Wire Bonding

Wire Bonding Quality Assurance and Testing Methods
Visual and mechanical testing methods of wire bonds

• Light- and scanning electron microscopical examinations
• Pull test
• Shear test
β β
β β
Dr.-
Dr.-Ing. M. Schneider-
Schneider-Ramelow phone: +49 30 / 46 40 3-172, fax: -162
martin.schneiderramelow@izm.fraunhofer.de
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)
Gustav-Meyer-Allee 25, D-13355 Berlin
sheet 1
Wire bonding and quality assurance: General requirements
Global formulation:
• low cost technology
• easy to realize and flexible during application
• strong mechanical stability
• thermal stability (in regard to further processing steps) and
• good long term stability
• low contact resistance
• as much as possible great welding area between wire and metallization
• no physical and chemical interactions with other materials
Test methods:
• visual inspektion MIL-STD 883 method 2010, 2017
• pull test MIL-STD 883 methode 2011 (destructive), methode 2023 (non destructive)
• shear test ASTM F 1269-89
sheet 2
Bonding methods Wire Quality assurance Bonding metallization

! principle ! diameter ! quality test methods ! material, pretreatment
! parameters ! elongation, pull-strenght ! standards ! hardness, property
! bonding material ! hardness ! parameter control ! layer thickness/structure
! process kinetics ! surface topology ! product/application ! contamination
etc. ! behavior during bonding requirements etc.
etc. etc.
Influences due to the bonding process

Bonding machine Bonding conditions Bonding substrate Design
! bonding procedure ! personal know-how ! material, assembly ! layout
! bonding speed ! personal motivation ! vibration behavior ! functionality
! adjustment, accuracy ! production sequence ! layer adhesiveness ! simulation
! pattern recognition ! manuf. Infrastructure ! work holder ! compabibility to package
system ! maintenance etc. and device standards
etc. etc. etc.
sheet 3
Bond pads on chip:

• Multiple imprints of test probes or deep very imprints
• Strong adverse effects of surface quality
• Influence on bondability
sheet 4
Visual inspection MIL-STD 883 method 2010, 2017
to proof:
proof: selective parameters:
parameters:
- geometry of bond contacts - wire deformation
- loop geometry - snap off behaviour
- placement of bond contacts - position and welded area
- predetermined quantity of loops - adhesion of metallization
- short circuits - missing bonds or loops
Remark:
Remark: Visual inspection of bondpads before wire bonding!
bonding!
sheet 5
Ball and wedge bond

lift offs of wafer
metallizations while
TS-Au-B/W-Bonding
Wafer metallization lift offs

while TS-Au-W/W-Bonding
sheet 6
SEM-View (BSE): PCB metallization lift off and

undersurface of a lift off bond (wedge)
sheet 7
Quality Tests (Visual Methods)
Ball Bond loop high Wedge Bond

loop high
loop length loop length

influence to horizontal and
neck and heel vertical deformation SEM – Figure of a typical Ball Bond
loop size and

sweeping position of bonds
on the pad
Geometrical Parameters during Wire Bond
SEM – Figure of a typical Wedge Bond
sheet 8
Ball bond failures
sheet 9
Visual inspection of wire bonds
sheet 10
Visual inspection of wire bonds
sheet 11
Wedges on chip
Drahtbonds auf dem Chip
-• strongVerdrängung
Starke squeezing out of chip
der Chipmetallisierung
metallization while bonding
durch die Drahtbonds
-• possible evidence
Möglicherweise of aauf
Hinweis too
zusoften
weiche
surface metallization
Oberfläche
sheet 12
A W wire standard cutting edge

D A B P W A B P W
100µm 125µm 125µm 45µm 50µm 75µm 75µm 38µm
1Mil .004in .005in .005in .0018in .002in .003in .003in .0015in
B 2Mil
.005in .006in .008in .003in .0036in .005in .0056in .0028in
D 4Mil
.008in .0112in .0112in .0052in .006in .0088in .0076in .0052in
wire Heavy wire

P P D A B P W A B P W
5Mil .01in .012 .014in .006in .007 .01in .01in .006in
A pad width W bond width 250µm 500µm 400µm 200µm 230µm 320µm 250µm 180µm
B pad length P pitch 400µm 800µm 600µm 320µm 350µm 500µm 350µm 300µm
D wire diameter 800µm 1300µm1150µm 650µm 660µm 950µm 700µm 600µm
sheet 13
Overbonded wedges (too much deformation), right: Detail
sheet 14
Results of a tilted glued or

soldered chip on bonding
process:
• Surfaces of chip pads
aren´t horizontal
• Bonding tool is touched
down tilted, too
• Wedge is deformed non-
uniform
• Pad metallization or chip
could be damaged
sheet 15
Optical inspection of die tilting
tilted chip
IZM: Hillmann, Großer, Ghaharemani
sheet 16
Wire Sweep Definition
Normal Lead
bond line finger
α Swept lead
Integrated
circuit chip
L
Sweep % = α/L x 100%
sheet 17
Mechanical
Mechanical bond contact inspection (tests)
tests)
to proof: selected tests:
- mechanical stiffness of loops - pull test

- ball bond strength - shear test
- heavy wire wedge bond strength - shear test
- simultaneous proofing of many bond contacts - centrifugal test
- fatigue behaviour of loops - vibration test
- crack initiation and growth - mechanical shock test
- sweep off behaviour - air jet test
sheet 18
Principle of pull test
β β
β β
Quelle: Dage Firmenschrift
sheet 19
Failure modes:
1, 5 Bond lift off from pad metallization
(lift off)
2, 4 Wire break at bond (heelcrack or neck
FR break when ball/wedge bonding)
3 wire break
1. Bond 3
1 2. Bond
2
4 5
sheet 20
Load/Force
Load/Force distribution while bond pull test load at chip:
F cos (Θ2 - Φ)
2 1/2 F1 = F
F = F 1+ d Φ
F1 = F2 = sin (Θ1 + Θ2)
2 sin Θ 2 2h
load at substrate:
true for Φ = 0, both bond contacts at cos (Θ1 + Φ)
one level and Θ1 = Θ2 = Θ F2 = F
F1
sin (Θ1 + Θ2)
h
Θ1
F2
chip H
Θ2
d1 d2 support
d
sheet 21
Quality criteria for pull testing
β β
if β β
Conditions
Characteristics laboratory fabrication
pull force
- average value (based on nondeform ed wire) >50 % >50 %
- standard deviation (based on average value) <15 % <25 %
- proportion of values < (based on standards) cN 0% 0%
lift offs
- pull lift off 0% <10 %
- bond lift off 0% 0%
sheet 22
Minimum pull forces for destructive pull test (MIL STD 883, Methode 2011):
1000
1
2 Wires:
3
Minimum Bond Pull Limit [cN]
1 Au (preseal)
2 Al (preseal)
100
Au (postseal)
3 Al (postseal)
10
25 250 2500
wire diameter [µm]
sheet 23
Pull
Force
increasing quantity increasing quantity

of pull lift offs of heelcracks
optimum increasing parameters
sheet 24
Principle of shear test
1 Substrate/Pad
2 Interface Ball/Substrate
3 Au-Ball
4 Shear Tool S Shear Heigth
5 Shear Level FS Shear Force
Source: Dage and „DVS-Merkblatt Drahtbonden“
sheet 25
Standard report of pull test: Standard AlSi1 wire (30 µm)
Fehlerrate
error rate Pullkraft
pull force
bond lift offs [%]

1./2. bond [scale]
20,0
pull lift offs[%]

100
pull force [cN]
average value
< 6 cN [%]
cN
pull force
US power
%
s [cN] 16,0
80
104/110 10,5 1,6 16,7 10,0 5,0
12,0
109/115 12,0 1,4 6,7 5,0 1,7
114/120 14,5 0,9 0,0 0,0 0,0 60
124/130 15,0 0,8 0,0 0,0 0,0
8,0
134/140 14,5 0,9 0,0 0,0 0,0
144/150 11,5 1,0 11,5 0,0 0,0 40
154/160 8,5 1,2 20,0 0,0 0,0 4,0
20
average
Pullkraft MWpull[cN]
force [cN]
standard deviations[cN]
Standardabweichung [cN]
number of tests: n = 30
0 pull force< <
Pullkraft 6 cN
6 cN [%][%]
104/ Pullabheber [%]
pull lift offs [%]
109/
110 114/ 124/ Bondabheber
bond lift offs[%]
[%]
US time: 30 ms 115 134/
120 130 144/
140 154/
bond force: 32 cN 150
160
tensile wire strength: 19 cN US power 1./2. bond [scale]
scale]
sheet 26
Failure modes while shear test
schear tool
metallization
ball
shear heigth
substrate (chip) Ball lift off Metallization lift off
Ball shear Metallization cracking Chip cratering
sheet 27
Quality criteria for ball shear testing (TS bonding)

bonding)
Conditions
Characteristics laboratory fabrication
shear force
- average value (based on minimum shear force value) > 140 % > 120 %
- standard deviation (based on average value) < 15 % < 20 %
- minimun shear force (based on ball diameter after bonding) see beneath, no value < …
lift offs
- bond lift off 0% 0%
- shear lift off 0% 0%
- percentage off Au on pad > 80 % > 50 %
no metallization lift off,
no cratering
Minimum shear ballbond diameter (µm)

value 50 75 100 125
shear force (cN) 15 30 45 75
sheet 28
Heavy wire wedge shear testing
Fshear
Pitch = W + S
W S
Heavy wire: 400 µm Principle of shear test

Pitch: 750 µm
sheet 29
Problems while evaluation of heavy wire shear test results
950
250 µm Al heavy wire on Al sheet
900
shear force [cN]

optimised parameters
850
800
750
700 very high parameters
650
0 25 50 75 100 125
Partial shear lift off shear heigth [µm]
Questions: Where is the limit between shear lift off and shear through the
bond? What shear heigth should be choosen while shear testing?
Source: IZM Berlin
sheet 30
Load Cartridge Options:

1. Wire Pull
Maximum Pull Force I Cartridge 1 I 100 g
I Cartridge 2 I 1 kg
2. Tweezer Pull/Peel
Maximum Pull Force I Cartridge 1 I 100 g
3. Ball Shear
Maximum Shear Force I Cartridge 1 I 250 g
4. Shear
Maximum Shear Force I Cartridge 2 I 5 kg
Special Load Cartridges:
High Force Tweezer Pull up to 10 kg
Heated Bump Pull up to 10 kg
Stud Pull
Cold Bump Pull up to 5 kg
sheet 31

Wire Bonding

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Wire Bonding Quality Assurance and Testing Methods

Visual and mechanical testing methods of wire bonds

Wire bonding and quality assurance: General requirements

Bonding methods Wire Quality assurance Bonding metallization

Influences due to the bonding process

Bond pads on chip:

Visual inspection MIL-STD 883 method 2010, 2017

Ball and wedge bond

Wafer metallization lift offs

SEM-View (BSE): PCB metallization lift off and

Quality Tests (Visual Methods)

Ball Bond loop high Wedge Bond

loop length loop length

loop size and

SEM – Figure of a typical Wedge Bond

Ball bond failures

Visual inspection of wire bonds

Visual inspection of wire bonds

A W wire standard cutting edge

wire Heavy wire

Overbonded wedges (too much deformation), right: Detail

Results of a tilted glued or

IZM: Hillmann, Großer, Ghaharemani

Wire Sweep Definition

Sweep % = α/L x 100%

to proof: selected tests:

- mechanical stiffness of loops - pull test

Principle of pull test

Quelle: Dage Firmenschrift

Quality criteria for pull testing

increasing quantity increasing quantity

optimum increasing parameters

Principle of shear test

bond lift offs [%]

pull lift offs[%]

substrate (chip) Ball lift off Metallization lift off

Ball shear Metallization cracking Chip cratering

Quality criteria for ball shear testing (TS bonding)

Minimum shear ballbond diameter (µm)

Heavy wire: 400 µm Principle of shear test

shear force [cN]

700 very high parameters

Load Cartridge Options:

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