Professional Documents
Culture Documents
Part 1
The trend to miniaturization in electronics continues. Integrated circuit In the following, you will find information about systems that
board solutions are becoming more and more popular as a means of effi- explain the different variants of flex-rigid circuit boards as well
ciently utilizing the even smaller casing volume in all three dimensions. as practical tips on design:
Flexible foils of polyimide and LCP (Liquid Cristal Polymer) with a typical 1. Systematic view of flex-rigid circuit boards
thickness of 50 m are materials that withstand high temperatures and 2. Project checklist for system requirements
can be used with copper-cladding as base material for pure flex circuit 3. Selection of the right technology
boards or in combination with rigid base materials for flex-rigid circuit 4. Materials and design parameters
boards with all the prevalent soldering methods. Thin FR4 layers in FR4 5. Mechanical design
Semiflex circuit boards are also bendable. 6. Layout and routing
7. Documents for manufacturing circuit boards
In recent years, Wrth Elektronik has accumulated extensive expertise in
already completed projects and commissions of the widest variety of
designs and applications, from Aerospace to Medical devices and Basically, standards must be regarded such
currently it supplies more than 500 customers. With the broad range of as IPC-2223, IPC-6013, the Basic Design Guide
technology we offer, you can make the best possible selection for any from Wrth Elektronik, as well as variant-specific
requirements in terms of performance and costs. design rules and drying recommendations.
PCB1 PCB2
Rigid circuit board + wiring harness/ Circuit boards with identical stack-up in Sub-systems vary considerably in terms
flex soldered in or plugged (detachable) all rigid areas of technology and size: e.g. flex-rigid/
connector combination
Few connections Integrated flex layer(s) throughout
Non-critical applications Considerably greater wiring density Separable
Wiring errors possible Saves valuable space by eliminating
connecting points (solder pads or footprint
TIP:
of connectors) Integrated wiring should be
provided for the smaller and
simpler PCB1.
2D
e) Product operating conditions: ambient conditions such as tem- i) Type and positioning of components, design and connection
perature, temperature change, cooling, humidity, shock and vibration, technology: components such as BGA requiring advanced via tech-
non-flammability, component assembly/soldering/repairs, test pro- nology, stackup, naked chip technology, soldering surface, delivery
cedures for environmental and reliability tests panel, legend print, press-fit technology, embedded components
f) Casing size, material and shape: analysis of all mechanical and j) Testing and Packaging: electrical and mechanical test of the
electrical interfaces, displays, switches, connectors, interfaces with circuit board, product testing documentation (detailed initial sample
other devices or modules. Design of a three-dimensional model test report is recommended for complex stack-up, specify test
(paper + scissors / mCAD+eCAD) in order to find minimum area for criteria), packaging
flat projection of the circuitry
k) Further processing of flex and flex-rigid PCBs: possibilities of
drying prior to soldering, logistics, dry storage, panel separation,
casing assembly, installation tolerances and fastening possibilities
rigid
flex
rigid
2F-Ri (TWINflex)
2F-2Ri
ML6 Semiflex 2-layers
3Ri-2F-3Ri
FR4 core
NOTE:
Often more affordable than a
Components on stable rigid section connector-cable-connector solution
Very thin flexible foil PI /LCP
1 to 6 copper layers Flexible area 1 to 12 layers bonded/
Partially reinforced with stiffener unbonded (airgap)
Photosensitive solder mask foil or Flexible Polyimide layers out-side
Polyimide coverlay or symmetrically inside
Delivered individually or as panel Rigid areas: standard soldermask
Flexible area: highly flexible
NOTE: soldermask or Polyimide coverlay
Flex-rigid 1F-0Ri design can be more
affordable than a TWINflex 1F-Ri
Please look at the Basic Design Guide of The requirements in the checklist should be
Wrth Elektronik for design rules regarding analyzed in detail in a discussion of the project
structures, via sizes and soldermask. with our specialists.
flex length L
thickness T
L A + R + 2 (T - R) L A + R -2 R L A + R + 2 (T - 2R)
With short flexible areas, four bonded flex layers are easier to bend
than 2+2 flex layers with airgap
3.00
C G
R 1 mm
soldermask clearance
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