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IGBT-SP-15002 R2 P1
FEATURES
Soft switching & low conduction loss IGBT :
Soft low-injection punch-through
High conductivity IGBT with advanced trench MOS gate.
Low driving power due to low input capacitance.
Ultra low recovery loss with SiC diode.
High Current rate Package.
Low stray inductance.
RoHS
ELECTRICAL CHARACTERISTICS
Typical Typical
2400 2400
Tj=25℃ Tj=150℃
VGE=15V
13V
VGE= 15V
2000 2000 13V
11V
Collector Current IC (A)
1200 1200
800 800
9V
9V
400 400
7V
7V
0 0
0 1 2 3 4 5 0 1 2 3 4 5
Collector - Emitter Voltage VCE (V) Collector - Emitter Voltage VCE (V)
Typical
2400
VGE=0V
2000
Tj=150℃
Tj=25℃
Forward Current IF (A)
1600
1200
800
400
0
0 2 4 6 8 10 12
IF vs. VF
IGBT MODULE Spec.No.IGBT-SP-15002 R2 P3
Typical Typical
10 10
【Conditions】 【Conditions】
VCC=1800V VCC=1800V
VGE=±15V VGE=±15V
RG=6.8Ω RG=6.8Ω
Ls=100nH Ls=100nH
8 Tj=150oC Tj=150oC
8
Turn-on Loss, Eon (J/pulse)
4 4
2 2
0 0
0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500
Collector Current, IC (A) Collector Current, IC (A)
Turn-on loss vs. Collector current Turn-off loss vs. Collector current
Typical Typical
1 8
【Conditions】
VCC=1800V 【Conditions】
VGE=±15V VCC=1800V
RG=6.8Ω VGE=±15V
Ls=100nH RG=6.8Ω
Tj=150oC Ls=100nH
0.8 Tj=150oC
6
Reverse Recovery Loss, Err (J/pulse)
0.6
toff
2
4
y = -2E-08x + 0.0001x + 0.0052
0.4
tf
2
0.2
ton
tr
trr
0 0
0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500
Forward Current, IF (A) Collector Current, IC,IF (A)
Recovery loss vs. Forward current Switching time vs. Collector current
IGBT MODULE Spec.No.IGBT-SP-15002 R2 P4
Typical Typical
5 5
【Conditions】 【Conditions】
VCC=1800V VCC=1800V
IC=1200A IC=1200A
VGE=±15V VGE=±15V
Ls=100nH Ls=100nH
4 Tj=150oC Tj=150oC
4
Turn-on Loss, Eon (J/pulse)
2 2
1 1
0 0
0 5 10 15 20 25 0 5 10 15 20 25
Turn-on loss vs. Gate Resistance Turn-off loss vs. Gate Resistance
Typical Typical
1 10
【Conditions】 【Conditions】
VCC=1800V VCC=1800V
IF=1200A IC,IF=1200A
VGE=±15V VGE=±15V
Ls=100nH Ls=100nH
Tj=150oC Tj=150oC
0.8 8
Reverse Recovery Loss, Err (J/pulse)
0.6 6
toff
0.4 4
tf
0.2 2
ton
tr
trr
0 0
0 5 10 15 20 25 0 5 10 15 20 25
Recovery loss vs. Gate Resistance Switching time vs. Gate Resistance
IGBT MODULE Spec.No.IGBT-SP-15002 R2 P5
10
Cies
100 5
10 -5
Coes
Cres -10
VCC=1800V, IC=1200A
VGE=±15V,Ls=100nH
Tj=25o C
1 -15
0.1 1 10 100 -5 -4 -3 -2 -1 0 1 2 3 4 5
Collector-Emitter Voltage VCE (V) Gate Charge QG (uC)
3000
2500
2000
IC (A)
1500
1000
500
VCC≦2200V, Tj=150oC
VGE=±15V, RG(off)=6.8Ω
Ls≦100nH, Pulse width≧10us
0
0 1000 2000 3000 4000 5000
RBSOA
IGBT MODULE Spec.No.IGBT-SP-15002 R2 P6
OUTLINE DRAWINGS
E E E
Notices
1. The information given herein, including the specifications and dimensions, is subject to
change without prior notice to improve product characteristics. Before ordering,
purchasers are advised to contact Hitachi sales department for the latest version of this
data sheets.
2. Please be sure to read "Precautions for Safe Use and Notices" in the individual brochure
before use.
3. In cases where extremely high reliability is required (such as use in nuclear power
control, aerospace and aviation, traffic equipment, life-support-related medical
equipment, fuel control equipment and various kinds of safety equipment), safety should
be ensured by using semiconductor devices that feature assured safety or by means of
users’ fail-safe precautions or other arrangement. Or consult Hitachi’s sales department
staff.
4. In no event shall Hitachi be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to this data sheets. Hitachi
assumes no responsibility for any intellectual property claims or any other problems that
may result from applications of information, products or circuits described in this data
sheets.
5. In no event shall Hitachi be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
6. No license is granted by this data sheets under any patents or other rights of any third
party or Hitachi Power Semiconductor Device, Ltd.
7. This data sheets may not be reproduced or duplicated, in any form, in whole or in part,
without the expressed written permission of Hitachi Power Semiconductor Device, Ltd.
8. The products (technologies) described in this data sheets are not to be provided to any
party whose purpose in their application will hinder maintenance of international peace
and safety not are they to be applied to that purpose by their direct purchasers or any
third party. When exporting these products (technologies), the necessary procedures are
to be taken in accordance with related laws and regulations.
For inquiries relating to the products, please contact nearest overseas representatives that is located
“Inquiry” portion on the top page of a home page.