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The thermal conductivity of embedded nano-aluminum nitride-doped multi-walled carbon

nanotubes in epoxy composites containing micro-aluminum nitride particles

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2012 Nanotechnology 23 065303

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IOP PUBLISHING NANOTECHNOLOGY
Nanotechnology 23 (2012) 065303 (10pp) doi:10.1088/0957-4484/23/6/065303

The thermal conductivity of embedded

nano-aluminum nitride-doped
multi-walled carbon nanotubes in epoxy
composites containing micro-aluminum
nitride particles
Seran Choi, Hyungu Im and Jooheon Kim
School of Chemical Engineering and Materials Science, Chung-Ang University, Seoul 156-756, Korea

E-mail: Jooheonkim@cau.ac.kr

Received 23 August 2011, in final form 10 November 2011

Published 17 January 2012
Online at stacks.iop.org/Nano/23/065303
Abstract
Amino-functionalized nano-aluminum nitride (nano-AlN) particles were doped onto the
surfaces of chlorinated multi-walled carbon nanotubes (MWCNTs) to act as fillers in
thermally conducting composites. These synthesized materials were embedded in epoxy resin.
Then, the untreated micro-aluminum nitride (micro-AlN) particles were added to this resin,
whereby the composites filled with nano-AlN-doped MWCNTs (0, 0.5, 1, 1.5, 2 wt%) and
micro-AlN (25.2, 44.1, 57.4 vol%) were fabricated. As a result, the thermal diffusivity and
conductivity of all composites continuously improved with increasing nano-AlN-doped
MWCNT content and micro-AlN filler loading. The thermal conductivity reached its
maximum, which was 31.27 times that of the epoxy alone, when 2 wt% nano-AlN-doped
MWCNTs and 57.4 vol% micro-AlN were added to the epoxy resin. This result is due to the
high aspect ratio of the MWCNTs and the surface polarity of the doped nano-AlN and
micro-AlN particles, resulting in the improved thermal properties of the epoxy composite.
(Some figures may appear in colour only in the online journal)

1. Introduction its thermal resistance and conductivity cannot completely

Demands for the miniaturization of electronic packages and
continuous performance improvements have led to the devel-
opment of new microelectronic packaging techniques. The
typical characteristics of future microelectronic packaging
include high density, high frequency, and high speed [1–3].
It is known that when a microelectronic product is operated,
a considerable amount of heat is generated. The heat must
be dissipated to avoid overheating [4], suggesting that
the packaging materials of the product should have good
thermal conductivity in addition to the traditionally desired
physical–mechanical properties.
Epoxy resin has been widely applied in electronics,
paints, electrical insulators, printed circuit boards, and
packaging materials as a matrix [5, 6]. Unfortunately,
satisfy the needs of high performance products. Several
research studies have been conducted to improve the thermal
conductivity of polymeric composites.
Traditionally, in order to achieve the percolation
threshold and obtain a higher thermal conductivity while
maintaining their existing properties, very high micro-filler
loadings have been incorporated, typically 60 wt% or even
higher, to form a heat conductive chain that is as continuous
as possible in the matrix. A variety of fillers including carbide
(SiC) [4, 7], nitrides (BN and AlN) [8, 9], and oxides (Al2 O3 ,
ZnO, and BeO) [10–12] have been investigated. Among them,
aluminum nitride has been considered an attractive candidate
due to its very high thermal conductivity (∼320 W mK−1 at
room temperature), lack of toxicity, stable crystal structure,
and relatively low cost. Many researchers have observed a

0957-4484/12/065303+10$33.00 1 c 2012 IOP Publishing Ltd Printed in the UK &the USA

Nanotechnology 23 (2012) 065303
Table 1. The raw materials and corresponding specifications of filler, coupling agent, epoxy resin, curing agent, solvent.
Materials Abbreviation
Aluminum nitride (40 nm) a
Nano-AlN
Aluminum nitride (100 µm)b Micro-AlN
3-Amino propyltriethoxy silane 3-APTES
Multi-walled carbon nanotube MWCNTs
Bisphenol-A BPA
Tetraethylenepentamine TEPE
Methanol MeOH
Acetone — >99.5
Sulfuric acid H2 SO4
Nitric acid HNO3
Thionyl chloride SOCl2
Tetrahydrofuran THF
N,N-dimethylformamide DMF
a Crystal form: hexagonal.
b Crystal form: hexagonal.
significant increase in the thermal conductivity in different
polymer–AlN composites [13–18]. However, an increase in
the amount of filler loading results in a high density and poor
mechanical properties.
Also, to effectively solve these thermal dissipation
problems, multi-walled carbon nanotube (MWCNT)/polymer
composites such as polyethylene [19–21], polypropylene [22],
poly(methylene methacrylate) [23], poly(vinylcarbazole), and
polyamide [24] have typically been used. Bae et al added
modified MWCNTs to a liquid-crystal epoxy and studied
their surface properties as well as their mechanical and
thermal properties [25]. Since the thermal conductivity of
pure MWCNTs may be as high as 2800 W mK−1 [26],
it is anticipated that the use of MWCNTs is an effective
way to reduce the filler content needed to achieve relatively
high thermal conductivity, thereby minimizing the problems
associated with density and mechanical properties that can
arise when the filler content is high. However, enhancement
of the thermal conductivity in MWCNT/polymer composites
cannot be easily achieved because of the lower intrinsic
tube conductivity and the scattering of heat-carrying phonons
through interactions with the surroundings or defects [27, 28].
Recently, MWCNTs have been coated with metal
particles to further enhance the thermal conductivity of
polymer composites and nanofluids [29, 30], resulting in
a reduction in the thermal interfacial resistance due to the
covalent attachment of metal particles onto the MWCNT
surfaces. Sihn et al demonstrated thermal conduction
behaviors at the transition zone (TZ) between the thermally
conductive and insulating phases in a parametric study [31].
They indicated that the thermal conductivity of the TZ is
a major factor in controlling the thermal conductivity of
composites. Therefore, the thermal resistance at the junction
with the nanoparticles can be reduced via covalent attachment.
In this study, to synthesize metal nanoparticle-doped
MWCNTs for use as fillers in thermally conducting compos-
ites, nano-aluminum nitride (40 nm, nano-AlN) particles were
covalently bonded to MWCNT surfaces (nano-AlN-doped
MWCNTs). The resulting nano-AlN-doped MWCNTs could
S Choi et al
Purity (%) Supplier
>99 Hefei Kaier Nanometer Technology
Development Co., Ltd, China
>98 Sigma Aldrich, Seoul, Korea
>99 Sigma Aldrich, Milwaukee, WI, USA
>95 Hanhwa Nanotech, Seoul, Korea
— Kukdo Chemical Co., LTD, Seoul, Korea
— Tokyo Chemical Industry Co., LTD
Seoul, Korea
>99.5 Samchun Chem.., Pyung-teak, Korea
Samchun Chem.., Pyung-teak, Korea
>95 Samchun Chem.., Pyung-teak, Korea
>70 Samchun Chem.., Pyung-teak, Korea
— Sigma Aldrich, Seoul, Korea
>99.5 Sigma Aldrich, Seoul, Korea
>99 Samchun Chem.., Pyung-teak, Korea
have electrical insulating properties along with enhanced
thermal conductivity because of reduced thermal resistance at
the junction with nanoparticles. These synthesized materials
were added to epoxy/TEPE (tetraethylenepentamine, a curing
agent) composites containing untreated micro-aluminum
nitride (micro-AlN) particles with an average size of ∼100 nm
to minimize the decrease in thermal conductivity associated
with thermal interfacial resistance between the MWCNTs.
Finally, it was proved that a small amount of nano-AlN-doped
MWCNTs (∼2%) would help to establish 3D percolation
networks with micro-AlN particles.
2. Experimental details
2.1. Raw materials
The raw materials and the corresponding specifications for the
fillers, coupling agent, epoxy resin, curing agent, and solvent
are given in table 1.
2.2. Surface modification of nano-AlN particles
The process used to generate the nano-AlN hydroxide
particles involved the following steps: (a) drying in a
vacuum oven at 180 ◦ C for 12 h to remove moisture and
water, (b) dipping nano-AlN particles in a 10 wt% sodium
hydroxide solution at 90 ◦ C for 20 min to attach more
hydroxide ions onto the surfaces of the nano-AlN particles,
and (c) centrifuging and rinsing with acetone and filtering
several times. The nano-AlN hydroxide particles were left in
the furnace at 65 ◦ C for 24 h, cooled to room temperature, and
then stored in desiccators.
The silane treatment of inorganic particles using 3-
APTES consisted of (a) adding an appropriate amount of
3-amino propyltriethoxy silane (3-APTES; 0.5–1% based on
the weight of the nano-AlN particles) to methanol (MeOH)
and dispersing the solution including the nano-AlN particles
using a high level of ultrasonication for 8 h, (b) stirring with a
high speed magnetic stirrer equipped with a reflux condenser
2
Nanotechnology 23 (2012) 065303 S Choi et al

Figure 1. Chemical routes for the synthesis of (a) silane treated nano-AlN particles, (b) chlorinated MWCNTs, and (c) nano-AlN-doped
MWCNTs.

at 70 ◦ C for at least 4 h, and (c) rinsing with absolute MeOH not bonded and thus would not significantly contribute to the
and filtering several times followed by drying at 100 ◦ C for joint strength. The probable schematic reaction between the
3 h to remove the solvent and the silane molecules that were nano-AlN particles and 3-APTES is shown in figure 1(a).

3
Nanotechnology 23 (2012) 065303 S Choi et al

2.3. Synthesis of nano-AlN-doped MWCNTs Table 2. Formation of the epoxy composites.

The preparation process of chlorinated MWCNTs was carried Micro-AlN MWCNTs

System (vol%) (wt%)
out by (a) adding MWCNTs to a mixture of concentrated
sulfuric and nitric acid, which produces carboxylic groups A-1 25.2 0.0
on the surfaces of the MWCNTs without resulting in large A-2 0.5
A-3 1.0
decreases in the lengths of the MWCNTs, under stirring A-4 1.5
using a high speed magnetic stirrer, equipped with a reflux A-5 2.0
condenser at 65 ◦ C for 16 h. Next, the MWCNTs were A-6 44.1 0.0
(b) rinsed with deionized water and filtered several times A-7 0.5
until a neutral solution was obtained. Then, (c) the obtained A-8 1.0
A-9 1.5
carboxyl-terminated MWCNTs were immersed into SOCl2 A-10 2.0
using an ultrasonicator at room temperature for 24 h to form A-11 57.4 0.0
a suspension, and (d) the excess SOCl2 was removed by A-12 0.5
distillation and the remaining solvent was dried under vacuum A-13 1.0
(figure 1(b)). A-14 1.5
A-15 2.0
The fabrication of nano-AlN-doped MWCNTs involved
(a) adding chlorinated MWCNTs to the amine-functionalized
nano-AlN particles in tetrahydrofuran (THF) and sonicating
the mixture for 3 h to disperse the solution, (b) stirring with VG-Microtech, ESCA2000), and energy-dispersive x-ray
a high speed magnetic stirrer at 60 ◦ C for 8 h and then spectroscopy (EDX; EX-350, Horiba) were employed to
filtering the resulting solution through a nylon membrane analyze the nano-AlN-doped MWCNTs. For the FT-IR
filter, (c) making a solution of these synthesized materials, measurements, the synthesized materials were pressed into
nano-AlN-doped MWCNTs, which was diluted with MeOH pellets with potassium bromide (KBr) and scanned using
to a low concentration, and (d) sonicating the solution for radiation which ranged in frequency from 400 to 4000 cm−1 .
several hours. Then, (e) the diluted solution was filtered In the XPS analysis, a monochromatic Mg Kα x-ray source
through a nylon membrane filter with a pore size of 200 nm was used at 1253.6 eV and the Gaussian peak widths were
since the average size of nano-AlN particles is 40 nm. The constant in each spectrum during the curve fitting.
final stage was (f) repeating the (c)–(e) process several times Field emission scanning electron microscopy (FE-SEM;
to remove nano-AlN particles which were not doped on the Sigma, Carl Zeiss) was carried out to confirm the morphology
surface of chlorinated MWCNTs, followed by drying the of the MWCNTs before and after functionalization and
obtained materials in a vacuum oven at 110 ◦ C for 5 h. The the fracture surface of the curing composite. The samples
optimized schematic reaction of the synthesis of modified were sputtered with a thin layer of platinum to avoid the
nano-AlN and MWCNTs is described below and the chemical accumulation of charge before the FE-SEM observation.
route is shown in figure 1(c). The thermal diffusivity (δ, mm2 s−1 ) at room temperature
was measured on disk samples by a laser flash method
2.4. Procedure for composite preparation (Netzsch Instruments Co., Nanoflash LFA 447 system).
The specific heat (C, J g−1 K−1 ) at room temperature
The composites were prepared by solution blending and a was measured on disk samples by differential scanning
casting method consisting of (a) adding nano-AlN-doped calorimetry (DSC; Perkin-Elmer Co., DSC-7 system) and the
MWCNTs to the epoxy resin, bisphenol-A, at 60 ◦ C for about bulk density (ρcomp , g cm−3 ) of the specimens was measured
3 h in N,N-dimethylformamide (DMF) until the synthesized by the water displacement method. For each measurement,
materials were completely mixed, (b) vigorously mixing 15 samples were tested three times. Then, the thermal
untreated micro-AlN particles and the blends of epoxy resin conductivity (8, W mK−1 ) was calculated by using the
at 60 ◦ C, (c) adding the curing agent, TEPE, at a loading of following equation.
4 wt% of the epoxy resin, to the mixture and continuously
stirring for 30 min, (d) pre-curing the mixture at 80 ◦ C for 5 h 8 = δCρcomp . (1)
until no air bubbles appeared on the surface of the mixture
followed by post-curing at 125 ◦ C for 4 h, and (e) cooling to 3. Results and discussion
room temperature. The composites were made by embedding
nano-AlN-doped MWCNTs (0, 0.5, 1, 1.5, 2 wt%) and 3.1. Synthesis of nano-AlN-doped MWCNTs
micro-AlN (25.2, 44.1, 57.4 vol%) (table 2), and specimens
were cut with dimensions of 10 mm length × 10 mm
width × 0.2 mm thickness. 3-APTES was chosen as a coupling agent to functionalize the
nano-AlN particles to enhance the dispersion and interface
2.5. Characterization adhesion between the nano-AlN particles and the MWCNTs.
The chosen silane has two different functional groups, one of
Fourier transform infrared (FT-IR; Perkin-Elmer Spectrum which is reactive with the surface of nano-AlN particles and
One) spectroscopy, x-ray photoelectron spectroscopy (XPS; the other which reacts with MWCNTs.

4
Nanotechnology 23 (2012) 065303
Figure 2. FT-IR spectra of the (a) raw nano-AlN particles,
(b) functionalized MWCNTs, and (c) nano-AlN-doped MWCNTs.
In this study, bonding of the nanoparticles to the
chemically modified MWCNTs was achieved using the
method to prepare MWCNTs and inorganic particles that was
previously reported [4, 32, 33].
3.1.1. FT-IR. FT-IR was used to characterize the synthesis
of the modified nano-AlN particles. Figures 2(a) and (b)
show the FT-IR spectra of raw nano-AlN particles and
functionalized MWCNTs to be compare with nano-AlN-
doped MWCNTs. As shown in figure 2(c), the presence
of a band at 2967 cm−1 represents the stretching of the
methylene group [−CH2 ] in the 3-APTES molecules. In
addition, the new appearance of a band at the lower frequency
of 1637 cm−1 is assigned to the amide carbonyl (C=O)
stretching and the peaks at 1537 and 1223 cm−1 correspond
to N–H in-plane and C–N bond stretching, respectively,
which suggest the presence of amide functional groups
[(−C=O)−NH−] on the MWCNTs [34, 35]. Further, by
comparing the spectra for functionalized MWCNTs and
nano-AlN-doped MWCNTs it could be proved that the
−C=OCl and −NH2 functional groups were covalently
attached to each other (figures 2(b) and (c)).
3.1.2. FE-SEM &EDX. FE-SEM provides more evidence
that the amine-functionalized nano-AlN particles were doped
onto the modified surface of the MWCNTs, as shown in
figures 3(b)–(d). In contrast to the raw MWCNTs (figure 3(a)),
the synthesized materials were found to have nano-AlN
particles at various points along their sidewalls. EDX was
used to further examine the doped particles, as shown in
figure 4. As expected, the elemental composition analysis
revealed Al and N peaks originating from the doped nano-AlN
particles on the MWCNT surfaces (table 3).
5
S Choi et al
Table 3. Elemental analysis of the nano-AlN-doped MWCNTs
obtained by EDX.
Element C–K O–K Al–K N–K
Weight (%) 49.72 14.55 26.58 9.16
3.1.3. XPS. The variations of the chemical bonds of the
MWCNTs before and after functionalization were evaluated
using XPS analysis. Figure 5 shows the general XPS spectra
of the pristine MWCNTs and the nano-AlN-doped MWCNTs
as well as the fits of the C 1s and N 1s peaks of
these synthesized materials. The binding energies at around
284.6 and 531.93 eV are attributed to C 1s and O 1s,
respectively. It should be noted that a significant increase
in the oxygen content was observed, as indicated by the
peak intensity (figure 5(a)), suggesting the attachment of
functional groups onto the MWCNT surfaces. In addition,
newly introduced Al and Si peaks, which originated from
the nanoparticles and the silane coupling agent, respectively,
can be confirmed in the spectrum of the nano-AlN-doped
MWCNTs. The C 1s peak of these synthesized materials can
be fitted using a curve with several component peaks. For
the amide (−NH−C=O)-functionalized MWCNTs shown in
figure 5(b), the XPS results show a slight broadening of the
main C 1s peak at 284.62 eV, as well as a binding energy
peak at 287.4 eV, which is 2.78 eV higher than the main
C 1s peak and is assigned to an amide group. In addition, the
peaks at 285.85 eV and 288.86 eV represent the C–N bonds in
the amine (−CH2 −NH2 ) and carboxylic acid (−C=O−O−)
groups, respectively [34, 36, 37]. To provide clearer evidence
of amide bonding between the nano-AlN particles and the
MWCNTs, the N 1s peaks of the nano-AlN-doped MWCNTs
were fitted with two component peaks, as shown in figure 5(c).
The lower binding energy peak at 400.1 eV is attributed to
the formation of an amide linkage on the MWCNTs, as the
N1s binding energy for amides is expected between 399.5
and 400 eV [34, 38, 39]. The higher bonding energy peak
at 400.5 eV is assigned to an amine nitrogen (−CH2 −NH2 )
bond associated with the amine groups on the nano-AlN
particles surface. These results are in good agreement with
reactions taking place between the nano-AlN particles and
functionalized MWCNTs as well as with the obtained FT-IR
results (figure 2).
3.2. Thermal conductivity of the composites
In this paper it was studied how to further utilize nano-fillers,
e.g. nano-AlN-doped MWCNTs, to improve the thermal
conductivity of composites and how to further enhance
the properties of microcomposites without sacrificing their
original properties.
The thermal diffusivity and conductivity as a function
of the loading of nano-AlN-doped MWCNTs are shown
in figure 6. It can be seen that as the weight fraction
of these synthesized materials increased, the calculated
thermal conductivity increased considerably while the thermal
diffusivity constantly increased for all the investigated
Nanotechnology 23 (2012) 065303
Figure 3. FE-SEM images of the (a) raw MWCNTs and (b)–(d) nano-AlN-doped MWCNTs under different magnifications.
Figure 4. EDX spectrum of nano-AlN-doped MWCNTs.
composites. At a 2 wt% loading of nano-AlN-doped
MWCNTs, the thermal conductivity for micro-AlN loadings
of 25.2, 44.1, and 57.4 vol% increased 12.07, 23.24, and 31.27
fold, respectively, compared to the pure resin (∼0.2 W mk−1 ).
This effect can be explained by two major factors related
to the enhanced conductivity. One factor is the presence
of embedded conducting materials in the epoxy resin; the
thermal conductivity of nano-AlN-doped MWCNTs is above
2800 W mk−1 and that of micro-AlN is about 320 W mk−1 .
The other factor is the enhanced interconnectivity between
conducting particles and nano-AlN-doped MWCNTs. It is
well known that the addition of only pure MWCNTs in
6
S Choi et al
the polymer composites did not show the increased thermal
conductivity because of enhanced phonon scattering effect
at the interface which is related to interface area [39–42].
Therefore, in this study, micro-AlN particles are used as the
thermal conducting filler, mainly because of their negligible
phonon scattering effect and excellent thermal conductivity.
Further, we have fabricated a polymer composite with thermal
transport properties that are enhanced by the combination
of the remarkable properties of each material used in the
composite. Subsequently, since the MWCNTs had a high
aspect ratio, these synthesized materials could establish a
thermal conducting path among the micro-AlN particles in
the composite. The nanoparticles attached to the MWCNTs
provided interfacial interactions, such as van der Waals
force and attractive Coulomb interaction. These secondary
interactions led to a uniform distribution of MWCNTs in
the composite and, thus, a thermal conducting path was
easily established. If the nano-AlN particles were not attached
to the MWCNTs, however, the MWCNTs could not be
easily dispersed in the composite because of weak interfacial
interactions among the MWCNTs and the micro-AlN or
polymer matrix. Therefore, it has to be considered that
the explanation for the enhanced thermal conductivity was
related to the 3D heat conductive network structure in
the composite.
Nanotechnology 23 (2012) 065303
Figure 5. XPS wide scan spectra of (a) the functionalized MWCNTs and curve fitting of (b) the C 1s peak and (c) the N 1s peak of the
nano-AlN-doped MWCNTs .
The morphology of the fractured surfaces of the A5 and
A15 systems are shown in figures 7(a) and (b), respectively. In
the case of the A5 system (figure 7(a)), the embedded nano-
AlN-doped MWCNTs were well dispersed and agglomerated
bundles were rarely observed in the composites. However, at
low micro-filler concentrations, the thermal conductivity is
rather lower since the nano-AlN-doped MWCNTs could not
act as interconnectors.
In contrast to the A5 system, as shown in figure 7(b),
the A15 system, which is the epoxy/TEPE composite
containing 2 wt% nano-AlN-doped MWCNTs and 57.4 vol%
micro-AlN particles, provides higher thermal conductivity.
Since the formation of heat conducting three-dimensional
(3D) percolating networks in the matrix is the key parameter
that influences the value of the thermal conductivity of the
composites, nano-AlN-doped MWCNTs effectively behaved
7
S Choi et al
as interconnectors between the micro-AlN particles and as a
heat conducting medium when the micro-filler loading was
increased.
As a result, to combine the high performance of
composites with low nano-filler content and composites with
high micro-filler content, it is reasonable to partially replace
the micro-filler with nano-filler and expect a higher thermal
conductivity of the resulting composites filled with hybrid
filler, due to a synergistic effect with contributions from the
nano- and micro-fillers.
4. Conclusions
In the present work, the effects of embedded nano-
aluminum nitride (nano-AlN) doped multi-walled nan-
Nanotechnology 23 (2012) 065303
Figure 6. (a) Thermal diffusivity and (b) thermal conductivity of
the embedded nano-AlN-doped MWCNTs in epoxy/TEPE
composites containing micro-AlN.
otubes (MWCNTs) on the thermal properties of epoxy/
tetraethylenepentamine (epoxy/TEPE) composites containing
untreated micro-aluminum nitride (micro-AlN) particles were
investigated with different filler loadings. The major findings
of this study can be summarized as follows.
(1) The amino-functionalized nano-AlN particles were co-
valently bonded to the chlorinated MWCNTs, thereby
fabricating nano-AlN-doped MWCNTs with amide func-
tional groups. The FT-IR, FE-SEM, EDX, and XPS
studies demonstrated the chemical bonding and ele-
8
S Choi et al
Figure 7. FE-SEM images of (a) A5 system and (b) A15 system.
mental components of these synthesized materials and
the morphology of the MWCNTs before and after
functionalization.
(2) The embedded nano-AlN-doped MWCNTs in the
epoxy/TEPE composite containing micro-AlN particles
were employed as thermally conducting fillers to obtain
enhanced thermal properties. The influence of the fillers
was investigated by a laser flash method and the
interconnectivity resulting from the conducting materials
was also studied by FE-SEM.
(3) The thermal conductivity of the composites depended on
the properties of the filler, including the filler content and
filler components. In particular, the materials made in this
study have a great influence on the thermal conductivity.
(4) The maximum thermal conductivity of the composite,
which is 31.27 times that of the epoxy alone, was
obtained after adding 2 wt% nano-AlN-doped MWCNTs
and 57.4 vol% micro-AlN particles to the epoxy/TEPE
resin.
(5) Therefore, nano-AlN-doped MWCNTs are feasible for
the establishment of heat conducting networks in the
matrix and result in an improved thermal conductivity.
Nanotechnology 23 (2012) 065303
Acknowledgments
This work (grant no. 00045311) was supported by Business
for Cooperative R&D between Industry, Academy, and
Research Institute funded Korea Small and Medium Business
Administration in 2011. Also, this research was supported
by the Chung-Ang University Freshman Academic Record
Excellent Scholarship Grants in 2011.
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