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Control of Bouncing in MEMS Switches Using Double Electrodes
Copyright © 2016 F. Abdul Rahim and M. I. Younis. This is an open access article distributed under the Creative Commons
Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is
properly cited.
This paper presents a novel way of controlling the bouncing phenomenon commonly present in the Radio Frequency
Microelectromechanical Systems (RF MEMS) switches using a double-electrode configuration. The paper discusses modeling
bouncing using both lumped parameter and beam models. The simulations of bouncing and its control are discussed. Comparison
between the new proposed method and other available control techniques is also made. The Galerkin method is applied on the
beam model accounting for the nonlinear electrostatic force, squeeze film damping, and surface contact effect. The results indicate
that it is possible to reduce bouncing and hence beam degradation, by the use of double electrodes.
VDC1
Control electrode
VDC2
d/2 k c
Source Gate
d/2
Actuation electrode
m
VDC2
d
damping. The final simulation and testing showed that using
kc cc
two modes in the simulation captures the real dynamics of
the system as the bouncing has several short spaced impacts
during the actual impact. The transient excitation of the sec-
ond mode can be thus accurately captured by using a second
mode in the reduced order model. The authors showed the Figure 2: Equivalent lumped mass model representation.
influence of contact stiffness and actuation voltage on the
final bouncing characteristics. A double-electrode switch was
designed by Dadgour et al. [13] to form a universal Negative
And (NAND) and a Negative OR (NOR) gate. Such a double- Normalizing by 𝑚 yields
electrode design is similar to the configuration under study
in this work. 2 2
𝑉DC 𝑉DC
In previous works, delayed feedback controllers have 𝑥̈ + 2𝜁𝑤𝑓 𝑥̇ + 𝑤𝑓2 𝑥 = 𝐾𝑒 ( 1
− 2
), (2)
been proposed to stabilize MEMS resonators and make (𝑑 − 𝑥)2 (𝑑 + 𝑥)2
them more immune to dynamic disturbances [14–17]. The
technique was based on modifying the electrostatic force to where 𝑤𝑓 = √𝑘/𝑚, 𝑐/𝑚 = 2𝜁𝑤𝑓 .
include a delayed velocity or displacement with the delay Note that subscript 𝑓 means free (not in contact with the
equal to half of the natural period of the resonator. Such substrate). The values for 𝑘 and 𝑐 are adjusted depending on
technique however is hard to implement for switches during whether there is a contact with the substrate or not; hence
bouncing since the motion is not necessarily periodic. Yagu- the corresponding variables for (2) will also vary. Hence,
bizade and Younis [18] developed and studied the effect of 𝑤𝑓 is changed to 𝑤𝑐 and 𝜁 to 𝜁𝑐 , which refer to the natural
the nonlinear squeeze film damping on MEMS microbeams frequency and damping ratios in the presence of contact with
undergoing large motion and during mechanical shock. the substrate, respectively.
This paper presents a new method to control bouncing of
switches by implementing a double-electrode configuration
for actuation and control. Using a lumped parameter and 2.2. Beam Model. For the beam model, the Euler Bernoulli
continuous beam models, the new method will be demon- equation is solved using the Galerkin method to obtain a
strated by simulations based on several practical case studies. reduced order model [19]. A single mode, the first mode, is
chosen for the simulation to allow for comparison between
2. Modelling the System the beam model and the lumped parameter model. As before,
the dynamics of the beam will be split into contact and
The modeling of the double-electrode beam is done using noncontact regimes.
both lumped parameter and beam models (Figures 1 and To obtain the reduced order model, the following beam
2). The two models are discussed here with the relevant equation is assumed:
parameters taken for each.
𝜕2 𝜕2 𝑤 𝜕2 𝑤 𝜕𝑤
2.1. Lumped Parameter Model. The equation of a motion of a 2
(𝐸𝐼 2 ) + 𝜌𝐴 2 + 𝑐 = 𝐹, (3)
𝜕𝑥 𝜕𝑥 𝜕𝑡 𝜕𝑡
switch sandwiched between two electrodes can be written as
[19]
where 𝐸 is Young’s modulus, 𝐼 is the second moment of inertia
2
𝜀𝐴
2
𝑉DC 2
𝑉DC of the cross section, 𝐴 is cross-sectional area, 𝑤(𝑥, 𝑡) is the
𝑚𝑥̈ + 𝑐𝑥̇ + 𝑘𝑥 = ( 1
− ) .2
(1) beam deflection, 𝑥 is position on the beam, 𝑡 is time, and 𝐹 is
2 (𝑑 − 𝑥)2 (𝑑 + 𝑥)2 the external applied force.
Mathematical Problems in Engineering 3
1
(∫0 (𝜑2 + 2𝑢𝜑3 + 𝑢2 𝜑4 ) 𝑑𝑥)
2
𝑢̈ + 𝑤non 𝑢 + 𝑐non 𝑢̇ = 𝛼2
𝐷
2 2 𝑥 𝑥 𝑥 𝑥
((𝑉DC2
− 𝑉DC1
) (𝑢3 ∫𝑥 2 𝜑4 − ∫𝑥 2 𝜑) − (3𝑉2DC2 + 𝑉DC
2
1
) (𝑢2 ∫𝑥 2 𝜑3 − 𝑢 ∫𝑥 2 𝜑2 ))
⋅ 1 1 1 1
𝛼2
𝐴𝐷
2 2 𝑥 𝑥 𝑥 𝑥
((𝑉DC2
− 𝑉DC1
) (𝑢3 ∫𝑥 2 𝜑4 − ∫𝑥 2 𝜑) − (3𝑉2DC2 + 𝑉DC
2
1
) (𝑢2 ∫𝑥 2 𝜑3 − 𝑢 ∫𝑥 2 𝜑2 ))
⋅ 1 1 1 1
,
𝐷
(15)
where 𝐷 is expressed as (or dielectric layer). The high stiffness of the substrate in the
1 1 1
model only allows for small penetration.
𝐷 = (−𝑢5 ∫ 𝜑7 𝑑𝑥 + 𝑢4 ∫ 𝜑6 𝑑𝑥 + 2𝑢3 ∫ 𝜑5 𝑑𝑥 Tuning to obtain the best possible result (i.e., lowest
0 0 0 landing velocity and landing time) is a tedious process.
(16)
1 1 1 However this process can be made simpler by discussing the
2 4 3 2
− 2𝑢 ∫ 𝜑 𝑑𝑥 − 𝑢 ∫ 𝜑 𝑑𝑥 + ∫ 𝜑 𝑑𝑥) . effect of some key parameters that affect the switch dynamics.
0 0 0 These include the actuation voltage, the control voltage, the
Although bouncing is simulated through the use of the pulse width (duration of application of the control voltage),
above equation, which accounts for the nonlinear squeeze and pulse position (start of the control voltage). Also, it is
film damping, for comparison with literature, the equation important to point out that most of these parameters are
is shown below for the case of a linear constant damping influenced by each other. For example, variation in the pulse
coefficient width will not allow for any noticeable change in the landing
1 1
time and landing velocity if the application of the control
2
𝑢̈ + 𝑤non 𝑢 + 𝑐non 𝑢̇ (𝑢4 ∫ 𝜑6 𝑑𝑥 + 𝑢2 ∫ 𝜑4 𝑑𝑥 pulse occurs after the first contact between the tip and the
0 0 substrate.
1 The values of actuation, control voltages, and the pulse
+ ∫ 𝜑2 𝑑𝑥) = 𝛼2 [(𝑉DC
2
1
2
− 𝑉DC2
) width are given in Table 2.
0
(17) From Figures 5 and 6, it is evident that pulse position
𝑥2 𝑥2 is an important parameter and fairly intuitive. For instance,
4 2 3 2 2
⋅ (𝑢 ∫ 𝜑 𝑑𝑥 + 𝑢 ∫ 𝜑 𝑑𝑥) + (𝑉DC1
+ 𝑉DC2
) applying the control voltage after the initial landing has
𝑥1 𝑥1
occurred will not change the landing time on velocity. Also,
applying the control pulse before the landing will increase the
⋅ (2𝑢𝜑)] .
landing time but reduce the landing velocity.
Actuation voltage and control voltage changes are also
3. Results studied. The parameters used in the simulation are given in
Table 3.
Simulations were run for both the lumped parameter model Figures 7-8 show the result of changing the actuation volt-
and the beam model. The first target of the simulation is age. The results are quite intuitive and show that increasing
to obtain the bouncing dynamics of the switch using (2) actuation voltage can allow for reduction in landing time
and (15). Later, the dynamic response of the beam model is while sacrificing velocity reduction.
compared to other well-known pulses in literature. A detailed However, further reduction in velocity can be achieved
study of the effect of different parameters on the switch for negligible change to landing times by applying the control
dynamics is also performed. voltage pulse in a noncontinuous fashion (as in Figure 9). For
example, for the duration of the application of the control
3.1. Bouncing and Control Using Lumped Parameter Model. wave, the actuation voltage is dropped to zero. Figure 9
To simulate bouncing, the damping term and the stiffness demonstrates such an application.
term are varied when the beam comes into contact with the These signal values represent the application of the
substrate. The parameters used to model the beam are taken control voltage and actuation voltage for the specified time
from [5] and are given in Table 1. periods. Using a similar application, the landing velocity
Figure 4 shows the simulation result of the uncontrolled curve is found to be as shown in Figure 10.
bouncing displacement and velocity profile obtained through It is seen in Figure 10 that applying a noncontinuous
the integration of (2) in time using Runge-Kutta scheme. The actuation voltage improves overall velocity characteristics. A
dotted horizontal line represents the position of the substrate velocity of around 0.073 m/s can be reached, which provides
Mathematical Problems in Engineering 5
Table 1: The parameters used in the lumped parameter model based 1.5
Displacement (𝜇m)
on the case study done in [5]. In the table, the word “free” means
without contact (with subscript 𝑓) while 𝑤𝑐 and 𝜁𝑐 refer to the 1
natural frequency and damping ratios in the presence of contact with
the substrate. The constant 𝐾𝑒 is based on the permittivity of air, area 0.5
of the beam, and mass of the beam.
0
Parameter Value 0 50 100 150
Natural frequency free (𝑤𝑓 ) 2.1 × 104 [Hz] Time (𝜇s)
0.2
Damping free (𝜁𝑓 ) 2 × 10−2
Gap (𝑑𝑔 ) 3.8 × 10−6 [m]
Velocity (m/s)
Maximum distance to travel 2.6 × 10−6 [m] 0
Constant 𝐾𝑒 (𝜀A/2m) 1.9 × 10−11 [F⋅m/kg]
Effective spring constant 42 [N/m]
Natural frequency during contact (𝑤𝑐 ) 6.1 × 104 [Hz] −0.2
0 50 100 150
Damping ratio during contact (𝜁𝑐 ) 2 × 10−1 Time (𝜇s)
Table 2: Parameters used for studying pulse position using the Figure 4: Uncontrolled bouncing and velocity characteristics.
lumped model.
24 0.25
22
0.2
Landing time (𝜇s)
Velocity (m/s)
20
0.15
18
0.1
16
14 0.05
28 30 32 34 36 38 40 42 24 26 28 30 32 34 36 38
Actuation voltage (V) Actuation voltage (V)
Figure 7: Landing time versus actuation voltage. Figure 10: Landing velocity versus actuation voltage for the lumped
parameter model for the case of noncontinuous actuation voltage.
0.26 1.4
0.24 1.2
Displacement (𝜇m)
1
Velocity (m/s)
0.22
0.8
0.2 0.6
0.18 0.4
0.2
0.16
28 30 32 34 36 38 40 42 0
Actuation voltage (V) 0 5 10 15 20 25
Time (𝜇s)
Landing velocity for VDC1
Uncontrolled landing velocity VDC1 = 25 V
VDC1 = 30 V
Figure 8: Landing velocity versus actuation voltage. VDC1 = 35 V
Figure 11: Landing times for different actuation voltages for con-
stant control pulse parameters.
2
1.5 1.5
Displacement (𝜇m)
1
1
0.5
0.5
Signal
0
0
−0.5 0 50 100 150 200 250 300
Time (𝜇s)
−1
0.1
Velocity (m/s)
−1.5
−2 0
0 5 10 15 20 25 30
Time (𝜇s)
−0.1
Actuation signal 0 50 100 150 200 250 300
Control signal Time (𝜇s)
Figure 9: Noncontinuous application of actuation and control Figure 12: Displacement and velocity profiles for tuned system
signal. using the double-electrode scheme.
Mathematical Problems in Engineering 7
Vp Vp
Actuation voltage
Actuation voltage
Vℎ Vℎ
Time
ta Time
ta
(a) (b)
Figure 13: (a) Dual pulse actuation waveform (DP). (b) Exponentially increasing dual pulse actuation waveform (EDP).
Vp Vp
Actuation voltage
Actuation voltage
Vℎ Vℎ
Time Time
ta tc ta tc
Vc Vc
(a) (b)
Figure 14: (a) Modified dual pulse actuation waveform (MDP). (b) Modified exponentially increasing dual pulse actuation waveform
(MEDP).
2
EDP 26.4 80 40 — —
MEDP 29 80 40 50 31.405 1.5
0.25 0.2
0.2
0.15
Velocity (m/s)
Velocity (m/s)
0.15
0.1
0.1
0.05
0.05
0 0
0 5 10 15 20 25 30 0 10 20 30 40 50
Time (𝜇s) Time (𝜇s)
Figure 16: Velocity profile for DP and MDP. Figure 18: Velocity profile for EDP and MEDP.
1
3
2.5 0.8
Displacement (𝜇m)
Displacement (𝜇m)
2
0.6
1.5
0.4
1
0.2
0.5
0 0
0 10 20 30 40 0 0.5 1 1.5
Time (𝜇s) Time (𝜇s)
Figure 17: Displacement profile for EDP and MEDP. Table 5: Parameters used for the beam model [2].
Parameter Value
Length 70 [𝜇m]
reduces from 0.0053 m/s for a single electrode to 0.0032 m/s Width 30 [𝜇m]
for the double-electrode configuration. Thickness 2 [𝜇m]
Gap (𝑑𝑔 ) 1.5 [𝜇m]
Max distance (𝑑𝑡 ) 0.75 [𝜇m]
3.3. Beam Model. Double-electrode model using a continu-
ous beam model is developed to improve the accuracy of the Electrode position 21 [𝜇m] to 49 [𝜇m]
results. As such, the parameters of the model are taken from Young’s modulus (𝐸) 207 [GPa]
[2] and are provided in Table 5. Density 8900 [kg/m3 ]
The bouncing profile obtained using the beam model for
actuation voltage 280 V and control voltage 0 V (uncontrolled
response) is given in Figure 19. control and actuation voltages, respectively. The pulse width
When varying the application time of the pulse, Figures is set to 0.21 𝜇s.
20-21 are obtained. Similar to the lumped parameter model, it is possible
As in the case of lumped parameter system, the beam to tune the system to get reduced overall bouncing and
model shows similar results for landing time and landing landing velocity in the beam. Tuning is a dynamic process and
velocity. For Figure 20, voltages are set at 280 V and 110 V for requires use of the results derived earlier in the form of the
Mathematical Problems in Engineering 9
0.8 0.8
0.7
0.78
0.6
Landing time (𝜇s)
Displacement (𝜇m)
0.5
0.76
0.4
0.3
0.74
0.2
0.72 0.1
0.55 0.6 0.65 0.7 0.75 0.8
Pulse position (𝜇s) 0
0 0.5 1 1.5
Landing time for pulse position Time (𝜇s)
Uncontrolled landing time
Figure 22: Tuned displacement profile for the beam model.
Figure 20: Landing time versus pulse position.
2.5 4. Conclusions
2.4 This paper discusses a method that can allow the users to
actively tune their devices to obtain the required landing
Landing velocity (m/s)
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