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描述 / Descriptions
0.8A 表面贴装玻璃钝化整流桥,薄型 ABS/LBF 封装。
0.8A Surface Mount Glass Passivated Bridge Rectifier,ABS/LBF thin package.
特征 / Features
玻璃钝化芯片,浪涌电流大,反向电压:100V~1000V 正向电流:0.8A,适用于表面贴装。无卤产品。
Glass Passivated Chip Junction, Reverse Voltage :100 to 1000V,Forward Current: 0.8A,High Surge
Current Capability, Designed for Surface Mount Application. Halogen free product.
用途 / Applications
一般用途.
General purpose.
引脚排列 / Pinning
印章代码 / Marking
http://www.fsbrec.com 1/6
ABS1~ABS10
Rev.C Feb.-2015 DATA SHEET
参数 数值
Parameter 符号 Rating 单位
Symbol Unit
ABS1 ABS2 ABS4 ABS6 ABS8 ABS10
Maximum Repetitive Peak
VRRM 100 200 400 600 800 1000 V
Reverse Voltage
Maximum RMS voltage VRMS 70 140 280 420 560 700 V
Maximum DC Blocking
VDC 100 200 400 600 800 1000 V
Voltage
Average Rectified Output
Io 0.8 A
Current at Ta = 40 °C
Peak Forward Surge
Current 8.3 ms Single Half
Sine Wave Superimposed IFSM 30 A
on Rated Load
(JEDEC Method)
Typical Junction Ci 13 pF
Capacitance(Note1)
参数 符号 测试条件 数值 单位
Parameter Symbol Test Conditions Rating Unit
IF=0.4A 1.0
Forward Voltage per
VF V
element
IF=0.8A 1.1
Ta=25℃ 5.0
Maximum DC
Reverse Current at
IR Ta=100℃ 50 μA
Maximum DC
Blocking Voltage
Ta=125℃ 100
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ABS1~ABS10
Rev.C Feb.-2015 DATA SHEET
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ABS1~ABS10
Rev.C Feb.-2015 DATA SHEET
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ABS1~ABS10
Rev.C Feb.-2015 DATA SHEET
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ABS1~ABS10
Rev.C Feb.-2015 DATA SHEET
回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free)
说明: Note:
1、预热温度 25~150℃,时间 60~90sec; 1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 245±5℃,时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec. 3. Cooling Speed: 2~10℃/sec.
卷盘包装 / REEL
3
Package Type Units 包装数量 Dimension 包装尺寸 (unit:mm )
Units/Reel Reels/Inner Box Units/Inner Box Inner Boxes/Outer Box Units/Outer Box
封装形式 Reel Inner Box 盒 Outer Box 箱
只/卷盘 卷盘/盒 只/盒 盒/箱 只/箱
ABS/LBF 5000 2 10000 5 50000 13〞×15 336X336X40 345X345X235
使用说明 / Notices
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