Professional Documents
Culture Documents
ELECTRON PHYSICS
VOLUME 77
EDITOR-IN-CHIEF
PETER W. HAWKES
Laboratoire d’Optique Electronique
du Centre National
de la Recherche Scientifque
Toulouse, France
ASSOCIATE EDITOR
BENJAMIN KAZAN
Xerox Corporation
Palo Alto Research Center
Palo Alto, California
Advances in
Electronics and
Electron Physics
EDITEDBY
PETER W. HAWKES
Laboratoire d’Optique Electronique
du Centre National
de la Recherche Scient@gue
Toulouse, France
VOLUME 77
@ 1990 BY ACADEMIC
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CONTENTS
CONTRIBUTORS TO VOLUME 77 . . . . . . . . . . . . . . . . , . . . . . . vii
PREFACE. ............... .,................ ix
The numbers in parentheses indicate the pages on which the author’s contributions begin.
vii
This Page Intentionally Left Blank
PREFACE
The four chapters that make up this volume cover several fields of
electronics and electron physics. The opening survey, by Shinji Morozumi,
provides a broad survey of the history and present status of one of the most
important of the newer display technologies, the so-called “active-matrix”
type of liquid-crystal display. For many decades the cathode-ray tube (CRT)
has dominated the display field, especially where high-resolution, large-area
images are involved and particularly where full-color information is required.
Although a variety of new displays have gained acceptance during the past 10
to 15 years, for example gas plasma, electroluminescent, and liquid-crystal
types, inherent limitations make it unlikely, except for limited application
areas, that any of these will seriously challenge the CRT. However, by
integrating an array of thin-film transistors with a corresponding matrix of
liquid-crystal elements, a versatile new form of display has emerged that
overcomes many of the limitations of these other displays, offering the
possibility that images with picture quality comparable to that of cathode-ray
tubes can be produced. In addition, such displays have the added advantages
of being in the form of a flat panel whose size may vary from a few centimeters
to more than a meter. It is thus likely that these new displays will be of major
importance during the coming decade, not only for television but also for
computer and industrial applications.
The second chapter is concerned with a topic that is of considerable
practical importance: piezoelectricity and its applications in resonator and
oscillator design. The range of applications of piezoelectric devices is very
broad, too broad for all of them to be covered in a single chapter, and Jean-
Jacques Gagnepain has chosen to concentrate on resonators. The treatment is
detailed and his account is virtually an up-to-date monograph on the subject.
A short but important section is devoted to non-linear properties, for “non-
linearities . . . are at the origin of some of the most fundamental properties of
the materials.”
The third chapter is a further member of a series of occasional articles on
particular applications of the transmission or scanning electron microscope
(SEM). Here, the role of the scanning instrument in the, at first sight, unlikely
field of petroleum exploration is explained in great detail by J. M. Huggett. In
fact, the SEM has been in use in the petroleum industry for almost as long as
the instrument has been in existence for the examination of core samples. The
modes of operation employed have expanded over the years, and specimen
ix
X PREFACE
P. W. Hawkes
SHINJI MOROZUMI
I . Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 2
A . Historical Background . . . . . . . . . . . . . . . . . . . . 2
B. Basic Twisted-Nematic Liquid-Crystal Display Cell . . . . . . . . . . 4
C. Multiplexed Twisted-Nematic Liquid-Crystal Display Cells and Their Limitation 6
D . Advantages of Active-Matrix Liquid-Crystal Display Panels . . . . . . . 9
I1 . Evolution and History of Thin-Film Transistor-Addressed Liquid-Crystal Displays 12
A . Early Work on CdSe Thin-Film Transistors and Silicon-on-Sapphire Transistors 13
B. Transistor Arrays Based on Single-Crystal Silicon and Diode Arrays . . . . 14
C . Emergence of Silicon Thin-Film Transistors and Diodes . . . . . . . . . 15
I11. Key Factors in Thin-Film Transistors for Liquid-Crystal Displays . . . . . . 17
A . Fundamental Physical Arrangement and Operation of the Thin-Film . . .
Transistor Liquid-Crystal Display . . . . . . . . . . . . . . . . 18
B. Electrical Requirements . . . . . . . . . . . . . . . . . . . . 21
C. Structural Requirements and Fabrication Processes . . . . . . . . . . 23
IV. Characteristics of Different Types of Thin-Film Transistors and Thin-Film Transis-
tor Liquid-Crystal Displays . . . . . . . . . . . . . . . . . . . . 28
A . CdSe Thin-Film Transistors . . . . . . . . . . . . . . . . . . 29
B. Amorphous Si Thin-Film Transistors . . . . . . . . . . . . . . . 31
C. Polycrystalline Si Thin-Film Transistors . . . . . . . . . . . . . . 39
V . Driving Schemes for Thin-Film Transistor Liquid-Crystal Displays . . . . . . 47
A . “Point-at-a-Time” Data Transfer Method . . . . . . . . . . . . . . 48
B. “Line-at-a-Time” Data Transfer Method . . . . . . . . . . . . . . 50
C. Input-Signal Modification for Grey-Scale Operation . . . . . . . . . . 53
D . Large-Scale Integration Drivers and Their Connection to the Liquid-Crystal
Display . . . . . . . . . . . . . . . . . . . . . . . . . 54
E. Integrated Thin-Film Transistor Drivers . . . . . . . . . . . . . . 55
VI . Color-Image Thin-Film Transistor Liquid-Crystal Displays . . . . . . . . . 57
A . Structure . . . . . . . . . . . . . . . . . . . . . . . . . 58
1
.
Copyright 0 1990 by Academic Press Inc
All rights of reproduction in any form reserved.
ISBN 0- 12-014677-0
2 SHINJI MOROZUMI
I. INTRODUCTION
A . Historical Background
elements. These are also directly multiplexed displays making use of the T N or
the more recent supertwisted birefringence effect (SBE) liquid-crystal mode
(see Section 1.C). Although the latter provides somewhat improved viewing
characteristics, the overall viewing quality is still considered inadequate.
The continuing need for compact LCD TVs (Morozumi et al., 1984a) and
laptop computers with desirable viewing characteristics has thus stimulated
the research and development of active-matrix LCDs in which an active
element is incorporated at each picture cell (pixel). Although various types of
active elements have been explored, the greatest interest has been in TFT
elements, particularly those based on amorphous and polycrystallized silicon
TFTs. Although such TFTs have already been incorporated in pocket LCD
TVs, the screen size is still too small for more general applications. Present
activity is thus being directed at developing large-area TFT LCDs for larger-
size TVs and computer screens with picture sizes of more than 10 inches in
diagonal.
In the following sections of this chapter, liquid-crystal displays based on
such TFT elements (TFT LCDs) are discussed at length. In addition to the
material aspects of TFT elements and their performance characteristics, the
design, structure, and operation of complete TFT LCDs will be discussed.
Also included are the electrical driving schemes used and the application areas
of these displays.
Conductor
(a) (b)
FIG.1. The principle of the twisted-nematic liquid-crystal display (TN LCD):(a) without an
electric field, incident light can pass through the cell; (b) with the applied voltage, the light is
blocked.
layer, as shown in Fig. lb, the molecules are forced into a position parallel to
the electric field because of their dielectric anisotropy so that their long axes
become perpendicular to the plates. The polarized light entering the liquid-
crystal layer is now no longer rotated and is blocked by the upper polarizer.
Instead of the above arrangement, where the polarizers of the glass plates are
positioned with their axes perpendicular to each other (crossed polarizer
method), the parallel polarizer method, in which the axes of both polarizers
are parallel, is also possible. In this case, the optical effect of the applied
voltage is inverted. An example of the light transmission as a function of
voltage for the crossed polarizer method is shown in Fig. 2. As indicated, the
application of as little as 3-4 volts is sufficient to switch the cell from ON to
OFF.
Of importance to note in Fig. 2 is the fact that the change in light
transmission depends strongly on the viewing angle, and this may be a serious
problem when displaying an image with grey scale. This dependency is caused
by the partial tilt from parallel to perpendicular of the molecules at inter-
mediate voltages. For instance, when a voltage intermediate between the
O F F and ON state is applied to the cell, tilting the molecules by 45" with
respect to the plates, the curves of light transmission viewed respectively at
60",90°,and 120"to the glass plates differ from each other, since the molecules
have varying orientations with respect to the polarized light. If, however, a
voltage sufficient to fully shift the molecules to the perpendicular state is
applied to the cell, light is completely blocked and a good black state may be
achieved over a considerable range of viewing angles.
6 SHINJI MOROZUMI
0 1 2 3 4 5
Voltage ( V )
FIG.2. Optical response of a twisted-nematic (TN) cell with crossed polarizers to applied
voltage: cell exhibits a viewing-angle dependency in light transmission; a smaller angle gives a
steeper characteristic; in the case of parallel polarizers, these characteristics are inverted with
respect to applied voltage.
\Data Lines
Positive Negative
Field ield
k I
1
scan lines is made larger to increase the resolution of the display, the effective
voltage difference between ON and OFF pixels is reduced and the viewing
quality of the displayed information becomes poorer. This results from the fact
that the optical response of the liquid-crystal cells is determined by the rms
voltage, i.e., the integral of the square root of the voltage applied to them over
the time required to scan all the rows. In terms of the rms voltage, the ON
voltage V,, of a pixel can be expressed as (Alt and Pleshko, 1974):
V,, = J { k 2 V ; / M } + {(M - l)V$M}, (1)
where M is the number of scan lines. For an OFF pixel, the rms voltage V,,,
can expressed as:
V,,, = J{(k 2)'Vi/M)
- +
{ ( M - l)Vi/M}. (2)
The resulting ratio of V,,,/Kff, expressed by C, is then given by:
C = Jk2 + V t / ( k - 2)2 + V i . (3)
It can be shown that the maximum value of this ratio, C,,, is given when
k=&G+I. (4)
If this condition is satisfied, the maximum voltage ratio ,,C, becomes:
cmax = J(JM+ I)/(& - 1). (5 )
From Eq. (5), it can be seen that as the number of scan lines M increases,
,,C
, becomes progressively smaller and approaches unity. As an example, if a
value of M = 200 is inserted into Eq. (9,a voltage ratio ,,C , of 1.152 is
obtained. Assuming that the magnitudes of the ON and OFF voltages allow
them to fall on the steeply sloping portions of the curves of Fig. 2, the resulting
optical contrast ratio will be only 2.5 at a viewing angle of 60", whereas at
larger viewing angles, the contrast ratio will be reduced to a much lower level.
In order to alleviate this problem, attempts have been made to develop new
TN liquid-crystal materials as well as to optimize the cell structure and
fabrication process (e.g., surface alignment of molecules) to obtain cells with a
sharper threshold. However, it appears that for practical purposes, images
with acceptable contrast cannot be obtained for direct-drive dot-matrix TN-
LCD arrays with more than about 100 scanning lines. Recently, other
solutions have been proposed using a new phenomenon in nematic liquid
crystals, the supertwisted birefringence effect (Scheffer et al., 1985) as well as
new materials in the form of ferroelectric liquid crystals (Clark and Lagerwall,
1980). Although these approaches have advantages, they still present some
problems such as limited speed of response, difficulty in producing a good grey
scale, and difficulty of fabrication of the display as a result of the more critical
cell spacing.
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 9
D. Advantages of Active-Matrix Liquid-Crystal Display Panels
rode
(a) (b)
FIG.4. Configuration of TFT LCD: (a) thin-film transistors (TFTs), pixel electrode, gate
lines, and data lines are fabricated on lower glass substrate; upper glass plate has transparent
common electrode; the liquid-crystal material is confined between both plates; (b) LC material
acts as capacitor in each pixel.
10
\
-
Data Line
SHINJI MOROZUMI
\
Pixel
Electrode
(a)
\
Diode
Scan Line
-Glass
-LC
Material
.Glass
Data Line
I
-------1
Diode
I
I
-I------J
Pixel Pixel
Electrode
(b) (C)
FIG.5. Configurationof diode LCD: (a) thin-film diodes, data lines, and pixel electrodes are
fabricated on lower glass substrate; upper glass has stripe transparent electrodes as scan lines;
(b) each pixel consists of a bidirectional diode in series with a liquid-crystal element connected
between a scan line and data line; (c) current-voltagecharacteristicof bidirectional diode.
material are, in effect, subjected to a static drive signal during the entire frame
time. At the same time, the high resistance of the OFF TFTs of the array
eliminates cross talk, that is, it prevents signal voltages from building up across
liquid-crystal elements of other rows when they are not being selected. Due to
the above storage action and cross-talk-free operation, a high optical contrast
ratio can be obtained in accordance with the curves of Fig. 2, avoiding the
limitation of VJEff signals imposed by Eq. (5).
In the arrangement of Fig. 5, each data line is connected to a set of
bidirectional diodes that are in series with the pixel electrodes of a column of
liquid-crystal cells. In order to enable positive and negative signals to be
applied to each pixel during successive fields, diodes having a bidirectional
characteristic are employed. In this structure, a layer of liquid-crystal material
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 11
is confined between the pixel electrodes and the scanning electrodes oriented
horizontally. Operation of this type of display structure depdnds on the
availability of diodes that have a well-defined threshold in their current-
voltage characteristic and a steep slope beyond the threshold. During
addressing, the signals applied to the array are somewhat similar to those
employed for the array of Fig. 3. In the case of Fig. 5, however, the diodes
serve to prevent voltage from appearing across the liquid-crystal elements that
are not being addressed. In the case of elements being addressed, the combined
voltage across the data line and the scan line is assumed to exceed the voltage
threshold of the diode, allowing these liquid-crystal elements to be charged. As
in the case of the TFT array, if the OFF resistance of the diodes is sufficiently
high, a charge established across a liquid-crystal element may be retained for a
long period after the moment of addressing, thus permitting high-contrast
images to be obtained.
Aside from the high contrast ratio and wide viewing angle that can be
achieved by using the active-matrix concept, this approach allows the design
of display panels with a relatively large number of scan lines, e.g., 500 or more.
Also, since liquid-crystal elements without a sharp electro-optical character-
istic and small C,,, in Eq. ( 5 ) can be used in order to attain high contrast ratio,
other phenomena and materials than those associated with the twisted-
nematic effect may be used. In addition, the active-matrix approach allows
images with a much better grey scale to be produced than is possible with
direct-drive multiplexed operation.
Early arrays of TFTs employed cadmium selenide (CdSe) as the semi-
conductor for the conductive channel of the TFT. At present, the main efforts
are based on polycrystalline silicon (poly-Si) or amorphous silicon (a-Si) for
this purpose. Although the image quality of the TFT-type active-matrix
LCD is much higher than that of conventional direct-drive multiplexed LCDs,
the use of active-matrix addressing presents other difficulties. Display panels
with TFTs are inherently more complicated than those using the direct-drive
multiplexing method because of the added steps involved in TFT fabrication.
In practice, it is quite difficult to produce a TFT array with an acceptably low
number of defects. Since diodes in the form of thin-film elements involve a
simpler fabrication process than TFTs, active-matrix LCDs with diodes are
also receiving considerable attention. Typical of such diodes are metal-
insulator-metal (MIM) bidirectional elements and dual amorphous Si pn
diodes. Since their current-voltage characteristics are not quite ideal, the
actual grey-scale performance presently obtained with diodes may be
somewhat restricted. Though the emphasis in this chapter will be on LCDs
employing TFTs, a comparison between active-matrix LCDs with TFTs and
diodes will be discussed further in Section VI1.A.
12 SHINJI MOROZUMI
11. EVOLUTION
AND HISTORY
OF THIN-FILMTRANSISTOR-ADDRESSED
LIQUID-CRYSTAL
DISPLAYS
S i Thin-Film
u- (, poly& Amorphous)
0
L
0)
n
Varistor,MIM
E 5
z amorphous Si
0
'73 '14 '75 '76 '77 '70 '79 '80 '01 '82 '83 84 '05 '86
Year
FIG.6. Number of papers presented annually at the Society for Information Display (SID)
Symposia on active-matrix LCDs: TFT types are classified into CdSe and Te, MOS, and Si thin-
film categories; since 1982, papers on Si TFTs have received the most attention.
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 13
display panels based on MOS transistors. However, they appeared not to have
a high potential for practical use, because these LCDs had viewing limitations
due to the opaque substrate. In parallel with this work, diode elements were
proposed as active-matrixelements in order to solve problems associated with
the difficulty of transistor fabrication.
In the third period, from 1982 to the present time, a remarkably large
number of papers on arrays of Si TFTs appeared because of their ease of
fabrication and excellentcharacteristics.Furthermore, the demonstration that
full-color images could be achieved with Si-TFT technology greatly stimu-
lated the further development of active-matrix LCDs. This period exhibits a
flowering of the active-matrix LCDs with a long-term effort since 1971.
Actually, the commercial application of active-matrix LCDs to pocket TV
receivers has already begun.
In the next generation, explored during the 1970s, the use of MOS
transistors (instead of SOS technology) fabricated on a silicon single-crystal
wafer was investigated for small video LCD devices 1-2 inches in size (Lipton
et al., 1977). Such MOS transistors could be easily fabricated by means of
ordinary integrated-circuit (IC) technology, unlike SOS transistors. However,
since the silicon crystal substrate is not transparent and therefore prevents a
second polarizer from being positioned under the lower electrodes, the TN
mode (see Section LB), which produces the highest contrast ratio of all the
liquid-crystal operating modes, could not be applied. Initially, the dynamic-
scattering mode was employed (Yanagisawa et al., 1981),but this resulted in
problems of material degradation (see Section 1.A). Subsequently, the guest-
host mode (Heilmeir and Zanoni, 1968a),which involved use of a dye material
in addition to the liquid-crystal material, was employed for active-matrix
LCDs with MOS transistor arrays (Hosokawa et al., 1981, and Yamasaki
et al., 1982), since this eliminated the need for a rear polarizer. However,
this approach also had size and cost limitations similar to those of the SOS
technology. Furthermore, since the full-color display technique made possible
by the transmissive mode cannot be used, this approach has been almost
discontinued at the present time.
During this period, diode-type active elements were explored as an
alternative to transistors in active LCDs because of the difficulties in transistor
fabrication of the active elements and the limitations of display quality such as
contrast ratio. The object of such efforts was to achieve a simpler and easier
fabrication procedure than that associated with TFTs. The use of diodes also
seemed to present less of a stability problem than TFTs. One example is the
“varistor” diode array produced on a sintered zinc oxide (ZnO) substrate
(Castleberry, 1979).However, since the ZnO diodes required as much as 200
volts for driving and the ZnO substrate was opaque, problems similar to those
of the MOS-array LCD emerged and this work was not entirely successful. In
another approach, a MIM bidirectional diode array was fabricated on a glass
substrate (Baraff et al., 1980). The diodes used here consisted of tantalum-
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 15
anodic oxidized (Ta,O,), and chromium. These had quite stable electrical
characteristics, a sufficiently low threshold voltage to drive the TN liquid-
crystal material, and were easily fabricated on a large-area glass substrate,
making possible active-matrix LCDs that exhibited excellent display quality.
At the present time, MIM LCDs remain one of the promising solutions to
realize large-area, high-quality, and low-cost liquid-crystal displays. As an
example, small-size video LCDs (220 x 220) and large-size graphic LCDs
(400 x 640) have been developed with MIM elements(Morozumi et al., 1983b,
and Niwa et al., 1984).Aside from MIM diode arrays, developmentalefforts on
other diode-type active-matrix LCDs have been relatively small compared to
the efforts on TFTs.
small area, they were suitable vehicles for the study of the properties of
amorphous silicon films and enabled the optimization of the deposition
systems required for them. Resulting from the accumulated experience with
the deposition technique developed for producing amorphous silicon p-n
diodes for such solar cells, systems making use of plasma-enhanced chemical
vapor deposition (P-CVD) became available for production use. P-CVD
equipment allows a highly controlled amorphous silicon film to be fabricated
on a large-area substrate. Building on this background, the first suggestion for
amorphous silicon TFTs (Le Comber et al., 1979) led rapidly to the successful
research and development of active-matrix LCDs.
N-channel amorphous silicon TFTs based on electron conduction (in
which an electron mobility of around 0.1-1.0 cm2/V sec was obtained) were
selected at the very start. Initially, the OFF current was too high because a
thick film of 1 pm was employed. However, this problem was later corrected
by reducing the film thickness to below several hundred angstroms (Sunata
et al., 1985). Although the electron mobility of the amorphous silicon was
relatively low, films of this material exhibited an extremely high dark resis-
tance. The resulting TFTs thus had an extremely low OFF current as well as
an ON/OFF current ratio sufficiently high to make it useful as an active-
matrix element.
In early test samples of amorphous Si TFTs, their electrical characteristics
were lacking in reproducibility and shifted considerably in a short time. Efforts
to reduce this instability constitute the major element in the history of the
development of amorphous silicon TFTs. However, recently, with the use of
the continuous deposition method, whereby the gate insulator of the TFT and
the amorphous silicon semiconductor film are deposited during a single
pump-down, the stability has been improved sufficiently to allow the practical
use of such TFTs.
In addition to efforts to develop amorphous silicon TFTs, diode-type
active elements based on amorphous silicon, such as amorphous silicon p-n
diode rings (Togashi et al., 1984), were proposed and explored. These were
developed for the purpose of avoiding the stability problems associated with
amorphous silicon TFTs by making use of the symmetrically bidirectional
electrical characteristics achieved with groups of series or parallel diodes.
Aside from the succession of developmental efforts on amorphous silicon
films mentioned above, the fabrication method and properties of poly-Si films
were studied at around the same time. In the mid-70s, most of the MOS
transistors used in integrated circuits employed silicon gate technology in
which a doped poly-Si film made by the thermal decomposition of SiH4 gas
was utilized for the gate electrode material. This fostered the investigation of
various aspects of poly-Si films such as the grain size, grain boundary
properties, grain growth, and carrier mobility (Seto, 1975, Baccarani et al.,
1978, and Mandurah et al., 1979). During this period, low-pressure and low-
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 17
temperature-CVD (LPT-CVD)systems were developed for LSI production to
deposit silicon, silicon nitride, and silicon oxide films with high throughput
and quality. Since at pressures lower than atmospheric, silicon grains grow
even at low temperatures around 6WC, these systems made it possible to
deposit high-mobility poly-Si films at these low temperatures. Such materials
thus became of interest for TFTs having a structure similar to that of the MOS
transistor, whose stability had been investigated previously. Aside from their
potential use as active-matrix elements, the comparatively high mobility of
poly-Si films and the excellent switching characteristics of TFTs based on
these films suggested the possibility that poly-Si TFT driver circuits, as well as
active elements for the display itself, could be fabricated on a single substrate.
Both amorphous and polycrystalline Si TFTs have desirable features
compared to materials used in earlier TFTs. Since a silicon film consists of a
single type of atom as opposed to a chemical compound such as CdSe, whose
stoichiometry may be upset in processing, its controllability and reproduc-
ibility are quite good. In addition, deposition systems for silicon films capable
of high uniformity and throughput are readily obtained. Also, since silicon, a
nontoxic material, is commonly used as the semiconductor in the production
of ICs, the associated device technologies, design software, and production
equipment could easily be diverted to the Si TFT technology.
The most important factor in the production of active-matrix elements is
the yield, determined by the number of defects caused by nonoperable TFT
elements and open- and short-circuited metallization lines. Techniques for
minimizing the number of defects also profited from the production tech-
niques developed for LSI and very-large-scaleintegration (VLSI) used for such
products as the high-yield 256K-bit and the 1M-bit dynamic random access
memories (DRAM). As an example, the optical-projection system developed
for photo-exposure patterning in LSI and VLSI production is also very
effective for the fabrication of TFT arrays with a minimum of defects.
Active-matrix displays based on TFT arrays utilizing silicon thin films
have thus become the main stream of LCD development. Since 1984, such
LCDs with full color capability have been in commercial use for pocket-size
TV sets.
The TFT-addressed LCD has a much more complicated structure than the
direct-drive multiplexed TN LCD because of the TFT array. In realizing a
TFT LCD, many factors must be taken into account. These include the TFT
material, the TFT structure, and the fabrication processes involved. Although
18 SHINJI MOROZUMI
the structure, operation, and characteristics of TFTs are quite similar to those
of MOS transistors fabricated on a silicon single-crystal wafer, the fabrication
of a TFT array for an LCD involves, from some point of view, more
technological problems. Due to the nonsingle-crystal material used in TFTs,
the realization of the desired electrical characteristics becomes extremely
difficult. At the same time, the required uniformity and stability present major
problems. In addition, these arrays must be fabricated without defects that
result in nonoperating pixels on a glass substrate much larger in area than
a silicon wafer. For instance, in a 4 x 4-inch matrix display that contains
500 x 500 pixels, all 250,000 transistors must operate properly in order to
obtain a defect-free display panel. In this section, the key factors associated
with the TFT elements themselves are discussed.
,Common Electrode
Liquid-
Crystal Glass
Substrate
Sealing
TFT 'Pixel Electrode
I
Gate
FIG.7. Cross-sectional view of TFT LCD: the liquid crystal is driven by a voltage applied
between the common electrode on the upper glass plate and the pixel electrode connected to the
TFT; in the usual case where twisted-nematic (TN) liquid-crystal material is employed, polarizers
(not shown here) are placed on the outer surfaces of both glass plates.
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 19
contained between the glass substrates as a layer 5-7 pm thick. In operation,
the liquid-crystal elements are driven by AC voltages (accomplished by
polarity reversal of drive voltages of each field) applied between the pixel
electrodes and the common electrode. It should be noted that for proper
operation, the electrode surfaces must be suitably treated to appropriately
align the liquid-crystal molecules, and polarizers must be provided on the
external surfaces of both glass plates.
The circuit arrangement of the complete TFT LCD is shown in Fig. 8. As
indicated, there are (N x M) pixels addressed by N data lines and M gate lines.
The drive circuits for these lines may be located outside the display and
connected to these lines, or they may be integrated along the edges of the
display substrate, fabricated from TFTs based on the same semiconductor if
suitable characteristics can be obtained.
In operation, the gate lines are sequentially activated during a frame time,
turning on successive rows of TFTs. During the time a row of TFTs is turned
on, the signal voltages corresponding to that row are transferred from the
drive circuits to the pixel electrodes through these TFTs. After this row of
TFTs is turned off, the capacitive charges stored on the pixel electrodes (i.e.,
across the liquid-crystal elements) may be retained until this row is addressed
again if the OFF resistance of the TFTs is high enough (assumingthe leakage
through the liquid-crystal elements is small).
The equivalent circuit for one pixel is shown in Fig. 9. The liquid-crystal
material is represented as a resistor Rlq in parallel with a capacitor Clq
FIG.8. Circuit arrangement of TFT LCD: usually, the column and row drivers are
positioned along the four edges; gate lines correspondto scan lines, and display data is transferred
through the data lines to each pixel.
20 SHINJI MOROZUMI
VG Line
Pixel Electrode
VP
between the pixel electrode and common electrode. As indicated, the TFT as a
switching element has parasitic capacitances Cgs and Cgp between the gate
line and data line, and between the gate line and pixel electrode, respectively.
To prevent signals from the gate line capacitively coupling to the liquid-crystal
elements, Clq should be much larger than Cgp. In some designs, an additional
capacitance Ca is incorporated to avoid this problem. For a given O F F
Time
FIG.10. Driving waveforms for TFT LCD: one frame consists of a positive and negative
field. The input signal on an activated data line, e.g., D1,has a voltage swing V,; similar signal
voltages are applied to the other activated data lines in accordance with the picture content; the
gate line voltage is zero when nonselected, and V, when selected; V,,, is the signal voltage
appearing across the liquid crystal.
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 21
resistance of the TFT, such a capacitance also serves to increase the charge
storage time of a pixel.
Figure 10 shows an example of the driving waveforms and the resulting
signal on the pixel elements, V, is the amplitude of the gate signal and f V,
represents the signal voltage (whose polarity is reversed for each field) applied
to the data line. V,,, is the resultant pixel electrode voltage, with AV, being
produced by the capacitive coupling through Cgp of Fig. 9. By reversing the
polarity of the signal voltage each field, a DC voltage, which would con-
siderably shorten the life of the material, is prevented from appearing across
the liquid crystal. Although signal voltages of equal magnitude are applied
in each field, a large value of AV, (which is always of the same polarity) may
generate an undesirable asymmetry in the pixel voltage. In addition, such a
AVp may cause a large leakage current through the TFT due to the increase in
the voltage difference between the data line and pixel electrode. Therefore, in
addition to the reasons mentioned above, a small value of Cgp compared to
the total pixel capacitance is required.
B. Electrical Requirements
From Eqs. (6) and (7), the switching ratio, R = RT,,,/RT,,, must therefore be:
R > 1 x 104. (8)
This is the minimum requirement for proper operation of the TFT LCD. In
practice, a value for R of more than 10’ is necessary, since in extreme
environments, involving high temperature or high ambient light, the O F F
current of the TFT easily increases by a factor of 10 or more. Also, the ON
current might be degraded by aging of the TFT.
Figures l l a and b show typical characteristics of a poly-Si TFT. They
exhibit close similarity to the “gradual” model (Grove, 1967) for the
conventional MOS transistor governed by the following formulas:
Id = p{(VG - VTH)VD - Vi/2} (unsaturated region), (9)
Id = /?(V, - VTH)~/~ (saturated region), (10)
p = p c o x W/L, (1 1)
where V, is the gate voltage with respect to the source, V, is the drain voltage,
VTH is the threshold voltage, p is the carrier mobility, Cox is the gate
capacitance, and W/Lis the ratio between the width and length of the channel,
respectively. Relative to the MOS transistor, the amorphous or polycrystalline
silicon TFT has a smaller mobility and a higher threshold voltage because of
the larger density of trapping states in the channel region. On the other hand,
especially in polycrystalline material, the OFF current is larger than in the
MOS transistor because of the leakage current flowing through the traps
across the reversely biased p-n junction at the drain electrode.
0
I
a
-
v
3
n
5
-31- 0
-10 0 10 20 30 0 5 10 15 20
vG(v) vO(v)
(a) (b)
FIG. 11. Typical characteristics of a polycrystalline-Si TFT: (a) log of drain current (I,) vs.
gate voltage (Vo);(b) drain current (I,) vs. drain voltage (VD).
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 23
The required voltage for controlling the liquid-crystal element depends on
the material itself and its mode of operation. In the case of the typical TN
liquid crystal, the optical saturation voltage, as shown in Fig. 2, is around 3.5
volts. However, a writing voltage of more than 4 volts is required on the data
line to compensate for any decay in the stored charge. Since the available
voltage from the usual CMOS LSI driver is about 20 volts, the breakdown
voltage of the gate insulator is designed to be more than 20 volts. In addition,
an excess gate voltage swing may lead to misoperation as a result of the
parasitic capacitance Cgp in Fig. 9. When the TFT is turned on and off, a
spurious signal, determined by the ratio of (Clq + Ca) to Cgp, (shown by AV,
in Fig. 10) will be capacitively coupled to the pixel electrode. If Cgp is not
+
small, e.g., > 1/ 10 of (Clq Ca), this spurious voltage may become a problem.
The net voltage V,, between gate and source, assuming the waveforms
shown in Fig. 10, is given by:
VG, = VG - (12)
If V, is limited to 20 volts and V, is required to be at least 4 volts, the TFT must
have the required ON/OFF ratio expressed by Eq. (8), with the net gate
voltage of less than 16 volts for the ON condition and 0 volts for the OFF
condition, respectively.
In a two-level display with only O N and OFF elements, a low degree of
uniformity, for example a variation within a factor of 10 in the O N and O F F
currents of the TFTs, is allowed. On the other hand, a much better degree of
uniformity in TFT characteristics is required across the entire substrate for
high-quality video and computer displays intended for operation with a large
number of grey levels. Assuming that more than 20 grey levels are to be
achieved, the pixel optical transmission must be controlled to within less than
5%. If the TFT has uniform enough characteristics in its O N and OFF
currents, this may not be a serious problem. However if, for instance, one pixel
is to be written to 90% and another pixel to 95% of full brightness, variations
in O N current that cause a 5% difference in the written potential will cause
a nonuniformity in brightness corresponding to one grey level. Such a non-
uniformity may easily be recognized by the human eye. Likewise, the O F F
current distribution may influence the uniformity of brightness due to the
variation in the storage time constant. Thus, when a high-quality display with
a large number of grey levels is desired, much more stringent requirements are
imposed on the TFT characteristics than those indicated by Eqs. (6) and (7).
The production yield of the substrate with its TFT array fundamentally
depends on the TFT device structure and the fabrication processes employed.
24 SHINJI MOROZUMI
1. Device Structure
Generally, two types of TFT structures are used, the staggered type and
the inverted staggered type as shown in Fig. 12. In addition, a double-gate
structure (Farrah and Steinberg, 1967), in which gate electrodes are provided
on both sides of the thin-film semiconductor, has occasionally been in-
vestigated. Such structures enable a higher ON current to be obtained, since
conductivity is induced on both surfaces. However, this arrangement has not
been adopted in practice, because its fabrication is too complicated. In the two
types of TFT indicated in Fig. 12, at least four layers, the channel
semiconductor film, the layer from which the source and drain are fabricated,
the gate insulator layer, and the gate electrode layer, are necessary. In addition,
not shown in Fig. 12, a transparent conductive layer is required from which the
pixel electrodes are fabricated as well as a metallization layer for the data lines
and an insulating layer to separate the metallization layer from the gate
electrodes. Also, additional layers may be needed if an added capacitor in
parallel with the liquid-crystal pixel capacitance is necessary. In view of the
numerous fabrication steps, simpler structures could make the production
process shorter and increase the yield.
Although a thin gate insulator is desirable to obtain high ON currents for a
given gate voltage, this causes a lowering of the breakdown voltage. Such
breakdown can occur as a result of defects resulting from dust or flakes of
Rl Gate
Semiconductor
0 Source and Drain
0 Insulator
Glass Substrate
(a) (b)
FIG.12. Typical structure of a TFT:(a) staggered type; (b) inverted staggered type,
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 25
foreign matter incorporated during fabrication and also as a result of a
discharge due to static electricity, which is a more serious problem. In practice,
the thickness of the gate insulator is determined by compromising between
these two factors. The nature of the contact between the semiconductor and
the source and drain electrodes is another key factor in the performance of the
TFT, since a high contact resistance may reduce the O N current. Generally,
the use of an intrinsic or slightly doped semiconductor results in a nonohmic
contact. Whether or not the TFT requires an additional intermediate layer to
produce an ohmic contact is determined by the maximum contact resistance
that can be tolerated between the TFT drain electrode and pixel electrode.
2. Substrate Material
Since a primary requirement for the substrate is transparency, glass is
usually used. There are various kinds of glasses, the choice of which depends
on the processing temperature it must withstand, its acid resistivity, impurities,
and flatness. For the highest processing temperatures of up to 1l W C , quartz
substrates can be used. Hard glass such as Corning 7059 glass can be employed
at intermediate and low temperatures of less than 600°C. Soft soda-lime glass
can be used only at low temperatures.
For the photolithographic process used to form the patterns in each layer,
sulfuric acid, nitric acid, hydrochloric acid, etc., are used to etch away the
undesired portion of each deposited layer. The glass must be resistant to such
acids, otherwise it will be simultaneously etched, generating many fine cracks.
Impurities, particularly alkali metals such as Na and K, affect the stability of
the TFT characteristics in the same manner as in MOS transistors if they are
allowed to penetrate into the channel material and insulator region. Since this
is often the case, the glass surface is coated with a Silicon Oxide (SiOJ film.
This prevents etching of the glass and diffusion of contaminants into the TFT.
The flatness of the glass is also very important for the assembly of a
satisfactory liquid-crystal cell. For a complete TN LCD, the spacing variation
between the plates must be less than 0.2 pm. This requires the short-range
deviation in the flatness of the glass to be less than 0.2 pm. However, a long-
range warpage of more than 10 pm can be tolerated, since the flexibility of the
plates allow them to be bent during cell assembly, retaining their spacing
uniformity with the aid of small internal spacers distributed over the display
area.
3. Elimination of Defects
The problem of defects is the most important factor determining the
fabrication yield and cost. Various types of defects are observed in active-
matrix LCDs. Some are defects in the TFT itself due to breakdown of the gate
26 SHINJI MOROZUMI
insulator that cause the TFT to remain permanently ON or OFF. Others arise
from short circuits at cross points between the gate and data lines, caused by
damage from an electrostatic discharge or from defective patterns produced
during photolithography. Also, open circuits caused by defective photoli-
thography may arise in the data and gate lines.
During the photolithographic process, several photomasks are used to
produce the TFT and active-matrix substrate patterns. Figure 13 shows the
three types of photolithography that can be used: contact, proximity, and
projection. During optical exposure, defects may arise as a result of the
detachment of photoresist material from the substrate and transfer to the
photomask, dust on or in the photoresist, dust and flakes on the substrate, and
transfer of other small particles from the substrate to the photomask. Once
such materials come in contact with the photomask, they are hard to remove,
since brushing the surface of the photomask may cause new damage. After
repeated use, defects on the photomask gradually accumulate if the mask is in
contact or near the substrate. To avoid such defect generation in the mask,
projection exposure is preferred, since the mask never touches the substrate.
With the employment of this method, it has been shown that defects generated
during photolithography can be greatly reduced.
Usually, during deposition, the film is deposited not only on the substrate
but also on areas around the substrate, such as substrate holders, electrodes,
chamber walls, etc. This material may fall on the substrate as flakes, causing
defects. Therefore such flake generation has to be considered when choosing
the deposition system. For example, P-CVD systems for producing amor-
phous Si films easily generate flakes and require an appropriate design or
other means to suppress them.
Photoresist
0 Patterned Layer
Photo-Mask
I I
4. Environmental Problems
In many cases, LCDs must endure harsh environmental conditions, such
as high or low temperature, high humidity, and strong ambient light. These
conditions may cause problems with the TFT itself or the liquid-crystal
material. In some cases, the LC material limits the temperature-operating
range. At low temperature, the response time of the LC material may become
too long, whereas at high temperature, the RC time constant may be dgraded
because of the decrease of its resistivity. In addition, the LC material may
suffer from high humidity if it is not completely protected from the outside
environment. In fact, moisture may penetrate into the LC material through the
edges of the display panel where the glass plates are sealed together, requiring
the choice of a suitable moisture-resistant LC material. Since the metallization
layers and other layers associated with the TFT may be damaged by moisture,
causing open circuits in the data and gate lines as well as a shift in the TFT
characteristics, they may have to be covered with some kind of passivation
layer.
Usually, at high temperature or under strong ambient light, the OFF
current of the TFT increases. In such cases, the leakage current through the
TFT must still satisfy Eq. (6). For example, the leakage current of the TFT
doubles with every 10-degree rise in temperature, assuming the activation
energy of the semiconductor film to be about 0.6 eV. If the TFT LCD is
required to operate up to 6 0 T , the leakage at room temperature must then be
less than 1/10 of the value indicated by Eq. (6).
Generally, if the LCD is viewed in the reflective mode, it may be placed in
direct sunlight. On the other hand, if it is viewed in the transmissive mode with
back lighting, the illumination level of the backlight will have to be about ten
times greater than sunlight if the display is designed to be visible in sunlight.
However, the actual intensity of the backlight reaching the TFT will be a half
or a quarter of the full backlight level because of absorption by the rear
polarizer as well as the internal color filter layers (see Section VI) if the display
is designed for color. The leakage current I, induced by light is determined by
the photo-generated carriers created in the channel region,
I , = W/Lnqp E/hvz{ 1 - exp( - at)} V , , (13)
28 SHINJI MOROZUMI
where Wand L are the channel width and length respectively, n is the quantum
efficiency (chargecarriers produced per absorbed photon), q is the unit charge
of an electron, p is the mobility of the carriers (one of which is assumed to be
mobile), E is the light power, v is the average frequency of the light, z is the
carrier lifetime, a is the optical absorption coefficient, t is the thickness of the
semiconductor film between source and drain, and V, is the drain voltage
relative to the source. As indicated by Eq. (13), channel-region semiconductor
films with small values of a and t have a smaller photo-induced leakage
current. It is therefore obvious that a very thin semiconductor film is useful to
reduce such current. In cases where the photo-leakage current is too large, a
light shield in the form of a metal film may be deposited over each TFT to
reduce this current to an acceptable level.
5. Reliability Problems
Conventionally, the reliability of MOS transistors on a Si single-crystal
wafer is evaluated by means of the bias-temperature (BT) test, in which
maximum-rating DC voltages are applied at elevated temperatures between
gate and drain and between source and drain. Under these conditions, the
activation energy for the transistor degradation at different temperatures is
calculated. From this, the lifetime at room temperature can be determined.
The lifetime may be defined as the time required for a specific shift of the
electrical characteristics to occur, for instance a 2- 3-volt shift in the threshold
voltage, a several-times increase of the OFF current, or a similar decrease of
the ON current. The lifetime of a TFT can similarly be determined. In the
operation of the TFT LCD, the TFT is always driven by a pulse signal. If the
pulse-temperature (PT) test is used instead of the BT test, the measured
lifetime becomes much longer. However, it is not clear which method is most
accurate. The required lifetime of an LCD depends on the application.
Typically it is more than 1,000hours, but in some cases, it may be more than
10,000 hours.
IV. CHARACTERISTICS
OF DIFFERENT
TYPESOF THIN-FILM
TRANSISTORS
AND THIN-FILMTRANSISTOR
LIQUID-CRYSTAL
DISPLAYS
Source Drain
Gate
Glass
2. Characteristics
The conductivity of a CdSe TFT can be understood by means of a model
involving a polycrystalline semiconductor with grain boundary trapping
(Levinson et al., 1982).Here, it is assumed that the current flowing through the
film is governed by thermionic emission above the barrier height formed at the
grain boundary. For small drain voltages, this model applied to the TFT has
exhibited good agreement with experiment.
The field-effect carrier mobility reported for CdSe TFTs is slightly different
from publication to publication, but in each case, the ON/OFF ratio reported
was more than lo4. In one example, the mobility was found to be in the range
of 40-100 cm2/V sec when the thickness of the CdSe film was about 500 A
(Lee et al., 1983). Generally, CdSe TFTs have had poor reliability. For
example, with a DC bias gate voltage, the electrical characteristics of CdSe
TFTs tend to shift in a short time. However, in the early work on the
uniformity and stability of this material under the accelerated life test, it was
concluded that CdSe exhibited adequate stability and uniformity for display
devices (Brody et al., 1975). The OFF current stability was investigated using
an 80-100-&thick CdSe semiconductor with a double-gate structure using a
1000-A-thick A1203 film together with a 3000-A-thick SiO, film for the top
insulator and a 4000-A-thick A1203 film for the bottom insulator (Luo et al.,
1981). The leakage current in the O F F state of this TFT was 2.5 x lo-',
ampere, giving an ON/OFF current ratio of 2.7 x lo'. DC and dynamic life
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 31
tests in the O F F state showed that this TFT performed better under actual
operating conditions than under DC conditions.
2. Characteristics
The characteristics of the amorphous Si TFT are mostly determined by the
threshold voltage and the mobility of the semiconductor. The threshold
voltage, which is about 1-5 volts, is determined by the thickness of the gate
oxide, interface state density in the region between the gate insulator and the
amorphous Si layer, and the density of states within the semiconductor film.
The mobility,determined by the electrical properties of the amorphous Si film
itself, is almost the same for measurements by different laboratories; 0.1-
0.3 cm2/V sec. The OFF resistivity is quite high-more than 1014ohm cm. In
most cases, the ON/OFF current ratio is around lo6,which is sufficient for use
in active-matrixLCDs as discussed in Section 1II.B. Theoretical analyses were
made on the state density in hydrogenated amorphous silicon (a-Si:H) films
(Kishida et al., 1983,and Suzuki et al., 1982).According to the work of Kishida
et al., reduction of the gap-state density near the conduction band edge is
necessary in order to obtain a high ON/OFF current ratio.
In an early paper (Snell et al., 1981),the characteristics of the amorphous Si
TFT and its application to LCDs were investigated. Figure 15 shows the
structure of this device. An I T 0 layer is deposited on the Corning glass and
then patterned by photolithography to provide transparent conductive pixel
electrodes for driving the liquid-crystal element. A chromium film is then
evaporated and undesired areas are etched away to form the gate electrode.
Next, a 5000-A-thick silicon nitride film and an amorphous Si film are
deposited in sequence by means of an RF gIow discharge, and the unwanted
areas are etched off. Finally, an aluminum metallization layer is evaporated
and patterned to form the source and drain electrodes and data lines. In this
structure, no light shield was employed. The channel length (source-to-drain
distance) was 500 pm and the width of the source and drain electrodes was
40 pm. The transfer characteristics of this transistor, indicated by the drain
34 SHINJI MOROZUMI
a-Si
FIG. 15. Design of a-Si field-effect transistor element: (a) section through device; (b) FET in
part of the matrix array (ITO: indium-tin-oxide squares, G: gate electrode, D: drain electrode, S:
source electrode, A: contact hole etched through sillicon nitride film). (Figure 1 from Snell et a!.,
1981. Copyright 0 1981 Springer-Verlag.)
lo-' d
10-6 -
I
10-0 -
10-10-
10-12
-10 0 10 20 30 40
VC (v)
FIG. 16. Transfer characteristics of a-Si FET elements: the drain current I , is plotted
against the gate voltage V, for three drain potentials V., (Figure 2 from Snell et al., 1981.
Copyright 0 1981 Springer-Verlag.)
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 35
current I , as a function of gate voltage V, for 2, 10, and 20 volts of drain
voltage V,, are shown in Fig. 16. As indicated, the OFF current at zero gate
voltage is below lo-" ampere, the ON/OFF current ratio is about lo6, and
the threshold voltage is around 5 volts. Calculations indicate the field-effect
mobility to be around 0.4 cm2/V sec.
The effects of photoconductivity on the amorphous Si TFT are shown
by the transfer curves of Fig. 17 (Sugata et al., 1983).For this TFT, a 0.3-pm-
thick silicon nitride film was used as a gate insulator. The amorphous Si
layer was 0.2 pm thick, and a 0.1-pm n + layer was used to make ohmic con-
tact. These layers were deposited in succession by means of a glow discharge.
The gate electrode, and source and drain electrodes consisted of 0.1 and
0.5-pm-thick aluminum, respectively. The channel length was 16 pm and the
width was 4800 pm. The threshold voltage was 3 volts and the mobility was
0.3 cm2/V sec. At zero gate voltage, under illumination with a 2,500-lux
tungsten lamp, the O F F current without a light shield was more than lo3
lo+, I I I I 1
lo-"
0 10 20
VG (v)
FIG. 17. Characteristics of a-Si TFT:dotted curve represents the characteristics of TFT with
a light shield under illumination from a 2500-lux tungstenn lamp; solid curve shows character-
istics in dark. (Figure 2 from Sugata et al., 1983. Permission for reprint, courtesy Society for
Information Display and the Institute of Television Engineers of Japan.)
36 SHINJI MOROZUMI
times higher than in the dark state. However, by employing a light shield,
the photo-induced current increased less than 10 times as shown in Fig. 17.
By using a very thin amorphous Si film, it was shown that the light-shield
layer could be eliminated (Sakai et al., 1985, and Sakai et al., 1986). Figure 18
shows the structure and characteristics of such a TFT. First, a 50-nm-thick
gate electrode of chromium is sputtered. A 300-nm-thick silicon nitride film
and 40-nm intrinsic amorphous Si layer are then deposited by plasma-
enhanced CVD. Following this, the source and drain electrodes are formed
using a 10-nm-thick n + intermediate layer and a 100-nm-thick silicon-
containing aluminum layer. The channel length was 8 pm and the width was
30 pm. In Fig. 18b, the drain current ID as a function of the drain-to-source
voltage V,, is shown for gate voltages V, of 0 and 20 volts. This TFT exhibited
a threshold voltage of 3-5 volts and a mobility of 0.5 cmZ/Vsec. As shown in
Fig. 18, by employing a very thin amorphous Si film, an O N / O F F current
(a)
ID(A)
1E-05
decade
/div
1E-13
00.00 20.00
VDS 2.000/div(v)
(b)
FIG. 18. Structure and characteristics of a-Si very-thin-film transistor: (a) cross-sectional
view of device with thin 40-nm a-Si layer; (b) typical electric characteristics of device; curves (1)
and (2) show OFF characteristics in the dark and when illuminated with a fluorescent lamp of
10E4 lux, respectively. VDS is drain to source voltage. (Figures 1 and 2 from Sakai et al., 1985
Copyright 0 1985 IEEE.)
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 37
ratio of more than lo4 was obtained under illumination of a 10,000-lux
fluorescent tube.
Although the initial characteristics of amorphous Si TFTs measured just
after fabrication are good enough for use in an active-matrix LCD, their
uniformity and stability present major problems. The uniformity depends
mainly on the manufacturing equipment, but the stability is associated with an
undesirable physical property of the amorphous state semiconductor. In
studies of amorphous Si TFTs (Powell, 1983), it was shown that charge
trapping in the silicon nitride gate insulator layer caused a shift only in the
threshold voltage, but not the mobility, as a result of changes in the voltage
bias condition. For example, at a gate voltage of 12 volts, and at 70°C, Powell
observed more than a 3-volt shift of the threshold voltage within 5 seconds.
This shift did not exhibit a simple log-time dependence, but was a more
complicated function of time. It was concluded that such instability was
caused by the injection of electrons from the semiconductor channel into the
gate insulator with an activation energy of 0.3 eV. In other work (Ast, 1982),a
similar instability was observed by trapping electrons in the amorphous Si and
gate insulator, and detrapping by the light. Here, the illumination dependency
of the drain current decay due to such trapping was shown. In the dark
condition, drain current decay of up to one order of magnitude was observed
within 100 hours using the 10% duty cycle pulse measurement. In the
illuminated condition, the drain current decay reached a maximum of
only 113.
Counter Electrode I T 0
Aligning L a y e r
FIG. 20. Black-and-white photograph of a TV picture displayed on full-color LCD with very
thin 40 nm a-Si layer: the number of pixels is 220 x 240, and the contrast ratio is more than 30:l.
(Figure 4 from Sakai et al., 1985. Copyright 0 1985 IEEE, and courtesy Seiko Instrument and
Electronics Ltd.)
There are two types of poly-Si TFTs, depending of whether they are
subsequently processed at high or low temperature. The former employ a
thermally grown oxide and are fabricated at 800°C or higher on a quartz
substrate although a novel glass substrate capable of withstanding 800°C has
also been employed (Troxell et al., 1986).The latter employ a CVD-deposited
SiO, film as the gate insulator and are fabricated at less than 600°C on a hard-
glass substrate, such as Corning's 7059.
Figure 21 shows the fabrication steps employed in making a high-
temperature-processed poly-Si TFT, using four levels of photomask to
complete the TFT. This process is quite similar to that used for the Si-gate
MOSFET and is also easily performed, since all the manufacturing equipment
used for LSI production can be employed. A 1500-3000-1&thick poly-Si film
is first deposited. The undesired areas are then etched away by photolithogra-
phy with a first photomask, leaving the source, drain, and channel regions.
Following this, the gate insulator layer is grown in a dry 0, atmosphere. The
poly-Si film for the gate electrode is then deposited and removed except in the
Poly- Si
,-Gate Electrode
Insulator (SiOZ)
(C 1
FIG. 21. Fabrication process of a high-temperature-processed poly-Si TFT: (a) poly-Si film
is deposited by LPT CVD on the quartz substrate and patterned; (b) after thermal oxidation of the
first layer of poly-Si, a second poly-Si layer is deposited and patterned to form the gate electrode.
Following this, self-aligned source and drain regions are formed in the first poly-Si layer by ion
implantation; (c) after a second SiO, deposition, contact holes are opened to the source and drain
regions; (d) I T 0 is sputtered and patterned to form the data line and pixel electrode.
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 41
area of the gate electrode with a second photomask. Phosphorous ions are
then implanted in the source and drain regions to form a low resistance layer
and to enable ohmic contact to be made to the external conductors. In this
process, the poly-Si channel region below the gate electrode is shielded from
the phosphorous ions. Next, a 5000-8000-A-thick Si02 film is deposited by
CVD, and contact holes are opened to the source and drain regions with a
third photomask. Finally, the I T 0 layer used to form the pixel electrode and
data line is sputtered and patterned by photolithography with a fourth
photomask. Because of the self-aligningprocess used in fabricating the source
and drain electrodes, whereby the gate electrode acts as a shield for the
phosphorous ions, there is minimum overlap between these electrodes and the
gate, reducing the parasitic capacitances between these electrodes.
The structure of a low-temperature-processed poly-Si TFT is shown in
Fig. 22. This is also carried out with four photomasks (Morozumi et al., 1986b).
First, a 1500-A n+ layer of polycrystalline Si is formed on the hard-glass
substrate with a first photomask. Then, a 100-500-A-thin undoped poly-Si
layer is deposited by LPT CVD, and undesired areas are etched away except
for the channel region and the source and drain contact regions to the n+
poly-Si layer, using a second photomask. Next, a 2000-&thick I T 0 layer
is sputtered and patterned with a third photomask to provide the pixel
electrodes and data lines. After cleaning the surface of the poly-Si layer, the
gate oxide is deposited by CVD. Finally, the I T 0 layer for the gate electrodes
and gate lines is sputtered and patterned with the fourth photomask.
Other low-temperature methods to fabricate poly-Si TFTs making use of
molecular-beam deposition (MBD) and electron-beam gun (E-gun) evapora-
tion for the growth of the poly-Si film have also been developed. In the MBD
method (Matsui et al., 1980),the silicon film was deposited under ultrahigh-
vacuum conditions on the order of Torr. The film could then be easily
undoped poly-Si
\
glass
FIG.22. Structure of low-temperature-processed poly-Si TFT: a hard-glass substrate can be
utilized since the maximum process temperature is 600°C; contact resistance between the channel
under the gate electrode and the nf poly-Si layer is small, allowing high ON current to be
obtained.
42 SHINJI MOROZUMI
2. Characteristics
In general, the electrical characteristics of amorphous Si or poly-Si films
are determined by the states or traps in the band gap of the semiconductor
material itself. According to the analysis of field-effect phenomena in poly-Si
films (Kamins, 1972), the gap-state density near the Fermi level (deep defect
levels) is the dominant factor in determining the threshold voltage. On the
other hand, it is obvious that the electron mobility is influenced by the
scattering of the free carriers by the gap states near the conduction band edge.
Comparing the gap-state density between the a-Si:H (Suzuki et al., 1982) and
the poly-Si films (de Graaff et al., 1982), it has been found that the a-Si:H film
has much higher density near the conduction band edge than near the Fermi
level, whereas the poly-Si film has a relatively uniform distribution of gap
states within the forbidden gap. Here, the Fermi level is almost the same as the
intrinsic level, because the semiconductors for TFTs employ undoped or
lightly doped films. With respect to amorphous Si films, such densities in poly-
Si films are lower near the conduction band edge, and higher near the Fermi
level. As a result, the poly-Si film has much higher mobility, over 10cm2/Vsec,
and relatively higher threshold voltage, 5-7 volts, than the amorphous Si film.
As mentioned in Section IV.B.2 in connection with a-Si TFTs, the threshold
voltage can be affected either by interface states between the semiconductor
film and gate insulator or by charges trapped in the gate insulator.
The above-mentioned gap states of poly-Si films, which determine the
TFT characteristics, result from the properties of the grain boundaries.
Investigations of this subject (Depp et al., 1980, and Levinson et al., 1982) have
shown that the trap density located at the grain boundary influences the
carrier mobility as well as the threshold voltage of the TFT. In both
investigations, the drain current of poly-Si TFTs was calculated by using
models with appropriate trap density, resulting in good agreement with
experiments.
Although the poly-Si film has a higher carrier mobility, more than
10 cm2/V sec, compared to the amorphous Si film, its OFF resistance in the
dark may be too low because of its small band gap and large carrier density
as compared with the amorphous Si film. However, in the illuminated con-
dition, poly-Si TFTs have a much lower photo-induced leakage current than
amorphous Si TFTs. Whereas the energy band structure of amorphous Si
corresponds closely to the direct transition type in accordance with measure-
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 43
ments of the optical absorption coefficient (Carlson and Wronski, 1979), that
of polycrystalline Si seems to be of the indirect type as in the case of single-
crystal Si. These authors found the absorption coefficient .of amorphous Si
films to be more than an order of magnitude larger than that of crystalline Si,
consistent with the fact that the polycrystalline Si films exhibit an indirect
transition (Moss et al., 1973).This explains why the photo-leakage current of
poly-Si TFTs is much smaller than that of amorphous Si TFTs.
In order to reduce the OFF current in the dark to the required low level, a
thin poly-Si film of less than lo00 8 has been used as well as a dual-gate
structure as explained below. Both approaches are also effective in reducing
the photo-leakage current of poly-Si TFTs to the level where they can be used
without a light-shield layer.
The typical characteristics of poly-Si TFTs prepared by both the high-
temperature and low-temperature processes described in Section 1V.C.1 are
shown in Fig. 23. The thickness of the poly-Si films is 650 8 and 250 8,
. Vos=4V
Single Dual
!I
-c.'
C
e
l
I
L
3
0 High Temperature Process
Single Gate, Dark
n Dual Gate,Dark
__---Dual Gate,100,000lux
-12
I
respectively, with the gate oxide thickness being 1500 A for both. In both dual-
gate TFTs, with a channel length of (15 pm + 15 pm) and a channel width of
10 pm, the ON currents exceed 1 pA, whereas the OFF currents are below
1 PA, resulting in an ON/OFF current ratio that reaches lo6. Even when
illuminated with 100,OOOlux,the poly-Si TFT has a ratio of more than lo5.It is
thus clear that the dual-gate TFT is effective in reducing the O F F current
compared with a single-gate TFT of the same total channel length, especially
when a large negative gate bias is applied to the TFT.
As shown in Fig. 23, in the dual-gate structure, two TFTs are connected
serially and their gate electrodes connected together. In the case of n-channel
TFTs, for example, a p-type accumulation layer is formed at the surface of
the channel when a negative gate voltage is applied. In this condition, lateral
n-p-n junctions are induced, assuming n-type source and drain electrodes.
If positive drain voltage relative to the source is applied, the O F F current is
determined by the leakage current through the reverse-biased p-n junction at
the n-type drain electrode. Because of the large trap density in the poly-Si film,
the leakage current through the reverse-biased p-n junction increases
exponentially with the applied drain voltage. The dual-gate TFT arrangement
thus results in a tenfold decrease in the O F F current at a negative gate voltage
of 10 volts due to halving the applied drain-to-source voltage across the TFT
section (assuming the total length of the channel region is fixed).
The thickness of the poly-Si film has much to do with the drain current of
poly-Si TFTs. Such thickness dependency is shown in Fig. 24(Morozumi et al.,
1985). As the film becomes thinner, the OFF current decreases in both the
illuminated and dark conditions due to the decrease of cross-sectional area
and corresponding leakage carrier generation. At the same time, the O N
current increases because of the reduction of the threshold voltage, which
changes from 8 volts at a thickness of 1000A to 5 volts at 500 hi. The reason for
this is as follows. The threshold voltage is defined as the gate voltage required
to capacitively induce free carriers at the semiconductor channel surface and
space charge in the body of the semiconductor through the gate insulator to
turn on the TFT (Kamins, 1972). Although the number of surface carriers is
determined by the gate potential and independent of the semiconductor film
thickness, the number of space charges depends on the semiconductor film
thickness where this thickness is smaller than the space charge depth. Thus, as
the thickness of the poly-Si film decreases, the required space charge depth to
turn on the TFT also becomes smaller and the threshold voltage is
subsequently reduced. Accordingly, an ON/OFF current ratio of more than
10' in the dark can be obtained with a thickness below lo00 A.
Laser crystallization (Juliana et al., 1982), laser recrystallization (Nishi-
mura et al., 1982), and hydrogenation (Kamins and Marcoux, 1980) of the
poly-Si film are all effectiveapproaches to improve the ON current of the poly-
Si TFT. In the laser-recrystallization method, grains in the poly-Si film are
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 45
10-~
-5
1o - ~
10-8
L ON Current
*
S
W L = (15+15)u rn
:
3
lo-' W = lOum
V vDS=4v OFF Current
._
C tox = l500A
2
0
lo-"
10-1*
.,-I3
1U
Poly-Si thickness ( 8 , )
FIG.24. Dependence of poly-Si TFT characteristics on film thickness: with a thickness of
less than 1,OOO A, the ON current is drastically increased due to the space charge reduction in the
poly-Si film; the OFF current is also reduced by the thinner poly-Si film.
fused and regrown to a larger size when scanned with a CW argon laser beam,
resulting in a much higher electron mobility of up to 300 cm2/V sec. By
employing hydrogenation, in which the poly-Si film is treated in a hydrogen
plasma to reduce the number of grain boundary defects, the field-effect
mobility has been increased up to 34 cm2/V sec and the threshold voltage
decreased to 8 volts.
Generally, the stability and reliability of a TFT are determined by the
semiconductor film, gate insulator film, and the associated interface. In the
case of the poly-Si TFT, the properties of both the gate oxide and the interface
between the gate oxide and the poly-Si film are the dominant factors
determining the stability, since the poly-Si film itself is stable at room
environment due to its monoatomic structure and high crystallization or
recrystallization temperature, which is assumed to be more than 600°C.
Usually, the instability of the electrical characteristics is caused by a short- or
46 SHINJI MOROZUMI
long-term shift of the density of states in the oxide and at the associated
interface. Such a shift is strongly related to carriers being trapped or released
from the traps. In the case of high-temperature processing, where a thermally
grown oxide is used as a gate insulator, poly-Si TFT has a stability (Morozumi
et a]., 1983a)similar to that of the conventional MOS transistor fabricated on
a Si single-crystal wafer, since such oxide has a state density much smaller than
that of other gate insulator films. In the case of poly-Si TFTs fabricated by
the low-temperature process, the deposited oxide has a higher state density,
especially at the interface. However, with careful deposition of the oxide so as
to almost maintain stoichiometry, as well as using a suitable cleaning
treatment for the surface of the semiconductor just before the deposition, a
lifetime of four years at 60°C with DC bias has been obtained (Morozumi et al.,
1986a).
is easier than in the case of amorphous Si TFTs. With the advances being
made in low-temperature-processedpoly-Si TFTs, TFT LCDs of much larger
size and including integrated drivers are expected in the coming few years.
Details of the integration of the driver circuits are discussed further in
Section V.E.
v. DRIVING TRANSISTOR
SCHEMES FOR THIN-FILM LIQUID-CRYSTAL
DISPLAYS
GI
G2
G3
Gu
Di D2 D3 DN
FIG. 26. “Point-at-a-time” driving scheme: the switch array TI-TN and capacitors Cd
comprise the sampler and holder (sampler/holder) array; signals S,-S, sequentially activate the
sampler/holders in order to latch the display data on the video signal.
CLX
STX
s1
s2
Video
0-
- m--m - YTS
- I G
- 2G
V i d e 0
positive
-
field
k
--.
negative
field
4
I( Y
Dl- -o 1 trame
D2 0-.
(a) (b)
FIG.27. Driving waveforms for the “point-at-a-time’’ method: (a) the operation for a period
of one scanning line: Gate pulses S,-SN sample the video signal and hold it for full period of one
scanning line; (b) the operation for one frame: One frame consists of positive and negative fields to
drive the liquid-crystal material with the alternating voltage swing.
50 SHINJI MOROZUMI
These transistors together with their associated capacitors Cd, act as sampler/
holders and latch the instantaneous signals as voltages in the capacitors Cd.
These signal voltages are stored on the data lines D, -DN until the next acti-
vation of the sampler/holders and during this time are transferred to the
corresponding pixel electrodes through their associated TFTs in the ON
state. The transistors Tl - TN of the sampler/holders must respond to the
pulses Sl-SN, usually within a few hundred nsec, in order to charge or
discharge the capacitors Cd. However, several psec are allowed to transfer the
signals on the data lines through the pixel TFTs to the pixel electrodes, since
this transfer can take place during an entire line time.
During operation of a frame (Fig. 27b), the pulses to drive the successive
gate lines GI-G, are sequentially generated by the row shift register, which is
synchronized with the clock pulse CLY and started with the pulse STY. After
completing the scanning of the gate lines with positive video signals applied to
the data lines (producing a positive field), the scanning is repeated with video
signals of reversed polarity applied to the data lines (producing a negative
field) to create a complete frame.
This addressing method was applied to a commercial TFT LCD for a color
pocket television receiver with 240 (horizontal) x 220 (vertical) elements. The
display was provided with two column-driver LSIs, each with 120 output
channels, located on the upper and lower sides of the display panel, respec-
tively, with an interlaced connection to the data lines. These driver LSIs
were driven by NTSC signals. The frame rate was 30 hz and the period for one
scan line was about 64 psec, resulting in a point (pixel) addressing rate of
approximately 3 MHz. The +4-V video signal was applied to the data input
terminal of the display, and the voltage applied to the gate lines was about
20 volts. Since this addressing scheme can be realized by a simple circuit
configuration as shown in Fig. 26, as many as 120 output channels can easily
be integrated on a small silicon chip less than 25 mmz in size.
With the “line-at-a-time” method, the data line is driven for the full period
of one scan line. Operation is otherwise the same as in the “point-at-a-time’’
method. In this method, the signal is latched in a digital or analog latch array
before being applied to the data line buffers. If the display requires grey scales,
analog latches or equivalent circuits are used. In the case of a “bi-level”display
without any grey levels, digital latch arrays are sufficient. Due to the use of
latch arrays, the display signals are input to the column driver in one period of
the scan line, and are output through the latch array to the data lines in the
next period. Although such input and output operations require two periods,
the input operation for line (rn + 1) and output operation for line (rn) are
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 51
carried out in the same time period. As a result, the total addressing time
required is same as that of the “point-at-a-time” method.
The “line-at-a-time” driving scheme without grey scale, shown in Fig. 28, is
the simplest driving method. During the line time when gate line (m - 1) is
selected, the column shift register in the column driver serially transfers the
digital display data DX for line (m)with the shift clock pulse CLX. After this
input is completed, all the data signals are transferred to the latch with the
latch-enabling pulse LE, the display signals are output on the data lines
D,-DN through the digital buffers B,-BN, and at the same time the next
gate line (m)is selected to turn on the corresponding row of connected TFTs.
Data signals are then transferred to each pixel of the row through their TFTs
within the full period of a scan line. During the same period, the display
+
data for line (m 1) are input to the shift register. The row-driver operation
is the same as in the case of the “point-at-a-time” method. In order to provide
the necessary alternating polarity drive signal for the liquid-crystal elements,
the column buffers B,-BN output in a tristate, with their output, for exam-
ple, being either 0 or 4 volts for positive fields and either 0 or - 4 volts for
negative fields. Since all the circuits in this arrangement are of a fully digital
design and the total number of transistors is relatively small due to the sim-
ple configuration, these can easily be integrated on a small silicon chip.
There are two methods for obtaining a grey-scale capability with the “line-
at-a-time” method. One involves the employment of an analog latch array and
GI
G2
G3
Gu
D i Dz D3 DN
FIG.28. “Line-at-a-time” driving scheme without grey scale: this is the simplest method due
to the full digital configuration of the row and column shift registers, latch array, and associated
buffers.
52 SHINJI MOROZUMI
Da Dz DJ DN
FIG.29. “Line-at-a-time’’ driving scheme with grey-scale capability: the key is dual analog
sampler/holders consisting of gate transistors, storage capacitors, and analog buffers in-
corporated serially between the video signal line and gate lines, in which the lower sampler/holder
is operated as an analog latch; with this scheme, since the data lines are driven for the full time of
one scanning period, a video image with a large number of grey levels can be produced.
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 53
The outputs of the sampler/holders are transferred to analog latches through
analog buffers All -AlN. The analog latches, which have latching transistors
TZ1- TZN,signal-holding capacitors Csz and analog buffers A2,-AZN, receive
the analog display signals from sampler/holders, and transfer them to data
lines D,-DN controlled by latch-enabling pulse LE. When the gate line (m - 1)
is addressed, the sequentially sampled video signals are held in the capacitors
C,, during one line time; these stored signals are then transferred to analog
latches with the latch-enabling pulse LE to drive the corresponding data
lines after the last sampler/holder is activated. Subsequently, gate line (m)is
addressed, turning on the connected TFTs, and the video signal is thus
transferred to the pixel electrode through the TFTs. Since the data lines here
are driven for the full line scanning period, full pixel charging is achieved even
if the ON current of the TFTs is slightly insufficient or the metallization
resistance of the data lines is relatively high.
Usually, the analog buffers consist of a voltage follower differential
amplifier made of CMOS transistors and storage capacitors of a few p F
integrated on the silicon chips. In such analog buffers, any deviation from
linearity and variation in offset voltage must be strictly controlled in order to
display a high number of grey levels with satisfactory uniformity. Since the
analog buffers and storage capacitors occupy a large area of the Si integrated
circuit, the number of output channels per chip may be limited.
0
0 1 2 3 4 5
Applied Voltage (V)
FIG.30. Typical transmission as a function of applied voltage of TN LCD with crossed
polarizers: OFF state below 2 volts and ON state above 4 volts; between the saturated regions, a
nonlinear transition is observed; to obtain good grey levels, the applied voltage levels must be
modified to compensate for this nonlinearity.
in the LCD, the broadcast video signal must be reconverted from its gamma-
compensated state to an appropriate form as required by the LCD.
Row drivers to activate the lines and column drivers to transfer the display
signal to the data lines are available, integrated on CMOS-LSI chips with
multiple output channels. Usually, the driver LSIs have 60-120 output
channels per chip and are positioned on the four sides of the display panel for
connection to the LCD input terminals associated with the gate and data lines.
In the case of a display with 480 x 480 pixels, for instance, two row- and two
column-driver LSIs, each with 120 outputs, are connected to the LCD at the
left and right sides, and at the top and bottom, respectively. The connections at
opposite sides may be interlaced.
The design and operation of the row drivers are less of a problem than the
column drivers since all the circuits are fully digital and their operating speed is
relatively low. In the case of a TV display based on NTSC standards, the total
number of gate lines may be either the same or half the effective number of
scan lines (about 480)of the 525-line system. Since all of these lines are scanned
within 1/60 sec, the line time, i.e., one period of the shift clock, becomes
64 psec, which is relatively long. On the other hand, when designing a column-
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 55
driver circuit configuration such as shown in Fig. 26 and Fig. 28, many fac-
tors, such as the integrated silicon chip size, the operating frequency, power
consumption, grey-scale capability, and output impedance must be taken into
account. If a TV display panel has 500 data lines addressed within 64 psec,
each column driver must complete its operation within at least 128 nsec, an
extremely high speed for analog operation. With respect to power con-
sumption, since the liquid-crystal itself is essentially a capacitive circuit
element, most power is consumed by the driver LSIs, especially the high-
frequency data line drivers. Sometimes a pixel scanning rate of more than 5
MHz is required. In this case, each LSI with 120 driver channels consumes
more than 100 mW even though a CMOS circuit is used.
Since a dot-matrix-type LCD has many input terminals with a small pitch,
it requires accurate and highly reliable connections between the driver LSIs
and the LCD panel itself. The total number of connections and their pitch are
determined by the display area and resolution, e.g., the number of gate and
data lines. Here, it should be noted that the connection pitch can be halved by
using interlaced connections. For example, using such interlacing, a 5-inch
diagonal TV display with500 x 500 pixels requires a total of 1000connections
with a pitch of 0.4 mm for the columns and 0.3 mm for the rows, respectively.
For displays with such a large pitch, one can use flat-packaged LSIs assembled
on an ordinary circuit board. These may be connected to the LCD by sim-
ple means such as rubber connectors with separated U-shaped gold-plated
electrodes held together by the rubber material. However, when the pitch
becomes less than 0.3 mm, other approaches may be required. One method is
film bonding in which a flexible film such as polyimide with a copper
metallization layer is used with the tiny fingers of the film directly connected to
the LCD input terminals. This chip-on-glass technique is also useful for
compact displays. Here, the driver LSIs are mounted directly along edges of
the glass substrate of the display on which the pixel TFTs are fabricated. This
may be the best solution for connecting the LCD and LSIs when the driving
circuits cannot be integrated with the TFTs themselves on the same glass
substrate. as described below.
appear. If the TFTs associated with the pixels can be fabricated with few
defects, the integration of the driver circuits with TFTs may be feasible.
However, since a few defects in the pixel TFTs are sometimes acceptable,but at
the same time, no defects in the driving circuits can be tolerated, some
redundancy technique with alternative switches is necessary.
Efforts to integrate the driver circuits have been made with three types of
TFTs: CdSe, amorphous Si and poly-Si TFTs. In the drive circuits using n-
channel CdSe TFTs (Brody, 1984),the mobility of these TFTs is high enough
to allow satisfactory operation when integrated on the glass substrate of the
display. On the other hand, the mobility of amorphous Si TFTs is too low for
proper operation as integrated drivers for the column electrodes, although a
low-speed gate-line-integrated driver has been developed using such TFTs
(Akiyamaet al., 1986).In the case of poly-Si TFTs, the mobility is sufficiently
high, and full integration of the TFT drivers has been demonstrated. Figure 31
shows the frequency range of NMOS dynamic and CMOS static poly-Si TFT
shift registers (Morozumi et al., 1984b). Although both can operate at a
- CMOS Drivers
___---NMOS Drivers fro-4F--'
lo6 - Po'
lo5 -
10
fmin
I I
0 10 20
supply Voltage ( V )
FIG.31. Frequency range of shift registers based on poly-Si TFT-integrated drivers: as
shown, the CMOS static driver has a wider operatingfrequency range than the NMOS dynamic
driver. (Figure 4 from Morozumi et al., 1984b. Permission for reprint, courtesy Society for
Information Display.)
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 57
sufficiently high frequency (more than 1 MHz),the NMOS dynamic driver has
limitations in its low-frequency operation. With the CMOS poly-Si TFTs,
a fully integrated display with drive circuits was successfully achieved
(Morozumi, 1985). Figure 32 is a microphotograph of the integrated poly-Si
TFT driver circuits. These appear very much like ordinary LSI circuits on a Si
single-crystal wafer. Figure 33 also shows a photograph of an operating 1.27-
inch 220 x 320 pixel full-color TFT LCD with full integration of poly-Si TFT
driver circuits. It has a 80 x 90 pm pixel pitch and produces images with a
contrast ratio of over 40:l with rear illumination. Such a miniaturized LCD
can be used for video camera monitors and projection displays as mentioned
in Section VIII.A.3.
VI. COLOR-IMAGE
THIN-FILM
TRANSISTOR
LIQUID-CRYSTAL
DISPLAYS
FIG.32. Microphotograph of integrated poly-Si TFT drivers: the white region is the
metallization layer made of aluminum;other regions are the IT0 and poly-Si layer; minimum line
width is 5 pm.
58 SHINJI MOROZUMI
A. Structure
-Liquid-Crystal
Pixel Electrode ( I T 0 1
‘Pixel
TF T
t t t t t
Light Source
FIG. 34. Structure of full-color TFT-LCD: a color filter layer is formed below the upper
common electrode as an addition to the monochrome-type LCD; usually, organic dyes are used to
produce the red, green, and blue filter elements.
small so that they are not resolved by the observer’s eye at normal viewing
distance. As shown, the color filter layer is fabricated on the inner surface of
the upper glass plate, with the common electrode then being deposited on the
color filter layer. Except for the filter, the display is thus exactly the same as the
monochrome-type TFT LCD. As in the case of color CRTs, the color image is
created by additive color generation. Since the total light absorption by the
color filters and polarizers on the outer surfaces of the display is high (more
than 90%), viewing the LCD by reflected light results in an image that is too
dark to view in normal room light. In order to obtain high brightness, a
backlight is therefore used.
Different arrangements using the same number of pixels may cause differ-
ent image perceptions by the observer, particularly with regard to resolution.
Typically, three types of color pixel arrangements are employed as shown
in Fig. 35: the stripe, diagonal mosaic, and delta arrangement. Figure 35a
shows the vertical stripe type. This arrangement makes the LCD drive
circuitry less complex but requires the use of more horizontal pixels than the
other schemes in order to produce a given effective resolution. Figure 35b
shows the diagonal mosaic arrangement, the most commonly used. The drive
circuit for generating the color video signal for this scheme (described in
Section V1.D) is rather complicated, but seems to produce good resolution.
Figure 35c shows the delta arrangement. This produces excellent resolution,
but the wiring layout of the pixels becomes somewhat complicated. If high
resolution is required with the limited number of pixels, the delta arrangement
is the best choice. However, if a relatively large number of pixels can be used,
displays with the mosaic or stripe arrangement are easier to design and drive.
60 SHINJI MOROZUMI
The overall light transmission of the LCD panel is determined by the LCD
cells as well as by the light absorption of the polarizers and color filter layer.
The transmission of the LCD cells depends on the “aperture ratio” and the
optical interface losses. Since the aperture ratio, defined as the ratio of the
window area of the pixel to its total area, is strongly related to the opaque
areas of the transistor and metallization area (which may be relatively fixed),
it is proportionate to the pixel size. A typical value of a TFT-LCD cell
transmission is about SO%, assuming an aperture ratio of 70% and a pixel
pitch of about 0.2 mm, and considering reflections at the optical interfaces
such as between the glass and air, glass and ITO, etc. In a color filter layer,
lower transmission produces higher color purity. In some color filter designs,
the transmission is as low as 20%. Since the two polarizers absorb about 60-
70% of the incident light, the total transmission is reduced to less than 5%.
Thus, in order to realize a highly graded color image, color LCD requires the
use of a backlight source with a correspondingly high power consumption.
An example of the color gamut of a full-color TFT LCD shown on the CIE
chromaticity diagram is indicated in Fig, 36 (Morozumi, 1985). In this chart,
the center point corresponds to “white” and the outer heavy line shows the
locus of each wavelength that is assumed to have an infinitely narrow peak in
the spectrum. Therefore, a larger triangle is desirable to obtain high color
purity as close as possible to pure red, green, and blue. As can be seen, an
excellent color gamut similar to that of a CRT is obtained. The slight
difference in the triangle between the TFT-LCD and the CRT results from a
difference in the contrast ratio of the two. The black level of a CRT represents
the completely nonemissive state, whereas in the case of the TFT LCDs, there
is a slight light leakage in the black state, allowing some color mixing to occur.
In addition, the LCDs depend on the use of a white fluorescent tube for
backlighting. The wide spectral distribution of such a tube influences the
colors obtained, whereas in the CRT the colors produced depend only on the
electron-excited phosphors that may have narrow emission bands.
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 61
0 10 20 30 40 50 60 70 80
Values of x
FIG.36. Chromaticity diagram of full-color TFT LCD: as a result of improvements in the
optical properties of the LCD, color filter layer, and backlight, an excellent color gamut close to
that of a CRT is obtained. (Figure 8, from Morozumi, 1985. Copyright @ 1985 IEEE.)
Organic Base
(a)
Glass Substrate
(b) Y T R e d - D y e d Areas
C Green
C C C .Dye
1 . 1 Photoresist
(C)
Blue Dye
. 1 C C C & J
Photoresist
t
.....V,,
(d)
~
Overcoat
I I
FIG.37. Fabrication method of dye-type color filter: (a) a photoresist window for the red
region is opened and the surface exposed to dye; (b) the photoresist is removed; (c),(d) same
procedure is repeated for green and blue regions;(e) an overcoat layer is provided for passivation;
(f) Common electrode mode of I T 0 is deposited.
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 63
their resistance to fading under intense backlight and exposure to sunlight, as
well as the acceptability of such dyes by the base film. The dyes and their
concentration are selected in order to obtain the necessary spectrum of the
color filter layer, taking into account the backlighting spectrum. Although a
high dye concentration provides high color purity as mentioned in Section
VLA, it results in poor light transmission. Therefore, the concentration of the
dye has to be accurately controlled in order to obtain an optimal combination
of transmission, chromaticity, and white balance. Figure 38 shows the typical
spectrum of color filters fabricated by organic dying. In this example, the
average transmission of white light is about 25%.
C. Backlighting
Wavelength (nrn)
FIG.38. Transmission properties of dyed color filter layers with respect to wavelength:
average transmission of white light is about 25%.
64 SHINJI MOROZUMI
n
2,
P
01
K
w _1
400
Wavelength (nm)
FIG.39. Spectrum of peak-enhanced-type fluorescent tube: the peaks of the red, green, and
blue bands are positioned so as to match the optical properties of the color filter elements in order
to produce the desired spectral output from the display.
efficiency (a few lumens/watt), they are used for applications requiring a long
lifetime. In order to obtain primary colors with sharp peaks in the spectrum,
i.e., high color purity, special phosphors whose emission is concentrated in
narrow bands corresponding to the red/green/blue (RGB)primaries are used
in the tubes.
Figure 39 shows the spectrum of such a “peak-enhanced” fluorescent tube
of the filament type designed for use with a full-color TFT LCD. The color
temperature of the emission is about 7,000 K, and the efficiency of the tube is
15 lumens/watt. The starting voltage for the discharge is close to 1,000 volts,
and the maintaining voltage is 70 volts using an AC power source and an
electronic ballast circuit. Such a fluorescent tube, with a length of 5 inches and
diameter of 0.4 inches, has a power consumption of 3 watts. When used with
a 3 inch color LCD, a surface brightness of 5,000 nits is obtained from the
diffuser, resulting in a surface brightness of 200 nits from the display. With the
tube placed midway between the diffuser and reflector, which have a spacing
of 0.8 inches, there is a variation in brightness of about 50% across the panel.
The driving scheme for the TFT-LCD color panel is slightly different from
the monochrome type shown in Fig. 26 (Section V.A), since the display data
must be processed to contain R, G,and B signals that match the color pixel
arrangement of the panel. As one example of the driving scheme, the circuit
diagram for a color TFT LCD with pixels of each color arranged along
diagonal lines is shown in Fig. 40. In operation, the commonly used composite
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 65
FIG.40. Driving scheme for full-color TFT LCD with diagonal mosaic color pixel
arrangement: video signals, Vl-V3, are composed through a 3 x 3 matrix switch triggered by a
horizontal synchronizing signal; in this example, the “point-at-a-time”addressing method of Fig.
26 is employed.
TV video signal is first demodulated to obtain the normal color video signals,
V,, V,, and V, through the chroma circuit conventionally used in color-TV sets.
These signals are then converted to alternating-polarity video signals, V,, V,,
and V,, by a video conversion circuit to satisfy the requirements of the liquid-
crystal materials as mentioned in Section V and shown in Fig. 27. The
amplitudes of these signals and their voltage levels are also adjusted in this
circuit in accordance with the electro-optical characteristics of the liquid
crystal. The R, G, and B video signals, V,, V,, and V, are multiplexed by
a 3 x 3 matrix switcher to generate the V1, V 2 , and V 3 signals so that the
starting pixel in each scan line shifts successively from R to G, G to B, and
G to R. The matrix switch is controlled by the horizontal synchronizing
signal, switching once per scan line. In the case of the delta arrangement of
color pixels, a similar driving scheme is used. In the case of a vertical stripe
filter arrangement, however, there is no need for a rotator or multiplexer.
relative merits of these other technologies compared with TFT LCDs, they are
discussed in the sections below.
Important points of comparison between TFT and diode LCDs are in the
ease of the active element fabrication and the display performance. For use as
thin-film diodes, MIM elements based on Ta,05 or SIN films (Suzuki et al.,
1986) as well as amorphous silicon elements in the form of so-called p-n
diodes have been developed. The former have bidirectional current-voltage
characteristics within a single element, in which the electrons flow through
traps in the thin Ta,O, film and exhibit the Poole-Frenkel-effect current
(Baraff et al., 1980). In one form, p-n diodes have been employed using the
“diode ring” configuration, in which a pair of p-n diodes of opposite polarity
are connected in parallel utilizing the nonlinearity in the forward characteristic
of each diode to obtain bidirectional characteristics (Togashi et al., 1984). In
an alternative form, a “back-to-back” diode configuration has been studied
with a connection in series employing the nonlinearity of the reverse
characteristics (Szydlo et al., 1983).In the fabrication process for such diodes,
2-4 photomasks are required for their fabrication, whereas TFTs generally
require 4-9 photomasks, making the large-area fabrication process with thin-
film diodes simpler than that for TFTs. However, in the case of diodes, the
nonlinearity characteristicsbetween two terminals connected in series with the
liquid-crystalelement directly influences the ON/OFF ratio. By comparison,
in the case of TFTs, the ON/OFF current ratio is selective in accordance with
the gate voltage swing, being independent of any nonlinearity in the current-
voltage characteristic between the source and drain. Unfortunately, the diode
nonlinearity factors, which, up to now, are almost the same among the various
thin-film diodes (Howard, 1986), are not sufficient to enable complete frame
storage operation to be obtained in an active-matrix LCD. This differs from
the case of TFT-type active-matrix LCDs. Whereas most TFTs have an
ON/OFF current ratio greater than lo5, the ON/OFF ratio for diodes is
around lo3 or lo4 at best because of the poor nonlinearity factor.
It is thus difficult for diodes to satisfy the requirements indicated in Eqs. ( 5 )
and ( 6 ) of Section 1II.B. This leads to contrast ratio degradation and limited
grey-scale capabilities unlike the situation with TFT elements. In addition,
since the spread or distribution of electrical characteristics of diodes as well as
their shifts with temperature directly degrade the display uniformity, strict
control is absolutely required in the fabrication of the diodes to insure sufficient
uniformity of their characteristics. Accordingly, at the present time, the TFT
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 67
LCD is the most promising device for the realization of high-quality images,
whereas the diode-type LCD is more suitable for large-area displays with
limited or no grey-scale capability, although directly multiplexed LCDs are
also competitive for such applications.
Using thin-film diode elements, a number of LCDs have already been
fabricated. For practical applications, full-color pocket TV sets based on
MIM LCDs are already being mass-produced with 2.6 and 3.3-inch diagonal
sizes. For test purposes, 6.7-inch MIM LCDs with 440 x 640 pixels capable of
displaying full-color video images have also been built (Maezawa et al., 1987).
For portable computer displays without grey scale, 9-inch diagonal mono-
chrome MIM LCDs with 400 x 640 pixels have been developed (Morozumi,
1985). Using amorphous Si diode rings, full-color LCD panels containing
480 x 720 elements with an area of 122.4 x 120 mm have also been deve-
loped (Togashi et al., 1986). In any case, as long as the TFT elements present
difficulties for large-area fabrication, thin-film diodes will remain a potential
challenge to TFTs for large-area, high-quality displays.
A. Television Applications
1 . Pocket TV
Pocket color-TV receivers with 2-inch and 2.5-inch diagonal picture size
containing 220 x 240 and 220 x 320 poly-Si TFT arrays, respectively, were
already marketed by Seiko Epson in 1984 and 1985. Also a 3-inch color TV
receiver with an array of 240 x 378 amorphous Si TFT elements was
marketed by Matsushita and Sharp in 1986 and 1987,respectively. Following
these TVs, 4-inch and 5-inch color TV sets have been marketed by several
Japanese consumer electronics companies. A black-and-white photograph of
the 2-inch TFT-LCD color-TV set made by Seiko Epson is shown in Fig. 41.
The color pixels here are fabricated in a diagonal arrangement with the filter
elements made by the organic dye method. Using the conventional twisted-
nematic liquid crystal with crossed polarizers, a contrast ratio of more than
50: 1 is obtained. Although the image has some viewing-angle dependency
because of the type of liquid crystal employed, in a pocket-type TV receiver
viewed by one person this is not a serious problem. A single pencil-type hot-
cathode fluorescent tube with a power consumption of about 1 watt is used as
the backlighting source, producing a 50-ft lambert brightness at the viewing
70 SHINJI MOROZUMI
surface of the display panel. The total power consumption of the set is closed
to 1.8 watts, allowing it to be operated for more than three hours with four AA
dry batteries. The outside dimensions are 128.6 x 76.6 x 30.7 mm, resulting in
a compact pocket receiver that can be viewed almost anytime anywhere.
At present, the size of such displays is limited by their cost, which is almost
proportionate to the display area. However, the cost of TFT LCDs is expected
to be reduced year by year, with commercial displays being enlarged to 6-inch
to 10-inch diagonal size. Aside from their use for receiving broadcast TV
signals, such displays will no doubt find applications in viewing or monitoring
images produced by video cassette recorders, video discs, as well as portable-
type video cameras.
2. Wall-type Flat T V
Large-sized flat TV displays that can be mounted on the wall are the
ultimate target for every flat-display technology. At the present time, TFT
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 71
LCDs for color video displays up to around 12 inches in diagonal size (Takeda
et al., 1986, and Sakamoto et al., 1986) have already been fabricated for test
purposes but not for commercial use. However, achieving the most desirable
size, e.g., more than 30 inches diagonal, is very difficult even for developmental
evaluation because of the lack of suitable fabrication equipment. Even though
the current techniques, available for a diagonal size of less than 12 inches,
could be applied to the fabrication of such large-size display panels, the
production cost would be extremely high due to the very poor yield caused by
defects as well as the very low productivity, i.e., the very small ratio of
production capacity to required investment. For example, the step-and-repeat
projection aligner used in existing photolithography machines, which is quite
common for the current production of TFT substrates, costs more than one
million dollars. At best, this can process 30 1-foot-square glass substrates per
hour to form a fine pattern for a single layer with a minimum number of
defects. In effect, this would require over 30 projection aligners to be installed
in order to produce only the photolithographic pattern for 10,000 pieces
of 40-inch diagonal TFT-LCD arrays per month, resulting in quite a high
production cost. Besides, in such large-size displays, the image quality (which
is determined for example, by contrast ratio, grey-scale reproducibility,
viewing angle, and brightness) must be better than or at least equal to that of
CRTs, unlike the case of small-size display panels. This requires further
technical improvements in the panel itself.
In view of the extensive efforts being presently directed toward the
development of large-size, high-definition TV systems based on more con-
ventional display technologies, it is expected that progress in this area will
further increase the demand for 30 or 40-inch-size wall-type TV displays. Of
importance is the fact that, in the case of TFT LCDs regardless of the display
size, no significant differences in the fundamental technology is required. More
important, as mentioned, are the improvements in the manufacturing
technique and related equipment necessary to achieve a large production-
capability/equipment-investment ratio for large-size substrates, as well as
improvements in the TFTs to obtain the necessary high uniformity in electrical
characteristics and low-metallization resistance.
3. Projection TV
At the present time, there is much interest in projection systems for
producing large-screen color images. Such systems, generally making use of
multiple CRTs, are costly and bulky and have limited light output. The use of
TFT LCDs instead of CRTs for projection provides an attractive alternative
approach and presently seems to be a more realistic method for containing a
large-size image compared to attempting to obtain a large wall-type TV
72 SHINJI MOROZUMI
V i e w i n g Screen
7
Mirror
7
Hal
-
Ref l e c t o r
Dichroic Mirror
\Dichroic Prisms
FIG.42. Basic structure of color projector using three TFT LCDs: due to its simple structure,
the projector is small and lightweight. (Figure 1 from Morozumi et al., 1986b. Permission for
reprint, courtesy Society for Information Display.)
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 73
obtain an increased screen brightness and higher color temperature image
as well as to extend the lifetime of the lamp. With this system, an image with
300-ft-lambert brightness was obtained on a 40-inch diagonal front-projected
screen having an optical gain of 19. An example of such a color image is shown
by the black-and-white photograph in Fig. 43.
B. Computers
IX. CONCLUDING
REMARKS
During the next three years, TFT LCDs are expected to find use in small
pocket and portable color-TV receivers, with display sizes up to about
10 inches in diagonal. The main technology employed will be amorphous Si
thin films rather than polycrystalline films for the TFTs because of the relative
ease of fabrication of large-area substrates with this technology using pre-
sent manufacturing equipment. During this period, it is also expected that the
image quality in terms of contrast ratio, viewing angle, and color purity will be
continuously improved and eventually approach that of CRTs. However,
since it will be difficult during this period for TFT LCDs to dominate in other
applications requiring a large size and an absence of defects, such as in
portable computers, directly multiplexed LCD devices, despite their limita-
tions, will continue to be used primarily for these purposes.
Within 10 years, it is expected that many of the problems mentioned above
will be solved and thus enable TFT LCDs to be utilized for large-area displays
up to or more than 20 inches in diagonal with a resolution as high as 1,000
lines, not only for TV but also for computer terminals. Such displays may also
be used for personal applications in which a computer terminal is combined
with a TV system functioning as a general-purpose color information display
unit. The most advanced TFT-LCD units will have a diagonal size up to 40
inches and contain over 1,000 x 1,000 color pixel triads. It is also expected
that these displays will have a contrast ratio in excess of 100: 1, a viewing cone
of more than a 120" included angle, a brightness of more than 300 ft-lamberts,
and a panel depth less than 4 inches, making them useful for high-definition
home TV. During this period, the production of such TFT LCDs will be fully
automated, and a production technique requiring no redundant elements may
be established. These displays may make use of polycrystalline silicon films
fabricated by low-temperature techniques such as laser-beam annealing to
obtain TFTs with greatly improved characteristics, since scanning speeds and
data rates much higher than the current NTSC system will be required. It is
also highly likely that these display panels will be fully integrated with their
drive circuits on a single substrate, minimizing the number of input leads.
Although the CRT is presently considered to be the standard against
which other displays are measured, within the next decade there is a distinct
ACTIVE-MATRIX THIN-FILM TRANSISTOR LIQUID-CRYSTAL DISPLAYS 77
possibility that liquid-crystal displays based on thin-film transistors will not
only become strong competitors to CRTs in many applications but will also
displace them in a significant number of applications.
ACKNOWLEDGMENT
The author would like to express great thanks to Dr. B. Kazan for his continuous en-
couragement and helpful suggestions in completing this article.
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Resonators. Detectors. and Piezoelectrics
JEAN-JACQUES GAGNEPAIN
Laboratoire de Physique et MPtrofogie des Oscillateurs du C.N.R.S.
UniversitP de Franche-Cornti-Besanron
Besanron. France
I . Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 84
I1. Fundamental Equations of Elasticity and Piezoelectricity . . . . . . . . . 85
A. Initial and Final States. Displacements . . . . . . . . . . . . . . . 86
B. Strains . . . . . . . . . . . . . . . . . . . . . . . . . . 87
C . Mechanical Forces and Stresses . . . . . . . . . . . . . . . . . 87
D . Electrical Forces . . . . . . . . . . . . . . . . . . . . . . 88
E. Conservation Laws . . . . . . . . . . . . . . . . . . . . . 89
F . Equilibrium Equations in the Material State . . . . . . . . . . . . . 92
I11. Material Constants . . . . . . . . . . . . . . . . . . . . . . . 93
A . Elastic Constants . . . . . . . . . . . . . . . . . . . . . . 94
B . Piezoelectric, Electroelastic and Electrostrictive Constants . . . . . . . . 95
C . Dielectric Constants . . . . . . . . . . . . . . . . . . . . . 91
IV. Crystal-Lattice Anharmonicities (A Brief Review) . . . . . . . . . . . . 98
A. Specific Heat . . . . . . . . . . . . . . . . . . . . . . . 100
B. Acoustic Wave Attenuation . . . . . . . . . . . . . . . . . . 100
C . Heat Conductivity . . . . . . . . . . . . . . . . . . . . . . 102
D . Thermal Expansion . . . . . . . . . . . . . . . . . . . . . 102
V. The Resonator: Simple Linear Model . . . . . . . . . . . . . . . . 103
A . Bulk-Acoustic-Wave Resonator . . . . . . . . . . . . . . . . . 103
B. Surface-Acoustic-Wave Resonator . . . . . . . . . . . . . . . . 108
V1. Nonlinear Properties . . . . . . . . . . . . . . . . . . . . . . 112
A . Propagation and Resonance of Finite-Amplitude Waves . . . . . . . . 112
B. Propagation in a Prestrained Medium . . . . . . . . . . . . . . . 118
VII . Sensitivities to External Perturbations and the Design of Detectors . . . . . . . 125
A . Temperature . . . . . . . . . . . . . . . . . . . . . . . . 125
B. Forces and Pressures . . . . . . . . . . . . . . . . . . . . . 127
C . Accelerations . . . . . . . . . . . . . . . . . . . . . . . 129
D . Electric Field . . . . . . . . . . . . . . . . . . . . . . . 129
E. Miscellaneous Detectors . . . . . . . . . . . . . . . . . . . . 131
VIII . Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . 132
References . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
83
Copyright 0 1990 by Academic Press. Inc .
.
All rights of reproduction in any farm reserved
ISBN O-I?-014677-0
84 JEAN-JACQUES GAGNEPAIN
I. INTRODUCTION
EQUATIONS
11. FUNDAMENTAL OF ELASTICITY
AND PIEZOELECTRICITY
0. = -.dxj
dt
B. Strains
Let dl, and dl be the distance between the points M ( a i ) and P(a, + da,)
+
before deformation, and M'(xj) and P'(xj dxj) after deformation
dlo = daidai, dl = dxjdxj. (3)
The strain tensor qij is defined as
d12 - d l i = 2qijdaidaj, (4)
which by means of the relation dxj = (axj/aa,)da,can be written
It must be noticed that this exact relation is nonlinear, due to the quadratic
term (auk,/aai)(auk/aaj), a term which is neglected in the approximation of
infinitesimal deformations. This strain expression is given with respect to the
material coordinates ai. A similar expression could be established with respect
to the final coordinates x j by usingda, = (aai/dxj)dxj,leading to the strains eij,
In the linear approximation, the two strains qij and eijbecome identical and
are noted
The solid can be subject to internal and external forces that are surface and
body forces, the latter resulting from the application of an external quasistatic,
electrical field. One considers in the usual manner an elementary tetrahedron
(Fig. 2) with surface element dS(ABC) of normal unit component ni submitted
to surface force (per unit area) Qj.
88 JEAN-JACQUES GAGNEPAIN
x3 +
X1
FIG.2. Tetrahedron with surface dS ( A B C )of unit normal n submitted to a surface force Q,
D. Electrical Forces
C =8 h Ei.
pi is the dipole density and Ej the quasistatic Maxwell electric field, which
RESONATORS, DETECTORS, AND PIEZOELECTRICS 89
derives from the electric potential 4,
E. = --. a4
J axj
It will be useful to introduce the Maxwell stress tensor T ; ,
+
TE = &oEiEj &Ej - 4 ~ ~ E ~ E k 6 ~ ~ , (13)
and the electric displacement Di,
Di = EO&+ c, (14)
E. Conservation Laws
Four basic conditions, known as the conservation laws, state that the mass
of a solid remains constant, the rate of change of the momentum equals the
resultant force, the rate of change of the angular momentum equals the
resultant couple, and the rate of change of energy equals the external work
done (mechanical and nonmechanical) and, in addition, the heat exchange.
The conservation laws are established using the integral form. By con-
sidering an arbitrary element of volume (and surface), the integral forms are
transformed into a local form (valid at every point of the solid), with the
conditions at the surfaces of discontinuity being associated. Only the main
results are given here. Details of the transformation and extensions to
generalized discontinuities and interfaces can be found in various works
(Thurston, 1974; Planat, 1984; Daher, 1987).
which, after transformation, leads to the local form generally called the
equation of continuity
dp avi
- + p- = 0.
dt axi
Q a E j / d x i )correspond to the electrical forces, and Fj are the other body forces
(gravitational forces, for instance).
Using Eq. (9) in (19) and applying the divergence theorem gives the local
form, called the equilibrium equation
= d j v ( x j A pvj)dl.i
After transformation, the local form gives the symmetry property of the
stress tensor.
Gi - T k = EiPk - Eke. (24)
RESONATORS, DETECTORS, AND PIEZOELECTRICS 91
This shows that in a general electroelastic solid, the stress tensor is not
symmetrical. The condition of symmetry is verified only in a pure elastic
medium, or in the linear approximation, since the right-hand side of Eq. (24) is
nonlinear.
U is the internal energy per unit mass; QkUk and FkUk represent the rate of
working of the surface and body forces. The electric forces are included in the
stress
dE. dP.
D = cAui
axj + E idtL ,
and nkqkis the thermal energy flow.
The local form of Eq. (25) is obtained by applying the mass and linear
momentum conservation laws and the divergence theorem in Eq. (25). This
yields
x = u - '10 E i 4
--,
P
This leads to
x = x (axj/da,.Ei&), then
(30)
p. = - p - 82 (32)
aEi’
ax
q = -- (33)
ae’
It will be more convenient to express the energy function x in terms of the
strain and electric field given in the initial reference system. By using Eq. (5) for
the strain and the transformation
a4
Wk -- -- = _ _84 ax,
_ __ = -E ax,
- (34)
auk ax, aak auk
for the electric field, the constitutive equations become
ax. ax. ax axi ax
T.. = p l A -+ p-Ej-, (35)
aa, da, dqmk dam aW,
ax
p. = -p- ax. __
aa, dw,’
(36)
q = -- ax (37)
ae’
in the absence of free charges in the volume, and the boundary conditions
Ag9; - 9;)
= 0, (43)
(4+ - $-) = 0 (44)
on the surface.
Equation (43) assumes that there are no electric charges on the surface.
Such a condition is arbitrary, but was useful for solving the problem of the
propagation of a surface acoustic wave on a piezoelectric and semiconductor
substrate, because without this assumption, one boundary condition would be
missing. The problem was finally solved by Ancona and Tiersten (1980; 1983)
by considering an exact model of the charge distribution near the interface of
the solid, and more recently by Daher and Maugin (1987).
111. MATERIAL
CONSTANTS
The thermal terms have been omitted in this expression. The symbols cijkr,
represent the second-, third-, and fourth-order elastic constants,
Cijklmn, Cijklmnpq
respectively. In this definition, the order corresponds to the power of the
corresponding term in the energy expansion. Therefore, second-order terms
for the energy lead to linear relations in the constitutive equations. Nonlinear-
ities begin with the third-order terms. The symbols, , ,& cmnpare the second-
and third-order dielectric constants, and emijare the regular second-order
piezoelectric constants. Finally, and correspond to nonlinear third-
order piezoconstants. They are known as electroelastic and electrostrictive
constants, respectively, with the latter ones occurring even in nonpiezoelectric
media.
Among the large family of piezoelectric materials, which can be classified
as monocrystals, ceramics, polymers, and others, only the most widely used
monocrystals will be examined here (quartz, lithium niobate, and lithium
tantalate). Quartz has been studied intensively, but knowledge of its constants
is still incomplete, and even fewer constants are known for the other crystals.
Therefore, in this section only the constants of quartz will be presented in
detail, and general comments will be made for the other crystals and materials.
Almost all values of the constants that have been measured can be found in
the Landolt-Bornstein (1979) tables.
A . Elastic Constants
The values of the second-order elastic constants are well known and are
available in the form of the compliance or stiffness constants, defined at
constant electric field or constant electric displacement. They have been
measured for most piezoelectric materials (Landolt-Bornstein, 1979).
TABLE I
VALUES OF THE 14TH INDEPENDENT THIRD-ORDER FUNDAMENTAL
ELASTIC CONSTANTS (in 10'' N/m2)."
OF QUARTZ
Standard Standard
Coeff. Value error Coeff. Value error
~ ~ ~
q j OC em.ijklWmqkl. (46)
Therefore, the electroelastic effect appears as a nonlinear coupling between
electric fields and mechanical strains. If, for instance, W, is a static quantity
denoted by W,,and qj and qkl are dynamic quantities (Ej and &), then
relation (46) becomes
TABLE 11
ELECTROELASTIC CONSTANTSOF QUARTZ CRYSTAL (INC/m2)
(THE SINGLE-SUBSCRIPT NOTATION
IS USED IN THIS TABLE).
- 0.68 -0.42
- 0.90 - 1.99
E1.24 -0.88 -2.41
E1.44 0.90 1.02
E3.15 1.01 0.72
RESONATORS, DETECTORS, AND PIEZOELECTRICS 97
who indicated that only linear combinations of the electroelastic constants
can be presently determined (shown in Table 11), and that there is no dis-
crepancy between the authors concerning the values of these combinations.
The electrostrictive constants of quartz were also evaluated by Kittinger
et al. (1986) using the pulse-echo method. Their values are given in Table 111.
Lithium niobate and lithium tantalate crystals have high electromechan-
ical coupling factors and are used in particular for wide-band filters or acoustic
convolvers. In the convolver, large nonlinear constants are also needed for
increasing the efficiency (Ganguly and Davis, 1980). The electroelastic and
electrostrictive constants of LiNbO, were evaluated by Thomson and Quate
(1971), Koborov and Lyamov (1975), and for LiNbO,, LiTaO, by Agishev et
al. (1979), Chizhikov et al. (1982), and Zelenka (1982). It must be noticed that
not all these constants are homogeneous, some are material constants, some
others are effective constants. They are also not all defined with respect to the
same reference coordinate system.
C. Dielectric Constants
TABLE 111
ELECTROSTRICTIVE
CONSTANTS
OF QUARTZ (INFlm)."
CRYSTAL
n-1 n
- - -
un-1 un Un+l
FIG.3. Chain of atoms with mass M, and distance a.
RESONATORS, DETECTORS, AND PIEZOELECTRICS 99
distance between
atoms
t
8 /
+8 /
.-
U
E
s distance between
e atoms
s.-E
A. Specijic Heat
k = k’ + k” + -,2nm
U
where m is an integer.
If Nk is the number of phonons in mode k when not in equilibrium (nk is the
number when in equilibrium), collisions (that is, nonlinear interactions
between modes) will force mode k back to equilibrium, with a relaxation time
t(k) given by
where so is the sound-wave mean phase velocity and po the crystal specific
mass.
102 JEAN-JACQUES GAGNEPAIN
C. Heat Conductivity
is calculated with the Boltzmann transport equation, and after some calcula-
tion, the thermal conductivity coefficient takes the simpler form
Kij =C(ZU~U~), (69)
where C is the specific heat, and the averaging ( ) has the form given by
Eq. (66).
D. Thermal Expansion
Thermal expansion has its origin in the same phenomenon. The free energy
A of the crystal is composed of the elastic deformation energy and the thermal
phonon energy. The derivative with respect to strain of the free energy, at
constant temperature gives the thermodynamic tension, and the thermal
expansion coefficient aydis obtained by taking the derivative with respect to
temperature at constant tension (Maradudin, 1962).
RESONATORS, DETECTORS, AND PIEZOELECTRICS 103
caPydare the second-order elastic constants, and
V. THERESONATOR:
SIMPLELINEARMODEL
a3
I
a1
FIG.6. Resonator with thickness 2h and infinite lateral sizes.
with
4 ' at
4 = +AP' s= +h. (75)
2
Let A, and ly) be the three eigenvalues (r = 1,2,3)and the three eigenvector
components of the system
(CijklNifl - n 6 j k ) l j = 0. (76)
After introduction of the curvilinear coordinate
s=ya,, (77)
and the resultant polarization
u, = p1 u I'.
the system of Eqs. (72) to (74) is transformed into
PO f i r = ~r U , s s + ~rb,ss,
YrKss -4?ss = 07
ArUr,, + yr4,,= 0 at s = fh.
This system has been written in a new coordinate system composed of the
three orthogonal eigenvectors, and spatial derivatives are performed with
respect to s, with the notation alas = ,s.
Now the equations of the three waves (r = 1,2,3) are uncoupled, and the
subscript r can be omitted in the following.
RESONATORS, DETECTORS, AND PIEZOELECTRICS 105
The coefficients 2, y, and E read
2 = cijk.&filjlk, (82)
y = enijNiNnlj, (83)
E = E,, N, N, . (84)
Integrating Eq. (80) gives the electrical potential, and substitution of the
potential into the boundary condition (81) leads to a system that for plane
waves can be satisfied only by an antisymmetrical mode solution (this means
that a symmetrical mode cannot be piezoelectrically driven).
The resonance is given by the determinant of the boundary condition
system of equations, which yields the transcendental equation
uh oh
- = K’tg-,
V V
where K is the electromechanicalcoupling factor,
L --,
poh3
'
- y2A
4Ay2
TZ
2 D
1 h(2p +
R, =
n2hq(2p + q2 (93)
4yZA '
co =z
&A
(94)
co
FIG.7. Resonator-equivalentcircuit for frequencies near the resonance and antiresonance
conditions.
RESONATORS, DETECTORS, AND PIEZOELECTRICS i 07
Energy
I
(a)
R (b)
R
FIG. 8. (a) Plano-convex shape for a thickness shear resonator; (b) Energy distribution.
TABLE IV
.
MEANVALUESOF THE Qo fo PRODUCT
FOR DIFFERENT
PIEZOELECTRIC
CRYSTALS,
FOR DIFFERENT CRYSTALLOGRAPHIC
ORIENTATIONS
AND
VIBRATION
MODES.
Material Qo fo product
9 From
B. Surface-Acoustic-Wave Resonator
Surface acoustic waves, like Rayleigh waves, cannot be reflected at the edge
of a plate (they do not satisfy such a boundary condition and are converted
into bulk waves). Standing waves are obtained by using multiple reflections in
a surface grating as proposed by Ash (1970). The reflection comes from the
electrical or mechanical perturbation on each element of the grating: the
shorting out of the piezoelectric field by metal strips and, in addition, the mass-
loading effect. For materials with lower electromechanical coupling factor,
grooves made by ionic etching are used (Staples, 1974). Ion-implanted strips
(Hartemann, 1975) and metal-diffused strips (Schmidt, 1975) have also been
studied.
The resonator is composed of two identical reflectors realizing a SAW
cavity, which is coupled to the external circuit by means of one or two
interdigital transducers, as shown in Fig. 9.
The surface-grating reflector has the properties of dispersion of a cor-
rugated structure (Fig. 10). If the wave frequency is in the range of the stop
band (near kd = n or 274 the corrugated structure behaves as a reflector
(Li et al., 1975).
A typical admittance curve of a one-port resonator is shown in Fig. 11.
This admittance is similar to that of the bulk-wave resonator and exhibits
both resonance and antiresonance. Resonance occurs when the phase
interference is constructive. This happens when the length of the cavity (the
distance between the effective centers of the reflectors) is an integral number of
half wavelengths.
RESONATORS, DETECTORS, AND PIEZOELECTRICS 109
P L L
I w s
2n
kcd
0 n 2n
kd
FIG.10. Theoretical dispersion curve for an infinite array of grooves of period d ; k , is the
unperturbed Rayleigh wave number, and k the wave number on the periodic structure.
110 JEAN-JACQUES GAGNEPAIN
10
c
h
Y)
.-
c
3
499 500 50 1
Frequency (MHz)
FIG. 11. Admittance curve of a one-port SAW resonator.
cavity and enhances the transmission between the transducers. This appears as
a sharp resonance on top of the transducer response (Schoenwald et al., 1975).
An equivalent circuit (Shreve, 1975), valid for two identical transducers is
given in Fig. 13. The two equivalent circuits of Figs. 12 and 13 are simplified
circuits valid near the resonance. Other equivalent circuits with a wider
frequency range have been also proposed (Joseph and Lakin, 1975).
In terms of the reflection coefficient r of the gratings, the motional
inductance and resistance are given by the relations (Staples et al., 1974;
P
L1
co c1
b
FIG. 12. One-port SAW resonator-equivalentcircuit.
RESONATORS, DETECTORS, AND PIEZOELECTRICS 111
0- Q
.L1 c1 RI
co 3 : co
0- -0
FIG.13. Two-port SAW resonator-equivalentcircuit.
where Leffis the effective cavity length, which equals the distance between the
two reflectors plus the penetration length in the reflectors; fo and Izo are the
resonance frequency and the mean wavelength.
The unloaded Q-factor of a SAW resonator is limited by different sources
of losses, as follows
1 1
- =- +-1 + -1 +--.
1
Q Qm Qd Qr Qb
The term l/Qm is related to the acoustic attenuation in the material and
-
corresponds to the ultimate limitation of the Q-factor. The Q f product can
also be used in this case for characterizing a given material with a given
crystallographic orientation and in addition for a given propagation direction
-
of the wave. For ST-cut quartz a Q f product close to l.lOI3 was evaluated
(Li et al., 1974).
If the device is not under vaccum, air loading will be also a limitation of the
Q, but generally the device is sealed in an enclosure under vaccum, and air
loading is eliminated.
The term l/Qd is the loss due to the diffraction of the finite-width beam.
During many transits, the beam spreads and a part of its energy is lost beyond
the aperture of the reflectors. This can be reduced by optimizing the beam
112 JEAN-JACQUES GAGNEPAIN
TABLE V
COMPARISON
OF BAW AND SAW-RESONATORS
Q-FACTORS.
SC-cut (Y = 0)
width a with respect to the wavelength &. It has been shown that Qd is
proportional to (Li et al., 1974).Diffraction can also be generated when
the wave propagates on the grating. This will depend on the type of grating,
i.e., on the relative speed of the wave on the grating, with respect to the
unperturbed Rayleigh wave velocity, and higher transverse modes can be
excited (Staples, 1974).
Two other important sources of loss due to the gratings arise from the
leakage of energy because of imperfect reflections ( l/Qr), and because of mode
conversion into bulk waves (l/Qb).The reflecting coefficient can be improved
by using deeper grooves in a short grating, or by using a larger number of
shallow grooves. The Q-factor is improved by increasing the grooves’ depth,
but there is a limit, and beyond that limit the resonance can even vanish. This
has been attributed to bulk-wave generation at the front of the grating. A
solution consists in gradually tapering the groove depth up to its final value (Li
et al., 1975). The second solution consists in using a much larger number
( N 1OOO) of shallow grooves per grating, which minimizes the leakage loss
without increasing the bulk generation.
The interdigital transducer also contributes to the losses by spurious
reflections. It was proposed to use transducers made of aluminum strips
recessed in quartz grooves (Dunnrowicz et al., 1976; Haydl et al., 1976) for
reducing these reflections.
A comparison between achievable Q-factors of BAW and SAW resonators
is given in Table V.
PROPERTIES
VI. NONLINEAR
The nonlinear terms of third and fourth orders change the characteristics
of the wave when its amplitude is finite (and not infinitesimal as it was the case
in the previous section). The first consequence of these quadratic and cubic
114 JEAN-JACQUES GAGNEPAIN
In this case rrr,r,t= r, when r" = r' = r, and = A, when r"' = 1'' =
r' = r, and are neglected for all values of r"', r", r' # r.
Several methods are available for solving these nonlinear equations: the
perturbation method of PoincarC, the method of multiple scales, the method
of characteristics, the method of coupled amplitude equations, etc., (Planat,
1984).
Using the PoincarC method, a solution is chosen in the form
V, = Vo cos Y + A 2 cos 2" + B2 sin 2Y + C2 + A , cos 3"
+ B3cos3Y + C,cosY + D3sinY +-.-, (110)
with Y = wt - kos.
In this expression, Uo is the amplitude of the driving signal, Vo cos ot at
s = 0, ko is the wave number ( k , = w/Vo),and Vo is the wave velocity in the
linear approximation.
Amplitudes of the different harmonics are obtained by substituting the
solution (110) in Eq. (109) and by identifying corresponding terms.
For the second harmonic,
Equations (1 11) to (1 17) show how the second and third harmonic levels
increase as a function of the propagation distance and absorb energy at the
fundamental frequency. For longer distances, coupling with higher-rank
harmonics will induce a reduction of the second and third, with, as a con-
sequence, an increase of the fundamental, and so on. Such effects do not
appear in the above relations, since the calculation is limited to the second
order of approximation, and the relations are valid only for distances close to
the source.
The additional terms at the fundamental frequency [Eq. (116)] and
[Eq. (1 19)] are equivalent to a perturbation of the amplitude and phase of
the wave. Combining with the main fundamental term gives the velocity-
amplitude effect
This effect is related to the nonlinear elastic constants, and since (r/A),
and
A/,? are of the same order of magnitude (see Section III.A), both third- and
fourth-order elastic constants must be taken into account.
A similar relation can be written for the resonance frequency of a reso-
nator. This well-known amplitude-frequencyeffect is shown in Fig. 14.
It should be noticed that these results are general. They take into account
both the vibration mode and the crystal anisotropy, but are limited to a one-
dimensional plate. Two-dimensional models have been studied by Tiersten
(1975).
A second nonlinear phenomenon that arises in resonators used as filters is
intermodulation. For a signal with two frequency components wt and 0,
(both close to the resonance frequency wo of the resonator, and within its
bandwidth), the quadratic nonlinearities generate frequencies 204, 20,,
o1+ a,,and o1- 0,. Cubic nonlinearities generate 3w1, 3wz, w1 + 20,,
0,+ 204, 2w, - w 2 , and 201, - wl. All these frequencies are completely
out of the resonator bandwidth, except 2 0 , - w, and 20, - ol. If
0 1 N 0,2: w,, (121)
116 JEAN-JACQUES GAGNEPAIN
-
FRACTIONAL FREQUENCY
FIG.14. Amplitude-frequency effect of a 5-MHz AT-cut quartz resonator.
it follows that
20, - 0 2 N 20, - o1N w1 N o2N 0,. (122)
Therefore, such frequencies will not be eliminated by the filter. This
intermodulation can have a serious effect, in particular in front-end filters
when high signal levels are received.
Intermodulation has been studied by Tiersten (1974), Smythe (1974) in
thickness-shear quartz resonators, and by Planat et al. (1980a)in X-cut lithium
tantalate resonators. It was shown that both third- and fourth-order elastic
constants are again involved. Because the fourth-order constants are un-
known, the value of intermodulation cannot be calculated, and, in fact, the
models were used for evaluating some values of fourth-order elastic constants
from experimental measurements of intermodulation. It should be noticed
that these evaluations were based on solutions including Eqs. (113)and (117).
The corrected solutions (118) and (119) will yield different values of the
corresponding fourth-order elastic constants. But this evaluation has not yet
been made.
A direct comparison between the elastic nonlinearities of quartz and
lithium tantalate resonators is shown in Fig. 15.
Lithium tantalate has nonlinearities that are much smaller than those of
quartz. The intermodulation ratio PIP, corresponds to the ratio of the power
of one of the test tones at frequencies 0,and o2(with Pw, = Po,= P) over the
RESONATORS, DETECTORS, AND PIEZOELECTRICS 117
PI Po (dB)
4
1 * P (dBrn)
-50 -30 -10
FIG.15. Comparison of intermodulation in 456 kHz face-shear mode quartz and lithium
tantalate resonators (Planat et al., 1980).
where a2 is the direction of penetration normal to the surface, and ny) is the
complex penetration coefficient.
Applying PoincarC‘s perturbation (Planat et al., 1980b), and a much
lengthier calculation than for bulk waves, gives the second harmonic solution
TABLE VI
CoMPARISON OF THE COEFFICIENTK
AMPLITUDE-FREQUENCY
OF SAW AND BAW RESONATORS."
final (Xi)
dynamic u
natural (a,)
Strains, stresses, and fields are also identified using the same static,
dynamic, and total notation.
Finally, let N,, 7ii, and n, be the cosine directors of the unit normal at a point
of surface in the different states.
where zij is the total stress, composed of a mechanical part Tjand an electrical
part TE,
IJ =
7.. 1J + 7’:.
T.. (132)
The boundary condition corresponding to a free surface is
I IJ = 0
n.2.. on the surface. (133)
Equations (1 3 1) and (133) can also be written in the initial state
and
7i,Ksj = 0 on the surface, (135)
with K , representing the stress components with respect to the initial
coordinate system. That is
with
J = p/p. (137)
Finally, in the natural state,
d zu j aflj
P O F = -9
aa1
and
N,Sj = 0 on the surface, (139)
RESONATORS, DETECTORS, AND PIEZOELECTRICS 121
with
and
J= po/p. (141)
ax, = 0,
and in the initial state as
- 0.
agj -
-
aaj (143)
In Eq. (143),
Subtracting Eqs. (146), (147),and (148), respectively, from Eqs. (138), (139),
and (143), and using Eqs. (128)-( 130), gives the dynamical system
and
3)+ -
aii,
aar aar
Therefore,
where Aljkr and are effective elastic and piezoelectric constants given by
and
where A,, is the effective piezoelectric constant and is the effective di-
electric constant.
RESONATORS, DETECTORS, AND PIEZOELECTRICS 123
and
These quantities depend on the elastic constants of the second and third
order, on the second-order piezoelectric constants, on the electroelastic and
electrostrictive constants, on the second- and third-order dielectric constants,
and on the gradients of the static mechanical displacements and electric
potential.
The dynamic problem is now represented by a set of linearized equations,
which can be solved by the usual manner by replacing the ordinary constants
by the effective ones. A perturbation method (Tiersten, 1978) can be used to
obtain directly the velocity or frequency variations.
For a sinusoidal wave ujeiootin the absence of perturbation, the mechan-
ical equilibrium equation is written
-
(the symbol is now omitted and the notation ,1 is used for alas,).
In presence of a perturbation, the solution becomes ujeiw', and the
equilibrium equation
-pow2uj = (161)
Multiplying the complex conjugate of Eq. (160) by uj and Eq. (161) by the
complex conjugate uj*, integrating over a volume V of the solid limited by a
surface S , and taking the difference, yields
where Ao = o - w,,.
124 JEAN-JACQUES GAGNEPAIN
The effective constants of Eqs. (157)' (158), and (159) are written in the form
-
= Cljkr + 21jkr, (163)
A,,j = e,ij
-
+ G j ? ( 164)
Ejr = &jr + Zjr, (165)
where Cljkr,trlj, and Fjr appear as perturbations of the regular elastic, piezo-
electric, and dielectric constants.
Using Eqs. (153)' (156), and the electrical equilibrium equation
9j,j
= 0, 9.
J.J , = 0 (166)
in Eq. (162)and applying the divergence theorem and the boundary conditions
gives the final relation
P
2p00,Ao J GjGT dV
V
r
+ ij,Ii?rIjc$: + iTIi?rIjc$,r
- c$,jE;.rc$f] dV. (167)
VII. SENSITIVITIES
TO EXTERNAL
PERTURBATIONS
AND
THE DESIGN
OF DETECTORS
A. Temperature
’-fo
= a,(T - To)+ b,(T - To)’ + c,(T -
J T
+ a-,
dt
(173)
where a,, b,, c, are the first-, second-, and third-order static temperature
coefficients of frequency, and a“ the dynamic temperature coefficient. The
quantities a,, b, and c, are generally evaluated from the phenomenological
Bechmann’s constants, and Zis calculated by using the temperature derivative
of the fundamental elastic constants and nonlinear elastic couplings involving
the third-order elastic constants.
Since temperature gradients induce in-plane thermal stresses (Valentin
et al., 1985),compensation is achieved by determining a crystal orientation
such that the two in-plane axial stress components cancel out. This was the
definition given by Eernisse (1976) of the SC-cut.
In quartz crystal resonators, the first- and second-order frequency-
temperature coefficients a, and b, can be compensated. The resulting
temperature characteristic has a cubic shape, with, for instance, a sensitivity
of CZ~O-~/K’ near the upper turnover point for the AT-cut. For SAW
resonators, only the first-order coefficient is compensated (ST-cut), and the
resulting sensitivity s N -40.10-9/K2. Efforts have been made to find a SAW
configuration with a temperature characteristic similar to the BAW AT-cut,
but without real success.
Configurations with high temperature sensitivity and linear characteristics
have also been studied and used as temperature sensors. The BAW LC-cut has
a sensitivity of N 30 ppm/K, and similar characteristics were found for SAW
(Hauden et al., 1980).
The dynamic temperature behavior is characterized by the Zcoefficients of
Eq. (173)with values on the order of lo-’ sec/K for the AT-cut and a few lo-’
for the compensated SC-cut. The SAW dynamic coefficient is similar to that of
the SC-cut one (Hauden and Thtobald, 1980).
RESONATORS, DETECTORS, AND PIEZOELECTRICS 127
B. Forces and Pressures
was presented by Eernisse (1976). This lead to the definition of the stress-
compensated SC-cut, which is very similar to the thermal transient-
compensated cut previously described.
The same generalization was extended to SAW resonators by Bigler et al.
(1987, 1989), who showed the possibility of compensation of two or four
symmetrically applied forces on circular quartz plates.
Bulk w a v e S u r f a c e wave
I5mm 4O m
I 1 1 1 I
30 60 90 120 150
Force aziriiuthal a n g l e
FIG. 17. Force-sensitivity of BAW and SAW resonators.
128 JEAN-JACQUES GAGNEPAIN
- I 4 1 a-
I
I
1:xperiiiieiital points
FIG. 18. SAW pressure sensor.
RESONATORS, DETECTORS, AND PIEZOELECTRICS 129
C. Accelerations
D. Electric Field
:02+
L.
-20t. L .
0 6 12 18 2L
TIME Ittours)
FIG.20. Influence of a DC electric field on a quartz-crystal resonator.
RESONATORS, DETECTORS, AND PIEZOELECTRICS 131
that appears after the initial frequency shift is due to ionic impurity migration
in the crystal.
The presence of interstitial impurities makes the crystal sensitive to
irradiation (Kahan et al., 1987). This phenomenon can be reduced by using
swept crystals, where the ions have been removed by applying a DC field at
high temperature (Martin, 1987).
The results also show how necessary it is to insulate the resonator from DC
voltages when used in high-stability oscillators. Conversely, this sensitivity
could be utilized to use resonators as voltage detectors. But for accurate
voltage measurements, the relaxation effect must be cancelled.
E. Miscellaneous Detectors
New acoustic resonators and delay lines are being developed for detecting
and measuring a large variety of chemical and biological substances
(Motamedi and White, 1987). The principle of operation is still based on the
detection of frequency, phase, or velocity variations, but these are now due to a
change of mass loading on the surface, which is covered with a chemically
sensitive coating. One of the first works on the use of SAW delay line as a
chemical detector is due to Wohltjen and Dessy (1979),Hou and Van de Vaart
(1987). The main difficulty is the selectivity of the coating, which can be
improved by different techniques. Porous coating can admit only molecules
smaller than a pore in diameter. Molecules can be distinguished by their rate
of adsorption (White, 1987). Simultaneous changes of mass loading and of
electrical conductivity were used by Venema and coauthors (1987) for
detecting NO, gas with a SAW delay line having a ZnO-SO,-Si structure. A
similar structure was proposed by Vetelino and coauthors (1987) for the
detection of H,S concentrations.
Most of the effort today is made on SAW detectors. But studies were also
made previously on the possibilities offered by BAW resonators (King, 1971).
More recently, they were used as a quartz hygrometer (Ito, 1987), as an
enzymes detector (Guilbault, 1983), and others.
Various applications were also made of acoustic detectors immersed in a
liquid. The difficulty is the high attenuation of the acoustic wave (of the order
of several dB/MHz/cm), which is minimized by operating, if possible, at lower
frequency and by using acoustic wave with horizontal shear polarization. An
interesting procedure was achieved by White and coauthors (1987), who stud-
ied the propagation of the lowest-order Lamb waves in very thin Si-ZnO
membranes. Velocities of the order of a few 100 mjsec were achieved with
membranes 1 pm thick, which make feasible a detector operated in a liquid.
Similarly, leaky waves were used for measuring liquid viscosity (Moriizumi
and Unno, 1987).
132 JEAN-JACQUES GAGNEPAIN
VIII. CONCLUSION
As has been shown, the basic properties of the crystals are related to the
nonlinear nature of the lattice. Consequently, the characteristics of acoustic
devices, and in particular of piezoelectric resonators, are strongly influenced
by these nonlinearities. Most of the efforts consist in trying to minimize the
nonlinearities that are at the origin of the instabilities of resonators, oscil-
lators, filters, etc. As a by-product, nonlinearities are also used for detection
and measurement of physical or chemical quantities. In both cases, the
control of the nonlinearities in relation to the crystal anisotropy requires
knowledge of the values of its fundamental constants. Today, many crystals
appear to be well characterised, particularly quartz. In fact, some important
gaps still exist. The fourth-order elastic constants are almost completely
unknown, and the temperature dependence of the third-order elastic con-
stants must still be measured. Some uncertainties also remain concerning the
values of the electroelastic and electrostrictive constants. This is the case for
quartz, and a fortiori for the other crystals. In addition to the deterministic
mechanisms that were described, problems of random fluctuations must also
be considered. For instance, the resonant frequency fluctuations of piezo-
electric resonators have not yet been completely explained, in particular the
part of the spectrum that exhibits a 1/f dependence.
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This Page Intentionally Left Blank
Scanning Electron Microscopy in the Petroleum
Exploration Industry
J . M . Huggett
Exploration Department
BP Petroleum Development Ltd .
Moor Lane. London. England*
I . Introduction . . . . . . . . . . . . . . . . . . . . 140
I1. Techniques . . . . . . . . . . . . . . . . . . . . . . . . . 140
A . Backscattered-Electron Imaging . . . . . . . . . . . . . . . . . 141
B. Cathodoluminescence . . . . . . . . . . . . . . . 144
C . Color Imaging . . . . . . . . . . . . . . . . . . 149
D. Fine-Particle Analysis . . . . . . . . . . . . . . . 149
I11. Sample Preparation . . . . . . . . . . . . . . . . . . . . . . 150
A . Critical-Point Drying . . . . . . . . . . . . . . . . . . . . 13!!
B. Freeze-Drying . . . . . . . . . . . . . . . . . . . . . . . 152
C . Cryogenic Drying . . . . . . . . . . . . . . . . . . . . . . 153
D . Conductive Coating . . . . . . . . . . . . . . . . . . . . . 154
E . Polymeric-Film Coating . . . . . . . . . . . . . . . . . . . 155
F. Enviromenmental Cells . . . . . . . . . . . . . . . . . . . . 156
IV . Reservoir Petrography and Diagenesis . . . . . . . . . . . . . . . . 156
A. Introduction to Clay Minerals . . . . . . . . . . . . . . . . . 156
B . Sandstone Petrography and Diagenesis . . . . . . . . . . . . . . 157
C . Carbonate-Rock Petrography and Diagenesis . . . . . . . . . . . . 173
D. Shale Petrography and Diagenesis . . . . . . . . . . . . . . . . 175
E . Scanning Electron Microscopy in Experimental Diagenesis . . . . . . . . 183
V. Paleontology . . . . . . . . . . . . . . . . . . . . . . . . . 185
VI. Qualitative Pore Studies . . . . . . . . . . . . . . . . . . . . . 185
A. Pore Classification . . . . . . . . . . . . . . . . . . . . . 185
B. Direct Observation . . . . . . . . . . . . . . . . . . . . . 186
C. Porecasts . . . . . . . . . . . . . . . . . . . . . . . . 187
D . Fractures in Mudstone Reservoirs . . . . . . . . . . . . . . . . 191
VII . Petrophysics and Reservoir Production . . . . . . . . . . . . . . . 192
.A Introduction . . . . . . . . . . . . . . . . . . . . . . . 192
B. Core Flood Tests . . . . . . . . . . . . . . . . . . . . . . 193
C. Scale Evaluation . . . . . . . . . . . . . . . . . . . . . . 197
D . Qualitative Porosity Measurement . . . . . . . . . . . . . . . . 199
E. Stimulation by Fracturing . . . . . . . . . . . . . . . . . . . 201
VIII . Future Developments . . . . . . . . . . . . . . . . . . . . . . 201
References . . . . . . . . . . . . . . . . . . . . . . . . . 202
* Current address: BP Research Centre. Chertsey Road. Sunbury.on.Thames. Middlesex.
England
139
Copyright 0 1990 by Academic Press. Inc .
All rights of reproduction in any form reserved.
ISBN n-12-014677-o
140 J. M. HUGGETT
I. INTRODUCTION
11. TECHNIQUES
CI c2 I K
Chlorite Chlorite Illite Kaolinite
using the Ortec ZAF program with full matrix corrections. The mean atomic
numbers and BSE coefficients were determined after estimating the H,O
content by difference.
Accelerating voltage: 15 kV.
Probe beam current: 10 nA.
Calculated mineral formulae from the above analyses:
c1: ~ ~ ~ ~ . ~ ~ ~ ~ ~ . ~ ~ ~ ~ ~ . ~ o ~ ~ o . ~ o ~ ~
c2: ~ ~ ~ ~ . 8 z ~ ~ ~ . 8 ~ ~ ~ ~ . ~ ~ ~ ~ o , o 6 ~ ~ o . o i ~ ~ ~ ~
I: l.16Na0.20ca0.01~A~4.07Fe0.~OM~0.0~Ti0,01
MnO.OO)
Si6.35A11.35020(0H)4.
K:K0.0Z(A13.65M~0.10Fe0.07Mn0.GO)Si4.16010(oH)8 '
nification of x 60, they were able to obtain pore data from a sufficiently large
area to obtain realistic porosity measurements. At higher magnifications, the
clay morphology could be viewed. In pores partially filled with clay, the image
contrast between the clay and the resin-filled pore was insufficient for
automatic IA. Quantification of such pores was achieved by subtracting the
area occupied by clay from the bulk pore area. The high cost of Quantimet,
however, did rule out its widespread geological application. In the early 1980s,
simpler and lower-cost IA systems became available. Pye (1984) reports the
use of one such system to produce distributional images of phases in a range of
rock types, including shales, with far superior resolution to that achieved by
x-ray scanning maps produced with a windowless detector.
A major limitation of the BSE-imaging method is that it cannot
distinguish different minerals with the same backscatter coefficient. In a study
that aimed to quantify hydrocarbon reservoirs by mineralogy and pore data,
144 J. M. HUGGETT
Dilks and Graham (1985) showed that there is substantial peak overlap
between the backscatter coefficient histograms used to identify mineral phases.
They found that the sharpest peaks, and therefore the most easily quantified,
were those of quartz, K feldspar, and zircon (Fig. 1). Overlap problems can
now be overcome by using color X-ray maps to distinguish minerals with
similar atomic-number contrast but different chemistry. Cook and Parker
(1988) have shown that by using this approach, the mineralogy and porosity of
reservoir sandstones may be quantified to a similar if not greater degree of
accuracy to the approach that may be obtained through manual point-
counting with an optical microscope, with the additional advantages of speed
and automation. This is probably destined to become a routine petrographic
tool, though it is as yet in its infancy.
B. Cathodoluminescence
TASEIUM FELDSPAR
z
-
U
YI
a
E 10
FIG.1. Pixel-intensity histogram for an image. The arrows are weighted mean backscatter
coefficient values.
SCANNING ELECTRON MICROSCOPY 145
spatial and spectral information. For a general review of CL in the SEM, see
Muir and Grant (1974).
Scanning CL images were first obtained by McMullan and Smith (Smith,
1956), and Smith and Stenstrom (1965) who used a focussed microprobe elec-
tron beam to observe CL from crystals in thin section. The microprobe, how-
ever, is not an ideal instrument for CL, because the optics are poor and it is
expensive to dedicate exclusively for CL work. Subsequent scanning studies
have mostly been of metals (e.g., Horl and Mugschl, 1972) and semiconduc-
tors (e.g., Holt, 1974; Yacobi and Holt, 1986), with only a few published
geological studies (e.g., Grant and White, 1978; Dietrich and Grant, 1985).
Optical microscopes have been preferred for geological studies until quite
recently, because color images were easily obtained and the SEM light detec-
tors were no more efficient than light microscopes. Two types of optical CL
microscopes have been developed.
TABLE I1
MINERALS
AND ROCKS SUCCFSSFULLY IhiACED BY
SEM CL."
Ideal formula
Silica SiO,
Feldspars KAISi,O,, NaAISi,O,, CaAI,Si,O,
Zircon ZrSiO,
Olivine Mg,SiO,
Pyroxene MgSiO,
Kyanite AI,SiO,
Kaolinite AI,Si,O d O H )*
Cassiterite SnO,
Corundum A1203
Sphalerite ZnS
Celestine SrSO,
Anhydrite CaSO,
Apatite CaAPO,),OH
Fluorite CaF,
1. Geological Applications
CL of quartz has three major petrological applications:
1) Distinction between grains and cements of the same mineral (usually
quartz in the SEM and carbonates in the light microscope);
2) identification of provenance from the style of quartz luminescence;
3) recognition and differentiation of quartzitic rock fragments.
SCANNING ELECTRON MICROSCOPY 147
SEM-CL of diagenetic quartz fabrics makes the distinction between
quartz grains and their overgrowths simple. Moreover, authigenic quartz-
cemented fractures within grains, which cannot be detected either optically or
with other electron-beam techniques, are easily recognized. MacQuaker et al.
(in press) have used SEM-CL systems with a parabolic mirror to examine both
reservoir sandstones and silty mudstones. In all cases, they were able to
observe luminescence and complex diagenetic zonation, even in overgrowths
< l p m (Fig. 2). Kearsley and Wright (1988) have used the same system to
distinguish between sutured grain contacts that are due to pressure solution
(i.e., silica loss) and those produced by silica cement growth (i.e., silica gain).
With SEM CL, all porosity-reducing mechanisms-cementation, pres-
sure solution, and mechanical compaction-can be quantified. In combina-
tion with the chemical data that can be provided by x-ray analysis and BSE
imaging, this is a powerful technique that should become routine for quan-
titative sandstone-reservoir petrography.
Spectral analysis of CL emission from quartz grain cores show a variety of
colors, with a violet-blue being most common (analysis of the impurity
contents of the quartz shows that crystals with high titanium concentrations
and low iron concentrations luminesce blue, whereas crystals with low
titanium concentrations and high iron concentrations luminesce red (Sprunt
and Nur, 1980; Sprunt, 1981). Authigenic quartz cements give a marked blue
response, but also show longer wavelengths of low intensity “brown.” Imaging
of narrow wavelength bands will undoubtedly distinguish quartz grains of
different origins and discrete zones within cement overgrowths. The light
wavelength data can be collected and displayed as spectra, but at present there
is no software available to correct for absorption effects. Consequently, the
spectral data remains qualitative. It should, however, be possible to use the
chemical data derived from spectra to find answers to some important
unsolved problems: namely, the actual nature of luminescence centres, their
distribution, and the cation ordering of luminescent ions.
Krinsley and Hyde (1971) and Krinsley and Tovey (1978) demonstrated
the value of SEM CL in environmental analysis based on surface textures.
They recognized at least seven different CL contrast features in quartz grains.
These features are primarily due to properties of the crystal lattice rather than
chemical or topographic factors, and are believed to be the result of abrasion
or stress that has altered lattice conditions. By using SEM CL, Krinsley and
Tovey were able to measure the area and thickness of disrupted lattice quartz
on and within quartz grains. They proposed that these parameters may be a
function of the degree and conditions under which grinding occured, i.e., they
may reflect the energy of the environment in which the grains have been
transported. For instance, quartz sand grains from dune, beach, and
weathered granite environments show fewer cracks in SEM CL than do those
148 J. M. HUGGETT
(b)
FIG.2. (a) BSE micrograph of quartz grains with overgrowths;(b) SEM-CL micrograph of
the same area reveals four growth zones in the overgrowth.
SCANNING ELECTRON MICROSCOPY 149
that have at some time passed through a glacial environment (Krinsley and
Hyde, 1971). The use of this approach in identification of sedimentary
environments is strictly limited to recent sediments, because the disrupted
lattice layers heal with time.
C. Color Imaging
D. Fine-Particle Analysis
By using a combination of x-ray analysis and IA software, size, shape, and
chemical data may be obtained for particles dispersed on a low atomic-
number contrast substrate. The particles should be larger than the volume of
the probe being used if meaningful chemical data is to be obtained, and smaller
than the area being scanned. From the point of view of IA, fine-particle
analysis is easier than making pore measurements, because the particle
boundaries are clearly defined. The particles to be analyzed should be
mounted on a low-mean atomic-number substrate, such as a polycarbonate
filter, and well dispersed to avoid overlap, as overlapping particles of differ-
ent composition cannot be placed in the mineralogical classification. Particles
150 J. M. HUGGETT
111. SAMPLE
PREPARATION
Under reservoir conditions, porous rocks contain fluid, with the exception
of dry gas reservoirs. It is adequate to examine air-dried rock; however, if
delicate, fluid-supported, fibrous or filamentous minerals such as illite or
hydrous clays such as smectite are present, air-drying will distort the
appearance of the minerals and may cause them to collapse or curl up. This
may be very significant in reservoir studies, since collapse of clay particles
alters the reservoir properties, in particular the permeability. To avoid this,
special drying techniques are required. These include critical-point drying
(reviewed by Cohen, 1977), freeze-drying from water and nonaqueous
solutions (de Harven et al.; 1970), and cryopreservation (Sargetn, 1982; Read
et al.; 1983). Without appropriate core preservation and drying, it is difficult
to interpret clay mineral textures and hence their effects upon reservoir
properties. This problem is particularly accute in the case of fibrous illite
cements.
If it is desirable to examine the rock in a wet state, special techniques are
again required. Fluid-filled rock samples cannot be placed directly into a
conventional SEM, because the water would vaporize and interfere with the
electron generation and/or detection system. The effect of hydrocarbons is
even worse, because they evaporate and deposit a contaminating organic layer
on the inside of the column. To overcome these problems, the samples must
either be dried and all traces of hydrocarbons removed, or volatile compo-
nents must be prevented from escaping up the microscope column, either
through freezing or through use of an environmental cell.
A. Critical-Point Drying
B. Freeze-Drying
C . Cryogenic Drying
Cryogenic methods of specimen drying probably produce the least
shrinkage and distortion of water-bearing or water-supported structures. As a
result, the morphologies are believed to most closely resemble those in the
undried sample (Sargent, 1982).
Cryosystems provide a rapid method of SEM sample preparation. The
sample (which should be a few mm in diameter at most) is rapidly frozen by
plunging it into nitrogen slush at approximately -210°C. The specimen is
transferred under vacuum from the rapid-freezing chamber to a prechamber
attached to the SEM, where it can be fractured and coated with a conductive
layer. The specimen is then ready for examination on the SEM cold stage,
which is kept at a temperature of - 190°C by a flow of liquid nitrogen.
Cryopreservation has been used with moderate success to examine cores
cut in oil-bearing sands within permafrost (unpublished work by the author).
The technique was successful in so far as the oil did not evaporate and the
sample remained intact, allowing observation of textures (previous attempts
at sample preparation at room temperature had resulted in total disintegra-
tion). It was unsuccessful in that equipment problems resulted in ice for-
mation partially obscuring the sample surface and limiting petrographic
observation. Once such problems are overcome, the technique should prove
of great value to petroleum geologists wishing to examine either oily or un-
consolidated reservoir sands.
The relative position of various fluids within the pores of reservoir rocks
has been a major point of interest for those interested in secondary and tertiary
hydrocarbon recovery. The wettability, surface tension, and capillarity of
fluids in pores of various sizes and shapes, and with various lining minerals,
are factors that directly affect ultimate recovery. Laboratory measurements
and observations can provide indirect evidence, but until cold-stage SEM
became a reality, the direct observation of fluid-rock and fluid-fluid
interfaces within reservoir rock was not possible. This is an application of
SEM that has exciting prospects for the petroleum industry but is as yet in its
infancy.
154 J. M. HUGGETT
D. Conductive Coating
As a matter of principle, totally unknown samples should always be
examined uncoated first. If a sample has surface features, these can be
FIG.5. Eldorado crude oil and brine in Berea Sandstone. B = brine, 0 = crude oil. Bar =
100 pm.
SCANNING ELECTRON MICROSCOPY 155
concealed by coating, or if the sample is unstable at the temperature at which
coating is carried out, it may be damaged or dehydrated. Most rock samples
can be examined uncoated at low kV, although they are nonconducting,
because the small amount of charge that accumulates is insufficient to be
detected in the image. If, however, as is often the case, it is desired to carry out
x-ray analyses, it is necessary to work at a minimum of 10 kV (20-25 kV is the
norm). Consequently, because rocks are poor conductors, they require
coating. Poor coating will result if a sample is not properly cleaned of
hydrocarbons, or if it has high microporosity that is not adequately degassed
before coating. Wispy illite often proves difficultto coat adequately to prevent
charging. In the authors experience, this is best overcome by using as small a
sample as possible, leaving it pumping overnight before coating, and applying
a light coat of carbon or gold. For most geological purposes, applying a
conductive coating does not interfere with observation of the sample, because
it is not necessary to work at such a high magnification that the coating can be
seen. However, a low-temperature coater should always be used if clays are
known or thought to be present in a sample to avoid structural or physical
damage to the clay.
E. Polymeric-Film Coating
F. Environmental Cells
Iv. RESERVOIR
PETROGRAPHY AND DIAGENESIS
Most SEM studies in the petroleum industry come under the topic of
reservoir petrography and diagenesis. Diagenesis is the physical and chemical
modification of sediments after deposition; it is often thought of as the process
that makes a sediment into a rock, athough this is not strictly true, since the
sediment may still be uncemented after diagenesis. Diagenesis affects the
quality of sedimentary hydrocarbon reservoirs from the time of deposition
onwards. The final porosity and permeability of a sandstone is greatly
affected, even after burial-induced compaction, by the growth of authigenic
minerals, particularly quartz overgrowths, clays, and carbonate minerals.
SEM is an ideal tool for examining the effects of diagenesis on reservoir
properties, if the depth and timing of such diagenetic alteration can be
measured and the extent of diagenesis estimated, then prediction of the
diagenetic state of undrilled sandstones may become possible and diagenesis
related more closely to the timing of hydrocarbon migration and the
formation of hydrocarbon traps.
FIG.8. Pressure-solutionscars are easily identified in SEM images. Scale bar = 100 pm.
SCANNING ELECTRON MICROSCOPY 161
grain size and temperature on pressure solution, quartz cementation, and
porosity in the quartzose Hartshorne Sandstone, from the Arkhoma Basin,
Ontario. He observed that the diameter of pressure-solution scars relative to
the grain diameter in sandstone increases in proportion to thermal maturity
(i.e., the maximum burial temperature). The absence of clay diagenesis has
been claimed as a reason for lack of quartz cementation in sandstones of the
Akata and Agbada Formations, Tertiary of the Niger delta (Lambert-
Aikhionbare and Shaw, 1982). They suggested that the lack of alteration of
authigenic smectite in the reservoir, which, if it had occured could have
released silica into pore solutions, and the presence of thick clay films around
the detrital grains are the principal causes for the poor development of quartz
overgrowths.
Whether or not clay coats on quartz grains inhibit overgrowth precipita-
tion has been widely debated in the literature. Colter and Ebbern (1978)
found that coats of tangentially arranged clay platelets (i.e., effectively con-
tinuous) did not seem to inhibit overgrowth nucleation. However, it is now
generally accepted that whilst thin illite or smectite coats may encourage
pressure solution and the formation of silica cements, thick clay coatings,
especially if of kaolinite and chlorite, will inhibit quartz overgrowth develop-
ment (Heald, 1956; Siever, 1959; Pittman and Lumsden, 1968; Heald and
Lareses, 1974; Houseknecht and Hathon, 1987). Clay coats that appear not
to have inhibited quartz overweight formation are probably discontinuous;
this is substantiated by TEM studies (Huggett, 1982).
2. Clay Petrography and Diagenesis
The use of SEM in reservoir studies had become routine by the late 1970s,
but because it could not be used in a quantitative manner, it was largely limited
to identifying authigenic (i.e., formed in situ) and detrital minerals, and
unravelling diagenetic sequences. In this latter role, SEM has proved
invaluable. An understanding of clay mineral occurrence is important
because, firstly, authigenic clays in sandstones have a huge surface area in
contact with the pore fluid, secondly, pore-filling and grain-coating clay
minerals can drastically reduce reservoir permeability, and thirdly, direct
observation of samples with the SEM makes it possible to distinguish the
genetic sequence of mineral cements. A combination of SEM and x-ray
analysis (XRA) is particularly effective for identifying mineral species. It
should be remembered that many of the geological SEM studies before about
1975 were carried out without the benefit of an x-ray analyser and that the
identification of minerals was based on morphology and independent x-ray
diffraction data. Moreover, even after XRA became a routine aid to
identification, analyses remained qualitative due to the problems of x-ray
“contamination,” which occur with rough specimens typical of those
162 J. M. HUGGETT
examined by petroleum geologists. There are now software packages available
that allow quantitative analysis of rough surfaces, but they are not widely used
in the petroleum industry, where it is felt that qualitative analysis is usually
adequate.
Before describing the role of SEM in reservoir studies in general, a brief
description of the distribution and crystal habit may be of benefit to the reader
unfamiliar with the subject.
The 1970s saw an outburst of publications on sandstone diagenesis and
reservoir properties that were illustrated with scanning electron micrographs,
mostly of clays, but also quartz and feldspar grains and their overgrowths.
Bohor and Hughes (1971) published micrographs showing a wide range of
morphologic features of kaolinite (the most common member of the kandite
group of clays) from sandstones, clay deposits, geodes, and underclay deposits
beneath coals. In the authigenic clays, they observed growth-related pheno-
mena such as layering, crystal habit, topotaxis, twinning, and spiral growth.
Detrital kaolinite consists of ragged, disaggregated plates. Authigenic kaolin-
ite morpholog y has also been studied in detail and reported in many papers
by Keller and co-workers (e.g., Keller, 1976a, b; Keller and Haenni, 1978;
Keller et al., 1986).This is largely a reflection of the commercial value of kaolin
deposits. Kaolinite and to a lesser extent dickite (another kaolin mineral)
have also been described in many reservoir studies (e.g., Amr, 1971; Stalder,
1973; Sommer, 1975; Pittman and Wilson, 1977; Land and Dutton, 1978;
Odom et al., 1979; Huggett, 1982, 1984; Kantorowicz, 1984; Goodchild and
Whitaker, 1986; Cowan, 1988). Authigenic kaolinite morphology may be
controlled by environment and time, relative to compaction, of deposition,
also pore fluid chemistry and possibly the parent minerals that have been re-
placed by the clay. Platey kaolinite morphology (Fig. 9) is thought to be evi-
dence of compaction or a result of further kaolinite precipitation in an already
tightly packed pore; conversely, blocky kaolinite (Fig. 10) may be indicative
of formation after compaction and formation of any platey kaolinite present
in the same sandstone (Huggett, 1982). Cowan (1988) reports early, poorly
crystalline, small particles of kaolinite and late, well-crystallized large parti-
cles. Authigenic kaolinite can also occur as an in-situ replacement of detrital
mica and chlorite in sandstones and mudstones (Huggett, 1982; White et al.,
1984,1985).BSE of polished thin sections is the technique used for examina-
tion of these very-fine-scale clay mineral intergrowths. Figure 1 1 shows a typi-
cal complex assemblage of clay minerals replacing chlorite. By using BSE
imaging and XRA, it was a simple procedure to unravel the sequence of
events. Huggett (1982) and White et al. (1984) showed authigenic clays in
mica and chlorite “stacks” to be interlayered on a scale not previously recog-
nized (Figs. 12 and 13), with clear deformation of the detrital phyllosilicate
structure caused by the authigenic clay. In Fig. 13 the fine-scale intergrowths
SCANNING ELECTRON MICROSCOPY 163
FIG. 12. BSE micrograph of detrital chlorite partially replaced by apparently cohesive
kaolinite.
SCANNING ELECTRON MICROSCOPY 165
1978; Huggett, 1982) are also common. It is less easy to determine whether
these are authigenic but ragged, detrital, or recrystallized detrital illite.
Chlorite (Fig. 14) also occurs as platelets. In authigenic form, these are
usually pseudo-hexagonal, often arranged on grain surfaces with a radial
boxwork texture. More rarely, chlorite has a blocky pseudo-hexagonal
morphology, which is visually indistinguishable from blocky kaolinite.
Detrital chlorite is usually indistinguishable (on the basis of morphology
alone) from mica, when coarse grained, or detrital illite, when fine grained.
Authigenic chlorite in reservoirs is less widespread than authigenic illite or
kaolinite, however it has been well described (Land and Dutton, 1978; Alford,
1983; Kantorowicz, 1984; Huggett, 1984; Imam and Shaw, 1985; Hurst and
Archer, 1986). This is largely because early grain-coating chlorite is found
preserving porosity through prevention of quartz overgrowth nucleation (e.g.,
Imam and Shaw, 1985) and therefore can have an important influence on
reservoir quality (Fig. 14). However, more pervasive, late pore-filling chlorite
reduces porosity and permeability (e.g., Janks et al., 1985).
Authigenic smectite in sandstones consists of irregular, undulose platelets,
which form radial honeycomb grain coatings in samples (Fig. 15). Detrital
smectite is not generally observed due to its similarity to the more common
detrital illite. Authigenic smectite in hydrocarbon reservoirs is relatively rare
and hence infrequently described (Stanley and Benson, 1979; Lambert-
Aikhionbare and Shaw, 1982). It is tentatively recognized on the basis of x-ray
analysis and its honeycomb morphology.
Even less SEM data is available on interstratified clays. SEM data alone is
insufficient to identify these clays with certainty, because neither their
morphology nor their chemistry is sufficiently distinct to distinguish them
from their pure end-member constituents. X-ray diffraction data is required to
identify the interlayering. Tompkins (1981) describes corrensite (mixed-layer
chlorite smectite) from a reservoir sandstone in the Guadaloupe Formation
(Permian), West Texas. He concluded that this clay may be distinguished from
chlorite by its undulose honeycomb morphology. Consequently, it is usually
indistinguishable from smectite. Illite smectite is similar to illite in appearance
when it contains mostly illite layers, and similar to smectite when most of the
layers consist of smectite (e.g., Hurst and Irwin, 1982; Burley, 1984; Pollastro,
1985; Keller et a/., 1986). Keller et al. (1986) used SEM to examine the
morphology of illite smectite from deeply buried bentonites and hydrother-
mally altered Tertiary volcanic rocks from Japan. They found that the clay
morphology changed from the honeycomb appearance of smectite (Fig. 15) to
the platy appearance of illite (Fig. 16) at a composition of roughly 60-70%
illite layers. Pollastro (1985) records honeycomb illite smectite (also identified
by x-ray diffraction) with rigid laths and plates of ordered, highly illitic, illite
smectite growing out from the surface of less illitic illite smectite. From this,
168 J. M. HUGGETT
2000
/-\
'O0O I Areas marked represent /
/ ' \
- the main concentrations / /
- of points I /
I /
- I /
/ /
KAOLlNlTE
/
100- -- CEMENTED
WELL
/
/
/ I
- / I
/
- /
/
/
/
10 -
/
--
/ / I
/ I I
- I f I
1-
- / / ILLITE
/
L-'
/
, CEMENTED
WELL
0.1 I I I I I
0 4 8 12 16 20 24 1
FIG. 17. Effect of the type of clay mineral cement on permeability of porous Rotliegend
sandstones of the North Sea basin. (From Stalder, 1973.)
hence cut well costs. However, most oil company work still uses core material
rather than cuttings, because core is required for many other geological and
petrophysical measurements.
SEM has proved a particularly useful means of studying sandstones that,
either because they are fine grained or argillaceous, have low permeability.
This is because it is usually straightforward to distinguish between authigenic
and detrital clay. Thomas (1978) found that early authigenic illite formation
had reduced permeability and effective porosity in shaley sands from
Wyoming and Alberta. As a result of early pore space reduction by authigenic
clays, fine-grained sandstones, such as these, are poor liquid-hydrocarbon
reservoirs but are still potential targets for gas. Pollastro and Bader (1983)
used detailed SEM and x-ray diffraction studies to obtain detailed mineralog-
ical characterizations of low-permeability gas and oil-bearing sandstone and
shale sequences in the Green River Basin, Wyoming. They found discrete
detrital illite to be abundant in the shales and authigenic chlorite in the
SCANNING ELECTRON MICROSCOPY 171
sandstones. In the cleaner sandstones, they also found authigenic illite
smectite. The authors point out that, because of these differences in clay
mineral assemblages between the sandstones and the shales, log interpre-
tations of these and similar low-permeability sandstones should not be
extrapolated from adjacent shales.
5. Carbonate Cementation
Carbonate cement in sandstones that is present as tiny crystals (micrite) is
readily observed. However, sandstones that have large crystals of pore-filling
carbonate are not usually suitable for fracture surface SEM examination
because the samples tend to fracture across the cement crystals, and the
infilling of interparticle porosity by the carbonate limits observation of any
earlier clay or overgrowth cements. Consequently, this SEM technique has not
been widely applied to the study of carbonate cements in sandstones.
SCANNING ELECTRON MICROSCOPY 173
BSE of polished thin sections has proved more informative. Coupled with
quantitative x-ray analysis it is possible to obtain data on the chemistry and
zoning of the cement. From this, the pore-fluid history may be deduced.
1. Source-Rock Studies
Little is known of carbonates as source rocks compared with clastic source
rocks, and until recently there has been a reluctance by petroleum geologists to
accept that it is probable that some oils are sourced from limestones. Ferguson
(1987) showed that modern ooids can be artificially matured, using enhanced
temperature and pressure, in the presence of natural sea water, so that an
evolutionary series of kerogen and soluble hydrocarbons is produced that is
comparable with material isolated from British Jurassic ooliths. He confirmed
by SEM that the concentric voids between layers or aragonite needles and the
smaller voids between intermeshing needles in modern ooids are normally
filled with algal material. This, however, is probably only a minor source of
hydrocarbons.
Most SEM petrographic studies of shales have been concerned with the
fabric. Until recently, this is probably because they were too fine grained for in-
depth petrographic analysis using SEM. Now, high-resolution SEMs are
available, and thorough studies of shale petrography are possible. So far, very
little at all has been published.
Shale fabric is of special interest to petroleum geologists in connection
with hydrocarbon migration, identification of depositional environment, and
the ability of shales to act as seals to hydrocarbon reservoirs. Shales are also a
common source of problems during drilling (most frequently, caving in, to give
an abnormally large hole that upsets downhole log measurements, and
swelling, which can cause the drill bit to stick). Such problems can often but
not always be ascribed to the presence of unstable minerals. When this is not
the case, the cause is likely to be physical rather than chemical, and
examination of the shale fabric and textures in the SEM could prove infor-
mative. So far, this use of SEM has not been taken particular advantage of.
176 J. M. HUGGET’I
1. Fabric Measurement
Gipson (1965) demonstrated that SEM can be used to measure particle
orientation and fissility in shales by means of the “gap” test and the “chi-
square test” to determine particle orientation. Combined optical and electron
microscope studies revealed that particles in a fissile shale that overall exhibit
a strong preferred orientation locally have a random distribution. It was
inferred from these studies that fissile planes occur:
1) in zones of preferentially oriented particles;
2) at interfaces between zones of preferentially oriented particles and
organic matter;
3) at interfaces between zones of randomly oriented particles and organic
material.
In a study of Ordovician shales from Ontario, Gillott (1969) showed that
although a shale may display well-developed fissility in hand specimen and
even when examined at low magnification with a SEM, high-magnification
SEM images show a surprising degree of random arrangement of platey
particles. These findings were confirmed by Huggett (1989), who also showed
that the numerical x-ray diffraction method for fabric measurement described
by Gipson (1966) can be correlated with SEM fabric studies. This enabled a
numerical classification of fabric types observed with the SEM, which could be
incorporated into a statistical analysis of the correlations between fabric,
mineralogy, and textures. Fabric studies may improve our understanding of
shale behavior during drilling.
3. Shale Diagenesis
Because most theories of diagenesis rely to some extent upon exchange of
fluids containing reactive ions, between shales and sandstones, an understand-
ing of shale petrology and diagenesis is needed if sandstone diagenesis is ever
to be fully understood. This topic is covered in the section on BSE microscopy,
because this is the SEM technique generally used to investigate shale
petrography and diagenesis.
Most published geological BSE studies have been of shales (Krinsley et al.,
1983; Pye and Krinsley, 1983; White et al., 1984; Shaw and Primmer, 1987;
Primmer and Shaw, 1989; Huggett, 1989). This is undoubtedly because
electron-microscope resolution is almost essential for detailed petrographic
analysis of shales, with the optical microscope being inadequate for most
petrographic studies of fine-grained rocks. Indeed BSE imaging has probably
been partially responsible for the increasing interest shown in shales by
geologists. The burial diagenesis of shales is slowly becoming of major
research interest in petroleum geology. The nature of the pore fluids expelled
from shales and their role in sandstone diagenesis, organic maturation, the
importance of fabric to seal capacity and hydrocarbon expulsion, the relative
178 J. M. HUGGETT
FIG. 18. BSE micrograph of fossil shell containing authigenic chlorite and illite smectite.
180 J. M. HUGGETT
shells and foraminifera tests. Pye et al. (1986) also noted infilling and
replacement of foraminifera tests by illite; but perhaps because they did not
observe the illitization of illite smectite with increasing depth observed by
Shaw and Primmer, they concluded that this mineral is at least partially
neoformed and not entirely produced through the transformation of smectite.
However, it is important to remember that the pattern of shale diagenesis
found in the Gulf Coast differs from that in many other sedimentary basins
such as the North Sea, the Niger Delta, and the Po basin. The vast number of
publications on the Gulf Coast can give an unbalanced view of the global
variation in shale-diagenetic pathways. In contrast to the Gulf Coast, many
North Sea Jurassic shales initially contained little smectite or mixed-layer
illite smectite relative to degraded micas, and experienced low burial
rates (Irwin et al., 1977; Huggett, 1986; Pye and Krinsley, 1986; White et al.,
1984). White et al. (1984) also examined an argillaceous oil shale of
Carboniferous age from Lothian, Scotland. The microstructure of the clay and
pyrite framboids, and the angular quartz grains and calcite are clearly
seen in the BSE micrographs (Figs. 19 and 20). The compaction of the
FIG. 19. BSE micrograph of an oil shale showing a vein or fossil fragment of calcite.
SCANNING ELECTRON MICROSCOPY 181
FIG.20. BSE micrograph of an oil shale showing the presence of pyrite framboids.
phyllosilicates around the large quartz fragments and the pyrite framboids are
clearly visible. Optical microscopy revealed neither the compaction, nor the
blocky nature of the calcite. BSE imaging also revealed fine-scale inter-
growths in the clays of illite and chlorite (identified by x-ray analysis). X-
ray mapping was used to map out areas rich in elements characteristic of
specific minerals; Fig. 21 shows how this was used to map carbon. The ability
to image-map for carbon, in addition to oxygen and nitrogen, allows the
distribution and diagenesis of individual grains of organic matter to be
monitored in terms of these elements. This could prove important in
improving understanding of organic maturation and migration processes in
oil source rocks, because current source-rock studies are, with few exceptions
(e.g., unpublished work by Kearsley), concerned with the bulk organic matter
rather than individual in-situ particles.
FIG.21. (a)BSE micrograph of an oil shale with the discrete organic matter appearing very
dark; (b) secondary electron image of the same specimen in 6(a). The internal structure of the
organic matter is now visible. (c) Map showing distributionof elemental carbon seen in the same
specimen as 6(a),confirming the high carbon content to be expected in the organic particles. The
higher the carbon concentration,the more intense is the signal (same scale as (a) and (b)).
FIG.24. Kaolinite platelets experimentally grown on feldspar grain in acidic solution with
high fluid-rock ratio at 200°C and 500 bar. (From Huang et al.,1986.)
SCANNING ELECTRON MICROSCOPY 185
V. PALEONTOLOGY
The study of surface features of microfauna and microflora was one of the
earliest geological applications of SEM (e.g., Hay and Sandberg, 1967; Wise
and Hay, 1968a,b; Muir, 1970).With SEM, highly detailed observations could
be made of the surface features of microfauna and flora (particularly pollen
grains). This resulted in major improvements in classification and hence in
biostratigraphy. This in turn had important consequences for the petroleum
industry: better well correlation and better climatic and environmental
interpretations. Today SEM continues to be widely used in paleontological
studies.
PORESTUDIES
VI. QUALITATIVE
A. Pore ClassiJication
B. Direct Observation
Porosity may be directly observed in the SEM using either fracture surface
samples or polished thin sections. BSE of polished thin sections is particularly
valuable for observing pore-filling cement and porosity distributions in 2D.
Cowan (1988) used BSE imaging in this manner to complement SE fracture
surface imaging and other standard petrographic techniques in a study of
the diagenetic textures in Carboniferous reservoir sandstones from the East
Midlands, United Kingdom.
Most oil companies use SEM to make simple visual assessment of poros-
ity. But it is permeability that determines whether a reservoir with good po-
rosity will flow, and this is hard to estimate using SEM. In one of the earliest
SEM pore studies, Weinbrandt and Fatt (1969) attempted simple permeabil-
ity measurements using SEM. This was probably the first study to produce
SCANNING ELECTRON MICROSCOPY 187
semiquantitative measurements from SEM images of porosity, pore sizes, and
the tube interconnection parameter, B,which is defined as the number of flow
channels connected to each flow channel. Stereo pairs were found particularly
useful for B-parameter measurement, because the additional depth perception
enabled the viewer to recognize pores partially obscured by overhang. The
connectivity has also been expressed as the number of throats connecting each
pore by Wardlaw and Cassan (1978),who called it the “coordination number.”
Timur et a/.(1971) used SEM to investigate the pore systems in a diverse group
of lithologies at magnifications, which for the time, were very high (over
x 10,000).The main purpose of this study was to investigate the extremely
small pores in shales and granites, which had not previously been imaged; they
did, however, also examine sandstone, limestone, and dolomite.
In a study of the Spirit River Sandstone (a tight gas sandstone), Walls
(1981) used qualitative SEM observations to interpret the measured permea-
bility data. He concluded that pore structure was the major factor in
determining permeability behavior, with clay content being of secondary
importance in the Spirit River Sandstone. Pore types identified were flat cracks
between quartz grains and a few open pores partially filled by illite. He
concluded that the flat cracks provide most of the permeability at low effective
pressures, however they would easily be closed by increasing overburden
pressure and may not be significant at reservoir depths.
SEM has been widely used to determine porosity types in fine-grained
carbonate reservoirs. In North Sea Cretaceous Chalk SE (Harper and Shaw,
1974; Rickards, 1974; Mapstone, 1975; Kaldi, 1982; and others), Matiisen and
Shehata (1987) showed that the two main porosity types in the Midale Beds of
the Tatagwa oil field, Southern Saskatchewan, could be related to reservoir
properties measured from core plugs and downhole logs. The Midale Beds
consist of a marly dolomite with good to excellent intercrystalline porosity
and a vuggy unit with intergranular, moldic, and vuggy porosity. Because of
the varying types of porosity and its varying areal distribution, these two
limestone units show a significant difference in reservoir characteristics.
Consequently, each one requires a separate approach with regard to
completion, production, and enhanced recovery.
C . Pore Casts
Pore casts are epoxy-resin replicas of pore space. Prior to the widespread
use of SEM in petroleum geology, pore casts had not been much used, because
light microscopes are inadequate for examining all but the largest pores and
pore throats and have a severely limited depth of focus.
Pore casts are undoubtedly the best technique available for evaluation of
pore shapes and their connectivity, but they have the disadvantage of not
188 J. M. HUGGETT
Many economic gas reservoirs exist in shales in the United States, though
not worldwide. In these reservoirs, fractures are the crucial conduits.
SEM observations of shales suggest that microfracturing does not make a
significant contribution to mudrock porosity (Nuhfer et al., 198 1; Huggett,
1988). Natural macrofractures enhance production flow rates, but appear to
provide a minor contribution to total reservoir storage volume (Nuhfer and
Vinopal, 1978; Vinopal et al., 1979; Vinopal, 1981). Most gas encountered in
macrofractures is depleted during the first few hours of production (Schettler,
1979). Nonetheless, the presence of natural fractures in gas wells can improve
production, and the completion of such wells by hydraulic fracturing is a
proven method for increasing production.
SEM study of the surfaces of natural fractures has helped to explain why
some fractures are associated with increased open flow to wells, whereas others
are not (Vinopal et al., 1979). Fractures with high open flow invariably have
surfaces whose original fabric is undamaged (Fig. 28). In contrast, those
VII. PETROPHYSICS
AND RESERVOIR
PRODUCTION
A . Introduction
and Wu, 1983).This has the advantage over the first method that there are less
likely to be differences between the two ends of one plug than there are
between two plugs. The slices are examined in the SEM to determine the grain
and pore structure prior to treatment. After the flow test, the treated core plug
is examined using the untreated ends as a reference for evaluating changes. The
plugging of pores and dissolution effects may be observed, but because the
same pores and grains are not examined before and after the test, minor
changes, such as small-scale calcite dissolution, may not be detected. Nor is it
possible to be sure whether an open pore was previously filled with loose
particles or not.
Kantorowicz et al. (1986) used SEM to examine sandstones, partially
cemented by thin quartz overgrowth and siderite, before and after acidization.
They found that acidization removed siderite and chlorite, with a consequent
slight rise in porosity. However, the dissolution released fine clays and silt-
sized quartz grains into the pore space. This countered any improvement in
permeability resulting from the siderite and chlorite dissolution. In addition,
the thin quartz overgrowths were etched, resulting in an increase in the
proportion of loose grains. These results indicate that acidization could result
in either production of sand and other fines with the hydrocarbons, or the fines
could cause minor blockage of the pore throats around the wellbore. Which of
these happens will depend upon whether the fines are predominantly smaller
or larger than the pore throats. Neasham (1980)showed that whilst kaolinite is
stable in the presence of acid, because it is frequently loosely attached to grain
surfaces, it has the potential to be mobilized when fluid flow occurs during
production. Kantorowicz et al. (1986) also examined sandstone core plugs
before and after water injection. Permeabilities measured on the same plugs
were lower after injection, but some of the loss was reversible. The authors
concluded that the reversible permeability loss was due to fines migration, and
the irreversible loss was due to expansion of swelling clay.
The effect of brines saturated with CO, on limestone reservoirs was
investigated and observed by Sayegh et al. (1987) and Krause et al. (1987) using
SEM. The core floods were conducted in both “circulating” and “once-
through” modes. The measured permeability changes during flooding ranged
from large increases to decreases. All postflood cores showed dissolution
textures. Large crystal faces display rhombic corner- and staircase-etching
features, whilst etching in micrites gives the rock a chalky appearance, which
close up was seen to be due to micron-sized needles and abundant crystal-
shaped pits. SEM observations also showed that the brines etched and
followed preferred paths, forming a braided network of variably sized tubules.
Insoluble minerals such as quartz and illite bound to the matrix and mixed
with drilling fines were released during the etching process. These migrated
and, in some cases, became lodged in constrictions. Hence, as with acidization,
SCANNING ELECTRON MICROSCOPY 195
the result of using carbonated brines, from the point of view of enhanced oil
recovery, may or may not be beneficial.
McLane and Scott (1983)also used SEM to study the effects of acidization
on reservoir rocks, but in an indirect manner. They were concerned with
evaluating the maximum HCl strength that may be used in acid stimulation of
a highly fractured, slightly dolomitic sandy limestone from the Mission
Canyon formation, North Dakota. The rock was characterized through
detailed SEM/x-ray analysis and optical microscopy. One-gram samples were
tested for acid solubility by placing them in 5 % , 15%, and 20% HCI at room
temperature and allowing them to react for three hours. The fines remaining
after dissolution were examined by SEM and analyzed by using an EDS
attachment. They were found to consist of quartz, illite, illite-smectite, albite,
and incompletely dissolved dolomite and anhydrite. The proportion of sample
remaining after acid treatment (i.e., the fines) decreased with acid strength,
thereby confirming that low-strength acid is most suitable for acid stimulation
because it releases fewer fines than does high-strength acid.
A system whereby the same point in a sample was examined before and
after treatment was used by Thomas et al. (1976). The samples were reference
marked before examination so that clay particles could be relocated. After
preliminary examination in the SEM, the samples were stripped of their
conductive coating (aluminium rather than gold or carbon was used for the
coating because it is easily removed by acid), treated, recoated, and re-
examined with the SEM. Thomas et al. (1976) used this technique to evaluate
the effects of commonly used stimulation (HCI and mud acid) and clay
stabilization treatments (hydroxy aluminium and zirconium oxychloride) on
Berea Sandstone. Results showed that on prolonged exposure, hydroxy
aluminium forms extensive deposits on clay surfaces and produces fusion of
platelets. Zirconium oxychloride, however, was found to stabilize clays
without buildup of reaction products on the clay surface. Mud acid was found
to rapidly dissolve clays within the matrix of the rock, with negligible attack
upon the sand grains.
The technique described above has two disadvantages. The samples
examined are not those used in the flow tests, instead they are saturated with
the solutions, whilst the core flow test samples are simultaneously flushed with
the same solutions. The effect of flow (as opposed to saturation) on particle
movement and filtrate straining can therefore not be evaluated. The other
disadvantage is that the aluminium coating is stripped with a 28% HCI
solution. Thomas et al. demonstrated that this caused no morphological
damage to kaolinite or illite, but this would not be the case for chlorite or
carbonate minerals. Also it was not known whether the surface chemical
properties were changed.
Coulter et al. (1983) and Rothbard et al. (1987)overcame these problems by
196 J. M. HUGGETT
clearly marking each end of the core plug with locating marks and by
examining the sample uncoated before treatment. To prevent charging, this
was done at 5-kV accelerating potential. Coulter et al. (1983) used this
technique to examine the effect of fracturing fluid on permeability. The
permeability of each sample was measured before and after treatment with 2%
KCI solution in the pH range 4.7 to 11.5. They found only very slight
permeability changes and negligible change in the surfaces observed with the
SEM (minimal in the range pH 7 to 9). Rothbard et al. (1987) examined
uncoated reservoir core plugs before and after formation of a siderite
mudcake, a 6% HCI preflush and a 2% H F acid wash. The mudcake occluded
many pores at the point of contact, indicating mud invasion (Fig. 30). The 6%
HCI was not found to be effective at removing the mud (Fig. 31); the sub-
sequent 2% H F flood was, although it also caused pitting of the framework
grains, especially feldsparts.
SEM is also an ideal tool for the examination of effluent from core flood
tests, or for “real” fines produced with water or hydrocarbons. The particles
are readily mounted on a stub; or if they have been collected on a filter, this
may be attached directly to a stub. This technique may be used to examine the
size, shape, and mineralogy of fines (Muecke, 1978; Ward et al., 1981; Udell
and Lofy, 1985). Software is now available for both physical and chemical
quantification of fine particles. By adding in chemical criteria for mineral
identification, it is possible to obtain output that combines mineralogy and
FIG.30. Berea Sandstone with drilling mud coating grain surfaces and bridging pores.
SCANNING ELECTRON MICROSCOPY 197
FIG.31. Berea Sandstone after mud treatment and subsequent 6% HC1 treatment.
C . Scale Evaluation
A minor, but important, use of SEM in petroleum production has been the
examination of pipe scales (Figs. 32 and 33). The surface textures of these can
give valuable indications as to the type of fluid that deposited the scale and the
flow conditions under which deposition occurred. SEM also provides a rapid
means of obtaining an x-ray analysis from which the nature of the constituent
minerals can often be identified, as scales rarely have a complex mineralogy.
198 J. M. HUGGETT
FIG.33. Iron oxide pipe scale from an oil terminal. Bar = 10 pm,
SCANNING ELECTRON MICROSCOPY 199
Scale formation is a problem in injection and production wells and in the
associated process equipment. It is frequently the unwanted byproduct of
seawater injection into a reservoir to maintain well pressure; either the pH and
temperature change may precipitate insoluble salts from the seawater, or the
mixing of seawater and the formation water may cause precipitation of solids.
Both mechanisms can result in damage to the near-well-bore formation in
injection wells. In production wells, the associated pipes may also be affected,
particularly by sulfur-bearing hydrocarbons.
Read and Ringen (1982) used SEM coupled with x-ray diffraction (XRD)
to observe laboratory tests designed to evaluate the extent of formation
damage that could result from scales formed within a North Sea reservoir
scheduled for major seawater injection. As a result of this study, they were able
to prepare remedial and preventative (scale inhibitors) strategies for the real
operation. Porous alumina cores (used because they are temperature and
pressure stable) were first injected with reservoir formation water. They were
then injected with formation water and seawater, from separate ports to
prevent scaling of the outside of the core before the waters entered into the
pores. SEM examination revealed pores blocked by large euhedral crystals
of strontian barite [(BaSr)SO,]. These are mainly large planar crystals,
sometimes twinned (in cores where a high proportion of seawater was injected,
or stacked (Fig. 32). Where the injection fluid is dominated by formation
water, well-developed rosettes of crystals are more frequent. The worst
permeability loss occurred for blends of 90% formation water and 10% sea
water; the loss increased with decrease in the percentage of seawater injected.
SEM has also been successfully used to determine the composition,
textures, and growth history of pipe scales. These commonly consist of
carbonates, sulphates, or iron oxides/hydroxides. Morphologies include
feathery gypsum, baryte (Fig. 32), or (BaSr)SO, crystals, blocky porous baryte
or calcite, arld many other crystal morphologies that can be used as indicators
of the chemical environment of deposition. Iron oxide/hydroxide scales often
include siderite or sulfur crystals and have a globular (Fig. 33), vuggy, or
vesicular form, with abundant gas/fluid escape holes visible with the SEM.
BSE microscopy has proved particularly useful in this respect for distinguish-
ing zones of CaCO, scale from BaSO, or (BaSR)SO, and for unravelling the
sequence of chemical events that led to the scale formation.
E. Stimulation by Fracturing
VIII. FUTURE
DEVELOPMENTS
SEM began as a tool for making qualitative observations and has evolved
into one capable of sophisticated analytical measurements, which are
increasingly automated. This is reflected in the increasing use of SEM to
obtain analyses of individual particles, quantification by point counting, and
202 J. M. HUGGETT
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SEM Inc., Amf OHare (Chicago), Illinois.
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Harper, M. L., and Shaw, B. B. (1974).Offshore North Sea Technology Con$, Stavanger, Norway,
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204 J. M. HUGGETT
L . R . MURRAY
Wheatstone Laboratory
King’s College. London
United Kingdom
I . Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 210
I1. The Wave Equation . . . . . . . . . . . . . . . . . . . . . . 214
A . The Force Law . . . . . . . . . . . . . . . . . . . . . . . 214
B. Dilatational Stress . . . . . . . . . . . . . . . . . . . . . . 216
C. Shearstress . . . . . . . . . . . . . . . . . . . . . . . . 216
D. Derivation of the Wave Equation . . . . . . . . . . . . . . . . 218
E. Solution of the Wave Equation for Uniform Density . . . . . . . . . . 220
F. An Ideal Seismic Pressure Impulse . . . . . . . . . . . . . . . . 224
G . Absorption . . . . . . . . . . . . . . . . . . . . . . . . 225
111. Wave Propagation across Plane Interfaces . . . . . . . . . . . . . . . 229
A . Propagation across a Liquid-Solid Interface . . . . . . . . . . . . . 229
B. The Generation of Evanescent Waves at a Liquid-Solid Interface . . . . . 235
C. Wave Propagation across a Solid-Solid Interface . . . . . . . . . 236
D . Numerical Examples at a Solid-Solid Interface . . . . . . . . . . . . 241
IV. Preprocessing and Prestack Deconvolution . . . . . . . . . . . . . . 244
A . Dix’sEquation . . . . . . . . . . . . . . . . . . . . . . . 244
B. Noise Characterisation . . . . . . . . . . . . . . . . . . . . 249
C. F-K Filtering . . . . . . . . . . . . . . . . . . . . . . . 251
D. Multiple Suppression and Primary Reflection Enhancement . . . . . . . 254
E. Predictive Deconvolution . . . . . . . . . . . . . . . . . . . 256
V. Velocity- Field Determination and Stacking . . . . . . . . . . . . . . 263
A. Stacking Velocity . . . . . . . . . . . . . . . . . . . . . . 263
B. Normal Moveout and Stacking . . . . . . . . . . . . . . . . . 274
VI. Migration . . . . . . . . . . . . . . . . . . . . . . . . . . 277
A . Geometrical Migration . . . . . . . . . . . . . . . . . . . . 277
B. DipMoveout . . . . . . . . . . . . . . . . . . . . . . . 279
C. The Common Midpoint Frame . . . . . . . . . . . . . . . . . 283
D . Fourier Space Migration . . . . . . . . . . . . . . . . . . . . 286
E. Finite-Difference Migration . . . . . . . . . . . . . . . . . . 286
VII . Amplitude Variation with Offset . . . . . . . . . . . . . . . . . . 298
A . Approximations to the Zoeppritz Equations . . . . . . . . . . . . . 298
B. Subsurface Parameter Estimation . . . . . . . . . . . . . . . . . 302
209
Copynght Q 1990 by Academic Press. Inc.
All nghts of reproduction in any form reserved
ISBN 0-1 2-014677-0
2 10 J. F. BOYCE AND L. R. MURRAY
Appendices . . . . . . . . . . . . . . . . . . . . . . . . . . . 308
A. The Wiener Filter for Common Midpoint SeismicGathers . . . . . . . . . 308
B. Ray-Acoustic Geometry . . . . . . . . . . . . . . . . . . . . . 311
C. Stacking by Maximisation of the Posterior Probability Distribution . . . . . . 313
Acknowledgement . . . . . . . . . . . . . . . . . . . . . . . . . 3 16
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 16
I. INTRODUCTION
(3)
where
11. THEWAVEEQUATION
[ ( + ”2” - ( -,? )]
axx x -, y , 2 a, x- y, z 6 y S z = -a%,
6x6y6z.
ax (5)
[ (
a,, x, y, z +- F) -a
,,
( x, y, z - -
F)] 6 x 6 y = -a%,
6xdy6z.
ax
(7)
Hence the total net force in the x direction acting upon the elemental volume
of the material is
{% +%
ay + %aZ) d x 6 y 6 r .
By Newton's second law, the increase in the force acting on the two faces,
i.e., the net force, equals the rate of change of momentum in the x direction,
therefore
and hence
and
216 J. F. BOYCE AND L. R. MURRAY
B. Dilatational Stress
-
to first order in the derivatives. Hence the fractional increase in volume is V u,
and assuming that the material responds elastically, this will induce a cor-
responding outwards pressure on each face of the cuboid. Therefore,
a
, = ayy= cTzz = AV ’ u, (15)
where 1 is the dilatational elastic constant of the material. This is the con-
stitutive equation of dilatational stress.
C. Shear Stress
Suppose that a shear stress acts as shown in Fig. 2. Under the action of the
above deformation, the point A(x, y, z) transforms to A’(x’, y’,z’), with
A B X
au
2’ = z’(x, y + 6y, 2) =z + u, + -2
6y
aY
One effect of the deformation is to introduce a shear s t r e s s t h e y s c t i o n
which is proportional to the scalar product of the vectors A’C’ and A‘B’. The
corresponding stress is
oxy6x 6y = pA‘C’ .A’B’
d -
oxy= + $),
and due to the isotropy of the medium, the corresponding relations that are
obtained by cyclic permutations of x, y, and z apply also.
218 J. F. BOYCE AND L. R. MURRAY
-p = AV * u + 2p-.8%
ax (25)
”i
ax 1 ( V * u) + 2PdU.j
ax +; { P ( Z + $)}
+ f{ P ( Z + $)] = ; {P%)
SIGNAL ANALYSIS IN SEISMIC STUDIES 219
If we assume that the material is homogeneous, then the elastic constants are
independent of position. This assumption will not be valid in general, since the
elastic constants may be depth dependent. It should be noted, however, that
the density occurs in terms to which time derivatives are applied, not space
derivatives. From homogeneity, it follows that
+
i.e.,
a
(A + p)-(V
ax
* u) + pvzu, = -
:t{ p-
2}.
By cyclic symmetry in x, y and z, it follows that
(A + p)V(V - u) + pv2u = at
a { p- }: ,
(A + 2p)V(V - u) - pv x v x u =-
a { p-
at }: . (33)
The above equation is the wave equation for homogeneous isotropic elastic
-
materials. It relates the dilatational (or fractional volumetric) distortion V u,
together with the components of the shear distortion V x u, to the instanta-
neous rate of change of momentum.
The two components may be separated by taking the divergence and curl
of Eq. (33), when the following independent equations are obtained,
s I .
v(x, t) = (d3k) (dw)v(k,W ) exp{ - i(k x - at)},
s s
(d3k) (dw)(02 - c:k2)v(k, w)exp{ - i(k x
j
u(x, t ) = -[v'+'(k) exp{ -i(k
: ; (
.x - w p t ) }
+ v'-)(k)exp{ -i(k - x + ~ ~ t ) } ] , (41)
'
We use the notation (d3k)o d3k/(2n)3and (dw) 0dwl(2n)together with &w) o 2n6(w),
with 6 being a Dirac delta function.
SIGNAL ANALYSIS IN SEISMIC STUDIES 22 1
where up= cplkl,with c p being the P-wave velocity; d+)(k)is the amplitude of
the dilatation having wave vector k, which is travelling in the positive k-
direction; d-)(k) is the corresponding amplitude in the negative k-direction.
Since the dilatational field is real, is follows that
U(+)(k)*= v ( - ) ( -k). (42)
An analogous analysis may be applied to the wave equation satisfied by the
shear vector field w, resulting in
w(x, t) = s (;2
-[w‘+)(k)exp{ - i(k x
+ w(-)(k)exp{-i(k. x + cost)}],
- cost)}
(43)
where 0,= cslk(, with cs being the S-wave velocity, with c3 = p - l p . The
solenoidal character of the shear field
v-w=o (44)
requires the conditions
k * w(*)(k)= 0. (45)
For each wave vector k, we may define transverse unit vectors e,(k), or-
thogonal to k,
-
k e,(k) = 0 u = 1,2, (46)
in terms of which the shear field amplitude may be expanded as
2
w(*’(k) = 1 w!*’(k)e,(k),
a= 1
(471
it following that
w(x,t) = {(;2.fl1
- [w!+)(k)exp{ -i(k. x - cost)}
s s
u(x, t) = (d3k) (do)u(k, o)exp{ - i(k x - at)>,
it follows that
- (51)
p
5 3kS
(d ) (do)w2u(k,o)exp{-i(k - x - at))
= i(A + 2p) j(2 -k[u(+)(k)exp{ -i(k. x - qd)}
+ u(-)(k)exp{-i(k.x + opt)}]
1 (53)
and hence the total displacement field may be expanded as
[d+)(k)exp{-i(k -x - opt)}
+ u(-)(k)exp{-i(k - x + opt)}]
--
2pw:
ip
1 k x e,(k)[wh+)(k)exp(-i(k
a= 1
-x - cost)}
+ w!-)(k) - + wst)}3 ,
exp{ - i(k x
)
where d*)(k) are the dilatational (P) wave amplitudes corresponding to wave
vector k in the fk directions and w;*)(k) are the analogous shear (S) wave
amplitudes polarised in the direction defined by the unit vector E,(k). (In the
case of a liquid, p = 0 and the displacement field reduces to the dilatational
SIGNAL ANALYSIS IN SEISMIC STUDIES 223
component.) Now cs/osk, e,(k), e,(k) form a right-handed orthonormal set of
vectors, hence
It follows that
If el(k) is chosen in the vertical and e,(k) in the horizontal plane, then wH(k)
represents horizontally and w,(k) vertically polarised shear waves, re-
spectively. Upon choosing e,(k) and el(k) within and normal to the surface
plane, i.e.,
then, explicitly,
Since the P and S wave velocities are given by (A + 2p) = pc: and p = peg, it
follows that the total displacement field may be expressed as
u(x, t ) = i
j
(d3k)
(;:p
-
k[u(+)(k)exp{ - i(k x - opt)}
= ](d3k)M
20:k 2 [ u ( + ) ( k ) e x p {-i(k. x - apt)}
-i(k -x - apt)}
8%
-(x, t ) N -cpu(x, t),
at
and therefore, the velocity and pressure pulse profiles will be similar. As a
result, the signals recorded by marine geophones, which respond to overpres-
sure, and land geophones, which react to the vertical component of ground
velocity, will be approximately equivalent.
Notice that u can be written in the form
U(X,t ) = V ~ ( Xt ,) + V x A(x,t), (64)
where 4 is determined by v, and A by w, being a scalar and a vector potential,
respectively, which leads to an equivalent formulation in terms of potentials
rather than fields.
1
we may identify the solution at any positive time to be
a!;s[)i
u ( x , ~=) U O ( d 3 k ) 7 --
cos ka
1
x exp{ -i(k -x - wt)} + exp{ -i(k. x + w t ) } ] (68)
by choosing the k-axes such that k, is in the x-direction, and integrating over
u(x, t ) = 7
avoIrn
the angles, the expression becomes
(T dki1 sin(ka) - cos ka
(69)
G. Absorption
It has been shown by Ricker (1953) that absorption may be taken into
account by including within the dilatational wave equation a frictional term
226 J. F. BOYCE AND L. R. MURRAY
that is proportional to the first time derivative of the dilatation, the equation
then becoming
1 av 1 a20
VZU(X, t) +- -(x,
at
woc2
t ) = - -(x,
c2 at2
t),
+ p2)-1/4c0s
For large values of r, due to the negative exponential, only those values of /?
that are close to zero will yield any significant contribution to the integral. We
may therefore replace the exponent and trigonometric argument by their
lowest-order approximations in p, thereby obtaining
v(x,t) x -
001
:1 p2 exp{ - Wp2}
C cos{%(r
C - ct)b
2c a2
C C
k=-,0 0 s (75)
C
when we obtain
az
u(x, t ) = -- exp{ik(r - ct)} dk
[z
E
(D
Tina Id .
FIG.3. Ricker wavelet.
1e.w - I 1
16.00 -
14.00 -
P)
-0
3
Y
2
a
E
Q
r
0
2
P,
>
Q
3
0.W 0.02 0.04 0.04 0.00 0.10 0.12 0.16 0.16 0.111 0.20 0.22
Yavenunber ( 1 /n) .
FIG.4. The wave-number spectrum of a Ricker wavelet.
The internal friction model (Biot, 1956; Volarovich et al., 1969), how-
ever, is regarded as representative of the most important loss mechanism in
low-permeability rocks (Gregory, 1977). The internal friction of a volume
of material when it is cycled under stress at a given angular frequency o is
given by
where E is the peak strain energy stored in the volume, - 6E is that energy lost
in each cycle due to imperfections in the elasticity of the material, and Q(w) is
the quality factor. A high Q-factor = 200 indicates that a material has a very
small attenuating effect. In seismology, the attenuation of a signal comprised
of a range of frequencies is involved, and it has been experimentally verified
that this attenuation is linear with frequency (McDonal et al., 1958; Attewell
and Ramana, 1966; Tullos and Reid, 1969).This is referred to as the constant
Q-model of attenuation (Kjartansson, 1979).
For a linear stress-strain relation, the wave amplitude A is proportional to
E 'Iz, and applying the constraint that successive peaks have almost identical
SIGNAL ANALYSIS IN SEISMIC STUDIES 229
strain energies, Q >> 1,
A(t) = Aoexp --
{ 3 .
Since the angular frequency is related to the wave number by w = cI kl, and the
wave front of a spherical wave is given by r = ct, the decay factor of the
amplitude due to absorption is
u(x,t) a!jm
r. -w k’exp{ - g ] e x p { i k ( r - ct)}dk
when it may be compared with that derived from the Ricker model in Eq. (76).
For the limited range of wave numbers that occur in seismic wavelets, the
difference between a linear and a quadratic k-dependence in the exponent is
unlikely to be of significance.
111. WAVEPROPAGATION
ACROSS PLANE
INTERFACES
s
u”(x, t ) = i (d3k”)-
Ik”
2p0 ; 3
.
u”(k)exp{ - i(k” x - w;t)},
u’(x,t) = i ~ ( d 3 k ’2P
) [ ’~OuP ’ ( k ‘ ) e x p ( - i ( k ’x - wkt)}
2
-- y’ 1 k’ x e,(k’)wb(k’)exp{-i(k’.x
2 ~ 0 ,
,3
a=l
- wkt)}]. (88)
If el(k’) is chosen in the vertical and e2(k’) in the horizontal plane, then
wk(k’) represents horizontally and w;(k‘) vertically polarised shear waves,
respectively.
Continuity of the normal component of displacement at the interface
requires
UZ(X,t ) + U:l(X, t ) = Ui(X, t ) (90)
2 = 0,
whereas continuity of the z-component of the traction acting on a surface
normal to the x-direction requires
t)
a~x(x, + all,(x, t ) = a:,(x, t) z = 0, (91)
together with the analogous expressions for a,, and a,,,
%y(x,t ) + all,(% t ) = a:&, 0,
192)
azz(x,t ) + &(x, t ) = ai,(x, t ) 2 = 0.
Since the medium occupying the upper half space is a liquid, p = 0, and,
from Eq. (85), the three conditions of continuity of traction across the interface
become
(93)
-
IV u(x, t ) + IV u”(x, t ) = A’V ’ u‘(x, t ) + 2p‘-.
aU:(x, t )
aZ
Equations (90) and (93) represent the conditions that the displacement fields
given by Eqs. (86)and (88) must satisfy on the interface z = 0.
232 J. F. BOYCE A N D L. R. MURRAY
with
SIGNAL ANALYSIS IN SEISMIC STUDIES 233
where
cpkp = (w’ - c:(k: + k;))”’,
ClpkZ = (W 2 - c;?(kZ + k,2))”2, (102)
c$k$ = (0’- ck’(k2 + k;))”’.
The equations that represent continuity of traction are also invariant
under space translations in x and y, and time translations, hence they too give
rise to linear relations between the wave-vector amplitudes at wave-vector
values given by Eqs. (101)and (102).
From the first equation of conservation of traction, we obtain
0 = ur(klp) + -(k,Z
w
c$k$
+ ky) 2 -112
x [
-k,k$w;(k$)
C’
- $k$’k,w;(k$)
C‘
+ ”ky(k:
W
+ k;)w;(k$)
1
. (104)
Upon subtracting the product of k, times Eq. (103) from the product of k,
times Eq. (104), we obtain
wh(k$) = 0, (105)
hence no horizontally polarised shear waves are created at the interface.
The third condition of conservation of traction yields
Ik’ Rk’
-o(k) +- U”(k”)
kP kP
1‘”’ p’kp
= ___ o’(klp) + -u’(klp) + 2p‘(k; + k;)”’W;(k$). (106)
kZ k,
Equations (loo), (103), (104), and (106) reduce to three independent equa-
tions, namely,
k2
1-(u(k) + U”(k”))= (I’kp + 2p’k;?)u’(klp) + 2p’(k3 + kt)”2w;(k;).
kP klp
234 J. F. BOYCE A N D L. R. MURRAY
Since
kcp = k‘ck = w
0
(k: + kyZ)1/2= -sin 8,
CP
At normal incidence,
g (c?
~gk2 - cg)(k: + k;), ( 120)
therefore such a condition should be included in the solution for z 5 0 , i.e.,
Eq. (86), in order for Eq. (88) to be applicable.
For ranges of k p where the critical angle of the dilatational (P) wave has
been exceeded, but that of the shear wave has not, we may look for solutions of
the wave equation having the form of Eqs. (86) and (87) for z I 0, whereas
236 J. F. BOYCE A N D L. R. MURRAY
From Equation (60)the general displacement for z < 0 takes the form
ik
-i(k-x - w,t)}, ( 124)
SIGNAL ANALYSIS IN SEISMIC STUDIES 237
I\ L
I
and
u”(x, t ) = (d3k)
s
--
ic;
( ;:,
1 k x e,(k)[wb+)(k)exp{-i(k.
.
u”(k) exp{ - i(k x - wpt)}
x - w,t)}
20s a=t
whereas for z 2 0,
U’(X, t) =
s(d3k’)clpz-
202
ik’
[u’(+)(k’)exp{ - i(k’ x
--
ic;’ 12
k’ x e,(k’)[wl+)(k’)exp{-i(k’
2 ~ a =s l
-x - wst))
We adopt the definitions given by Eqs. (101) and (102), with, in addition,
ki = (kx, ky,- M Y
and utilise
+
(1 2p) = pc:; p = pcs”,
(131)
(n, + 2p’) = PIC:; p’ = p’ck2.
2
Continuity of the x component yields
1
-{u(k) + u”(k”)} + (kf +c sk:)-ll2
ki
{ o- wk(k:) + cskswk(kB))
k,
and
sin I$’’ sin fp’
{U(k) - v”(k;)} +-
cos
w’;(ki) = d(kk) + -w;(k$),
cos fp‘
(137)
where they have been expressed in terms of the angles defined by Eq. (109).
SIGNAL ANALYSIS IN SEISMIC STUDIES 239
The conditions for continuity of the normal, i.e., z components, of traction
are
aza(X, t ) + a:b(x,t ) = a:a(x, t), a = X, Y , Z, (138)
with ozagiven by Eq. (85). Written fully, the equations are
and
x { C$kX
-k$k,wL(k$) - -(ki2
w
- k,2 - (141)
with
0
+
2pkY{u(k)- u”(kg)} - 2p’kYu’(kk) p F ( k f k:)-”2 +
csks
{
x -k;k,w;(k;)
csky
- -(k;2 - kf - k;)w’;(k;)
0
0
and
ckk,
+k$k,wh(k$) - -(kk2
w
- kf - k;)w;(k$)
I = 0, (142)
k2
&-{U(k) + v”(kg)} + 2ppkp{~(k)+ u”(kg)}
k,
- 2pp(k; + k;)1/2W;l.(k;) - 2p1p’(ki+ k;)’/2w;(k$)
k k2
- 2p’p’kk~’(k;) - 2A’p’- ~’(klp)= 0. (143)
klp
240 J. F. BOYCE A N D L. R. MURRAY
Upon multiplying Eq. (141) by k, and Eq. (142)by k , and then subtracting, we
obtain
Wk(kg) + wh(k$)= 0. ( 144)
Taken in conjunction with Eq. (135), we may infer
wk(kg) = wh(k$) = 0, (145)
and hence that no horizontally polarised shear waves are created at a planar
interface.
In terms of the angles defined by Eq. (109) and by utilising the identity
A + 2p cos2 e = pc; cos 24, (146)
the pair of independent equations becomes
and
cos 24 cos 24’
pep- {u(k) - u”(kg)} - p’c’p-
cos 4 cos Wlp) el
with
T(k) + R(k) = 1. (1 54)
SIGNAL ANALYSIS IN SEISMIC STUDIES 24 1
We may identify Eqs. (136), (137), (147), and (148) with the more usual
statement of the Zoeppritz equations, as given, for example, in Appendix 2A of
Waters (1981), by making the identifications
where
(157)
cp = 2400 m/s
cp = 3600 m/s
shale c. = 1470 m / s
p = 2.4 g/cc
1.00
-_ _ _ _ _ _ y---=-
e
. 0.60 -
C
!! 0.40 -
RP
-0 -
u-
* 0.20
0
u0 0.00
7m -0.20 -
-
-
c,
a
E
-0.40 -
-z -0.60 -
-0.80 -
-1.00
O.W 10.00 3.00 30.00 40.w s0.w 60.00 70.00 moo 90.00
r 0.w - I
I \
\
C / \
-a, 0.07 - , /
I \
\
-0 TS, '
-_ _ _ - - - -
0 \
u- \
u- \
a, 0.00 \
0
0
P)
-0
3
r
-
d
n
E
<
A n g l m o f Incldoncm (dog).
FIG. 10. S-wave reflection and transmission coefficients at a normal interface. RS = reflected
S-wave, TS = transmitted S-wave.
--- - - - ---_
'
----_- -
I
-
1.00
0.0 -
Tp
. ..
\
0.60 - \
\
\
\
0.40 - \
\
\
\
0.20 - \
\ -
\
\
0.00
30", but increases rapidly as the critical angle is approached. The energy is
mostly concentrated in the P-wave mode, there being little P-to-S-wave
conversion.
The form of the coefficients for the shale-gas sand interface is shown in
Figs. 11 and 12. No critical angle exists for P-wave reflection. The P-wave
reflection coefficient becomes more negative as the angle of incidence
increases, with the ,corresponding transmission coefficient gradually reducing
to zero at glancing incidence. As in the previous example, there is relatively
little P-to-S-wave conversion.
IV. PREPROCESSING
AND PRESTACK
DECONVOLUTION
A. Dix's Equation
are common both to it and land data. The major differences between the two
cases are that marine data suffers from reverberant effects caused by the sea-
surface/sea-bed forming an effective waveguide, whereas land data is affected
by static corrections due to local variation of the earth’s surface and by
difficulty of geophone placement and acoustic coupling caused by terrain
irregularity.
A typical marine shot gather is shown in Fig. 14. It may be regarded
as being composed of a plethora of approximate Ricker wavelets at varying
time delays and magnitudes. There is a clear coherence between events as
represented by similar wavelets across the gather. The strong early arrivals
that form a steeply dipping collection are a combination of direct (water-
bourne) arrivals and refracted waves. As we shall now show, their hyperboli-
cally correlated successors are a combination of primary and multiple
reflections.
As a first approximation the earth’s subsurface may be represented by a set
of distinct horizontal layers (strata) of homogeneous isotropic material having
arbitrary thicknesses but constant physical properties. This assumption, the
horizontally layered earth approximation, together with that of ray optics for
wave-front propagation, is sufficient to establish the basic experimental
parameters such as shot interval and number of geophones. The assumptions
within the approximation may then be progressively relaxed.
Consider the earth model shown in Fig. 15, with a single shot and
geophone, and where refraction of the rays and multiple reflections have been
8
d
8 ni
u
0
n 4
U
5
w f
*u G
Lr,
ri
i
8 8
ni
d
SIGNAL ANALYSIS IN SEISMIC STUDIES 247
ignored. Even in this simplest of models, it is necessary to determine both the
times of delay of the reflections from each of the interfaces and the wave
velocities of the separate strata in order to predict the depths of the interfaces.
It is therefore necessary to consider a collection of shot-geophone responses
at different separations. Practically this means a number of geophones for
each shot at a set of increasing separations with, for simplicity, a fixed
intergeophone distance. If we assume a constant velocity c, then, for a
reflection from an interface at a depth z, a geophone at distance 2h from the
shot will receive a reflection signal at time 2t, where
42
C
-
0
a common common shot common
m Idpo Int 0ffm.t
m
0
L
a
0
m cmmon
U pophonm
O O D O
0 0 0 0
Shot potnt
FIG. 16. The stacking chart.
SIGNAL ANALYSIS IN SEISMIC STUDIES 249
B. Noise Characterisation
On a common shot gather, the refracted wave energy precedes the earliest
reflected waves and hence may be removed by muting the traces with a time
delay that increases with offset distance, with the rate of increase being
determined by the observed diffracted wave velocity. Direct arrivals may be
removed both by receiver array design and by f - k filtering.
The acoustic amplitude u(h, t), where h is the offset distance and t the two-
way travel time, is expanded as an inverse Fourier transform in angular
frequency -w and wave number k.
n = - N I=O
wt)}, (167)
where
h=nAh; t=lAt -N<n<N, 01212M
2zn 2x1 (168)
k= w=
(2N + *
1)Ah' (3M + 1)At
with
N 2M
u"(k,w)= C C u(h, t)exp{i(kh - wt)}
n=-N m=O
1
--
-
(c At)'
{u(h, t + At) - 2 + u(h, t - At)},
then
N 2M
n=-N m=O
(0' - c2k2)u"(k,w)exp{-i(kh- at)} + O(Ah4,At4) = 0, (171)
“1
FIG. 18. Aliasing of the dispersion relation due to discrete spatial and temporal sampling.
aliased components of the water waveguide mode, and as a result, any filter
that mutes that portion of the waveguide noise contained within the aliased
component would then mute the primary reflection signal. In addition, Gibb’s
oscillation effects may occur, caused either by discrete filter edges or discrete
data cutoff at the edges of the gather. An example of just such an effect is
shown in Fig. 19, which is a frequency-wavenumber plot of a shot gather in
the marine data set shown in Fig. 15, where both aliasing and Gibbs effectsare
evident.
The response of the filter with regard to Gibb’s oscillations may be
improved by smoothing the theta function cutoff at the edges and by
progressively reducing its effect along the dispersion relation. An improve-
ment with respect to aliasing is obtained by padding the midpoint gather with
zero values in the range N < (nl < 2 N , thereby preventing noise. Gibb’s
oscillationsdue to sudden termination of coherent signals at the gather edges
may be reduced by muting the contributions from the long offset traces
consistently with the rate of decrease of the wedge-shaped filter response
function. The general principles governing the design of filters in the (0, k)
plane are that a minimal region should be muted, that the filters should be
smooth with tapered edges, and that the data of the common midpoint gather
should be padded with zeroes to obviate aliasing.
E. Predictive Deconvolution
The observed amplitude g(t), after removal of refracted wave energy and
direct water-bourne (waveguide) noise, is assumed to be linearly related to the
reflection coefficient field r(t) by
The kernel H(t,t’) represents the effects of the source wavelet, multiple
reflections, absorption, receiver (geophone) response, and recording instru-
mentation, together with source and receiver ghosts. Uncorrelated noise is
represented by the additive term n(t).The problem is to recover r from g, given
a knowledge of H.
As a first approximation, the effects are assumed to be separable and to
be invariant under time translations. Hence, each individual effect may be
expressed as a convolution
where h(t) depends on the underlying physics, and may be compensated for
by an appropriate inversion. The overall system may be represented by a
succession of such convolutions, and hence the required reflection coefficient
field may be recovered by a sequence of inversions. The basic techniques
employed are those of crosscorrelation and Wiener filtering.
where ta is the reflection time from interface a. Given a source wavelet s(t) and
ignoring amplitude decrease due to geometrical spreading, absorption and
multiple reflection,the reflected amplitude from such an idealised subsurfaceis
where s ( t ) represents the source wavelet. Now the correlation of s ( t ) with g ( t ) is,
SIGNAL ANALYSIS IN SEISMIC STUDIES
as defined by geophysicists,
where
Ghost Deconuolution
The effect of the sea surface on the source wavelet s(t) is to subtract from it a
delayed replica, i.e.,
s(t) + s(t) - s(t - t, sec a), (183)
where the subtraction occurs since the water-air reflection coefficient is - 1,
and t s is the two-way travel time from the source to the water surface along the
normal to the surface.
The combination may hence be expressed as a convolution
1;
the convolution of both kernels, explicitly,
h,(t - t’)h,(t‘)dt’
where
m(t) = d(t) - rd(t - tw) + rZd(t - 2,) - .... (191)
SIGNAL ANALYSIS IN SEISMIC STUDIES 259
In terms of a Z operator formalism, where 2 denotes time translation
through a time interval tw, viz.,
Zf(t) = f(t - tw), ( 192)
the convolution kernel of the reflection sequence may be represented as
rn = (1 - rZ + r 2 Z 2 - . ..)
= (1 + Kq-1. ( 193)
Each seismic signal is doubly affected by the reverberant water layer, once for
the downgoing and once for the upcoming amplitudes, hence the overall
convolution kernel is
m2 = (1 + r Z ) - 2
=1 - 2rZ + 3r2Z2 - -.a,
(194)
with the corresponding convolution being
where
d 2 ) ( t )= d(t) - 2rd(t - tw) + 3r2 d(t - 2tw)- ..-. (196)
It follows that if the time period t w may be determined, for example from the
autocorrelation of the trace, then application of the inverse operator
will deconvolve the reverberant effects of the water layer, viz., remove the
corresponding short-period multiples. This assumes, however, that the time
period tw and the sea-bottom reflection coefficient r are known accurately.
The above problem, the removal of the reverberant wave train, may be
regarded as a particular case of a more general problem, namely that of
designing a stable linear filter that deconvolves a known signal from a noisy
realisation of it. Such an identification then permits the application to the
problem of general methods of solution, in particular the Wiener filter.
Specifically,Eq. (195)may be regarded as a particular case of Eq. (1 73), and we
may seek a filter function h(t), such that
with
e = ( C f ( t + tw) - m2> (202)
being a minimum. The required filter is then a solution of the Wiener-Hopf
equation (Eq. 199), with
g(t) = f ( t + tw). (203)
As a result of this definition, f(t) then contains any of the reverberant
characteristics of the seismic amplitudes that occur with period t , or greater,
and therefore
f ( t >- At - t w ) W - tw) (204)
yields the deconvolved trace.
In terms of discretised variables, Eq. (199) is
f
(.LA+,,> = 1 <S,f,-t~>h,*,
t’=O
(205)
A= i
t’=O
ht-t!fk (207)
ooo
1. OOO 1.
2. OOO 2.
FIG.20. A predictively deconvolved marine shot gather.
from [SOO, 40001 ms for a near trace to [2000,4000] ms for a far trace. The
predictive gap was 28 ms.
The effect of muting the data within one operator length of the first breaks
is demonstrated in Fig. 21. Later sections of this paper deal with amplitude
versus offset analysis, for which this data is examined. Therefore, a front-end
mute was used, instead of applying an ‘fk’filter to remove the first breaks and
refraction arrivals, because, by considering Fig. 19, the result of employing
such a filter would be to affect the region of the ‘fk’spectrum that also contains
primary energy.
The sensitivity of the geophones may be determined by averaging each of
their individual responses along a seismic line, viz., determining the average
energy of a receiver gather. The effect of thereby equalising the geophone
sensitivities upon the processed shot gather is displayed in Fig. 22.
It may be observed that the systematic trace variability that was previously
present in Fig. 21 has been removed.
SIGNAL ANALYSIS IN SEISMIC STUDIES 263
am
1. Ooo 1. OOO
2. m 2. Ooo
FIG.21. A front-end muted, deconvolved marine shot gather.
V. VELOCITY-FIELD
DETERMINATION
AND STACKING
A. Stacking Velocity
CAOOO
1. OOO 1. OOO
2. ooo 2. OOO
FIG.22. A geophone sensitivity-equalised processed marine shot gather.
:/
\ I I I I
I I
I I
I I
I 1
ZI
I
I
hence
c2
h =-tsinO,,
C1
where
E2 = t-'(c:t, + cit2)
is a mean square velocity. A further application of Snell's law to Eq. (213)
yields
h
F2
-= cl't,sine, + c;'t2sine2,
and therefore, upon multiplying Eqs. (209) and (219,
h2 -
_
c2- t(tl sin2el + t2 sin2 02). (216)
this being the generalisation of Dix's equation (Eq. (161)),that is, the normal
moveout equation for a two-layer system of horizontal strata.
The above equation is again hyperbolic to the extent that the final term is
negligible. Snell's law permits its reformulation as
where
Ac2 = C: - c:.
The square root may be expanded by the binomial theorem, subject to the
condition
tan2e, <
Ic: - c y
when the first-order approximation is
SIGNAL ANALYSIS IN SEISMIC STUDIES 267
and yields a negligible contribution to Eq. (218). However, for cz > c l , again
by Snell's law, Eq. (221)is equivalent to
(sin8,I < 1. (223)
It is therefore violated at the critical angle of incidence, when 8, = 5, while the
first-order approximation will become increasingly invalid as the critical angle
is approached. We may therefore expect the normal moveout equation to
deviate from the hyperbolic form near the critical angle.
+
For a sequence of ( A 1) horizontal strata separated by A interfaces,
indexed by Q = 1,. ..,A, the source receiver half-separation distance h may be
expressed as
A
h= 1 catasinOa,
a= 1
1 t, cos 6,.
A
to =
a= 1
where
A
c2 = t-' 1 c;ta
a= 1
As in the two-layer case, since the correction term to the hyperbolic form is a
sum of differences of cosines,it may be neglected in comparison with the h2/C2
term unless one of the incident angles approaches the critical angle of the
corresponding interface.
For a sequence of A strata, having velocities c,, a = 1,. ..,A and angles a,
to the horizontal, the offset dependence of reflection time remains approx-
imately hyperbolic (Shah, 1973),
in which 0, and 0; are the incident and refracted angles of the zero-offset ray
path at the ath interface, with cos20, = cos2 Ob, i.e.,
h2
t2 = tg + -2
C
+ o(h4). (236)
The velocity field, viz, the acoustic velocity within a given stratum, may be
obtained from the change in stacking velocity on entering a statum if the angle
of dip of the interface is known. Determination of the dip, however, requires
that the imaging problem be solved, hence the two problems of geometric
structure and velocity field determination are at best only approximately
separable.
Given a midpoint gather of amplitudes g(t, h) composed of recorded
amplitudes at reflection time t and source receiver separation h, the method for
determining the stacking velocity field F(t) is to apply the normal moveout
transformation
SIGNAL ANALYSIS IN SEISMIC STUDIES 269
for a representative set of velocity fields and then to select or “pick” from the
set a function c(t),usually piecewise linear, that provides a best estimate, as
measured by maximum signal coherence across the transformed gather.
Initially, this may be performed by transforming the midpoint gather using a
set of constant velocity fields, with the resulting set being known as a constant
velocity gather, and by visually estimating the reflection-time interval during
which each is applicable. Operational consistency and the occurrence of large
data sets require standardisation and automation of the procedure. A suitable
measure of coherence, though by no means the only one, is provided by the
semblance (Al-Chalabi, 1979)
-
g(t, h) = 21’2 ( w ~ h ) ) 5 ” [- ~ r ] { --Gf2}
-2 1 exp
where
Hence
exp[
0
-2cr(h)
(r(h) - ( c 2 t ; + 4h2)1/2)2.
where the higher-order terms may be neglected, since the wavelet is of signi-
ficant magnitude only for zh << t,. It follows that to O(T:),the normal moveout
transformed wavelet is
SIGNAL ANALYSIS IN SEISMIC STUDIES 27 1
Upon comparing Eqs. (243) and (250), it may be observed that the approx-
imate NMO corrected wavelet may be obtained from the original by the
transformation
(255)
The effect of the NMO transformation has thus been to broaden the wavelet
by the same factor, (1 + 4h2/~2tg)1/2,which occurred in the narrowing of the
wave-number distribution.
A consequence of the wavelet distortion is that, even when the correct
normal moveout is applied to the gather, any measure of coherence, including
the semblance as defined by Eq. (238),no longer yields a uniform maximum
within the time interval occupied by the wavelet. This situation is exacerbated
by the not infrequent occurrence of multiple reflections that are received
contemporaneously with the primary reflection pulse.
Multiple reflections arise either from surface or interbed reflections at
shallower depths. Although the amplitudes of such events are substantially
reduced by the multiple nature of the reflections in comparison with the
272 J. F. BOYCE AND L. R. MURRAY
- . .... ..
where r, is the reflection coefficient from the ath interface, having two-way
time t,. Due to the assumed geometry, the two-way travel time takes the
approximate form given by a normal moveout hyperbola
where Cis the stacking velocity obtained from the velocity field analysis, and t o
is the travel time at zero separation between source and receiver. Upon making
the normal moveout transformation
gt(a) + 8’ = g(t2+ h2(a)/E2)1/2(a), (259)
the reflection from a given interface will occur at approximately the same
travel time for every trace of the gather. If the set of such corrected traces are
now summed, or “stacked,”
then the contributions from an interface will tend to reinforce each other while
any additive noise will be distributed randomly and hence, by the central limit
theorem, be attenuated by a factor (M)-’/’. An example of a normal moveout-
corrected gather (with amplitude clipping) is shown in Fig, 25.
SIGNAL ANALYSIS IN SEISMIC STUDIES 275
1 1 I 1 I 1 12222222222333333332 144444444:
ao00 234: 345678901234567890 1234567E 123456789i
a
OOO
1. OOO 1. aK)
2. OOO
mt 2. OOO
FIG.25. A normal moveout-corrected gather.
A further benefit accrues from the effect of stacking upon energy arising
from multiple reflections. These are due to reflections between widely spaced
interfaces, frequently, though not invariably, involving a surface reflection. As
a result, the curvature of the moveout hyperbola differs significantly from that
of any primary reflections with which it may be temporally coincident, since
the summation appearing in the stacking velocity of the multiple [Eq. (229)]
is over a different set of strata than those corresponding to nearby primary
reflections. As velocity generally increases with depth, and the summation
yielding the multiple's stacking velocity will be confined to shallower layers, its
C is smaller than those of nearby primaries; in consequence its moveout
hyperbola is more curved. It follows that a normal moveout transformation
that is performed with the stacking velocity of the primaries will leave any
reflection wavelet due to a multiple unaligned across the gather, so that, upon
stacking, its energy becomes dispersed into a smooth background.
276 J. F. BOYCE AND L. R. MURRAY
The effect of stacking has been to reduce the set of common midpoint
gather traces {g} to a single average trace g via Eq. (260).This achieves a data
reduction by a factor of M , the fold of the gather, at the expense, however, both
of a loss of resolution, due to the inevitable fluctuations of position and
structure of the normal moveout traces, and of the discarding of any wavelet
variation, and hence reflection-coefficient variation, across the gather.
Were it not for the poor signal-to-noise ratio of individual traces, then the
trace having minimum offset would be the most reliable, since it is the
geometry of this trace that corresponds most closely to a normal incidence ray
path upon which the validity of the subsequent migration will depend. (This
argument is subject to the caveat that the trace should not be corrupted by
propellor noise from the survey ship.) From this point of view, we may regard
the purpose of the remainder of the gather as that of providing a statistical
sample set that may be employed to improve the signal-to-noise ratio of the
minimum offset trace. A development of the above approach is given in
Appendix C, where the use of Bayesian statistics to, maximise the posterior
probability of the traces leads to a weighted estimate f(a)for each trace, having
where the weighting factor v, is given in terms of the trace and noise variances
0,2 and a:, respectively, by
The mean trace Q of Eq. (261) is now replaced by the estimate T(1) of the
minimum offset trace.
The traces of the weighted gather { T ) preserve the resolution and wavelet
localisation of the original traces, whilst attaining a signal-to-noise ratio
comparable to that of the stacked trace. In addition, they retain any amplitude
variation across the gather, thus permitting the characterisation of intrinsic
reflection coefficient dependence on angle of incidence. The effect of maximum
a posteriori (MAP) processing on the gather of Fig. 25 is displayed in Fig. 26.
The final signal processing operation before display or migration is that of
band-limiting filtering, with time variant band limits. Reflected wavelets
received at early arrival times have larger signal-to-noise ratios and broader
bandwidths compared to those received at later times. The objective of the
band-limiting filters is to obtain the broadest signal bandwidth permitted
by the prevailing signal-to-noise conditions. Structural interpretation of an
exploration prospect is based on the filtered and deconvolved common
midpoint stacked section.
SIGNAL ANALYSIS IN SEISMIC STUDIES 277
am a000
0.100 a 100
0.200 0.200
0.300 0. 300
0.400 0.400
0.500 0.m
0.600 0. My)
0.700 0.700
am 0.En0
0.900 0.900
1. m 1. OOO
1. im 1. 100
1.200 1.200
I. a0 1.300
1.400 1.400
1. 500 1.500
1.600 1.600
1. m 1.700
1.800 1. BM
1.900 1.900
2. OOO 2. OOO
FIG.26. A MAP-processed gather.
VI. MIGRATION
A . Geometrical Migration
The result of the velocity determination and stacking is, firstly, a stacking
velocity field as a function of position and, secondly, a set of seismic traces
approximating to the seismic response that would have been observed at a grid
point of the datum plane if the shot and geophone had been coincident at that
point and only the response due to primary reflections had been recorded. This
latter property, however, is contingent upon the ability of the normal moveout
transformation, using the stacking velocity field, to compensate for the effect
of the offset dependence of the trace of a common midpoint gather. This
278 J. F. BOYCE AND L. R. MURRAY
At
tan8, =c-.
Ah
Ah x hh x
(a1 (bl
FIG.27. Dipping reflectors.
SIGNAL ANALYSIS IN SEISMIC STUDIES 279
In the true earth coordinate system, the rays are reflected normally from the
interface, thus the true angle of dip 6, satisfies
A1
sin 9, = -.
Ah
The spaces are related by
A1 = c At,
and hence
sin 0, = tan 6, ; (266)
therefore the true dip is always larger than the observed dip unless the reflector
is horizontal. From a consideration of Fig. 27, it follows that the reflected
energy at (x,ct) must be migrated through a distance of 2ctsin()6,) in the
direction at an angle $9, to the horizontal, in order to coincide with its correct
physical location. Arguments such as this, based upon ray acoustics, were
utilised to formulate geometrical migration algorithms, but have been
superseded by methods founded on the acoustic-wave equation.
B. D i p Moveout
Notice that we now consider the two-way reflection time rather than the one-way time
variable that was utilised in Sections IV and V.
280 J. F. BOYCE AND L. R. MURRAY
5 B M G
I ct
FIG.28. The fixed offset ellipse.
space having the shot and geophone positions as foci and a semimajor axis of
1
ZCt,
The reflection point may lie anywhere on the ellipse, and hence, to achieve a
partial migration, the recorded pulse should be smeared along it. If we now
consider how such a notional reflector would be observed at zero offset,
characterised by coincident incident and reflected rays if t , is the observed
reflection time, then, since the rays are normal to the reflecting surface,
(;y + (;y =1
xm =-
2h2
cth ’
and
for
SIGNAL ANALYSIS IN SEISMIC STUDIES 28 1
Thus, upon transforming to a zero-offset section, the ellipse of Eq. (267) is
converted into the partial ellipse, or “smile,” defined by Eqs. (269) and (272).
The transformation from the observed amplitude u(x, t; h) at midpoint x
and offset h to the zero-offset amplitude u,(x, t ; O ) may be achieved via the
convolution
where
Vo(X,
ss
t;0) = dth dx‘s(x - x’, t, th)U(th,X’, h),
we find that
when it yields
where
and
282 J. F. BOYCE A N D L. R. M U R R A Y
leading to an identity for Eq. (274) in the h -+ 0 limit. Alternatively, for large
values of h,
t h ) = (2X,)-’
S(k,0, exp[i(h2k2 + o’t,2)’/’], (283)
consistent with the result of Deregowski and Rocca (1981).
Now, from Eqs. (268) and (269), the time t on the zero-offset section is
related to the observed time t h at offset h by
t = (t,” - 4h2C-2)’/2(1 - x2h-2)1/2, (284)
whereas, since zero-offset reflection is along the normal to the ellipse, for a
given angle of dip 8,
cos’ 6 = h-’[h4 - ( + C t h X ) ’ ] ( h ’ - x2)-’, (2851
with it following that
(1 - x2h-2)-1 = (t: - 4 ~ ~ - 2 ) - 1 ( t-; 4~ cos2 8); (286)
and hence, from Eq. (284),
t = t,”(tl + 4h2c-’ sin’ 8 p 2 , (287)
where we may identify (tf + 4h2c-’ sin’ 8)’/’ as the zero moveout time that
would be observed at M if the reflector consisted of a straight line passing
through P with angle of dip 8.
This identification suggests an alternative formulation of the dip moveout
correction in terms of the normal moveout amplitude un(x,t; h), defined by the
normal moveout transformation [Eq. (237)], to be
V n ( x , t h ; h) = u(x, (t’ + 4h2C-’)’/’; h). (288)
Upon Fourier expanding the observed amplitude at offset h,
where, from Eqs. (288) and (289),the integral may be expressed in terms of the
normal moveout amplitude as
s
vo(k,o;O) = dt,t,(ti + 4h2c-2)-”2S(k,w; th)V,(k,t,; h).
Using the approximation to S(k, o;t h )given by Eq. (282), the above relation
(292)
becomes
s
uo(k,w;0) = dt,t,(t; + 4h2~-2)-1’2exp[i(h2k2 + ~ ~ t i ) ~ ~ ~ ]t,;u h),
when it may be identified with the expression obtained by Hale (1984) by
, , ( k(293)
,
u(K,,z,w; h) = jK(24
s d K , a ( K x , K , , w ;k)exp[i(K,z
(24
- kh)]. (304)
s$$
wave amplitudes,
with
k, = - [ ~ W ~ C - ’ - (k: + k;)]1’2. (3 12)
Since u(k,w) may be recovered from the surface amplitude via the inverse
Fourier transform,
ss
u(k,w) = d2x dtu(x,y,z = O,t)exp[i(k x - at)]; -
hence u(x, y, z = 0) may be recovered from the surface data. These relations,
(313)
since they depend upon Fourier transforms, may be readily discretised and
implemented using “fast” numerical algorithms. They form the basis of most
migrations presently performed. Alternatively, the k,, k,, and w dependence of
Eq. (311) may be integrated out, yielding a Kirchoff integral relation between
u(x, t = 0) and its time derivative at the surface. Of course, the basic premise,
that the earth is homogeneous, is invalid, so the above approach must be
progressively modified to take account of increasing geological complexity.
E . Finite-Diflerence Migration
The situation may change, at least for marine data, if vertically double streamers of
geophones are utilised, since the amplitude and an estimate of its first derivative would then
become available.
SIGNAL ANALYSIS IN SEISMIC STUDIES 287
time until the same space-time point is reached by each continuation, when
their ratio yields the reflectivity at that location. A one-way wave equation for
upward propagating waves is given by
when it becomes
u(x, t ) =
SI: (dw)u(x,o)exp(iwt) (3 15)
au
-(x, 0)= D(x,W)U(X, w), (316)
aZ
where
and
The above two components are the diffraction and refraction components of
the operator. The wave equation may now be solved in finite intervals of z by
the alternate application of the two parts. In the sequel, we shall consider only
two space dimensions, suppressing any y dependence. The techniques of
analysis extend directly to three dimensions, although implying a significant
increase in computational load. Moreover, in order to develop the technique,
only the diffraction term will be considered explicitly,since the refraction term
may be included in any migration scheme without approximation. Now
expansion of the square root as a continued fraction
Y = (1 + X2)”2
X2
=1+-
l + Y
yields various orders of approximation. In particular, from the third-order
approximation,
X2
Y=l+ (323)
2 + X2/2’
the 45-degree equation results.
{4d + C Z pa 2
with expression in (z,T ) space as
I au dX
a20
z(x,z,w) = 2ioc+x,z,w), (324)
with
v,,(x,z,T) = exp(ik,x +i
(
k, -- z
3+ I iwz ,
w 0
k,=-sin8 k, =-cosO. (327)
C C
x
0
c
0 10 20 30 40 50 60 70 80 90
Ang Le (degrees)
FIG.29. Phase errors of the continuous 45-degree equation. The contours are of phase
errors lo, lo", loo", respectively.
The corresponding phase shift that arises from a solution of the 45-degree
equation is
A plot of the resulting phase error (Whitlesley and Quay, 1977), is shown in
Fig. 29 for a phase-velocity of 2400 ms-' and a migration length Az of 24 m.
In order to formulate a migration algorithm in the (x, z, z) domain, the
derivatives in Eq. (325) are approximated by finite differences for the second-
order derivatives in x and 7,together with Crank-Nicholson averaging for the
z derivative. The phase shift corresponding to a finite-difference approxi-
mation to the 45-degree equation is
where
and
GI = sin(GAClz)/A.z, (332)
290 J. F. BOYCE AND L. R. MURRAY
120
100
-.. 80
I
x
60
m
0-
3
m
& 40
\
\
20 - \
\
.. - - - _ _
\
0
0 10 20 30 40 so 60 70 80 90
hng l e (degrees)
FIG.30. Phase errors of the discrete 45-degree equation.
with
Lj = 2 sinr+)/Az, (333)
such an approximation for an angle t9 = 30" and N = 12 are shown in Fig. 31.
The region of small errors is more extensive than that of Fig. 30.
SIGNAL ANALYSIS IN SEISMIC STUDIES 291
120
100
- 80
z
x
2 60
m
&
k 40
20
0
0 10 20 30 40 50 60 70 80 90
Angle (degrees)
FIG.31. Phase errors of the discrete equation, optimised to a 30-degree propagation angle.
[:
H ( x , w ) = 1 --D(X,W)
I-" : 1 +-D(x,w)
Q(X,W) =
n=-N
2 Hn(0)Z", (338)
Isin81 I 1. (350)
SIGNAL ANALYSIS IN SEISMIC STUDIES 293
Therefore, if w is such that
Ax
w- I sc, (351)
C
then the range of application of the transform extends beyond the physical
range. For values of K , beyond the physical range, (1 - x2K;}'/' becomes
complex, the transfer function is no longer of unit modulus, and the ap-
proximation of H(x,w) by A(x,w) breaks down. This effect occurs at the
lower frequencies. In terms of wavelength, it corresponds to the condition
A x I4. (352)
Physically it means that we are attempting to fit data having a sampling length
of A x by waves whose wavelength is too long to accommodate the possible
variation. The problem may be overcome by increasing A x to 2 A x or 3 A x
at the lower frequencies, i.e., by Fourier expanding in terms of 2K, or 3K,
whilst maintaining the order of the expansion. The input data to the migra-
tion algorithm at lower frequencies for a given x value will be the wave field
at displacements 2 A x or 3 A x from it; however, since the number of such
contributions is maintained, the range in x is correspondingly increased. If this
principle of adapting the effective A x to w is accepted, then it becomes possible
to envisage migration utilising 3 Ax12 or 5 Ax12 for certain frequency ranges,
with the wave field at half-integer values of A x being obtained by inter-
polation. The phase shift that arises from the finite-difference approximation is
(353)
For frequencies of 40 Hz and below, the limit is set both by the order of
the discrete Fourier transform and by the effective A x corresponding to the
frequency. For example, since 3KX/2was utilised at 30 Hz, the maximum angle
N
Frequency (HA \o
N c. OI 0)
-
0 N p
0 0 0 0
SIGNAL ANALYSIS IN SEISMIC STUDIES 295
00 -00
01 01
oa 02
03 03
04 04
06
p 06 00 g
i:: 0s
O7
O8
09
6
j
B
I 0 LO
11 11
12 12
1s 15
14 14
2N +1 1m = - W,
~ 2, a)exp ( ( 2 N + 1 ) A x ) '
(354)
296 J. F. BOYCE AND L. R. MURRAY
where
1 u(x,z,w)exp
N
ij(rn,z,o) = (357)
n= -N
?(aAx,z,w) = c A(a,n)u(nA x , z , w ) ,
n= -N
N
(359)
where
1 sin[n(a - n)]
A(a,n) =
(2N + 1) sin(rr(u - n)/(2N + 1))’
with the corresponding transfer function being
N
F(w)=
n=-N
1 A(a,n)exp(ino).
Further, the asymmetry that exists between the data range n Ax( - N I n S N )
and the interpolation range a A x ( 0 I us 1) may be removed by averaging the
interpolated field over the value obtained from Eq. (359), and that obtained
from the equivalent operator defined over the range - N 1I n I N 1+ +
and interpolated within the same range, a A x ( 0 I a I 1). The interpolation
equation then becomes
F(CIA X ,Z, W) =
[:
- A(u, - N)u(- N A X ,Z , W)
+ j1A ( a , N + l)U((N + 1 ) A x , Z, W)
+ c N
n= - N + I
A(a,n)u(nAx,z,co)
1. (362)
T r a n s f e r f u n c t I on - modulus. N = 7
m = 1/8 (I = 218
0.5
H If) H I i r Y
"12 f
00 - -00
01 01
02 02
03 03
04 04
06 05
Boa 08 g
6
io7
P O 8
07
08
I
1
09 09
10 ia
11 11
12 10
13 13
14 I4
The slight amount of dispersion exhibited in Fig. 34, due to spatial aliasing
in the frequency range 30 to 40 Hz, has now been eliminated as a result of the
improvement in the design of the interpolation operator. By interpolating to
Ax/16, the limiting angle of dip has been extended to 70”. We may expect that
increasing the order of the interpolation operator in Eq. (362) will enable
reflections arising from arbitrarily large angles of dip to be migrated
successfully.
The method may be extended to three space dimensions by replacing the
single-dimensional Fourier transform by one of two dimensions.
)::(
6e=tan - ; d $ = tan(%),
SIGNAL ANALYSIS IN SEISMIC STUDIES 299
where
6%= $1 - e; 64 = 41 - 4, (367)
and
-
e= $(el + e); 6 = $(4’ + 4). (368)
Expanding the terms of Eq. (157) to first order in the changes of the param-
eters yields the approximate form of P-wave ~oefficient.~
This equation, known as the Aki and Richards equation (1980) is a rewritten
version of an expression given by Bortfeld (1961) as part of a more general
approximation to the Zoeppritz equations. Various alternative expressions
have been derived by other authors (Richards and Frazier, 1976; Shuey, 1985).
An estimate of the parameter ratios in Eq. (369) may be obtained by a least-
squares fitting to the reflection events of a common midpoint gather (Mayne,
1962), having first determined the angle of incidence of the P-wave on the
interface at each offset. Such an analysis is known as “amplitude versus offset.”
Its efficacy relies on the approximation that a common midpoint gather
provides multiple realisations of the reflection response from the same
reflection point at different angles of incidence. An approach of this kind was
developed by Smith and Gidlow (1985)from earlier work by Stolt and Weglein
(1985) to perform a weighted averaging process (“geostack”) to display
information concerning rock properties in the form of P- and S-wave
reflectivities.
Smith and Gidlow rearrange Eq. (369) to the form
+--tan2e (370)
and then used the “mudrock line” assumption for water-saturated silicate
rocks (Castagna et al., 1985)
cp N 1360 +1.66~~ (371)
to express cs in terms of c p and hence to utilise in Eq. (370). Unfortunately the
constants in Eq. (371) are survey dependent, so well control data, i.e.,
compressional and shear wave velocities obtained by drilling, is required. This
is not always available, and, although estimates may be made from the seismic
data (Carrion and Hassanzadeh, 1985), the values so obtained may not be
For notational simplicity, the bars indicating the means across the interface will be omitted.
300 J. F. BOYCE A N D L. R. MURRAY
reliable. In addition, Eq. (371) is incorrect for regions where carbonates are
present, such as the North Sea.
A further problem arises from the terms sin’ 0 and tan’ 0 in Eq. (370).These
have similar magnitudes at small angles; thus small errors in the data may
produce an incorrect distribution between the two terms. To combat this
effect, Smith and Gidlow assumed a relationship between density and P-wave
velocity that holds for water-saturated rocks, excluding evaporites (Gardner
et. al., 1974),namely,
p N 0.23cy4, (372)
where c p is in feet/sec. It follows that
6p 1 6cp
- (373)
P 4 CP’
yielding the final form of the equation to be fitted to the common mid-
point data
When this equation is fitted to the seismicdata, the ratios 6cp/cpand 6c,/c, can
be obtained, where the latter relies upon the validity of Eq. (373). Notice that
the former is the P-wave reflectivity at zero offset, and should, in principle, be a
more accurate estimate than that obtained by stacking.
By assuming a constant density model, Smith and Gidlow showed that the
6 p l p term in Eq. (370) could be removed without significantly affecting the
results, indicating that the parameters that determine the characteristics of the
reflection are primarily the phase velocities of the dilatation and shear waves.
The problem of reliably estimating the shear wave velocity was clearly
demonstrated when, even with well control allowing cross-plots of the two
velocity fields cpand cs and thus the constants of Eq. (370)to be determined for
the gas prospect being investigated, the results did not give a satisfactory
indication of the gas-bearing sediments.
A form of Eq. (369) that is more suitable for amplitude variation with offset
analysis may be obtained by rewriting it as a parabola in terms of the three
parameters of intercept, gradient, and curvature at zero offset. Upon defining
the P- and S-wave moduli of the two strata by
SIGNAL ANALYSIS IN SEISMIC STUDIES 30 1
Then
sin2~+2&
-sin40. (379)
M
This is the Pan and Gardner (1985, 1987) approximation to the Zoeppritz
equations. It is of the form
Fitting the above equation to common midpoint data provides estimates for
the parameter ratios 6p/p, 6 M / M , and d p / M . Model calculations (Murray,
1989) have shown that even with significant changes in the values of the
parameters (16c,l < 20%, 16c,l < 29%, 16pJ< 12%), good agreement is ob-
tained between the fit to a common midpoint gather yielded by Eq. (380)
and that of a calculation using the exact Zoeppritz equations. Hence it may be
inferred that the approximation should be adequate to account for any
parameter variations likely to be encountered when fitting real seismic data.
Due to preprocessing, however, real data are scaled in a manner that precludes
the determination of the true values of the ratios in Eq. (380); nevertheless, the
relative values that can be obtained are sufficient for the characterisation of
the horizons of interest.
302 J. F. BOYCE A N D L. R. MURRAY
-DO
01
02
03
04
OL
00
07
Given an amplitude anomaly such as that between 1.1 s and 1.2 s on the
stacked section of Fig. 37, amplitude versus offset analysis may be used to
determine whether the anomaly is hydrocarbon related. Although methods for
analysing the amplitude of a seismic event have existed for a couple of decades
(Grant and West, 1965; Anstey, 1980), only in the last few years have
quantitative methods been proposed, due to the improvement in acquisition
techniques and a better appreciation of the effects of the processing operations
on the true amplitude of the seismic wavelet (Gassaway and Richgels, 1983;
Gelfand and Larner, 1984).
The problem may be approached from a knowledge-based, forward-
modelling point of view, the elements of which may be summarized as:
(i) identifying a possible hydrocarbon prospect from bright-spot or
related anomalies on a section, usually by visual inspection;
(ii) proposing the lithologic constituents of the suspected reservoir by
using knowledge of the regional geology;
SIGNAL ANALYSIS IN SEISMIC STUDIES 303
(iii) calculating synthetic seismograms or reflection coefficient plots to
give an indication of the amplitude variation with offset that may be anti-
cipated from this lithology;
(iv) designing a filter based on this expected amplitude variation that
characterises the horizon and applying it to the data, such that post filtering,
only those sections of the gather that possess this amplitude variation remain.
The last step may be regarded as a form of automatic pattern recognition.
Pursuant to the above scheme, the amplitude variation with offset observed
for a synthetic top gas-sand reflection was characterised and used to construct
a pattern-recognition filter. This filter was then applied to the real data of
Fig. 37.
A stacked section data set is shown in Fig. 38, on which a gas sand can be
seen from 1.10 s to 1.18 s. The fault in the base of the gas sand can be clearly
seen around trace 375 at 1.14 s, as can the faults in the Base Tertiary at traces
303 to 345 and 0.48 s to 0.53 s. It should be noted that the data of Fig. 38 has
been scaled in such a way as to preserve relative amplitude. All the data in the
gather has been scaled such that the maximum amplitude in the gather has a
set number of trace deflections, in this case 1.5 trace deflections.
The values of the parabolic coefficients a , , . . u3 of Eq. (380) were obtained
for each sample of the MAP-processed section. In order to obtain a confident
estimate of these coefficients, no sample time was fitted that did not have nine
live traces. This resulted in no output for the data at times less than w0.4
seconds, however this region of the section is of little interest. The physical
am a
O O0
a la, a LOO
am am
a m a m
am aw
am am
am am
a m a m
am amo
asm asm
1. ooo 1. ooo
1. la, 1. loo
1.200 1.m
(383)
II;
was noted to be negative for the shale-gas sand interface. What are more
important, however, are the relative values of the coefficients a, and a 3 ,
because these are derived from the amplitude variation across the gather.
From the calculated amplitude variation with offset coefficient, a2 is negative
whilst a3 is positive in both cases; and this fact, together with their ratio and
the negative a, observation was used to characterise the shale-gas reflection.
From these considerations, the conditions characterising a shale-gas sand
interface can be stated as
Note that
giving
6P
- < 0,
P
that is, 6p must be negative. As p' < p, this is physically consistent with
the model
Also, if a3 < 21a21,
8P SP
2-<-+ 4-SP
M P M
or
6P
- + 2-6 P > 0.
P M
Using Eq. (386), this results in the condition
When the constraints of Eq. (384) are applied to the coefficient stacks and
the conversion to 6p/p, 6 M / M , and Bp/M is made, the results obtained are
shown in Figs. 39 to 41. The cumulative action of the constraints of Eq. (384) is
to produce a filter that passes only that region of the data consistent with the
shale-gas sand horizon characterisation. Comparing the three “subsurface
308 J. F. BOYCE AND L. R. MURRAY
parameter sections” with the stacked section of Fig. 38, the only area where
there is a significant amount of coherent signal is where the shale-gas sand
horizon is in fact situated.
The success of the filter is qualified, however, firstly by the fact that the
signal at the shale-gas sand horizon is only evident on one side of the
reservoir. This is most likely due to the incorrect estimation of angles of
incidence, arising from an erroneous velocity model, across that half of the
section containing the dipping Base Tertiary horizon, and the deleterious
effect the faulted portion of this same interface has on the true amplitude of the
wave front. Secondly, the lack of response from the edges of the gas sand is
probably due to tuning effects between the top and bottom gas-sand
reflections.
APPENDICES
g(t) =
:1 +
h(t,t ‘ ) f ( t ’ ) d t ’ n(t), (388)
SIGNAL ANALYSIS IN SEISMIC STUDIES 309
where f ( t )is an “ideal” trace and n(t) represents the effect of additive random
noise. We wish to find a filter function h(t) such that
is a minimum, where
and the average, ( ), is taken with respect to the common midpoint gather.
Now
( f M t - 1)) = Y
j m- (g(t t ’ )s (t - z)>h(.r’)dz’, (392)
For discretely sampled functions, Eq. (173) becomes the matrix equation
where, since it is derived from a convolution, h,. is a Toeplitz matrix, viz., the
elements on any diagonal are all equal.
The discrete analogue of the Wiener-Hopf equation is
ca,
1” = -m
h,t,*(gt,,gt,>= ( f t S t * > , (398)
where R,, and R,, are the cross- and autocorrelation matrices, respectively.
If the signal and noise are uncorrelated, i.e., if
<f(W’)>
= 0,
then, from Eq. (397),
(f,s,,>= C(f,f,->&,,
1”
or
R,, = R,,HT,
where HTis the transpose of H, and similarly,
Theorem 1. The points formed by the shot, geophone, reflection point, and
the intersection of the shot-receiver perpendicular bisector, with the per-
pendicular to the line of reflection at the reflection point, all lie on a circle.
Proof. As shown in Fig. 42, S and G are the shot and geophone positions,
respectively; M is their midpoint. AD is the reflection line, with D being
vertically below M. S, G, and D define a circle whose centre lies on M D ; P is its
intersection with AD. Since ED is a diameter of the circle, E P is perpendicular
to the reflection line AD. The proof consists of showing that the angles a and a’
are equal and therefore that P is the reflection point for a ray that emanates
from S and is reflected from AD to be received at G . Now it follows from the
property that the angle subtended by the chord of a circle at any point of the
circumference is a constant and that ct and a’, subtended at P by SE and EG,
respectively, are equal to the corresponding angles subtended at D, with the
latter being coequal, by the property of congruent triangles, since M is the
midpoint of SG.
Lemma 1. The angles of emergence of the incident and reflected rays are
(a - 8) and (a + 8), respectively.
and hence
(
t = t ; + ( 2 h y 0”””
But
AG=AM+h
and
CtO
AM=-
2 sin 8 ’
hence
+ a) sin 0.
r = (&
COqe
+ h) cos a
5 + 1)cos(e
= h cot 8 cot(&
+ a) sin 6
cos a
- 2h cos(8 - a)cos(8 + a)
- 3
sin 2a
and since we may write
2u = (e + a) - (e - a),
the theorem follows by trigonometric identity.
The objective of stacking is to coalesce the gather into a single trace that
displays the signal characteristic of primary seismic reflections while suppress-
ing noise and spurious signals caused by long-period multiples or diffractions.
Realisation of this intention requires a model to determine the statistical
behaviour of a trace element across the gather. The model may be expressed in
314 J. F. BOYCE AND L. R. MURRAY
terms of an ideal trace, it being the trace that would be observed if the system
were noise free, the instrumentation were perfect, and the static and normal
moveout corrections exactly compensated for seismic propagation path
differences.
Since the recorded amplitude is regarded as being derived from an ideal
signal that has been transformed by propagation and instrument response
effects, and corrupted by noise, from Eq. (173), an individual trace of the
normal moveout corrected gather takes the form
g(a) = (H* f)(a) + n(a), (42 1)
where the action of dispersion and instrumentation effects on the signal f (a) is
represented by convolution with H,whilst n(a) represents noise, assumed to be
additive and independent for different traces.
If the static corrections, stacking velocity analysis, and corresponding
normal moveout corrections were to compensate exactly for the seismic
propagation path differences, then f (a) would be the ideal signal. If second-
order effects, such as normal moveout stretch, may be neglected, then for
primary reflections,f (a)would be the same for each trace of the gather. In fact,
due to errors arising both inherently from the approximations underlying the
preliminary processing and from observational effects, f (a) varies around
some mean trace f, assuming that, since the errors are due to many residual
effects, the probability distribution p(f(a)) of observing a trace f(a) may be
approximated by a Gaussian distribution
- " ~ -(f(a) - ?)T(2Rf)-'(f(a) - i)}, (422)
p(f(a)) = [ ( ~ X ) ~ I R ~ I ] exp{
where Rf is the autocovariance matrix.
Systematic errors do arise when there is signal due to a long-period
multiple reflection. The ideal trace then contains a wavelet whose location'
varies across the gather along the residual moveout hyperbola arising from the
difference between the primary and multiple stacking velocities at the same
time. This effect, however, may be removed by introducing a semblance
threshold consistent with the velocity field analysis.
The noise is similarly assumed to be Gaussian distributed about zero
mean, with the probability of observing a trace containing noise component
n(a)being
p(n(a)) = [ ( ~ x ) ~ I R , ~ ] -exp{
' / ~ - n(a)T(2R,)-'n(a)}, (423)
where R, is the autocorrelation matrix of the distribution of noise traces.
Now the conditional probabilities for observing either f (a) or (H * f (a)),
given that g(a) has been observed, are related by
p(f(a)lg(a)) = ldet Hlp(H * f(a)/g(a))* (424)
SIGNAL ANALYSIS IN SEISMIC STUDIES 315
The optimum trace for each offset distance is that f(a) that maximises the
above quantity, the posterior probability distribution of the ideal trace f, given
the observed trace g. It depends both on the observed trace g(a) and the overall
statistics of the complete gather, with the latter dependence being expressed
via the autocovariance matrices RHf and R, of signal and noise, respectively.
The maximum occurs for
a
---In[p(f(a)/g(a))] =0 i = 1, ..., N , (425)
afi (a)
where g is the mean trace of the observed gather. This equation expresses the
optimum trace?@)for each offset distance in terms of the mean observed trace
g and the observed trace g(a) at that offset,weighted by the inverse correlation
matrices R,' and R;? of the noise and noise-free signal, respectively. When
the signal-to-noise ratio is small, the optimum trace is weighted towards the
usual stacked trace g, and when the ratio is large, the optimum is weighted
towards the observed trace g(a).
The common midpoint gather of observed traces f (a), a = 1,. . . ,M has
been transformed into a common midpoint gather of optimal traces H * T(a),
a = 1,. . .,M . The arithmetic means of both sets are equal, being the usual
stacked trace. The signal-to-noise ratio of an optimal trace is significantly
increased relative to that of the corresponding observed trace, being of the
same order as that of the stacked trace, whereas its resolution is comparable to
that of the observed trace. Moreover, since the minimum offset trace g(1) is
least affected by errors due_to stacking, velocity determination, and normal
moveout corrections, H * f(1) will be chosen as the overall optimum trace.
Effectively, the minimum offset trace g(1) has been regarded as the most
reliable, and the remainder of the gather has been employed to constru_ct a
statistical filter to convert from g(1) to the corresponding MAP trace H * f(1).
The continued appearance of the dispersion and instrumentation convolution
H is not surprising since the poststack processing is designed to remove it.
Although Eq. (426) defines the optimal trace, its application requires a
knowledge of the autocovariance matrices. Fortunately these may, to a
sufficient approximation, be assumed to be diagonal. In addition, the noise
variance may be identified with a background upon which signal peaks are
superimposed, with this structure enabling the signal component c& to be
separated from that of the noise 0,' and permitting the MAP equation to be
simplified to
) (1 + Vi)-l(gi
j i ~ a= + vigi(a)), (427)
316 J. F. BOYCE AND L. R. MURRAY
where
V =
&c + 0;
0; ‘
ACKNOWLEDGEMENT
The authors wish to thank Seismographic Services (United Kingdom) Ltd. for permission to
utilise the seismic data contained within the figures showing real data. They also wish to thank
Mr. D. W. March and Dr. R. Silva of Seismographic Services for their generosity both of time
and patience during many discussions. Any shortcomings within the above work are the respon-
sibility of the authors alone.
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318 J. F. BOYCE AND L. R. MURRAY
319
320 INDEX
Figures 30 and 31 arc reprinted from Rothbard, D. R., and Skopec, R. A.,
Bajsarowicz, C. J.. and Fa& T. H. (1987). Scanning Microscopy 1,489-494.
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