+ 0 V

L
U 0 V
P

–
L
OD
D

TH P LP L
P P
OD OD
D TH W OD TH W
TH P P
ID P
ID
OD
L
ID P

L
L TH L TH
P P
TH P W W
Disks with special electrodes (wrap-around contacts)

Design OD in mm TH in mm Electrodes:
Soldering instructions
for users
10 / 16 / 20 / 20 / 25 / 40 0.5 / 1.0 / 2.0 Fired silver
L
All our metallizations
P
(thick film) can be soldered in
TH W or PVD (thin film) conformance with
L
P RoHS. We recom-
TH W mend the use of a
Rings solder with the com-
position Sn 95.5. Ag
Design OD in mm ID in mm TH in mm Electrodes: 3.8. Cu 0.7. If the
L TH piezoceramic element
10 2.7 0.5 / 1.0 / 2.0 Fired silver
P is heated throughout
10* W 4.3* L 0.5 / 1.0 / 2.0 (thick film)
L TH L above the Curie
OD
OD
TH TH P TH 10* 5* P 0.5 / 1.0 / 2.0 or CuNi temperature, the
W P
12.7 5.2* 0.5 / 1.0 / 2.0 (thin film)
material is depolari-
zed, and there is thus
25 16* 0.5 / 1.0 / 2.0 a loss of, or reduction
*Tolerances as fired, 38 13* 5.0 / 6.0 in, the piezoelectric
s. table p. 27 50 19.7* 5.0 / 6.0 / 9.5 parameters.
OD OD
P This can be prevented
TH TH P
Tubes ID ID by adhering to the
following conditions
Design OD in mm ID in mm L in mm Electrodes: under all circumstan-
ces when soldering:
76 60 50 Inside:
40 38 40 Fired silver ꔴ All soldered
L
20 18 30 (thick film) contacts must be
TH
P point contacts.
10 9 L 30 Outside:
TH 10 8 P 30 Fired silver ꔴ The soldering times
6.35 5.35 30 (thick film)
must be as short
as possible (≤ 3 sec).
3.2 2.2 30 or CuNi or Au
OD 2.2 1.0 20 (thin film) ꔴ The specific
P soldering
TH
ID
OD
temperature must
Tubes with special electrodes
P
not be exceeded.
TH
ID
Design OD in mm ID in mm L in mm Electrodes:

20 18 30 Inside:
10 9 30 Fired silver
Quartered outer 10 8 30 (thick film)
electrodes
6.35 5.53 30 Outside:
3.2 2.2 30 Fired silver
2.2 1.0 30 (thick film)
Wrap-around
contacts or CuNi or Au
(thin film)

29

PIEZOTECHNOLOGY