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DATA SHEET
TDA7056B
5 W mono BTL audio amplifier with
DC volume control
Product specification 1997 Aug 15
Supersedes data of 1996 May 28
NXP Semiconductors Product specification
ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TDA7056B SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1
1997 Aug 15 2
NXP Semiconductors Product specification
BLOCK DIAGRAM
VP
3
input
5
DC volume control
I – i 8
negative output
STABILIZER TEMPERATURE
Vref PROTECTION
4 7
MSA708 - 1
signal power
ground ground
PINNING
n.c. 9
MSA707
1997 Aug 15 3
NXP Semiconductors Product specification
FUNCTIONAL DESCRIPTION The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stage has a logarithmic control
The TDA7056B is a mono BTL output amplifier with DC
characteristic. Therefore, the total gain can be controlled
volume control, designed for use in TV and monitor but is
from 40.5 dB to 33 dB. If the DC volume control voltage
also suitable for battery-fed portable recorders and radios.
falls below 0.4 V, the device will switch to the mute mode.
In conventional DC volume circuits the control or input
The amplifier is short-circuit proof to ground, VP and
stage is AC coupled to the output stage via external
across the load. Also a thermal protection circuit is
capacitors to keep the offset voltage low. In the TDA7056B
implemented. If the crystal temperature rises above
the DC volume control stage is integrated into the input
+150 C the gain will be reduced, thereby reducing the
stage so that no coupling capacitors are required. With this
output power. Special attention is given to switch-on and
configuration, a low offset voltage is still maintained and
switch-off clicks, low HF radiation and a good overall
the minimum supply voltage remains low.
stability.
The BTL principle offers the following advantages:
Lower peak value of the supply current Power dissipation
Consequently, a reduced power supply with smaller The Rth vj-a of the package is 55 K/W.
capacitors can be used which results in cost reductions. Therefore Tamb (max) = 150 55 1.8 = 51 C.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VP supply voltage 18 V
V3, 5 input voltage pins 3 and 5 5 V
IORM repetitive peak output current 1.25 A
IOSM non-repetitive peak output current 1.5 A
Ptot total power dissipation Tcase 60 C 9 W
Tamb operating ambient temperature 40 +85 C
Tstg storage temperature 55 +150 C
Tvj virtual junction temperature +150 C
Tsc short-circuit time 1 h
THERMAL CHARACTERISTICS
1997 Aug 15 4
NXP Semiconductors Product specification
CHARACTERISTICS
VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 ; Tamb = 25 C; unless otherwise specified (see Fig.13).
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 and B = 5 kHz.
3. The ripple rejection is measured with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage VR of 200 mV
(RMS value) is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with RS = 5 k unweighted.
5. The DC volume control can be configured in several ways. Two possible circuits are shown in Figs 14 and 15.
The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage
gain.
1997 Aug 15 5
NXP Semiconductors Product specification
MBH372 MBH365
40 1
handbook, halfpage handbook, halfpage
Gv
(dB)
Vno
0
(mV)
−40 10−1
−80
−120 10−2
0 0.4 0.8 1.2 1.6 2.0 0 0.4 0.8 1.2 1.6 2
VDC (V) VDC (V)
Fig.3 Gain control as a function of DC volume Fig.4 Noise output voltage as a function of DC
control. volume control.
MBH376 MBH367
25 20
handbook, halfpage handbook, halfpage
IDC
(μA) IP
15 (mA)
15
5
−5
10
−15
−25 5
0 0.4 0.8 1.2 1.6 2.0 0 4 8 12 16 20
VDC (V) VP (V)
Measured with RL = .
Fig.5 Control current as a function of DC volume
control. Fig.6 Quiescent current versus supply voltage.
1997 Aug 15 6
NXP Semiconductors Product specification
MBH361 MBH362
10 10
handbook, halfpage handbook, halfpage
THD THD
(%) (%)
8 8
(1) (2)
6 6
4 4 (1)
2 2
(2)
0 0
10-1 1 PO (W) 10 10−2 10−1 1 10 102
f (kHz)
(1) RL 16 . PO = 0.1 W.
(2) RL = 8 . (1) Gv(max) = 40 dB.
(2) Gv(max) = 30 dB.
Fig.7 Total harmonic distortion versus output
power. Fig.8 Total harmonic distortion versus frequency.
MBH363 MBH364
10 6
handbook, halfpage handbook, halfpage
PO Pd
(W) (W)
5
8
4
6
3
(1) (2)
(1) (2)
4
2
2
1
0 0
0 4 8 12 16 20 0 4 8 12 16 20
VP (V) VP (V)
1997 Aug 15 7
NXP Semiconductors Product specification
MBH374 MBH375
−20 2.0
handbook, halfpage handbook, halfpage
SVRR VI
(dB)
(V)
−30 1.6
(1)
−40 1.2
−50 0.8
(2)
−60 0.4
−70 0
10−2 10−1 1 10 102 0 4 8 12 16 20
f (kHz) VP (V)
1997 Aug 15 8
NXP Semiconductors Product specification
(1)
VP = 12 V
handbook, full pagewidth
100 nF 220 μF
2
1
n.c.
9 TDA7056B
n.c. I+i 6 +
0.47 μF
input 3
5 RL = 8 Ω
I−i 8
−
RS
5 kΩ TEMPERATURE
DC STABILIZER
PROTECTION
volume
control
4 7
MSA709 - 2
ground
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.
(1) This capacitor can be omitted if the 220 F electrolytic capacitor is connected close to pin 2.
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MLC) will be activated.
1997 Aug 15 9
NXP Semiconductors Product specification
volume
control volume 100 kΩ
5 control
5
1 μF 1 MΩ
1 μF 22 kΩ
MSA710
MBH366
Fig.14 Application with potentiometer as volume Fig.15 Application with potentiometer as volume
control; maximum gain = 34 dB. control; maximum gain = 40 dB.
1997 Aug 15 10
NXP Semiconductors Product specification
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1
D1
q
P P1 A2
A3
q2
q1
A4
E
seating plane
pin 1 index
L c
1 9
Z e b Q
b2 w M
b1
0 5 10 mm
scale
UNIT A
A2
A3 A4 b b1 b2 c D (1) D1 E (1) e L P P1 Q q q1 q2 w Z (1)
max. max.
18.5 8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 3.9 2.75 3.4 1.75 15.1 4.4 5.9
mm 3.7 0.25 1
17.8 8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20 3.4 2.50 3.2 1.55 14.9 4.2 5.7
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
95-02-25
SOT110-1
03-03-12
1997 Aug 15 11
NXP Semiconductors Product specification
1997 Aug 15 12
NXP Semiconductors Product specification
DOCUMENT PRODUCT
DEFINITION
STATUS(1) STATUS(2)
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
1997 Aug 15 13
NXP Semiconductors Product specification
NXP Semiconductors does not accept any liability related Export control This document as well as the item(s)
to any default, damage, costs or problem which is based described herein may be subject to export control
on any weakness or default in the customer’s applications regulations. Export might require a prior authorization from
or products, or the application or use by customer’s third national authorities.
party customer(s). Customer is responsible for doing all
Quick reference data The Quick reference data is an
necessary testing for the customer’s applications and
extract of the product data given in the Limiting values and
products using NXP Semiconductors products in order to
Characteristics sections of this document, and as such is
avoid a default of the applications and the products or of
not complete, exhaustive or legally binding.
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this Non-automotive qualified products Unless this data
respect. sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
Limiting values Stress above one or more limiting
product is not suitable for automotive use. It is neither
values (as defined in the Absolute Maximum Ratings
qualified nor tested in accordance with automotive testing
System of IEC 60134) will cause permanent damage to
or application requirements. NXP Semiconductors accepts
the device. Limiting values are stress ratings only and
no liability for inclusion and/or use of non-automotive
(proper) operation of the device at these or any other
qualified products in automotive equipment or
conditions above those given in the Recommended
applications.
operating conditions section (if present) or the
Characteristics sections of this document is not warranted. In the event that customer uses the product for design-in
Constant or repeated exposure to limiting values will and use in automotive applications to automotive
permanently and irreversibly affect the quality and specifications and standards, customer (a) shall use the
reliability of the device. product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
Terms and conditions of commercial sale NXP
specifications, and (b) whenever customer uses the
Semiconductors products are sold subject to the general
product for automotive applications beyond NXP
terms and conditions of commercial sale, as published at
Semiconductors’ specifications such use shall be solely at
http://www.nxp.com/profile/terms, unless otherwise
customer’s own risk, and (c) customer fully indemnifies
agreed in a valid written individual agreement. In case an
NXP Semiconductors for any liability, damages or failed
individual agreement is concluded only the terms and
product claims resulting from customer design and use of
conditions of the respective agreement shall apply. NXP
the product for automotive applications beyond NXP
Semiconductors hereby expressly objects to applying the
Semiconductors’ standard warranty and NXP
customer’s general terms and conditions with regard to the
Semiconductors’ product specifications.
purchase of NXP Semiconductors products by customer.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
1997 Aug 15 14
NXP Semiconductors
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Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands RM5/03/pp15 Date of release: 1997 Aug 15
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