Professional Documents
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Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer, Any measurements not within the limits specified
always make a safety check of the entire instrument, herein indicate a potential shock hazard that must
including, but not limited to, the following items: be eliminated before returning the instrument to
the customer.
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing.
(READING SHOULD
(1)Protective shields are provided to protect both NOT BE ABOVE
the technician and the customer. Correctly replace 0.5mA)
LEAKAGE
all missing protective shields, including any DEVICE CURRENT
UNDER TESTER
removed for servicing convenience. TEST
(2)When reinstalling the chassis and/or other as- TEST ALL
sembly in the cabinet, be sure to put back in place EXPOSED METER
SURFACES
all protective devices, including, but not limited to,
nonmetallic control knobs, insulating fish papers, 2-WIRE CORD
adjustment and compartment covers/shields, and ALSO TEST WITH EARTH
isolation resistor/capacitor networks. Do not oper- PLUG REVERSED GROUND
(USING AC ADAPTER
ate this instrument or permit it to be operated with- PLUG AS REQUIRED)
out all protective devices correctly installed and
functioning. Fig. 1-1 AC Leakage Test
(2) Be sure that there are no cabinet openings through (4) Insulation Resistance Test Cold Check-(1) Unplug
which adults or children might be able to insert the power supply cord and connect a jumper wire
their fingers and contact a hazardous voltage. Such between the two prongs of the plug. (2) Turn on the
openings include, but are not limited to, excessive- power switch of the instrument. (3) Measure the
ly wide cabinet ventilation slots, and an improper- resistance with an ohmmeter between the
ly fitted and/or incorrectly secured cabinet back jumpered AC plug and all exposed metallic cabinet
cover. parts on the instrument, such as screwheads,
antenna, control shafts, handle brackets, etc. When
(3) Leakage Current Hot Check-With the instrument an exposed metallic part has a return path to the
completely reassembled, plug the AC line cord chassis, the reading should be between 1 and 5.2
directly into a 120V AC outlet. (Do not use an iso- megohm. When there is no return path to the chas-
lation transformer 110-240V during this test.) Use a sis, the reading must be infinite. If the reading is
leakage current tester or a metering system that not within the limits specified, there is the possibil-
complies with American National Standards insti- ity of a shock hazard, and the instrument must be
tute (ANSI) C101.1 Leakage Current for Appliances repaired and rechecked before it is returned to the
and Underwriters Laboratories (UL) 1270 (40.7). customer. See Fig. 1-2.
With the instrument’s AC switch first in the ON
position and then in the OFF position, measure
Antenna
from a known earth ground (metal water pipe, con-
Terminal
duit, etc.) to all exposed metal parts of the instru-
ment (antennas, handle brackets, metal cabinets,
screwheads, metallic overlays, control shafts, etc.),
Exposed
especially any exposed metal parts that offer an Metal Part
electrical return path to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the out- ohm
ohmmeter
let and repeat the test. See Fig. 1-1.
Fig. 1-2 Insulation Resistance Test
2) Read and comply with all caution and safety re- 5) Components, parts, and/or wiring that appear to
lated notes on or inside the cabinet, or on the chas- have overheated or that are otherwise damaged
sis. should be replaced with components, parts and/ or
wiring that meet original specifications.
3) Design Alteration Warning-Do not alter or add to Additionally, determine the cause of overheating
the mechanical or electrical design of this instru- and/or damage and, if necessary, take corrective
ment. Design alterations and additions, including action to remove any potential safety hazard.
but not limited to, circuit modifications and the
addition of items such as auxiliary audio output 6) Product Safety Notice-Some electrical and mechani-
connections, might alter the safety characteristics of cal parts have special safety-related characteristics
this instrument and create a hazard to the user. Any which are often not evident from visual inspection,
design alterations or additions will make you, the nor can the protection they give necessarily be
servicer, responsible for personal injury or property obtained by replacing them with components rated
damage resulting therefrom. for higher voltage, wattage, etc. Parts that have spe-
cial safety characteristics are identified by shading,
4) Observe original lead dress. Take extra care to an ( )or a ( )on schematics and parts lists. Use
assure correct lead dress in the following areas: of a substitute replacement that does not have the
(1) near sharp edges, (2) near thermally hot parts (be same safety characteristics as the recommended
sure that leads and components do not touch ther- replacement part might create shock, fire and/or
mally hot parts), (3) the AC supply, (4) high voltage, other hazards. Product safety is under review con-
and (5) antenna wiring. Always inspect in all areas tinuously and new instructions are issued whenev-
for pinched, out-of-place, or frayed wiring, Do not er appropriate.
change spacing between a component and the
printed-circuit board. Check the AC power cord for
damage.
MEMO
* : Nominal specification
Chassis EZVIEW
DVD-HD850
DV -HD850
Model Standard of
Batteries for
4301-001035 BD-P1000/XEU
Remote Control
S.N.A
Model Standard of
User’s Manual AK68-01229A
BD-P1000/XEU
Model Standard of
AK68-01230A
Quick Guide BD-P1000/XEU
AK68-01231A
S.N.A
Model Standard of
Component Cable MD39-00107A
BD-P1000/XEU
Model Standard of
Bundle Disc _
BD-P1000/XEU
MEMO
1) Insert update CD and close the tray. 4) When Finished, tray opened automatically, then power goes
off.
Fig. 3-1
Fig. 3-4
2) Press Yes if the update CD you insert is a later one than
before.
Yes No
Fig. 3-2
Fig. 3-3
3-1-2 Sub F/W Update Method 3-1-2 Loader F/W Update Method
(for DVD Logical Problem) (for Disc Physical Problem)
1) Insert update CD and close the tray. 1) Insert update CD and close the tray.
2) Press Yes if the update CD you insert is a later one than 2) Press Yes if the update CD you insert is later one than before.
before.
Yes No Yes No
4) When Finished, tray opened automatically, then power goes 4) When Finished, tray opened automatically, then power goes
off. off.
Fig. 3-9
1) Remove 5 Screws Œ, ´, ˇ.
2) Lift up the Top Cabinet ¨ in direction of arrow.
´ 1 SCREW Œ 3 SCREW
(3 x 10 Y) (3 x 10 Y)
¨ TOP CABINET
ˇ 1 SCREW
(3 x 10 Y)
¨ 2 HOOK
Œ 1 HOOK
´ 1 HOOK
ˇ 3 HOOK
ˆ ASS’Y FRONT-CABINET
Œ 2 SCREW ´ 2 SCREW
(3 x 10 Y) (3 x 10 Y)
ˇ ASS’Y DECK
Œ 6 SCREW
(3 x 8 Y)
´ SMPS PCB
ˇ Mian PCB
Œ 6 SCREW
(3 x 6 Y)
´ 5 SCREW
(3 x 10 B)
ˇ 2 SCREW
(3 x 14 W)
¨ FAN
MAIN PCB
SMPS PCB
MEMO
NO Power Detected
(Stand by LED OFF)
No
F01 is normal? Change fuse
Yes
C10 voltage No
is normal voltage? Change BD01
Yes
No
Check Current Digital Audio No Check the A/V Receiver No Set to Bitstream
Setting is PCM. can Decode Current
Bit-Steam
Yes Yes
Yes
Yes
No
Check 5V at AIC2 pin14 Check the power cable
AUDIO DATA
Yes
No
No
Yes
Yes
Is the 40pin No
FFC cable(between main & deck) Reinsert FFC cable correctly
inserted correctly?
Yes
Is the wavefrom No
of U10-pin24 normal? Change the Main board
(MAIN PCB)
U10-pin24
Yes
Remocon battery No
Change the battery
OK?
Yes
Yes
Yes
No Picture
No
Logo screen is OK ? NO LOGO
Yes
No
BD playback picture is OK ? BD
Yes
No
DVD playback picture is OK ? DVD
Yes
Yes
NO LOGO Screen(HDMI)
Yes
Yes
data output from HIC1 ? No Check the HIC1 power input and
(pin26,27,29,30,32,33,35,36) peripheral devices
Yes
NO LOGO Screen
(Component 1080i, 720p, 575p/480p)
Video selection
accords with cable No Check the Video select, cable
connection and TV mode ? connection, TV mode
Yes
Yes
Yes
Yes
Yes
Y,Pb,Pr signals No
output from VIC4 ? Check VIC4 power input
(pin25,21,17)
Yes
Yes
Video selection No
accords with cable connection Check the Video select, cable
and TV mode ? connection, TV mode
Yes
Yes
Yes
No
Y,Pb,Pr signal output from VIC3 ? Check VIC3 power input
(pin25,21,17)
Yes
Yes
Yes
Yes
Video and S-Video signal output No Check VIC7 power and Reset
from VIC7 ? (pin44,43,42) (pin33; ‘High’) input
Yes
Yes
Yes
BD
TS Clock, data
and SYNC output from U1 ? No Check U1 power input and Memory
(EL6, R342~344, R348) interface
Yes
Yes
Yes
Yes
Yes
DVD
PS Clock, data
and SYNC output from U1 ? No Check U1 power input and Memory
(EL6, R342~344, R348) interface
Yes
Clock, data
output from U20 ? No Check U30 power input and Memory
(RP30, RP31, R518) interface
Yes
Yes
Yes
Yes
W348 W289
(3 x 8 Y) (3 x 10 Y)
W289
(3 x 10 Y)
P003
W289 W289
(3 x 10 Y) (3 x 10 Y)
C015
W289
P160 P025 (3 x 10 Y)
W275 H003
(3 x 6 Y)
P030 W275
(3 x 6 Y)
W001
(3 x 10 B)
P001
ASSY FRAME (S.N.A)
S.N.A.: Service Not Available
BRACKET-FRAME (S.N.A.)
W020
(3 x 14 Y)
P006 P004
A001
C001
W275
(3 x 6 Y)
W020
C022 (3 x 14 Y)
W275
(3 x 6 Y) P005
C641
C002
C011
MEMO
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
P001 AK92-01215A ASSY PCB-MAIN;BD-P1000/XEU,MAIN PCB 1 SA AD77 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3 1 SA
AC1 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA AD8 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3 1 SA
AC108 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA AD81 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3 1 SA
AC111 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA AD87 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3 1 SA
AC135 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
AD91 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3 1 SA
AC21 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA AD97 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3 1 SA
AC3 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA AE1 2402-000176 C-AL,SMD;10uF,20%,16V,GP,TP,4.3x4.3 1 SA
AC4 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA AE111 2402-000176 C-AL,SMD;10uF,20%,16V,GP,TP,4.3x4.3 1 SA
AC5 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA AE135 2402-001221 C-AL,SMD;470UF,20%,16V,-,TP,A8.3XB8 1 SA
AC520 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
AE2 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6. 1 SA
AC6 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA AE202 2402-000170 C-AL,SMD;1uF,20%,50V,GP,TP,4.3x4.3x 1 SA
AC61 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA AE3 2402-000179 C-AL,SMD;47uF,20%,16V,GP,TP,6.6x6.6 1 SA
AC611 2203-005194 C-CER,CHIP;0.22nF,10%,50V,X7R,1608 1 SA AE4 2402-001096 C-AL,SMD;220UF,20%,16V,GP,TP,6.6X6. 1 SA
AC62 2203-000726 C-CER,CHIP;3.9nF,10%,50V,X7R,1608 1 SA AE61 2402-001269 C-AL,SMD;10uF,20%,10V,WT(BP),REEL,4 1 SA
AC63 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA
AE67 2402-001269 C-AL,SMD;10uF,20%,10V,WT(BP),REEL,4 1 SA
AC65 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA AE71 2402-001269 C-AL,SMD;10uF,20%,10V,WT(BP),REEL,4 1 SA
AC66 2203-000726 C-CER,CHIP;3.9nF,10%,50V,X7R,1608 1 SA AE77 2402-001269 C-AL,SMD;10uF,20%,10V,WT(BP),REEL,4 1 SA
AC67 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA AE81 2402-001269 C-AL,SMD;10uF,20%,10V,WT(BP),REEL,4 1 SA
AC671 2203-005194 C-CER,CHIP;0.22nF,10%,50V,X7R,1608 1 SA AE87 2402-001269 C-AL,SMD;10uF,20%,10V,WT(BP),REEL,4 1 SA
AC7 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,1608 1 SA
AE91 2402-001269 C-AL,SMD;10uF,20%,10V,WT(BP),REEL,4 1 SA
AC71 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA AE97 2402-001269 C-AL,SMD;10uF,20%,10V,WT(BP),REEL,4 1 SA
AC711 2203-005194 C-CER,CHIP;0.22nF,10%,50V,X7R,1608 1 SA AIC1 1002-001456 IC-D/A CONVERTER;AK4358,24Bits,LQFP 1 SA
AC72 2203-000726 C-CER,CHIP;3.9nF,10%,50V,X7R,1608 1 SA AIC2 AH14-10004R IC-CMOS LOGIC;M74HCU04,-,SOP,14P,-, 1 SA
AC73 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA AIC3 0801-002393 IC-CMOS LOGIC;74VHC244,BUS BUFFER,T 1 SA
AC75 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA
AIC4 0801-002393 IC-CMOS LOGIC;74VHC244,BUS BUFFER,T 1 SA
AC76 2203-000726 C-CER,CHIP;3.9nF,10%,50V,X7R,1608 1 SA AIC5 0801-002393 IC-CMOS LOGIC;74VHC244,BUS BUFFER,T 1 SA
AC77 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA AIC6 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,1 1 SA
AC771 2203-005194 C-CER,CHIP;0.22nF,10%,50V,X7R,1608 1 SA AIC7 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,1 1 SA
AC8 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,1608 1 SA AIC8 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,1 1 SA
AC81 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA
AIC9 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,1 1 SA
AC811 2203-005194 C-CER,CHIP;0.22nF,10%,50V,X7R,1608 1 SA AL1 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm/70MH 1 SA
AC82 2203-000726 C-CER,CHIP;3.9nF,10%,50V,X7R,1608 1 SA AL3 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm/70MH 1 SA
AC83 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA AL4 2901-001273 FILTER-EMI SMD;50V,2A,-,220pF,3.2x1 1 SA
AC85 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA ANR123 2011-000660 R-NET;1Kohm,5%,1/16W,L,CHIP,8P,TP,3 1 SA
AC86 2203-000726 C-CER,CHIP;3.9nF,10%,50V,X7R,1608 1 SA
ANR127 2011-000660 R-NET;1Kohm,5%,1/16W,L,CHIP,8P,TP,3 1 SA
AC87 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA AP1 1203-001697 IC-POSI.FIXED REG.;78R08,TO-220,4P, 1 SA
AC871 2203-005194 C-CER,CHIP;0.22nF,10%,50V,X7R,1608 1 SA AP3 1203-003180 IC-POSI.FIXED REG.;MM1565,SOP,7P,5x 1 SA
AC9 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,1608 1 SA AP4 1203-000122 IC-NEGA.FIXED REG.;7908,TO-220,3P,- 1 SA
AC91 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA APC1 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
AC911 2203-005194 C-CER,CHIP;0.22nF,10%,50V,X7R,1608 1 SA
APC2 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
AC92 2203-000726 C-CER,CHIP;3.9nF,10%,50V,X7R,1608 1 SA APC5 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
AC93 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA APE2 2402-001096 C-AL,SMD;220UF,20%,16V,GP,TP,6.6X6. 1 SA
AC95 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA APE3 2402-000179 C-AL,SMD;47uF,20%,16V,GP,TP,6.6x6.6 1 SA
AC96 2203-000726 C-CER,CHIP;3.9nF,10%,50V,X7R,1608 1 SA AQ15 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT- 1 SA
AC97 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608 1 SA
AQ3 0501-000002 TR-SMALL SIGNAL;KSA812,PNP,150MW,SO 1 SA
AC971 2203-005194 C-CER,CHIP;0.22nF,10%,50V,X7R,1608 1 SA AQ6 0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,22K/22 1 SA
AD1 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3 1 SA AQ61 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW 1 SA
AD4 0401-000008 DIODE-SWITCHING;DAN217,80V,100MA,SO 1 SA AQ611 0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,22K/22 1 SA
AD61 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3 1 SA AQ612 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT- 1 SA
AD67 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3 1 SA
AQ67 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW 1 SA
AD71 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3 1 SA AQ671 0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,22K/22 1 SA
Samsung Electronics This Document can not be used without Samsung’s authorization 7-1
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
AQ672 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT- 1 SA AR613 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
AQ71 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW 1 SA AR614 2007-000643 R-CHIP;270ohm,5%,1/10W,TP,1608 1 SA
AQ711 0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,22K/22 1 SA AR62 2007-000450 R-CHIP;180ohm,5%,1/10W,TP,1608 1 SA
7-2 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
AR96 2007-000450 R-CHIP;180ohm,5%,1/10W,TP,1608 1 SA C151 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
AR97 2007-000869 R-CHIP;4.7Kohm,1%,1/10W,TP,1608 1 SA C152 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
AR971 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 1 SA C153 2203-000426 C-CER,CHIP;0.018nF,5%,50V,C0G,1608 1 SA
Samsung Electronics This Document can not be used without Samsung’s authorization 7-3
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
C205 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA C269 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
C206 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA C270 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
C207 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA C271 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,1608 1 SA
7-4 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
C2878 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA C2935 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
C2879 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA C2937 2203-000332 C-CER,CHIP;0.012nF,5%,50V,C0G,1608 1 SA
C288 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA C294 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
Samsung Electronics This Document can not be used without Samsung’s authorization 7-5
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
C45 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA C64 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
C46 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA C640 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
C47 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA C641 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
7-6 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
C717 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,1608 1 SA CP57 2402-000176 C-AL,SMD;10uF,20%,16V,GP,TP,4.3x4.3 1 SA
C718 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA CP58 2402-000176 C-AL,SMD;10uF,20%,16V,GP,TP,4.3x4.3 1 SA
C72 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA D10 0401-000008 DIODE-SWITCHING;DAN217,80V,100MA,SO 1 SA
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Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
E35 2402-001096 C-AL,SMD;220UF,20%,16V,GP,TP,6.6X6. 1 SA HC17 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1 1 SA
E36 2409-001108 C-ORGANIC,LEAD;47##F,20%,10V,-,TP,6 1 SA HC18 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
E37 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6. 1 SA HC19 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
7-8 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
HR33 2007-000962 R-CHIP;5.1Kohm,1%,1/10W,TP,1608 1 SA L42 3301-000353 BEAD-SMD;120ohm,2x1.25x0.9mm,-,TP,- 1 SA
HR34 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 SA L43 3301-000353 BEAD-SMD;120ohm,2x1.25x0.9mm,-,TP,- 1 SA
HR35 2007-000869 R-CHIP;4.7Kohm,1%,1/10W,TP,1608 1 SA L44 3301-000353 BEAD-SMD;120ohm,2x1.25x0.9mm,-,TP,- 1 SA
Samsung Electronics This Document can not be used without Samsung’s authorization 7-9
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
R149 2007-001014 R-CHIP;51OHM,5%,1/10W,TP,1608 1 SA R27 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
R151 2007-001014 R-CHIP;51OHM,5%,1/10W,TP,1608 1 SA R270 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
R154 2007-001014 R-CHIP;51OHM,5%,1/10W,TP,1608 1 SA R271 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
7-10 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
R2889 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA R2983 2007-000869 R-CHIP;4.7Kohm,1%,1/10W,TP,1608 1 SA
R289 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA R299 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
R2890 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA R2990 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 SA
Samsung Electronics This Document can not be used without Samsung’s authorization 7-11
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
R316 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA R405 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
R317 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA R406 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
R318 2007-000115 R-CHIP;82ohm,5%,1/10W,TP,1608 1 SA R407 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 SA
7-12 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
R515 2007-000071 R-CHIP;22ohm,5%,1/10W,TP,1608 1 SA R576 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
R516 2007-000071 R-CHIP;22ohm,5%,1/10W,TP,1608 1 SA R577 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
R517 2007-000071 R-CHIP;22ohm,5%,1/10W,TP,1608 1 SA R578 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
Samsung Electronics This Document can not be used without Samsung’s authorization 7-13
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
R664 2007-000659 R-CHIP;27ohm,5%,1/10W,TP,1608 1 SA RN24 2011-001001 R-NET;0ohm,5%,1/16W,L,CHIP,8P,TP,3. 1 SA
R67 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA RN25 2011-000816 R-NET;100ohm,5%,1/16W,L,CHIP,8P,TP, 1 SA
R68 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA RN26 2011-001001 R-NET;0ohm,5%,1/16W,L,CHIP,8P,TP,3. 1 SA
7-14 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
RP53 2011-000002 R-NET;22ohm,5%,1/16W,L,CHIP,8P,TP,3 1 SA U24 0801-002393 IC-CMOS LOGIC;74VHC244,BUS BUFFER,T 1 SA
RP54 2011-000002 R-NET;22ohm,5%,1/16W,L,CHIP,8P,TP,3 1 SA U25 0801-002522 IC-CMOS LOGIC;74VHC541,BUFFER/LINE 1 SA
RP55 2011-000002 R-NET;22ohm,5%,1/16W,L,CHIP,8P,TP,3 1 SA U26 1103-001134 IC-EEPROM;24C040,512x8,SOP,8P,5.13x 1 SA
Samsung Electronics This Document can not be used without Samsung’s authorization 7-15
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
VC37 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA VIC7 1002-001480 IC-D/A CONVERTER;ADV7322KSTZ,11bits 1 SA
VC4 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA VL1 2703-000166 INDUCTOR-SMD;2.7uH,5%,3225 1 SA
VC41 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA VL2 2703-000166 INDUCTOR-SMD;2.7uH,5%,3225 1 SA
7-16 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
VR82 2007-000726 R-CHIP;300ohm,1%,1/10W,TP,1608 1 SA C31 2401-002300 C-AL;47##F,20%,50V,GP,TP,6.3x11,5mm 1 SA
VR83 2007-000726 R-CHIP;300ohm,1%,1/10W,TP,1608 1 SA
VR84 2007-000726 R-CHIP;300ohm,1%,1/10W,TP,1608 1 SA C33 2401-003549 C-AL;470uF,20%,25V,LZ,TP,10x16,5 1 SA
C34 2401-002300 C-AL;47##F,20%,50V,GP,TP,6.3x11,5mm 1 SA
VR85 2007-000726 R-CHIP;300ohm,1%,1/10W,TP,1608 1 SA C35 2401-003390 C-AL;2200uF,20%,16V,LZ,TP,13x31.5,5 1 SA
VR86 2007-000842 R-CHIP;3Kohm,1%,1/10W,TP,1608 1 SA C36 2401-001126 C-AL;330uF,20%,25V,WT,TP,10x12.5,5 1 SA
VR87 2007-000835 R-CHIP;39ohm,1%,1/10W,TP,1608 1 SA C37 2401-002300 C-AL;47##F,20%,50V,GP,TP,6.3x11,5mm 1 SA
VR88 2007-001116 R-CHIP;680ohm,1%,1/10W,TP,1608 1 SA
VR89 2007-000071 R-CHIP;22ohm,5%,1/10W,TP,1608 1 SA C39 2301-000129 C-FILM,LEAD-PEF;100nF,5%,50V,TP,10X 1 SA
C40 2401-003390 C-AL;2200uF,20%,16V,LZ,TP,13x31.5,5 1 SA
VR9 2007-001164 R-CHIP;75ohm,1%,1/10W,TP,1608 1 SA C41 2401-001126 C-AL;330uF,20%,25V,WT,TP,10x12.5,5 1 SA
VR90 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA C42 2401-003390 C-AL;2200uF,20%,16V,LZ,TP,13x31.5,5 1 SA
VR91 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA C43 2401-003390 C-AL;2200uF,20%,16V,LZ,TP,13x31.5,5 1 SA
VR92 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
VR95 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA C44 2401-001126 C-AL;330uF,20%,25V,WT,TP,10x12.5,5 1 SA
C45 2301-000129 C-FILM,LEAD-PEF;100nF,5%,50V,TP,10X 1 SA
VR96 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA C46 2401-001126 C-AL;330uF,20%,25V,WT,TP,10x12.5,5 1 SA
VRN1 2011-001194 R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,3 1 SA C47 2307-000104 C-FILM,LEAD-PCF;10nF,5%,50V,TP,-,5m 1 SA
VRN10 2011-000816 R-NET;100ohm,5%,1/16W,L,CHIP,8P,TP, 1 SA C48 2401-001363 C-AL;470uF,20%,16V,GP,TP,10x12.5,5 1 SA
VRN2 2011-001194 R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,3 1 SA
VRN3 2011-001194 R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,3 1 SA C50 2301-001654 C-FILM,LEAD-PEF;1000nF,5%,100V,TP,2 1 SA
C51 2301-001654 C-FILM,LEAD-PEF;1000nF,5%,100V,TP,2 1 SA
VRN4 2011-001194 R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,3 1 SA C938 AK39-00092A LEAD CONNECTOR;BD-P1000,UL 1007#24, 1 SA
VRN5 2011-001194 R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,3 1 SA CN01 3711-000203 HEADER-BOARD TO CABLE;1WALL,2P/3P,1 1 SA
VRN6 2011-001194 R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,3 1 SA CN1 3711-005582 HEADER-BOARD TO CABLE;BOX,24P,2R,2. 1 SA
VRN7 2011-000816 R-NET;100ohm,5%,1/16W,L,CHIP,8P,TP, 1 SA
VRN8 2011-000816 R-NET;100ohm,5%,1/16W,L,CHIP,8P,TP, 1 SA CN2 3711-004484 HEADER-BOARD TO CABLE;BOX,5P,1R,2mm 1 SA
CN3 3711-003942 HEADER-BOARD TO CABLE;BOX,2P,1R,2mm 1 SA
VRN9 2011-000816 R-NET;100ohm,5%,1/16W,L,CHIP,8P,TP, 1 SA D10 0402-000012 DIODE-RECTIFIER;UF4007,1KV,1A,DO-41 1 SA
X1 2801-004182 CRYSTAL-SMD;13.5MHZ,10PPM,28-AAN,24 1 SA D11 0402-001195 DIODE-RECTIFIER;F1T4,400V,1A,DO-204 1 SA
X600 2801-004496 CRYSTAL-SMD;19.6608MHz,30ppm,HC-49/ 1 SA D12 0402-001195 DIODE-RECTIFIER;F1T4,400V,1A,DO-204 1 SA
XU801 1107-001588 IC-FLASH MEMORY;S29GL032M,32Mbit,4M 1 SNA
Y2 2801-001384 CRYSTAL-UNIT;14.31818MHz,30ppm,28-A 1 SC D15 0402-000012 DIODE-RECTIFIER;UF4007,1KV,1A,DO-41 1 SA
D30 0402-001195 DIODE-RECTIFIER;F1T4,400V,1A,DO-204 1 SA
AK41-00590A PCB-MAIN;BD-P1000,EPOXY,6,00,1.6,29 1 SNA D31 0402-001194 DIODE-RECTIFIER;SHG2D,200V,2A,-,TP 1 SA
D32 0402-001600 DIODE-RECTIFIER;MBRF20100CT,100V,20 1 SA
D33 0401-000005 DIODE-SWITCHING;1N4148,75V,150mA,DO 1 SA
Samsung Electronics This Document can not be used without Samsung’s authorization 7-17
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
PZD2 0403-000720 DIODE-ZENER;MTZJ9.1B,8.57-9.01V,500 1 SC C20 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
C21 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1 1 SA
Q10 0501-000442 TR-SMALL SIGNAL;KTC3203-Y,NPN,400mW 1 SA
Q30 0505-001522 FET-SILICON;FQP33N10,N,100V,33A,52m 1 SA C22 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1 1 SA
R01 2002-000121 R-COMPOSITION;1Mohm,10%,1/2W,AA,TP, 1 SA C23 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
R10 1404-001195 THERMISTOR-NTC;5.1ohm,15%,2900,27mW 1 SA C24 2203-000041 C-CER,CHIP;0.01nF,0.25pF,50V,C0G,16 1 SA
R11 2006-000273 R-CEMENT;27KOHM,5%,2W,CA,BK,6.4X6.5 1 SA C3 2203-000041 C-CER,CHIP;0.01nF,0.25pF,50V,C0G,16 1 SA
C4 2203-000041 C-CER,CHIP;0.01nF,0.25pF,50V,C0G,16 1 SA
R12 2006-000273 R-CEMENT;27KOHM,5%,2W,CA,BK,6.4X6.5 1 SA
R13 2001-000793 R-CARBON;47OHM,5%,1/8W,AA,TP,1.8X3. 1 SA C5 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1 1 SA
R15 2003-000105 R-METAL OXIDE;0.33ohm,5%,2W,AD,TP,6 1 SA C6 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
R16 2001-000325 R-CARBON;120OHM,5%,1/8W,AA,TP,1.8X3 1 SA C7 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
R17 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3 1 SA C8 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
C9 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA
R20 2003-000994 R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP 1 SA
R21 2003-000994 R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP 1 SA CN1 3708-002284 CONNECTOR-FPC/FFC/PIC;47P,0.5mm,SMD 1 SA
R22 2003-002197 R-METAL OXIDE;0.47ohm,5%,2W,AF,TP,3 1 SA CN2 3709-001417 CONNECTOR-CARD EDGE;50P,0.635mm,SMD 1 SA
R30 2001-000038 R-CARBON;390OHM,5%,1/4W,AA,TP,2.4X6 1 SA CN3 3709-001411 CONNECTOR-CARD EDGE;41P,0.7mm,-,AU, 1 SA
R31 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3. 1 SA E3 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA
E4 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216 1 SA
R32 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3 1 SA
R33 2001-000221 R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8X 1 SA E5 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA
R34 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3. 1 SA E6 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216 1 SA
R35 2004-000869 R-METAL;3Kohm,1%,1/8W,AA,TP,1.8x3.2 1 SA E7 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216 1 SA
R36 2004-000869 R-METAL;3Kohm,1%,1/8W,AA,TP,1.8x3.2 1 SA FL624 3809-001840 CABLE-FLAT;30V,80C,210mm,47P,0.5mm, 1 SA
R1 2007-000124 R-CHIP;2.2Kohm,5%,1/10W,TP,1608 1 SA
R37 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3 1 SA
R38 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3 1 SA R10 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R39 2001-000924 R-CARBON;680OHM,5%,1/8W,AA,TP,1.8X3 1 SA R11 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R40 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3. 1 SA R12 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R41 2001-000924 R-CARBON;680OHM,5%,1/8W,AA,TP,1.8X3 1 SA R13 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R14 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R42 2001-000221 R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8X 1 SA
R43 2004-000459 R-METAL;2.2Kohm,1%,1/8W,AA,TP,1.8x3 1 SA R15 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R44 2001-000440 R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2 1 SA R16 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R47 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3 1 SA R17 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R54 2003-000148 R-METAL OXIDE;100ohm,5%,2W,AE,TP,6x 1 SC R18 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R19 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
R55 2001-000440 R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2 1 SA
RA1 2001-000019 R-CARBON(S);10OHM,5%,1/2W,AA,TP,2.4 1 SA R2 2007-000124 R-CHIP;2.2Kohm,5%,1/10W,TP,1608 1 SA
VA01 1405-000186 VARISTOR;470V,2500A,17.5x7.5mm,TP 1 SA R20 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
VA02 1405-001026 VARISTOR;470V,600A,9x7mm,TP 1 SA R21 2007-000124 R-CHIP;2.2Kohm,5%,1/10W,TP,1608 1 SA
W004 6003-000283 SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(YEL) 8 SA R22 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R23 2007-000124 R-CHIP;2.2Kohm,5%,1/10W,TP,1608 1 SA
ZD10 0403-000713 DIODE-ZENER;MTZJ20B,18.63-17.7V,500 1 SA
ZD11 0403-000713 DIODE-ZENER;MTZJ20B,18.63-17.7V,500 1 SA R24 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
ZD30 0403-000753 DIODE-ZENER;MTZJ27D,26.2-27.6V,500m 1 SA R25 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
AK41-00518B PCB-SMPS;BD-P1000,CEM-3,1,00,1.6T,1 1 SNA R26 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R27 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
R28 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
7-18 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
R5 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
R6 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA C14 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
C141 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA
R8 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA C142 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
R9 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA C143 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
RA1 2011-001011 R-NET;10Kohm,5%,1/16W,L,CHIP,8P,TP, 1 SA C145 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
RA2 2011-001011 R-NET;10Kohm,5%,1/16W,L,CHIP,8P,TP, 1 SA
RA3 2011-001011 R-NET;10Kohm,5%,1/16W,L,CHIP,8P,TP, 1 SA C146 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
C147 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
RA4 2011-001086 R-NET;47KOHM,5%,1/16W,L,CHIP,8P,TP 1 SA C148 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA
RA5 2011-001011 R-NET;10Kohm,5%,1/16W,L,CHIP,8P,TP, 1 SA C149 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,1608 1 SA
RA6 2011-001011 R-NET;10Kohm,5%,1/16W,L,CHIP,8P,TP, 1 SA C15 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
RA7 2011-001086 R-NET;47KOHM,5%,1/16W,L,CHIP,8P,TP 1 SA
U1 0904-002011 IC-DMA CONTROLLER;ATA16V2,16Bit,LQF 1 SA C151 2203-000998 C-CER,CHIP;0.047nF,5%,50V,C0G,1608 1 SA
C152 2203-000998 C-CER,CHIP;0.047nF,5%,50V,C0G,1608 1 SA
U2 1103-001147 IC-EEPROM;24256,256Kbit,32Kx8Bit,SO 1 SNA C153 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,1608 1 SA
U3 1203-002178 IC-POSI.FIXED REG.;1563,SOP,7P,173M 1 SA C154 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA
U4 1203-002178 IC-POSI.FIXED REG.;1563,SOP,7P,173M 1 SA C155 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
X1 2801-003773 CRYSTAL-SMD;12MHz,30ppm,28-AAN,20pF 1 SA
AK61-00569A BRACKET-PCB 9IN2;BD-P1000,SPTE,T0.6 1 SA C156 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
C157 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
AK41-00515A PCB-MEMORY CARD;BD-P1000,EPOXY,2,00 0.25 SNA C158 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA
C159 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA
C162 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
Samsung Electronics This Document can not be used without Samsung’s authorization 7-19
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
C202 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA C262 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA
C203 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA C263 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
C204 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA C264 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
C205 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA C265 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA
C206 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA C266 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
C207 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA C267 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
C208 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA C268 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
C209 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA C269 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA
C21 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528 1 SA C27 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
C210 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA C270 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,1608 1 SA
7-20 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
C71 2203-000626 C-CER,CHIP;0.022nF,5%,50V,C0G,1608 1 SA IC15 1105-001397 IC-DRAM;K4S641632,-,64Mbit,1Mx16x4B 1 SA
C73 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,1608 1 SA IC17 1103-000170 IC-EEPROM;24C64A,64Kbit,8Kx8Bit,SOP 1 SA
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Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
R17 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA R233 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
R170 2007-000115 R-CHIP;82ohm,5%,1/10W,TP,1608 1 SA R237 2007-000082 R-CHIP;3.3Kohm,5%,1/10W,TP,1608 1 SA
7-22 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
R337 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 1 SA S.N.A AK63-00262A GROUND-TERMINAL R;DP-R2,SECC,0.6T,- 1 SNA
R340 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA S.N.A 0205-001033 GREASE;PL-30G,W050030019,- 0.1 SNA
Samsung Electronics This Document can not be used without Samsung’s authorization 7-23
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
X2 2801-004180 CRYSTAL-SMD;33.8688MHZ,50PPM,28-AAN 1 SA AK67-00048A LENS-OL BD;SOH-BP1,PLASTIC,NTR,PI4. 1 SNA
X3 2801-004074 CRYSTAL-SMD;40MHz,50ppm,28-AAN,18pF 1 SA AK97-01425A ASSY-BLADE;-,SOH-BP1,BD Player 1 SNA
AK97-01373A ASSY-BD PLAYER DECK;ABS, POM, SECC, 1 SNA 3812-001437 WIRE-NO SHEATH CU;SCM,-,15.5,-,-,SI 2 SNA
AK97-01428A ASSY-SUB PICK UP;-,SOH-BP1,BD Playe 1 SNA 0201-001081 ADHESIVE-AA;1401C,RED,-,BOND-LOCK S 0.005 SNA
AK97-01424A ASSY-OPT;-,SOH-BP1,BD Player 1 SNA 0201-001230 ADHESIVE-CYA;LOCTITE 480,BLK,300,- 0.005 SNA
0201-001081 ADHESIVE-AA;1401C,RED,-,BOND-LOCK S 0.01 SNA 0201-001371 ADHESIVE-SIL;KE3494,GRAY,50 PA,OL P 0.005 SNA
0201-001411 ADHESIVE-UV;8833,YEL,50000,250G/1BT 0.02 SNA 0201-001525 ADHESIVE-UV;8840L,YEL,TRANS,23000,D 0.01 SNA
0202-001499 SOLDER-WIRE FLUX;SR34 SUPER LFM-48, 0.05 SNA AH68-00464J LABEL-STICKER;SOH-DR2,-,ART PAPER,- 1 SNA
AK31-00030A MOTOR STEP-CLD;-,SOH-BP1,-,-,-,2.5- 1 SNA AK61-00667A SPRING ETC-DVD HOE;SOH-BP1,Pbr,-,-, 1 SNA
AK41-00551A FPC-CLD;SOH-BP1,POLYMIDE,1,2.0,t0.1 1 SNA AK63-00281A COVER-ACT;SOH-BP1,SUS-301,T0.3,W18. 1 SNA
AK61-00533A HOLDER-CL;SOH-BP1,PPS,T1,W16.6,L23. 1 SNA AK63-00382A PROTECTOR-FILM OL;SOH-DR3,PVC,0.085 1 SNA
AK61-00534A BASE-CLD;SOH-BP1,Al,T4.6,W14.1,L25. 1 SNA AK69-00043A MASTER CARTON-BOX;DVD-S223K/GRA,SW3 0.022 SNA
AK61-00545A SPRING ETC-CLD;SOH-BP1,STS304-WBP,0 1 SNA AK69-00483A PACKING CASE-PICK UP;SOH-BP1,DW2,-, 0.011 SNA
AK66-00076A SHAFT-MAIN CLD;SOH-BP1,SUS303C,L24. 1 SNA AK67-00050A LENS-OL DVD CD;SOH-BP1,PLASTIC,NTR, 1 SNA
AK66-00077A SHAFT-SUB CLD;SOH-BP1,SUS303C,12.3, 1 SNA AK61-00518A HOLDER-FFC PU;BD-P1,POM,2,10,30,WHI 1 SNA
AK67-00022A LENS-CL BD;SOH-BR1,BK7,NTR,##5.5,T1 1 SNA
0201-001388 ADHESIVE-CYA;LOCTITE 460,WHT,45 MPA 0.005 SNA
7-24 This Document can not be used without Samsung’s authorization Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
FCN1 3708-001887 CONNECTOR-FPC/FFC/PIC;20P,1.25MM,AN 1 SA W001 6003-000275 SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC(B 7 SA
FCN2 3711-000827 HEADER-BOARD TO CABLE;BOX,2P,1R,2mm 1 SA W009 6003-000276 SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC(Y 4 SA
FCN3 3711-000988 HEADER-BOARD TO CABLE;BOX,5P,1R,2MM 1 SA W020 6003-000278 SCREW-TAPTITE;BH,+,-,B,M3,L14,ZPC(Y 11 SA
FD1 0403-000718 DIODE-ZENER;MTZJ6.8B,6.52-6.79V,500 1 SA W200 6003-001375 SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(YEL) 2 SA
FD5 0401-000005 DIODE-SWITCHING;1N4148,75V,150mA,DO 1 SA W271 6009-001411 SCREW-SPECIAL;TH,+,-,M5,L14,NI PLT, 2 SA
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Electrical Parts List
MEMO
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Block Diagrams
Flash
Local Bus
Memory Card
YPbPr
Analog Video Video DAC
UART
BD decoder Digital Video
1080p
DVD Digital Video Main CPU 1080i
HDMI
Front I/F decoder Transmitter
Digital Audio
I2S/SPDIF
(I2S/SPDIF)
A bus B bus C bus DDR CT.LFE
From BD Decoder
Surr
From DVD Decoder 8ch DAC
DDR DDR I2S Front
Down Mix 2ch
(64M Byte)
SPDIF
DDR DDR Total 320M Byte
DZF
LOUT1+ Audio MCLK
SCF DAC DATT
LOUT1- I/F LRCK
BICK
ROUT1+ SDTI1
SCF DAC DATT PCM SDTI2
ROUT1-
SDTI3
LOUT2+ SDTI4
SCF DAC DATT
LOUT2-
ROUT2+
ROUT2- SCF DAC DATT Control 3-wire
Register or I2C
LOUT3+
SCF DAC DATT
LOUT3-
DCLK
ROUT3+
SCF DAC DATT DSDL1
ROUT3-
DSDR1
DSDL2
LOUT4+ DSD DSDR2
SCF DAC DATT
LOUT4- DSDL3
DSDR3
ROUT4+ DSDL4
SCF DAC DATT
ROUT4- DSDR4
AK4358
HSYNC
TIMING
VSYNC
GENERATOR
BLANK
CLKIN_A
PLL
CLKIN_B
Control/Status
Generic
GPIO SPI PCI 16-bit
System I/O
DDR Audio
DDR SDRAM Controller Decoder
SDRAM
Transport/Program/Elementary Stream In
LOC X-Y
U707 A-3
MIC1 A-3
VIC1 B-1
VIC4 B-2
U601 B-3
U701 B-4
U704 C-0
U56 C-0
U57 C-1
U58 C-2
XU59 C-2
U700 C-4
U59 D-0
U60 D-0
U1 D-2
U4 D-3
U10 D-4
U61 E-0
U23 E-3
U24 E-3
U25 E-4
U30 F-1
U20 F-3
U28 F-4
CN3 F-4
U32 G-1
U31 G-1
U21 G-2
U22 G-3
Œ V10 Pin24
CONDUCTOR SIDE
LOC X-Y
U16 A-4
U27 B-4
AIC3 C-2
AIC4 C-3
U29 B-4
AIC5 D-3
U53 E-3
U54 E-4
VIC7 G-1
IC06
IC05
IC07
IC04
IC08
IC03
CONDUCTOR SIDE
IC06
IC07 IC05
IC04
IC03
IC08
COMPONENT SIDE
CONDUCTOR SIDE
11-1 SMPS (SMPS PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-2 11-19 BCM7411A(Ana/Dig Decoupl) (Main PCB) - - - - - - - - - - - - - - - - - - - - - - 11-20
11-2 Audio DAC (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-3 11-20 Power (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-21
11-3 S5L3700(Audio/ATA/PERI) (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - 11-4 11-21 BCM7411A(Ana/Dig Decouplir) (Main PCB) - - - - - - - - - - - - - - - - - - - - - 11-22
11-4 S5L3700(Flash/CS8900) (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-5 11-22 FLI8638 (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-23
11-5 S5L3700(DDR Memory) (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-6 11-23 FLI8638 (DDR/Flash) (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-24
11-6 S5L3700(Video Out) (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-7 11-24 Front (Front Key PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-25
11-7 S5L3700(Power/GND) (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-8 11-25 Memory Caed (Memory Card PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - 11-26
11-8 DDR Termination(C) (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-9 11-26 Power (Power Key PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-27
11-9 DDR Termination (A/B) (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-10 11-27 SUB (SUB PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-28
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Schematic Diagrams
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Schematic Diagrams
때문에
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Schematic Diagrams
Reset
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
ŒV10 Vin24
◆ These are the waveforms of BD-P1000 .
Caution) There can be some differences (Voltage, Frequency, stc.) among cameras.
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Schematic Diagrams
Digital Video
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
Digital Video
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Schematic Diagrams
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Schematic Diagrams
Digital Video
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Schematic Diagrams
Reset
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Schematic Diagrams
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Schematic Diagrams
Reset
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
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Schematic Diagrams
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12. Operating Instructions
+ Switch
Vin +
Vs switch
–
ON/OFF Control I switch
Fig. 13-1
◆Terms
1) R11, R12 : IC01 driving resistance (IC01 works through driving resistance at power cord in)
2) IC01 VCC: R13, D11, C11, ZD10,
IC02 VCC: D12, R16, C20, ZD11
! Use the output of transformer as Vcc,because the current starts to flow into transformer while IC01, IC02 is
active
@ Rectify to D11, D12 and smooth to C11, C20.
# Use the output of transformer as IC01, IC02 Vcc : The loads are different before and after IC01, IC02 driving.
(Vcc of IC01, IC02 decreases below OFF voltage , using only the resistance dut to lode increase after IC01,
IC02 driving.)
5.8V
C35 C36, C42
IC01(ICE3B5065P) D39
R47
R32
R35
IC05 R33
R34 C39
IC07
R36
Fig. 13-3
3.3V Rectified
Smoothing Circuit
Smoothing
Circuit
Noise Converter
Removal
(SNUBBER) O
5V Rectified 5V Rectified U
Rectified Circuit
Smoothing Circuit VoltageCircuit (x3) T
P
U
12V Rectified 12V Rectified
T
Smoothing Circuit VoltageCircuit(X3)
PWM Control
Line Filter Circuit
(ICE3B5065P)
Voltage 3.3V Rectified
Detection Smoothing Circuit
Circuit
Power IN
(110V)
Fig. 13-4
13-2 Video
BD Video
Decoder
(U30) HDMI Tx HDMI
(HIC4)
Y data
TS C data
Y data Y data Y
Y
A/V Decoder Cb data Scaler Cb data Video DAC Pb
Video
data Y
Pb
Y data Pr Y/C
CPLD Video DAC Video
DVD Decoder (U704)
C data (VIC7) Video Amp
Y
(VIC2) CVBS
(U20) C
Fig. 13-5
Sources of video signal is separated into BD and DVD, and the signal routes are different with the playing disc.
13-2-1 BD Playback
Output data from Loader is inputted by U1. U1 decodes these signals which are consisted of BD format and
passes TS (Transport Stream) to U30.
U30 separates Video data from, and does MPEG decoding. Decoded signal is displayed by Y 8 bit C (signal that
become Cb, Cr mux) 8 bit forms. The data rate differs to source on the disc, 1080 and 720p modes are 74.175MHz,
and 576i/480i mode is 27MHz. These signals are inputted by U1 again, mixed with graphic data.
Output format is Y 8 bits, Cb 8 bits, Cr 8 bits. Output signals from U1 are inputted to U601 and U704 at the
same time, route is selected to last output mode.
In case of the output mode is HDMI, signal inputted to U601 is scaled by resolution of last output specification
and transferred to HIC4. Format of these signals are Y 8 bits, Cb 8 bits, Cr 8 bits. Data rate is decided by final
output mode. 1080p mode-148.35 MHz, 1080i/720p mode-74.175 MHz, 576p/480p mode-27 MHz. Signal inputted
to HIC4 is displayed finally becoming encoding by HDMI format. HDMI jack is not displayed by 576i/480i
modes.
Also, there is Hot Plug Detection pin (pin 19) on HDMI jack, this pin can confirm connection state with TV
according. If this pin is 0~0.4 V, TV is not connected with this system. If this pin is 2.0~5.0 V, TV is connected
with this system by HDMI cable. Set changes the output mode to HDMI mode, or returns previous mode
according to this status.
In case of the output mode is Component, route is selected unusually to resolution.
When the output mode is 1080i/720p/576p/480p, signals that become scaling in U601 are outputed. VIC4
receives these signals and changes to analog signal. VIC4 has 11 bits resolution. Converted signals are forms of
analog Y, Pb, Pr, and change finally to output level through VIC3 video amp and are displayed. VIC3 does togeth-
Signals from loader are inputted to U20 which is a DVD A/V decoder. U20 decodes MPEG video data and change
the data format to ITU-R656 format.
Output signal from U20 is inputted by U1, and remainder signal processing is equal with BD's occasion.
13-3 Audio
<Table 13-1>
2ch Analog 2ch Downmixed with Button, Interactive 2ch Downmixed Mute
Setup = PCM 2ch Downmixed with Button, Interactive 2ch Downmixed Mute
Optical
/Coaxial Setup = Primary audio without
Bitstream Bitstream Bitstream
SPDIF Bitstream Button, Interactive
U1(ATA16V2) performs Memory Card Interface. It is designed for the bridge between the S5L3700A01(MAIN
PCB’s U1) ATAPI interface to the xD Card, MMC(MultiMediaCard), SD(Secure Digital), Memory Stick, MS PRO,
Compact Flash and Micro Drive Interface. The Host ATAPI interface signal line belongs to U1(ATA16V2).
POSEIDON CF/MD
HOST BUFFER Compact Flash Card
S5L3700A01 I2C MASTER Extension
SD/MMC
Secure Digital Card
Extension
CARD
MCU CORE INTERFACE
INTERFACE ATA I/F xD Card xD Card
PORT MODULE Extension
MEMORY STICK
MEMORY Memory Stick Card
Extension
32
1x8/1x10 YUV
Video Video DSP Motion
1x8 Memory
Interface and Estimator
YUV Controller
Memory and Memory
64
2Port
Bitstream/ 1394
Audio Host USB
Storage Link Serial I/O DENC
Interface Interface Interface
Interface Interface
S/PDIF 16/32
4- 4-
Port Port
Fig. 13-7
1) SPARC Processors
Two 32-bit SPARC processors, one dedicated to video processing and the other assigned general system tasks
and audio processing, performthree classes of functions: system processing, audio processing, and high-level
control flow and decision-making tasks for video processing.
Optionally, they can also perform 2D graphics and host functions.
The SPARC processors have a programmable, scalable architecture that includes an internal 16 Kbyte
instruction cache and an internal configurable 16 Kbyte data memory/cache. Data memory is used instead
of a data cache when the software needs predictable real-time performance and overlapped DMA transfers.
Each SPARC delivers 150 MIPS of processing power.
The DMN-8602 device integrates a 2D graphics accelerator on the dual SPARC processors.
This graphics accelerator supports:
◆ On-Screen Display (OSD)
◆ 2D graphical user interfaces
◆ A 32-bit RGBA with an 8-bit alpha blending channel, flicker filters, and a high-quality video scaler.
The DMN-8602 also supports multiple video inputs, windowed video and graphics with arbitrarily
relocatable and resizable windows, PiP (Picturein-Picture), letterbox, and side-by-side display of SD sources.
2) Memory Mapping
The following paragraphs and figures summarize the DMN-8602 memory map for different configurations.
These configurations include SDRAM access and access to internal registers via the internal Control Bus
(CBus).
3) Video Processing
As a highly integrated network media processor engine, the DMN-8602 device implements motion-com
pensated, block-DCT-based video compression algorithms. To this end, the DMN-8602 device includes a
Video DSP and Motion Estimation coprocessor that off-load computeintensive tasks from the SPARC
processors.
4) Audio Processing
The audio processing hardware is physically integrated into the System SPARC processor. The hardware
consists of two parallel, 63-bit Multiplier/Accumulator (MAC) units with 32-bit precision for samples of high
quality and a DSP instruction set to support efficient encoding and decoding of a wide variety of audio
algorithms.
These include MPEG-1 Layer 2, MP3, AC-3, AAC, etc., as well as audio special effects such as 3D audio,
Dolby ProLogicTM, echo, harmonizing, bass management, FIR filters, and IIR filters.
Each SPARC processor can execute two instructions in parallel:
a MAC operation (DSP instruction) and a regular SPARC processor instruction.
In other words, there can be an overlap between the load-and-store operations and the multiply-and-accumu
late operations.
5) Host Interface
The generic host interface provides a simple, efficient, low-cost interface to a 16-bit or 32-bit host micro-con
troller interface bus.
The host interface provides three distinct functions:
◆ Local SDRAM access
◆ Internal register access
◆ Compressed data input /output (if the dedicated bit-stream interfaces are not used for this purpose)
The host communication functions include initializing the DMN-8602 device, downloading software to
the local SDRAM, sending commands, monitoring status, and downloading graphics data such as OSD
bitmaps.
The host interface supports two types of read/write protocols:
◆ Individual (I) mode
◆ Multiplexed (M) mode
In I mode, the decoder requires the host to drive separate signals (RD and WR) to indicate whether a
transfer is a read or a write. In M mode, the decoder requires one direction signal (RD or WR) and a
data strobe.
This selection allows the DMN-8602 Dual Stream NMP to operate with most popular micro-controllers.
6) Bitstream/Storage Interface
The primary BIO port consists of three component modules that operate independently
◆ ATAPI Controller
◆ 1394 Controller
7) Video Interface
The video interface is a programmable high-speed I/O port that supports the transfer of uncompressed
digital video into and out of the DMN-8602device. One video input channel and one video output channel
are provided.
8) Audio Interface
The DMN-8602 device has a single serial audio input port capable of four channels of audio input for recording
of two stereo sources, and four serial audio output ports capable of eight channels of audio output for up to
eight-channel surround sound reproduction.
The same serial clock is used for both input and output ports, and it supports word clock synchronized audio
output. In addition, the audio interface supports an S/PDIF output interface port that is fully IEC-1937/958
compliant.
9) SDRAM Interface
The DMN-8602 device utilizes Synchronous DRAM (SDRAM) for the external memory bank due to the
flexibility and high sustainable bandwidth of SDRAM. The interface supports Single Data Rate (SDR) SDRAM
for the low-power/ low-cost market and Double Data Rate (DDR) SDRAM for high performance applications.
DVD is the next generation medium and is the acronym of the Digital Versatile Disc or thr Digital Video Disc,
which maximizes the saving density of the disk surface using the MPEG-2 compression technology to enable the
storage of 17G bytes of data on the same size CD.
2) Disc Formats
DVD consists of two 0.6mm discs attached together, enabling access to the upper and lower side of the disk,
and 4 sides could be used at maximum.
Dual Side Single Layer : 9.5GByte Dual Side Dual Layer : 17GByte
Polycarbonate Polycarbonate
Semi-reflective layer
Reflective layer Reflective layer
Bonding layer Bonding layer
Reflective layer
Reflective layer Semi-reflective layer
Polycarbonate Polycarbonate
DVD-Video Playback Only High quality image and sound for movies and other video media.
DVD-ROM Read Only Multi-functional, multi-media software that requires large storage capacity.
DVD-Audio Playback Only High quality sound that exceeds the CD, multi-channel Audio.
1) Able to store up to 160 minutes of Movie by utilizing the MPEG-2 compression technology. ( Aver. 133min.)
2) Enables more than 500 lines of horizontal resolution. (Class corresponding to the Master Tapes used in
broadcasting stations)
3) Provides Dolby Digital 5.1ch Surround 3D sound, which enables theater quality sound (NTSC area).
• For PAL areas, 1 of either MPEG-2 Audio or Dolby Digital must be selected.
4) Multi-Language
• Able to store up to 8 languages of dubbing.
• Able to store up to 32 subtitle languages.
5) Multi-Aspect Ratio
3TV Mode alternatives ; 16:9 Wide Screen (DVD Basic)/4:3 Pan & Scan/Letter Box.
6) Multi-Story
Possible to implement Interactive Viewing which enables the user to select the scenario.
7) Multi-Angle
Able to view the camera angle you selected among the scenes recorded with multiple camera angles.
Note ; The above media features must have the DVD Title that contains the appropriate contents to function
properly.
Horizontal resolution Max. 500 Lines Max. 250 Lines Max.420 Lines
VIDEO
Compression rate 1/40 1/140
Analog
Transmission speed Max. 9.8Mbps (variable) 1.15Mbps (fixed)
DVD-Video Feature 1 When Developing the DVD Software, various addition and modification is possible.
As the storage capacity increases, the DVD-Video separates the main data and the additional data such as the
Multi-Function into different data areas, enabling the control of time-data ratio to provide the format that enables
the flexible Software development
• 1 Movie (3.5Mbps)
+ Subtitle (1 Language)
+ Surround Audio (1 Language)
= 160min storage (4.673Gbytes)
• 1 Movie (3.5Mbps)
+ Subtitle (4 Language)
+ Surround Audio (4 Language)
= 160min storage (4.680Gbytes)
DVD-Video uses the variable compresion technology, the MPEG-2 to compress the moving image optimally, mini-
mizing the Data loss to Provide a clear, natural screen while increasing the storage time.
DVD-Video can store the audio using the 5.1ch Dolby Digital compression or the advanced Liner PCM method,
providing the better-than-CD quality and theater like audio quality.
Channel Format
Audio Coding
Front Surround (Rear) Remark
Mode
L C R L R
1/0 O Mono
2/0 O O Stereo
3/0 O O O
2/1 O O Mono
3/1 O O O Mono Surround
2/2 O O O O
3/2 O O O O O
• Unlike the conventional VCD or LD, DVD-Video has the default of 16:9 Wide, and can be viewed using the
conventional 4:3 TV, enabling the expansion of viewer selection capabilities.
• Up to 9 angles of view may be stored, enabling the viewer to select a specific viewpoint at a given time.
--> Especially, for the Music Video and Sports Title, this provides a more lively image of the scene.
• DVD-Video provides the enviroment suitable for the bi-directional Software develoment, providing multiple
scenarios. This feature enables the Multi-Story function.
• For the titles that are not suitable for children viewing, Parental Locks are set, requesting user defined
passwords for viewing
• Parential Locks may be set on specific frames of the Title, enabling the player to skip those frames during
playback.
• Classify the world into 6 regions, and if the DVD Title and the Player’s “Reginal Code” do not agree, playback
is prohibited.
• Regionnal Coding is optional for the Soft developers (Region 0 All Code), but the Hardware developers
must adopt the appropriate regionnal code for sale.
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• The image quality of the DVD-Video may vary accoring to the quality of the Master and the Authoring Process
- The image quality of the DVD-Video varies according to the Digital Mastering Source such as the
conventional LD, VCD, or Original Film.
- Different Authoring Process are used accoring to the Software developers, and this may affect the
DVD image quality.
• Authoring Process
bit stream
Video/Audio MPEG-2
Master Encoding Disc
Production
bit stream
Subtitle Subtitle
Master Encoding
Authoring Process
One stand along device supports 10 kinds of media for 2 different slot.
SD Card
Memory Stick Duo
Compact Flash
Micro Driv
• Due to the fact that the data layer on a Blu-ray Disc is placed much "closer" to the laser lens than in DVD (or
even the HD-DVD proposal), there is less distortion resulting in significantly improved tolerances.
Hence, more precision and ultra high storage densities are made possible.
• As a result of Blu-ray Disc being manufactured as a single substrate disc comparable to CD, but unlike
DVD (and the HD-DVD proposal), the manufacturing process does not involve the bonding of two substrates,
resulting in less production material, a shorter production time and hence lower production costs per disc.
• Blu-ray Disc has the same physical characteristics as DVD and CD, and like its predecessors it also does not
require a cartridge. This makes it possible to create Blu-ray Disc products that are backwards compatible with
CD and DVD, allowing for a seamless transition to the new technology. Likewise, the technology is perfectly
suitable for integration in small form factor equipment, like notebook computers.
HD DVD-Video DVD-Video
Disc HD DVD ROM 3xDVD ROM DVD ROM
Laser wavelength 405 nanometers 650 nanometers 650 nanometers
Numerical aperture 0.65 0.6 0.6
Storage Dual layer 30GB 8.5GB 8.5GB
capacity
(ROM) Single layer 15GB 4.7GB 4.7GB
Disc playing Dual layer HD Video 8 hours HD Video 2.6 hours SD Video-3.5 hours
time 4 hours 1.3 hours 2 hours
(examples) Single layer AVC at 8 Mbps AVC at 8 Mbps MPEG-2 VBR at 5 Mbps
AVC MPEG-4/VC-1
Video Codecs MPEG-2
MPEG-2
Lossless
Linear PCM/MLP(True HD) [2-ch] Lnear PCM[2-ch]
(mandatory)
Audio Lossless
DTS HD(lossless)
Codecs (option)
Lossy Dolby Digital plus/DTS Dolby Digital
(mandatory) Dolby Digital/MPEG Audio MPEG Audio(Europe)
Maximum data transfer rate 36.55Mbps 11.08Mbps
Advanced Access Content System
Content protection CSS 40bit
[AACS] 128-bit
720x408&702x576
Video Systems 1920x1080 50/60 HDTV
50/60 SDTV
Mandatory Optional
Independent substream from the Dolby Dependent substreams from the Dolby
Dolby Digital Plus audio stream
Digital Plus audio stream Digital Plus audio stream
Dolby Digital audio from the Dolby MLP audio stream from the Dolby
Dolby Lossless audio stream
Lossless audio stream Lossless audio stream
• DVD 2000/12
Table 5.5.2-1 Choice of audio coding
525/60 625/50
Audio Coding Linear PCM or Dolby AC-3 Linear PCM or MPEG or Dolby AC-3
DTS, SDDS (option)
• HD-DVD 2005/08
Table 5.5.2-1 Choice of audio coding
525/60 625/50
14-4-8 Blu-ray
• MPEG-2 TS multiplexing of independent substream 0 and dependent substream 0 of a Dolby Digital Plus
audio stream
• Video highlights
The BD-ROM format for movie distribution supports three highly advanced video codecs, including MPEG-2,
so an author can choose the most suitable one for a particular application. All codecs are industry standards,
meaning easy integration with existing authoring tools, and choice from wide range of encoding solutions.
All consumer video resolutions are available:
- 1920 x 1080 HD (50i, 60i and 24p)
- 1280 x 720 HD (50p, 60p and 24p)
- 720 x 576/480 SD (50i or 60i)
• Audio highlights
The BD-ROM format for movie distribution supports various advanced audio codecs, so an author can choose
the most suitable for a particular application. The high capacity and data rate of Blu-ray Disc allow for extreme
high quality audio in up to 8 channels to accompany High Definition video. Final audio specifications include
DTS (core format), Dolby Digital AC-3 and LPCM (up to96/24) .
Optionally, the format might support DTS++ and LPCM 192/24 7.1.
• "HDMV" mode
Offers all features of DVD-Video and more. The authoring process in line with DVD-Video creation.
• "BD-J" mode
Offers unparalleled flexibility and features, because it is based on Java runtime environment. It allows for
extensive interactive applications, and offers Internet connectivity.
• Introduction
HDMV" mode was designed to offer exciting new features, while keeping authoring process as simple as
possible. It streamlines the production of both Blu-ray Disc as well as DVD-Video titles, as the production
process incorporates many identical phases. It offers improved navigational and menu features, improved
graphics and animation, improved subtitling support and new features like browsable slideshows.
• "Out-of-mux" reading
Unlike DVD-Video, the Blu-ray Disc format allows for data to be read from a different location on the disc,
while uninterruptedly decoding and playing back video. This allows the system to call up menus, overlay
graphics, pictures, button sounds, etc. at user request without stopping playback. Some examples of
possibilities will be explained later.
• Graphic planes
Two individual, full HD resolution (1920x1080) graphics planes are available, on top of the HD video plane.
One plane is assigned to video-related, frame accurate graphics (like subtitles), and the other plane is assigned
to interactive graphical elements, such as buttons or menus. For both planes, various wipes, fades and scroll
effects are available, for example to present a menu.
• Button graphics
Menu buttons can have 3 different states: Normal, Active and Selected. They support 256 color full resolution
graphics and animation, thereby greatly surpassing the capabilities of DVD-Video. Buttons can be called and
removed during video playback, there is no need to return to a "menu screen".
• Button sounds
Button sounds can be loaded into memory of the Blu-ray Disc player. When a user highlights or selects a menu
option, the sound can be played (such as a voice-over explaining the highlighted menu choice, or button clicks).
These button sounds can even be mixed with the running audio from the movie or menu.
• Multi-page Menus
In DVD-Video, playback was interrupted each time a new menu screen is called. Due to Blu-ray Disc's ability
to read data from the disc without interrupting the current audio/video stream, a menu can consist of several
pages. Users will be able to browse through the menu pages or select different menu paths, while the audio
and video remain to be playing in the background.
• Subtitles
In DVD-Video, subtitles were stored in the audio/video stream, and therefore they had limitations on the
number of languages and display styles. Again, it is due to Blu-ray Disc's ability to read data from the disc
without interrupting the current audio/ video stream, that subtitles can be stored independently on the disc.
A user may select different font styles, sizes and colors for the subtitles, or location on screen, depending on
the disc's offerings. Subtitles can be animated, scrolled or faded in and out.
• Introduction
"BD-J" mode was designed to offer the content provider almost unlimited functionality when creating
interactive titles. It is based on Java 2 Micro Edition, so programmers will quickly be familiar with the
programming environment for BD-J. Every Blu-ray Disc player will be equipped with a Java interpreter, so
that it is capable of running discs authored in BD-J mode.
• Playback control
The BD-J application can act as the sole interface to the disc's contents (thus replacing the players on-screen
controls as with discs authored in HDMV mode). The BD-J environment offers all of the playback features of
HDMV mode, including the selection of subtitle, trick play modes, angles, etc. Video can even be scaled
dynamically, so that it can be played in a small size in the corner of a menu, and resume full screen when a
selection is made
• Storage
ABlu-ray Disc player might contain a small amount of non-volatile system storage (flash memory).
This system storage can be used to store game scores, bookmarks, favorites from a disc, training course results,
etc. As a manufacturer's option, a Blu-ray Disc player may also be equipped with Local Storage (hard disk, to
allow large amounts of data like audio/video to be stored.
• Internet connection
The BD-J system supports basic Internet protocols like TCP/IP and HTTP. The player may connect to the disc
publisher's web site to unlock certain content on the disc (after certain conditions, like payment, are met), or
dynamically display certain info (like theater playing schedules for a movie) on the screen. The disc's program
may be extended with JPEG pictures or audio fragments downloaded from the Internet, or it can even stream
full new audio/visual content to Local Storage.
• Conclusion
The Blu-ray Disc format for Movie Distribution offers two flexible profiles for the creation of titles. It was
designed to allow for the streamlined development of Blu-ray Disc (HD) and DVD-Video (SD) titles at the same
time, if needed. Basic menus and navigation can be identical. However, it also offers many new functions that
will benefit both the author (by offering flexible ways of creating disc content), as well as end users (by offering
exiting new functionality compared to DVD-Video).
• Enables authorized movement of content onto home network and portable devices
• Specifications allow first generation AACS-protected discs to be Managed Copy-ready
• Devices manufactured under Interim License will have access to entire library of content (i.e., discs produced
under current and future AACS specifications)
• Managed Copy technologies currently submitted include CPRM, VCPS, WMDRM, MagicGate, as well as
AACS for Recordable Media
• Managed Copy to be permitted under Final License
• Digital Only Token will be utilized to enable new business models that are materially different from
traditional video sell-through
– e.g., “Day and date” release of disc and theatrical versions
– e.g., HD preview of content before generally available
• Restricts content from flowing out of analog outputs, further protecting content from piracy
• If employed, disc required to be clearly labeled to avoid consumer confusion
• Encourages industry use of protected digital interconnections and enhanced security
• Digital Only Token to be permitted under terms of Final Agreement
• Addressed as “Note to Adopter” in Compliance Rules under Interim License, since obviously not applicable
until Final License
• Addresses balance between content protection needs & realistic timeframe for digital output adoption
• Complements existing timeframes for phase-out of analog broadcasting in US and Japan
• 2010 – analog output limited to SD Interlace Modes only (i.e., Composite, S-Video, 480i component)
• 2013 – sunset for all analog output
• There is no ‘e’