving the yield of acceptable parts.

6.225 Right-angle Edge Connector - Connector which terminates conductors at the

edge of a printed board while bringing the terminations out at right angle to the plane of
the board conductors.

6.226 Roadmap - Printed pattern of non-conductive material by which the circuitry

and components are delineated on a board to aid in service and repair of the board.

6.227 Schematic Diagram - Drawing which shows, by means of graphic symbols,

the electrical connections, components and functions of a specific circuit arrangement.

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 JSS 52300: 1992
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6.228 Screen Printing (non-preferred synonym: Silk Screening) A process for

transferring an image to a surface by forcing suitable media through a stencil screen with
a squeeze.

6.229 Semi-Additive Process - An additive process for obtaining conductive patterns

which combines an electroless metal deposition on an unclad substrate with
electroplating, etching or with both,

6.230 Separable Component Part - Replaceable component part, the body of which
is not chemically bonded (excluding protective, coatings, solder and potting materials) to
the base material.

6.231 Shadowing -Condition occurring during etchback in which the dielectric

material, immediately next to the foil, is incompletely removed although acceptable
etchback may have been achieved elsewhere.

6.232 Shielding, Electronic - % physical barrier usually electrically conductive

designed to reduce the interaction of electric or magnetic fields upon devices, circuits or
portions of circuits.

6.233 Signal - An electrical impulse of a predetermined voltage, current, polarity

and pulse width.

6.234 Single Conductor - An individual conductor used to transmit an impressed

signal.

6.235 Signal Plane - A conductor layer intended to carry signals rather than serve as
a ground or other fixed voltage function.

6.236 Single Sided Board - A printed board with a conductive pattern on one side
only.

6.237 Solder Plugs - Cores of solder in the plated-through holes of a printed board.

6.238 Solder Projection - An undesirable protrusion of solder from a solidified

solder joint or coating.

6.239 Solder Side - The side of a printed board which is opposite to the component
side.

6.240 Solderability - The property of a metal to be wetted by solder.

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JSS 52300: 1992
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6.241 Soldering - The process of joining metallic surfaces with solder without
melting of the base material.

6.242 Solderless Wrap - A method of connecting a solid wire to a square,

rectangular or V-shaped terminal by tightly wrapping the wire around the terminal with a
special tool.

6.243 Span - The distance from the reference edge of the first conductor to the
reference edge of the last conductor, expressed in decimal inches or centimetres.

6.244 Stamped Printed Miring - Miring which is produced by die stamping and
which is bonded to an insulating base.

6.245 Step and Repeat - A method by which successive exposures of a single image
are made to produce a Multiple Image Production Master.

6.246 Step-Scale Step-Wedge - A series of regularly spaced tones ranging from

clear to black through intermediate shades of grey and used as a reference scale for
exposure control in photo fabrication.

6.247 Stripline - A type of transmission line configuration which consists of a

single narrow conductor parallel and equidistant to two parallel ground planes.

6.248 Subtractive Process - A process for obtaining conductive patterns by the

selective removal of unwanted portions of a conductive foil.

6.249 Supported Hole - A hole in a printed board that has its inside surface plated or
otherwise reinforced.

6.250 Surface Mounting - The electrical connection of components to the surface of

a conductive pattern without utilizing component holes.

6.251 Swaged Leads - Component lead wires which extend through the printed
board and are flattened or swaged so as to secure the component to the board during
manufacturing operations.

6.252 Taped Components - Components attached to a continuous tape for and in

automatic assembly.

6.253 Tenting - A printed board fabrication method of covering over plated-through

holes and the surrounding conductive pattern with a resist, usually dry film.

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 JSS 52300: 1992
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6.254 Test Board - A printed board suitable for determining acceptability of the
board or of a batch of boards produced with the same process so as to be representative of
the production board.

6.255 Test Coupon - A portion of a printed board or of a panel containing printed

coupons used to determine the acceptability of such a board (s).

6.256 Test Pattern - A pattern used for inspection or testing purpose.

6.257 Test Point - Special points of access to an electrical circuits used for testing
purposes.

6.258 Thermal Relief - Crosshatching to minimize blistering or warping during

soldering operations.

6.259 Thief - A racking device used in the electroplating process to provide a more
uniform current density on plated parts. ("Thieves absorb the unevenly distributed
current on irregularly shaped parts, thereby; assuring that the parts will receive an
electroplated coating of uniform thickness)

6.260 Through Connection - An electrical connection between conductive patterns

on opposite sides of an insulating base e.g. plated through hole or clinched jumper wire.

6.261 Thin Foil - A metal sheet less than 0.0178 mm thick.

6.262 Tinning - A process for the application of solder coating on component leads,
conductors and terminals to enhance solderability.

6.263 Tooling Feature - A specified physical feature on a printed board or a panel

such as a marking, hole, cut-out, notch, slot or edge used exclusively to position the
board or panel or to mount components accurately.

6.264 Tooling Holes - The general term for holes placed on a printed board or a
panel and used to aid in the manufacturing process,

6.265 Transmission Cable - Two or more transmission lines. (If the structure is flat,
it is called "flat-transmission cable" to differentiate it from a round structure such as a
jacketed ground of coaxial cables)

6.266 Transmission Line " A signal-carrying circuit composed of conductors and

dielectric material with controlled electrical characteristics used for the transmission of
high-frequency or narrow pulse type signals.

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JSS 52300: 1992
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6.267 Treatment Transfer - The transfer of copper foil treatment to the base material
as indicated by the presence of black, brown or red streaks after the copper has been
removed by etching,

6.268 Trim Lines - Lines which define the borders of a printed board.

6.269 True Position - The theoretically exact location of a feature or hole established
by basic dimension.

6.270 True Position Tolerance - The total diameter of permissible movement around
the true position as shown in the master drawing.

6.271 Twist - The deformation parallel to a diagonal of rectangular sheet such that
one of the corners is not in the plane containing the other three corners.

6.272 Undercut (in process) - The distance on one edge of a conductor measured
parallel to the board surface from the outer edge of the conductor including etch resists,
to the maximum point of indentation on the copper edge.

6.273 Undercut (after fabrication) - The distance on one edge of a conductor

measured parallel to the board surface from) the outer edge of the conductor excluding
overplating and coating, to the maximum point of indentation on the same edge.

6.274 Underwriters Symbol - Pt logotype authorised for placement on a product

which has been recognized (accepted) by Underwriters Laboratories, Inc, (UL).

6.275 Unsupported Hole - A hole containing no conductive material nor any other
type of reinforcement.

6.276 Via Hole - A plated-through hole used as a through connection, but in which
there is no intention to insert a component lead or other reinforcing material.

6.277 Void - The absence of substances in a localized area.

6.278 Voltage Plane - A conductor or portion of a conductor layer on or in a printed

board which is maintained at other than ground potential. It can also be used as a
common voltage source for heat sinking or for shielding.

6.279 Voltage-plane clearance - Voltage-plane clearance is the etched portion of a

voltage plane around a plated-through or non-plated through hole that isolates the voltage
plane from the hole.

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 JSS 52300: 1992
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6.280 Wave Soldering - A process wherein printed boards are brought in contract
with the surface of continuously flowing and circulating solder.

6.281 Meave Exposure - A surface condition of base material in which the unbroken
fibres of woven glass cloth are not complete covered by resin.

6.282 Weave Texture - A surface condition of base material in which a weave

pattern of glass cloth is apparent although the unbroken fibers of the woven cloth are
completely covered with resin.

6.283 Metting - The formation of a relatively uniform, smooth, unbroken and

adjacent film of solder to a base material.

6.284 Whisker - A slender acicular (needle shaped) metallic growth on a printed

board.

6.285 Wicking - Capillary absorption of liquid along the fibres of the base material.

7. MATERIALS, PROCESSES AND FINISHES

7.1 Where materials, processes and finishes are specified in the relevant detailed
specifications, they are mandatory, attention is drawn to the requirements in JSS 50102
that materials, processes and finishes shall not be changed significantly without prior
approval.

7.2 Workmanship, Processor and Finishes - Printed wiring boards shall be

processed in such a manner as to be uniform in quality and shall be free from dirt, oil,
corrosion, corrosive products, salts, smut, grease, finger prints, mould release agents,
foreign matter, flux residue and other defects that will affect life, serviceability or any
combination of these.

8. MARKING

8.1 Each board shall be legibly and indelibly marked with the date,
manufacturers code and serial number. The marking shall be produced either by the
same process used in producing the conductor pattern or by use of a permanent non-
nutrient ink or paint. Conductive Marking shall not be closer to the pattern than the
spacing requirement specified. All markings shall be compatible with materials and
parts, legible after all tests and in no case shall affect the board performance.

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JSS 52300: 1992
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9. PACKAGING

9.1 Printed wiring boards shall be clear dry and packed in a manner that will
afford adequate protection against corrosion, deterioration and physical damage.
Shipment Packaging (preservation, identification and picking) shall be in accordance
with the terms of the contract.

10. QUALIFICATION APPROVAL AND MAINTENANCE OF

QUALIFICATION APPROVAL PROCEDURE

10.1 Qualification Approval and Maintenance of Qualification Approval shall be

obtained as described in JSS 50102 and in the relevant detailed specification.

10.2 Provision of Samples - The manufacturer shall, submit specimens of printed

wiring boards for which approval is desired, as specified in the relevant detailed
specification.

10.3 Grouping of Specimens - The test specimens shall be grouped as indicated in

the relevant detailed specification.

10.4 Test incidence - Initial measurements referred to in Table 4 of JSS 50101 and
in this specification as Group '0', shall be carried out immediately prior to the
commencement of tests on subsequent groups and the results shall be recorded. Each test
shall be performed in the order listed and where measurements are not required, the
results shall be recorded where tests are not applicable, this will be indicated in the
relevent detailed specification.

11. BATCH ACCEPTANCE PROCEDURE

11.1 Batch acceptance shall be performed as described in JSS 50102 and in this
specification.

11.2 Inspection Batch - Unless otherwise specified in the relevant detailed

specification, an inspection batch shall be as specified in IS 10&73 and shall consist of
printed wiring boards of the same style produced under essentially the same conditions
and offered for inspection at one time. Each production board or panel of boards shall
incorporate the test coupons at specified. The location of the test coupons shall be not
closer to the edge of the panel than the edge of the printed wiring board. Test coupons
shall be used in performing Group A' inspection and all unused test coupons shall be
retained by the supplier, unless otherwise specified.

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 JSS 52300: 1992
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11.3 100 percent Acceptance Test - These tests shall be performed as described in
the relevant detailed specifications.

11.4 Sampling Tests - Tests bracketed together within a group or subgroup are
considered as a sequence and must be performed as such using the same sample.

11.4.1 Group 'A' Tests - These tests shall be performed as described in the relevant
detailed specifications.

11.4.2 Group 'B' Tests - These tests shall be performed as described in the relevant
detailed specifications.

12. TEST PROCEDURE

12.1 Atmospheric Condition for Testing - Unless otherwise specified, all tests shall
be performed under standard atmospheric conditions as defined in JSS 50101.

12.2 Accuracy of Test Equipment - The accuracy of test equipment shall be as

specified in the relevant test clauses.

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 JSS 52300: 1992
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13. TEST DETAILS

13.1 Wherever, the terms 'as specified' occurs against the 'description' or
'requirements' it indicates that details are given in the corresponding clauses of the
relevant detailed specifications.
Test Title of Test Description Requirements
Number
1 2 3 4
13.1 General
Examination
13.1.1 Visual The boards shall be examined The board shall be processed in such
Examination visually to verify that the a manner as to be uniform oil,
dimensions, machinability, repair, corrosion corrosive products salts,
marking and workmanship are in grease, finger prints, mould release
accordance with the applicable agents, foreign matter and other
requirements. Suitable light source defects that will affect life,
and magnification (approximately serviceability and appearance (See
3x) shall be employed. For also clause 7). Marking shall be in
acceptance test, reference shall be accordance with the Master Drawing
made to qualification approval and shall be made either by the same
certificate for compliance. process used in producing the
conductor pattern or with the use of
percent ink or paint. Conductive
marking shall not be closer to the
pattern than the, spacing,
requirements, given in Appendix, 'A'.
Marking shall be legible and shall in
no case affect the performance of
board (See also clause 8). The board
shall be capable of withstanding in
all directions in required machine
operation, without cracking, splitting,
delaminating or in any other way
exhibiting adverse effects.
13.1.1.1 Edge of the The edge of the Printed Wiring The burrs, nicks along the edges of
printed Wiring Boards shall be inspected to verify Printed Wiring Boards shall be
Board burrs, nicks and haloing along the acceptable provided the penetration
edges of Printed Circuit Board. does not reduce edge spacing more
than 50% of the edge spacing
specified in the Master Drawing. The
penetration shall not exceed 2.5 mm
if it is not mentioned in the Master
Drawing.
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 JSS 52300: 1992
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Test Title of Test Description Requirements

Number
1 2 3 4
13.1.1.2 Surface The features of the boards shall be Surface imperfection (such as weave
Imperfection inspected using an optical apparatus texture, haloing, scratches pits and
or aid which provides a minimum dents shall be acceptable if:
magnification of 4X. Inspection of a) The laminate fibre is not cut.
Board features shall be
accomplished at a magnification of b) The imperfection does not bridge
10X. between conductors.
c) The dielectric spacing between the
imperfection and a conductor is not
reduce below the minimum
requirements i.e. 0.13 mm for external
conductors and 0.10 mm for internal
conductors. And the minimum laternal
width of external and internal
conductors shall not be less the 0.13
mm.
13.1.1.3 Sub-surface The PWBs shall be inspected as The blistering, haloing and
Imperfection specified in clause 13.1.1.2 delamination shall be acceptable
provided:
a) Imperfection is tranclucent.
b) It does not bridge more than 25% of
the distance between conductors or
plated through holes. Not more than
one percent of the board area on each
side shall be affected.
c) Does not reduce conductor spacing
below the minimum requirements as
mentioned in clause 13.1.1.2.
d) Does not propagate as a result of
testing (such as bond strength, rework
simulation, thermal stressor thermal
shock).

13.1.1.4 Repair The PWBs shall be inspected as There shall be no evidence of repair
specified in clause 13.1.1.1 when inspected and PW shall not be
repaired.

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 JSS 52300: 1992
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Test Title of Test Description
Number
1 2 3 4
13.1.2 Dimensions and The dimensions of the board and
Materials pattern shall be checked for
conformity with the Master
Drawing. The finished Printed
Wiring Board shall meet the
dimensional requirements specified
here in an on the Master Drawing.
13.1.2.1 Annular ring The measurement of the annular ring
on external layers shall be made from
the inside surface (Within the hole)
of the plated hole to the outer edge of
the annular ring on the surface of the
board. On the internal layers, the
annular ring shall be measured from
the edge of the drilled hole to the
outer edge of the annular ring.
32
Requirements
The dimensions of the board and
pattern shall be specified on the
Master Drawing. The type of Material
shall be as given below and as
specified in the drawing:
a) For Single and Double sided
boards:
The metal clad laminates shall be in
accordance with JSS 51701.
b) For multiplayer boards: -
The metal clad laminates shall be in
accordance with JSS 51702 and of a
type specified on the relevant
Drawing. Base material shall be of
minimum 0.05 mm per sheet. Copper
cladding on external surface, shall be
at least 305 g/ m and copper cladding
on internal layers shall be at least 610
g/m.
The bonding interlayer material shall
be a pre-impregnated glass cloth.
There shall be a minimum of 0.1 mm
of dielectric material between
conductive layers of Copper in the
finished board.
The annular ring shall be in
accordance with the following for the
layer(s) indicated.
External. The minimum annular ring
for an unsupported hole shall be 0.38
mm. The minimum annular ring for a
plated through hole shall be 0.13mm.

Test Title of Test Description
Number
1 2 3 4
13.1.2.2 Plating Inspection for plating thickness
Thickness (conductor pattern) shall be carried
out as specified in clause 13.1.1.
Microsection inspection as
mentioned in Appendix B with a
magnification of 100X, shall be
carried out. Plating measurements
in the reported as the average of
three determinations per each side
of the hole. Isolated thick or thin
sections shall not be used for
averaging. However, isolated areas
of reduced Copper thickness shall
be measured.
13.1.2.3 Dielectric layer The dielectric layer thickness of the
board shall be inspected using an
optical apparatus or aid which
provides a minimum magnification
of approximately 3x.
13.1.2.4 Under cutting The undercutting at the edge shall
(For external be inspected by the method of
conductors microsection inspection mentioned
only) in the Appendix 'B'.
33
JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003
Requirements
Internal. The minimum annular ring
for internal terminal area on multi
layer boards shall be 0.05 mm.
The plating and coating thickness
shall conform to the requirement
specified herein:-
Plating Material:
Surface and through hole plating
thickness. (see also 13.5)
Electroless. Sufficient for subsequent
electro deposition.
Electrolytic. 0.03 mm (min.).
Gold - 0.00125mm (min.)
Nickel - 0.005 mm (min.)
Tin-Lead - 0.008 mm (min) at
the surface as
plated.
Solder - 0.008 mm (min.)
coating at the crest on the
surface as coated.
The minimum dielectric thickness for
printed Wiring Boards shall be as
defined on the Master Drawing.
Under cutting at each edge of the
conductors shall not exceed the total
thickness of clad and plated Copper.
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

Test Title of Test Description Requirements

Number
1 2 3 4
13.2 Conductor (a) The conductor pattern shall be
Pattern examined using an optical apparatus
(External or aid which pro vides a signification
layers) of approximately 3x minimum.
(b) Conductor overhang: - The
extent of overhang on conductors
plated with gold, shall be determined
by measuring the conductor width
before and after mechanically
removing the overhang metal.
The procedure for removing gold
overhang metal, for this test shall be
as follows:-
Wet the board in tap water at
approximately room temperature.

While Wet brunch the board with a

brass wire brush to remove the
overhang metal Brush in the
direction of the functional line, using
moderate pressure.

The microsectioned specimen could

also be used alternatively to measure
the cross section of the pattern.

(c) Conductor Spacing The The conductor spacing shall be as

conductor spacing shall be inspected specified on the Master Drawing.
using an optical apparatus or aid
which provides a minimum
magnification of approximately 3x.
13.2.1 Conductor The PWBs shall be inspected in The conductor width and spacing of
Width accordance with clause 13.1.1 printed wiring boards shall meet the
minimum requirements as specified
in the Master Drawing. If nothing is
specified, it shall be in accordance
with the requirements mentioned in
(iii) in clause 13.1.1.2.
34
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

Test Title of Test Description Requirements

Number
1 2 3 4
13.2.2 Circuit Short A test voltage shall be applied The minimum resistance between
between all common portions of mutually isolated conductors shall be
each conductor pattern and all 2 Megaohms.
adjacent common portions of each
conductor pattern.

A minimum voltage 200V in the

case of manual testing is applied for
5 seconds. When automatic test
equipment is used, the minimum
applied test voltage shall be twice
the maximum rated voltage on the
boards. If maximum rated voltage
on the boards, in not specified, in
the Master Drawing, the test voltage
shall be 40 volt minimum.

13.3 Plating Plating Adhesion shall be tested as There shall be no plating particles or
Adhesion follows: - conductor patterns removed from the
board except for overhang. If
A strip of pressure sensitive overhang metal breaks off and
cellophane adhesive tape 12.7 mm adheres to the tape, it is an evident of
wide and 50 mm long shall be cut growth but not a plating adhesion
placed across the surface of the failure
conductor pattern and pressed
firmly to the conductor eliminating
air bubbles. A tab shall be left for
pulling. The tape shall be pulled
with a snap pull at an angle of
approximately 90 degree to the
board. Tape shall be applied to end
removed from three different
locations on each board tested.
Fresh tape shall be used for each
test.

13.4 Bow and Twist The board shall be placed The maximum allowable Bow and
unrestrained on a flat horizon surface Twist shall be 1.5 per cent.
with the convex surface of the panel
upward. The maximum vertical
35
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

Test Title of Test Description Requirements

Number
1 2 3 4
displacement (the vertical distance
from the horizontal surface to the
maximum height of the determined
by taking the measurement and
subtracting the thickness of the board
if it is included in the height
measurement. The vertical
displacement divided by the length
of the longest side and multiplied by
100 shall be considered the
percentage Bow and Twist.
13.5 Plated through Plated through hole examination Plating thickness shall be as in
hole shall be accomplished by 13.1.2.2. Plating shall be continuous
microsectioning using methods except for allowable plating voids.
given in Appendix 'B'.
13.5.1 Vertical The microsectioned plated through There shall be no crack, epoxy smear
holes in the vertical plane at the nodule or separation of conductor
centre of the hole shall be examined interface. The plated through hole
for quality of plating at a shall not exhibit more than three
magnificattion of 50x to 100x. plating voides, totaling not more than
Plating thickness shall be viewed 5 percent of the wall length.
independently. A minimum of the
micro section containing atleast three
holes shall be prepared for each
sample tested. Measurements shall
be reported as the average of three
determinations per hole. Isolated
thick or thin sections shall not be
used for averaging.

13.6 Layer to Layer Layer to layer registration shall be Unless otherwise specified, layer to
Registration measured at 100x after vertical layer conductor pattern misregistration
(Applicable microsectioning of two samples as shall not exceed 0.36 mm.
only for detailed in clause 13.5 and as shown
multiplayer in Fig. 18. One sample shall be
Boards) vertically cross sectioned parallel to
the board length and one vertically
cross sectioned perpendicular to the
board length. These microsections
36
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

Test Title of Test Description Requirements

Number
1 2 3 4
shall be evaluated by difference of
centre lines of all lands of all
conductor layers shifted to extreme
positions (see fig 1). All lands
(external and internal) shall be
included in the evaluation of
registration.
[
13.7 Voltage Proof The Printed Wiring boards shall be There shall be no flash over, spark
tested as follows:- over or breakdown.
The voltage shall be steadily
increased from zero to the proof
value at a rate of approximately
500V. (rms or dc) per second. Upon
completion of test, the proof voltage
shall be gradually reduced to avoid
voltage surges. When required
suitable current limiting device
shall to the value specified. The
following details shall apply

(a) Magnitude of test voltage

1000V (ac peak or dc)
(b) Duration of application 30
seconds for Qualification Approval
and 2 seconds for batch acceptance
(c) Point of application
(i) Single sided and double
sided board. Between two
adjoining conductors of the
test pattern.
(ii) Multilayer board
Between all common points of
each common portions of each
conductor patterns of each
adjacent layer.

37
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

Test Title of Test Description Requirements

Number
1 2 3 4
13.8 Insulation Unless otherwise specified, the The insulation resistance shall be 500
Resistance insulation resistance shall be Megaohms (Minimum)
measured at 100 Vdc 10 percent.
The voltage shall be applied for the
period of 1 minute 5 seconds. The
points of measurement shall be as
follows :-
(a) For Single and double sided
boards between two adjoining
conductors of the test pattern.
(b) For Multilayer boards between
conductor pattern of each layer and
the electrically insulated pattern of
each adjacent layer.
13.9 Continuity A current of 1A shall be passed There shall be no open circuit in the
through each conductor or group of specimen The temperature rise shall
interconnected on the terminals at be not greater than 10 deg C over
each end of the conductor or group ambient temperature.
of conductors. The current rating
can also be determined from the fig.
19a and 19b. The current shall not
exceed than that specified for the
smallest conductor in the circuit.
13.10 Solderability The test pattern shall be tested in For Single sided boards the specimens
accordance with JSS 50101 test shall exhibit proper wetting of the
number 19 procedure 2 big size A, surface and there shall be no
unless otherwise specified but at separation or other forms of
260 to 280 deg C. degradation of the conductive
patterns. The wetting of the wall of
the plated through hole and the
associated land the wetting shall be
completed within first two seconds.
For double sided (with PTH) and
multilayer board, the specimens shall
exhibit proper wetting of the wall of
the plated through hole and the
associated land the wetting shall be
completed within first two seconds.
38
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

Test Title of Test Description Requirements

Number
1 2 3 4
13.11 Pull off strength Three holes per coupon shall be The specimens shall with stand a force
tested. Insert wires in holes in m a of 22.25N or tensile pull of 345N/cm
selected terminal area and solder by whichever is less. A plated shall not
hand. The wires shall not be be loosened. A conductor or terminal
clinched. Subject wires to five cycles area around an unsupported hole shall
of unsoldering and soldering by hand not be loosened.
after the initial hand soldering.
During the five cycles, the wires
shall be completely removed during
each unsoldering operation and
replaced during each soldering
operation. A 60W conventional
soldering iron with a tip temperature
of 232 to 260C (Max) shall be used
for the unsoldering and soldering
operation. The iron shall be applied
to the leads and not to the foil and
shall be applied only as long as it is
necessary to performs the
unsoldering or soldering operation.
Following the fifth cycle the printed
wiring board shall be clamped to the
jaws of bond tester. A pull at the rate
of 50.8 mm/minute shall be applied
to the wire (on the terminal area side
in the case of unsupported hole)

The pull shall be applied until the

specified load of 22.25 N is
reached. The tensile pull shall be
calculated using the formula.

4L
--------------------- > or = 345N/cm2
n (d22 d22)

Where L = load in N
d1 = diameter of the hole
d2 = terminal area diameter

39
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

Test Title of Test Description Requirements

Number
1 2 3 4
The load shall be applied
perpendicular to the major surface of
the terminal area until the required
force is reached of failure occurs.
Breaking of a wires pull out shall not
be considered as a failure but the
wire shall be resoldered and pulled
again.
13.12 Temperature As in JSS 50501 test number 20
cycling procedure 1 at the maximum and
(Thermal minimum temperature specified
shock) below. The transfer time shall be 5
minutes for single or double sided
boards, 2 minutes for single or
double sided boards and 2 minutes
maximum for multi layer boards.

Type Px of JSS 51701 : T65/205

Type GB, GH, GP, GR

& GT of JSS 51701 : T65/150

Type GE and GF of
JSS 51701 and 51702 : T65/125

13.12.0 Final On completion of test, the following

Measurements measurement shall be made
13.12.1 Visual The boards shall be visually There shall be no blistering measling,
examination examined crazing or delamination.
13.12.1.2 Continuity As in clause 13.9 As in clause 13.9
13.12.1.3 Bow and twist As in clause 13.4 The maximum Bow and Twist shall
be twice the that of specified in 13.4.
13.13 Climatic The sequence of test shall be carried
out in accordance with JSS 50101 at
the severities specified. The damp
heat severity shall be H12.

40
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

Test Title of Test Description Requirements

Number
1 2 3 4
13.13.1 Intermediate The following tests shall be made
Measurements subsequent to removal form the
conditioning chambers for
temperature (dry heat) and
temperature (cyclic) tests after
allowing the appropriate recovery
period specified in JSS 50101.
13.13.1.1 Visual The board shall be visually examined There shall be no blistering measling,
Examination crazing or delamination.
13.13.2 Temperature As in JSS 50101, test number 22, at
(Dry Heat) the temperature specified below:
Type PX of JSS51701 at 105 deg C
Type GB, GH, CP & GT of JSS
51701 at 150 deg C
Type GE and GF of JSS 51701 and
51702 at 125 deg C
13.13.2.1 Continuity As in clause 13.9 As in clause 13.9
13.13.3 Damp Heat As in JSS 50101 test number 5.
(cyclic)
13.13.4 Temperature As in JSS 50101 test number 21 at
(Dry cold) the temperature of (-) 65 deg C
13.13.4.1 Continuity On completion of the test and while As in clause 13.9
the boards are still in the chamber,
the resistance and temperature of the
test pattern shall be measured and
recorded.
13.13.5 Damp Heat As in JSS 50101, test number 5
(cyclic)
13.13.5.1 Insulation On completion of the final cycle, the As in clause 13.8
resistance boards shall be removed from the
chamber. After removing surface
moisture, the insulation resistance
shall be measured as in clause 13.8
within 5 minutes.
13.13.6 Final The following measurements shall be
41
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

Test Title of Test Description Requirements

Number
1 2 3 4
Measurements made at the conclusion of the
sequence.
13.13.6.1 Visual The boards shall be visually There shall be no blistering measling,
Examination examined. crazing or delamination.
13.13.6.2 Voltage proof As in clause 13.7 As in clause 13.7
13.13.6.3 Insulation As in clause 13.8 As in clause 13.8
resistance
13.13.6.4 Continuity As in clause 13.9 As in clause 13.9
13.13.6.5 Bow and Twist As in clause 13.4 The maximum Warp and Twist shall
be twice the that of specified in clause
13.4
13.13.6.6 Solderability As in clause 13.10 As in clause 13.10
13.13.6.7 Pull of strength As in clause 13.11 As in clause 13.11
(Bond strength)

13.14 Damp heat As in JSS 50501 test number 7. The

(steady state) damp heat severity shall be H12.
During the test, a polarizing voltage
of 100 5V dc shall be applied
through a current limiting resistor
such that the current shall not exceed
1mA.

13.14.1 Final The following measurements shall be

measurements made after the completion of the
appropriate recovery period.

13.14.1.1 Visual The boards shall be visually

examination examined
13.14.1.2 Voltage proof As in clause 13.7 As in clause 13.7
13.14.1.3 Insulation As in clause 13.8 As in clause 13.8
Resistance

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 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

Test Title of Test Description Requirements

Number
1 2 3 4
13.14.1.4 Continuity As in clause 13.9 As in clause 13.9
13.14.1.5 Bow and Twist As in clause 13.4 As in clause 13.4
13.14.1.6 Solderability As in clause 13.10 As in clause 13.10
13.14.1.7 Pull off strength As in clause 13.11 As in clause 13.11
(Bond strength)
13.15 Thermal stress The boards shall be conditioned at The boards shall exhibit no measling,
121 to 149 deg C for one hour The fractures, separation of plating and
boards shall than be floated in a conductors, blistering or delamination
solder bath (63/37) tin lead solder
composition, maintained at 288C
6 C for a period of 10 seconds then
microsectioned and examined in
accordance with clause 13.5.
13.16 Rework The test specimens shall be The micro sectioned specimens shall
simulation conditioned at 23 deg C, 40-65% RH meet the requirements of clause 13.5
(plated through for 24 hours, prior to soldering and
hole) unsoldering procedure.
Insert the test wires in PTH and
solder by machine or hand as
applicable. The wire shall have a
diameter of 0.5 mm smaller than the
hole diameter. The wire shall not be
clinched. Subject the wires to five
cycles by unsoldering and soldering,
by head after the initial soldering.
During each cycle the wires shall be
completely removed and allowed to
cool to ambient temperature and then
replaced and resoldered.
Apply the iron to the test wire, not to
terminal pad and it should be applied
only as long as it is necessary to
perform the unsoldering and
soldering operation. Following the
fifth cycle, observe the specimen
through microsectioning.
43
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

Test Title of Test Description Requirements

Number
1 2 3 4
13.17 Cleanliness A convenient sized funnel shall The Printed Wiring Boards shall be
positioned over an electrolytic within the allowable limits of ionic
beaker. The printed wiring board and other contaminants. If PUBs
shall be suspended within the require permanent ionic within the
funnel. A wash solution of 75 pr allowable limiting ionic contaminants
cent by volume of ACS reagent prior to the application of solder
grade isopropyl alcohol and 25 per maskcoating (i.e. the resitivity shall
cent by volume of distilled water not be less than 2 x 10 ohm cm or
shall be prepared, which will have equivalent)
resistivity equal to or greater than
6x10 ohm/centimeters. The wash
solution shall be directed in affine
stream from a wash bottle on to
both Printed Wiring Board until 100
milli-meters of the wash solution is
collected for each 254 sq/mm of
board surface (including both sides
of the board). The time required for
the wash activity shall be a
minimum of 1 minute. It is
imperative that the initial washing
be included in the sample to be
measured for resistivity. The
resistivity of the collected wash
solution shall be measured with a
conductivity bridge or other
instrument of equivalent range and
accuracy.

44
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

14. SUGGESTION FOR IMPROVEMENT

14.1 Any suggestion for improvement in this document shall be used to: -

The Director,
Directorate of Standardisation
Ministry of Defence
H Block
New Delhi 110 011.

45
JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

APPENDIX 'A'

(Clause 13.1.1)

CONDUCTIVE PATTERN

A.0 Scope :This appendix gives detail requirements of conductive pattern.

A.1 Conductor thickness and width: The width and thickness of conductors on the
finished printed wiring board shall be determined on the basis of the current carrying
capacity required. The temperature rise shall be determined in accordance with fig. 19(a)
and 19(b).for the case of manufacture and durability in usage, conductor width and
spacing requirements shall be maximized while maintaining the minimum spacing
requirements of Table A.1. The minimum Conductor width shown on the master drawing
Shall be not less than 0.10mm.To maintain the conductor width shown on the master
drawing the line width on the production master shall be compensated for process
allowance Table A.4 of the Appendix A.

A.2 Conductor with less than 90 deg. included angle: All conductors that change
direction Where the included angle is lese than 90 deg. shall have external corners of the
conductor rounded.

A.3 Conductors: The length of a conductor between any two lands should be held
to a minimum. However, conductors which are straight lines and run in X, Y or 45deg
directions in general are preferred to aid computerized documentation for mechanized or
automated layouts.

A.4 Conductor Spacing: large spacing shall be used whenever possible and the
minimum spacing between conductors, between conductor patterns, and between
conductive materials (such as conductive marking s or mounting hardware) and
conductors shall be in accordance with Table A.1. and defined on the master drawing. To
maintain the conductor spacing shown on the master drawing, space width on the
production master shall be compensated for process allowance as shown on Table A.4 of
the Appendix. Plated-through holes passing through internal foil planes (ground and
voltage and thermal planes shall meet the same minimum clearance between the plated-
through hole and foil of ground planes as required for spacing between internal
conductors.

A.5 Edge Spacing: The minimum spacing between conductive patterns and the
edge of the printed wiring board or any adjacent conductive surface, such as supporting
structure or frames (nonmoving), shall be not less than the minimum spacing specified in
Table A.1 plur 0.38 mm, provided the edges are protected from the physical harm in the
installed assembly configuration. Printed wiring not so protected shall have a minimum
46
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

conductor to edge distance of 1.25 mm. The edge spacing requirement is not applicable to
heat sinks and ground planes. To maintain the edge spacing shown on the master
drawing, the edge spacing shall be compensated for process allowances shown in Table
A.4.

TABLE A.1: CONDUCTOR SPACING

Voltage between Minimum spacing

conductors DC or Surface layers Internal layers
AC peak (volts)
0-100 0.13 mm 0.10 mm
101-300 0.38 mm 0.20 mm
301-500 0.76 mm 0.2525 mm
Greater than 500 0.00305 mm 0.0025 mm
1/ (per volt) (per volt)

1/ for reference only, voltages greaer than 500 v should be evaluated for the
specific design application.

A.8 Large internal conductive areas (for multilayer boards only): When a
conductive area that extends beyond 25.4 mm diameter circle is used on an internal layer,
the layer should be placed areas that will breakup large conductive area but retain the
continuity and functionality of the conductor. If more than one internal layer has a large
conductive area, the layers should be located in the board to provide balanced
construction.

A.9 Interfacial connections: Interfacial connections on double sided and multilayer

printed wiring boards shall be made by use of plated-through holes only. Wires, standiff
terminals, eyelets, rivets, or pins shall not be used to provide interfacial connections.

A.10 Solder fillets and plugs: Printed wiring boards subjected to wave or dip
solderings shall be designed to facilitate flow of solder around components leads in
plated through holes and into plated-through holes without leads, so as to create a solder
plug. Careful consideration shall be given to hole-to-lead diameter clearance, hole to
board thickness rations and heat relief of metal planes to promote solder plugging. In the
event solder plugging due to natural capillary action is not possible, such as when a heat
sink is bonded directly over plated-through holes, the design shall include provision for
prevention of solder, flux or other chemical from entering the plated-through holes.
Solder may be prevented from entering the holes by profiling these holes with an
appropriate polymer plug, covering the holes with a sheet of permanent bonded material,
tenting the holes with a permanent solder mask of blocking these holes with some

47
JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

temporary techniques that will prevent solder access to the hole. All techniques must
have sufficient durability not to break up when exposed to the solder process. The printed
wiring assembly shall define the absence of such solder plug requirements. As a
minimum, solder plugs shall be required in:

(i) All electrically functional and non -functional plated through hole with a
lead is required to be surrounded 360 deg c by the solder plug, no matter what
technique for soldering is used.

(ii) Any plated -through hole without a lead, that is subject to wave or dip
soldering with the degree and percentage of hole plugging described by the
appropriate assembly of solder specification.

Solder plugs are not necessarily required in:

(i) Any unsupported hole without a lead.

(ii) Non-functional plated-through holes (hand soldered or vapour phase

reflowed assembly)

(iii) Any electrically functional plated-through hole (without a lead) not

subjected to wave or dip soldering.

(iv) Any plated -through hole covered with permanent solder mask, other
polymeric cover layer (non conformal coating) or is already filled with an
appropriate polymer in order to prevent hole access during wave or dip
soldering.

(v) Any plated -through hole, electrically functional or not, without a lead,
where access to the hole is limited by components, heat sinks, by design
(bling vias), or where access of solder to the hole is prevented during the
solder process.

A.11 Test pints: When required by the design, test points for probing shall be
provided as part of the conductor pattern and shall be identified on the master drawing
and the assembly drawing. These "probe points" shall require that a land be available for
probing as opposed to air conductor. Vias or component lead mounting lands may be
considered as probe points provided that sufficient area is available for probing and
maintaining the integrity of the via or component lead mounting joint.

A.12 Lands: Lands shall be provided for each point of attachment of a part lead or
other electrical connection to the printed wiring board.

48
 JSS 52300: 1992
(Revision No. 1)
Reaffirmed 2003

A.12.1 Lands for through hole attachment: When through hole attachment is required,
all the requirements of para A.12 shall be considered in the design of the printed wiring
board except where para A.12.4 applies for the surface attachment.

A.12.2 Lands location: The lands shall completely surround and a but on the
mounting holes except where paras A.12.4 and A.14 applies.

A.12.3 Through hole land requirements: The minimum diameter of the land
surrounding an unsupported hole shall be at least 1.02 mm greater than the maximum
diameter of the hole. When eyelets or standoff terminals are used, the lands on single and
double sided boards and external layers of multilayer boards shall be so designed as to
have a minimum diameter of at least 0.51 mm greater than the maximum diameter of the
projection of the eyelet or standoff terminal flange. The minimum diameter of a land
surrounding a plated-through hole on double sided and multiplayer boards shall be
determined by considering the following:

(i) Maximum diameter of the drilled hole.

(ii) Minimum annular ring requirements. Etch back, when required, will
reduce the insulation area that supports the internal land. The minimum
annular ring considered back allowed.

(iii) A standard fabrication allowance, determined by statistical survey, which

considers production master tooling and process variations required for
fabrication boards. (See Table A.2)

TABLE A.2 MINIMUM STANDARD FABRICATION ALLOWANCES FOR PTH

Greatest Board/ Preferred Standard Reduced producibility

Panel dimension mm mm mm
Upto 305 mm 0.71 0.51 0.30
More than 305 mm 0.86 0.61 0.41

All lands and annular rings shall be maximized wherever feasible, consistent
with good design practice and electrical clearance requirements.

A.12.4 Lands for surface attachment: When surface attachment is required, all of the
requirements of para A.12 shall be considered in the design of the printed wiring board
except where paras A.12.1 and A.12.9 apply. The selection, design, and position of the
land geometry in relation to the part may significantly impact the solder joint. The
designer must understand the capabilities and limitation of the manufacturing and
assembly operations.
49
JSS 52300: 1992
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Reaffirmed 2003

A.12.5 Land for end capped discrete components: Discrete components when
mounted shall have their land relationship identified as shown in figure 20.

A.12.6 Land pattern for leadless chip carriers: The attachment lands for surface
mounting and leadless chip carriers should be the same width as the component terminal
plus 0.01 mm whenever possible. The land length should extend between 0.38 to 1.02
mm beyond the maximum chip carrier outling on all four sides to create a horizontal
solder fillet length equal to the vertical filler rise (See Figure 21). The design of fan-out
to interconnect the basic land pattern to other circuitry/devices is independent of wiring
density, testability, assembly; repairability land sides should be located on fixed grid
within the printed board to optimise testing. The grid should be compatible with assembly
and testing equipment so as to minimise the amount of specialised and complex
equipment necessary.

A.12.7 Lands for leaded chip carriers: The land size for ceramic and for leaded chip
carrier should match the lead configurations. 'J' shaped leads should have the land width
equal or 0.13 mm larger than the width of the lead. The land length should extend
between 0.38 to 1.02 mm beyond both sides of the foot of the 'J' pattern. Other types of
leads used for chip carriers should have the land commensurate with the lead
configuration, in order to create a horizontal solder fillet length at the toe and heel of the
lead configuration as shown in Fig. 23.

A.12.8 lands for ribbon leaded surface mounted parts: The land requirements for
mounting ribbon leaded parts, such as flat packs', 'quad packs' or small outline devices
shall preferably be rectangular. The minimum land width shall be equal to or exceed the
maximum lead width by the amount as shown in Figure 23 providing room for both
solder fillets at both the heel and toe of the ribbon lead. The minimum land width shall be
approximately one and one-half times the width of the lead or 0.13 mm, whichever is less
(See Figure 24). Flat pack termination shall be staggered to permit greater spacing
wherever possible. The centre position of ribbon leaded components should be a fixed
grid, wherever possible, to facilitate testing.

A.12.9 Land for flattened round leads: Flattened round leads shall have a land which
will provide the seating so that the heel and the terminal relationship is in accordance
with Figure 25. Leads shall be seated with no side overhang. Toe overhang is acceptable,
area is a minimum of 150 percent of the unflattened lead diameter and the overhang does
not reduce the spacing to adjacent parts to less than that specified on the assembly
drawing.

A.12.10 Lands for plated through holes (vias for board with surface attached parts) :
The minimum diameter of a land surrounding a plated-through hole on double sided and
multiplayer boards where surface attachment is used, shall be determined by considering
the following :
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(i) Maximum diameter of the drilled hole.

(ii) Minimum annular ring. Etchback, when required, will reduce the
insulation that supports the internal land. The minimum annular ring
considered in the design shall be not less than the maximum etchback
allowed.

(iii) A standard fabrication allowance, determined by statistical survey, which

considers tooling, production master and process variation required to
fabricate boards (See Table A.3).

TABLE A.3 MINIMUM STANDARD FABRICATION ALLOWANCES FOR

SURFACE ATTACHMENT

Greatest Board/ Preferred Standard Reduced producibility

Panel dimension mm mm mm
Upto 305 mm 0.66 0.46 0.25
More than 305 mm 0.81 0.56 0.36

All lands and annular rings shall be maximized wherever feasible, consistent
with good design practice and electrical clearance requirements.

A.13 Annular ring considerations: The minimum annular ring on external layers is
the minimum amount of Copper (at the narrowest point) between the edge of the hole and
the edge of the land after plating of the hole. The minimum annular ring on internal
layers is the minimum amount of Copper (at the narrowest point) between the edge of the
drilled hole and the edge of the land after drilling the hole.
External - The minimum annular ring for an unsupported hole shall be 0.38
mm. The minimum annular ring for a layers of the multilayer boards shall be
0.051 mm, except where the conductor joins the land the annular ring shall be
0.13 mm.
Internal - The minimum annular ring for internal lands on multi layer boards
shall be 0.051 mm. Etchback, when required, will reduce the insulation
supporting the annular ring of internal lands. The minimum annular the
considered in the design shall be not less than the maximum etch back
allowed.

A.14 Offset lands: Lands, when used in conjunction with clinched leads, may be
located adjacent to (non surrounding) the lead termination hole. The land shall have a
sufficient distance from the hole to allow clipping of the part lead prior to unsoldering the
part lead from the land.

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TABLE AS COMPOSITE BOARD DESIGN GUIDANCE

Preferred Standard Reduced

Producibility
Numbers of conductors layers 6 12 20
max. 1/
Thickness of total board (max.) 2.54 3.81 5.08
Board thickness tolerance + 10% of above nominal or 0.18 mm whichever is
greater
Thickness of dielectric (min.) 0.20 0.15 0.10
Minimum conductor width
Internal 0.38 0.25 0.10
External 0.51 0.38 0.10
Conductor with tolerance
Unplated 610 g/sq.m. + 0.10 + 0.05 + 0.025
-0.15 -0.13 -0.08
Unplated 305 g/sq.m + 0.05 + 0.025 + 0.025
-0.08 -0.05 -0.025
Protective plated (metallic etch + 0.20 + 0.10 + 0.05
resist over 610 g/sq.m of Copper) -0.15 -0.10 -0.05
Minimum Conductor Spacing (of 0.51 0.25 0.13
Table A.1,whichever is greater)
Annular Ring plated through
Hole (min)
Internal 0.20 0.13 0.05
External 0.25 0.20 00.13
Feature location tolerance master
pattern material movement and
registration (rtp)
Longest board dimension 30 cm 0.20 0.18 0.15
or less
Longest Board Dimension over 0.25 0.23 0.20
30 cm.

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Preferred Standard Reduced

Producibility
Board thickness to plated hole 3.1 4.1 5.1
diameter (maximum)
Hole location tolerance (rtp)
Longest board dimension 30 cm 0.13 0.08 0.05 3/
or less
Longest Board Dimension over 0.18 0.13 0.08 3/
30 cm.
Unplated hole diameter tolerance 0.10 0.08 0.05
(unilateral)
Upto 0.81 0.10 0.08 0.05
0.84 to 1.61 0.15 0.10 0.05
1.63 to 4.77 0.20 0.15 0.10
Plated hole diameter tolerance
(unilateral) for minimum hole
diameter to maximum board
thickness rations greater than 1.4
add 0.01
0.38 - 0.76 0.20 0.13 0.10
0.79 - 1.56 0.25 0.15 0.10
1.59 - 4.75 0.31 0.20 0.1
Conductor to edge of board
(min.)
Internal layer 2.54 1.27 0.64
External layer 2.54 2.54 2.54

1/ The number of conductor layers should be the optimum for the board function and
good producibility.

2/ See para A. 13.

3/ To be used only in extreme situations warranted by the application.

NOTE: Unless otherwise specified, all dimensions and tolerances are in mm.

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APPENDIX 'B'

(Clause 13.5)

PLATED THROUGH HOLE EXAMINATION

B.0 SCOPE - This procedure is to be used for preparing the metallographic

specimen for evaluating the plating and/or coating thickness and quality in the plated
through hole and on the prined wiring board surface. The same basic procedures may be
used for mounting and examination of other areas.

B.1 TEST SPECIMENS

B.1.1 cut the required specimens from a printed wiring board or test coupon. Allow
sufficient clearance to prevent damage to the area to be examined. It is recommended that
a minimum of one microsection containing at least three of the smallest size plated-
through holes shall be made for each specimen tested.

B.2 APPARATUS

B.2.1 The following apparatus and materials are needed to perform this test: Sample
cutter (Jeweller's saw), punch press with a relief on punch (caution may cause board
damage), router or diamond saw, mount rings, smooth flat, mounting surface, belt sander
(80 grit paper) metallograph room temperature rating, patting material emery paper, grit
numbers 180-220, 320, 400 and 600, cloth for polishing wheels, alumina 5 and 0.3
micron, polishing, lubricant, etching solution cotton swabs for clearing and etchant
application, methanol and engraver.

B.3 PROCEDURE

B.3.1 Preparation of specimen: Grind sample on 180-220 or 320 grit wheel to within
approximately 1.27 mm of final polish depth. Deburr all edges prior to mounting.

B.4 NOTES

B.4.1 Plating thickness determination should not be determined at nodules, voids,

cracks, or irregular and thin platings.

B.4.2 Plating quality observation may include the following: Blisters, laminate
voids, cracks, resin recession, plating uniformity, burre and nodules and plating voids. In
addition plating quality for multilayer PWB's may include. Inner plane bond to plated-
through hole, resin smear, glass fibre protrusion, and epoxy etchback. Some of these
conditions may be observed on the polished specimen prior to etching.
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B.4.3 Over plating the specimen with a thin layer of nickel or other hard plating,
prior to encapsulating, considerably improves sample quality and readability.

B.4.4 Diamond paste is preferred over alumina because PWB's are being evaluated
for high reliability application. A 6 micron and 1 micron diamond paste can be
substituted for the alumina pastes called out in clause B.1.5 Diamond paste substantially
reduces the risk of specimen smear or burnishing.

B.4.5 A dichromate reagent consisting of saturated solutions of potassium

dichromate and sodium chloride combined with sulphuric acid may also be etching
copper in the preaence of solder plate. It is more stable than the Ammonium
Hydrosuphide/Hydrogen peroxide etchant.

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FIGURES

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