Notes

Outline

Computational, Analytical and Experimental Heat Transfer Study of a Board-Mounted Stand-Alone Hea
ME 697 Project

Statement of the problem

Significance of the problem

ME 697 Project work

Unigraphics model of the heat sink

Schematic of heat sink and amplifier IC

Experimental Work

Experimental Set up
Experimental results
Simplified hand calculations

Results of simplified hand calculations

ANSYS Analysis

Mesh of the Model

Types of analysis performed on ANSYS

One Watt load analysis results

Two Watts load analysis results
Variations of k and f
Three Watts load analysis results
Comparisons

Comparisons

Results and Conclusion

ard-Mounted Stand-Alone Heat Sink

Asif Fayyaz
Department of Mechanical Engineering, IUPUI
Spring 2001
Faculty Advisor: Dr. Hasan U. Akay

To determine the maximum heat dissipation from a stand alone heat sink, which is attached to the am
The decision is to be based on experimental, analytical and computational analysis.

The dissipation of heat from the IC is very important because overheating can cause the solder conne
The determination of maximum heat dissipation is important because it would help in selecting the rig

Objective

Approach used

Circuit Board

Objective

Methodology
Thermal
Chamber

Assumptions

Power Dissipation of heat sink

Elements used

Why 2 elements?

Real constants & material properties

Length of each element = 1mm

Free meshing option used

Three types of analysis

Applied loads
Experimental and ANSYS

Simplified Hand Calculations and ANSYS

Operational heat power dissipation

Maximum heat power dissipation

k, which is attached to the amplifier integrated circuit (IC) of an automobile radio.
nal analysis.

g can cause the solder connecting the junction of silicon die and IC’s back plate to melt, leading to failure of the
would help in selecting the right size of the heat sink for the amplifier IC.

To determine the maximum heat dissipation of a board mounted stand alone heat sink

Experimental work
Simplified hand calculations
ANSYS analysis
Comparisons

To get actual temperature readings on the surface of the heat sink and the ambient air around it
To compare those actual temperature readings with the results of ANSYS

2 thermocouples attached to the heat sink and its surrounding

Radio placed in the thermal chamber
Experimental data recorded
Heat from the device (amplifier IC) flows by conduction to the heat sink alone and losses to the board
The heat dissipation through the heat sink is through convection and radiation only
For convection, the heat sink acts as a vertical plate in free convection
For radiation calculations, all the radiation leaving the heat sink is absorbed in the atmosphere around

For 79 0 C surface temperature and 40 0 C surrounding temperature, heat dissipation is 1.124 Watts

Shell 57
Surf 152

To include radiation effect into ANSYS analysis

Thickness of the shell = t = 1.3 mm

Thermal conductivity = k = 0.204 W/mm.k (Aluminum)
Emissivity = e = 0.85 ( Black anodized aluminum)
Form factor = f = 1

One Watt load analysis

Two Watts load analysis
Three Watts load analysis

Heat flux applied to 100 nodes on the backside of heat sink

Surface convection load of 8.45 x10 –6 W/mm 2 K (calculated from simplified hand calculations)
Bulk or ambient temperature of 313 K
Approximately 1 Watt

Approximately 3 Watts
 melt, leading to failure of the IC.

alone heat sink

he ambient air around it

alone and losses to the board are negligible
diation only

bed in the atmosphere around it i.e. form factor is 1

at dissipation is 1.124 Watts

ified hand calculations)

Concluded by comparing the experimental, hand calculation and ANSYS analysis

At 3 Watts load, junction temperature reaches 150 0C

150 0C is the maximum allowable temperature at junction because above this the solder starts to me
ve this the solder starts to melt