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MODEL M1717S-BNN
M1917S-BNN BRAND LG
Part No. 38289S0041Q
SUFFIX FLATRON M1717S
KNEUEPX Product Name FLATRON M1917S
2. Printing Specification
2. Printing Colors
Cover : 2 COLORS (M100%, BLACK)
Inside : 1 COLORS (Black)
3. Stock (Paper)
Cover : 100 g/
Inside : 100 g/
4. Printing Method :
5. Bindery : Saddle stitch
6. Language : English
7. Number of pages : 32 (Including blank 4pages)
3. Special Instructions
4. Changes
8
7
6
5
4
3
2
REV.
NO. MM/DD/YY SIGNATURE CHANGE NO. CHANGE CONTENTS
P/NO. 38289S0041Q
Pagination sheet Total pages :32pages
blank 2 3 4 . ..
COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : LM52A
MODEL: M1717S (M1717S-BNN.AN**LF)
M1917S (M1917S-BNN.AX**LF)
*( ) **Same model for Service
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
AUTO/SET
Blank Page1
CONTENTS
SPECIFICATIONS ................................................... 2 ADJUSTMENT ...................................................... 12
PRECAUTIONS ....................................................... 3 TROUBLESHOOTING GUIDE .............................. 14
SERVICE PRECAUTIONS ...................................... 4
WIRING DIAGRAM ............................................... 18
TIMING CHART ....................................................... 7
EXPLODED VIEW...................................................19
DISASSEMBLY ....................................................... 8
BLOCK DIAGRAM ................................................... 9 REPLACEMENT PARTS LIST ...............................21
DESCRIPTION OF BLOCK DIAGRAM ................. 10 SCHEMATIC DIAGRAM ......................................... 24
SPECIFICATIONS
1. LCD CHARACTERISTICS 5. POWER SUPPLY
Type : TFT Color LCD Module 5-1. Power
Active Video Area : 17.0 inch-M1717S AC 100-240Vac, 50/60Hz
: 19.0 inch-M1917S
Size : 358.5(V) x 296.5(H) x 17(D)-M1717S 5-2. Power Consumption
: 396.0(V) x 324.0(H) x 16.5(D)-M1917S MODE H/V SYNC VIDEO POWER CONSUMPTION LED COLOR
Pixel Pitch : 0.264mm x 0.264mm-M1717S
: 0.098mm x 0.294mm-M1917S less than 37 W-M1717S
POWER ON (NORMAL) ON/ON ACTIVE BLUE
Color Depth : 16.2M colors less than 42 W-M1917S
Surface Treatment : Anti-Glare, Hard Coating (3H)
Operating Mode : Normally white, Transmissive mode OFF/ON
Backlight Unit : 4 CCFL SLEEP MODE ON/OFF OFF less than 1 W AMBER
Electrical Interface : LVDS
OFF/OFF
2. OPTICAL CHARACTERISTICS POWER S/W OFF - OFF less than 1 W OFF
2-1. Viewing Angle by Contrast Ratio 10
M1717S
Left : -60 min., -70 typ / Right : +60 min., +70 typ 6. ENVIRONMENT
Top : +60 min., +75 typ / Bottom : -50 min., -65 typ 5-1. Operating Temperature : 10C ~ 35C
5-2. Operating Humidity : 20% ~ 80%
M1917S 5-3. MTBF : 50,000 Hours (Min)
Left : -70 min., -80 typ / Right : +70 min., +80 typ
Top : +60 min., +75 typ / Bottom : -70 min., -85 typ 7. DIMENSIONS (with TILT/SWIVEL)
M1717S
2-2. Luminance : 200(min.), 250(typ.)-M1717S Width : 389.5 mm (15.33'')
: 250(min.), 300(typ.)-M1917S Depth : 232 mm (9.13'')
Height : 437.9 mm (17.24'')
2-3 Contrast Ratio : 350(min.), 600(typ.)-M1717S
: 450(min.), 700(typ.)-M1917S M1917S
Width : 443.6 mm (17.46'')
3. SIGNAL (Refer to the Timing Chart) Depth : 232 mm (9.13'')
3-1. Analog Video Input Height : 475.6 mm (18.72'')
1) Video Input Range : 0~0.7V 5%
2) Video Termination Impedance : 75 5% 8. WEIGHT (with TILT/SWIVEL)
3) Sync Type : Separate Sync. M1717S
4) Sync Level : TTL Low 0.8V, High 2.0V Net. Weight : 5.28 kg (11.64 lbs)
Gross Weight : 6.62 kg (14.60 lbs)
3-2. Operating Frequency
Horizontal : 30 ~ 83kHz M1917S
Vertical : 56 ~ 75Hz Net. Weight : 5.78 kg (12.74 lbs)
Gross Weight : 7.65 kg (16.87 lbs)
4. RESOLUTION
Analog Max : 1280 x 1024@75Hz
-2-
PRECAUTION
TAKE CARE DURING HANDLING THE LCD MODULE Leakage Current Hot Check Circuit
WITH BACKLIGHT UNIT.
Must mount the module using mounting holes arranged AC Volt-meter
in four corners.
Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the Good Earth Ground
screen. such as WATER PIPE,
To Instrument's CONDUIT etc.
Do not scratch or press on the panel with any sharp exposed
objects, such as pencil or pen as this may result in METALLIC PARTS
damage to the panel.
Protect the module from the ESD as it may damage the 1.5 Kohm/10W
electronic circuit (C-MOS).
Make certain that treatment persons body are
grounded through wrist band.
Do not leave the module in high temperature and in
areas of high humidity for a long time.
The module not be exposed to the direct sunlight.
Avoid contact with water as it may a short circuit within
the module.
If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
-3-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this 9. Use with this receiver only the test fixtures specified in
service manual and its supplements and addenda, read this service manual.
and follow the SAFETY PRECAUTIONS on page 3 of this CAUTION: Do not connect the test fixture ground strap
publication. to any heat sink in this receiver.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the Electrostatically Sensitive (ES) Devices
safety precautions on page 3 of this publication, always Some semiconductor (solid-state) devices can be
follow the safety precautions. Remember: Safety First. damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
General Servicing Precautions Devices. Examples of typical ES devices are integrated
1. Always unplug the receiver AC power cord from the AC circuits and some field-effect transistors and
power source before; semiconductor "chip" components. The following
a. Removing or reinstalling any component, circuit techniques should be used to help reduce the incidence of
board module or any other receiver assembly. component damage caused by static by static electricity.
b. Disconnecting or reconnecting any receiver electrical 1. Immediately before handling any semiconductor
plug or other electrical connection. component or semiconductor-equipped assembly, drain
c. Connecting a test substitute in parallel with an off any electrostatic charge on your body by touching a
electrolytic capacitor in the receiver. known earth ground. Alternatively, obtain and wear a
CAUTION: A wrong part substitution or incorrect commercially available discharging wrist strap device,
polarity installation of electrolytic capacitors may which should be removed to prevent potential shock
result in an explosion hazard. reasons prior to applying power to the unit under test.
d. Discharging the picture tube anode. 2. After removing an electrical assembly equipped with
2. Test high voltage only by measuring it with an ES devices, place the assembly on a conductive
appropriate high voltage meter or other voltage surface such as aluminum foil, to prevent electrostatic
measuring device (DVM, FETVOM, etc) equipped with charge buildup or exposure of the assembly.
a suitable high voltage probe. 3. Use only a grounded-tip soldering iron to solder or
Do not test high voltage by "drawing an arc". unsolder ES devices.
3. Discharge the picture tube anode only by (a) first 4. Use only an anti-static type solder removal device.
connecting one end of an insulated clip lead to the Some solder removal devices not classified as "anti-
degaussing or kine aquadag grounding system shield static" can generate electrical charges sufficient to
at the point where the picture tube socket ground lead damage ES devices.
is connected, and then (b) touch the other end of the 5. Do not use freon-propelled chemicals. These can
insulated clip lead to the picture tube anode button, generate electrical charges sufficient to damage ES
using an insulating handle to avoid personal contact devices.
with high voltage. 6. Do not remove a replacement ES device from its
4. Do not spray chemicals on or near this receiver or any protective package until immediately before you are
of its assemblies. ready to install it. (Most replacement ES devices are
5. Unless specified otherwise in this service manual, packaged with leads electrically shorted together by
clean electrical contacts only by applying the following conductive foam, aluminum foil or comparable
mixture to the contacts with a pipe cleaner, cotton- conductive material).
tipped stick or comparable non-abrasive applicator; 7. Immediately before removing the protective material
10% (by volume) Acetone and 90% (by volume) from the leads of a replacement ES device, touch the
isopropyl alcohol (90%-99% strength) protective material to the chassis or circuit assembly
CAUTION: This is a flammable mixture. into which the device will be installed.
Unless specified otherwise in this service manual, CAUTION: Be sure no power is applied to the chassis
lubrication of contacts in not required. or circuit, and observe all other safety precautions.
6. Do not defeat any plug/socket B+ voltage interlocks 8. Minimize bodily motions when handling unpackaged
with which receivers covered by this service manual replacement ES devices. (Otherwise harmless motion
might be equipped. such as the brushing together of your clothes fabric or
7. Do not apply AC power to this instrument and/or any of the lifting of your foot from a carpeted floor can
its electrical assemblies unless all solid-state device generate static electricity sufficient to damage an ES
heat sinks are correctly installed. device.)
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
-4-
General Soldering Guidelines Replacement
1. Use a grounded-tip, low-wattage soldering iron and 1. Carefully insert the replacement IC in the circuit board.
appropriate tip size and shape that will maintain tip 2. Carefully bend each IC lead against the circuit foil pad
temperature within the range or 500F to 600F. and solder it.
2. Use an appropriate gauge of RMA resin-core solder 3. Clean the soldered areas with a small wire-bristle
composed of 60 parts tin/40 parts lead. brush. (It is not necessary to reapply acrylic coating to
3. Keep the soldering iron tip clean and well tinned. the areas).
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a "Small-Signal" Discrete Transistor
metal handle. Removal/Replacement
Do not use freon-propelled spray-on cleaners. 1. Remove the defective transistor by clipping its leads as
5. Use the following unsoldering technique close as possible to the component body.
a. Allow the soldering iron tip to reach normal 2. Bend into a "U" shape the end of each of three leads
temperature. remaining on the circuit board.
(500F to 600F) 3. Bend into a "U" shape the replacement transistor leads.
b. Heat the component lead until the solder melts. 4. Connect the replacement transistor leads to the
c. Quickly draw the melted solder with an anti-static, corresponding leads extending from the circuit board
suction-type solder removal device or with solder and crimp the "U" with long nose pliers to insure metal
braid. to metal contact then solder each connection.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil. Power Output, Transistor Device
6. Use the following soldering technique. Removal/Replacement
a. Allow the soldering iron tip to reach a normal 1. Heat and remove all solder from around the transistor
temperature (500F to 600F) leads.
b. First, hold the soldering iron tip and solder the strand 2. Remove the heat sink mounting screw (if so equipped).
against the component lead until the solder melts. 3. Carefully remove the transistor from the heat sink of the
circuit board.
c. Quickly move the soldering iron tip to the junction of 4. Insert new transistor in the circuit board.
the component lead and the printed circuit foil, and 5. Solder each transistor lead, and clip off excess lead.
hold it there only until the solder flows onto and 6. Replace heat sink.
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the Diode Removal/Replacement
circuit board printed foil. 1. Remove defective diode by clipping its leads as close
d. Closely inspect the solder area and remove any as possible to diode body.
excess or splashed solder with a small wire-bristle 2. Bend the two remaining leads perpendicular y to the
brush. circuit board.
3. Observing diode polarity, wrap each lead of the new
IC Remove/Replacement diode around the corresponding lead on the circuit
Some chassis circuit boards have slotted holes (oblong) board.
through which the IC leads are inserted and then bent flat 4. Securely crimp each connection and solder it.
against the circuit foil. When holes are the slotted type, 5. Inspect (on the circuit board copper side) the solder
the following technique should be used to remove and joints of the two "original" leads. If they are not shiny,
replace the IC. When working with boards using the reheat them and if necessary, apply additional solder.
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above. Fuse and Conventional Resistor
Removal/Replacement
Removal 1. Clip each fuse or resistor lead at top of the circuit board
1. Desolder and straighten each IC lead in one operation hollow stake.
by gently prying up on the lead with the soldering iron 2. Securely crimp the leads of replacement component
tip as the solder melts. around notch at stake top.
2. Draw away the melted solder with an anti-static 3. Solder the connections.
suction-type solder removal device (or with solder CAUTION: Maintain original spacing between the
braid) before removing the IC. replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
-5-
Circuit Board Foil Repair At Other Connections
Excessive heat applied to the copper foil of any printed Use the following technique to repair the defective copper
circuit board will weaken the adhesive that bonds the foil pattern at connections other than IC Pins. This technique
to the circuit board causing the foil to separate from or involves the installation of a jumper wire on the
"lift-off" the board. The following guidelines and component side of the circuit board.
procedures should be followed whenever this condition is 1. Remove the defective copper pattern with a sharp
encountered. knife.
Remove at least 1/4 inch of copper, to ensure that a
At IC Connections hazardous condition will not exist if the jumper wire
To repair a defective copper pattern at IC connections use opens.
the following procedure to install a jumper wire on the 2. Trace along the copper pattern from both sides of the
copper pattern side of the circuit board. (Use this pattern break and locate the nearest component that is
technique only on IC connections). directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
1. Carefully remove the damaged copper pattern with a of the nearest component on one side of the pattern
sharp knife. (Remove only as much copper as break to the lead of the nearest component on the
absolutely necessary). other side.
2. carefully scratch away the solder resist and acrylic Carefully crimp and solder the connections.
coating (if used) from the end of the remaining copper CAUTION: Be sure the insulated jumper wire is
pattern. dressed so the it does not touch components or sharp
3. Bend a small "U" in one end of a small gauge jumper edges.
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
-6-
TIMING CHART
VIDEO
A
E
D B
SYNC
C
-7-
DISASSEMBLY
#1 #2
#3 #4
-9-
DESCRIPTION OF BLOCK DIAGRAM
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power
board.
12V is provided for inverter, 5V is provided for LCD panel and micom.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC12V to AC 700Vrms and operates back-light lamps of module.
3. MICOM Part.
This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset
IC and the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.
- 10 -
LIPS Board Block Diagram
12V
50 ~ 60Hz
HVDC 100KHz 5V
EMI INPUT RECTIFIER ENERGY OUTPUT RECTIFIER
COMPONENTS AND FILTER TRANSFER AND FILTER
LINE GND
100 ~ 240V
PRIMARY SECONDARY
Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.
- 11 -
ADJUSTMENT
1. Port Setup
a) Copy UserPort.sys file to
c:\WINNT\system32\drivers folder
b) Run Userport.exe
- 12 -
SERVICE OSD
1) Turn off the power switch at the front side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) Auto Color : W/B balance and Automatically sets the gain and offset value.
b) NVRAM INIT : EEPROM initialize.(24C08)
c) CLEAR ETI : To initialize using time.
d) AGING : Select Aging mode(on/off).
e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)
i) MODULE : To select applied module.
IBM 9 6
Video Signal 5 1
Compatible PC 15 11
Generator 10 6
5 1
C
PARALLEL PORT
ed
13 1
us
2C
t
25
No
14
23
RS
OFF ON
5V
L
Control Line
F
E
LL
C
RA
PA
VG ON
WE
S 5V
(110V/220V)
PO
E 74LS06
A
T
MO Power LED
CS
NI OFF 4.7K
YN
TO
V-S
R
74LS06
E ST Switch
B
B
F V-Sync On/Off Switch
(Switch must be ON.)
- 13 -
TROUBLESHOOTING GUIDE
1. NO POWER
NO POWER
(POWER INDICATOR OFF)
YES
YES YES
YES
Waveforms
1 J705-#5,6(5V) 2 U203-#8(3.3V) 3 U202 -#108,109
- 14 -
2. NO RASTER (OSD IS NOT DISPLAYED) LIPS
NO RASTER
(OSD IS NOT DISPLAYED)
NO
J705 PIN5, 6 CHECK LIPS
5V?
YES
YES
1. CONFIRM BRIGHTNESS
J705 PIN11 NO OSD CONTRL STATE.
5V? 2. CHECK MICOM DIM-ADJ
PORT
YES
CHECK
PULSE AS
CONTACTING SCOPE
PROBE TO CAUTION LABEL. NO
(CONTACT PROBE TO LIPS
CAUTION LABEL.
CAN YOU SEE PULSE
AT YOUR
SCOPE?
YES
- 15 -
3. NO RASTER (OSD IS NOT DISPLAYED) GM2621
NO RASTER
(OSD IS NOT DISPLAYED)
NO
CHECK U503 PIN3 TROUBLE IN LIPS
3.3V?
YES
CHECK U502 NO
TROUBLE IN LIPS
PIN2 1.8V?
YES
YES
Q701
5 PIN3 IS 65.22KHz H-SYNC? CHECK CONNECTION
NO
Q702 PIN3 IS 60Hz V-SYNC? LINE FROM D-SUB TO
6 U202
IS PULSE APPEARED
AT SIGNAL PINS?
AT MODE 12?
YES
TROUBLE IN CABLE
OR LCD MODULE
Waveforms
4 U202 #108,109(14.318V) 5 Q701-#3 6 Q702-#3
- 16 -
4. TROUBLE IN DPM
TROUBLE IN DPM
7 CHECK NO CHECK PC
R720, R721(SYNC) ? PC IS NOT GOING
8 INTO DPM OFF MODE
YES
CHECK
R701(SIGNAL NO TROUBLE IN SIGNAL
DETECT)? CABLE
YES
TROUBLE IN PC
Waveforms
7 R721 V-SYNC 8 R720 H-SYNC
- 17 -
WIRING DIAGRAM
6631T11012W
or 6631T11020W
6631T20023A
11P 30P
12P
6P
L R
6631900036E
6631900035C
- 18 -
130
010
020
030
110
090
100
120
- 19 -
060
040
EXPLODED VIEW
050
080
070
EXPLODED VIEW PARTS LIST
30919L0002M CABINET ASSEMBLY, M1917 BRAND - CABINET ASSY MULTI MEDIA(BK) CKD
020 6304FLP274A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-TLA1 LG PHILPS TFT COLOR P5,645CH,250NITS,8MS,LPL NJ/KUMI,PB FREE,EGI,OKI S D-IC,EGI,SXGA,L
or 6304FLP280A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-TLA4 LG PHILPS TFT COLOR P6,645CH,250NITS,8MS,LPL NJ/KUMI,PB FREE,EGI,MAGNA,S D-IC,EGI,SXGA
or 6304FLP279A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-TLA2 LG PHILPS TFT COLOR P6,645CH,250NITS,8MS,LPL NJ/KUMI,PB FREE,EGI,OKI S D-IC,SXGA,LVDS
or 6304FLP275A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-TLA3 LG PHILPS TFT COLOR P5,645CH,250NITS,8MS,LPL NJ/KUMI,PB FREE,EGI,MAGNA S D-IC,EGI,SXGA
6304FLP310A LCD(LIQUID CRYSTAL DISPLAY), LM190E03-TLB5 LG PHILPS TFT COLOR P4,645CH,300NITS,TN,8MS,LPL KUMI,PB FREE,EGI,OKI S D-IC,SXGA,LVDS
or 6304FLP337A LCD(LIQUID CRYSTAL DISPLAY), LM190E03-TLBB LG PHILPS TFT COLOR DOT FREE OF LM190E03-TLB7,P4,645CH,300NITS,TN,8MS,LPL KUMI,PB FREE
or 6304FLP336A LCD(LIQUID CRYSTAL DISPLAY), LM190E03-TLBA LG PHILPS TFT COLOR DOT FREE OF LM190E03-TLB5,P4,645CH,300NITS,TN,8MS,LPL KUMI,PB FREE
or 6304FLP313A LCD(LIQUID CRYSTAL DISPLAY), LM190E03-TLB8 LG PHILPS TFT COLOR P3,645CH,300NITS,TN,8MS,LPL KUMI,PB FREE,EGI,NEC S D-IC,SXGA,LVDS
or 6304FLP312A LCD(LIQUID CRYSTAL DISPLAY), LM190E03-TLB7 LG PHILPS TFT COLOR P4,645CH,300NITS,TN,8MS,LPL KUMI,PB FREE,EGI,NEC S D-IC,SXGA,LVDS
030 3809900101F BACK COVER ASSEMBLY, M1717 NON M/M C-CORE E-CKD
3809900104F BACK COVER ASSEMBLY, M1917 NON M/M E-CKD RAVEN BLACK
040 3043TKK274B TILT SWIVEL ASSEMBLY, L1732 . BODY ASSY,CKD
050 3043TKK275C TILT SWIVEL ASSEMBLY, LX32 . BASE ASSY-CKD-M1717S
68719ST849A PWB(PCB) ASSEMBLY,SUB, SUB T.T LM52A M1717S ANEUEF CONTROL LF-M1917S
090 6871TPT318A PWB(PCB) ASSEMBLY,POWER, MFT 4-LAMP POWER TOTAL BRAND .
100 33139L7013B MAIN TOTAL ASSEMBLY, M1717S BRAND LM051A EADI CKD-For Europe,Pakistan,Saudiarabia
49519S0011M METAL ASSEMBLY, FRAME MAIN M1917S MM , SUPPORT & EMI GASKET ( L-CSKD )
120 49509K0003A METAL, SHIELD INVERT BRAND(M1717/M1917) MFT
130 6410TEW010A POWER CORD, LP34A+LS60 LONGWELL VDE/SEMKO 1870MM WALL CD/PB FREE BLACK-For Europe,Saudiarabia
6410TIW006B POWER CORD, SP81A+IS14 I-SHENG ISI 1870MM WALL PB/CD FREE BLACK-For Pakistan
6410TPW003A POWER CORD, LP-33+LS-60 LONGWELL PCT 1870MM WALL CD/PB FREE BLACK-For Russia
- 20 -
REPLACEMENT PARTS LIST
CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,
READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.
* NOTE : S SAFETY Mark
AL ALTERNATIVE PARTS
- 21 -
DATE: 2005. 11. 14. DATE: 2005. 11. 14.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
U501 0IMCRFA010A "KA7809R, FAIRCHILD 2P D-PAK," R303 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
U502 0IPMGSG019A "LD1117S18TR,LF STM SOT223 R/" R304 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
U503 0IPMGKE011A KIA78D33F KEC DPAK R/TP 3.3V R305 0RJ3002D477 30K OHM 1/10 W 1% 1608 R/TP
U701 0IMMRSG036A "M24C02-WMN6T(P),LF SGS-THOMS" R306 0RJ1003D677 100K OHM 1/10 W 5% 1608 R/TP
R307 0RJ1003D677 100K OHM 1/10 W 5% 1608 R/TP
FILTERs R308 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
R309 0RJ1003D677 100K OHM 1/10 W 5% 1608 R/TP
L301 6200J00005R HB-1M1608-501JT CERATECH R/T R310 0RJ1003D677 100K OHM 1/10 W 5% 1608 R/TP
R311 0RJ2002D677 20000 OHM 1/10 W 5% 1608 R/T
TRANSISTOR R312 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
R313 0RJ2002D677 20000 OHM 1/10 W 5% 1608 R/T
Q201 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T" R314 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
Q202 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T" R315 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
Q203 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T" R501 0RX0471J609 4.7 OHM 1 W 5% TA52
Q204 0TR390609FA FAIRCHILD KST3906-MTF TP SOT R502 0RJ5600D677 560 OHM 1/10 W 5% 1608 R/TP
Q205 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T" R503 0RX0271J668 2.7 OHM 1 W 5% SF15
Q701 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T" R504 0RJ2202D677 22K OHM 1/10 W 5% 1608 R/TP
Q702 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T" R505 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
Q704 0TR390609FA FAIRCHILD KST3906-MTF TP SOT R506 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
U504 0TFVI80067A SI3865BDV(E3) VISHAY R/TP TS R509 0RX0102K665 10 OHM 2 W 5% SF 20
R510 0RX0102K665 10 OHM 2 W 5% SF 20
RESISTORs R701 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
R702 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP
R201 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R703 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP
R202 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R704 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP
R203 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R706 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R205 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R711 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP
R206 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R713 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R207 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R715 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R208 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R716 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP
R209 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R718 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R210 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R719 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP
R211 0RJ2400D677 240 OHM 1/10 W 5% 1608 R/TP R720 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
R212 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R721 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP
R213 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R725 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R214 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R726 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R216 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R727 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
R218 0RJ2201D677 2200 OHM 1/10 W 5% 1608 R/TP R728 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
R219 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R729 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP
R220 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R730 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R221 0RH0000D622 0 OHM 1 / 10 W 2012 5.00% D R731 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R222 0RH0000D622 0 OHM 1 / 10 W 2012 5.00% D R732 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
R223 0RH0000D622 0 OHM 1 / 10 W 2012 5.00% D R733 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R224 0RH0000D622 0 OHM 1 / 10 W 2012 5.00% D R734 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R225 0RH0000D622 0 OHM 1 / 10 W 2012 5.00% D R735 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP
R226 0RH0000D622 0 OHM 1 / 10 W 2012 5.00% D R736 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
R227 0RJ2202D677 22K OHM 1/10 W 5% 1608 R/TP R737 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R228 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TP R738 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R229 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R739 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP
R230 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TP
R231 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP OTHERs
R232 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TP
R233 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP X201 6202TST001A "SX-1 SUNNY ,SMS, 14.31818MHZ"
R234 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP
R235 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP CONTROL BOARD
R236 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP
R237 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP SW501 140-058E SKHV10910B LGEC NON 12V 20A
R238 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP SW502 140-058E SKHV10910B LGEC NON 12V 20A
R239 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP SW503 140-058E SKHV10910B LGEC NON 12V 20A
R240 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP SW504 140-058E SKHV10910B LGEC NON 12V 20A
R301 0RJ9101D677 9.1K OHM 1/10 W 5% 1608 R/TP SW505 140-058E SKHV10910B LGEC NON 12V 20A
R302 0RJ9101D677 9.1K OHM 1/10 W 5% 1608 R/TP SW506 140-058E SKHV10910B LGEC NON 12V 20A
- 22 -
DATE: 2005. 11. 14.
*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
- 23 -
3 4
SCHEMATIC DIAGRAM
1. SCALER (GM2621)
- 24 -
2
Waveforms
2 U203-#8(3.3V) 3 U202 -#108,109 4 U202 #108,109(14.318V)
2. AUDIO
- 25 -
3. POWER
- 26 -
8
7
4. CONNECTOR
- 27 -
1
Waveforms
1 J705-#5,6(5V) 7 R721 V-SYNC 8 R720 H-SYNC
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Nov. 2005
P/NO : 38289S0041Q Printed in Korea