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Manufacturing
Helmut.Kroener@de.multek.com
+49 171 463 5431
February 7 - 2006
Sao Paulo
ABRACI
Why is RoHS such a big deal??
ONE TRILLION + US $
worldwide
Military/
Industrial/ Aerospace Electronic Data
Military/ 5.4%
Medical Processing/Office
Industrial/ Aerospace 6.9%
5.7% Electronic Data 34.4%
Medical
Processing/Office Automotive
7.2%
34.8% 4.8%
Automotive
5.3% Consumer
CAAGR 04-07
5.0% 13.1%
Consumer
14.5%
IC Packages
Communications Communications
10.1%
22.3% 22.6% IC Packages
S24.044jpp-worldapp02-07
12.6%
Total: $36.1Bn Total: $41.8Bn
ELECTRONIC PRODUCTS
SUPPLY CHAIN
SUPPLY CHAIN
EMS PCB
Lead free soldering will require new alloys (Sn Ag Cu most likely)
96.5 Sn, 3 % Ag, 0.5 % Cu for solder balls and solder paste
US NEMI: Sn3.9wt%Ag0.6wt%Cu
EURAM: Sn3.8wt%Ag0.7wt%Cu
JEIDA: Sn3.0wt%Ag0.5wt%Cu
Sn(3-4)wt%Ag(0.5-1)wt%Cu
Melting Point: ~ 217 C
Typical Lead Free Assembly Requirements
Criteria Eutectic SnPb Lead free Comment
soldering soldering
(SnAgCu)
Average ramp 0.6 0.9 C/s 0.9 1.1 C/s Steeper ramp
rate 25 150 C
Time between 55 - 60 s 75 85 s Longer time
150 183 C
Peak 215 225 C 235 265 C Higher
Temperature temperature
Time above 45 55 s 30 - 80 s Longer dwell
183 C / 217 C (depending on times at higher
components) temperatures
Average 78C 10 11 C Faster cooling
cooling rate rates
peak T to 100C
Lead Free Requirements Reflow @ 260 C
Asia Asia
Europe USA EUROPE Europe
US US
Expectations from an EMS - Sanmina
ONLY RoHS compliant materials and products Q1 2005 and onwards
Full Traceability
Component PN change to reflect transition to RoHS
Component Identification signifying RoHS Compliance (JEDEC/NEMI
standards)
Warranted Compatibility of pre-RoHS and RoHS compliant
components
Reasonable sample quantities at supplier expense
Quality and Reliability of RoHS compliant components =/> than pre RoHS
No change in terms or conditions, including pricing, for RoHS compliant
components
Supplier will provide Certificate of RoHS compliance with each shipment by
means of paper, email, web.. (eg. Electronics Industries Alliance Materials
Compositions Declaration Guideline)
Ongoing communication
Product Transition Notice (ECN/PCN) last time buy end of life
Sample Availability
Revision to supplier RoHS roadmap
General Summary of Requirements
OSP
OSP / ENIG
Immersion Ag
Immersion Sn
Plated Ni Au
ENIG
PCB Finishes for LF OSP (0.2-0.6m)
Advantages Disadvantages
Flat, coplanar pads Limited heat cycle capability
Re-workable by PCB supplier Newer developments better
Cheap & simple process Assembly line changes (test ..)
Short and easy to control Reliability of exposed Cu after
process PCBA (ICT)
Cu-Sn intermetalic (IMC) is Test pins cut through copper
strong for solder joints with leaving exposed copper on PCBA
SAC Potential issue with voids
High reliability of solder joint (organics) in solder joint
High temperature OSP
developed
PCB Finishes for LF ENIG (3-5m Ni, 0.1 m Au)
Advantages Disadvantages
Flat, coplanar pads Expensive (Gold on record high)
Consistent thickness Brittle Fracture for BGA type
Withstands multiple heat packages (under mechanical
cycles load)
Long shelf life Black pad potential
Easily solder able May not be suited for high
Easy to repair on PCBA speed signals
Multiple repair possible Not possible to do gold wire
bonding
Works well for fine pitch
components Adjustments necessary for
Press Fit technology
No exposed copper
High barrel reliability
Easy to use for ICT
PCB Finishes for LF I Ag (0.15 0.5 m Au)
Advantages Disadvantages
Flat, coplanar pads Adjustments necessary for
Consistent thickness Press Fit technology (high friction
Withstands multiple heat coefficient)
cycles Anti-tarnishing is critical to
Long shelf life control
Likes to build oxides
Very easy solder able
Issues with process interruptions
Easy to repair on PCBA
Multiple repair possible
Diffuses into the copper
Works well for fine pitch
Exposed Cu
components
Color and look
High reliability with Cu Sn IMC
Potential issues with voids
Easy to for ICT
Thickness control critical
Relatively simple process
PCB Finishes for LF I Sn (0.5 1.2 m Au)
Advantages Disadvantages
Flat, coplanar pads Anti-tarnishing is critical to
Consistent thickness control
Very easy solder able Rinsing is highly critical
Likes to build oxides
Works well for fine pitch
components Diffuses into the copper
High reliability with Cu Sn IMC Exposed Cu
Color and look
Works well at ICT
Grows inter-metallic with every
Relatively inexpensive
heat cycle (0.1m/2 months)
Same metal as CuSnAg alloy
Fewer heat cycles possible than
(does not change alloy ratio
I Ag
much)
Fear of Sn Whiskers (perception
Well suited and proven for
only)
press fit technology
PCB Finishes for LF Plated Ni Au (5 m Ni, 0.1 m Au)
Advantages Disadvantages
Flat, coplanar pads Possibility of lower joint strength
Consistent thickness with SnAgCu alloy
Very easy solder able Brittle Fracture (comparable to
ENIG)
Works well for fine pitch
components Limitation is aspect ratio
10:1 max
Works well at ICT
Limitation in line spacing at
Very high barrel reliability PCB
about 4-5 mil (100-125 m)
Easy to rework (PCBA)
Not so widely available in the
industry
Conclusion Finish