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IGBT MODULE Spec.No.

IGBT-SP-15002 R2 P1

MBN1200F33F-C Preliminary Specification

3300V Silicon N-channel IGBT F version with SiC Diode

FEATURES
 Soft switching & low conduction loss IGBT :
Soft low-injection punch-through
High conductivity IGBT with advanced trench MOS gate.
 Low driving power due to low input capacitance.
 Ultra low recovery loss with SiC diode.
 High Current rate Package.
 Low stray inductance.
 RoHS

ABSOLUTE MAXIMUM RATINGS (Tc=25oC )

Item Symbol Unit MBN1200F33F-C


Collector Emitter Voltage VCES V 3,300
Gate Emitter Voltage VGES V 20
DC IC 1,200
Collector Current A
1ms ICp 2,400
DC IF 1,200
Forward Current A
1ms IFM 2,400
oC
Junction Temperature Tj -40 ~ +150
oC
Storage Temperature Tstg -40 ~ +150
Isolation Voltage VISO VRMS 6,000(AC 1 minute)
Terminals (M4/M8) - 2/15 (1)
Screw Torque N·m
Mounting (M6) - 6 (2)
+0
Notes: (1) Recommended Value 1.80.2/15 -3N·m (2) Recommended Value 5.50.5N·m

ELECTRICAL CHARACTERISTICS

Item Symbol Unit Min. Typ. Max. Test Conditions


- - 12 VCE=3,300V, VGE=0V, Tj=25oC
Collector Emitter Cut-Off Current I CES mA
- 25 - VCE=3,300V, VGE=0V, Tj=150oC
Gate Emitter Leakage Current IGES nA -500 - +500 VGE=20V, VCE=0V, Tj=25oC
Collector Emitter Saturation Voltage VCE(sat) V - 2.85 - IC=1200A, VGE=15V, Tj=150oC
Gate Emitter Threshold Voltage VGE(TO) V - 6.5 - VCE=10V, IC=1200mA, Tj=25oC
Input Capacitance Cies nF - 88 - VCE=10V, VGE=0V, f=100kHz, Tj=25oC
Internal Gate Resistance Rg(int) Ω - 1.9 - VCE=10V, VGE=0V, f=100kHz, Tj=25oC
Rise Time tr - 0.2 - VCC=1,800V, Ic=1200A
Turn On Time ton - 1.1 - Ls=100nH
Switching Times s RG(on/off)=6.8/6.8Ω (3)
Fall Time tf - 2.0 -
Turn Off Time toff - 4.2 - VGE=15V, Tj=150oC
Peak Forward Voltage Drop VFM V - 4.75 - IF=1200A, VGE=0V, Tj=150oC
VCC=1,800V, IF=1200A, Ls=100nH
Reverse Recovery Time trr s - 0.1 -
Tj=150oC
Turn On Loss Eon J/P - 1.4 - VCC=1,800V, Ic(IF)=1200A, Ls=100nH
Turn Off Loss Eoff J/P - 2.2 - RG(on/off)=6.8/6.8Ω (3)
Reverse Recovery Loss Err J/P - (0.1) - VGE=15V, Tj=150oC
Stray inductance module LSCE nH - 10 -
IGBT Rth(j-c) - - 0.010
Thermal Impedance K/W Junction to case
FWD Rth(j-c) - - (0.017)
Contact Thermal Impedance Rth(c-f) K/W - 0.008 - Case to fin
Notes: (3) RG value is a test condition value for evaluation, not recommended value.
Please, determine the suitable RG value by measuring switching behaviors.
* Please contact our representatives at order.
* For improvement, specifications are subject to change without notice.
* For actual application, please confirm this spec sheet is the newest revision.
* ELECTRICAL CHARACTERISTIC values according to IEC 60747–2 and IEC 60747–9
IGBT MODULE Spec.No.IGBT-SP-15002 R2 P2

MBN1200F33F-C Preliminary Specification

Typical Typical
2400 2400
Tj=25℃ Tj=150℃
VGE=15V
13V
VGE= 15V
2000 2000 13V
11V
Collector Current IC (A)

Collector Current IC (A)


1600 1600
11V

1200 1200

800 800
9V
9V

400 400

7V
7V
0 0
0 1 2 3 4 5 0 1 2 3 4 5

Collector - Emitter Voltage VCE (V) Collector - Emitter Voltage VCE (V)

IC vs. VCE (Tj=25℃) IC vs. VCE(Tj=150 oC)

Typical
2400
VGE=0V

2000
Tj=150℃
Tj=25℃
Forward Current IF (A)

1600

1200

800

400

0
0 2 4 6 8 10 12

Forward Voltage VF (V)

IF vs. VF
IGBT MODULE Spec.No.IGBT-SP-15002 R2 P3

MBN1200F33F-C Preliminary Specification

Typical Typical
10 10
【Conditions】 【Conditions】
VCC=1800V VCC=1800V
VGE=±15V VGE=±15V
RG=6.8Ω RG=6.8Ω
Ls=100nH Ls=100nH
8 Tj=150oC Tj=150oC
8
Turn-on Loss, Eon (J/pulse)

Turn-of f Loss, Eof f (J/pulse)


6 6
2 2
y = 6E-07x + 0.0003x + 0.0811 y = 6E-08x + 0.0016x + 0.2667

4 4

2 2

0 0
0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500
Collector Current, IC (A) Collector Current, IC (A)

Turn-on loss vs. Collector current Turn-off loss vs. Collector current
Typical Typical
1 8
【Conditions】
VCC=1800V 【Conditions】
VGE=±15V VCC=1800V
RG=6.8Ω VGE=±15V
Ls=100nH RG=6.8Ω
Tj=150oC Ls=100nH
0.8 Tj=150oC

6
Reverse Recovery Loss, Err (J/pulse)

Swiching time, ton,tr,tof f,tf,trr (us)

0.6

toff
2
4
y = -2E-08x + 0.0001x + 0.0052

0.4

tf
2
0.2

ton

tr
trr
0 0
0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500
Forward Current, IF (A) Collector Current, IC,IF (A)

Recovery loss vs. Forward current Switching time vs. Collector current
IGBT MODULE Spec.No.IGBT-SP-15002 R2 P4

MBN1200F33F-C Preliminary Specification

Typical Typical
5 5
【Conditions】 【Conditions】
VCC=1800V VCC=1800V
IC=1200A IC=1200A
VGE=±15V VGE=±15V
Ls=100nH Ls=100nH
4 Tj=150oC Tj=150oC
4
Turn-on Loss, Eon (J/pulse)

Turn-of f Loss, Eof f (J/pulse)


3 3

2 2

1 1

0 0
0 5 10 15 20 25 0 5 10 15 20 25

Gate Resistance, RG (Ω) Gate Resistance, RG (Ω)

Turn-on loss vs. Gate Resistance Turn-off loss vs. Gate Resistance

Typical Typical
1 10
【Conditions】 【Conditions】
VCC=1800V VCC=1800V
IF=1200A IC,IF=1200A
VGE=±15V VGE=±15V
Ls=100nH Ls=100nH
Tj=150oC Tj=150oC
0.8 8
Reverse Recovery Loss, Err (J/pulse)

Swiching time, ton,tr,tof f,tf,trr (us)

0.6 6

toff

0.4 4

tf
0.2 2

ton
tr
trr
0 0
0 5 10 15 20 25 0 5 10 15 20 25

Gate Resistance, RG (Ω) Gate Resistance, RG (Ω)

Recovery loss vs. Gate Resistance Switching time vs. Gate Resistance
IGBT MODULE Spec.No.IGBT-SP-15002 R2 P5

MBN1200F33F-C Preliminary Specification

1000 Typical 15 Typical


Tj=25℃
f=100kHz

10

Cies
100 5

Gate-Emitter Voltage VGE (V)


Cies, Coes, Cres (nF)

10 -5
Coes

Cres -10
VCC=1800V, IC=1200A
VGE=±15V,Ls=100nH
Tj=25o C

1 -15
0.1 1 10 100 -5 -4 -3 -2 -1 0 1 2 3 4 5
Collector-Emitter Voltage VCE (V) Gate Charge QG (uC)

Cies, Coes, Cres - VCE QG - VGE

3000

2500

2000
IC (A)

1500

1000

500
VCC≦2200V, Tj=150oC
VGE=±15V, RG(off)=6.8Ω
Ls≦100nH, Pulse width≧10us

0
0 1000 2000 3000 4000 5000

VCE (V) *Def ined at auxiliary terminals

RBSOA
IGBT MODULE Spec.No.IGBT-SP-15002 R2 P6

MBN1200F33F-C Preliminary Specification

OUTLINE DRAWINGS

Fig.1 Outline Drawings


C C
C

E E E

Fig.2 Circuit diagram


IGBT MODULE Spec.No.IGBT-SP-15002 R2 P7

MBN1200F33F-C Preliminary Specification

HITACHI POWER SEMICONDUCTORS

Notices
1. The information given herein, including the specifications and dimensions, is subject to
change without prior notice to improve product characteristics. Before ordering,
purchasers are advised to contact Hitachi sales department for the latest version of this
data sheets.
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before use.
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be ensured by using semiconductor devices that feature assured safety or by means of
users’ fail-safe precautions or other arrangement. Or consult Hitachi’s sales department
staff.
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any other cause during operation of the user’s units according to this data sheets. Hitachi
assumes no responsibility for any intellectual property claims or any other problems that
may result from applications of information, products or circuits described in this data
sheets.
5. In no event shall Hitachi be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
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party or Hitachi Power Semiconductor Device, Ltd.
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