SAE TECHNICAL

PAPER SERIES 2001-01-0072

LIN Bus and its Potential for use in Distributed

Multiplex Applications
John V. DeNuto, Stephen Ewbank, Francis Kleja,
Christopher A. Lupini and Robert A. Perisho, Jr.
Delphi Automotive Systems

Reprinted From: In-Vehicle Networks 2001

(SP–1594)

SAE 2001 World Congress

Detroit, Michigan
March 5-8, 2001

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LIN Bus and its Potential for Use in Distributed
Multiplex Applications
John V. DeNuto, Stephen Ewbank, Francis Kleja,
Christopher A. Lupini and Robert A. Perisho Jr
Copyright © 2001 Society of Automotive Engineers, Inc.
ABSTRACT
The increasing features and complexity of today's
automotive architectures are becoming increasingly
difficult to manage. Each new innovation typically
requires additional mechanical actuators and associated
electrical controllers. The sheer number of black boxes
and wiring are being limited not by features or cost but by
the inability to physically assemble them into a vehicle.
A new architecture is required which will support the
ability to add new features but also enable the Vehicle
Assembly Plants to easily assemble and test each
subsystem. One such architecture is a distributed
multiplex arrangement that reduces the number of wires
while enabling flexibility and expandability. Previous
versions have had to deal with issues such as noise
immunity at high switching currents. The LIN Bus with its
low cost and rail-to-rail capability may be the key
enabling technology to make the multiplexed architecture
a reality.
INTRODUCTION
HISTORY OF MULTIPLEXING –The multiplexing of
automotive electrical data onto communication buses
dates back to the late 1970s (1). This technology is only
beginning to reach its stride. It was originally hoped that
a single bus protocol could handle the needs of any
vehicle. Gradually that expanded to the SAE
categorization of Class A, B, and C and the realization
that up to three protocols and/or networks may be
necessary.
Today, it is realized that at least seven in-vehicle
protocols may be necessary (2). These include, besides
the existing SAE classes - diagnostics, airbag, mobile
media, and x-by-wire. Each area needs its own protocol
and one or more networks running that protocol.
Sometimes this is for safety reasons, such as with
airbags or x-by-wire. Another reason for such a “niche”
2001-01-0072
Delphi Automotive Systems
protocol is specialty use. An example of a niche protocol
is for the application of “smart sensor and actuator”
technology, sometimes also known as “smart connector”.
This relatively new area of automotive electronics
involves multiplexing low-level functions such as relays,
high/low side drivers, etc. onto a data bus. For now
smart connector functions are lumped into the SAE class
A category. Perhaps in the future it will become its own
class. Indeed, there are advanced vehicle electronic
architectures being considered that utilize up to 200
multiplexed sensors, actuators, and lamps. Each one of
these devices becomes a node on one or more smart
connector buses. The challenge is to make it cost
effective.
Multiplexing has always had an issue with cost.
Replacing some discrete wires and connectors with a
data bus interface tends to add cost. There are benefits
associated with increased diagnostic capabilities and
system expandability, but the bottom line is that the ICs
necessary for the multiplex circuit add additional cost –
making smart connector multiplexing appear
unattractive. It is well known that electronic systems
decrease their cost more quickly than traditional wiring.
This makes the eventual cost effectiveness of multiplex
inevitable, a question of when, not if.
Up to now the buses used in the first, basic
implementations of smart connectors, have been custom
or proprietary (e.g. CCD, BEAN, etc.), too complicated
(e.g. TTP/A) or too slow and cumbersome (e.g. ISO
9141) (3).
The latest entry into the low-cost smart connector arena
is Local Interconnect Network (LIN). With LIN lies the
hope of a worldwide smart connector data bus protocol
standard (4).
Specific advantages of LIN bus when applied to a
distributed multiplex architecture include:
• Standardization
• Low cost silicon
• 12V single wire interface
• Self Synchronization without a crystal
• Guaranteed latency times
• Speeds up to 20Kbit/s
OBJECTIVES
A distributed multiplex architecture is currently being
developed by Delphi Automotive Systems. This new
architecture increases the electronic content while
decreasing the conventional wiring content. The
multiplex nodes are referred to as Smart Connectors.
The goals of this approach are to offer the customer
greater flexibility and better packaging at a reduced sub-
system life-cycle cost.
imperative to obtain the minimum thermal resistance with
no increase in part cost. Advanced computer
simulations are being employed to obtain the optimum
packaging solution.
The third challenge is to demonstrate the performance of
such technology with technical demonstrations and test
data. With shortened product development cycles,
OEM’s are requiring this level of development prior to
including a new technology into one of their programs.
We are meeting these needs with functional
demonstrations of distributed multiplex sub-systems in
seats and doors and comprehensive testing.
Finally, we must overcome our natural resistance to
change. The old adage “if it isn’t broke, don’t fix it” is
often applied to technical innovations such as distributed
multiplex. It takes a technology leader, with a real vision
of the future, to see the many benefits that a distributed
multiplex system has to offer but are difficult to quantify.

BENEFITS APPROACH

The potential benefits of a distributed multiplex Figures 1 through 3 display three comparative
architecture are listed below: architectures applied to a driver’s door of a typical
automotive application. In Figure 1, no multiplexing is
• Simplified vehicle assembly used. Each device interfaces directly with a centralized
• Common application on multiple vehicles body computer and / or bussed electrical center. This
resulting in higher volumes and lower costs architecture possesses the least electronic content, the
• Significantly increased flexibility – the ability to most wires, and the least flexibility to change.
add features to a vehicle in a plug & play manner
• Improved quality and reliability due to a
significant reduction in the number of wires OSRV Driver’s
• Simplified wiring assembly and reduced mass Mirror Switch Door Lock
14 Assembly Assembly
14 9
6
Many of these benefits are compounded when the same
2
Smart Connectors are applied to multiple platforms.
2 Window
CHALLENGES Motor
33 Courtesy
The primary challenge to implementing a distributed Lamp
multiplex architecture remains cost. The cost increase in Electronic Module
Vehicle Body Conventional Connector
electronics must be offset with a decrease in the cost of 33 Wiring
the wiring system and other structural cost
improvements. A cost competitive solution for a Body Computer / Electrical Center
distributed multiplex door sub-system has been
proposed by Delphi. Figure 1: Driver’s door with conventional (non-multiplex) architecture

In order to keep the electronic cost increase as small as

possible, increased volumes, penetrations, and
packaging improvements must be realized. Only then
can cost parity be achieved.

The second challenge lies in the area of thermal

management. Specific new packaging techniques are
being applied to Smart Connector designs in order to
minimize package size and thermal resistance. It is
 central door module are distributed to four discrete Smart
OSRV Driver’s Connectors using the LIN protocol. This approach uses
Mirror Switch the most electronics and the least wiring of the three
Door Lock
Assembly Assembly approaches presented. The four Smart Connectors
14
9 defined in this system control the:
6

2
1. Window Motor
Door Window
2 2. OutSide RearView (OSRV) Mirror Assembly
Multiplex Motor
Module 3. Driver’s Door Switch
Courtesy 4. Door Lock Assembly
Lamp
Electronic Module This approach offers the greatest flexibility to change
Vehicle Body Conventional Connector
Power and the greatest potential for inter-platform application.
Ground
Body Computer / Electrical Center CAN data Four doors in a given vehicle can be executed using the
Other wiring
four Smart Connectors detailed above. This four-door
approach is shown in Figure 4.
Figure 2: Driver’s Door with centralized multiplex architecture

Master

Figure 2 depicts the same door loads controlled using a Mirror Mirror

centralized door multiplex module. This type of Dr Switch

architecture normally utilizes the CAN data bus, allowing Lock Switch Switch Switch Switches
the door module to exist as a peer to the vehicle’s body
Lamp Lamp Lamp Lamp
computer. Using this approach reduces the number of
discrete wires but still limits flexibility. A change in any Window Window Window Window
Motor Motor Motor Motor
load can require a change to the entire door module.
This technique usually results in different modules being Door Door Door Door
applied to the driver’s, passenger’s, and rear doors as Lock Lock Lock Lock

well as different modules on nearly every platform within Driver’s Left Rear Right Rear Passenger’s
Door Door Door Door
an OEM.
Figure 4: Four-door vehicle controlled using 4 types of Smart
Connectors

OSRV Driver’s
Mirror Switch Door Lock
14 Assembly Assembly Content changes in a vehicle can be executed more
easily using this approach. A load can be added to a
vehicle by plugging a Smart Connector to the bus and
modifying the software in the master. This essentially
Window makes the sub-system plug and play. Since the Smart
Motor connectors share a common three-wire bus structure,
Courtesy adding a Smart Connector need not change the wiring
Lamp content. The distributed architecture also offers the
Electronic Module possibility of automated wiring harness assembly
Vehicle Body Smart Connector
IDC Interface
through the use of Insulation Displacement Crimp (IDC)
Conventional Connector terminals
Body Computer / Electrical Center Power
Ground
LIN data
A comparison of the total wiring content can be seen in
Figure 5. As seen in the figure, the distributed multiplex
Figure 3: Driver’s Door with distributed multiplex architecture using
“Smart Connectors” architecture uses the least number of discrete wires and
enables automated assembly of the three-wire data bus.
Of the remaining wires, 14 out of the 21 (66%) are
associated with the mirror pigtail.

Figure 3 presents the same loads controlled using a

distributed multiplex architecture employing Smart
Connectors. In this approach, the functions of the
 90
Cut Leads (Body)
80
Cut Leads (Automated assembly)
70 Cut Leads (Door) Hi Current Ground
Hi Current Power
60 Mirror Pig Tail
Switch Input Ckt 1
50
40 Passenger
Switch Input Ckt 2
Window
30 Switch Switch Ground
20
10
Backlighting
0 Power
Conventional Centralized Multiplex Distributed Multiplex
Lock Switch LIN bus
Switch Input Ckt 3
Switch Input Ckt 4
Ground
Figure 5: Comparison of wiring in conventional, multiplexed, and Courtesy Lamp Output
distributed Smart Connector architectures Courtesy Lamp

Courtesy Lamp Ground

Motor Ckt 1

Window Motor

Motor Ckt 2
The four Smart Connectors described above are all
currently under development using Delphi’s Advanced
Development Process (ADP). The project recently
completed a comprehensive requirements review. A
more detailed description of each Smart Connector
follows: Figure 6: Window Motor Smart Connector I/O block diagram

The first Smart Connector described is the window motor

Smart Connector. An input / output block diagram of this
Smart Connector can be seen in Figure 6. This Smart
Connector is used in each door of a vehicle. It controls
the window motor and several other miscellaneous door
functions. These miscellaneous functions include the
courtesy lamp and window and lock switch inputs. This
functionality is included in the window motor Smart
Connector because dedicated Smart Connectors
controlling these functions were estimated to increase
the sub-system’s total cost.
The second Smart Connector defined is the OSRV Mirror
Smart Connector. An input / output block diagram of this
Smart Connector can be seen in Figure 7. This Smart
Connector controls the mirror tilt motors, mirror fold
motor, mirror heat, an exterior courtesy lamp, and reads
sensors for mirror position and outside temperature.
This Smart Connector would be used in each front
vehicle door.
 OSRV Mirror Assembly
The fourth Smart Connector defined is the door lock
Lamp Feed Smart Connector. An input / output block diagram of this
Puddle
Lamp
Ground
Smart Connector can be seen in Figure 9. This Smart
Connector drives the door lock and super-lock motors. It
Ground
Heater can also monitor the position of two digital input
Heater Feed switches. It will be used in each vehicle door.
Fold Motor Ckt 1
Fold
Motor

Fold Motor Ckt 2

Power
Vertical Motor

Vertical LIN Bus Door Lock Assembly

Motor
Switch Input Ckt 1
Ground
Motor Common

Horizontal
Motor Switch Input Ckt 2
Horizontal Motor
Power
Vertical Position Input

Horizontal Position Input LIN Bus

Switch Ground Ckt
5V Feed
Door Lock Motor Ckt
5V Return Ground
Thermistor Door Lock Motor
Temperature Input

Motor Common Ckt.

Motor 2

Motor 2 Ckt.
Figure 7: OSRV Mirror Smart Connector I/O block diagram

Figure 9: Door Lock Smart Connector I/O Block Diagram

The third Smart Connector defined is the Driver’s Switch
Smart Connector. An input / output block diagram of this
Smart Connector can be seen in Figure 8. This Smart
Connector is designed to read window switch inputs for
four windows, read the position of the mirror select / fold
switch, read the position of the mirror joystick, read the
position of the rear window lockout switch, and drive
dimmable backlighting. PLANS AND TESTING

Extensive test plans have been developed to

demonstrate the feasibility of the LIN bus for production
Driver Door Switch
applications. Since the bus protocol has just recently
been defined (and is still subject to revision), there is little
Switch Ground Ckt1
field experience to indicate how the bus will perform
Backlighting
Backlighting under real world conditions. Not only must the protocol
be shown to be workable, but manufacturer's claims
Driver’s Window Switch Input 1 regarding integrated circuit functionality and development
Passenger’s Window Power
systems capabilities must be verified. Areas of focus
Switch Input 2
include EMC, data bandwidth, latency, and bus operation
Mirror Joystick Switch Input 5
LIN Bus under high current load switching. In addition to bench
Ground testing of individual components, an actual 11-node
production intent system will be built and tested. All of
Mirror Select / Fold Switch Input 6 this is being done under Delphi's ADP process, and will
LR Window Switch Input 3 result in a system capable of being deployed on OEM
vehicles throughout the world.
RR Window Switch Input 4
Window Lockout
Switch Input 7

Figure 8: Driver’s Switch Smart Connector I/O Block Diagram

EMC sub-system. Worst-case analysis, as well as in-vehicle
testing, will be used to demonstrate acceptable latency
EMC will be an important issue for LIN, and requirements performance.
have been gathered from several different vehicle
manufacturers. In keeping with its goal of being a low HIGH CURRENT LOADS AND BUS DISRUPTIONS
cost solution, the LIN bus uses a single unshielded wire
as its transmission medium. Present day single wire Earlier prototype systems suffered from communications
systems run at speeds to about 10K bits/second, and disruptions when high current loads were switched off
use wave shaping on the signal to reduce radiation. But and on. Load currents (figure 10) in the three-wire smart
how will the LIN bus do? Bench testing has been connector configuration can result in a temporary (large)
performed to acquire LIN bus waveforms for use in voltage shift in the ground wire.
mathematical modeling, and to measure radiated
emission under worst case conditions -- highest bus
traffic at the highest speeds (5). The LIN bus protocol
specifies permissible data rates of up to 20K bits/second,
faster than today's single wire systems. The 10-node
test system will run as close as possible to this speed to
provide another check on EMC performance. If 20K
bits/second turns out to be unrealistic, it will be
necessary to determine what the actual upper limit is.
Speeds much lower will result in added cost, as more
buses will be required to handle communications.

BUS LATENCY AND BANDWIDTH

In evaluating LIN performance, it is not enough to simply

verify that the bandwidth is adequate for all the
messages planned for the system. When a user
generates a request through the system (by pushing a
button, for example), he or she expects an immediate
response to the command. A latency requirement has
been established for Delphi's system to address this
issue. Meeting this requirement has complicated the
message strategy for the 11-node test system, since a
single LIN bus is used for all communications. It would
take over 100 ms for all messages to be transmitted if
they were all processed sequentially.
A single master node initiates all communications in the
LIN bus system. Slave nodes cannot initiate
communications themselves, and must wait to be polled
by the master before their data can be output. Typically,
a schedule table is set up within the master, and this
determines when each message will be output on the
bus. A benefit of this method is that latency and bus
utilization are very predictable. The problem is that using
a static schedule table will result in unacceptable delays
for the system. Using conditional branches in the
schedule table can solve this (6).
Test and evaluation of these techniques is commencing
using a bus development tool known as LINspector.
This will be used to simulate a master node, and will be
programmed to change the scheduled table based on
data received from the slave nodes. Conditional
branches result in some loss of predictability, but should
reduce system delays to levels acceptable to vehicle
users. Full development of the LIN protocol must also
address variability of master nodes and slave nodes
designed and built by different suppliers combined into a
Figure 10: Ground shift at a window motor during inrush. LIN data
communications are also plotted. Note the ground shift in the slave
node’s response.
This is due to long wire lengths and the sharing of a
single ground wire by multiple smart connectors. These
voltage drops can corrupt the data transmission in the
commonly used single wire buses. The LIN physical
layer uses a rail-to-rail (ground to battery) swing, which
promises increased immunity to this problem. LIN
requires a transmitting node to transmit within 20% of the
local power and ground voltages. Receiving nodes are
designed to interpret messages that are within 40% of its
local battery and ground. This provides a significant
margin for ground shift when a remote slave node
responds to a poll by the master during a high current
event. This is shown in Figure 10. As long as the node’s
transmission, which is required to be within 20% of its
local ground reference, is received within the master’s
40% tolerance, the message will be valid.
The 11-node test system will be used to verify the proper
operation of the bus under realistic conditions. The
system will be wired in a production intent configuration,
using production intent loads. A tool such as LINspector
will be used monitor the bus while various loads are
energized. Electrical measurements will be taken to
determine noise margins. Some of the smart connectors
could have additional power and ground inputs, which
may be used to supply current to the high power loads.
This may be necessary in some vehicle applications.
SUMMARY: WHAT HAVE WE LEARNED?
The development of Smart Connectors requires that we:
• Define requirements to meet customer needs
• Benchmark current systems
• Assess the advantages and disadvantages
• Develop new concepts to capitalize on the
strengths and resolve weaknesses
Historically multiplexed systems have suffered from
various weaknesses. As these problems are resolved,
the systems become viable. Some common drawbacks
include:
• Custom non-standard protocols
• Complicated protocols
• Slow speed
• Lack of Development Tools
• Cost
To comprehend the potential commercial viability of such
a system, a thorough understanding of the underlying
power and signal distribution system must be present.
The majority of cost savings that can be realized in a
distributed multiplex system are a result of a
simplification of the wiring sub-system. Further cost
savings and reliability improvements can be achieved
through assembly automation. Process equipment that
will automatically assemble Smart Connectors with IDC
terminals onto a 3-wire bus is under development.
We are proceeding with packaging development of the
Smart Connectors specified earlier in this paper. Figure
12 shows a concept for the OSRV Mirror Smart
Connector. It mates to the three-wire power, ground,
and data bus using IDC terminals. This allows the Smart
Connector to be inserted onto a continuous piece of wire
and eliminates the need to strip insulation.
Thermal evaluation of this Smart Connector is
proceeding concurrently with the electronic and
packaging development. Figure 13 shows a temperature
contour plot of the OSRV Mirror Smart Connector with
mirror fold and heat activated. The plot also shows the
heat generated by the reverse battery diode, a
requirement when using a solid state H-bridge.
Concurrent electronic, packaging and thermal analysis
offer the greatest opportunity for developing a
commercially viable distributed LIN system with rapid
speed to market.

The LIN Bus protocol overcomes these drawbacks by

promoting a worldwide standard that is simple, fast and
low cost. At present, the hardware and development
tools are available but still working up the maturity curve.

At Delphi, we have completed a comprehensive review

of global customer requirements and allocated those
requirements into specific product attributes and
performance specifications. We have an initial 4-node
driver’s door system functioning and undergoing test.
We first showed this functional system to the public
during Convergence 2000. The system is running at
19.2Kbit/s and meeting our latency requirements. Initial
radiated emission testing run at 19.2Kbit/s has shown
promising results. Our development team is extending
from this 4-node driver’s door system to a full 11-node
vehicle architecture.
Figure 12: Smart Connector concept employing an IDC terminal
CONCLUSION interface to a three-wire bus.

The viability of a distributed multiplex LIN bus appears

very promising at this time. The development of such a
system requires an organization with expertise in
electronics, power and signal distribution, and connection
systems. Without any one of these three competencies,
successful deployment of such a system would be nearly
impossible.
 CONTACT

Controlling ASIC John V. DeNuto is an Engineering Supervisor with Delphi

Automotive Systems. He holds an MS degree in
Mechanical Engineering from the University of Akron and
a BS in Naval Architecture from the United States Naval
Mirror Heat FET
Academy. He can be reached at (330) 306-1143 or at
John.DeNuto@eng.ped.gmeds.com.

Reverse Battery Diode Mirror Fold FET’s

Steve Ewbank is a Senior Project Engineer with Delphi
Delco Electronics Systems. He holds an MS degree in
Figure 13: Computer simulation of the heat transfer within a mirror
Electrical Engineering from the University of Kansas. He
Smart Connector with mirror fold and heat activated.
can be reached at (765) 451-0353 or at
stephen.e.ewbank@delphiauto.com.

Fran Kleja is a Project Engineer with Delphi Packard

Electric Systems. He holds a BSAS degree in Electrical
We are proceeding with the development of a distributed
Engineering Technology from Youngstown State
multiplex door subsystem using the LIN communications
protocol. A detailed architecture study jointly conducted University. He can be reached at (330) 306-1124 or at
with a major OEM has shown the cost viability of such a Fran.Kleja@eng.ped.gmeds.com.
system. Delphi is currently on track to develop this
system for production application. Chris Lupini is a Senior Project Engineer with Delphi
Delco Electronics Systems. He has an MSEE degree
REFERENCES from Purdue University and a BSCompE degree from the
University of Michigan and is a licensed Professional
1. Bell, “Multiplexing – Past, Present, and Future,” SAE Engineer. He can be reached at (765) 451-0248 or at
760178, 1976. Christopher.A.Lupini@delphiauto.com.
2. Lupini, “Vehicle Multiplex Bus Progression,” SAE
2001-01-0060, 2001 Rob Perisho is a Senior Project Engineer with Delphi
3. Koptez, Elmenreich, and Mack, “A Comparison of Delco Electronic Systems. He holds a BS in Electrical
LIN to TTP/A,” Research Report 4/2000 Institut fur Engineering from Brigham Young University and did his
Technische Informatik, TU Wien, Austria. graduate work at San Diego State University. He can be
4. LIN Consortium, “LIN Protocol Specification 1.1, reached at (765) 451-0817 or at
http://w.w.w.lin-subbus.org, April 2000. rob.a.perisho.jr@delphiauto.com.
5. Motorola, MC33399 LIN Interface, Product Proposal
Rev 4.0.
6. Specks and Rajnák, “LIN – Protocol, Development
Tools, and Software Interfaces for Local Interconnect
th
Networks in Vehicles,” 9 International Conference
on Electronic Systems for Vehicles, Baden-Baden,
Oct 2000.